Liquid cooling modular converter

Abstract

The invention provides a liquid cooling modular converter, and belongs to the field of power conversion devices. The liquid-cooled modular converter comprises a shell and an installation base body arranged in the shell, an alternating-current capacitor plate, an alternating-current inductor unit and an IGBT unit are further arranged in the shell, the edge of the rear side of a liquid-cooled plate is close to a rear side plate, a spacing space is reserved between the edge of the rear side of the liquid-cooled plate and the rear side plate, and the alternating-current capacitor plate is located in the spacing space. And the alternating current inductance unit and the IGBT unit are respectively arranged on two sides of the liquid cooling plate. According to the invention, through the reasonable layout of each component and the board card, the space in the shell is fully utilized, the wiring is more orderly, the surface space of the liquid cooling plate is fully utilized, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This invention belongs to the field of power conversion devices, and in particular relates to a liquid-cooled modular converter. Background Technology

[0002] With the widespread application of clean energy, the construction of wind power and solar power plants, along with their supporting energy storage equipment, is increasing. A core component of energy storage equipment is the energy storage converter, which is typically designed as a modular device for easy installation and replacement.

[0003] Energy storage converters need to meet waterproof and dustproof requirements. At the same time, because they contain IGBTs, reactors, copper busbars and various circuit boards, these components generate a lot of heat and have high heat dissipation requirements. In order to adapt to different usage needs, energy storage converters need to be smaller in size. This requires the layout of internal components and circuit boards to be more reasonable and compact, which increases the design difficulty of energy storage converters.

[0004] Chinese invention patent CN120281165B discloses an energy storage converter, an energy storage system, and electrical equipment for an energy storage system. The energy storage converter includes a housing, within which are a high-voltage compartment and a low-voltage compartment. The high-voltage compartment is located near the front panel of the energy storage converter housing, while the low-voltage compartment is located near the back panel. The low-voltage compartment includes an upper space and a lower space. The upper space houses various functional boards, such as power boards, while the lower space houses heat sinks, inductors, and capacitors. This design achieves a more compact layout by dividing and layering the space within the energy storage converter housing and arranging various components and boards according to their characteristics in different areas and levels.

[0005] Another Chinese invention patent application, CN117013801A, discloses a fully liquid-cooled high-power-density modular energy storage converter. This converter features a fully enclosed housing structure, using liquid-cooled plates and partitions to divide the internal space into upper and lower layers. Components and circuit boards are respectively housed in the upper and lower layers. The upper and lower layers are connected at the front and rear ends, and a circulating fan is located near the connection point to circulate air between the two layers. The air blown by the upper circulating fan is cooled by fins on the liquid-cooled plate, thus providing more efficient heat dissipation for the components and circuit boards.

[0006] However, the layout of internal components in existing energy storage converters is still not reasonable enough, resulting in low space utilization and messy internal wiring. Moreover, existing technologies only install heat-generating components or boards on one side of the liquid cooling plate, which leads to low utilization of the liquid cooling plate and low heat dissipation efficiency. Summary of the Invention

[0007] The purpose of this invention is to provide a liquid-cooled modular converter to solve the technical problems of low internal space utilization, messy wiring, and low utilization of liquid cooling plates in the prior art.

[0008] To achieve the above objectives, the technical solution of the liquid-cooled modular converter provided by this invention is as follows: A liquid-cooled modular converter includes a housing and a plate-shaped mounting base disposed within the housing. The mounting base is composed of a liquid-cooled plate or a support plate and a liquid-cooled plate arranged front and rear. The mounting base divides the space inside the housing into two parts. An AC capacitor plate, an AC inductor unit, and an IGBT unit are also disposed inside the housing. The rear edge of the liquid-cooled plate is close to a rear side plate and has a gap between it and the rear side plate. The AC capacitor plate is located in the gap and is mounted on the rear side plate. The AC inductor unit and the IGBT unit are respectively mounted on both sides of the liquid-cooled plate. The AC capacitor plate, AC inductor unit, and IGBT unit are arranged in a triangular shape. The AC inductor unit is connected to the AC capacitor plate via a cable. The AC inductor unit is connected to the board containing the IGBT unit by a conductive busbar passing through the gap.

[0009] As a further improvement, an insulating plate is provided on the side of the liquid cooling plate where the AC inductor unit is located. The insulating plate is parallel to the liquid cooling plate and is fixed to the liquid cooling plate by an insulating support. The insulating plate is located at the rear edge of the liquid cooling plate. The cable between the AC inductor unit and the AC capacitor board is fixed on the outside of the insulating plate, and the conductive bar between the AC inductor unit and the board containing the IGBT unit is located on the inside of the insulating plate.

[0010] As a further improvement, the mounting base consists of a liquid cooling plate and a support plate. Low heat generation elements or plates inside the housing are mounted on the support plate. The length direction of the support plate is perpendicular to the front-to-back direction. The housing has connecting ports at both ends of the support plate in the length direction to connect the spaces on both sides of the support plate. Each connecting port is equipped with a circulating fan to drive the air circulation on both sides. A turbulence fan is provided at the rear of the housing to blow air toward the AC capacitor plate. The turbulence fan is used to add air near the AC capacitor plate and disrupt the air circulation on both sides of the support plate.

[0011] As a further improvement, the liquid cooling plate is equipped with an inlet and an outlet installed on the front side plate of the housing. The inlet and outlet are respectively connected to the liquid cooling plate by inlet pipes and outlet pipes. A heat exchange structure for cooling the air inside the housing is installed on the inlet pipe. The heat exchange structure is located at the air outlet or air inlet of one of the circulating fans.

[0012] As a further improvement, the low-heat-generating element or board includes an AC EMI board, which is located at the outlet of a circulating fan equipped with a heat exchange structure and is directly exposed to cold air.

[0013] As a further improvement, the AC EMI board and the AC inductor unit are located on the same side of the mounting base. A terminal block for wiring to the AC inductor unit is provided at the rear edge of the AC EMI board. The extension direction of the terminal block in the middle of the rear edge of the AC EMI board is the same as the extension direction of the rear edge of the AC EMI board. The extension direction of the terminal blocks at both ends of the rear edge of the AC EMI board is perpendicular to the extension direction of the rear edge of the AC EMI board.

[0014] As a further improvement, the two circulating fans are staggered in the front-to-back direction.

[0015] As a further improvement, low-heat-generating components or boards include an AC EMI board and control board on the same side as the AC inductor unit, and a DC capacitor board, DC board, conjugate inductor, and DC contactor on the same side as the IGBT unit.

[0016] As a further improvement, the mounting base is arranged vertically, and the thickness direction of the mounting base is parallel to the left and right directions. The left and right side plates of the shell are both detachable cover plates.

[0017] The beneficial effects are as follows: The liquid-cooled modular converter provided by this invention is an improvement on the existing technology. Through the rational layout of various components and circuit boards, this liquid-cooled modular converter makes full use of the space within the housing, thereby making the original structure more compact and facilitating neater wiring. Furthermore, since the IGBT units and AC inductor units, which generate significant heat, are respectively located on both sides of the liquid-cooled plate, the surface space of the liquid-cooled plate is also fully utilized, improving heat dissipation efficiency. Attached Figure Description

[0018] Figure 1 This is a front view of Embodiment 1 of the liquid-cooled modular converter in this invention; Figure 2 This is a right-side view of Embodiment 1 of the liquid-cooled modular converter in this invention after removing the right-side plate; Figure 3 This is an isometric view of Embodiment 1 of the liquid-cooled modular converter in this invention after removing the right side plate; Figure 4 This is a left-side view of Embodiment 1 of the liquid-cooled modular converter in this invention after removing the left-side plate; Figure 5 This is an isometric view of Embodiment 1 of the liquid-cooled modular converter in this invention after removing the left side plate.

[0019] Explanation of reference numerals in the attached figures: 1. Vent valve; 2. Support plate; 3. Housing; 31. Front side plate; 32. Rear side plate; 33. Top side plate; 34. Bottom side plate; 35. Left side plate; 36. Right side plate; 37. Handle; 38. Connecting port; 39. Grounding bolt; 4. Liquid cooling system; 41. Liquid cooling plate; 42. Water inlet; 43. Water outlet; 44. Water inlet pipe; 45. Water outlet pipe; 46. Heat exchange structure; 5. AC inductor unit; 51. Coarse inlet wire; 52. Fine inlet wire; 53. Outlet wire; 6. IGBT board unit; 61. IGBT unit; 62. IGBT board; 7. 1. AC EMI board; 8. Control board; 9. DC capacitor board; 10. DC board; 11. Conjugate inductor; 12. DC contactor; 13. Upper circulating fan; 14. Lower circulating fan; 15. Terminal block; 16. External network interface; 17. Auxiliary power interface; 18. Indicator light; 19. Hall effect sensor board; 20. Stacked array; 21. DC external terminal; 22. DC connection bar; 23. AC external terminal; 24. AC connection bar; 25. AC capacitor board; 26. Power board; 27. Insulation board; 28. Conductor bar; 29. ​​Turbulence fan; 30. Insulating support. Detailed Implementation

[0020] The present invention will be further described in detail below with reference to the embodiments.

[0021] Specific embodiment 1 of the liquid-cooled modular converter provided by the present invention: This liquid-cooled modular converter improves the utilization of the internal space through a reasonable layout of its internal structure, resulting in neat wiring and increased utilization of the liquid cooling plate.

[0022] See appendix Figure 2 Appendix Figure 3 Appendix Figure 4 and appendix Figure 5 The liquid-cooled modular converter includes a housing 3, a liquid cooling system 4 installed inside the housing 3, and various components and boards, which are divided into two categories: high heat generation and low heat generation.

[0023] Combined with appendix Figure 1 The housing 3 has a relatively flat structure in the left and right direction. The front side plate 31, top side plate 33, rear side plate 32 and bottom side plate 34 of the housing 3 together form a rectangular frame structure. The front side plate 31 is provided with various interfaces, vent valve 1, grounding bolt 39 and handle 37 for pulling the converter. The left side plate 35 and right side plate 36 are respectively detachably installed on the left and right sides of the rectangular frame structure by bolts, and good sealing is maintained by setting sealing strips. The left side plate 35 and right side plate 36 are both detachable covers for early installation and later maintenance.

[0024] The liquid cooling system 4 includes a liquid cooling plate 41 located inside the housing 3, an inlet 42 and an outlet 43 mounted on the front side plate 31 of the housing 3, an inlet pipe 44 connecting the inlet 42 and the liquid cooling plate 41, an outlet pipe 45 connecting the outlet 43 and the liquid cooling plate 41, and a heat exchange structure 46 disposed on the inlet pipe 44.

[0025] The liquid cooling plate 41 is positioned rearward within the housing 3, with a certain space between it and the rear side plate 32 of the housing 3. The thickness direction of the liquid cooling plate 41 is parallel to the left-right direction of the converter, and the liquid cooling plate 41 is centered in the left-right direction of the housing 3. A support plate 2 is fixedly installed inside the housing 3. The support plate 2 is located in front of the liquid cooling plate 41 and parallel to it. The rear end of the support plate 2 connects to the liquid cooling plate 41, and the front end extends to the front side plate 31 of the housing 3. The support plate 2 is also centered in the left-right direction of the housing 3. The liquid cooling plate 41 and the support plate 2 together divide the space inside the housing 3 into left and right parts. At the same time, both the liquid cooling plate 41 and the support plate 2 constitute the mounting base for mounting components or circuit boards.

[0026] The liquid cooling plate 41 has a stronger cooling capacity, therefore high heat-generating components or boards are mounted on it. These high heat-generating components or boards include AC inductor units 5 and IGBT board units 6. IGBT board unit 6 includes IGBT units 61 and an IGBT board 62. The IGBT board 62 is the board housing the IGBT units 61 and is used to drive them. The IGBT units 61 are the main source of heat generation in IGBT board unit 6. The IGBT units 61 and AC inductor units 5 are respectively arranged on the left and right sides of the liquid cooling plate 41, and vertically. The size of the liquid cooling plate 41 can be determined based on the distribution of the AC inductor units 5 and the IGBT units 61.

[0027] Low-heat-generating components or boards are mounted on support plate 2 and cooled by air cooling. These components mainly include AC EMI board 7, control board 8, IGBT board 62, DC capacitor board 9, DC board 10, conjugate inductor 11, and DC contactor 12. These components are located on the left and right sides of support plate 2, respectively. For convenient wiring, the left and right sections of the housing 3 can be designated as the DC side and AC side spaces, respectively. IGBT board 62, DC capacitor board 9, DC board 10, conjugate inductor 11, and DC contactor 12 are located on the same side as IGBT unit 61 in the DC side space, while AC EMI board 7 and control board 8 are located on the same side as AC inductor unit 5 in the AC side space.

[0028] The left and right spaces within the housing 3 are connected at the top and bottom by specially designed connecting ports 38. Each connecting port 38 is equipped with a circulating fan to drive the air circulation between the two spaces. The top circulating fan is an upper circulating fan 13, and the bottom circulating fan is a lower circulating fan 14. The upper circulating fan 13 is positioned slightly to the right and blows air downwards from the top into the right space within the housing 3; the lower circulating fan 14 is positioned slightly to the left and blows air upwards from the bottom into the left space within the housing 3, thus enabling air circulation between the left and right spaces.

[0029] In the liquid cooling system 4, the heat exchange structure 46 is located at the lower air outlet of the upper circulating fan 13. The coolant, which is at a lower temperature in the inlet pipe, first enters the heat exchange structure 46, absorbing heat from the surrounding air and making the air flowing through the heat exchange structure 46 cold air. In this way, the air circulating inside the shell 3 can be continuously cooled. The heat exchange structure 46 can be a partially coiled structure of the inlet pipe, in which case the inlet pipe itself needs to be a metal tube capable of rapid heat conduction. The heat exchange structure 46 can also be a heat absorption plate with a finned structure, and the heat absorption plate has coiled liquid flow channels inside.

[0030] The AC EMI board 7 is positioned adjacent to and below the heat exchange structure 46. This ensures that the downward-flowing cold air from the heat exchange structure 46 first passes through the AC EMI board 7. Since the AC EMI board 7 generates relatively more heat than other low-heat-generating components or boards, this arrangement guarantees sufficient heat dissipation. Furthermore, the front panel 31 of the housing 3 has an AC external terminal 23. Positioning the AC EMI board 7 here allows its front edge to be close to the front panel 31, facilitating connection to the AC external terminal 23 via the AC connector 24.

[0031] Three terminal blocks 15 are arranged vertically along the rear edge of the AC EMI board 7. The middle terminal block 15 extends vertically, while the upper and lower terminal blocks 15 extend horizontally. The AC inductor unit 5 contains six AC inductors arranged vertically, with the leads 53 of every two AC inductors connected to one terminal block 15. The AC inductors have a certain dimension in the left-right direction, so the leads 53 of the AC inductors are a certain distance from the support plate 2 in the left-right direction.

[0032] The control board 8 is located on the same side as the AC EMI board 7 and directly below it. The control board 8 is relatively thin, so the wiring between the control board 8 and other components is close to the support plate 2 in the left-right direction. The wiring of the control board 8 and the output wire 53 of the AC inductor unit 5 are layered in the left-right direction with overlapping areas. This fully utilizes the space within the housing 3 and ensures sufficient distance between strong and weak current circuits, reducing interference to the control board 8. The front end of the control board 8 connects to the front panel 31 of the housing 3. The front end of the control board 8 is equipped with an external network interface 16, an auxiliary power interface 17, and indicator lights 18. These devices can directly pass through the front panel 31 of the housing 3 and appear outside the front panel 31, thus shortening the communication distance between these devices and the control board 8 and enabling faster signal transmission.

[0033] The IGBT board 62 is located on the right side of the support plate 2 and in front of each IGBT unit 61. A Hall plate 19 is provided on the rear side of each IGBT unit 61. Copper busbars are installed on the terminals at the rear end of the IGBT board 62. The number of copper busbars corresponds to the number of AC inductor units 5. After passing through the Hall plate 19, the copper busbars bend to the right and then forward to reach the right side of the liquid cooling plate 41, and are connected to the thick input line 51 of each AC inductor unit 5.

[0034] A stack 20 extending vertically is provided on the front side of the IGBT board 62, and terminals for connecting to the IGBT board 62 are provided at the rear edge of the stack 20. Three terminals are provided on the upper part of the stack 20, one located at the upper edge and two at the front edge. A conjugate inductor 11 and a DC capacitor board 9 are located in the upper space in front of the stack 20, with the conjugate inductor 11 on top and the DC capacitor board 9 on the bottom. The three terminals on the upper part of the stack 20 facilitate wiring to the conjugate inductor 11 and the DC capacitor board 9. An insulating support 30 is provided on the lower side of the DC capacitor board 9, and the insulating support 30 is fixedly mounted on the support plate 2 to provide support for the DC capacitor board 9.

[0035] The DC contactor 12 and the DC board 10 are located in the lower space in front of the stack 20. A DC external terminal 21 is located on the lower part of the front side plate 31 of the housing 3. A DC connection bar 22 is connected between the DC external terminal 21 and the lower part of the stack 20. The DC connection bar 22 passes through the DC contactor 12 and the DC board 10 and maintains a certain distance from the DC contactor 12 and the DC board 10 in the left and right directions. This also makes full use of the space in the left and right directions inside the housing 3.

[0036] An AC capacitor board 25 and a power supply board 26 are mounted on the inner side of the rear panel 32 of the housing 3, with the AC capacitor board 25 positioned higher and the power supply board 26 positioned lower. Both the AC capacitor board 25 and the power supply board 26 are relatively wide but thin. If they were placed on the support plate 2, the front-to-back dimensions of the support plate 2 would increase, and wiring would be inconvenient. In this embodiment, the width direction of the AC capacitor board 25 and the power supply board 26 is parallel to the left-to-right direction. The AC capacitor board 25, the AC inductor unit 5, and the IGBT unit 61 are arranged in a triangular pattern, thus fully utilizing the space within the housing 3 in the left-to-right direction, saving space in the front-to-back direction, and facilitating wiring.

[0037] A conductive connection is required between the AC capacitor plate 25 and the AC inductor unit 5, and the connection between the two is a thin inlet wire 52. An insulating plate 27 is also provided on the side of the liquid cooling plate 41 where the AC inductor unit 5 is located. The insulating plate 27 is parallel to the liquid cooling plate 41 and is located behind each AC inductor unit 5, and is fixedly installed at the rear edge of the liquid cooling plate 41 by insulating supports. The thin inlet wire 52 passes around the outside of the insulating plate 27, and the conductive bus 28 passes through the inside of the insulating plate 27 and connects to the thick inlet wire 51. The insulating plate 27 can isolate the thin inlet wire 52 from the thick inlet wire 51, and also provides a foundation for fixing the thin inlet wire 52.

[0038] A baffle fan 29 is fixedly installed at the rear end inside the top side plate 33 of the housing 3. The baffle fan 29 is located above the AC capacitor plate 25 and blows air downwards towards the AC capacitor plate 25. Under the action of the baffle fan 29, the air in the rear space inside the housing 3 can pass through the AC capacitor plate 25 and the power board 26 in sequence, and then disperse and merge into the air circulation in the front space inside the housing 3, carrying away the heat from the AC capacitor plate 25 and the power board 26. At the same time, the baffle fan 29 disrupts the air circulation in the front space inside the housing 3, preventing laminar flow in this area, thereby making the airflow inside the housing 3 more uniform and the heat dissipation more even.

[0039] To further enhance the turbulence of air circulation, the upper circulating fan 13 and the lower circulating fan 14 can be slightly offset in the front-to-back direction. This prevents the air from flowing directly between the two circulating fans, instead ensuring that it impacts the inner side of the housing 3 and disperses outwards. Specifically, the lower circulating fan 14 is positioned forward-biased, and its upper air outlet is tilted backward, thus expanding the coverage area of ​​the air circulation.

[0040] Specific embodiment 2 of the liquid-cooled modular converter provided by the present invention: This embodiment is based on embodiment 1. The main difference between this embodiment and embodiment 1 is that in this embodiment, the thickness direction of the entire converter module is in the same direction as the vertical direction, the mounting base is horizontally set, the thickness direction of the mounting base is in the same direction as the vertical direction, the mounting base divides the internal space of the housing into upper and lower parts, and in this embodiment, only the top side plate of the housing is a removable cover.

[0041] Compared to Embodiment 1, this embodiment rotates the entire converter 90 degrees and lays it flat. The arrangement of its internal components is the same as in Embodiment 1. The only difference is that the left and right side plates in Embodiment 1 become the top and bottom side plates in this embodiment, respectively.

[0042] Specific embodiment 3 of the liquid-cooled modular converter provided by the present invention: This embodiment is based on embodiment 1. The main difference between this embodiment and embodiment 1 is that the mounting base in this embodiment is only composed of a liquid cooling plate. The front edge of the liquid cooling plate extends to the front plate of the housing. The components and boards that were originally mounted on the support plate in embodiment 1 are all mounted on the liquid cooling plate in this embodiment.

[0043] Since the liquid cooling plate itself has a strong cooling capacity, there is no need to install air cooling structures inside the casing.

[0044] Specific embodiment 4 of the liquid-cooled modular converter provided by the present invention: This embodiment is based on embodiment 1. The main difference between this embodiment and embodiment 1 is that in this embodiment, both circulating fans blow air vertically.

[0045] Specific embodiment 5 of the liquid-cooled modular converter provided by the present invention: This embodiment is based on embodiment 1. The main difference between this embodiment and embodiment 1 is that in this embodiment, the two circulating fans blow air directly opposite each other from top to bottom. In order to make the air flow range larger, the number of circulating fans can be increased.

[0046] Specific embodiment 6 of the liquid-cooled modular converter provided by the present invention: This embodiment is based on embodiment 1. The main difference between this embodiment and embodiment 1 is that the AC EMI board is located below the control board. Since the control board is thinner, more cold air will blow towards the AC EMI board without obstruction.

[0047] Specific embodiment 7 of the liquid-cooled modular converter provided by the present invention: This embodiment is based on embodiment 1. The main difference between this embodiment and embodiment 1 is that fin structures are provided on both the left and right side plates to increase the cross-sectional area. In this way, heat can be transferred to the fin structures during the air circulation process, and then dissipated to the outside of the shell through the left and right side plates.

[0048] In some embodiments of this implementation, if the above structure can meet the air cooling heat dissipation requirements, then a heat exchange structure is not required in the liquid cooling system.

[0049] Specific embodiment 8 of the liquid-cooled modular converter provided by the present invention: This embodiment is based on embodiment 1. The main difference between this embodiment and embodiment 1 is that the inductor unit’s incoming lines are arranged directly as needed, without the installation of an insulating plate.

[0050] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still make modifications to the technical solutions described in the foregoing embodiments without creative effort, or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A liquid-cooled modular converter, comprising a housing and a plate-shaped mounting base disposed within the housing, the mounting base being composed of a liquid-cooled plate or composed of front and rear arranged support plates and a liquid-cooled plate, the mounting base dividing the space within the housing into two parts, and the housing further comprising an AC capacitor plate, an AC inductor unit, and an IGBT unit, characterized in that, The rear edge of the liquid cooling plate is close to the rear side plate and has a gap between it and the rear side plate. The AC capacitor plate is located in the gap and is mounted on the rear side plate. The AC inductor unit and the IGBT unit are respectively mounted on both sides of the liquid cooling plate. The AC capacitor plate, AC inductor unit and IGBT unit are arranged in a triangular shape. The AC inductor unit is connected to the AC capacitor plate by a cable. The AC inductor unit is connected to the board containing the IGBT unit by a conductive busbar passing through the gap.

2. The liquid-cooled modular converter according to claim 1, characterized in that, On the side of the liquid cooling plate where the AC inductor unit is located, there is also an insulating plate that is parallel to the liquid cooling plate and is supported and fixed on the liquid cooling plate by an insulating pillar. The insulating plate is located at the rear edge of the liquid cooling plate. The cable between the AC inductor unit and the AC capacitor board is fixed on the outside of the insulating plate, and the conductive bar between the AC inductor unit and the board containing the IGBT unit is located on the inside of the insulating plate.

3. The liquid-cooled modular converter according to claim 1 or 2, characterized in that, The mounting base consists of a liquid cooling plate and a support plate. Low-heat-generating elements or plates inside the housing are mounted on the support plate. The length direction of the support plate is perpendicular to the front-to-back direction. The housing has connecting ports at both ends of the support plate along its length direction to connect the spaces on both sides of the support plate. Each connecting port is equipped with a circulating fan to drive the air circulation on both sides. A turbulence fan is located at the rear of the housing to blow air toward the AC capacitor plate. The turbulence fan is used to add air near the AC capacitor plate and disrupt the air circulation on both sides of the support plate.

4. The liquid-cooled modular converter according to claim 3, characterized in that, The liquid cooling plate is equipped with an inlet and an outlet installed on the front side plate of the housing. The inlet and outlet are connected to the liquid cooling plate by inlet pipes and outlet pipes, respectively. A heat exchange structure for cooling the air inside the housing is installed on the inlet pipe. The heat exchange structure is located at the air outlet or air inlet of one of the circulating fans.

5. The liquid-cooled modular converter according to claim 4, characterized in that, Low heat-generating elements or boards include AC EMI boards, which are located at the outlet of a circulating fan equipped with a heat exchange structure and are directly exposed to cold air.

6. The liquid-cooled modular converter according to claim 5, characterized in that, The AC EMI board and the AC inductor unit are located on the same side of the mounting base. The rear edge of the AC EMI board has a terminal block for wiring to the AC inductor unit. The extension direction of the terminal block in the middle of the rear edge of the AC EMI board is the same as the extension direction of the rear edge of the AC EMI board. The extension direction of the terminal blocks at both ends of the rear edge of the AC EMI board is perpendicular to the extension direction of the rear edge of the AC EMI board.

7. The liquid-cooled modular converter according to claim 3, characterized in that, The two circulating fans are staggered in the front-to-back direction.

8. The liquid-cooled modular converter according to claim 3, characterized in that, Low heat-generating components or boards include AC EMI boards and control boards on the same side as the AC inductor unit, and DC capacitor boards, DC boards, conjugate inductors, and DC contactors on the same side as the IGBT unit.

9. The liquid-cooled modular converter according to claim 1 or 2, characterized in that, The mounting base is arranged vertically, and the thickness direction of the mounting base is parallel to the left and right directions. The left and right side plates of the shell are both removable cover plates.

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