Micro-expansion constant temperature controller

Abstract

The invention discloses a micro-expansion constant-temperature controller which comprises a low-temperature contact plate and a heating surface mounting plate arranged above the low-temperature contact plate in parallel, and further comprises a plurality of heat conduction pieces movably mounted between the low-temperature contact plate and the heating surface mounting plate through fixing rods, and the heat conduction pieces are evenly arranged on the heating surface mounting plate. And a heating surface temperature sensor and a low-temperature contact plate temperature sensor are respectively arranged on the heating surface mounting plate and the low-temperature contact plate. The device has no energy consumption problem and no mechanical fatigue problem, and has the characteristics of self-adaptive adjustment, flexible structural arrangement, safety, reliability, high cooling efficiency and the like.

Description

Technical Field

[0001] This invention patent belongs to the field of electrical equipment thermal management technology, specifically relating to a micro-expansion thermostat. Background Technology

[0002] When electrical equipment is working, due to the size, structure or other reasons of the equipment, no additional heat dissipation method can be adopted, and heat dissipation is required through a low temperature heat sink. If the electrical equipment is in direct contact with the low temperature environment, the temperature of the electrical module will be too low and it will not be able to work. Therefore, a constant temperature control device is needed between the electrical equipment and the low temperature environment, which can both transfer heat dissipation and control the temperature range.

[0003] To ensure controllable cooling temperature, traditional solutions involve water or air cooling, which requires additional cooling devices such as water pumps, heat exchangers, or fans. This necessitates providing additional circulating power, resulting in complex equipment control strategies and low cooling efficiency. Summary of the Invention

[0004] To address the aforementioned shortcomings in the existing technology, this invention provides a micro-expansion thermostat.

[0005] The technical solution adopted by this invention patent to solve its technical problem is: a micro-expansion constant temperature controller, including a low-temperature contact plate and a heating surface mounting plate arranged parallel above the low-temperature contact plate, and also including a number of heat-conducting components movably installed between the low-temperature contact plate and the heating surface mounting plate by fixing rods. The heat-conducting components are evenly arranged on the heating surface mounting plate, and the heating surface mounting plate and the low-temperature contact plate are respectively provided with a heating surface temperature sensor and a low-temperature contact plate temperature sensor.

[0006] The aforementioned micro-expansion thermostat has a heat-conducting component that is a heat-conducting disc.

[0007] The micro-expansion thermostat described above has a heating surface mounting plate with an area smaller than the low-temperature contact plate and is arranged concentrically.

[0008] The micro-expansion thermostat described above has a heat-conducting component whose upper end contacts the heating surface mounting plate, while its lower end does not contact the low-temperature contact plate, i.e., a gap exists.

[0009] The aforementioned micro-expansion thermostat has heating surface mounting holes and low-temperature contact plate mounting holes respectively provided on its heating surface mounting plate and low-temperature contact plate.

[0010] The aforementioned micro-expansion thermostat has a rectangular heating surface mounting plate and a low-temperature contact plate, with the heating surface mounting holes and the low-temperature contact plate mounting holes located at the four corners.

[0011] The beneficial effects of this invention are:

[0012] Based on the micro-expansion characteristics, this invention generates heat when the cooled component is working, causing the heat-conducting component to expand in volume at high temperatures and come into contact with the low-temperature end plane, thus opening the heat transfer path from the hotter component to the low-temperature end. When the temperature of the heat-conducting component is low, its volume contracts and separates from the low-temperature end plane, thus cutting off the heat transfer path. This ensures that the temperature of the cooled component does not drop too low and maintains a normal operating temperature range.

[0013] This invention simplifies the cooling scheme for the cooled equipment, controls the temperature of the heat-generating equipment within a certain range, and achieves constant temperature control. Using this constant temperature controller optimizes the equipment's structural design and improves its reliability and service life. In summary, compared with traditional heat dissipation methods, this invention features simple structure, safety and reliability, and maintenance-free operation, exhibiting better adaptability and significant economic and social benefits. Attached Figure Description

[0014] Figure 1 This is a side view of the present invention patent;

[0015] Figure 2 This is a top view of the present invention.

[0016] The labels in the attached drawings are as follows: 1—Heating surface mounting plate, 2—Low-temperature contact plate, 3—Heat-conducting component, 4—Fixing rod, 5—Heating surface mounting hole, 6—Low-temperature contact plate mounting hole, 7—Heating surface temperature sensor, 8—Low-temperature contact plate temperature sensor. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0018] like Figure 1 , Figure 2 As shown, this invention patent is a micro-expansion constant temperature controller, including a low-temperature contact plate 2 and a heating surface mounting plate 1 arranged parallel above the low-temperature contact plate 2 for connecting heating devices. It also includes a plurality of heat-conducting components 3 movably installed between the low-temperature contact plate 2 and the heating surface mounting plate 1 by fixing rods 4. The heating surface mounting plate 1 and the low-temperature contact plate 2 are respectively provided with a heating surface temperature sensor 7 and a low-temperature contact plate temperature sensor 8 for real-time acquisition of the temperature of the heating surface mounting plate 1 and the low-temperature contact plate 2.

[0019] In this embodiment, the preferred heat-conducting component 3 is a heat-conducting disc. The movable disc is made of a material with a high coefficient of thermal expansion. The circular heat-conducting disc is evenly arranged on the heating surface mounting plate 1 and the low-temperature contact plate 2, taking into account both production and installation convenience and heat dissipation efficiency.

[0020] In this embodiment, the heat-conducting component 3 is connected and installed with the heating surface mounting plate 1 of the heating device. The upper end of the heat-conducting component 3 is in contact with the heating surface mounting plate 1, while the lower end is not in contact with the low-temperature contact plate 2, i.e., there is a gap. When the heating device is working, the heat generated causes the movable heat-conducting disk to expand and lengthen along the axial direction, making contact with the cold end plane of the low-temperature contact plate 2, thereby cooling the heating device. If the temperature of the heating device decreases, the movable heat-conducting disk shortens along the axial direction, separating from the cold end plane of the low-temperature contact plate 2, or the contact thermal resistance increases, ensuring that the temperature of the cooled device does not drop too low and ensuring that the cooled device works normally.

[0021] The heating surface mounting plate 1 has a smaller area than the low temperature contact plate 2 and is arranged concentrically, which ensures that the heating device installed on the heating surface mounting plate 1 is smaller than the low temperature contact plate 2, which facilitates rapid temperature reduction, and also makes the heating surface temperature sensor 7 and the low temperature contact plate temperature sensor 8 staggered so that they do not interfere with each other.

[0022] The heating surface mounting plate 1 and the low temperature contact plate 2 are respectively provided with heating surface mounting holes 5 and low temperature contact plate mounting holes 6. Moreover, both the heating surface mounting plate 1 and the low temperature contact plate 2 are rectangular, and the heating surface mounting holes 5 and the low temperature contact plate mounting holes 6 are located at the four corners, which facilitates fixed installation on heating devices and other equipment.

[0023] This invention relates to a constant temperature control device based on micro-expansion characteristics. It achieves cooling between the cooled equipment and the low-temperature heat sink through the micro-expansion of the device after heating, and keeps the temperature of the cooled components within a certain range, thereby enhancing the adaptability of the equipment, optimizing the structural design of the equipment, and improving the reliability and service life of the system.

[0024] In summary, compared with traditional heat dissipation methods, this invention has the characteristics of simple structure, safety and reliability, and maintenance-free operation, and has better adaptability, resulting in significant economic and social benefits.

[0025] The above description is merely a preferred embodiment of the present invention. The orientations or positional relationships shown are only for the convenience of describing the present invention and simplifying the description. Terms such as "setting," "installing," "connecting," and "fixing" should be interpreted broadly. For those skilled in the art, the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A micro-expansion thermostat, characterized in that: It includes a low-temperature contact plate (2) and a heating surface mounting plate (1) arranged in parallel above the low-temperature contact plate (2), and also includes several heat-conducting components (3) that are movably installed between the low-temperature contact plate (2) and the heating surface mounting plate (1) by means of a fixing rod (4). The heating surface mounting plate (1) and the low-temperature contact plate (2) are respectively provided with a heating surface temperature sensor (7) and a low-temperature contact plate temperature sensor (8).

2. The micro-expansion thermostat according to claim 1, characterized in that, The heat-conducting component (3) is a heat-conducting disk.

3. The micro-expansion thermostat according to claim 1, characterized in that, The area of ​​the heating surface mounting plate (1) is smaller than that of the low temperature contact plate (2) and they are arranged concentrically.

4. A micro-expansion thermostat according to claim 1, 2, or 3, characterized in that, The upper end of the heat-conducting component (3) is in contact with the heating surface mounting plate (1), and the lower end has a gap with the low-temperature contact plate (2).

5. A micro-expansion thermostat according to claim 4, characterized in that, The heating surface mounting plate (1) and the low temperature contact plate (2) are respectively provided with heating surface mounting holes (5) and low temperature contact plate mounting holes (6).

6. A micro-expansion thermostat according to claim 5, characterized in that, The heating surface mounting plate (1) and the low temperature contact plate (2) are both rectangular, and the heating surface mounting hole (5) and the low temperature contact plate mounting hole (6) are located at the four corners.

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