Silicon-based OLED micro display screen and preparation method thereof

Abstract

The invention discloses a silicon-based OLED (Organic Light Emitting Diode) micro display screen and a preparation method thereof. The silicon-based OLED micro display screen comprises a silicon-based CMOS (Complementary Metal Oxide Semiconductor) circuit substrate; the light-emitting element layer, the thin film packaging layer, the color film layer and the first glass cover plate are sequentially arranged on the silicon-based CMOS circuit substrate; the second glass cover plate is arranged on one side, far away from the silicon-based CMOS circuit substrate, of the first glass cover plate; the second glass cover plate is attached to the first glass cover plate through a first optical adhesive layer; the second glass cover plate comprises a body part and a micro lens structure arranged on the side, away from the silicon-based CMOS circuit substrate, of the body part. According to the technical scheme provided by the invention, the micro display screen which is relatively low in cost and higher in safety is provided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a silicon-based OLED micro display screen and a preparation method thereof. BACKGROUND

[0002] At present, silicon-based OLED micro display gradually becomes the mainstream choice of AR (Augmented Reality) and VR (Virtual Reality) display products. Unlike conventional display screens, in the field of AR&VR applications, the light emitted by the silicon-based OLED micro display as a screen does not directly enter the human eye, but passes through the specific optical module, and is refracted and reflected multiple times between the lens or special film layer before entering the human eye. That is, the micro display screen and the optical module jointly determine the final imaging effect of the screen picture in the human eye.

[0003] At present, the mainstream optical module schemes include Pancake (folding light path), Bird Bath (using a combination of mirrors and beam splitters), waveguide (including diffraction and geometric waveguide), etc. After the screen display picture passes through the optical module, the final eye picture will change to a certain extent, such as non-uniform brightness, color deviation, etc. To solve this problem, the common solution is that the micro display screen supplier cooperates with the optical scheme supplier, and the micro display screen supplier offsets the Micro lens (micro lens) arrangement position on the CF layer according to the specific requirements of the optical scheme supplier. However, this scheme requires high-precision exposure technology, which is difficult and costly, and the process is carried out on high-value wafers, so once there is a quality abnormality in the process engineering, it will cause greater loss. SUMMARY

[0004] The embodiments of the present application provide a silicon-based OLED micro display screen and a preparation method thereof, so as to provide a micro display screen with lower cost and higher safety.

[0005] In a first aspect, the embodiments of the present application provide a silicon-based OLED micro display screen, comprising: a silicon-based CMOS circuit substrate; and a light emitting element layer, a thin film packaging layer, a color film layer and a first glass cover plate arranged in sequence on the silicon-based CMOS circuit substrate.

[0006] A second glass cover plate is arranged on the side of the first glass cover plate away from the silicon-based CMOS circuit substrate; the second glass cover plate is attached to the first glass cover plate through a first optical adhesive layer.

[0007] The second glass cover plate comprises a body portion and a micro lens structure arranged on the side of the body portion away from the silicon-based CMOS circuit substrate.

[0008] Secondly, embodiments of the present invention also provide a method for fabricating a silicon-based OLED microdisplay, applicable to the silicon-based OLED microdisplay provided in any embodiment of the present invention, comprising:

[0009] Obtain a silicon-based CMOS circuit substrate;

[0010] A light-emitting element layer, a thin-film encapsulation layer, and a color filter layer are sequentially formed on the silicon-based CMOS circuit substrate; and a first glass cover plate is attached to the side of the color filter layer away from the silicon-based CMOS circuit substrate to form a master structure;

[0011] The master structure is subjected to cutting and bonding processes to form a display module;

[0012] A second glass cover is formed by etching a glass sheet; the second glass cover includes a body portion and a microlens structure disposed on one side of the body portion;

[0013] A first optical adhesive layer is attached to the side of the second glass cover away from the microlens structure; and the second glass cover is attached to the first glass cover of the display module through the first optical adhesive layer.

[0014] In this invention, the silicon-based OLED microdisplay includes a silicon-based CMOS circuit substrate; and a light-emitting element layer, a thin-film encapsulation layer, a color filter layer, and a first glass cover plate sequentially disposed on the silicon-based CMOS circuit substrate. It should be noted that the silicon-based OLED microdisplay also includes a second glass cover plate, which includes a body portion and a microlens structure disposed on the side of the body portion away from the silicon-based CMOS circuit substrate. Therefore, in this embodiment, the microlens structure is directly fabricated on the second glass cover plate. Compared to directly fabricating the microlens structure on the color filter layer of the silicon-based OLED microdisplay, this method is less expensive, results in less loss in the event of quality abnormalities, and allows for flexible matching of second glass cover plates containing different microlens structures with displays of the same specifications, meeting the matching requirements of different optical modules and avoiding wasted production capacity and idle inventory. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a silicon-based OLED microdisplay in the prior art;

[0016] Figure 2 This is a schematic diagram of another silicon-based OLED microdisplay in the prior art.

[0017] Figure 3 This is a schematic diagram of the structure of a silicon-based OLED microdisplay provided in an embodiment of the present invention;

[0018] Figure 4This is a schematic diagram of a second glass cover plate attached to a silicon-based OLED microdisplay, provided by an embodiment of the present invention.

[0019] Figure 5 A schematic diagram of the display area of ​​a silicon-based OLED microdisplay provided in an embodiment of the present invention;

[0020] Figure 6 A schematic diagram of the arrangement of a microlens structure provided for the implementation of this invention;

[0021] Figure 7 A schematic diagram of another microlens structure provided for implementation of the present invention;

[0022] Figure 8 A schematic diagram of another microlens structure provided for implementation of the present invention;

[0023] Figure 9 A schematic diagram of another microlens structure provided for implementation of the present invention;

[0024] Figure 10 This is a schematic flowchart illustrating a method for fabricating a silicon-based OLED microdisplay provided in an embodiment of the present invention. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0026] Figure 1 This is a schematic diagram of the structure of a silicon-based OLED microdisplay in the prior art. Figure 2 This is a schematic diagram of another silicon-based OLED microdisplay in the prior art. The silicon-based OLED microdisplay includes a silicon-based CMOS circuit substrate 11', an organic light-emitting layer 12', an encapsulation layer 13', and a CF layer 14'. Microlenses (microlenses 15') are formed on the CF layer 14' using methods such as dispensing, to meet the display requirements of AR or VR. A typical arrangement is as follows... Figure 1 As shown, microlenses 15' are uniformly arranged on the color filter units of the CF layer 14'. When it is necessary to change parameters such as the optical path, the microdisplay supplier collaborates with the optical solution supplier, with the microdisplay supplier modifying the optical solution according to the specific requirements of the optical solution supplier, such as... Figure 2As shown, the positions of the microlenses (microlenses 15') on the CF layer 14' are offset according to a certain pattern to create uneven brightness or light emission angles across the entire display area. Matched with a specific optical scheme, this ultimately eliminates uneven brightness and color shift in the image. However, this method requires high-precision exposure processes to form the microlenses, which is technically challenging and costly. Furthermore, because this process is performed on high-value wafers, any quality issues during the process can easily damage the wafer, resulting in significant losses. Additionally, the offset structure of the microlens, once manufactured, only fits the current optical design requirements, exhibiting poor compatibility.

[0027] To address the above problems, embodiments of the present invention provide a silicon-based OLED microdisplay, such as... Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of a silicon-based OLED microdisplay provided in an embodiment of the present invention. The silicon-based OLED microdisplay includes: a silicon-based CMOS circuit substrate 11; and a light-emitting element layer 12, a thin film encapsulation layer 13, a color filter layer 14 and a first glass cover plate 15 sequentially disposed on the silicon-based CMOS circuit substrate 11.

[0028] The second glass cover plate 16 is disposed on the side of the first glass cover plate 15 away from the silicon-based CMOS circuit substrate 11; the second glass cover plate 16 and the first glass cover plate 15 are bonded together by the first optical adhesive layer 17.

[0029] The second glass cover plate 16 includes a body portion 161 and a microlens structure 162 disposed on the side of the body portion 161 away from the silicon-based CMOS circuit board 11.

[0030] refer to Figure 3 The silicon-based OLED microdisplay structure of this embodiment includes: a silicon-based CMOS circuit substrate 11; a light-emitting element layer 12 disposed on the silicon-based CMOS circuit substrate 11, the light-emitting element layer 12 may include multiple light-emitting elements of the same color or multiple light-emitting elements of different colors, for emitting light of corresponding colors; the light-emitting element layer 12 may be an organic light-emitting layer, which can be formed by vapor deposition; a thin film encapsulation layer 13 disposed on the light-emitting element layer 12; and a color filter layer 14 (CF) disposed on the thin film encapsulation layer 13. The color filter layer 14 may include color filters 140 of different colors. For example, it includes a red color filter 141, a green color filter 142, and a blue color filter 143. The light-emitting elements can be arranged one-to-one with the color filters. The light emitted by the light-emitting elements passes through the red color filter 141 to form red light, the light emitted by the light-emitting elements passes through the green color filter 142 to form green light, and the light emitted by the light-emitting elements passes through the blue color filter 143 to form blue light, thereby the silicon-based OLED microdisplay displays the corresponding image.

[0031] A first glass cover plate 15 is formed on the color filter layer 14, which protects the color filter layer 14 and the silicon-based CMOS circuit substrate 11 and light-emitting element layer 12 beneath it. In this embodiment, instead of directly forming a microlens structure on the color filter layer 14, it is separately disposed on a second glass cover plate 16, resulting in lower cost. In case of quality issues, the second glass cover plate 16 can be discarded, minimizing losses. Specifically, the second glass cover plate 16 may include a body portion 161 and a microlens structure 162 disposed on one side of the body portion 161. In this embodiment, the side of the body portion 161 of the second glass cover plate 16 away from the microlens structure 162 is bonded to the first glass cover plate 15 using a first optical adhesive layer 17. The structure and arrangement of the microlens structure 162 of the second glass cover plate 16 need to be customized according to the requirements of the optical module supplier to match the optical module and achieve the best visual display effect. This embodiment employs a double-layer glass cover plate, forming a lens structure on the second glass cover plate 16. This approach results in lower costs and minimizes losses when the quality of the formed microlens structure is poor. Furthermore, silicon-based OLED microdisplays of the same specifications can be flexibly paired with lens glass cover plates (second glass cover plate 16) of different structures to meet the matching requirements of different optical module solutions. This expands the applicable scenarios for silicon-based OLED microdisplays and avoids wasted production capacity and idle inventory.

[0032] Optionally, the microlens structure 162 can be formed by an etching process. Specifically, the etching process for the microlens structure 162 can be one of the following: wet etching, ion beam etching, laser etching, and dry etching. For example, in this embodiment, the microlens structure 162 can be formed by etching with an ICP etching machine. An ICP etching machine is a dry etching device based on inductively coupled plasma technology, widely used in semiconductor manufacturing, microelectronics, and optoelectronic device processing. This device generates plasma through high-frequency electric and magnetic fields, combined with reactive gases to achieve high-precision etching, featuring good anisotropy and fast etching rate.

[0033] Figure 4 This is a schematic diagram of a second glass cover plate attached to a silicon-based OLED microdisplay according to an embodiment of the present invention. Optionally, after etching to form the second glass cover plate 16 with a microlens structure 162, a first optical adhesive layer 17 can be attached to the side of the body portion 161 of the second glass cover plate 16 away from the microlens structure 162, and then the second glass cover plate 16 is attached to the first glass cover plate 15 of the silicon-based OLED microdisplay. Optionally, the first optical adhesive layer 17 can be a solid optical adhesive layer. Solid optical adhesive (OCA) exists in the form of a solid dry film, usually a substrate-free double-sided adhesive tape. In this embodiment, the first glass cover plate 15 is directly attached using the solid first optical adhesive layer 17.

[0034] Optionally, the color filter layer 14 and the first glass cover plate 15 can be bonded together using a second optical adhesive layer 18; the second optical adhesive layer 18 is a liquid optical adhesive. Liquid optical adhesive (LOCA) is liquid before curing, has good fluidity, and can be precisely applied through dispensing, screen printing, etc., and can fill the gap between the color filter layer 14 and the first glass cover plate 15, thus protecting the silicon-based OLED microdisplay. Optionally, the silicon-based OLED microdisplay may also include a flexible printed circuit (FPC) bonded to the bonding area of ​​the silicon-based CMOS circuit substrate 11. The controller provides driving signals to the silicon-based OLED microdisplay through the flexible printed circuit.

[0035] In this embodiment of the invention, the silicon-based OLED microdisplay includes a silicon-based CMOS circuit substrate; and a light-emitting element layer, a thin-film encapsulation layer, a color filter layer, and a first glass cover plate sequentially disposed on the silicon-based CMOS circuit substrate. It should be noted that the silicon-based OLED microdisplay also includes a second glass cover plate, and the second glass cover plate includes a body portion and a microlens structure disposed on the side of the body portion away from the silicon-based CMOS circuit substrate. Therefore, in this embodiment, the microlens structure is directly fabricated on the second glass cover plate. Compared to directly fabricating the microlens structure on the color filter layer of the silicon-based OLED microdisplay, this method is lower in cost, results in less loss in the event of quality abnormalities, and allows for flexible matching of second glass cover plates containing different microlens structures with displays of the same specifications, meeting the matching requirements of different optical modules and avoiding wasted production capacity and idle inventory.

[0036] The above is the core idea of ​​this invention. The technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0037] Optionally, the thickness of the second glass cover 16 can range from 0.1 mm to 0.2 mm; the diameter of the spherical cross-section of the microlens structure 162 perpendicular to the plane of the silicon-based CMOS circuit substrate 11 can range from 1 μm to 10 μm. In this embodiment, the thickness of the second glass cover 16 is controlled within the range of 0.1 mm to 0.2 mm to avoid reducing transmittance and making the silicon-based OLED microdisplay too thick. The diameter of the cross-section of the microlens structure 162 formed by etching, perpendicular to the plane of the silicon-based CMOS circuit substrate 11, ranges from 1 μm to 10 μm. The plane perpendicular to the silicon-based CMOS circuit substrate 11 is perpendicular to the extension direction of the microlens structure 162, thereby obtaining the cross-sectional dimensions of the microlens structure 162. Since the cost of glass is low, quality abnormalities during the manufacturing process will not cause too much loss. After the manufacturing is completed, qualified products of the second glass cover 16 are selected, and then the process of bonding the second glass cover 16 to the silicon-based OLED microdisplay is continued.

[0038] The following provides several feasible lens arrangement examples. Optional, Figure 5 As shown, Figure 5 This is a schematic diagram of the display area of ​​a silicon-based OLED microdisplay provided in an embodiment of the present invention. The display area includes a central region A1 and an edge region A2 surrounding the central region A1. The arrangement of the microlens structure 162 is obtained from a first position B1 in the central region A1 and from a second position B2 in the edge region A2 to obtain the differences between different optical module schemes.

[0039] Figure 6This is a schematic diagram of the arrangement of a microlens structure provided for an embodiment of the present invention. Optionally, within a first plane P1 perpendicular to the extension direction of the microlens structure 162, the centerline of the microlens structure 162 in the direction perpendicular to the silicon-based CMOS circuit substrate 11 is designated as the first centerline L1; the centerline of the color filter 140 of the color filter layer 14 in the direction perpendicular to the silicon-based CMOS circuit substrate 11 is designated as the second centerline L2; in the central region A1 of the display area, the distance between the second centerline L2 of the color filter 140 and the corresponding first centerline L1 of the microlens structure 162 is designated as the first distance d1; in the edge region A2 of the display area, the distance between the second centerline L2 of the color filter 140 and the corresponding first centerline L1 of the microlens structure 162 is designated as the second distance d2; wherein, the first distance d1 is smaller than the second distance d2. When the optical design requires changing the optical path position, emission angle, and color gamut of the edge region A2, the position of the microlens structure 162 in the edge region A2 is shifted. Within a first plane P1 perpendicular to the extending direction of the microlens structure 162, the microlens structure 162 forms a spherical or near-spherical cross-section. The centerline of this cross-section in the direction perpendicular to the silicon-based CMOS circuit substrate 11 is designated as the first centerline L1, and the centerline of the color filter 140 in the direction perpendicular to the silicon-based CMOS circuit substrate 11 is designated as the second centerline L2. In the central region A1, the position of the microlens structure 162 does not shift or the shift is minimal. Figure 6 As shown, the distance between the second center line L2 of the color filter 140 and the first center line L1 of the corresponding microlens structure 162 is the first distance d1, which may be zero. In the edge region A2, the distance between the second center line L2 of the color filter 140 and the first center line L1 of the corresponding microlens structure 162 at the second position B2 is the first distance d2. Figure 6 It can be seen that d2 is greater than d1. That is, in this embodiment, the offset of the microlens structure 162 in the edge region A2 is controlled to be greater than the offset of the center region A1 in order to achieve specific light output requirements.

[0040] Figure 7 The schematic diagram of another arrangement of microlens structures provided for the implementation of the present invention shows that, optionally, in the first plane P1 perpendicular to the extension direction of the microlens structure 162, the center line of the microlens structure 162 in the direction perpendicular to the silicon-based CMOS circuit substrate 11 is the first center line L1; in the central region A1 of the display area, the distance between the first center lines L1 of two adjacent microlens structures 162 is the third distance d3; in the edge region A2 of the display area, the distance between the first center lines L1 of two adjacent microlens structures 162 is the fourth distance d4; wherein, the third distance d3 is smaller than the fourth distance d4.

[0041] Similarly, within the first plane P1 perpendicular to the extending direction of the microlens structure 162, the microlens structure 162 forms a spherical or near-spherical cross-section, the centerline of which is perpendicular to the silicon-based CMOS circuit substrate 11 and is designated as the first centerline L1. In the central region A1 of the display area, the distance between the first centerlines L1 of two adjacent microlens structures 162 is the third distance d3; in the edge region A2 of the display area, the distance between the first centerlines L1 of two adjacent microlens structures 162 is the fourth distance d4. Figure 7 As can be seen, in this embodiment, d4 is controlled to be greater than d3. That is, in this embodiment, the spacing between the microlens structures 162 in the edge region A2 is controlled to be greater than the spacing between the microlens structures 162 in the central region A1. The light output performance of the edge region A2 is adjusted by increasing the spacing between adjacent microlens structures 162 in the edge region A2.

[0042] Figure 8 This is a schematic diagram illustrating another arrangement of microlens structures provided for an embodiment of the present invention. Optionally, within a first plane P1 perpendicular to the extending direction of the microlens structure 162, the microlens structure 162 has a spherical cross-section; in the central region A1 of the display area, the diameter of the spherical cross-section of the microlens structure 162 is a first diameter r1; in the edge region A2 of the display area, the diameter of the spherical cross-section of the microlens structure 162 is a second diameter r2; wherein the first diameter r1 is smaller than the second diameter r2. Within the first plane P1 perpendicular to the extending direction of the microlens structure 162, the microlens structure 162 forms a spherical or near-spherical cross-section. In the central region A1 of the display area, the diameter of the spherical cross-section of the microlens structure 162 is the first diameter r1, and in the edge region A2 of the display area, the diameter of the spherical cross-section of the microlens structure 162 is the second diameter r2. In this embodiment, the radius of curvature of the microlens structure 162 in the edge region A2 is controlled to be greater than the radius of curvature of the microlens structure 162 in the central region A1, thereby controlling parameters such as light path, light angle, brightness and color gamut, thereby eliminating the uneven brightness and color shift of the image entering the eye and achieving special display requirements.

[0043] Figure 9The schematic diagram of another microlens structure provided for the implementation of the present invention shows that, optionally, in the first plane P1 perpendicular to the extension direction of the microlens structure 162, the first surface of the body portion 161 near the microlens structure 162 has an inclination angle with the plane where the silicon-based CMOS circuit substrate 11 is located; in the central region A1 of the display area, the inclination angle of the body portion 161 is the first inclination angle α1; in the edge region A2 of the display area, the inclination angle of the body portion 161 is the second inclination angle α2; wherein, the first inclination angle α1 is smaller than the second inclination angle α2. In the edge region A2 of the display area, the tilt angle of the body portion 161 is the second tilt angle α2, while in the central region A1 of the display area, the tilt angle of the body portion 161 is the first tilt angle α1. As shown in Figure 9, the value of the first tilt angle α1 tends to zero, while the second tilt angle α2 is relatively large. Therefore, in this embodiment, by controlling the tilt angle between the first surface of the body portion 161 close to the microlens structure 162 and the plane where the silicon-based CMOS circuit substrate 11 is located, the tilt angle of the edge region A2 of the display area is controlled to be larger, thereby adjusting the optical parameters and achieving the target optical design. The above embodiments show four different optical adjustment schemes. This embodiment includes, but is not limited to, the above four schemes. Other schemes can also be set, all of which can be achieved by setting the microlens structure 162 of the second glass cover plate 16. The setting cost is low, and the same specification of display screen can be flexibly matched with second glass cover plates containing different microlens structures to meet the matching requirements of different optical modules and avoid production capacity waste and idle inventory.

[0044] Based on the same concept, embodiments of the present invention also provide a method for fabricating a silicon-based OLED microdisplay. Figure 10 This is a schematic flowchart of a method for fabricating a silicon-based OLED microdisplay provided in an embodiment of the present invention, as shown below. Figure 10 As shown, the method in this embodiment includes the following steps:

[0045] Step S101: Obtain a silicon-based CMOS circuit substrate.

[0046] Step S102: A light-emitting element layer, a thin film encapsulation layer, and a color filter layer are sequentially formed on a silicon-based CMOS circuit substrate; and a first glass cover plate is attached to the side of the color filter layer away from the silicon-based CMOS circuit substrate to form a master structure.

[0047] This embodiment obtains a silicon wafer containing CMOS circuitry and deposits an organic light-emitting layer (light-emitting element layer) on the silicon wafer; deposits a thin-film encapsulation layer on the organic light-emitting layer; fabricates a color filter layer on the thin-film encapsulation layer using photolithography; and performs a first-layer glass cover bonding process on the color filter layer using a second optical adhesive layer 18, using the first-layer glass cover and liquid optical adhesive to protect the display area. At this point, a master structure containing multiple silicon-based OLED microdisplays is formed.

[0048] Step S103: Perform cutting and bonding processes on the master structure to form a display module.

[0049] The wafer is diced into individual dies; and module processes such as FPC bonding are performed to fabricate display modules for micro-display screens.

[0050] Step S104: The glass plate is etched to form a second glass cover plate; the second glass cover plate includes a body part and a microlens structure disposed on one side of the body part.

[0051] At this point, a second glass cover plate needs to be etched using another glass sheet. During the etching process, the main body and a microlens structure disposed on one side of the main body are formed. Based on the above embodiment, the etching process for the microlens structure can be one of the following: wet etching, ion beam etching, laser etching, and dry etching. Since glass is relatively inexpensive, quality defects during manufacturing will not cause significant losses. After manufacturing, qualified products are selected, and the bonding process with the microdisplay is then completed.

[0052] Step S105: Attach the first optical adhesive layer to the side of the second glass cover away from the microlens structure; and attach the second glass cover to the first glass cover of the display module through the first optical adhesive layer.

[0053] For the second glass cover containing the microlens structure, an OCA adhesive layer (first optical adhesive layer) is bonded to the lower surface of its body portion away from the microlens structure, and the second glass cover is then bonded to the first glass cover of the microdisplay screen via the first optical adhesive layer. Optionally, the second glass cover and the first glass cover are bonded in a vacuum environment to avoid air bubbles between the two glass cover layers and improve the image display effect of the silicon-based OLED microdisplay.

[0054] In this embodiment of the invention, the silicon-based OLED microdisplay includes a silicon-based CMOS circuit substrate; and a light-emitting element layer, a thin-film encapsulation layer, a color filter layer, and a first glass cover plate sequentially disposed on the silicon-based CMOS circuit substrate. It should be noted that the silicon-based OLED microdisplay also includes a second glass cover plate, and the second glass cover plate includes a body portion and a microlens structure disposed on the side of the body portion away from the silicon-based CMOS circuit substrate. Therefore, in this embodiment, the microlens structure is directly fabricated on the second glass cover plate. Compared to directly fabricating the microlens structure on the color filter layer of the silicon-based OLED microdisplay, this method is lower in cost, results in less loss in the event of quality abnormalities, and allows for flexible matching of second glass cover plates containing different microlens structures with displays of the same specifications, meeting the matching requirements of different optical modules and avoiding wasted production capacity and idle inventory.

[0055] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A silicon-based OLED microdisplay, characterized in that, include: Silicon-based CMOS circuit substrate; And the light-emitting element layer, thin film encapsulation layer, color filter layer and first glass cover plate are sequentially disposed on the silicon-based CMOS circuit substrate; The second glass cover is disposed on the side of the first glass cover away from the silicon-based CMOS circuit substrate; the second glass cover and the first glass cover are bonded together by a first optical adhesive layer; The second glass cover includes a body portion and a microlens structure disposed on the side of the body portion away from the silicon-based CMOS circuit substrate.

2. The silicon-based OLED microdisplay according to claim 1, characterized in that, The color filter layer and the first glass cover are bonded together by a second optical adhesive layer; The first optical adhesive layer is a solid optical adhesive layer; the second optical adhesive layer is a liquid optical adhesive.

3. The silicon-based OLED microdisplay according to claim 1, characterized in that, The thickness of the second glass cover plate ranges from 0.1 mm to 0.2 mm; the diameter of the spherical cross-section of the microlens structure in the plane perpendicular to the silicon-based CMOS circuit substrate ranges from 1 μm to 10 μm.

4. The silicon-based OLED microdisplay according to claim 1, characterized in that, In a first plane perpendicular to the extension direction of the microlens structure, the centerline of the microlens structure in the direction perpendicular to the silicon-based CMOS circuit substrate is the first centerline; the centerline of the color filter of the color filter layer in the direction perpendicular to the silicon-based CMOS circuit substrate is the second centerline. In the central region of the display area, the distance between the second center line of the color filter and the first center line of the corresponding microlens structure is the first distance; in the edge region of the display area, the distance between the second center line of the color filter 140 and the first center line of the corresponding microlens structure is the second distance. Wherein, the first spacing is smaller than the second spacing.

5. The silicon-based OLED microdisplay according to claim 1, characterized in that, In a first plane perpendicular to the extension direction of the microlens structure, the centerline of the microlens structure in the direction perpendicular to the silicon-based CMOS circuit substrate is the first centerline; In the central region of the display area, the distance between the first midline of two adjacent microlens structures is the third distance; in the edge region of the display area, the distance between the first midline of two adjacent microlens structures is the fourth distance. The third spacing is smaller than the fourth spacing.

6. The silicon-based OLED microdisplay according to claim 1, characterized in that, In a first plane perpendicular to the extending direction of the microlens structure, the microlens structure has a spherical cross-section; In the central region of the display area, the diameter of the spherical cross-section of the microlens structure is a first diameter; in the edge region of the display area, the diameter of the spherical cross-section of the microlens structure is a second diameter. Wherein, the first diameter is smaller than the second diameter.

7. The silicon-based OLED microdisplay according to claim 1, characterized in that, In a first plane perpendicular to the extending direction of the microlens structure, the first surface of the body portion near the microlens structure has an angle of inclination with the plane where the silicon-based CMOS circuit substrate is located; In the central region of the display area, the tilt angle of the main body portion is a first tilt angle; in the edge region of the display area, the tilt angle of the main body portion is a second tilt angle. Wherein, the first tilt angle is smaller than the second tilt angle.

8. A method for fabricating a silicon-based OLED microdisplay, characterized in that, The silicon-based OLED microdisplay according to any one of claims 1-7 comprises: Obtain a silicon-based CMOS circuit substrate; A light-emitting element layer, a thin-film encapsulation layer, and a color filter layer are sequentially formed on the silicon-based CMOS circuit substrate; and a first glass cover plate is attached to the side of the color filter layer away from the silicon-based CMOS circuit substrate to form a master structure; The master structure is subjected to cutting and bonding processes to form a display module; A second glass cover is formed by etching a glass sheet; the second glass cover includes a body portion and a microlens structure disposed on one side of the body portion; A first optical adhesive layer is attached to the side of the second glass cover away from the microlens structure; and the second glass cover is attached to the first glass cover of the display module through the first optical adhesive layer.

9. The method for fabricating a silicon-based OLED microdisplay according to claim 8, characterized in that, The etching process for the microlens structure is one of the following: Wet etching, ion beam etching, laser etching, and dry etching.

10. The method for fabricating a silicon-based OLED microdisplay according to claim 8, characterized in that, The second glass cover and the first glass cover are bonded together in a vacuum environment.

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