Substrate holding apparatus, substrate processing apparatus, and substrate processing method

Abstract

The invention relates to a substrate holding apparatus, a substrate processing apparatus, and a substrate processing method. The invention provides a technology capable of reducing the load of a rotation driving part. A substrate holding device (1) is provided with a porous member (21), a support member (221), a rotation drive unit (25), and a holding drive unit (24). The porous member (21) has an adsorption surface (21a) that adsorbs the film (82) on the substrate (80) with the frame. The support member (221) surrounds the porous member (21) and supports the frame (81) of the framed substrate (80). The rotation drive unit (25) integrally rotates the support member (221) and the porous member (21). The holding drive unit (24) includes a magnet (241) provided in a state spaced apart from the support member (221) on the opposite side of the support member (221) from the frame (81), and presses and holds the frame (81) against the support member (221) by the magnetic force of the magnet (241).

Description

Technical Field

[0001] This disclosure relates to a substrate holding device, a substrate processing device, and a substrate processing method. Background Technology

[0002] Patent Document 1 discloses a wafer processing apparatus for processing wafers. In Patent Document 1, a wafer is placed on a ring including a mounting frame and a protective film. The mounting frame has a ring-shaped plate shape, and the protective film is installed on the inner side of the mounting frame. The wafer is attached to the protective film of the ring. Hereinafter, the integral assembly including the wafer, the protective film, and the mounting frame will be referred to as a framed wafer.

[0003] The wafer processing apparatus includes a chuck platform for holding a wafer with a frame. The chuck platform includes a frame with recesses and suction pads embedded in the recesses of the frame. A protective film is placed on the suction pads, and a mounting frame is placed on the periphery of the frame.

[0004] The adsorption pad is a porous component. A vacuum mechanism draws the protective film onto the adsorption pad. An electromagnet is embedded in the frame; the electromagnet applies magnetic force to the mounting frame, pressing it against the frame. In this way, the framed wafer is held by the chuck platform.

[0005] [Background Technical Documents]

[0006] [Patent Literature]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 2010-137349 Summary of the Invention

[0008] [The problem the invention aims to solve]

[0009] As described above, in Patent Document 1, an electromagnet is installed in the frame. Therefore, the weight of the chuck platform increases. Consequently, when a rotary drive unit for rotating the chuck platform is provided, the load on the rotary drive unit increases.

[0010] Therefore, the purpose of this disclosure is to provide a technique that can reduce the load on the rotary drive unit.

[0011] [Technical means to solve the problem]

[0012] The substrate holding device comprises: a porous component having an adsorption surface for adsorbing a membrane comprising a ring-shaped frame, a membrane mounted inside the frame, and the membrane disposed in a framed substrate of a substrate of the membrane; a support component surrounding the porous component and supporting the frame; a rotation drive unit for rotating the support component and the porous component together; and a holding drive unit comprising a magnet disposed on the side opposite to the support component and the frame, spaced apart from the support component, wherein the frame is pressed and held onto the support component by the magnetic force of the magnet.

[0013] The substrate processing apparatus includes the substrate holding device and an ejection section for ejecting processing fluid onto the framed substrate held by the substrate holding device.

[0014] The substrate processing method includes: a magnetic holding step, wherein the frame comprising a ring-shaped frame, a membrane mounted on the frame, and a substrate of the membrane disposed thereon is pressed against the support member to hold the frame by magnetic force from a magnet disposed spaced apart from the support member; an adsorption step, wherein a negative pressure is applied to a porous component supporting the membrane to adsorb and hold the membrane; and a processing step, wherein the porous component, the support member, and the substrate are rotated integrally, and a processing fluid is supplied to the framed substrate.

[0015] [The effects of the invention]

[0016] Since the magnet is separated from the support component, it rotates without being driven by the rotary drive unit. Therefore, the load on the rotary drive unit can be reduced. Attached Figure Description

[0017] Figure 1 This is a diagram that schematically illustrates an example of the configuration of a substrate processing apparatus including the substrate holding device of the first embodiment.

[0018] Figure 2 This is a three-dimensional diagram that schematically represents an example of the structure of a framed substrate.

[0019] Figure 3 This is a block diagram that roughly represents an example of the structure of the control unit.

[0020] Figure 4 This is a flowchart illustrating an example of the operation of a substrate processing apparatus.

[0021] Figure 5 This is a diagram that schematically illustrates an example of the configuration of a substrate holding device during the transfer step.

[0022] Figure 6 This is a diagram that schematically illustrates an example of the state of the substrate holding device in the magnetic holding process.

[0023] Figure 7 This is a diagram that schematically illustrates an example of the substrate holding device during the adsorption process.

[0024] Figure 8 This is a diagram that schematically illustrates an example of the state of a substrate processing apparatus during a processing step.

[0025] Figure 9 This is a top view that roughly represents an example of the structure of the drive unit.

[0026] Figure 10 This is a diagram that schematically illustrates an example of the substrate holding device of the second embodiment.

[0027] Figure 11 This is a diagram that schematically illustrates an example of the substrate holding device of the second embodiment. Detailed Implementation

[0028] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. In addition, for ease of understanding, the dimensions or quantities of various parts are exaggerated or simplified in the drawings as needed. Furthermore, parts with the same structure and function are labeled with the same symbols, and repeated descriptions are omitted in the following explanation.

[0029] Furthermore, in the following description, the same symbols are used to illustrate the same constituent elements, and their names and functions are also the same. Therefore, there are cases where detailed descriptions have been omitted to avoid repetition.

[0030] Furthermore, in the following description, even when numbers such as "first" or "second" are used, these terms are used for the purpose of easily understanding the content of the implementation method and are not limited to the order that may be generated by the numbers.

[0031] When using expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along a direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.), unless otherwise specified, the expression does not strictly represent the positional relationship, but also indicates a relative displacement of angles or distances within tolerance or to achieve the same level of functionality. When using expressions indicating equality (e.g., "same," "equal," "homogeneous," etc.), unless otherwise specified, the expression does not quantitatively represent a strictly equal state, but also indicates a state with tolerances or differences in achieving the same level of functionality. When using expressions indicating shape (e.g., "quadrilateral" or "cylindrical"), unless otherwise specified, the expression does not strictly represent the shape geometrically, but also indicates a shape with concavity, convexity, or chamfers, etc., within the range to achieve the same level of effect. When using expressions such as "equipped," "equipped," "possesses," "comprises," or "has" a constituent element, the expression is not an exclusive expression excluding the existence of other constituent elements. When using the expression "at least one of A, B and C", the expression includes only A, only B, only C, any two of A, B and C, and all of A, B and C.

[0032] <First Implementation>

[0033] Figure 1 This is a schematic diagram illustrating an example of the configuration of a substrate processing apparatus 1 including the substrate holding device 20 of the first embodiment. The substrate processing apparatus 1 is a monolithic processing apparatus that processes framed substrates 80 one by one.

[0034] Figure 2 This is a perspective view illustrating, schematically, an example of the configuration of the framed substrate 80. (See diagram below.) Figure 2 As shown, the framed substrate 80 includes a frame 81, a film 82, and a substrate 83. The frame 81 is formed of a magnetic material (e.g., stainless steel). Figure 2 As shown, frame 81 has a ring-shaped, plate-like shape. Figure 2 In the example, the inner circumferential surface of frame 81 has a circular shape when viewed from above. The inner diameter of frame 81 is, for example, several hundred mm (for example, about 200 mm or more and about 400 mm). The maximum value of the outer diameter of frame 81 can be set to be, for example, an amount that is about tens of mm larger than the inner diameter of frame 81. The thickness of frame 81 is, for example, several mm (for example, about 1 mm or more and about 5 mm).

[0035] The membrane 82 is disposed inside the frame 81. Specifically, the periphery of the membrane 82 is fixed to the frame 81. Therefore, the membrane 82 closes the inner opening of the frame 81. In other words, the membrane 82 is exposed at the inner opening of the frame 81. The membrane 82 is elastic. The membrane 82 is formed, for example, from a synthetic resin. Hereinafter, the portion including the frame 81 and the membrane 82 will also be referred to as the cutting ring. A substrate 83 is disposed on a main surface 82a of the membrane 82. The substrate 83 is mounted on the main surface 82a of the membrane 82, for example, by means of attachment.

[0036] exist Figure 1 In the example, multiple substrates 83 are attached to the main surface 82a of the film 82. Additionally, in... Figure 2 For simplicity, the illustration of multiple substrates 83 is omitted, and only one substrate 83 is shown. The substrate 83 is, for example, a semiconductor chip, also known as a die. Each substrate 83 has a plate-like shape. Each substrate 83 is attached to the main surface 82a of the film 82 in an orientation along the thickness direction of both the frame 81 and the film 82. Each substrate 83 has, for example, a rectangular shape when viewed from above. The multiple substrates 83 are arranged, for example, in a matrix when viewed from above. Gaps can be formed between adjacent substrates 83. The multiple substrates 83 can be formed, for example, by cutting a single substrate.

[0037] like Figure 1 As shown, the substrate processing apparatus 1 may include a chamber 10. The chamber 10 has a box-shaped form and an internal space. The internal space corresponds to the processing space for processing the framed substrate 80. An openable and closable inlet / outlet (not shown) is provided in the chamber 10. A conveying unit (not shown) conveys the unprocessed framed substrate 80 into the chamber 10 through the inlet / outlet. As described later, the substrate processing apparatus 1 processes the framed substrate 80. Then, the conveying unit removes the processed framed substrate 80 from the chamber 10 through the inlet / outlet.

[0038] exist Figure 1 In this example, a substrate holding device 20 is disposed within a chamber 10. The substrate holding device 20 holds a framed substrate 80 and rotates the framed substrate 80 about a rotation axis Q1. The framed substrate 80 is held by the substrate holding device 20 with the substrate 83 positioned above the film 82. The rotation axis Q1 is an axis along a vertical direction, for example, passing through the center of a circle along the inner circumferential surface of the frame 81. Hereinafter, the circumferential and radial directions with respect to the rotation axis Q1 will be simply referred to as circumferential and radial, respectively.

[0039] like Figure 1 As shown, the substrate holding device 20 includes a porous component 21, a base 22, a rotation drive unit 25, and a holding drive unit 24.

[0040] The porous component 21 is a component used to adsorb the film 82 of the framed substrate 80. The porous component 21 has porous properties and is formed, for example, from a ceramic such as alumina. Figure 1 In the example, the porous component 21 has a plate-like shape and is arranged with its thickness direction aligned vertically. The porous component 21 has an adsorption surface 21a, a side surface 21b, and a bottom surface 21c. The adsorption surface 21a is in contact with the main surface 82b of the membrane 82 to support the membrane 82. The main surface 82b is the surface opposite to the main surface 82a, and no substrate 83 is disposed on the main surface 82b. Figure 1 In the example, adsorption surface 21a corresponds to the upper surface of porous component 21, and main surface 82b corresponds to the lower surface of membrane 82. See also Figure 5 The adsorption surface 21a may have a flat surface 21aa and a peripheral surface 21ab. The flat surface 21aa is, for example, a horizontal surface. However, minute irregularities may be formed on the flat surface 21aa. The flat surface 21aa may have a circular shape when viewed from above. The peripheral surface 21ab is the portion surrounding the flat surface 21aa when viewed from above, corresponding to the peripheral portion of the adsorption surface 21a. Figure 5 In the example, multiple substrates 83 are all supported by a flat facet 21aa of the diaphragm 82. That is, multiple substrates 83 are all facing the flat facet 21aa in the vertical direction. The peripheral facet 21ab is curved downwards as it moves radially outwards. In addition, the peripheral facet 21ab may be inclined in a straight line.

[0041] The bottom surface 21c of the porous component 21 is the side opposite to the adsorption surface 21a. The side surface 21b is the surface that connects the periphery of the adsorption surface 21a (that is, the periphery of the peripheral surface 21ab) to the periphery of the bottom surface 21c. The adsorption surface 21a and the bottom surface 21c have, for example, a circular shape when viewed from above.

[0042] The base 22 includes a support member 221 and a base plate 222. The support member 221 is a component that supports the frame 81 of the framed substrate 80. The support member 221 surrounds the porous member 21 when viewed from above. The support member 221 has, for example, an annular shape when viewed from above. The upper surface of the support member 221 is, for example, a horizontal flat surface. The frame 81 is mounted on the upper surface of the support member 221. That is, the upper surface of the support member 221 is in contact with the lower surface of the frame 81. The inner circumferential surface of the support member 221 partially faces the side surface 21b of the porous member 21. Specifically, the upper portion of the inner circumferential surface of the support member 221 faces the lower portion of the side surface 21b of the porous member 21 throughout its circumference.

[0043] In the substrate holding device 20, the adsorption surface 21a of the porous component 21 is located above the upper surface of the support component 221. Therefore, the framed substrate 80 is held in the substrate holding device 20 with the multiple substrates 83 above the frame 81 in an elongated state. In this state, the membrane 82 can be in contact with the entire surface of the adsorption surface 21a of the porous component 21.

[0044] The support member 221 protrudes below the bottom surface 21c of the porous member 21. A base plate 222 is connected to the lower part of the support member 221, closing the inner opening of the support member 221. The support member 221 and the base plate 222 can be integrally formed from the same material, or they can be formed by combining multiple components. The base plate 222, separated by a gap H1, faces the bottom surface 21c of the porous member 21 in the vertical direction. The gap H1 is surrounded by the bottom surface 21c of the porous member 21, the inner circumferential surface of the support member 221, and the upper surface of the base plate 222.

[0045] The porous component 21 may be detachably fixed to the support component 221, or it may be fixed in a way that makes it difficult to remove (or impossible to remove). The side surface 21b of the porous component 21 and the inner circumferential surface of the support component 221 may be sealed with a specified sealing material. For example, if an adhesive is used as the sealing material, the porous component 21 will be more firmly fixed to the support component 221 by the adhesive.

[0046] Through the suction section 26 (reference) Figure 1 A negative pressure is applied to the porous component 21 and the pores H1. Because the porous component 21 is porous, when the pores H1 are under negative pressure, gas flows from the adsorption surface 21a of the porous component 21 into the pores H1 through the interior of the porous component 21. Thus, the membrane 82 is adsorbed and retained by the adsorption surface 21a of the porous component 21.

[0047] exist Figure 1 In the example, the suction unit 26 includes a suction pipe 261, a suction valve 262, and a suction drive unit 263. The upstream end of the suction pipe 261 is connected to the gap H1. The upstream end of the suction pipe 261 can be connected to the center of the base plate 222 of the base 22. The suction pipe 261 can pass through the rotary drive unit 25 (described later) in the vertical direction. The downstream end of the suction pipe 261 is connected to the suction drive unit 263. The suction drive unit 263 is controlled by the control unit 90 and draws gas from the gap H1 through the suction pipe 261. The suction drive unit 263 is, for example, a pump. The suction valve 262 is inserted into the suction pipe 261 and switches the opening and closing of the suction pipe 261. The suction valve 262 and the suction drive unit 263 are controlled by the control unit 90.

[0048] After opening the suction valve 262, the control unit 90 actuates the suction drive unit 263. As a result, a negative pressure is generated in the gap H1, and the membrane 82 is adsorbed and held by the porous component 21.

[0049] The retaining drive unit 24 includes a magnet 241. The retaining drive unit 24 causes the magnetic force (e.g., magnetic attraction force) of the magnet 241 to act on the frame 81, thereby pressing and holding the frame 81 onto the support member 221. Figure 1 In this example, magnet 241 is positioned opposite the support member 221 to the frame 81 and spaced apart from the base 22 (support member 221 and base plate 222). As an example, magnet 241 is located directly below the support member 221. Magnet 241 faces the support member 221 at a distance in the vertical direction. Magnet 241 may have a ring-shaped shape surrounding the rotation axis Q1.

[0050] Magnet 241 has a magnetic pole surface 24a and a magnetic pole surface 24b. Magnetic pole surface 24a is the surface opposite to the surface of support member 221 in the vertical direction, and magnetic pole surface 24b is the surface opposite to magnetic pole surface 24a. Magnetic pole surfaces 24a and 24b have magnetic poles with opposite polarities. For example, when magnetic pole surface 24a is the N pole, magnetic pole surface 24b is the S pole.

[0051] The support member 221 is non-magnetic. It is formed, for example, from a non-magnetic material such as aluminum. Therefore, the magnet 241 exerts almost no magnetic attraction force on the support member 221. On the other hand, the frame 81 is magnetic. Therefore, when the magnetic attraction force from the magnet 241 acts on the frame 81, the frame 81 is drawn to the magnet 241 and pressed against the support member 221. Thus, the frame 81 is pressed and held onto the support member 221.

[0052] The holding drive unit 24 is controlled by the control unit 90 to adjust the magnetic attraction force acting on the frame 81 from the magnet 241. Specifically, the holding drive unit 24 switches between a holding state in which the frame 81 is held by the magnetic attraction force pressed by the support member 221, and a holding release state in which the magnetic attraction force of the frame 81 is reduced or eliminated to release the holding by the pressing of the frame 81.

[0053] Magnet 241 can be an electromagnet, but in Figure 1 The example uses a permanent magnet. Figure 1 In the example, the retaining drive unit 24 includes a magnet movement drive unit 242. The magnet movement drive unit 242 moves the magnet 241 between a retaining position and a retaining release position, which will be described below. The retaining position is the position where the magnetic attraction force from the magnet 241 is fully applied to the frame 81. With the magnet 241 in the retaining position, the frame 81 is pressed and held onto the support member 221 by the magnetic attraction force. Figure 1The image shows magnet 241 in the holding position. The holding release position is a position further away from the frame 81 than the holding position. For example, the holding release position is a position where the magnetic attraction force from magnet 241 is not substantially acting on the frame 81. With magnet 241 in the holding release position, the magnetic attraction force on the frame 81 is substantially eliminated, releasing the pressing holding on the frame 81.

[0054] The magnet movement drive unit 242 can raise and lower the magnet 241. That is, the hold-off position can be a position lower than the hold position and aligned vertically with the hold position. The magnet movement drive unit 242 can be, for example, a cylinder. Alternatively, the magnet movement drive unit 242 can include an electric motor and a power transmission unit that transmits the driving force from the electric motor to the magnet 241. The power transmission unit can include, for example, a ball screw mechanism or a cam mechanism. The magnet movement drive unit 242 is controlled by the control unit 90. Additionally, in Figure 1 In the example, although multiple magnet movement drives 242 are provided, they will be described in detail later.

[0055] The rotation drive unit 25 is controlled by the control unit 90 to rotate the porous component 21 and the base 22 together around the rotation axis Q1. Hereinafter, the part including the porous component 21 and the base 22 will also be referred to as the holding platform 23. As the holding platform 23 rotates around the rotation axis Q1, the framed substrate 80 held by the holding platform 23 also rotates around the rotation axis Q1.

[0056] exist Figure 1 In this example, the rotation drive unit 25 is positioned below the holding platform 23 and includes a shaft 251 and a motor 252. The shaft 251 extends downward from the lower surface of the base 22 in a vertical direction. Specifically, the upper end of the shaft 251 is connected to the center of the base plate 222 of the base 22 and extends along the rotation axis Q1. The motor 252 is connected to the shaft 251. The motor 252 is controlled by the control unit 90 to rotate the shaft 251 about the rotation axis Q1. As a result, the holding platform 23 connected to the shaft 251 and the framed substrate 80 held by the holding platform 23 rotate integrally about the rotation axis Q1.

[0057] exist Figure 1 In the example, shaft 251 is a hollow shaft, and the suction tube 261 of the suction section 26 extends vertically inside shaft 251. Furthermore, the internal space of shaft 251 can function as a suction path. That is, the upstream end of the suction tube 261 can be rotatably connected to the lower end of shaft 251. As described above, in Figure 1 In the example, negative pressure is applied to the porous component 21 through the interior of the shaft 251. Therefore, negative pressure can be applied to the porous component 21 with a simple configuration.

[0058] exist Figure 1In the example, the holding drive unit 24 is adjacent to the rotation drive unit 25 in the horizontal direction and is disposed in the space directly below the holding platform 23. The holding drive unit 24 is disposed, for example, on the bottom surface of the chamber 10. The holding drive unit 24 is independent of the rotation drive unit 25 and does not rotate by the drive of the rotation drive unit 25. For example, the holding drive unit 24 is non-rotating.

[0059] As described above, according to the substrate holding device 20, the drive object of the rotary drive unit 25 does not include the magnet 241. Therefore, the load on the rotary drive unit 25 (that is, the weight of the holding platform 23) can be reduced. Therefore, the lifespan of the rotary drive unit 25 can be extended, and a smaller rotary drive unit 25 (specifically, an electric motor 252) can be used.

[0060] exist Figure 1 In this example, a drive housing 27 is provided within the chamber 10. The drive housing 27 houses the retaining drive unit 24 and the motor 252. The drive housing 27 protects the retaining drive unit 24 and the motor 252 from the influence of the processing fluid, which will be described later.

[0061] The control unit 90 controls the substrate processing apparatus 20. Specifically, as described above, the control unit 90 controls the holding drive unit 24, the rotation drive unit 25, and the suction unit 26. Furthermore, the control unit 90 can also control other components of the substrate processing apparatus 1. Figure 1 In the example, the substrate processing apparatus 1 includes an ejection section 30, as an example of other configurations. Additionally, in... Figure 1 In the example, the substrate processing apparatus 1 also includes a protective section 70, as an example of other configurations. The ejection section 30 and the protective section 70 will be described in detail below.

[0062] Figure 3 This is a block diagram schematically illustrating an example of the configuration of the control unit 90. The control unit 90 is an electronic circuit and includes, for example, a data processing unit 91 and a storage unit 92. Figure 3 In a specific example, the data processing unit 91 and the storage unit 92 are interconnected via a bus. The data processing unit 91 may be, for example, an arithmetic processing device such as a CPU (Central Processing Unit). The storage unit 92 may have a non-temporary storage unit (e.g., ROM (Read Only Memory)) 921 and a temporary storage unit (e.g., RAM (Random Access Memory)) 922. The non-temporary storage unit 921 may, for example, store a program that specifies the processing to be executed by the control unit 90. By executing the program through the data processing unit 91, the control unit 90 can execute the processing specified in the program. Of course, some or all of the processing executed by the control unit 90 may be executed by dedicated hardware such as logic circuits.

[0063] exist Figure 3 In the example, a storage unit 94 is also connected to the control unit 90. The storage unit 94 includes at least one of a memory and a hard disk. Various types of data are stored in the storage unit 94.

[0064] <Operation of the substrate holding device>

[0065] Figure 4 This is a flowchart illustrating an example of the operation of substrate processing apparatus 1. Figure 4 The process is realized by the control unit 90 controlling each part of the substrate processing apparatus 1.

[0066] First, in step S1 (moving in step), the framed substrate 80 is moved into the chamber 10. Figure 5 This is a diagram illustrating, schematically, one example of the configuration of the substrate holding device 20 during the transfer step. Figure 5 In the example, the framed substrate 80 just before being moved in is represented by an imaginary line. This moving in is performed, for example, by a transport unit (not shown) located outside the substrate processing apparatus 1. This transport unit is also controlled by a control unit 90. Additionally, as... Figure 5 As shown, during the loading step, the magnet movement drive unit 242 stops the magnet 241 at the holding release position. Therefore, the magnetic attraction force from the magnet 241 has not yet been applied to the frame 81. The framed substrate 80 loaded into the chamber 10 is supported by the holding platform 23.

[0067] Next, in step S2 (holding step), the substrate holding device 20 holds the framed substrate 80. Figure 3 In the example, firstly in step S21 (magnetic holding step), the substrate holding device 20 presses the frame 81 against the support member 221 by the magnetic attraction force from the magnet 241, thereby holding the frame 81. Specifically, the control unit 90 causes the holding drive unit 24 to apply the magnetic attraction force of the magnet 241 to the frame 81. As a specific example, the control unit 90 causes the magnet movement drive unit 242 to move the magnet 241 from the holding release position to the holding position. Figure 6 This is a diagram that schematically illustrates an example of the state of the substrate holding device 20 during the magnetic holding step. (See diagram for example.) Figure 6 As shown, when magnet 241 moves to the holding position, the magnetic attraction force from magnet 241 acts fully on frame 81, pressing and holding frame 81 onto support member 221. Figure 6 In the example, the magnetic suction force is schematically represented by a dashed arrow.

[0068] Next, in step S22 (adsorption step), the substrate holding device 20 applies a negative pressure to the porous component 21 of the support film 82, thereby adsorbing and holding the film 82. Specifically, the control unit 90 actuates the suction unit 26. Figure 7 This is a diagram that schematically illustrates an example of the condition of the substrate holding device 20 during the adsorption step. Figure 7 In the example, the flow of gas caused by the suction drive unit 263 is schematically indicated by arrows. The control unit 90 actuates the suction drive unit 263 after opening the suction valve 262. When the suction drive unit 263 is actuated, the gas between the main surface 82b of the membrane 82 and the adsorption surface 21a of the porous component 21 flows sequentially through the interior of the porous component 21, the voids H1, and the suction tube 261, and is drawn in by the suction drive unit 263. Thus, the membrane 82 is adsorbed and held onto the porous component 21.

[0069] In addition, the magnetic holding step and the adsorption step can be performed in reverse order, or the adsorption step and the magnetic holding step can be performed in parallel.

[0070] Next, in step S3 (processing step), the substrate processing apparatus 1 processes the framed substrate 80. Figure 8 This diagram is a schematic representation of an example of the state of the substrate processing apparatus 1 during the processing steps. While a specific example of the process will be described in detail later, in this process, the control unit 90 causes the rotation drive unit 25 to rotate the framed substrate 80 about the rotation axis Q1, and the ejection unit 30 ejects processing fluid onto the framed substrate 80. When the processing ends, the control unit 90 stops the ejection unit 30 from ejecting the processing fluid and stops the rotation of the framed substrate 80 from rotating the rotation drive unit 25.

[0071] Next, in step S4 (holding release step), the control unit 90 causes the substrate holding device 20 to release the framed substrate 80 from holding. Figure 4 In the example, firstly, in step S41 (adsorption release step), the control unit 90 stops the operation of the suction unit 26. For example, after stopping the suction drive unit 263, the control unit 90 closes the suction valve 262. This releases the suction on the membrane 82. Alternatively, a gas supply unit that sets the pore H1 to a positive pressure can be provided in the substrate processing apparatus 1. By setting the pore H1 to a positive pressure through the gas supply unit in the adsorption release step, the adsorption of the membrane 82 onto the porous component 21 can be released more reliably.

[0072] Next, in step S42 (magnetic retention release step), the control unit 90 causes the retention drive unit 24 to reduce the magnetic attraction force acting on the magnet 241 of the frame 81. For example, the retention drive unit 24 causes the magnetic attraction force to substantially disappear from the frame 81. As a specific example, the control unit 90 causes the magnet movement drive unit 242 to move the magnet 241 to the retention release position. As a result, the magnetic attraction force from the magnet 241 substantially disappears from the frame 81, releasing the pressing retention of the frame 81.

[0073] In addition, the magnetic retention release step and the adsorption release step can be executed in reverse order, or they can be performed in parallel.

[0074] Next, in step S5 (removal process), the framed substrate 80 is removed from the chamber 10. This removal is performed, for example, by a conveying unit (not shown) located outside the substrate processing apparatus 1.

[0075] As described above, the substrate processing apparatus 1 can process the framed substrate 80. Furthermore, in the substrate holding apparatus 20, the magnet 241 of the holding drive unit 24 is positioned separately from the support member 221 and does not rotate integrally with the holding platform 23. In other words, the magnet 241 does not rotate integrally with the holding platform 23. Further, the magnet 241 is not driven by the rotation drive unit 25. As an example, the magnet 241 is non-rotating. Therefore, the load on the rotation drive unit 25 can be reduced.

[0076] Furthermore, in cases where the electromagnet rotates integrally with the clamping platform as in Patent Document 1, supplying power to the electromagnet would complicate the mechanism. In contrast, in this embodiment, since the magnet 241 does not rotate integrally with the holding platform 23, the configuration of the holding drive unit 24 can be simplified.

[0077] Furthermore, in the example described, magnet 241 is a permanent magnet. In this case, since magnet 241 itself does not consume electricity, the holding drive unit 24 can apply a magnetic attraction force to the frame 81 with low power consumption. Also, in this example, the press-hold and press-hold release are switched by the movement of magnet 241 in the magnet movement drive unit 242. Accordingly, the holding drive unit 24 can switch between press-hold and press-hold release with a simpler construction.

[0078] In the example described, the magnet movement drive 242 causes the magnet 241 to move up and down. Therefore, the magnet 241 hardly protrudes radially outward from the area directly below the holding platform 23. Thus, an increase in the radial dimension of the substrate holding device 20 can be suppressed. In other words, since the area directly below the support member 221 and adjacent to the shaft 251 is empty, the magnet 241 can move within this space, effectively utilizing the space.

[0079] Furthermore, when the magnetic suction force begins to act on the frame 81, the frame 81 may move slightly in the horizontal direction relative to the support member 221. As described above, after the frame 81 is pressed and held by the magnet 241, the membrane 82 can be adsorbed and held by the suction part 26. In this case, since the membrane 82 is not yet adsorbed and held when the magnetic suction force begins to act, even if the frame 81 moves relative to the support member 221, the membrane 82 can move relative to the porous member 21. Therefore, the membrane 82 hardly develops wrinkles or the like. Then, after the frame 81 is pressed and held, the suction part 26 adsorbs the membrane 82. Therefore, the membrane 82 hardly develops wrinkles or the like, thereby adsorbing the membrane 82 more appropriately onto the porous member 21.

[0080] When the magnetic attraction force of frame 81 disappears, frame 81 may also move slightly in the horizontal direction relative to support member 221. Therefore, as described above, the pressing and holding of frame 81 can be released after the adsorption of membrane 82 is released. In this case, since membrane 82 is no longer adsorbed and held when the magnetic attraction force disappears, membrane 82 can move relative to porous member 21 even if frame 81 moves relative to support member 221. Therefore, membrane 82 will hardly develop wrinkles or the like.

[0081] <Ejection section>

[0082] exist Figure 1 In the example, the substrate processing apparatus 1 includes an ejection section 30. The ejection section 30 ejects a processing fluid onto a framed substrate 80 held by a substrate holding device 20. The processing fluid can be a gas or a liquid. Here, a liquid (hereinafter referred to as processing liquid) is used as the processing fluid. The processing liquid includes, for example, a chemical solution and a cleaning solution. The chemical solution can be a liquid that chemically reacts with the substrate 83 (including impurities (particles, etc.) present on the surface of the substrate 83). As an example, the chemical solution can be a liquid such as hydrofluoric acid. The cleaning solution can be a liquid used to rinse the chemical solution, or, for example, pure water. The cleaning solution can be an organic solvent such as isopropanol.

[0083] exist Figure 1 In the example, the ejection section 30 includes a nozzle 31, a supply pipe 32, a supply valve 33, and a flow regulating valve 34. The nozzle 31 is disposed within the chamber 10. Figure 1 In this example, nozzle 31 is positioned above the framed substrate 80 held by the substrate holding device 20, and sprays the processing liquid onto the upper surface of the framed substrate 80. Nozzle 31 can be a nozzle that sprays the processing liquid in a continuous flow, or it can be a water mist nozzle or a spray nozzle that sprays the processing liquid in droplet form. Here, as an example, nozzle 31 is a nozzle that sprays the processing liquid in a continuous flow.

[0084] exist Figure 1In the example, the downstream end of the supply pipe 32 is connected to the nozzle 31. The upstream end of the supply pipe 32 is connected to a processing fluid supply source. The processing fluid supply source has a tank (not shown) for storing processing fluid and supplies the processing fluid to the upstream end of the supply pipe 32. Figure 1 In the example, a supply valve 33 and a flow regulating valve 34 are provided in the supply pipe 32. The supply valve 33 switches the opening and closing of the supply pipe 32, and the flow regulating valve 34 regulates the flow rate of the processed liquid flowing through the supply pipe 32. The flow regulating valve 34 can be a mass flow controller. The valves are controlled by the control unit 90.

[0085] The ejector section 30 may be configured to sequentially supply multiple treatment fluids. For example, a set of nozzles 31, supply pipes 32, supply valves 33, and flow regulating valves 34 may be provided for each type of treatment fluid.

[0086] exist Figure 1 In the example, a nozzle movement drive unit 35 is provided in the ejection section 30 to move the nozzle 31. The nozzle movement drive unit 35 moves the nozzle 31 between a processing position and a standby position, which will be described below. The processing position is the position where the nozzle 31 ejects the processing liquid onto the main surface (here, the upper surface) of the framed substrate 80 held by the substrate holding device 20, for example, a position facing the center of the framed substrate 80 in the vertical direction. Figure 1 In the example, nozzle 31 is shown in the processing position. The standby position is the position where nozzle 31 does not spray processing liquid onto the main surface of the framed substrate 80, for example, a position further radially outward than the framed substrate 80. The nozzle movement drive unit 35 is, for example, a linear mechanism such as an arm rotation mechanism with an electric motor or a ball screw mechanism with an electric motor.

[0087] With nozzle 31 in the processing position, when processing liquid is sprayed onto the main surface of the rotating framed substrate 80, the processing liquid adheres to the main surface of the framed substrate 80. The processing liquid is propelled radially outward by the centrifugal force accompanying the rotation of the framed substrate 80, and disperses outward from the periphery of the framed substrate 80. At this time, the framed substrate 80 is processed according to the type of processing liquid by the action of the processing liquid. For example, if the processing liquid is a cleaning solution, the substrate 83 is cleaned.

[0088] <Protection Department>

[0089] exist Figure 1In the example, the substrate processing apparatus 1 includes a protective section 70. The protective section 70 includes a protective member 71, a cup 72, and a protective member lifting drive 73. The protective member 71 has a cylindrical shape with a rotation axis Q1 as its central axis and surrounds the substrate holding device 20. The protective member 71 can catch various processing liquids that splash from the periphery of the framed substrate 80. The processing liquid flows down along the inner peripheral surface of the protective member 71. The cup 72 is disposed below the protective member 71 and catches the processing liquid from the protective member 71. The processing liquid caught by the cup 72 is discharged to the outside of the chamber 10 through a discharge pipe (not shown) provided in the cup 72.

[0090] The protective member lifting drive unit 73 moves the protective member 71 up and down between the upper position and the lower position, which will be described below. The upper position is when the upper end of the protective member 71 is above the framed substrate 80 held by the substrate holding device 20, and the lower position is when the upper end of the protective member 71 is below the upper surface of the support member 221. When the protective member 71 is in the upper position, the protective member 71 catches the processing liquid that splashes from the periphery of the framed substrate 80.

[0091] <Processing Steps>

[0092] Next, a specific example of the processing step (step S3) will be described. First, the control unit 90 moves the nozzle 31 to the processing position using the nozzle movement drive unit 35, raises the protective member 71 to the upper position using the protective member lifting drive unit 73, and rotates the framed substrate 80 using the rotation drive unit 25. Then, the control unit 90 opens the supply valve 33. As a result, processing liquid is sprayed from the nozzle 31 onto the main surface of the rotating framed substrate 80. The processing liquid adhering to the main surface of the framed substrate 80 flows radially outward as the framed substrate 80 rotates, scattering from the periphery of the framed substrate 80. The processing liquid is caught by the protective member 71 and discharged to the outside through the discharge pipe.

[0093] The framed substrate 80 is treated by applying a treatment solution to its main surface, with the treatment solution corresponding to the type of solution. For example, multiple substrates 83 can be cleaned. The ejection section 30 can sequentially supply different types of treatment solutions to the framed substrate 80. For example, a chemical solution and a cleaning solution can be sequentially ejected as treatment solutions.

[0094] When the liquid treatment of the treatment fluid is fully completed, the spraying unit 30 stops spraying the treatment fluid. Specifically, the control unit 90 closes the supply valve 33, and the nozzle movement drive unit 35 moves the nozzle 31 to the standby position.

[0095] Next, the control unit 90 causes the rotation drive unit 25 to increase the rotation speed of the framed substrate 80. As a result, the framed substrate 80 dries (so-called rotational drying). While the framed substrate 80 is drying, the control unit 90 causes the protective member lifting drive unit 73 to lower the protective member 71 to the lower position.

[0096] As described above, the substrate processing apparatus 1 can process the framed substrate 80.

[0097] <Keep Drive Section>

[0098] Next, a more specific example of the configuration of the drive unit 24 will be described. Figure 9 This is a top view that schematically illustrates an example of the configuration of the retaining drive unit 24. (See attached image.) Figure 9 As shown, the retaining drive unit 24 may include a plurality of magnets 241. Figure 9 In the example, multiple magnets 241 are arranged with open intervals in the circumferential direction. The multiple magnets 241 can also be arranged at equal intervals. Figure 9 In the example, although six magnets 241 are set, the total number of magnets 241 is arbitrary. Figure 9 In the example, magnet 241 has a long strip shape when viewed from above. Magnet 241 may also have a cuboid shape. Each magnet 241 is arranged in a circumferential orientation along its length.

[0099] Because multiple magnets 241 are arranged in this way, the magnetic attraction force acting on the frame 81 can be adjusted according to the number of magnets 241 and the size of each magnet 241. Therefore, the design is easier. In addition, compared with the case of using a ring-shaped magnet surrounding the rotation axis Q1, the number of magnets used can be reduced.

[0100] exist Figure 9 In the example, multiple magnet movement drive units 242 are provided. Each magnet movement drive unit 242 moves one or more magnets 241. Figure 9 In the example, a first magnet movement drive unit 242A and a second magnet movement drive unit 242B are shown as multiple magnet movement drive units 242. The first magnet movement drive unit 242A moves one or more of the multiple magnets 241A. Figure 9 In the example, the first magnet movement drive unit 242A causes multiple (e.g., three) magnets 241A to move together. Figure 9 In the example, multiple magnets 241A are integrally held by a holding member 243A. The holding member 243A has, for example, an arcuate shape when viewed from above, and houses the multiple magnets 241A. The holding member 243A is formed, for example, of a synthetic resin.

[0101] The second magnet movement drive unit 242B moves one or more magnets 241B that are different from magnet 241A among the plurality of magnets 241. Figure 9 In the example, the second magnet movement drive unit 242B causes multiple (e.g., three) magnets 241B to move together. Figure 9 In the example, multiple magnets 241B are integrally held by a retaining member 243B. The retaining member 243B has, for example, an arcuate shape when viewed from above, and houses the multiple magnets 241B. The retaining member 243B is formed, for example, of a synthetic resin.

[0102] As described above, by providing multiple magnet movement drive units 242, the number of magnets 241 required to move each magnet movement drive unit 242 can be reduced. In other words, the load on each magnet movement drive unit 242 can be reduced. Therefore, the magnet movement drive unit 242 can be made smaller.

[0103] The polarities of the magnetic pole faces 24a of two adjacent magnets 241 may be different. That is, the magnets 241 are arranged circumferentially with different magnetic poles alternately facing the support member 221. As a result, the magnetic gradient between each magnet 241 and the frame 81 can be increased, and consequently, the overall magnetic attraction force exerted on the frame 81 by the magnets 241 can be increased.

[0104] <Second Implementation Method>

[0105] The substrate holding device 20 of the second embodiment is configured the same as that of the first embodiment. However, the holding drive unit 24 applies a magnetic suction force to the frame 81 that is proportional to the weight of the substrate 80 with the frame. Specifically, the holding drive unit 24 applies a magnetic suction force to the frame 81 that is proportional to the weight of the substrate 80 with the frame.

[0106] Here, we envision multiple diced rings with varying thicknesses for the frame 81. The difference in thickness between the various diced rings of the frame 81 is, for example, several hundred μm. Since a thicker frame 81 is heavier than a thinner frame 81, the thicker the frame 81, the heavier the framed substrate 80.

[0107] Figure 10 and Figure 11 This is a schematic diagram illustrating one example of the substrate holding device 20 according to the second embodiment. Figure 10 and Figure 11 In the middle, the thickness of frame 81 varies. Due to Figure 10 The frame 81 is higher than Figure 11 The frame is 81mm thick, so Figure 10 80% of the framed substrate Figure 11 The framed substrate weighs 80.

[0108] exist Figure 10and Figure 11 In the example, the holding drive unit 24 also includes a magnet movement drive unit 242. However, unlike the first embodiment, the magnet movement drive unit 242 moves the magnet 241 to a holding position corresponding to the weight of the framed substrate 80. The heavier the framed substrate 80, the closer the holding position is set to the frame 81. Thus, the holding drive unit 24 can exert a magnetic attraction force on the frame 81 equal to the weight of the framed substrate 80. The magnet movement drive unit 242 includes, for example, an electric motor and a power transmission unit that transmits the driving force of the electric motor to the magnet 241. The power transmission unit is, for example, a ball screw mechanism. This magnet movement drive unit 242 is also called an electric actuator, which can stop the magnet 241 at any position within a specified range of movement. The arbitrary position referred to here is any position within the resolution range of the magnet movement drive unit 242.

[0109] The correspondence between the weight of the framed substrate 80 and the magnetic attraction force on the frame 81 is predetermined, for example, through simulation or experimentation. Correspondence data representing this correspondence is stored in the storage unit 94, for example, in advance. The correspondence data may include the type of framed substrate 80 and its corresponding holding position. For example, the correspondence data may include a holding position P1 when the framed substrate 80 is relatively heavy, and a holding position P2 when the framed substrate 80 is relatively light. Holding position P1 is set closer to the frame 81 than holding position P2 (see also...). Figure 10 and Figure 11 For example, holding position P1 is the position between support member 221 and holding position P2. Conversely, holding position P2 is set closer to the holding release position than holding position P1.

[0110] Substrate data related to the weight of the framed substrate 80 is input to the control unit 90 before processing. The substrate data may include information indicating the type of the framed substrate 80 as weight-related information. This substrate data can be input to the control unit 90, for example, via user input using a user interface (not shown). Alternatively, the substrate data can be sent to the control unit 90 from a device upstream of the substrate processing apparatus 1. The substrate data is input to the control unit 90 at least before the magnetic holding step (step S21). As an example, the substrate data is input to the control unit 90 before the loading step (step S1).

[0111] Based on substrate data and corresponding relationship data, the control unit 90 sets a magnetic suction force (e.g., holding position) corresponding to the weight of the substrate 80 with the frame. Then, in the magnetic holding step (step S21), the control unit 90 causes the holding drive unit 24 to apply the set magnetic suction force to the frame 81. As an example, the control unit 90 causes the magnet movement drive unit 242 to move the magnet 241 to the set holding position.

[0112] As described above, in the second embodiment, the holding drive 24 applies a magnetic attraction force to the frame 81 equal to the weight of the framed substrate 80. Therefore, even if the framed substrate 80 is heavy, the substrate holding device 20 can hold the framed substrate 80 more appropriately. On the other hand, when the framed substrate 80 is light, the holding drive 24 applies a smaller magnetic attraction force to the frame 81. Accordingly, excessive magnetic attraction force applied to the frame 81 can be avoided. Therefore, the substrate holding device 20 can apply a magnetic attraction force to the frame 81 with higher efficiency. For example, when the holding drive 24 includes a magnet movement drive 242, since the holding position P2 is closer to the holding release position, the movement distance of the magnet 241 from the holding release position to the holding position P2 is relatively short. Therefore, the power consumption of the magnet movement drive 242 can be reduced when the framed substrate 80 is light. Alternatively, when the magnet 241 is an electromagnet, the current flowing to the magnet 241 is smaller when the framed substrate 80 is light. Therefore, the power consumption of the drive unit 24 can be reduced.

[0113] As described above, the substrate holding apparatus 20, the substrate processing apparatus 1, and the substrate processing method have been described in detail. This description is illustrative in all respects, and the disclosure is not limited thereto. Furthermore, the various variations described can be combined and applied as long as they do not contradict each other. Moreover, it should be understood that several variations not illustrated can be conceived without departing from the scope of the disclosure.

[0114] This disclosure includes the following aspects.

[0115] The first aspect is a substrate holding device comprising: a porous component having an adsorption surface for adsorbing a membrane comprising a ring-shaped frame, a membrane mounted inside the frame, and the membrane disposed in a framed substrate of a substrate of the membrane; a support component surrounding the porous component and supporting the frame; a rotation drive unit for rotating the support component and the porous component integrally; and a holding drive unit comprising a magnet disposed on the side opposite to the support component and the frame, spaced apart from the support component, wherein the frame is pressed and held onto the support component by the magnetic force of the magnet.

[0116] The second aspect is the substrate holding device of the first aspect, wherein the magnet is a permanent magnet, the holding drive includes a magnet movement drive, and the magnet movement drive causes the magnet to move between a holding position in which the frame is pressed and held on the support member by the magnetic force, and a holding release position which is further away from the support member than the holding position and releases the pressing and holding of the frame.

[0117] The third aspect is the substrate holding device of the second aspect, wherein the holding position and the holding release position are arranged in a vertical direction, and the magnet movement drive unit causes the magnet to move up and down between the holding position and the holding release position.

[0118] The fourth aspect is a substrate holding device of any one of the first to third aspects, wherein the holding drive includes a plurality of said magnets arranged in a ring along the circumference of the frame.

[0119] The fifth aspect is the substrate holding device of the fourth aspect, wherein the magnetic pole faces of two adjacent magnets of the plurality of magnets are different from each other.

[0120] The sixth aspect is a substrate holding device of the fourth or fifth aspect, wherein the holding drive unit includes: a first magnet moving drive unit that moves one or more of the plurality of magnets; and a second magnet moving drive unit that moves one or more of the plurality of magnets that are different from the first magnet.

[0121] The seventh aspect is a substrate holding device of any one of the first to sixth aspects, wherein the holding drive uses a magnetic force equal to the weight of the framed substrate to press the frame against the support member.

[0122] The eighth aspect is a substrate holding device of any one of the first to seventh aspects, wherein the rotation drive includes a hollow shaft through which a negative pressure is applied to the porous component.

[0123] The ninth aspect is a substrate processing apparatus comprising: a substrate holding device according to any one of the first to eighth aspects; and an ejection section for ejecting processing fluid onto the framed substrate held by the substrate holding section.

[0124] A tenth aspect is a substrate processing method comprising: a magnetic holding step in which the frame comprising an annular frame, a membrane mounted on the frame, and a substrate of the membrane disposed thereon are pressed against the support member by magnetic force from a magnet disposed spaced apart from a support member to hold the frame; an adsorption step in which a negative pressure is applied to a porous member supporting the membrane to adsorb and hold the membrane; and a processing step in which the porous member, the support member, and the substrate are rotated integrally, and a processing fluid is supplied to the framed substrate.

[0125] The 11th aspect is a substrate processing method of the 10th aspect, wherein the adsorption step is performed after the magnetic holding step.

[0126] According to aspects 1, 9, and 10, since the magnet is separated from the support member, it rotates without being driven by the rotary drive unit. Therefore, the load on the rotary drive unit can be reduced.

[0127] According to the second aspect, the drive unit can switch between press hold and press hold release with a simple structure.

[0128] According to the third aspect, it is possible to suppress the radial dimension increase of the substrate holding device.

[0129] According to the fourth aspect, the amount of magnets used can be reduced compared to using ring-shaped magnets.

[0130] According to aspect 5, the overall magnetic force acting on the frame from multiple magnets can be increased.

[0131] According to aspect 6, a small magnet can be used to move the drive unit.

[0132] According to aspect 7, even when the framed substrate is heavy, the substrate holding device can hold the framed substrate more appropriately. On the other hand, when the framed substrate is light, the substrate holding device can hold the framed substrate with higher efficiency.

[0133] According to aspect 8, negative pressure can be applied to porous components with a simple configuration.

[0134] According to aspect 11, since the retaining membrane is adsorbed after pressing the retaining frame, wrinkling of the membrane can be suppressed.

[0135] [Symbol Explanation]

[0136] 21 Porous Components

[0137] 21a Adsorption surface

[0138] 221 Supporting components

[0139] 24 Keep drive unit

[0140] 241 magnets

[0141] 241A First Magnet

[0142] 241B Second Magnet

[0143] 242 Magnet Moving Drive Unit

[0144] 242A First Magnet Moving Drive Unit

[0145] 242B Second Magnet Moving Drive Unit

[0146] 24a Magnetic pole face

[0147] 25 Rotary drive unit

[0148] 30 Ejector Section

[0149] 80 Framed Substrates

[0150] 81 Framework

[0151] 82 membrane

[0152] 83 Substrate

[0153] S21 Magnetic Holding Procedure (Steps)

[0154] S22 Adsorption Step (Step)

[0155] S3 Processing Steps (Steps).

Claims

1. A substrate holding apparatus comprising: a porous member having a film adsorption surface that adsorbs a film included in a frame that is ring-shaped, the film being mounted on an inner side of the frame, and a frame-equipped substrate in which the film is provided in a substrate of the frame; a support member that surrounds the porous member and supports the frame; a rotation drive section that rotates the support member and the porous member integrally; and a holding drive section that includes a magnet provided in a state of being separated from the support member on an opposite side of the support member from the frame, and that holds the frame pressed against the support member by a magnetic force of the magnet.

2. The substrate holding apparatus according to claim 1, wherein the magnet is a permanent magnet, the holding drive section includes a magnet moving drive section, and the magnet moving drive section moves the magnet between a holding position at which the frame is held pressed against the support member by the magnetic force, and a holding release position that is farther from the support member than the holding position and releases the pressing hold of the frame.

3. The substrate holding apparatus according to claim 2, wherein the holding position and the holding release position are arranged in a vertical direction, and the magnet moving drive section raises and lowers the magnet between the holding position and the holding release position.

4. The substrate holding apparatus according to any one of claims 1 to 3, wherein the holding drive section includes a plurality of the magnets, and the plurality of the magnets are arranged in a ring shape along a circumferential direction of the frame.

5. The substrate holding apparatus according to claim 4, wherein magnetic pole surfaces of two adjacent ones of the plurality of the magnets are different from each other.

6. The substrate holding apparatus according to claim 4, wherein the holding drive section includes: a first magnet moving drive section that moves one or more first magnets of the plurality of the magnets; and a second magnet moving drive section that moves one or more second magnets of the plurality of the magnets that are different from the first magnets.

7. The substrate holding apparatus according to any one of claims 1 to 3, wherein the holding drive section holds the frame pressed against the support member by a magnetic force of a magnitude of a weight of the frame-equipped substrate.

8. The substrate holding apparatus according to any one of claims 1 to 3, wherein the rotation drive section includes a hollow shaft, and a negative pressure is applied to the porous member through an inside of the hollow shaft.

9. A substrate processing apparatus comprising: the substrate holding apparatus according to any one of claims 1 to 3; and an ejection section that ejects a processing fluid toward the frame-equipped substrate held by the substrate holding section.

10. A substrate processing method comprising: a magnetic force holding step of holding a frame included in a frame that is ring-shaped, a film mounted on the frame, and a frame-equipped substrate in which the frame is provided in a substrate of the film, pressed against a support member by a magnetic force from a magnet provided in a state of being separated from the support member; a film adsorption step of adsorbing and holding the film by applying a negative pressure to a porous member that supports the film; and ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The processing step rotates the porous member, the support member, and the substrate integrally, and supplies a processing fluid to the substrate with the frame.

11. The substrate processing method according to claim 10, wherein The adsorbing step is performed after the magnetic force retaining step.

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