Clamping and positioning device

Abstract

The embodiment of the invention provides a clamping and positioning device which comprises a bottom plate, a clamping and positioning device and a clamping and positioning device, the bottom plate is defined by three face plates, and the three face plates comprise the front face plate and the two opposite side face plates; the bearing protrusions are arranged at the bottoms of the panels and arranged in a protruding mode towards the inner sides of the panels, and the three panels are provided with at least three bearing protrusions in total; the three protective arms are respectively arranged on the three panels, and at least one elastic clamping jaw is fixed on each protective arm; the three protective arms comprise a positioning arm located on the front panel and two swing arms located on the two side panels respectively. The elastic clamping jaw comprises an L-shaped elastic piece, the L-shaped elastic piece comprises a transverse plate and a vertical plate which are perpendicular to each other and connected with each other, the end, away from the transverse plate, of the vertical plate is connected with the protection arm, and the upper surface of the transverse plate is lower than or flush with the upper surface of the bearing protrusion. According to the embodiment of the invention, after the wafer is supported through point contact, the wafer is clamped through the inclined elastic force of the vertical plate of the elastic clamping jaw, so that the center position precision and the attitude stability of the wafer in a clamping state are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing equipment, and in particular to a clamping and positioning device. BACKGROUND

[0002] In a semiconductor manufacturing process, clamping and positioning of a wafer (or silicon wafer) is a core link throughout photolithography, thin film deposition, etching, detection and other key processes. The performance of a clamping and positioning mechanism directly determines the position accuracy, surface protection and overall production efficiency of the wafer in the processing process, and is crucial to guaranteeing the yield and performance of the final chip. With the continuous reduction of the semiconductor technology node, the wafer size is standardized to 12 inches (300 mm), and in order to improve the performance and integration of devices, the wafer thickness tends to be thinned (such as the increasing application of warped wafers with a thickness of less than 200 μm), which puts higher requirements on the clamping and positioning mechanism.

[0003] The prior art mostly uses a rigid clamping jaw in combination with a single driving structure, which has obvious defects: firstly, the clamping force of rigid clamping is not precisely controlled, and scratches or cracks are easily caused on the edge of the wafer, especially on ultra-thin warped wafers with a thickness of less than 200 μm; secondly, the positioning and clamping actions are coupled, and it is difficult to balance the radial positioning accuracy and the demand for rapid response, and the complex transmission structure leads to low efficiency.

[0004] It should be noted that the above content is not necessarily prior art, and is not used to limit the patent protection scope of the present application. SUMMARY

[0005] Embodiments of the present application provide a clamping and positioning device to solve or alleviate one or more technical problems proposed above.

[0006] As an aspect of the embodiments of the present application, the embodiments of the present application provide a clamping and positioning device for clamping and positioning a wafer, the clamping and positioning device comprising: a bottom plate, the bottom plate being surrounded by three panels, the three panels including a front panel and two opposite side panels; a supporting protrusion, the supporting protrusion being provided at the bottom of the panel and protruding towards the inner side of the panel, and at least three supporting protrusions being provided on the three panels; three arm guards, each of the three arm guards being provided on one of the three panels and having at least one elastic clamping jaw fixed thereon, the three arm guards including a positioning arm provided on the front panel and two swing arms provided on the two side panels respectively, each of the two swing arms being rotatable relative to the side panel on which the swing arm is provided; wherein the elastic clamping jaw comprises an L-shaped elastic sheet, the L-shaped elastic sheet including a horizontal plate and a vertical plate which are perpendicular to and connected to each other, one end of the vertical plate away from the horizontal plate being connected to the arm guard, and the upper surface of the horizontal plate being lower than or flush with the upper surface of the supporting protrusion.

[0007] In an embodiment, the three panels are integrally formed, and the three panels enclose a structure with a circular-arc-shaped inner side edge; the circular arc of the inner side edge is a first circular arc, and a radius of the first circular arc is greater than a radius of the wafer, and a radius difference is 9-10 mm.

[0008] In an embodiment, an arc of the first circular arc is 110°-270°.

[0009] In an embodiment, the front panel is provided with a bearing protrusion; the positioning arm is provided with two elastic clamping jaws, and the two elastic clamping jaws are respectively located on two sides of the bearing protrusion.

[0010] In an embodiment, the swing arm includes a fixed end and a swing end, the fixed end is close to the front panel, and the swing end is away from the front panel; the swing end is circular-arc-shaped, and an inner circular arc radius of the swing end is less than a radius of the wafer, and a radius difference is 0-1 mm.

[0011] In an embodiment, the side panel is provided with a bearing protrusion; an arc of the first circular arc is greater than or equal to 180°, the swing arm is provided with at least two elastic clamping jaws, and the at least two elastic clamping jaws are distributed on two sides of the bearing protrusion.

[0012] In an embodiment, the side panel is provided with a strip-shaped through hole extending to the inner side, the number of the strip-shaped through holes is at least one, and at least one of the two elastic clamping jaws moves in the strip-shaped through hole along with the swing arm.

[0013] In an embodiment, the side panel is provided with at least one bearing protrusion, an arc of the first circular arc is less than or equal to 180°, the swing arm is provided with at least one elastic clamping jaw, and the at least one elastic clamping jaw is distributed on a side of the swing arm away from the fixed end.

[0014] In an embodiment, the first driving member is embeddedly installed on the side panel, so that an output shaft of the first driving member extends upward and is connected with the swing arm; the first buffer member is embeddedly installed on a side of the first driving member away from the inner side edge of the bottom plate, and is located on a side of the first driving member away from the swing end of the swing arm.

[0015] In an embodiment, the L-shaped elastic sheet is made of spring steel sheet; the elastic clamping jaw further includes a cylindrical PIN rod, and a surface roughness Ra of an upper surface of the cylindrical PIN rod is less than or equal to 0.8.

[0016] In an embodiment, an elastic pressure of the elastic clamping jaw on a wafer with a preset size is 2 N.

[0017] In an embodiment, the three panels are integrally formed, and the three panels enclose a square U-shaped structure or a U-shaped structure.

[0018] The embodiment of the present application supports the wafer through point contact, clamps the wafer through the inclined elastic force of the vertical plate of the elastic clamping jaw, provides reliable and symmetrical clamping force through three-direction layout, guarantees the need of stable positioning and clamping, provides activity space for the swing of the swing arm, and improves the center position precision and attitude stability of the wafer in the clamping state. BRIEF DESCRIPTION OF DRAWINGS In the drawings, like reference numerals refer to same or similar components throughout the several views. The drawings are not necessarily to scale. It should be understood that the drawings only depict some embodiments in accordance with the present disclosure and should not be considered limiting the scope of the present disclosure.

[0019] Figure 1 A perspective structural schematic view of the clamping and positioning device provided by an embodiment of the present application is shown.

[0020] Figure 2 Another perspective structural schematic view of the clamping and positioning device provided by an embodiment of the present application is shown.

[0021] Figure 3 A swing arm structural schematic view of the clamping and positioning device provided by an embodiment of the present application is shown.

[0022] Figure 4 A structural schematic view of the swing arm, the first driving member and the first buffer member of the clamping and positioning device provided by an embodiment of the present application is shown.

[0023] Figure 5 A positioning arm structural schematic view of the clamping and positioning device provided by an embodiment of the present application is shown.

[0024] Figure 6 A structural schematic view of the positioning arm, the second driving member and the second buffer member of the clamping and positioning device provided by an embodiment of the present application is shown. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and embodiments.

[0026] It is to be understood that the terminology "first", "second" and the like used throughout this specification and the accompanying drawings is merely used for distinguishing between similar objects, and does not imply a particular order or chronology. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of use in the order written, or in reverse order, depending on the particular application, unless otherwise specifically stated herein. Moreover, the terms "include", "have", and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, product or apparatus that comprises a list of steps or units are not necessarily limited to those steps or units that are expressly listed, but can include other not expressly listed steps or units.

[0027] In the following, exemplary embodiments according to this application will be described in more detail, by way of example only, with reference to the accompanying drawings. It is to be understood that these exemplary embodiments can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein.

[0028] The embodiments of the present application provide a clamping positioning device, which is used for clamping and positioning a wafer. Figures 1 to 6 As shown in the drawings, the clamping positioning device provided by the embodiments of the present application is used for clamping and positioning a wafer, and comprises a bottom plate 100, a supporting protrusion 140 and three arm guards.

[0029] The bottom plate 100 is surrounded by three panels, which comprise a front panel 110 and two opposite side panels 120; The supporting protrusion 140 is arranged at the bottom of the panel and protrudes towards the inner side of the panel, and the three panels are provided with at least three supporting protrusions 140 in total; The three arm guards are arranged on the three panels respectively, and at least one elastic clamping jaw 170 is fixed on each arm guard; the three arm guards comprise a positioning arm 150 arranged on the front panel 110, and two swing arms 160 arranged on the two side panels 120 respectively, and the swing arms 160 are rotatable relative to the side panels 120; The elastic clamping jaw 170 comprises an L-shaped elastic sheet, which comprises a horizontal plate 172 and a vertical plate 171 perpendicular to and connected with each other, one end of the vertical plate 171 away from the horizontal plate 172 is connected with the arm guard, and the upper surface of the horizontal plate 172 is lower than or flush with the upper surface of the supporting protrusion.

[0030] The size of the wafer can be 12 inches (300 mm) for example.

[0031] The base plate 100 is composed of a front panel 110 and two opposite side panels 120, which are integrally formed (e.g. cast or machined) to form a stable integral frame. This U-shaped or U-like enclosure provides a rigid base for the entire device and naturally performs the preliminary constraint and guidance of the wafer in the three edge directions, preventing the wafer from shifting significantly in the horizontal plane, thus creating conditions for subsequent accurate positioning.

[0032] On the inner bottom of the base plate 100, a plurality of inwardly protruding supporting protrusions 140 are provided. At least three supporting protrusions 140 are provided on the three panels (front panel 110, two side panels 120), for example, one in the center of the front panel 110, one or more on each of the two side panels 120; for example, one on one side panel 120 and two on the other side panel 120. The at least three supporting protrusions 140 form at least a triangular structure, which can stably hold the wafer. The upper surfaces of these supporting protrusions 140 are precisely ground, and together form a high-precision supporting plane. When the wafer is transported to the station by the robot, it is first placed on the upper surfaces of the supporting protrusions 140, achieving the pre-positioning. The supporting protrusions 140 use a "point contact" support, effectively reducing the contact area between the back of the wafer and the device, and reducing the risk of scratches or contamination of the back of the wafer due to friction or particulate contamination.

[0033] Secondly, the positioning arm 150 is used to provide the positioning reference of the wafer in the front-back direction. The positioning arm 150 can be fixedly arranged, or driven by the second driving member 151 to move linearly in the front-back direction to complete the positioning. As shown in Figure 6 The second buffer member 152 provides a buffer to achieve stable clamping while preventing damage to the wafer. The elastic clamping jaws 170 on the positioning arm 150 are used to provide the positioning reference in the front-back direction. The two swing arms 160 are rotatably connected to the side panels 120 by a pivot or a first driving member 161, and can swing within a certain angle around the shaft (e.g. vertical shaft), thereby driving the elastic clamping jaws 170 on them to move in the radial direction of the wafer, completing the positioning reference of the wafer in the left-right direction. Among them, the elastic clamping jaws 170 on the three panels simultaneously have elastic clamping, achieving the clamping action of the wafer, thereby stably clamping the wafer from the side edge of the wafer, without having clamping force in the upward and downward single axial direction, reducing the damage to the clamping position of the side edge of the wafer.

[0034] The upper surface of the horizontal plate 172 of the elastic clamping jaw 170 is arranged to be lower than or flush with the upper surface of the supporting protrusion 140, so as to ensure that the horizontal plate 172 of the elastic clamping jaw 170 does not interfere or rub with the lower surface of the wafer when the wafer is supported by the supporting protrusion 140. When the vertical plate 171 of the elastic clamping jaw 170 approaches the wafer, an elastic force is generated to clamp the wafer. This “pre-supporting and then tilting clamping” mode avoids the risk of wafer edge damage caused by the traditional rigid clamping jaw hitting the wafer edge from the side or clamping the wafer edge from the top and bottom.

[0035] After the wafer is supported by point contact, the wafer is clamped by the tilting elastic force of the vertical plate 171 of the elastic clamping jaw 170, and the three-direction layout provides reliable and symmetrical clamping force, which can guarantee the need for stable positioning and clamping, and provides a space for the swing of the swing arm 160, thereby improving the center position accuracy and attitude stability of the wafer in the clamped state.

[0036] In an embodiment, the three panels are integrally formed, and the three panels enclose a structure with a circular-arc-shaped inner side edge; the circular arc of the inner side edge is a first circular arc, and a radius of the first circular arc is greater than a radius of the wafer by 9-10 mm.

[0037] The three panels are integrally formed to enclose a smooth circular-arc-shaped inner side edge, which is a first circular arc. The radius of the first circular arc is slightly greater than the radius of a standard wafer. This provides an ideal guiding and avoiding space for the wafer to be clamped by a robot to the work station. During the placement or clamping of the wafer, a small gap is maintained between the circumferential edge of the wafer and the inner side circular arc surface, which can guide the wafer to the correct position and prevent hard collision between the wafer circumference and the table body.

[0038] In an embodiment, the first circular arc has an arc degree of 110°-270°.

[0039] The arc degree of the first circular arc can be designed according to the range that needs to be constrained by the wafer, for example, 110°, 135°, 150°, 160°, 180°, 190°, 210°, 230°, 255°, or 270°.

[0040] In an embodiment, the front panel 110 is provided with a supporting protrusion 140; the positioning arm 150 is provided with two elastic clamping jaws 170, and the two elastic clamping jaws 170 are respectively located on the two sides of the supporting protrusion 140. This layout of supporting in the middle and clamping on the two sides enables the wafer to be softly and firmly positioned when clamped on the two sides, and the clamping force is uniformly distributed, thereby avoiding the risk of wafer bending or edge breakage caused by excessive force on a single point.

[0041] In an embodiment, the swing arm 160 comprises a fixed end 163 and a swing end 164, the fixed end 163 is close to the front panel 110, and the swing end 164 is away from the front panel 110; the swing end 164 is arc-shaped, and the inner arc radius of the swing end 164 is smaller than the radius of the wafer, and the radius difference is 0-1mm.

[0042] The cutting point of the fixed end 163 and the swing end 164 can be based on the rotation axis 168, the part of the rotation axis 168 close to the front panel 110 is the fixed end 163, and the part of the rotation axis 168 away from the front panel 110 is the swing end 164. The swing arm 160 can be a rod structure, which is convenient for swinging. The swing end 164 is designed to be arc-shaped, and the inner arc radius is slightly smaller than or equal to the radius of the wafer, so that when the swing arm swings to the target position, the target position can be the inner arc of the swing arm and the first arc concentric. When the two swing arms 160 swing inward (i.e. towards the center of the wafer), the two arc-shaped swing ends 164 can "embrace" most of the outer edge of the wafer from both sides. Because the inner arc radius of the swing end 164 is smaller than the radius of the wafer, the elastic clamping jaw 170 generates an elastic force when it contacts the wafer to clamp the wafer.

[0043] In an embodiment, the side panel 120 is provided with a supporting protrusion 140; the first arc has an arc greater than or equal to 180°, and the swing arm 160 is provided with at least two elastic clamping jaws 170, and the at least two elastic clamping jaws 170 are distributed on both sides of the supporting protrusion 140.

[0044] In a preferred example, the first arc has an arc greater than or equal to 180°, which can wrap and guide more than half of the circumference of the wafer edge, and the positioning effect is better and more stable. This large-arc guiding structure highly constrains the movement of the wafer in the horizontal plane, so that even if there is a slight positional deviation, it can be smoothly corrected to the center in the clamping action, without causing stress concentration or damage due to local jamming.

[0045] The first arc has an arc greater than or equal to 180°, i.e. the length of the side panel 120 is relatively long, and the swing arm 160 can rely on the side panel 120 to rotate, so that the swing arm 160 can slide relative to the side panel 120, reducing the driving force, which can reduce the damage to the wafer edge and further reduce the buffer force.

[0046] In an example, the swing arm 160 is provided with a weight-reducing hole 165, which reduces the gravity of the swing arm 160, further reduces the driving force, reduces the damage to the wafer edge, and reduces the buffer force.

[0047] In an embodiment, the side panel 120 is provided with a strip-shaped through hole 101 extending inward, the number of strip-shaped through holes 101 is at least one, and at least one of the two elastic clamping jaws 170 moves in the strip-shaped through hole 101 along with the swing arm 160.

[0048] In order to accommodate the movement of the elastic clamping jaw 170 fixed on the swing arm 160 when the swing arm 160 rotates, a strip-shaped through hole 101 extending to the inner side edge is formed on the side panel 120. The vertical plate 171 of part of the elastic clamping jaw 170 (especially close to the fixed end 163) can move in the strip-shaped through hole 101 along with the swing arm 160. When the swing arm 160 rotates, the clamping jaw moves in the strip-shaped through hole 101. The design of the strip-shaped through hole 101 enables the elastic clamping jaw 170 to be distributed on both sides of the supporting protrusion 140, facilitating the balance of clamping force, further ensuring the stable clamping of the wafer, and avoiding damage to the wafer.

[0049] In an embodiment, at least one supporting protrusion 140 is provided on the side panel 120, the first circular arc has an arc less than or equal to 180°, the swing arm 160 is provided with at least one elastic clamping jaw 170, and the at least one elastic clamping jaw 170 is distributed on the swing arm 160 on the side away from the fixed end 163 of the supporting protrusion 140.

[0050] The first circular arc has an arc less than or equal to 180°, in this case, the length of the side panel 120 is shorter, at least one supporting protrusion 140 can be provided on each side panel 120, and at least one elastic clamping jaw 170 is provided on each swing arm 160. The mounting position of the elastic clamping jaw 170 on the swing arm 160 can be on the side of the supporting protrusion 140 away from the fixed end 163 of the swing arm 160. At the same time, the length of the side panel 120 is shorter, and the length of the swing arm 160 can be longer than the side panel 120, i.e. protruding from the side panel 120, and the elastic clamping jaw 170 is arranged at the position of the swing arm 160 protruding from the side panel 120. This layout also follows the function division of supporting and clamping, supporting first and clamping later, ensuring the reliability of positioning and clamping.

[0051] In an embodiment, a first driving member 161 and a first buffer member 162 are further included, the first driving member 161 is embeddedly installed on the side panel 120, so that the output shaft of the first driving member 161 extends upward and is connected with the swing arm, and the first buffer member 162 is embeddedly installed on the side of the first driving member 161 away from the inner side edge of the bottom plate 100 and on the side of the first driving member 161 away from the swing end 164 of the swing arm 160.

[0052] The first driving member 161 (such as a rotary swing cylinder) driving the swing arm 160 to move is preferably embeddedly installed on the side panel 120, so that the output shaft 301 of the first driving member 161 extends upward and is connected with the swing arm 160. This embedded installation makes the structure very compact, the overall profile simple, reduces external interference, and the symmetrical embedded installation ensures the high synchronism of the driving on both sides.

[0053] A first buffer 162 (such as a hydraulic buffer or an elastic damper) is also embedded and installed on the side of the first driving member 161 away from the inner side of the bottom plate 100 and away from the oscillating end 164 of the swing arm 160. The first buffer 162 can absorb the kinetic energy of the swing arm 160 when it swings to the limit position (clamping or loosening position), so as to achieve smooth and impact-free stopping. It is arranged on the side away from the wafer and the oscillating end 164, so as to avoid affecting the wafer into the station, and to enable the swing arm 160 to be close to the wafer, facilitating the stable rotation of the swing arm 160; secondly, any slight vibration or heat generated by the buffer can be as far away from the fragile wafer and the precise clamping jaw contact point as possible, further isolating the interference source that may affect the wafer.

[0054] In an embodiment, the L-shaped elastic sheet is made of spring steel sheet; the elastic clamping jaw 170 further comprises a cylindrical PIN rod 173, and the surface roughness Ra of the upper surface of the cylindrical PIN rod 173 is less than or equal to 0.8.

[0055] A cylindrical PIN rod 173 is fixed on the horizontal plate 172 of the L-shaped elastic sheet 210 of the elastic clamping jaw 170 by bonding or press fitting. The PIN rod 173 is preferably made of non-metallic, low-wear and anti-static materials such as PEEK (polyether ether ketone), and the upper surface of the top thereof in contact with the edge of the wafer is precisely polished with a surface roughness Ra less than or equal to 0.8. This smooth PIN rod 173 is the only component in direct contact with the wafer, and its low roughness and soft material ensure that the contact point will not scratch the sensitive area of the wafer edge.

[0056] In an example, the supporting protrusion 140 can also be provided with the above-mentioned cylindrical PIN rod 173.

[0057] In an embodiment, the elastic pressure of the elastic clamping jaw 170 on the wafer of a preset size is 2N.

[0058] When the elastic clamping jaw 170 clamps the standard thickness wafer, it generates precise elastic deformation through the L-shaped elastic sheet 210, thereby providing a constant clamping force. For example, the industry operation standard requires a clamping force of 2N to stably clamp the wafer. Through the limitation of the elastic coefficient, the length and thickness of the elastic clamping jaw 170, the elastic pressure of the elastic clamping jaw 170 on the wafer of a preset size is 2N. This force value (2N) is sufficient to firmly fix the wafer, and the two sides of the wafer are subjected to a clamping force of 4N, which can prevent the wafer from sliding or drifting and ensure positioning accuracy; and is lower than the critical force that causes cracks or damage to the edge of the wafer. The elastic force provided by the spring steel sheet is predictable, repeatable and linear, avoiding the uncertainty risk of the clamping force caused by pressure fluctuations.

[0059] In an embodiment, the three panels are integrally formed, and the three panels form a square U-shaped structure or a U-shaped structure.

[0060] In the foregoing embodiment, three panels are provided to form a bottom plate structure with a circular-arc-shaped inner side edge.

[0061] In other examples, for example, when the front panel 110 and the side panel 120 are both straight panels, or further, when the front panel 110 and the side panel 120 are circular-arc-transitioned at the connection position, a structure with a non-circular-arc-shaped inner side edge can also be implemented.

[0062] In this example, only at least three points on the front panel 110 and the side panel 120 are provided with the supporting protrusions 140, and the at least three supporting protrusions 140 are concentric, i.e., enclosed to form a circular arc, so as to support the wafer. In addition, as long as the elastic clamping jaws 170 on the swing arm 160 are distributed around the preset circular arc, the wafer can be lifted and clamped when the elastic clamping jaws 170 are close to the wafer.

[0063] The embodiments of the present application can achieve high-precision and high-repeatability positioning and clamping of the wafer, and at the same time, reduce or even eliminate the risk of wafer scratching, crushing or internal stress in the clamping process from the mechanical structure, and are suitable for ultra-thin wafers and high-end semiconductor manufacturing scenarios which are extremely sensitive to damage.

[0064] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprise" and / or "include" when used in this specification, specify the presence of features, steps, operations, devices, components and / or combinations thereof.

[0065] For the purpose of description, the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the purpose of facilitating the description of the present application and simplifying the description, and in the absence of the opposite description, these orientation words do not indicate and imply that the devices or elements referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component itself. For example, if the devices in the drawings are inverted, the devices described as "above" or "above" other devices or structures will be positioned "below" or "below" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below". The devices can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0066] Unless otherwise clearly indicated, the term "mounting", "connected", "connection", "fixed", and like terms are to be construed broadly, for example, can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection, or communication; can be direct connection, or indirect connection through intermediate medium, or internal connection of two elements, or interaction between two elements. The specific meaning of the above terms in the present application can be understood according to the specific circumstances by those skilled in the art.

[0067] Unless otherwise clearly indicated and limited, "on" or "under" of a first feature to a second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "over" of a first feature to a second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. "Under", "below" and "underneath" of a first feature to a second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the first feature is lower than the second feature in horizontal height.

[0068] Unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the application. At the same time, it should be understood that the size of each part shown in the drawings is not drawn in accordance with the actual proportion relationship. The technology, method and equipment known to those skilled in the related art can not be discussed in detail, but should be regarded as part of the authorized description under appropriate circumstances. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, not as a limitation. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0069] It should also be noted that "one embodiment", "another embodiment", "embodiment" and the like in the present specification refer to specific features, structures or characteristics described in connection with the embodiment, which are included in at least one embodiment generally described in the present application. The same expression appears in several places in the specification does not necessarily refer to the same embodiment. Further, when a specific feature, structure or characteristic is described in connection with any embodiment, it is claimed that the implementation of such feature, structure or characteristic in connection with other embodiments also falls within the scope of the present application.

[0070] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0071] It should be further noted that the above is only the preferred embodiment of the present application, and does not limit the patent protection scope of the present application, and any equivalent structure or equivalent process transformation using the content of the present application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A clamping and positioning device, characterized in that, The clamping and positioning device is used to clamp and position the wafer, and includes: A base plate, the base plate being surrounded by three panels, the three panels including a front panel and two opposing side panels; A supporting protrusion is provided at the bottom of the panel and protrudes towards the inside of the panel; at least three supporting protrusions are provided for the three panels. At least three guard arms are respectively disposed on the three panels, and at least one elastic gripper is fixed on each guard arm; the at least three guard arms include a positioning arm located on the front panel and two swing arms located on the two side panels respectively, and the swing arms are rotatable relative to the side panels; The elastic gripper includes an L-shaped elastic sheet, which includes a horizontal plate and a vertical plate that are perpendicular to each other and connected to each other. The end of the vertical plate opposite to the horizontal plate is connected to the guard arm, and the upper surface of the horizontal plate is lower than or flush with the upper surface of the supporting protrusion.

2. The clamping and positioning device according to claim 1, characterized in that, The three panels are integrally formed, and the three panels form a structure with an inner arc-shaped edge; the arc of the inner edge is a first arc, and the arc of the first arc is 110°~270°; the radius of the first arc is larger than the radius of the wafer, and the radius difference is 9-10mm.

3. The clamping and positioning device according to claim 2, characterized in that, The front panel is provided with a supporting protrusion; the positioning arm is provided with two elastic grippers, which are located on both sides of the supporting protrusion.

4. The clamping and positioning device according to claim 3, characterized in that, The swing arm includes a fixed end and a swing end. The fixed end is close to the front panel, and the swing end is away from the front panel. The swing end is arc-shaped, and the inner arc radius of the swing end is smaller than the radius of the wafer, with a radius difference of 0-1mm.

5. The clamping and positioning device according to claim 4, characterized in that, The side panel is provided with a supporting protrusion; the arc of the first arc is greater than or equal to 180°, and the swing arm is provided with at least two elastic grippers, which are distributed on both sides of the supporting protrusion.

6. The clamping and positioning device according to claim 5, characterized in that, The side panel is provided with a strip-shaped through hole extending to the inside, and the number of the strip-shaped through holes is at least one. At least one of the two elastic grippers moves with the swing arm within the strip-shaped through hole.

7. The clamping and positioning device according to claim 4, characterized in that, The side panel is provided with at least one of the supporting protrusions, the arc of the first arc is less than or equal to 180°, the swing arm is provided with at least one of the elastic claws, and the at least one of the elastic claws is distributed on the side of the supporting protrusion away from the fixed end on the swing arm.

8. The clamping and positioning device according to claim 4, characterized in that, It also includes a first drive member and a first buffer member. The first drive member is embedded in the side panel, such that the output axis of the first drive member extends upward and is connected to the swing arm. The first buffer member is embedded in the side of the first drive member away from the inner edge of the base plate and is located on the side of the first drive member away from the swing end of the swing arm.

9. The clamping and positioning device according to claim 1, characterized in that, The L-shaped elastic sheet is made of spring steel sheet; the elastic gripper also includes a cylindrical PIN rod, the surface roughness Ra of the upper surface of the cylindrical PIN rod is ≤0.8; the elastic pressure of the elastic gripper on the wafer of the preset size is 2N.

10. The clamping and positioning device according to claim 1, characterized in that, The three panels are integrally formed, and the three panels form a square U-shaped structure or a U-shaped structure.

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