Laser galvanometer cutting method, device and equipment and medium
By introducing the first correction matrix and the second correction matrix, the reflector and laser focal length of the laser cutting equipment are adjusted, which solves the problem of accuracy drift caused by temperature rise, mechanical wear and electronic control system drift during long-term operation of the laser galvanometer cutting equipment, and improves the cutting accuracy and yield of the cutting equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-30
- Publication Date
- 2026-04-14
AI Technical Summary
During long-term operation, laser galvanometer cutting equipment experiences precision drift due to temperature rise, mechanical wear, and electronic control system drift, which affects cutting uniformity and dimensional accuracy, reducing the yield of cut products.
The reflector and laser focal length of the laser cutting equipment are adjusted using a first correction matrix and a second correction matrix, and the accuracy is corrected using static and dynamic influence factors to ensure cutting accuracy.
It effectively compensates for the inherent and dynamic precision drift of laser cutting equipment, and improves the cutting yield.
Smart Images
Figure CN121847933A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of laser cutting, and in particular to a laser galvanometer cutting method, apparatus, equipment, and medium. Background Technology
[0002] Laser galvanometers combined with high-speed feeding technology can achieve high-speed, uninterrupted cutting of materials. However, the cutting accuracy will change over time during the cutting process. This accuracy drift is mainly caused by factors such as temperature rise due to long-term operation of the equipment, wear of mechanical parts, and drift of electronic control system parameters. These factors cause laser focus shift and scanning trajectory distortion, which in turn affect the uniformity and dimensional accuracy of the cutting, reducing the overall yield of cut materials. Summary of the Invention
[0003] In view of this, the purpose of this invention is to provide a laser galvanometer cutting method, apparatus, equipment, and medium that can ensure the cutting accuracy of the laser cutting equipment and improve the overall material cutting yield during long-term operation. The specific solution is as follows:
[0004] In a first aspect, this application provides a laser galvanometer cutting method, applied to laser cutting equipment, comprising:
[0005] Obtain the desired cutting pattern of the target material, and determine the desired cutting point of the laser on the target material located within the cutting window based on the desired cutting pattern;
[0006] Based on the first correction matrix and the second correction matrix, the original point coordinates of the desired cutting point are corrected to obtain the target point coordinates; wherein, the point coordinates include a first coordinate value, a second coordinate value and a third coordinate value, the first coordinate value is the deflection angle of the first reflector in the laser cutting equipment; the second coordinate value is the deflection angle of the second reflector in the laser cutting equipment; and the third coordinate value is the laser focal length.
[0007] The reflector and laser focal length of the laser cutting equipment are adjusted using the target point coordinates, and the target material is laser-cut after adjustment so that the actual cutting pattern on the target material coincides with the desired cutting pattern.
[0008] Wherein, the first correction matrix is a matrix pre-constructed based on static influence factors; the second correction matrix is a matrix dynamically updated based on dynamic influence factors; the static influence factors and the dynamic influence factors are both influence factors affecting the cutting accuracy of the laser cutting equipment.
[0009] Optionally, obtaining the desired cutting pattern of the target material includes:
[0010] Before the target material is fed into the cutting window by the feeding assembly, the identification code on the target material is scanned by the first camera.
[0011] Based on the scanned identification code, the desired cutting pattern of the target material is determined.
[0012] Optionally, determining the desired cutting point of the laser on the target material located within the cutting window based on the desired cutting pattern includes:
[0013] Obtain the target mesh obtained after pre-dividing the cutting window into meshes;
[0014] The desired cutting pattern is mapped onto the target partitioned grid to determine the target grid points that coincide with the desired cutting pattern, and the target grid points are determined as the desired cutting points.
[0015] Optionally, the distribution of matrix elements in each of the first and second correction matrices corresponds to the distribution of grid points in the target mesh.
[0016] Furthermore, each matrix element in each correction matrix includes a set of correction values, and each set of correction values includes correction values corresponding to the first coordinate value, the second coordinate value, and the third coordinate value, respectively.
[0017] Optionally, the step of correcting the original point coordinates of the desired cutting point based on the first correction matrix and the second correction matrix to obtain the target point coordinates includes:
[0018] Based on the position of the desired cutting point in the target mesh, the corresponding first set of correction values is determined from the first correction matrix;
[0019] Based on the position of the desired cutting point in the target mesh, the corresponding second set of correction values is determined from the second correction matrix;
[0020] Based on the first set of correction values and the second set of correction values, the original point coordinates of the desired cutting point are corrected to obtain the target point coordinates.
[0021] Optionally, the step of correcting the original point coordinates of the desired cutting point based on the first set of correction values and the second set of correction values to obtain the target point coordinates includes:
[0022] From the first set of correction values, determine the first correction value corresponding to each coordinate value in the original point coordinates;
[0023] From the second set of correction values, determine the second correction value corresponding to each of the coordinate values;
[0024] The coordinate values and their corresponding first correction value and second correction value are added together to obtain the corrected coordinate values.
[0025] The target point coordinates are determined based on the corrected coordinate values.
[0026] Optionally, the laser galvanometer cutting method further includes:
[0027] The actual cutting pattern and the desired cutting pattern, after being aligned by a spatial transformation network, are input into a preset convolutional model to extract the actual pattern contour map of the actual cutting pattern and the desired pattern contour map of the desired cutting pattern. Based on the similarity coefficient and Hu moment of the actual pattern contour map and the desired pattern contour map, the overlap between the actual pattern contour map and the desired pattern contour map is determined.
[0028] The error between the actual cutting point and the desired cutting point is determined based on the overlap ratio; wherein, the actual cutting point is the cutting point actually made by the laser cutting equipment on the target material using the target point coordinates;
[0029] The matrix elements corresponding to the desired cutting point in the second correction matrix are adjusted based on the error conditions to dynamically update the second correction matrix.
[0030] Secondly, this application provides a laser galvanometer cutting device, applied to laser cutting equipment, comprising:
[0031] The cutting point determination module is used to acquire the desired cutting pattern of the target material and determine the desired cutting point of the laser on the target material located within the cutting window based on the desired cutting pattern;
[0032] A coordinate correction module is used to correct the original point coordinates of the desired cutting point based on a first correction matrix and a second correction matrix to obtain the target point coordinates; wherein the point coordinates include a first coordinate value, a second coordinate value, and a third coordinate value, the first coordinate value being the deflection angle of the first reflector in the laser cutting device; the second coordinate value being the deflection angle of the second reflector in the laser cutting device; and the third coordinate value being the laser focal length;
[0033] The laser cutting module is used to adjust the reflector and laser focal length of the laser cutting equipment using the target point coordinates, and then perform laser cutting on the target material after adjustment so that the actual cutting pattern on the target material coincides with the desired cutting pattern.
[0034] Wherein, the first correction matrix is a matrix pre-constructed based on static influence factors; the second correction matrix is a matrix dynamically updated based on dynamic influence factors; the static influence factors and the dynamic influence factors are both influence factors affecting the cutting accuracy of the laser cutting equipment.
[0035] Thirdly, this application provides an electronic device, comprising:
[0036] Memory, used to store computer programs;
[0037] A processor for executing the computer program to implement the aforementioned laser galvanometer cutting method.
[0038] Fourthly, this application provides a computer-readable storage medium for storing a computer program, which, when executed by a processor, implements the aforementioned laser galvanometer cutting method.
[0039] In this application, a laser cutting device acquires a desired cutting pattern of a target material and determines the desired cutting point of the target material located within a cutting window based on the desired cutting pattern. The original coordinates of the desired cutting point are corrected based on a first correction matrix and a second correction matrix to obtain target point coordinates. The point coordinates include a first coordinate value, a second coordinate value, and a third coordinate value. The first coordinate value is the deflection angle of the first reflector in the laser cutting device; the second coordinate value is the deflection angle of the second reflector in the laser cutting device; and the third coordinate value is the laser focal length. The reflector and laser focal length of the laser cutting device are adjusted using the target point coordinates, and the target material is laser-cut after adjustment to make the actual cutting pattern on the target material coincide with the desired cutting pattern. The first correction matrix is a matrix pre-constructed based on static influence factors; the second correction matrix is a matrix dynamically updated based on dynamic influence factors; both the static influence factors and the dynamic influence factors are factors affecting the cutting accuracy of the laser cutting device.
[0040] Therefore, this application introduces a first correction matrix and a second correction matrix. The first correction matrix is a pre-constructed matrix based on static influencing factors affecting the cutting accuracy of the laser cutting equipment, which is adapted to the inherent accuracy defects of the laser cutting equipment. The second correction matrix is a dynamically updated matrix based on dynamic influencing factors affecting the cutting accuracy of the laser cutting equipment, which is adapted to the dynamically changing accuracy defects of the laser cutting equipment during long-term operation. This application uses the first and second correction matrices to correct the original coordinates of the desired cutting point to obtain the target point coordinates. The target point coordinates at this time not only compensate for the inherent accuracy drift caused by the static influencing factors, but also compensate for the accuracy drift caused by the dynamic changes caused by the dynamic influencing factors. Then, the reflector and laser focal length of the laser cutting equipment are adjusted using the target point coordinates, and the target material is laser-cut after adjustment. This allows the actual cutting point on the target material to better coincide with the desired cutting point, thereby making the actual cutting pattern on the target material better coincide with the desired cutting pattern. This solves the inherent accuracy defects of the laser cutting equipment and the accuracy defects caused by dynamic changes during long-term operation, ensuring the cutting accuracy of the laser cutting equipment and improving the overall material cutting yield. Attached Figure Description
[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0042] Figure 1 A flowchart of a laser galvanometer cutting method provided in this application;
[0043] Figure 2 A structural diagram of a laser cutting device provided in this application;
[0044] Figure 3 A flowchart of laser galvanometer cutting provided in this application
[0045] Figure 4 This application provides a schematic diagram of the structure of a laser galvanometer cutting device;
[0046] Figure 5 This application provides a structural diagram of an electronic device. Detailed Implementation
[0047] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0048] Laser galvanometers, combined with high-speed feeding technology, can achieve high-speed, uninterrupted cutting of materials. However, the cutting accuracy changes over time during the cutting process. This accuracy drift mainly stems from factors such as temperature increases due to prolonged equipment operation, wear of mechanical components, and drift in electronic control system parameters. These factors cause laser focus shift and scanning trajectory distortion, which in turn affect the uniformity and dimensional accuracy of the cutting, reducing the overall material yield. Therefore, this application provides a laser galvanometer cutting method that can maintain the cutting accuracy of the laser cutting equipment during long-term operation and improve the overall material yield.
[0049] See Figure 1 As shown, this embodiment of the invention discloses a laser galvanometer cutting method, applied to laser cutting equipment, comprising:
[0050] Step S11: Obtain the desired cutting pattern of the target material, and determine the desired cutting point of the laser on the target material located within the cutting window based on the desired cutting pattern.
[0051] In this embodiment of the invention, the laser cutting device first acquires the desired cutting pattern of the target material, and then, based on the desired cutting pattern, determines the desired cutting point of the target material located within the cutting window. The cutting window is located within the laser working area, which is the area on the working platform after the laser beam is reflected by galvanometers (including a first reflecting mirror and a second reflecting mirror).
[0052] According to one example, obtaining the desired cutting pattern for the target material can specifically include: scanning an identification code on the target material with a first camera before feeding the target material into the cutting window via a feeding assembly; and determining the desired cutting pattern for the target material based on the scanned identification code. It should be noted that the first camera can be a CCD (Charge Coupled Device) camera, and the laser cutting equipment pre-stores a correspondence between identification codes and cutting patterns. By looking up this correspondence, the desired cutting pattern corresponding to the scanned identification code can be determined.
[0053] According to one example, the process of determining the desired cutting point of the laser on the target material located within the cutting window based on the desired cutting pattern may specifically include: obtaining a target mesh obtained after pre-meshing the cutting window; mapping the desired cutting pattern onto the target mesh to determine the target mesh points that coincide with the desired cutting pattern from the target mesh, and determining the target mesh points as the desired cutting points.
[0054] For example, the cutting window is pre-divided into a 64×64 grid to obtain the target grid. At this time, the grid points of the target grid are distributed in a 65×65 pattern, and each grid point has its corresponding coordinates, which include a first coordinate value, a second coordinate value, and a third coordinate value. The first coordinate value is the deflection angle of the first reflector in the laser cutting equipment; the second coordinate value is the deflection angle of the second reflector in the laser cutting equipment; and the third coordinate value is the laser focal length.
[0055] Step S12: Based on the first correction matrix and the second correction matrix, correct the original point coordinates of the desired cutting point to obtain the target point coordinates; wherein, the point coordinates include a first coordinate value, a second coordinate value, and a third coordinate value, the first coordinate value being the deflection angle of the first reflector in the laser cutting equipment; the second coordinate value being the deflection angle of the second reflector in the laser cutting equipment; and the third coordinate value being the laser focal length; furthermore, the first correction matrix is a matrix pre-constructed based on static influence factors; the second correction matrix is a matrix dynamically updated based on dynamic influence factors; both the static influence factors and the dynamic influence factors are influence factors affecting the cutting accuracy of the laser cutting equipment.
[0056] When the laser cutting equipment has no precision drift, the reflector and laser focal length of the laser cutting equipment can be adjusted according to the coordinates of any grid point in the target grid so that the laser hits the grid point exactly. However, if the laser cutting equipment has precision drift, the laser will not hit the grid point exactly and there will be a certain offset. To address this, this application introduces a first correction matrix and a second correction matrix.
[0057] It should be noted that the first correction matrix in this application is a matrix pre-constructed based on static influence factors affecting the cutting accuracy of the laser cutting equipment, which is adapted to the inherent accuracy defects of the laser cutting equipment. The second correction matrix is a matrix dynamically updated based on dynamic influence factors affecting the cutting accuracy of the laser cutting equipment, which is adapted to the dynamically changing accuracy defects of the laser cutting equipment during long-term operation. Therefore, after determining the desired cutting point, this application needs to use the first correction matrix and the second correction matrix to correct the original point coordinates of the desired cutting point in order to obtain the target point coordinates. This allows the target point coordinates to compensate for the inherent accuracy drift caused by the static influence factors, and at the same time compensate for the dynamic accuracy drift caused by the dynamic influence factors.
[0058] It should also be noted that the distribution of matrix elements in each of the first and second correction matrices corresponds to the distribution of grid points in the target grid, that is, both the first and second correction matrices are 65×65 matrices; and each matrix element in each correction matrix includes a set of correction values, each set of correction values including correction values corresponding to the first coordinate value, the second coordinate value and the third coordinate value respectively.
[0059] The process of correcting the original coordinates of the desired cutting point based on the first correction matrix and the second correction matrix to obtain the target point coordinates can specifically include: determining the corresponding first set of correction values from the first correction matrix based on the position of the desired cutting point in the target grid; determining the corresponding second set of correction values from the second correction matrix based on the position of the desired cutting point in the target grid; and correcting the original coordinates of the desired cutting point based on the first set of correction values and the second set of correction values to obtain the target point coordinates.
[0060] It should be noted that since the distribution of matrix elements in the first correction matrix and the second correction matrix corresponds to the distribution of grid points in the target mesh, and the desired cutting point is essentially a grid point in the target mesh, the matrix elements at the corresponding positions can be determined from the first correction matrix and the second correction matrix based on the position of the desired cutting point in the target mesh, so as to obtain the first set of correction values and the second set of correction values.
[0061] According to one example, to correct the original coordinates of the desired cutting point based on a first set of correction values and a second set of correction values to obtain the target point coordinates, the specific steps may include: determining a first correction value from the first set of correction values that corresponds to each coordinate value in the original point coordinates; determining a second correction value from the second set of correction values that corresponds to each coordinate value in the original point coordinates; adding each coordinate value in the original point coordinates along with its corresponding first and second correction values to obtain each corrected coordinate value; and determining the target point coordinates based on each corrected coordinate value.
[0062] Assuming the original coordinates of the desired cutting point are (x, y, z) and the target point coordinates are P(x, y, z), expressed as Px, Py, and Pz respectively, the correction process for the original point coordinates is as follows:
[0063] The first set of correction values is determined from the first correction matrix A based on the original point coordinates (x, y, z), and is expressed as: PA(x, y, z) = A(dx0, dy0, dz0);
[0064] The corresponding second set of correction values is determined from the second correction matrix B based on the original point coordinates (x, y, z), and is expressed as: PB(x, y, z) = B(dx1, dy1, dz1);
[0065] Based on the first set of correction values and the second set of correction values, the original point coordinates of the desired cutting point are corrected, and the final target point coordinates are: P(x,y,z)=(x,y,z)+PA(x,y,z)+PB(x,y,z), which is equivalent to P(x,y,z)=(x,y,z)+A(dx0,dy0,dz0)+B(dx1,dy1,dz1). At this time, we can obtain Px=x+dx0+dx1, Py=y+dy0+dy1, Pz=z+dz0+dz1.
[0066] Step S13: Adjust the reflector and laser focal length of the laser cutting equipment using the target point coordinates, and then perform laser cutting on the target material to make the actual cutting pattern on the target material coincide with the desired cutting pattern.
[0067] In this embodiment of the invention, after obtaining the corrected target point coordinates, the reflector and laser focal length of the laser cutting equipment are adjusted using the target point coordinates. Specifically, the first reflector of the laser cutting equipment is adjusted using the first coordinate value in the target point coordinates, the second reflector of the laser cutting equipment is adjusted using the second coordinate value in the target point coordinates, and the laser focal length of the laser cutting equipment is adjusted using the third coordinate value in the target point coordinates. After adjustment, the target material is laser-cut to better coincide with the actual cutting point and the desired cutting point on the target material, thereby better coinciding the actual cutting pattern and the desired cutting pattern on the target material.
[0068] The first correction matrix is pre-constructed based on static influence factors. Therefore, it is created after the laser cutting equipment is manufactured and installed, but before actual use. Specifically, the reflector and laser focal length of the laser cutting equipment are adjusted using the coordinates of any grid point in the target mesh. Laser cutting is then performed after the adjustment. The deviation between the coordinates of the laser cutting point and the coordinates of any grid point is then determined to obtain a set of correction values corresponding to any grid point. Based on these correction values for each grid point in the target mesh, the first correction matrix can be constructed.
[0069] For the dynamic update of the second correction matrix, the actual cutting pattern and the desired cutting pattern, aligned by the Spatial Transformer Network (STN), are input into a preset convolutional model to extract the actual pattern contour map of the actual cutting pattern and the desired pattern contour map of the desired cutting pattern. Based on the similarity coefficient and Hu moments of the actual and desired pattern contour maps, the overlap between the actual and desired pattern contour maps is determined. Based on the overlap, the error between the actual cutting point and the desired cutting point is determined. The actual cutting point is the actual cutting point on the target material by the laser cutting equipment using the target point coordinates. The matrix elements in the second correction matrix corresponding to the desired cutting point are adjusted based on the error to dynamically update the second correction matrix.
[0070] The laser cutting equipment utilizes an AI (Artificial Intelligence) chip with a Convolutional Neural Network (CNN) to dynamically update the second correction matrix. A CNN is a deep feedforward neural network that excels in image processing, particularly in image recognition tasks. Through its unique structure of convolutional layers, pooling layers, and fully connected layers, CNNs effectively extract and classify features.
[0071] For the actual cutting pattern, the target material after cutting can be photographed by a second camera to obtain the actual cutting pattern; and the second camera can be a CCD camera.
[0072] The Hu moment of an image is an image feature that is invariant to translation, rotation, and scale, and can be used to measure the shape deformation between the actual pattern profile and the desired pattern profile.
[0073] The similarity coefficient used in this application can be the Dice similarity coefficient (DSC), which is mainly used to measure the positional deviation between the actual pattern outline and the desired pattern outline. The formula for calculating the Dice similarity coefficient can be expressed as:
[0074] DSC=2|A∩B| / (|A|+|B|)=2TP / (2TP+FP+FN);
[0075] Where A represents the actual pattern outline, B represents the desired pattern outline, TP represents the number of pixels simultaneously located in both the actual and desired pattern outlines, FP represents the number of pixels only in the desired pattern outline, and FN represents the number of pixels only in the actual pattern outline. The value of DSC ranges from 0 to 1; the closer the value is to 1, the higher the overlap between the two image regions and the better the matching effect.
[0076] In this way, by continuously updating the second correction matrix using a convolution model during the actual use of the laser cutting equipment, the second correction matrix can always adapt to the dynamically changing accuracy defects of the laser cutting equipment during long-term operation, thereby ensuring the cutting accuracy of the laser cutting equipment.
[0077] Therefore, this application introduces a first correction matrix and a second correction matrix. The first correction matrix is a pre-constructed matrix based on static influencing factors affecting the cutting accuracy of the laser cutting equipment, which is adapted to the inherent accuracy defects of the laser cutting equipment. The second correction matrix is a dynamically updated matrix based on dynamic influencing factors affecting the cutting accuracy of the laser cutting equipment, which is adapted to the dynamically changing accuracy defects of the laser cutting equipment during long-term operation. This application uses the first and second correction matrices to correct the original coordinates of the desired cutting point to obtain the target point coordinates. The target point coordinates at this time not only compensate for the inherent accuracy drift caused by the static influencing factors, but also compensate for the accuracy drift caused by the dynamic changes caused by the dynamic influencing factors. Then, the reflector and laser focal length of the laser cutting equipment are adjusted using the target point coordinates, and the target material is laser-cut after adjustment. This allows the actual cutting point on the target material to better coincide with the desired cutting point, thereby making the actual cutting pattern on the target material better coincide with the desired cutting pattern. This solves the inherent accuracy defects of the laser cutting equipment and the accuracy defects caused by dynamic changes during long-term operation, ensuring the cutting accuracy of the laser cutting equipment and improving the overall material cutting yield.
[0078] See Figure 2 and Figure 3 As shown, this embodiment of the invention discloses a laser galvanometer cutting method, comprising:
[0079] The laser cutting equipment includes a feeding assembly, CCD1, CCD2, a laser galvanometer island, and a controller. The laser galvanometer island includes a laser, a first reflector, and a second reflector, wherein the laser beam is reflected by the first and second reflectors before entering the cutting window.
[0080] CCD1 is used to scan the identification code on the target material before it is fed into the cutting window by the feeding assembly, so that the controller can determine the desired cutting pattern of the target material based on the scanned identification code.
[0081] The controller obtains the target mesh obtained after pre-dividing the cutting window into meshes, maps the desired cutting pattern onto the target mesh, determines the target mesh points that coincide with the desired cutting pattern from the target mesh, and identifies the target mesh points as the desired cutting points.
[0082] Based on the position of the desired cutting point in the target grid, the controller determines the corresponding first set of correction values from the first correction matrix, and based on the position of the desired cutting point in the target grid, determines the corresponding second set of correction values from the second correction matrix. Based on the first set of correction values and the second set of correction values, the controller corrects the original point coordinates of the desired cutting point to obtain the target point coordinates.
[0083] The controller uses the target point coordinates to adjust the first reflector, the second reflector, and the laser focal length of the laser cutting equipment, and then performs laser cutting on the target material after adjustment, so that the actual cutting point and the desired cutting point on the target material are better aligned, thereby making the actual cutting pattern on the target material better aligned with the desired cutting pattern.
[0084] The CCD2 is used to photograph the target material after cutting to obtain the actual cutting pattern, and then sends the actual cutting pattern to the controller.
[0085] The controller inputs the actual cutting pattern and the desired cutting pattern, which have been aligned by the spatial transformation network, into a preset convolutional model to extract the actual pattern contour map of the actual cutting pattern and the desired pattern contour map of the desired cutting pattern. Based on the similarity coefficient and Hu moment of the actual pattern contour map and the desired pattern contour map, the controller determines the overlap between the actual pattern contour map and the desired pattern contour map. Then, based on the overlap, the controller determines the error between the actual cutting point and the desired cutting point, and uses the error to adjust the matrix elements in the second correction matrix corresponding to the desired cutting point, so as to dynamically update the second correction matrix.
[0086] Therefore, this application introduces a first correction matrix and a second correction matrix. The first correction matrix is a pre-constructed matrix based on static influencing factors affecting the cutting accuracy of the laser cutting equipment, which is adapted to the inherent accuracy defects of the laser cutting equipment. The second correction matrix is a dynamically updated matrix based on dynamic influencing factors affecting the cutting accuracy of the laser cutting equipment, which is adapted to the dynamically changing accuracy defects of the laser cutting equipment during long-term operation. This application uses the first and second correction matrices to correct the original coordinates of the desired cutting point to obtain the target point coordinates. The target point coordinates at this time not only compensate for the inherent accuracy drift caused by the static influencing factors, but also compensate for the accuracy drift caused by the dynamic changes caused by the dynamic influencing factors. Then, the reflector and laser focal length of the laser cutting equipment are adjusted using the target point coordinates, and the target material is laser-cut after adjustment. This allows the actual cutting point on the target material to better coincide with the desired cutting point, thereby making the actual cutting pattern on the target material better coincide with the desired cutting pattern. This solves the inherent accuracy defects of the laser cutting equipment and the accuracy defects caused by dynamic changes during long-term operation, ensuring the cutting accuracy of the laser cutting equipment and improving the overall material cutting yield.
[0087] See Figure 4 As shown, this embodiment of the invention discloses a laser galvanometer cutting device, applied to laser cutting equipment, comprising:
[0088] The cutting point determination module 11 is used to acquire the desired cutting pattern of the target material and determine the desired cutting point of the laser on the target material located within the cutting window based on the desired cutting pattern.
[0089] The coordinate correction module 12 is used to correct the original point coordinates of the desired cutting point based on the first correction matrix and the second correction matrix to obtain the target point coordinates; wherein the point coordinates include a first coordinate value, a second coordinate value and a third coordinate value, the first coordinate value is the deflection angle of the first reflector in the laser cutting device; the second coordinate value is the deflection angle of the second reflector in the laser cutting device; and the third coordinate value is the laser focal length.
[0090] The laser cutting module 13 is used to adjust the reflector and laser focal length of the laser cutting equipment using the target point coordinates, and to perform laser cutting on the target material after adjustment so that the actual cutting pattern on the target material coincides with the desired cutting pattern.
[0091] Wherein, the first correction matrix is a matrix pre-constructed based on static influence factors; the second correction matrix is a matrix dynamically updated based on dynamic influence factors; the static influence factors and the dynamic influence factors are both influence factors affecting the cutting accuracy of the laser cutting equipment.
[0092] Therefore, this application introduces a first correction matrix and a second correction matrix. The first correction matrix is a pre-constructed matrix based on static influencing factors affecting the cutting accuracy of the laser cutting equipment, which is adapted to the inherent accuracy defects of the laser cutting equipment. The second correction matrix is a dynamically updated matrix based on dynamic influencing factors affecting the cutting accuracy of the laser cutting equipment, which is adapted to the dynamically changing accuracy defects of the laser cutting equipment during long-term operation. This application uses the first and second correction matrices to correct the original coordinates of the desired cutting point to obtain the target point coordinates. The target point coordinates at this time not only compensate for the inherent accuracy drift caused by the static influencing factors, but also compensate for the accuracy drift caused by the dynamic changes caused by the dynamic influencing factors. Then, the reflector and laser focal length of the laser cutting equipment are adjusted using the target point coordinates, and the target material is laser-cut after adjustment. This allows the actual cutting point on the target material to better coincide with the desired cutting point, thereby making the actual cutting pattern on the target material better coincide with the desired cutting pattern. This solves the inherent accuracy defects of the laser cutting equipment and the accuracy defects caused by dynamic changes during long-term operation, ensuring the cutting accuracy of the laser cutting equipment and improving the overall material cutting yield.
[0093] In some specific embodiments, the cutting point determination module 11 includes:
[0094] The identification code scanning unit is used to scan the identification code on the target material using a first camera before the target material is fed into the cutting window by the feeding component.
[0095] A cutting pattern determination unit is used to determine the desired cutting pattern of the target material based on the scanned identification code.
[0096] In some specific embodiments, the cutting point determination module 11 includes:
[0097] The mesh acquisition unit is used to acquire the target mesh obtained after pre-dividing the cutting window into meshes;
[0098] The cutting point determination unit is used to map the desired cutting pattern onto the target partitioned grid, so as to determine the target grid point that coincides with the desired cutting pattern from the target partitioned grid, and determine the target grid point as the desired cutting point.
[0099] In some specific embodiments, the distribution of matrix elements in each of the first and second correction matrices corresponds to the distribution of grid points in the target mesh.
[0100] Furthermore, each matrix element in each correction matrix includes a set of correction values, and each set of correction values includes correction values corresponding to the first coordinate value, the second coordinate value, and the third coordinate value, respectively.
[0101] In some specific embodiments, the coordinate correction module 12 includes:
[0102] The first set of correction value determination unit is used to determine the corresponding first set of correction values from the first correction matrix based on the position of the desired cutting point in the target grid.
[0103] The second set of correction value determination unit is used to determine the corresponding second set of correction values from the second correction matrix based on the position of the desired cutting point in the target grid.
[0104] The coordinate correction submodule is used to correct the original point coordinates of the desired cutting point based on the first set of correction values and the second set of correction values to obtain the target point coordinates.
[0105] In some specific embodiments, the coordinate correction submodule includes:
[0106] The first correction value determination unit is used to determine, from the first set of correction values, the first correction value corresponding to each coordinate value in the original point coordinates;
[0107] The second correction value determination unit is used to determine, from the second set of correction values, the second correction value corresponding to each of the coordinate values respectively;
[0108] The coordinate value correction unit is used to add the coordinate values and their corresponding first correction value and second correction value to obtain the corrected coordinate values.
[0109] The point coordinate determination unit is used to determine the target point coordinates based on the corrected coordinate values.
[0110] In some specific embodiments, the laser galvanometer cutting device further includes:
[0111] The overlap determination unit is used to input the actual cutting pattern and the desired cutting pattern after alignment by the spatial transformation network into a preset convolution model to extract the actual pattern contour map of the actual cutting pattern and the desired pattern contour map of the desired cutting pattern, and determine the overlap between the actual pattern contour map and the desired pattern contour map based on the similarity coefficient and Hu moment of the actual pattern contour map and the desired pattern contour map.
[0112] An error determination unit is used to determine the error between the actual cutting point and the desired cutting point based on the overlap degree; wherein, the actual cutting point is the actual cutting point on the target material by the laser cutting equipment using the target point coordinates;
[0113] The matrix dynamic update unit is used to adjust the matrix elements in the second correction matrix corresponding to the desired cutting point using the error conditions, so as to dynamically update the second correction matrix.
[0114] Furthermore, embodiments of this application also disclose an electronic device, Figure 5 This is a structural diagram of an electronic device 20 according to an exemplary embodiment. The content of the diagram should not be construed as limiting the scope of this application.
[0115] Figure 5 This is a schematic diagram of the structure of an electronic device 20 provided in an embodiment of this application. Specifically, the electronic device 20 may include: at least one processor 21, at least one memory 22, a power supply 23, a communication interface 24, an input / output interface 25, and a communication bus 26. The memory 22 stores a computer program, which is loaded and executed by the processor 21 to implement the relevant steps in the laser galvanometer cutting method disclosed in any of the foregoing embodiments. Alternatively, the electronic device 20 in this embodiment may specifically be an electronic computer.
[0116] In this embodiment, the power supply 23 is used to provide operating voltage for each hardware device on the electronic device 20; the communication interface 24 can create a data transmission channel between the electronic device 20 and external devices, and the communication protocol it follows can be any communication protocol applicable to the technical solution of this application, and is not specifically limited here; the input / output interface 25 is used to acquire external input data or output data to the outside world, and its specific interface type can be selected according to specific application needs, and is not specifically limited here.
[0117] In addition, the memory 22, as a carrier for resource storage, can be a read-only memory, random access memory, disk or optical disk, etc. The resources stored thereon can include operating system 221, computer program 222, etc., and the storage method can be temporary storage or permanent storage.
[0118] The operating system 221 is used to manage and control the various hardware devices on the electronic device 20 and the computer program 222, which may be Windows Server, Netware, Unix, Linux, etc. In addition to including a computer program capable of performing the laser galvanometer cutting method executed by the electronic device 20 as disclosed in any of the foregoing embodiments, the computer program 222 may further include a computer program capable of performing other specific tasks.
[0119] Furthermore, this application also discloses a computer-readable storage medium for storing a computer program; wherein, when the computer program is executed by a processor, it implements the aforementioned laser galvanometer cutting method. Specific steps of this method can be found in the corresponding content disclosed in the foregoing embodiments, and will not be repeated here.
[0120] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section.
[0121] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.
[0122] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented directly by hardware, a software module executed by a processor, or a combination of both. The software module can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.
[0123] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0124] The technical solutions provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.
Claims
1. A laser galvanometer cutting method, characterized in that, Applications in laser cutting equipment, including: Obtain the desired cutting pattern of the target material, and determine the desired cutting point of the laser on the target material located within the cutting window based on the desired cutting pattern; Based on the first correction matrix and the second correction matrix, the original point coordinates of the desired cutting point are corrected to obtain the target point coordinates; wherein, the point coordinates include a first coordinate value, a second coordinate value and a third coordinate value, the first coordinate value is the deflection angle of the first reflector in the laser cutting equipment; the second coordinate value is the deflection angle of the second reflector in the laser cutting equipment; and the third coordinate value is the laser focal length. The reflector and laser focal length of the laser cutting equipment are adjusted using the target point coordinates, and the target material is laser-cut after adjustment so that the actual cutting pattern on the target material coincides with the desired cutting pattern. Wherein, the first correction matrix is a matrix pre-constructed based on static influence factors; the second correction matrix is a matrix dynamically updated based on dynamic influence factors; the static influence factors and the dynamic influence factors are both influence factors affecting the cutting accuracy of the laser cutting equipment.
2. The laser galvanometer cutting method according to claim 1, characterized in that, The process of obtaining the desired cutting pattern of the target material includes: Before the target material is fed into the cutting window by the feeding assembly, the identification code on the target material is scanned by the first camera. Based on the scanned identification code, the desired cutting pattern of the target material is determined.
3. The laser galvanometer cutting method according to claim 1 or 2, characterized in that, Determining the desired cutting point of the laser on the target material located within the cutting window based on the desired cutting pattern includes: Obtain the target mesh obtained after pre-dividing the cutting window into meshes; The desired cutting pattern is mapped onto the target partitioned grid to determine the target grid points that coincide with the desired cutting pattern, and the target grid points are determined as the desired cutting points.
4. The laser galvanometer cutting method according to claim 3, characterized in that, The distribution of matrix elements in each of the first and second correction matrices corresponds to the distribution of grid points in the target mesh. Furthermore, each matrix element in each correction matrix includes a set of correction values, and each set of correction values includes correction values corresponding to the first coordinate value, the second coordinate value, and the third coordinate value, respectively.
5. The laser galvanometer cutting method according to claim 4, characterized in that, The step of correcting the original point coordinates of the desired cutting point based on the first correction matrix and the second correction matrix to obtain the target point coordinates includes: Based on the position of the desired cutting point in the target mesh, the corresponding first set of correction values is determined from the first correction matrix; Based on the position of the desired cutting point in the target mesh, the corresponding second set of correction values is determined from the second correction matrix; Based on the first set of correction values and the second set of correction values, the original point coordinates of the desired cutting point are corrected to obtain the target point coordinates.
6. The laser galvanometer cutting method according to claim 5, characterized in that, The step of correcting the original point coordinates of the desired cutting point based on the first set of correction values and the second set of correction values to obtain the target point coordinates includes: From the first set of correction values, determine the first correction value corresponding to each coordinate value in the original point coordinates; From the second set of correction values, determine the second correction value corresponding to each of the coordinate values; The coordinate values and their corresponding first correction value and second correction value are added together to obtain the corrected coordinate values. The target point coordinates are determined based on the corrected coordinate values.
7. The laser galvanometer cutting method according to claim 4, characterized in that, Also includes: The actual cutting pattern and the desired cutting pattern, after being aligned by a spatial transformation network, are input into a preset convolutional model to extract the actual pattern contour map of the actual cutting pattern and the desired pattern contour map of the desired cutting pattern. Based on the similarity coefficient and Hu moment of the actual pattern contour map and the desired pattern contour map, the overlap between the actual pattern contour map and the desired pattern contour map is determined. The error between the actual cutting point and the desired cutting point is determined based on the overlap ratio; wherein, the actual cutting point is the cutting point actually made by the laser cutting equipment on the target material using the target point coordinates; The matrix elements corresponding to the desired cutting point in the second correction matrix are adjusted based on the error conditions to dynamically update the second correction matrix.
8. A laser galvanometer cutting device, characterized in that, Applications in laser cutting equipment, including: The cutting point determination module is used to acquire the desired cutting pattern of the target material and determine the desired cutting point of the laser on the target material located within the cutting window based on the desired cutting pattern; A coordinate correction module is used to correct the original point coordinates of the desired cutting point based on a first correction matrix and a second correction matrix to obtain the target point coordinates; wherein the point coordinates include a first coordinate value, a second coordinate value, and a third coordinate value, the first coordinate value being the deflection angle of the first reflector in the laser cutting device; the second coordinate value being the deflection angle of the second reflector in the laser cutting device; and the third coordinate value being the laser focal length; The laser cutting module is used to adjust the reflector and laser focal length of the laser cutting equipment using the target point coordinates, and then perform laser cutting on the target material so that the actual cutting pattern on the target material coincides with the desired cutting pattern. Wherein, the first correction matrix is a matrix pre-constructed based on static influence factors; the second correction matrix is a matrix dynamically updated based on dynamic influence factors; the static influence factors and the dynamic influence factors are both influence factors affecting the cutting accuracy of the laser cutting equipment.
9. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor for executing the computer program to implement the laser galvanometer cutting method as described in any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that, Used to store a computer program, which, when executed by a processor, implements the laser galvanometer cutting method as described in any one of claims 1 to 7.