Manufacturing equipment and method for integrated circuit

Abstract

The invention relates to the technical field of integrated circuit production equipment, in particular to integrated circuit manufacturing equipment and a method thereof.The integrated circuit manufacturing equipment comprises an operation platform and a storage base table, the manufacturing equipment further comprises a cutting assembly capable of reducing burrs generated by cutting, and the cutting assembly comprises a mounting frame capable of adjusting the height; a mounting table capable of moving up and down is mounted at the bottom end of the mounting frame, an extending plate is mounted on the mounting table, and a position adjusting assembly is arranged at the top end of the extending plate. The situation that many burrs appear on the cut surface of the base plate in the long-time cutting process due to the fact that the base plate is cut only through one cutter head is avoided.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing equipment technology, specifically to a manufacturing equipment and method for integrated circuits. Background Technology

[0002] An integrated circuit is a microelectronic device that integrates electronic components onto a tiny semiconductor wafer. During the production process, in order to meet different design requirements, it often needs to be cut into substrates of different sizes. This requires the use of manufacturing equipment with cutting capabilities for the cutting operation.

[0003] Some existing manufacturing equipment uses PCB depaneling machines to cut the substrates used for integrated circuits. However, since the PCB depaneling machine cuts the substrate during the moving process by a single blade, and the blade only has a rotation function, if it is not maintained in time during long-term operation, the edge of the blade will not be sharp, which will easily cause more burrs on the cut surface of the substrate, affecting subsequent production. Summary of the Invention

[0004] The purpose of this invention is to provide a manufacturing apparatus and method for integrated circuits to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a manufacturing apparatus and method for integrated circuits, comprising an operating platform and a placement base, wherein the manufacturing apparatus further comprises a cutting component capable of reducing burrs generated during cutting; The cutting assembly includes a height-adjustable mounting frame, a lifting and lowering mounting platform is mounted at the bottom of the mounting frame, an extension plate is mounted on the mounting platform, and a position adjustment assembly is provided at the top of the extension plate. The position adjustment component includes a fixed frame capable of translational movement, a lifting plate capable of vertical movement is provided on the fixed frame, and a tool assembly capable of angle adjustment is installed on both the lifting plate and the mounting frame. The right side of the mounting platform is equipped with a reinforcement assembly for balancing the tool assembly and polishing the tool assembly.

[0006] The cutting tool assembly includes a fixed platform, on which a rotating platform capable of rotatable adjustment of angle is provided. A cutting disc for cutting substrate is provided on the rotating platform. Two fixing plates are provided on the fixed platform, and each of the two fixing plates is provided with a limiting screw for fixing the angle of the rotating platform.

[0007] The reinforcement assembly includes a positioning plate fixed on the mounting platform. The positioning plate is provided with an I-beam plate that can grind the cutter head. The positioning plate is also provided with a stop block that can fix the position of the I-beam plate. Four balance plates are installed at the bottom of the I-beam plate to ensure the smooth rotation of the cutter head. Each balance plate is provided with a triangular block at the bottom of its base that can detect whether the two cutter heads are at the same tilt angle.

[0008] The bottom end of the I-beam is equipped with a polishing stone plate for polishing the cutter head, and the polishing stone plate is located on the rotation path of the cutter head.

[0009] The position adjustment assembly includes a fixed frame installed on the top of the extension plate, the extension plate is provided on the fixed frame, the extension plate is provided on the extension plate, the rotating screw is fitted with a translation block capable of translational movement, and the translation block is fixedly connected to the fixed frame to form an integral whole.

[0010] The fixed frame is provided with a protruding plate, the protruding plate is provided with an adjusting screw, and the lifting plate is equipped with a lifting block that can be connected to the adjusting screw.

[0011] The mounting bracket is provided with a fixing block, and the fixing block is provided with a rotatable threaded post. The bottom end of the threaded post is fixedly connected to the mounting platform, and a nut is fitted on the outer wall of the threaded post.

[0012] The top of the mounting platform is equipped with two lifting rods to prevent it from rotating.

[0013] A turntable is rotatably mounted on the rotating platform, and the turntable is connected to the cutter head by a screw.

[0014] A method of using a manufacturing apparatus for integrated circuits, the method comprising the following steps: Step 1: When it is necessary to cut the substrate vertically, control the adjusting screw to rotate upward and adjust the height of the cutter head located directly below the extension plate so that it can only cut the substrate locally. At this time, place the substrate on the top of the placement base and control the substrate displacement. During the substrate displacement, the substrate can be cut in segments by the two cutter heads. Step 2: When a V-shaped cut is required on the substrate, control the rotating screw to rotate, causing the translation block to shift and adjust the position of the cutter head directly below the extension plate. Then, control the limiting screw to pass through the fixing plate and rotate, causing the rotating table and cutter head to rotate and adjust the tilt angle of the cutter head. Then, assemble the four triangular blocks together to form two isosceles triangles, and connect the top balance plates of the two isosceles triangle blocks together through the connecting rod. Then, place the triangular blocks forming the isosceles triangles between the two cutter heads and observe whether the other cutter head is also close to the triangular block when one cutter head is close to the triangular block to determine whether the two cutter heads are at the same tilt angle. When the triangular block detects that the two cutter heads have been adjusted to the same tilt angle, the substrate can be V-shaped cut. Step 3: By increasing the tilt angle of the rotating table and the cutter head, the cutter head can be closely attached to the polishing stone after rotation, and the stone is polished while the cutter head is manually pushed to rotate, so that the edge of the cutter head is always in a relatively sharp state.

[0015] Compared with the prior art, the beneficial effects of the present invention are: This invention adjusts the height of one cutting disc to enable two cutting discs to cut the substrate in segments, avoiding the problem of relying on only one cutting disc to cut the substrate, which would result in more burrs on the cut surface of the substrate during long-term cutting.

[0016] By controlling the rotation of the rotating screw, the translation block is displaced, and the position of the cutter head directly below the extension plate is adjusted. At this time, the limit screw is controlled to pass through the fixed plate and rotate, so that the rotating table and the cutter head rotate, and the tilt angle of the cutter head is adjusted. After the two cutter heads are adjusted to the same tilt angle by the triangular block, the substrate can be V-shaped cut.

[0017] By increasing the tilt angle of the rotating table and the cutter head, the cutter head can be made to fit closely to the polishing stone after rotation, and the stone can be polished while the cutter head is manually pushed to rotate, so that the edge of the cutter head is always kept in a relatively sharp state. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 This is a schematic diagram of the cutting component structure of the present invention.

[0020] Figure 3 This is a schematic diagram of the mounting platform structure of the present invention.

[0021] Figure 4 This is a partial structural diagram of the cutting component of the present invention.

[0022] Figure 5 This is a schematic diagram of the fixing frame structure of the present invention.

[0023] Figure 6 This is a schematic diagram of the lifting plate structure of the present invention.

[0024] Figure 7 This is a schematic diagram of the rotating platform structure of the present invention.

[0025] Figure 8 This is a schematic diagram of the I-beam mounting structure of the present invention.

[0026] Figure 9 This is an exploded view of the positioning plate structure of the present invention.

[0027] Figure 10 This is a schematic diagram of the assembly structure of the balance plate of the present invention.

[0028] In the diagram: 1. Operating platform; 2. Storage base; 3. Cutting component; 4. Mounting frame; 5. Fixing block; 6. Threaded post; 7. Nut; 8. Mounting platform; 9. Lifting rod; 10. Extension plate; 11. Fixing frame; 12. Rotating screw; 13. Translation block; 14. Fixing frame; 15. Adjusting screw; 16. Lifting block; 17. Lifting plate; 18. Fixing platform; 19. Rotating platform; 20. Cutter head; 21. Fixing plate; 22. Limiting screw; 23. Positioning plate; 24. I-beam plate; 25. Stop block; 26. Balance plate; 27. Triangular block; 28. Connecting rod. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figures 1 to 10This invention provides a technical solution: a manufacturing equipment and method for integrated circuits, comprising an operating platform 1 for cutting raw material substrates for integrated circuit production. The operating platform 1 has a hidden groove, and a threaded rod is disposed within the hidden groove. The left side of the threaded rod is connected to the inner wall of the hidden groove via a rotating connecting ring. The right side of the threaded rod passes through the hidden groove and extends to the right side of the operating platform 1. A handle is welded and installed on the right side wall of the threaded rod. A pushing block is disposed within the hidden groove, and the pushing block is movably fitted onto the outer wall of the threaded rod. The width of the pushing block is the same as the width of the hidden groove, facilitating translational movement of the pushing block within the hidden groove during the rotation of the threaded rod. The top of the operating platform 1 is also provided with two mounting slots, and a hidden groove is located between the two mounting slots. A crossbar is welded and installed in each mounting slot. A balance block with the same width as the mounting slot is movably fitted on the outer wall of each crossbar. The top of the two balance blocks and the push block are connected to a placement base 2 for placing the substrate to be cut. The placement base 2 is L-shaped and is used to tightly fit one end of the substrate with the inner corner of the L-shaped placement base 2. By controlling the rotation of the threaded rod, the placement base 2 and the part of the substrate to be cut located at its top are moved to directly below the cutter head 20, so that the operator can push the substrate to move linearly on the placement base 2, close to its inner corner, and cut it by the cutter head 20 during the movement.

[0031] A cutting component 3 with grinding function is welded to the top of the operating platform 1. The cutting component 3 includes a mounting bracket 4 fixedly installed on the top of the operating platform 1. The mounting bracket 4 consists of a vertical plate and an L-shaped lifting frame. The top of the vertical plate has an opening that matches the length and width of the short end of the L-shaped lifting frame. The L-shaped lifting frame is placed in this opening, and a screw for fixing the position of the L-shaped lifting frame is provided on the left side of the vertical plate. The top plate of the L-shaped lifting frame, which is one of the components of the mounting bracket 4, has an opening at its center. A fixing block 5 is welded into this opening. The fixing block 5 has threaded through holes at both its upper and lower ends, and the threaded through holes are equipped with fittings. The threaded column 6 has a nut 7 fitted on its outer wall to fix the height of the mounting platform 8, and the nut 7 is located above the mounting bracket 4. The bottom end of the threaded column 6 is connected to the mounting platform 8 through a rotating connecting ring to prevent the mounting platform 8 from rotating during the rotation of the threaded column 6. Two lifting rods 9 are welded to the top of the mounting platform 8 to prevent the mounting platform 8 from rotating on its own. The bottom plate of the fixing block 5 is provided with two grooves that match the diameter of the lifting rods 9. The top of each lifting rod 9 extends five centimeters into the groove at the bottom of the fixing block 5, so that the cutter head 20 can be adjusted to different heights when cutting substrates of different thicknesses.

[0032] An extension plate 10 is welded to the top of the mounting platform 8. A position adjustment assembly is located at the top of the extension plate 10. The position adjustment assembly includes a fixed frame 11 welded to the top of the extension plate 10. The fixed frame 11 partially extends beyond the top of the extension plate 10, and a rotatable rotating screw 12 is located within the fixed frame 11. The left side of the rotating screw 12 is connected to the inner wall of the fixed frame 11 via a rotating connecting ring. The right side of the rotating screw 12 passes through the right side plate of the fixed frame 11 and extends to the right side of the fixed frame 11. A handle is welded to the right side of the rotating screw 12. A translation block 13 with the same width as the inner frame of the fixed frame 11 is fitted onto the outer wall. A fixed frame 14 is welded to the bottom of the translation block 13. A balance bar is welded to the left side of the fixed frame 14 to ensure its stability. An opening with the same width and height as the balance bar is provided on the right side of the extension plate 10. The balance bar is placed in this opening, which can ensure the stable translation movement of the fixed frame 14 during the translation movement of the translation block 13 and the fixed frame 14 by rotating the screw 12, and prevent the fixed frame 14 from shaking during the cutting of the substrate. A T-shaped lifting groove is provided on the right side of the fixed frame 14. A T-shaped lifting block 16, adapted to the T-shaped lifting slide, is slidably installed in the T-shaped lifting slide. A lifting plate 17 is welded to the bottom end of the lifting block 16. An adjustable tool assembly is installed on the left side of the lifting plate 17 and the right side of the mounting platform 8. A protruding plate is welded to the top of the right side wall of the fixing frame 14. Threaded through holes are provided at both the upper and lower ends of the protruding plate. An adjusting screw 15 for fixing the position of the lifting block 16 is provided in the threaded through holes. A threaded groove with the same diameter as the adjusting screw 15 is provided at the top of the lifting block 16. By controlling the lifting block 16 to move up and down in the T-shaped lifting slide, the lifting plate... 17. After adjusting the height of the cutting tool assembly, control the adjusting screw 15 to rotate downward and connect to the lifting block 16. This can fix the height of the lifting block 16, the lifting plate 17, and the cutting tool assembly. Before cutting the substrate with the cutting tool assembly on the mounting table 8, the cutting tool assembly directly below the extension plate 10 is used to pre-cut the substrate. That is, by segmented cutting, the burrs that appear on the substrate during the cutting process are reduced, and excessive cutting into the substrate at one time is avoided. This reduces the surface burrs caused by the impact of the cutting edge of the cutting disc 20, and allows for more precise control of the cutting boundary, making the edge of the board smoother.

[0033] The tool assembly includes a fixed platform 18 welded onto a lifting plate 17 or a mounting platform 8. The fixed platform 18 has a groove, with through holes on both the front and rear inner walls. A rotating rod with the same diameter as the through holes is placed in the groove, with both ends extending into the through holes. A rotating platform 19 is welded onto the outer wall of the rotating rod, with the width of the rotating platform 19 matching the width of the groove to prevent lateral movement during use. A turntable is connected to the side of the rotating platform 19 away from the rotating rod via a rotating connecting ring, allowing rotation of the turntable. The turntable on the rotating table 19 can rotate on its own. A cutting disc 20 for cutting substrates is installed on the turntable. Both the cutting disc 20 and the rotating table 19 are provided with several threaded through holes of the same diameter. The cutting disc 20 and the turntable are installed as a whole by using an existing screw with the same diameter as the threaded through holes on the cutting disc 20. By controlling the rotation of the rotating rod, the rotating table 19 can be rotated, and the angle of the cutting disc 20 can be adjusted. When cutting substrates that need to be V-shaped, the cutting disc 20 can be tilted. At this time, the substrate is cut by the two tilted cutting discs 20 to achieve V-shaped cutting of the substrate.

[0034] Two fixing plates 21 are installed in the groove on the fixing platform 18 by welding. The rotating rod and the rotating platform 19 are located between the two fixing plates 21. Each fixing plate 21 is provided with a limiting screw 22 that can lock the angle of the rotating platform 19. First, the limiting screw 22 at the bottom of the rotating platform 19 is controlled to pass through the fixing plate 21 and stick to the rotating platform 19 to make it rotate upward. The rotating platform 19 and the cutter head 20 are adjusted to the required angle. Then, the limiting screw 22 directly above it is controlled to rotate downward and stick to the top plate of the rotating platform 19 to fix the position of the rotating platform 19.

[0035] The right side of the mounting platform 8 is equipped with a reinforcement assembly for balancing the cutter head 20 and polishing it. This assembly includes a positioning plate 23 welded to the right side wall of the mounting platform 8. The positioning plate 23 has a positioning groove at its top, into which an I-beam 24 is placed. The bottom of the I-beam 24 has four insertion slots, each containing an insertion block with dimensions matching its length and width. A balancing plate 26 is welded to the bottom of each of the four insertion blocks to ensure the smooth rotation of the cutter head 20. A triangular block 27 is installed at the bottom of each balancing plate 26 to detect whether the two cutter heads 20 are at the same tilt angle. This is achieved by using two points that are aligned with the operating platform 1. When the vertical cutting disc 20 cuts the substrate, the balance plate 26 can be in close contact with the cutting disc 20 to prevent the cutting disc 20 from shifting during the cutting process. When the cutting disc 20 is adjusted to an inclined angle to make a V-shaped cut on the substrate, the insert block can be pulled out from the insert slot at the bottom of the I-beam plate 24 by controlling the insert block, and the four triangular blocks 27 can be assembled together to form two isosceles triangles. The triangular blocks 27 forming the isosceles triangles are placed between the two cutting discs 20, and it is observed whether the other cutting disc 20 is also in close contact with the triangular blocks 27 when one cutting disc 20 is in close contact with the triangular blocks 27, in order to determine whether the two cutting discs 20 are at the same inclined angle.

[0036] A stop 25 that restricts the position of the I-beam 24 is movably placed at the top of the positioning plate 23. A positioning block for fixing its position is installed at the bottom of the stop 25 by welding. A positioning groove with the same shape as the positioning block is provided in the positioning groove on the positioning plate 23. By inserting the positioning block into the positioning groove, the stop 25 can be fixed to the positioning plate 23. A handle is provided on the right side wall of the stop 25 for controlling the upward movement of the stop 25. After the stop 25 is fixed at the top of the positioning plate 23, the positioning groove on the positioning plate 23 is adjusted to a T-shape. At this time, the T-shape is adapted to the shape of the part of the I-beam 24 on the positioning plate 23. That is, the I-beam 24 can be fixed on the positioning plate 23 by the cooperation of the stop 25 and the positioning plate 23, so as to avoid the I-beam 24 being unable to move up and down due to the extension plate 10 being at the top of the I-beam 24, which would make it impossible to remove the I-beam 24 from the positioning plate 23 later.

[0037] A polishing stone plate is attached to the base plate of the I-beam 24 by adhesive. The polishing stone plate is located at the top of the cutter head 20 and is on the rotation path of the cutter head 20. The side of the polishing stone plate that contacts the cutter head 20 is inclined so that it can stick tightly to the polishing stone plate after the cutter head 20 rotates and be polished during the rotation of the cutter head 20, so that the edge of the cutter head 20 is always in a relatively sharp state, reducing the occurrence of burrs during the cutting of the substrate.

[0038] Several holes are provided on the front and rear side walls of the four balance plates 26, and a connecting rod 28 is movably placed in the holes on two of the balance plates 26. After the triangular blocks 27 at the bottom of the four balance plates 26 are assembled into two isosceles triangles, by partially extending the connecting rod 28 out of the hole on one balance plate 26 and inserting it into the hole on the other balance plate 26, the two isosceles triangles can be aligned in a straight line after assembly.

[0039] Each of the four triangular blocks 27 has a protrusion at its top, and each protrusion has a mating hole. Two of the protrusions at the top of the triangular blocks 27 have protruding posts welded into their mating holes, which are adapted to the diameter of the mating holes. This is used to insert the protruding post on one protrusion into the mating hole on the other protrusion after the two triangular blocks 27 are assembled into an isosceles triangle, thereby increasing the connection between the two triangular blocks 27.

[0040] A method of using a manufacturing apparatus for integrated circuits, the method comprising the following steps: Step 1: When it is necessary to cut the substrate vertically, control the adjusting screw 15 to rotate upward and adjust the height of the cutter head 20 located directly below the extension plate 10 so that it can only cut the substrate locally. At this time, place the substrate on the top of the placement base 2 and control the substrate displacement. During the substrate displacement, the substrate can be cut in segments by the two cutter heads 20. Step 2: When the substrate needs to be V-shaped cut, control the rotating screw 12 to rotate, causing the translation block 13 to move and adjust the position of the cutter head 20 located directly below the extension plate 10. At this time, control the limiting screw 22 to pass through the fixing plate 21 and rotate, causing the rotating table 19 and the cutter head 20 to rotate and adjust the tilt angle of the cutter head 20. Then, assemble the four triangular blocks 27 together to form two isosceles triangles, and connect the top balance plates 26 of the two isosceles triangles formed by the connecting rod 28. Then, place the triangular blocks 27 forming the isosceles triangles between the two cutter heads 20 and observe whether the other cutter head 20 is also close to the triangular block 27 when one cutter head 20 is close to the triangular block 27 to determine whether the two cutter heads 20 are at the same tilt angle. When the triangular block 27 detects that the two cutter heads 20 have been adjusted to the same tilt angle, the substrate can be V-shaped cut. Step 3: By increasing the tilt angle of the rotating table 19 and the cutter head 20, the cutter head 20 can be made to fit tightly against the polishing stone after rotation, and the stone is polished while being manually pushed to rotate, so that the edge of the cutter head 20 is always in a relatively sharp state.

[0041] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A manufacturing apparatus for integrated circuits, comprising an operating platform and a storage base, characterized in that: The manufacturing equipment also includes a cutting component capable of reducing burrs generated during cutting; The cutting assembly includes a height-adjustable mounting frame, a lifting and lowering mounting platform is mounted at the bottom of the mounting frame, an extension plate is mounted on the mounting platform, and a position adjustment assembly is provided at the top of the extension plate. The position adjustment component includes a fixed frame capable of translational movement, a lifting plate capable of vertical movement is provided on the fixed frame, and a tool assembly capable of angle adjustment is installed on both the lifting plate and the mounting frame. The right side of the mounting platform is equipped with a reinforcement assembly for balancing the tool assembly and polishing the tool assembly.

2. The manufacturing equipment for integrated circuits according to claim 1, characterized in that: The cutting tool assembly includes a fixed platform, on which a rotating platform capable of rotatable adjustment of angle is provided. A cutting disc for cutting substrate is provided on the rotating platform. Two fixing plates are provided on the fixed platform, and each of the two fixing plates is provided with a limiting screw for fixing the angle of the rotating platform.

3. The manufacturing equipment for integrated circuits according to claim 1, characterized in that: The reinforcement assembly includes a positioning plate fixed on the mounting platform. The positioning plate is provided with an I-beam plate that can grind the cutter head. The positioning plate is also provided with a stop block that can fix the position of the I-beam plate. Four balance plates are installed at the bottom of the I-beam plate to ensure the smooth rotation of the cutter head. Each balance plate is provided with a triangular block at the bottom of its base that can detect whether the two cutter heads are at the same tilt angle.

4. The manufacturing equipment for integrated circuits according to claim 3, characterized in that: The bottom end of the I-beam is equipped with a polishing stone plate for polishing the cutter head, and the polishing stone plate is located on the rotation path of the cutter head.

5. The manufacturing equipment for integrated circuits according to claim 1, characterized in that: The position adjustment assembly includes a fixed frame installed on the top of the extension plate, the extension plate is provided on the fixed frame, the extension plate is provided on the extension plate, the rotating screw is fitted with a translation block capable of translational movement, and the translation block is fixedly connected to the fixed frame to form an integral whole.

6. The manufacturing equipment for integrated circuits according to claim 1, characterized in that: The fixed frame is provided with a protruding plate, the protruding plate is provided with an adjusting screw, and the lifting plate is equipped with a lifting block that can be connected to the adjusting screw.

7. The manufacturing equipment for integrated circuits according to claim 1, characterized in that: The mounting bracket is provided with a fixing block, and the fixing block is provided with a rotatable threaded post. The bottom end of the threaded post is fixedly connected to the mounting platform, and a nut is fitted on the outer wall of the threaded post.

8. The manufacturing equipment for integrated circuits according to claim 1, characterized in that: The top of the mounting platform is equipped with two lifting rods to prevent it from rotating.

9. The manufacturing equipment for integrated circuits according to claim 2, characterized in that: A turntable is rotatably mounted on the rotating platform, and the turntable is connected to the cutter head by a screw.

10. A method of using a manufacturing apparatus for integrated circuits, comprising the manufacturing apparatus for integrated circuits as described in any one of claims 1-9, characterized in that, The method includes the following steps: Step 1: When it is necessary to cut the substrate vertically, control the adjusting screw to rotate upward and adjust the height of the cutter head located directly below the extension plate so that it can only cut the substrate locally. At this time, place the substrate on the top of the placement base and control the substrate displacement. During the substrate displacement, the substrate can be cut in segments by the two cutter heads. Step 2: When a V-shaped cut is required on the substrate, control the rotating screw to rotate, causing the translation block to shift and adjust the position of the cutter head directly below the extension plate. Then, control the limiting screw to pass through the fixing plate and rotate, causing the rotating table and cutter head to rotate and adjust the tilt angle of the cutter head. Then, assemble the four triangular blocks together to form two isosceles triangles, and connect the top balance plates of the two isosceles triangle blocks together through the connecting rod. Then, place the triangular blocks forming the isosceles triangles between the two cutter heads and observe whether the other cutter head is also close to the triangular block when one cutter head is close to the triangular block to determine whether the two cutter heads are at the same tilt angle. When the triangular block detects that the two cutter heads have been adjusted to the same tilt angle, the substrate can be V-shaped cut. Step 3: By increasing the tilt angle of the rotating table and the cutter head, the cutter head can be closely attached to the polishing stone after rotation, and the stone is polished while the cutter head is manually pushed to rotate, so that the edge of the cutter head is always in a relatively sharp state.

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