A method and system for online monitoring of temperature field of high-voltage equipment of a booster station

Abstract

The application relates to the technical field of electric correlation parameter measurement, and provides a booster station high-voltage equipment temperature field online monitoring method and system. The method comprises the following steps: investigating high-voltage power supply equipment in a booster station, and determining the installation positions of multiple sets of infrared dual-view thermal imaging devices; starting the multiple sets of infrared dual-view thermal imaging devices, synchronously collecting visible light images and infrared thermal images of the high-voltage power supply equipment in respective monitoring areas, fusing and displaying the infrared thermal images and the visible light images in the same field of view to obtain dual-view images; acquiring key point temperature values and temperature field distributions of the high-voltage power supply equipment in the respective monitoring areas in real time and online through the infrared dual-view thermal imaging devices, monitoring the collection areas corresponding to the temperature field distributions in real time, tracking and displaying the highest temperature value, the lowest temperature value and the average temperature value in the collection areas, and realizing online and real-time monitoring of the temperature field of the high-voltage equipment in the booster station.

Description

Technical Field

[0001] This application relates to the field of electrical parameter measurement technology, and in particular to a method and system for online monitoring of the temperature field of high-voltage equipment in a booster station. Background Technology

[0002] In the field of electrical parameter measurement, substations, as the core hubs for power transmission and transformation in power systems, directly determine the continuity and reliability of power supply through the safe and stable operation of their internal high-voltage power supply equipment, such as disconnect switches, busbars, bushings, circuit breakers, instrument transformers, capacitors, and reactors. Temperature rise changes in high-voltage power supply equipment are a core parameter characterizing its operating status. Key locations prone to heat generation, such as equipment connections, moving contacts, and stationary contacts, are susceptible to increased contact resistance due to factors such as climate change, manufacturing defects, environmental pollution, overload operation, and contact oxidation. This leads to temperature increases, causing equipment aging, insulation degradation, and in severe cases, triggering major accidents such as arcing, short circuits, equipment burnout, or even fires and explosions, resulting in huge economic losses and widespread power outages.

[0003] Currently, temperature monitoring of high-voltage power supply equipment in substations mainly relies on traditional manual inspection methods. This involves periodic inspections or preventative tests using handheld infrared thermometers to determine the equipment's operating status. This approach has several inherent drawbacks: long inspection intervals, insensitivity to progressive insulation faults, and the potential for localized defects to expand rapidly and cause accidents; the need for close-range manual operation, resulting in low safety and high workload and labor costs; and the monitoring quality heavily dependent on the operator's professional skills and sense of responsibility. Furthermore, it cannot achieve continuous 24 / 7 temperature data collection, lacks historical data storage and comparison, and makes it difficult to predict equipment operating trends.

[0004] Therefore, a method is urgently needed to solve at least one of the above problems. Summary of the Invention

[0005] This application provides a method and system for online monitoring of the temperature field of high-voltage equipment in a substation. The aim is to address the current problem that temperature monitoring of high-voltage power supply equipment in substations mainly relies on traditional manual inspection methods. These methods use handheld infrared thermometers for periodic inspections or preventative tests to determine the equipment's operating status. This approach has several inherent drawbacks: long inspection intervals, insensitivity to progressive insulation faults, and the potential for localized defects to expand rapidly and cause accidents; the need for close-range manual operation, resulting in low safety and high labor costs; and the monitoring quality heavily dependent on the operator's professional skills and sense of responsibility. Furthermore, it cannot achieve continuous 24 / 7 temperature data acquisition, lacks historical data storage and comparison, and makes it difficult to predict equipment operating trends.

[0006] In a first aspect, embodiments of this application provide an online monitoring method for the temperature field of high-voltage equipment in a booster station, the method comprising:

[0007] A survey was conducted on the high-voltage power supply equipment within the substation to determine the installation locations of multiple sets of infrared dual-view thermal imaging devices. These devices were then fixedly installed on suitable fireproof walls or pillars within the substation, ensuring that each monitoring angle of the infrared dual-view thermal imaging device could cover all target high-voltage equipment within its assigned area. The high-voltage power supply equipment included at least one of the following: disconnecting switches, busbars, bushings, circuit breakers, instrument transformers, capacitors, and reactors.

[0008] Multiple infrared dual-view thermal imaging devices are activated to simultaneously acquire visible light images and infrared thermal images of high-voltage power supply equipment within their respective monitoring areas. The visible light images and infrared thermal images of the same monitoring area and at the same time acquired by each infrared dual-view thermal imaging device are received synchronously. The dual-view fusion processing method is used to fuse the infrared thermal image and the visible light image in the same field of view to obtain a dual-view image, so that the temperature abnormal area in the infrared thermal image corresponds precisely to the actual location of the equipment in the visible light image.

[0009] The infrared dual-view thermal imaging device acquires the key point temperature values ​​and temperature field distribution of high-voltage power supply equipment within its respective monitoring area in real time. The key point temperature values ​​are collected from the connection parts, moving contacts, and stationary contacts of the high-voltage power supply equipment, which are prone to heat generation. The overall temperature field distribution covers the entire visible area of ​​the equipment. The temperature field distribution is obtained through point temperature measurement, line temperature measurement, and area temperature measurement. The collection area corresponding to the temperature field distribution is monitored in real time, and the highest, lowest, and average temperature values ​​within the collection area are tracked and displayed. Based on the fused dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method, online real-time monitoring of the temperature field of the high-voltage equipment in the substation is achieved.

[0010] In some embodiments, the surveying of high-voltage power supply equipment within the substation to determine the installation locations of multiple infrared dual-view thermal imaging devices includes: adopting a zonal survey mode, dividing the substation into several monitoring zones according to the distribution density and equipment type of the high-voltage power supply equipment, with at least one infrared dual-view thermal imaging device deployed in each monitoring zone; locating each high-voltage power supply device in each monitoring zone, recording the installation height, distribution location, and surrounding obstacles of each device; determining the specific installation coordinates of each infrared dual-view thermal imaging device through simulation monitoring, based on the monitoring range and viewing angle of the infrared dual-view thermal imaging device, ensuring that the monitoring ranges of infrared dual-view thermal imaging devices in adjacent monitoring zones overlap appropriately to avoid monitoring blind spots; and simultaneously considering the distribution of strong electromagnetic fields within the substation, avoiding areas with concentrated strong electromagnetic interference to ensure the stability of the data collected by the infrared dual-view thermal imaging devices.

[0011] In some embodiments, the step of fixing multiple sets of infrared dual-view thermal imaging devices on suitable fireproof partitions or columns within the substation to ensure that the monitoring angle of the infrared dual-view thermal imaging devices can cover all target high-voltage equipment within the area under their responsibility includes: installing suitable fixed brackets on the corresponding fireproof partitions or columns according to the determined installation coordinates of each set of infrared dual-view thermal imaging devices; adjusting the tilt angle and height of the brackets so that the lens of the device faces the core high-voltage power supply equipment within the monitoring zone; after installation, starting the infrared dual-view thermal imaging devices for trial acquisition; checking whether each target high-voltage equipment within the monitoring zone can be clearly seen within the monitoring angle according to the monitoring images of the infrared dual-view thermal imaging devices; fine-tuning the bracket angle or device position for areas not covered by the view; testing the acquisition effect of the infrared dual-view thermal imaging devices under different ambient light conditions to ensure that the infrared dual-view thermal imaging devices can clearly capture equipment images and temperature data in both strong and weak light environments; fixing the device position and ensuring proper installation and reinforcement.

[0012] In some embodiments, the dual-view fusion processing method, which fuses infrared thermal images and visible light images within the same field of view to obtain a dual-view image, ensures that the temperature anomaly area in the infrared thermal image accurately corresponds to the actual location of the device in the visible light image. This includes: preprocessing the visible light image and infrared thermal image received synchronously in the same monitoring area at the same time, enhancing blurred areas to ensure image clarity; extracting the device contour features in the visible light image and the temperature distribution features in the infrared thermal image, establishing the coordinate correspondence between the two types of images, and achieving alignment within the same field of view; using a pixel-level fusion algorithm to fuse the temperature grayscale information of the infrared thermal image with the device detail information of the visible light image to generate a dual-view fused image; highlighting the temperature anomaly area in the fused image while retaining the specific location and appearance details of the device in the visible light image, allowing direct location of the specific device part corresponding to the temperature anomaly area through the fused image, thus achieving rapid and accurate fault location.

[0013] In some embodiments, the real-time online acquisition of key point temperature values ​​and temperature field distribution of high-voltage power supply equipment within each monitoring area using an infrared dual-view thermal imaging device includes: marking the easily heated key points of the high-voltage power supply equipment within each monitoring area, including equipment connection parts, moving contacts, and stationary contacts; assigning a unique identifier and acquisition priority to each key point; activating the fixed-point acquisition mode of the infrared dual-view thermal imaging device, whereby the device automatically focuses on each key point according to the preset key point identifier, and acquires and transmits the temperature value of each key point in real time; activating the full-domain acquisition mode to perform a comprehensive scan of the high-voltage power supply equipment within the monitoring area, acquiring the overall temperature data of the equipment, and generating a temperature field distribution image covering the entire visible area of ​​the equipment; and associating and storing the acquired key point temperature values ​​with the temperature field distribution image to ensure that the temperature data of each key point can be mapped to a specific location in the temperature field distribution image.

[0014] In some embodiments, the temperature field distribution is obtained through any one of point temperature measurement, line temperature measurement, and area temperature measurement, including: when using point temperature measurement, a target temperature measurement point is selected in the temperature field distribution image, the infrared dual-view thermal imaging device automatically focuses on the temperature measurement point, collects the temperature data of the point in real time, and provides real-time feedback; when using line temperature measurement, a target temperature measurement line segment is drawn in the temperature field distribution image, the line segment can cover any continuous part of the device, the device continuously collects temperature along the line segment, obtains the temperature data of each point on the line segment, and generates a line segment temperature distribution curve; when using area temperature measurement, a target temperature measurement area is selected in the temperature field distribution image, the target temperature measurement area covers a designated part of a single device or multiple devices, the infrared dual-view thermal imaging device collects temperature data at all points in the area, statistically analyzes the temperature data in the area, and generates an area temperature distribution heat map; the temperature measurement method can be flexibly switched according to monitoring needs.

[0015] In some embodiments, the real-time monitoring of the acquisition area corresponding to the temperature field distribution, tracking and displaying the highest, lowest, and average temperature values ​​within the acquisition area, includes: receiving temperature field distribution data transmitted by the infrared dual-view thermal imaging device in real time; filtering and statistically analyzing all temperature data within the acquisition area in real time; automatically identifying the highest temperature value and its corresponding location, the lowest temperature value and its corresponding location within the acquisition area, and simultaneously calculating the average temperature of all temperature measurement points within the acquisition area; associating the highest, lowest, and average temperature values ​​with the acquisition area identifier and acquisition time, and displaying them synchronously on the background display interface and the dual-view fused image, updating the temperature data in real time; and re-statistically updating the displayed values ​​when the temperature data within the acquisition area changes, ensuring that operators can monitor the temperature changes in the acquisition area in real time.

[0016] In some embodiments, the online real-time monitoring of the temperature field of the high-voltage equipment in the substation based on the fused dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method includes: building a centralized monitoring platform to integrate and display the fused dual-view image, key point temperature values, temperature field distribution data, and various temperature measurement statistics, and dividing the display interface according to monitoring zones; comparing the real-time collected temperature data with the preset normal operating temperature threshold of the equipment, and automatically triggering a prompt signal when the key point temperature value and the highest temperature value exceed the threshold range; and storing the dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method to form a historical database, thereby realizing comprehensive and real-time online monitoring of the temperature field of the high-voltage equipment in the substation.

[0017] In some embodiments, the method further includes: embedding a machine learning-based intelligent diagnostic algorithm; pre-collecting temperature data and dual-view image data of the high-voltage power supply equipment in the booster station under different operating conditions and different fault types; constructing an equipment fault sample database; the sample data includes normal operation samples, slightly overheated samples, severely overheated samples, and temperature and image features corresponding to different types of faults; inputting real-time collected fused dual-view images, key point temperature values, temperature field distribution data, and temperature measurement statistics into the intelligent diagnostic algorithm; by comparing the real-time data with the sample features in the fault sample database, extracting temperature change patterns and image anomaly features from the real-time data, identifying the current operating status of the equipment, and determining whether there is a potential overheating hazard and its severity; simultaneously, combining the equipment's historical operating temperature data, using the algorithm to predict the equipment temperature change trend, generating an equipment operating status diagnostic report and maintenance suggestions; and pushing the diagnostic results and maintenance suggestions to the operator's terminal, thereby achieving early warning and intelligent diagnosis of equipment faults and improving the initiative and effectiveness of monitoring.

[0018] Secondly, this application provides an online monitoring system for the temperature field of high-voltage equipment in a booster station, the system comprising:

[0019] The equipment survey unit is used to survey the high-voltage power supply equipment within the substation, determine the installation locations of multiple sets of infrared dual-view thermal imaging devices, and fix the multiple sets of infrared dual-view thermal imaging devices on suitable fireproof partitions or columns within the substation to ensure that the infrared dual-view thermal imaging devices can cover all target high-voltage equipment within their respective monitoring angles. The high-voltage power supply equipment includes at least one of the following: disconnecting switches, busbars, bushings, circuit breakers, instrument transformers, capacitors, and reactors.

[0020] The device start-up unit is used to start multiple infrared dual-view thermal imaging devices to simultaneously acquire visible light images and infrared thermal images of high-voltage power supply equipment in their respective monitoring areas. It synchronously receives the visible light images and infrared thermal images of the same monitoring area and at the same time acquired by each infrared dual-view thermal imaging device, and uses a dual-view fusion processing method to fuse the infrared thermal image and the visible light image in the same field of view to obtain a dual-view image, so that the temperature abnormal area in the infrared thermal image corresponds precisely to the actual location of the equipment in the visible light image.

[0021] The monitoring completion unit is used to acquire, in real time, the key point temperature values ​​and temperature field distribution of high-voltage power supply equipment within its respective monitoring area via an infrared dual-view thermal imaging device. The key point temperature values ​​are collected from the connection points, moving contacts, and stationary contacts of the high-voltage power supply equipment, focusing on areas prone to overheating. The overall temperature field distribution covers the entire visible area of ​​the equipment. The temperature field distribution is obtained through point temperature measurement, line temperature measurement, or area temperature measurement. The unit monitors the corresponding acquisition area in real time, tracking and displaying the highest, lowest, and average temperature values ​​within the acquisition area. Based on the fused dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method, the unit achieves online real-time monitoring of the temperature field of the high-voltage equipment in the substation.

[0022] This application, by surveying the high-voltage equipment of the substation and deploying multiple sets of infrared dual-view thermal imaging devices, rationally plans the installation locations and ensures that the monitoring ranges of adjacent devices overlap appropriately. This effectively avoids the blind spots of traditional manual inspections and single-device monitoring, and can comprehensively cover various major high-voltage power supply equipment such as disconnect switches, busbars, and bushings, achieving uninterrupted monitoring around the clock and reducing equipment failures caused by monitoring omissions from the source.

[0023] By employing a dual-view fusion processing method, infrared thermal images and visible light images are precisely fused within the same field of view. This preserves both the temperature anomaly information from the infrared thermal image and the equipment appearance details from the visible light image, ensuring that the temperature anomaly area corresponds precisely to the actual location of the equipment. This solves the defect in existing technologies where temperature anomalies could not be accurately matched with equipment parts. Operators can quickly locate the fault point, significantly improving fault handling efficiency and reducing the risk of fault escalation.

[0024] It simultaneously collects temperature values ​​of key points prone to overheating and the overall temperature field distribution of the equipment. Combining three diverse temperature measurement methods—point, line, and area—it can accurately capture temperature changes at key locations such as connection points and moving contacts, and comprehensively grasp the overall temperature distribution of the equipment. At the same time, it tracks and displays the highest, lowest, and average temperatures of the collected area in real time, providing comprehensive and accurate data support for equipment status assessment and avoiding missed fault diagnosis due to incomplete monitoring.

[0025] It replaces the traditional manual close-range inspection mode, reduces the workload and labor costs of operation and maintenance personnel, and avoids safety hazards such as electric shock during manual inspection. At the same time, it realizes real-time collection, storage and analysis of temperature data without manual recording, reduces human error, improves monitoring quality and efficiency, provides data support for equipment condition maintenance and life extension, and further reduces equipment maintenance and downtime losses.

[0026] This method organically integrates multi-device collaborative full-coverage deployment, dual-view synchronous fusion, synchronous monitoring of key points and the overall temperature field, and diversified temperature measurement modes. It solves many defects of the single monitoring method in the existing technology. There is no relevant technical inspiration in the existing technology to guide those skilled in the art to combine the above technical features. It effectively fills the technical gap in the field of online temperature monitoring of high-voltage equipment in existing booster stations and has outstanding substantive features and significant progress.

[0027] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic flowchart illustrating the steps of an online monitoring method for the temperature field of high-voltage equipment in a booster station, provided in an embodiment of this application.

[0030] Figure 2 This is a schematic diagram of the structure of an infrared dual-view thermal imaging device provided in an embodiment of this application;

[0031] Figure 3 This is a schematic block diagram of the structure of an online temperature field monitoring system for high-voltage equipment in a booster station, provided in one embodiment of this application.

[0032] Figure 4 This is a schematic block diagram of the structure of a computer device provided in an embodiment of this application.

[0033] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0035] The flowchart shown in the attached diagram is for illustrative purposes only and does not necessarily include all content and operations / steps, nor does it necessarily have to be performed in the order described. For example, some operations / steps can be broken down, combined, or partially merged, so the actual execution order may change depending on the actual situation.

[0036] It should be understood that, in order to clearly describe the technical solutions of the embodiments of the present invention, the terms "first" and "second" are used in the embodiments of the present invention to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" are not necessarily different.

[0037] It should be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0038] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0039] As the core hub for power transmission and transformation in the power system, the safe and stable operation of high-voltage power supply equipment such as disconnecting switches, busbars, bushings, circuit breakers, instrument transformers, capacitors, and reactors in substations directly determines the continuity and reliability of power supply. Temperature rise of high-voltage power supply equipment is a key parameter characterizing its operating status. Critical locations prone to heat generation, such as equipment connections, moving contacts, and stationary contacts, are susceptible to increased contact resistance due to factors such as climate change, manufacturing defects, environmental pollution, overload operation, and contact oxidation. This leads to temperature increases, causing equipment aging, insulation degradation, and in severe cases, triggering major accidents such as arcing, short circuits, equipment burnout, or even fires and explosions, resulting in huge economic losses and widespread power outages.

[0040] Currently, temperature monitoring of high-voltage power supply equipment in substations mainly relies on traditional manual inspection methods. This involves periodic inspections or preventative tests using handheld infrared thermometers to determine the equipment's operating status. This approach has several inherent drawbacks: long inspection intervals, insensitivity to progressive insulation faults, and the potential for localized defects to expand rapidly and cause accidents; the need for close-range manual operation, resulting in low safety and high workload and labor costs; and the monitoring quality heavily dependent on the operator's professional skills and sense of responsibility. Furthermore, it cannot achieve continuous 24 / 7 temperature data collection, lacks historical data storage and comparison, and makes it difficult to predict equipment operating trends.

[0041] With the intelligent and digital development of the power industry, some substations have begun to try using single infrared thermal imaging devices or visible light monitoring devices for temperature-assisted monitoring. However, existing technologies still have significant limitations: while a single infrared thermal imaging device can collect temperature data, it lacks detailed information about the equipment's appearance, making it difficult to accurately locate the specific equipment part corresponding to the temperature anomaly; a single visible light monitoring device can only acquire images of the equipment's appearance and cannot capture temperature change information, thus failing to provide early warning of faults; some attempts to combine infrared and visible light monitoring schemes can only achieve simple overlay display of the two images, failing to achieve precise fusion within the same field of view, making it impossible to accurately correspond temperature anomaly areas with the actual location of the equipment, resulting in low fault location efficiency. Furthermore, a standardized multi-device collaborative deployment scheme has not been formed, making it impossible to achieve full coverage monitoring of all major high-voltage equipment in the substation without blind spots; at the same time, existing monitoring methods have not achieved synchronous acquisition of key point temperatures and overall temperature field distribution, nor have they formed diversified temperature measurement modes combining points, lines, and surfaces, making it impossible to comprehensively and accurately grasp the temperature status of the equipment.

[0042] To solve the above problem, please refer to Figure 1 This application provides an online monitoring method for the temperature field of high-voltage equipment in a booster station, applied to computer equipment. The computer equipment can be deployed on a single server or a server cluster. It can also be deployed on handheld terminals, laptops, wearable devices, or robots, etc. It should be noted that all information involved in the method provided in this application is extracted with the authorization of the relevant user and in accordance with relevant regulations, and will not infringe on user privacy.

[0043] The provided method for online monitoring of the temperature field of high-voltage equipment in a booster station includes steps S101 to S103. Details are as follows:

[0044] Step S101. Conduct a survey of the high-voltage power supply equipment in the substation, determine the installation locations of multiple sets of infrared dual-view thermal imaging devices, and fix the multiple sets of infrared dual-view thermal imaging devices on suitable fireproof partitions or columns in the substation to ensure that the infrared dual-view thermal imaging devices can cover all target high-voltage equipment in the area under their responsibility by their respective monitoring angles; the high-voltage power supply equipment includes at least one of the following: disconnecting switches, busbars, bushings, circuit breakers, instrument transformers, capacitors, and reactors.

[0045] Specifically, the core technical objective of this step is to achieve the rational deployment of multiple infrared dual-view thermal imaging devices through scientific surveying and planning. This ensures that the monitoring perspective of the devices can comprehensively cover all target high-voltage power supply equipment within the substation, laying the foundation for the comprehensive and accurate acquisition of subsequent temperature and image data. Simultaneously, it clarifies the scope of high-voltage power supply equipment monitored by this method, ensuring no omissions or redundancies in monitoring. The high-voltage power supply equipment includes at least one of the following: disconnecting switches, busbars, bushings, circuit breakers, instrument transformers, capacitors, and reactors. The monitoring range can be flexibly adjusted according to the actual equipment configuration of the substation.

[0046] Preliminary surveys involved professional technicians or survey robots conducting a comprehensive survey of all high-voltage power supply equipment to be monitored within the substation. A zoned survey approach was adopted. For the 500kV substation, the substation was divided into four monitoring zones based on the distribution density and equipment type of the high-voltage power supply equipment: incoming line bay area, busbar area, circuit breaker bay area, and reactive power compensation area. A total of six sets of infrared dual-view thermal imaging devices were deployed: two sets in the incoming line bay area, two sets in the busbar area, one set in the circuit breaker bay area, and one set in the reactive power compensation area. Each device was responsible for monitoring the equipment within its corresponding zone. Cross-coverage was achieved at the zone boundaries according to quantitative standards to avoid insufficient data acquisition accuracy caused by an excessively large monitoring range of a single device.

[0047] The infrared dual-view thermal imaging device has a built-in infrared thermal imager with core field-of-view parameters of 14.9° horizontally and 11.2° vertically. It locates each high-voltage power supply device in each monitoring zone, recording in detail the installation height, specific distribution location, equipment model, and surrounding obstacles (such as guardrails and other auxiliary equipment) of each device. Simultaneously, combining the monitoring range of the infrared dual-view thermal imaging device and the aforementioned field-of-view parameters, the specific installation coordinates of each device are determined through simulation monitoring. The quantitative standards for installation parameters are as follows: the device installation reference plane is 8-12m above the ground, at the same height as the core monitoring parts such as equipment busbars and bushings, with a maximum installation height not exceeding 15m; the straight-line distance between the device and the monitored target equipment is 10-50m, and the monitoring distance of core monitoring equipment (disconnect switches, circuit breakers, and transformers) is controlled within 15-30m; the horizontal monitoring range overlap rate of two adjacent devices is ≥10%, the vertical monitoring range overlap rate is ≥15%, and the overlap rate in densely populated equipment areas and areas with obstructed structures is increased to ≥20%, completely eliminating monitoring blind spots.

[0048] The installation location is optimized to take into account the distribution characteristics of strong electromagnetic fields within the substation. The installation location of the infrared dual-view thermal imaging device is avoided in areas with concentrated strong electromagnetic interference (such as directly below the high-voltage busbar or in areas with dense transformers) to prevent strong electromagnetic interference from affecting the stability and accuracy of the data collected by the device. Suitable fireproof partitions or columns within the substation are preferred as installation carriers. Such carriers are structurally stable, not easily affected by equipment operation vibrations, and facilitate adjustment of the device's viewing angle.

[0049] Based on the determined installation coordinates of each device, install suitable fixed brackets on the corresponding fireproof partitions or columns, and adjust the tilt angle and height of the brackets to ensure that the device's lens is precisely facing the core high-voltage power supply equipment within the monitoring zone. After installation, start the device for trial data acquisition, and view the monitoring screen through the back-end computer equipment to verify that each target high-voltage device in the monitoring zone can be clearly seen in the monitoring view. For areas not covered by the view, fine-tune the bracket angle or device position. At the same time, test the device's acquisition effect under different ambient lighting conditions such as strong light and weak light to ensure that the device can clearly capture equipment images and temperature data under various operating conditions. Finally, fix the device position and perform installation reinforcement to prevent the device from shifting due to wind, vibration, or other factors.

[0050] In some embodiments, infrared dual-view thermal imaging devices such as Figure 2 As shown, it includes an anti-electromagnetic interference housing 1, a pan-tilt adjustment mechanism 2, a mounting bracket 3, an infrared dual-view thermal imaging module 4, and a data transmission module (located inside the device and therefore not shown). Figure 2(As shown); the anti-electromagnetic interference housing is fixedly mounted on the mounting bracket; the gimbal adjustment mechanism is embedded inside the anti-electromagnetic interference housing; the infrared dual-view thermal imaging module is drively connected to the gimbal adjustment mechanism and partially extends out of the anti-electromagnetic interference housing; the data transmission module (located inside) Figure 1 (Not shown) It is fixed inside the anti-electromagnetic interference shell and electrically connected to the infrared dual-view thermal imaging module; the infrared dual-view thermal imaging module synchronously collects infrared thermal image data and visible light image data of the power supply equipment; the pan-tilt adjustment mechanism drives the infrared dual-view thermal imaging module to perform multi-angle and multi-directional adjustment; the data transmission module transmits the collected data to the background monitoring center; the anti-electromagnetic interference shell isolates the high-voltage electromagnetic environment from the interference of each module.

[0051] The gimbal adjustment mechanism includes a horizontal rotation motor, a pitch adjustment motor, and an optical zoom drive unit. The horizontal rotation motor is used to drive the infrared dual-view thermal imaging module to perform 360° horizontal rotation without blind spots, and the pitch adjustment motor is used to drive the infrared dual-view thermal imaging module to perform pitch adjustment from -90° to 90°.

[0052] Specifically, the infrared dual-view thermal imaging device provided in this application aims to solve the problems of low efficiency, untimely monitoring, weak anti-interference capability, and inability to adapt to harsh outdoor environments and high-voltage electromagnetic scenarios in existing high-voltage power supply equipment at substations. It achieves all-weather, all-round, and high-precision online monitoring of power supply equipment. The device integrates core functions such as intelligent sensing, pan-tilt adjustment, anti-electromagnetic interference, and data transmission. It can simultaneously collect the temperature status and appearance information of the power supply equipment and transmit it to the back-end monitoring center in real time, providing accurate data support for equipment fault early warning and diagnosis. It is suitable for high-voltage power supply scenarios such as 500KV substations, and is particularly suitable for long-term stable operation in harsh outdoor climates in Inner Mongolia.

[0053] The overall structure of the device consists of five core components: a mounting bracket, an anti-electromagnetic interference housing, an infrared dual-view thermal imaging module, a pan-tilt adjustment mechanism, and a data transmission module. These components work together to form a complete monitoring chain of "acquisition-adjustment-transmission-anti-interference": the mounting bracket secures the device to a suitable location at the substation, ensuring installation stability; the anti-electromagnetic interference housing isolates the internal modules from the high-voltage electromagnetic environment, while also providing corrosion protection, sealing, and high-temperature resistance; the infrared dual-view thermal imaging module, as the sensing core, simultaneously acquires infrared thermal image data (reflecting equipment temperature) and visible light image data (reflecting the equipment's appearance); the pan-tilt adjustment mechanism drives the sensing module to achieve multi-angle and multi-directional adjustment, eliminating monitoring blind spots; and the data transmission module stably transmits the acquired data to the back-end monitoring center, enabling real-time data sharing and subsequent analysis and processing.

[0054] To address the need for comprehensive monitoring of widely distributed equipment in substations, a pan-tilt-zoom (PTZ) adjustment mechanism was designed, comprising three core components: a horizontal rotation motor, a pitch adjustment motor, and an optical zoom drive unit. These components respectively enable the horizontal rotation, pitch adjustment, and optical zoom functions of the infrared dual-view thermal imaging module, eliminating monitoring blind spots and ensuring coverage of all parts of the target equipment. Specifically, the horizontal rotation motor drives the module to perform 360° horizontal rotation without blind spots; the pitch adjustment motor drives the module to perform pitch adjustment from -90° to 90° (covering both high-altitude and ground-based equipment); and the optical zoom drive unit controls the module to achieve 38x optical zoom (clearly capturing details and temperature changes of distant equipment or minute components).

[0055] The horizontal rotation motor is a 50W DC geared motor with a speed of 10r / min and a self-locking function, allowing it to be fixed at any angle to prevent angular deviation due to external forces during rotation. The pitch adjustment motor is a small 30W DC motor with a speed of 15r / min, also with a self-locking function. The optical zoom drive unit is a stepper motor, compatible with the lens of the infrared dual-view thermal imaging module, enabling precise control of lens zoom. These three components are assembled inside an anti-electromagnetic interference housing. The horizontal rotation motor is fixed to the bottom of the housing, the pitch adjustment motor is connected to the output shaft of the horizontal rotation motor, the infrared dual-view thermal imaging module is connected to the output shaft of the pitch adjustment motor, and the optical zoom drive unit is connected to the module lens drive to ensure smooth transmission.

[0056] By developing a gimbal adjustment control program and integrating it into the backend monitoring system, two control modes (automatic and manual) are supported. In automatic mode, the horizontal rotation motor and pitch adjustment motor operate automatically according to the preset monitoring path and time interval. The drive module achieves 360° horizontal scanning and -90° to 90° pitch scanning. The optical zoom drive unit automatically adjusts the zoom magnification according to the monitoring distance (38x zoom for distant devices and low zoom for nearby devices). In manual mode, maintenance personnel can individually control the horizontal rotation angle, pitch angle, and zoom magnification via backend commands to accurately locate the target area. The response speed of the control signals has been debugged to ensure that the motor operation delay is ≤500ms and the zoom adjustment delay is ≤1s after the command is issued.

[0057] At the substation site, the automatic mode of the gimbal adjustment mechanism was activated to verify that the 360° horizontal rotation had no blind spots and that the pitch adjustment could cover equipment such as high-altitude busbars, bushings, and ground circuit breakers without any monitoring blind spots. The manual mode was then activated to test the accuracy of the horizontal rotation and pitch adjustment, ensuring that it could be accurately aimed at any target equipment component.

[0058] Step S102. Activate multiple sets of infrared dual-view thermal imaging devices to simultaneously acquire visible light images and infrared thermal images of high-voltage power supply equipment within their respective monitoring areas. Simultaneously receive the visible light images and infrared thermal images of the same monitoring area and at the same time acquired by each set of infrared dual-view thermal imaging devices. Use dual-view fusion processing to fuse the infrared thermal images and visible light images in the same field of view to obtain dual-view images, so that the temperature abnormal areas in the infrared thermal images correspond precisely to the actual locations of the equipment in the visible light images.

[0059] Specifically, the core technology of this step is to activate all deployed infrared dual-view thermal imaging devices to achieve synchronous acquisition and reception of visible light images and infrared thermal images. Through dual-view fusion processing technology, the two images are accurately fused in the same field of view to generate dual-view images. This solves the problems of separation between infrared thermal images and visible light images and the inability to accurately correspond temperature abnormal areas to the actual location of the equipment in the existing technology, providing technical support for rapid fault location in the future.

[0060] The device startup and synchronization control are achieved by sending startup commands through the background computer equipment, which controls multiple infrared dual-view thermal imaging devices to start up simultaneously and enter a state of continuous operation around the clock. This ensures that the acquisition time of all devices is synchronized and avoids problems of image and data asynchrony caused by differences in device startup time.

[0061] Each infrared dual-view thermal imaging device synchronously acquires visible light images and infrared thermal images of high-voltage power supply equipment within its respective monitoring area at a preset frequency. The visible light images are used to capture the equipment's appearance details, actual location, and surface condition, while the infrared thermal images are used to capture the equipment's temperature distribution information and areas of temperature anomalies. During the acquisition process, it is ensured that the visible light images and infrared thermal images of the same monitoring area and at the same time are generated synchronously, guaranteeing the temporal and spatial consistency of the two types of images.

[0062] The background computer equipment synchronously receives visible light images and infrared thermal images transmitted by each infrared dual-view thermal imaging device through a preset communication link (using a combination of industrial-grade wired network and wireless communication to ensure transmission stability). During the reception process, the image data is verified in real time to remove blurry, damaged, or lost image data that occurs during transmission, ensuring that the received image data is complete and clear.

[0063] The infrared dual-view thermal imaging device adopts a parallel optical axis and same field of view design. The parallelism deviation between the optical axes of the infrared detector and the visible light camera is ≤0.05°, the optical axis spacing is ≤25mm, and the image acquisition synchronization delay is ≤100ms, providing a hardware foundation for dual-view fusion. The back-end computer equipment adopts a dual-view fusion processing method, achieving fusion through a three-step core process: dual-camera calibration distortion correction, pixel-level coordinate mapping, and multi-scale weighted fusion. Specifically:

[0064] Image preprocessing involves using Gaussian filtering to remove environmental and temperature noise from simultaneously received visible light and infrared thermal images of the same monitoring area at the same time, and histogram equalization to enhance blurred areas and improve image clarity. Simultaneously, the Brown-Conrady model is used to correct radial and tangential lens distortion, and the two types of images are normalized to ensure consistent image resolution.

[0065] Pixel-level coordinate mapping and image registration employ Zhang Zhengyou's calibration method to perform stereo calibration on both infrared and visible light cameras, obtaining a 3×3 homography matrix H. This establishes the pixel-level coordinate correspondence between the two types of images, achieving alignment within the same field of view. For any pixel coordinate (xir, yir) in the infrared image, it is mapped to the corresponding pixel coordinate (xvis, yvis) in the visible light image through the homography matrix H. This coordinate mapping ensures precise matching between the temperature region in the infrared thermal image and the device location in the visible light image, with a registration accuracy ≤ 1 pixel, avoiding image offset and misalignment issues.

[0066] A Laplacian pyramid multi-scale fusion algorithm is adopted to deeply fuse the temperature grayscale information of infrared thermal images with the device detail information of visible light images to generate a dual-view fused image. The fusion formula is as follows: For the infrared image pixel Iirl(i,j) and the visible light image pixel Ivisl(i,j) of the l-th layer of the pyramid, the fused pixel Ifusel(i,j) is: Ifusel(i,j)=wirl(i,j)*Iirl(i,j)+wvisl(i,j)*Ivisl(i,j), where the weight coefficients satisfy wirl(i,j)+wvisl(i,j)=1. The low-frequency layer adopts the weight allocation based on regional energy, and the high-frequency layer adopts the weight allocation based on gradient magnitude. Finally, the fused dual-view image is obtained through inverse pyramid transformation.

[0067] In the fused image, a pseudo-color coding method is used to mark different temperature ranges with different colors. Abnormal areas where the temperature exceeds the preset normal threshold are highlighted and marked with the real-time temperature value of the area. The specific location, appearance details and surrounding environment of the equipment in the visible light image are completely preserved, so that operators can directly associate the abnormal temperature area with the actual part of the equipment through the dual-view image displayed on the back-end computer equipment, and realize the rapid location of the fault point.

[0068] Step S103. The key point temperature values ​​and temperature field distribution of the high-voltage power supply equipment in their respective monitoring areas are acquired in real time online using an infrared dual-view thermal imaging device. The key point temperature values ​​are collected from the connection parts, moving contacts, and stationary contacts of the high-voltage power supply equipment, which are prone to overheating. The overall temperature field distribution covers the entire visible area of ​​the equipment. The temperature field distribution is obtained through any one of point temperature measurement, line temperature measurement, and area temperature measurement. The collection area corresponding to the temperature field distribution is monitored in real time, and the highest, lowest, and average temperature values ​​in the collection area are tracked and displayed. Based on the fused dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method, online real-time monitoring of the temperature field of the high-voltage equipment in the booster station is achieved.

[0069] Specifically, the core technology of this step is to use an infrared dual-view thermal imaging device to simultaneously collect the temperature values ​​of key points and the overall temperature field distribution of high-voltage power supply equipment. Diverse temperature measurement modes are used to ensure the comprehensiveness and accuracy of temperature monitoring. By monitoring temperature data in real time and integrating various monitoring information, online real-time monitoring of the temperature field of high-voltage equipment in the booster station is finally realized, providing data support for equipment status assessment and fault early warning.

[0070] While acquiring dual-view thermal imaging, the infrared dual-view thermal imaging device simultaneously obtains real-time online acquisition of key point temperature values ​​and overall temperature field distribution of high-voltage power supply equipment within its respective monitoring area. Key point temperature values ​​are collected from easily heated critical locations such as connection points, moving contacts, and stationary contacts of the high-voltage power supply equipment. Prior to acquisition, key points prone to heat generation are labeled on the equipment within each monitoring area using a backend computer system, assigning a unique identifier and acquisition priority to each key point. The device automatically focuses on each key point based on the preset identifier, acquiring and transmitting the temperature value of each key point in real time. The overall temperature field distribution is acquired through the device's full-area scanning mode, covering the entire visible area of ​​the equipment, generating a temperature field distribution image that visually presents the overall temperature changes of the equipment.

[0071] Temperature field distribution is flexibly collected through three methods: point temperature measurement, line temperature measurement, and area temperature measurement. Operators can switch between different temperature measurement methods according to monitoring needs via a back-end computer: When using point temperature measurement, a target temperature measurement point (such as a connection part of the equipment) is selected in the temperature field distribution image, and the device automatically focuses on the temperature measurement point, collects the temperature data of the point in real time, and synchronously feeds it back to the back-end; when using line temperature measurement, a target temperature measurement line segment (such as the contact line between the moving and stationary contacts of the equipment) is drawn in the temperature field distribution image, and the device continuously collects temperature along the line segment, obtains the temperature data of each point on the line segment, and generates a line segment temperature distribution curve, which is convenient for observing the temperature change gradient of continuous parts; when using area temperature measurement, a target temperature measurement area (such as the entire area of ​​a single circuit breaker) is selected in the temperature field distribution image, and the device collects the temperature of all points in the area, statistically analyzes the temperature data in the area, and generates an area temperature distribution heat map, which intuitively presents the temperature distribution differences in the area.

[0072] The background computer equipment monitors the temperature field distribution in real time within the corresponding acquisition area, receives temperature data transmitted by the device, and performs real-time filtering and statistics on all temperature data within the acquisition area. It automatically identifies the highest temperature value and its corresponding location, the lowest temperature value and its corresponding location within the acquisition area, and calculates the average temperature of all temperature measurement points within the acquisition area. The highest temperature value, lowest temperature value, and average temperature value are associated and bound with the acquisition area identifier and acquisition time, and are displayed synchronously on the background display interface and the dual-view fusion image, updating the temperature data in real time. When the temperature data within the acquisition area changes, the system automatically re-calculates and updates the displayed values, ensuring that operators can monitor the temperature changes in the acquisition area in real time.

[0073] A centralized monitoring platform is built on the back-end computer equipment. It integrates and displays the fused dual-view images, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method. The display interface is divided according to monitoring zones, and operators can switch between interfaces to view monitoring data in different areas. The real-time temperature data is compared with the preset normal operating temperature thresholds of the equipment. When the key point temperature value or the highest temperature value exceeds the threshold range, the system automatically triggers an alert signal to remind the operator to take timely action. At the same time, the system automatically stores all real-time monitoring data to form a historical database. Operators can query historical monitoring data by time, equipment type, and temperature measurement method, and compare and analyze the temperature change trends of the equipment. This provides comprehensive data support for equipment status assessment, fault diagnosis, and maintenance plan formulation, ultimately achieving comprehensive, real-time online monitoring of the temperature field of the high-voltage equipment in the booster station.

[0074] In some embodiments, the surveying of high-voltage power supply equipment within the substation to determine the installation locations of multiple infrared dual-view thermal imaging devices includes: adopting a zonal survey mode, dividing the substation into several monitoring zones according to the distribution density and equipment type of the high-voltage power supply equipment, with at least one infrared dual-view thermal imaging device deployed in each monitoring zone; locating each high-voltage power supply device in each monitoring zone, recording the installation height, distribution location, and surrounding obstacles of each device; determining the specific installation coordinates of each infrared dual-view thermal imaging device through simulation monitoring, based on the monitoring range and viewing angle of the infrared dual-view thermal imaging device, ensuring that the monitoring ranges of infrared dual-view thermal imaging devices in adjacent monitoring zones overlap appropriately to avoid monitoring blind spots; and simultaneously considering the distribution of strong electromagnetic fields within the substation, avoiding areas with concentrated strong electromagnetic interference to ensure the stability of the data collected by the infrared dual-view thermal imaging devices.

[0075] The core technology of this embodiment is to refine the specific implementation of step S101, "surveying the booster station and determining the installation locations of multiple sets of infrared dual-view thermal imaging devices." Through zonal surveys, parameter analysis, simulation, and anti-interference optimization, it solves problems such as disordered deployment of existing monitoring devices, blind spots, and data instability caused by strong electromagnetic interference. This achieves a scientific and rational deployment of the devices, laying the foundation for subsequent comprehensive and accurate monitoring. This embodiment is suitable for actual scenarios with dense distribution of high-voltage equipment and strong electromagnetic interference in booster stations, and is particularly applicable to the deployment of devices in 500KV booster stations.

[0076] Arrange professional technicians or survey robots with high-voltage equipment operation and maintenance experience to conduct a comprehensive survey of all high-voltage power supply equipment to be monitored in the substation (including at least one of the following: disconnecting switches, busbars, bushings, circuit breakers, instrument transformers, capacitors, and reactors). Adopt a zoned survey mode, dividing the high-voltage equipment into several monitoring zones according to the distribution density and equipment type (such as busbar clusters and circuit breaker groups). Each monitoring zone should be equipped with at least one infrared dual-view thermal imaging device to avoid problems such as insufficient data acquisition accuracy and inadequate monitoring of high-altitude equipment caused by an excessively large monitoring range of a single device, and to ensure that the monitoring load of each device is reasonable.

[0077] Each high-voltage power supply device in each monitoring zone was located individually. Using tools such as laser rangefinders and high-definition cameras, detailed records were made of the installation height, specific distribution coordinates, equipment model, rated parameters, and surrounding obstacles (such as guardrails, auxiliary equipment, and cable trays) of each device, forming a parameter ledger for each zone's equipment. At the same time, the technical parameters of the infrared dual-view thermal imaging device were retrieved to clarify its monitoring range, viewing angle, zoom capability, and electromagnetic interference resistance level. Combined with the parameter ledger for each zone's equipment, simulation monitoring was conducted (using 3D modeling software to recreate the layout of the booster station and simulate the monitoring coverage of different installation locations of the devices) to determine the specific installation coordinates of each device.

[0078] During the simulation, the focus was on verifying the overlap of the monitoring range of devices in adjacent monitoring zones. The aforementioned quantitative standards for installation parameters were implemented to completely avoid monitoring blind spots. In particular, for areas prone to being overlooked, such as densely populated equipment areas, high-altitude busbars, and equipment corners, the installation coordinates of the devices were optimized to ensure full coverage monitoring. At the same time, considering the distribution of strong electromagnetic areas within the substation (such as directly below high-voltage busbars and areas with dense transformers), the installation locations of the devices were avoided in areas with concentrated strong electromagnetic interference, and the distance from strong electromagnetic equipment was kept at least 3 meters to ensure the stability and accuracy of the data collected by the devices.

[0079] To address visual blind spots caused by obstructions from architecture and large equipment, the following obstruction avoidance and blind spot compensation scheme is implemented: blind spot compensation for a single device can be achieved by setting preset positions on the pan-tilt unit and adjusting the viewing angle; blind spot compensation for fixed obstructed areas is achieved by overlapping adjacent devices; a panoramic scanning path is planned for each device, with ≥32 preset positions set, a field-of-view overlap rate of ≥5% for adjacent preset positions, and a single panoramic scanning cycle of ≤5 minutes, to achieve continuous 360° scanning without blind spots within the partition.

[0080] During the survey, the distribution and structural strength of fireproof partitions and columns within the substation were recorded simultaneously. Fireproof partitions or columns with stable structures, not easily affected by equipment operation vibrations, easy to adjust viewing angles, and far from strong electromagnetic interference were prioritized as installation carriers. The selected installation carriers underwent strength testing to ensure they could support the weight of the infrared dual-view thermal imaging device and its fixed bracket, avoiding problems such as carrier damage and device displacement during long-term operation. Finally, an installation location report for each device was generated, clearly specifying the installation coordinates, installation carrier, monitoring coverage area, and precautions, providing a basis for subsequent installation and construction.

[0081] In some embodiments, the step of fixing multiple sets of infrared dual-view thermal imaging devices on suitable fireproof partitions or columns within the substation to ensure that the monitoring angle of the infrared dual-view thermal imaging devices can cover all target high-voltage equipment within the area under their responsibility includes: installing suitable fixed brackets on the corresponding fireproof partitions or columns according to the determined installation coordinates of each set of infrared dual-view thermal imaging devices; adjusting the tilt angle and height of the brackets so that the lens of the device faces the core high-voltage power supply equipment within the monitoring zone; after installation, starting the infrared dual-view thermal imaging devices for trial acquisition; checking whether each target high-voltage equipment within the monitoring zone can be clearly seen within the monitoring angle according to the monitoring images of the infrared dual-view thermal imaging devices; fine-tuning the bracket angle or device position for areas not covered by the view; testing the acquisition effect of the infrared dual-view thermal imaging devices under different ambient light conditions to ensure that the infrared dual-view thermal imaging devices can clearly capture equipment images and temperature data in both strong and weak light environments; fixing the device position and ensuring proper installation and reinforcement.

[0082] The core technical content of this embodiment is to refine the specific implementation method of "device fixed installation and viewing angle calibration" in step S101. By adapting the bracket installation, viewing angle fine adjustment, multi-condition testing and reinforcement, it is ensured that the infrared dual-view thermal imaging device is firmly installed and has a precise viewing angle. It can stably capture images and temperature data of high-voltage equipment in each monitoring area and adapt to the working conditions of outdoor extreme climate (low temperature, strong sunlight) and equipment vibration of the booster station.

[0083] Based on the determined installation coordinates and mounting carrier (fireproof partition wall or column) for each set of equipment, a suitable fixing bracket is customized. The bracket is made of corrosion-resistant, vibration-resistant, and low-temperature resistant materials (suitable for low-temperature conditions below -30℃). The bracket is designed with an adjustable structure (tilt angle adjustable from 0-90°, height adjustable from 0.5-1.5 meters). On the selected fireproof partition wall or column, the fixing bracket is installed using expansion bolts and other reinforcing connectors. During the installation process, ensure that the bracket is level, firm, and without loosening. After installation, the bracket is subjected to a load-bearing test to ensure that it can withstand the effects of outdoor wind force, equipment vibration, etc.

[0084] The infrared dual-view thermal imaging device is fixed on the bracket. According to the aforementioned quantitative standards for installation parameters, the tilt angle and height of the bracket are adjusted so that the lens of the device is accurately facing the core high-voltage power supply equipment in the monitoring zone. This ensures that the monitoring range and field of view of the device can cover all target equipment in the zone, and that the lens is unobstructed and free from reflection. Anti-loosening bolts are used when fixing the device, and anti-vibration pads are added to reduce the impact of equipment operation vibration on the device and prevent the device from shifting and causing the viewing angle to deviate.

[0085] After installation, start the infrared dual-view thermal imaging device for trial data acquisition. View the monitoring screen of the device through the back-end computer equipment and check one by one whether each target high-voltage equipment in the monitoring zone can be clearly seen in the monitoring view. Pay special attention to the monitoring effect of easily overlooked parts such as high-altitude equipment and equipment corners. For areas where the view is not covered or the image is blurry, fine-tune the bracket angle or device position until all target equipment can be clearly displayed. At the same time, adjust the zoom parameters of the device to ensure that equipment details (such as moving contacts and connection parts) can be clearly captured.

[0086] The test device was evaluated for its data acquisition performance under various ambient lighting conditions (strong light, weak light, and cloudy days) to ensure clear image and temperature data capture under all lighting conditions. For strong light environments, the device's exposure parameters were adjusted to avoid overexposure. For weak light environments, the device's night vision enhancement function was activated to improve image clarity. After testing, the device's position and support angle were finalized, and installation reinforcement was implemented. Waterproof and dustproof seals were added at the connection between the support and the mounting carrier to adapt to harsh outdoor environments and prevent rainwater and dust from entering the device and causing malfunctions. Finally, an installation and commissioning report was generated, recording the commissioning parameters and test results.

[0087] In some embodiments, the dual-view fusion processing method, which fuses infrared thermal images and visible light images within the same field of view to obtain a dual-view image, ensures that the temperature anomaly area in the infrared thermal image accurately corresponds to the actual location of the device in the visible light image. This includes: preprocessing the visible light image and infrared thermal image received synchronously in the same monitoring area at the same time, enhancing blurred areas to ensure image clarity; extracting the device contour features in the visible light image and the temperature distribution features in the infrared thermal image, establishing the coordinate correspondence between the two types of images, and achieving alignment within the same field of view; using a pixel-level fusion algorithm to fuse the temperature grayscale information of the infrared thermal image with the device detail information of the visible light image to generate a dual-view fused image; highlighting the temperature anomaly area in the fused image while retaining the specific location and appearance details of the device in the visible light image, allowing direct location of the specific device part corresponding to the temperature anomaly area through the fused image, thus achieving rapid and accurate fault location.

[0088] The core technical content of this embodiment is to refine the specific implementation of the "dual-view fusion processing" in step S102. Through image preprocessing, feature extraction, alignment within the same field of view, pixel-level fusion, and anomaly marking, it solves the problems of simple superposition of infrared thermal images and visible light images, inaccurate correspondence between temperature anomaly areas and actual equipment locations, and low fault location efficiency in the prior art. It achieves accurate fusion of dual-view images, provides technical support for rapid fault location, and improves image clarity to meet the image acquisition needs of the complex environment of the booster station.

[0089] The background computer equipment synchronously receives visible light images and infrared thermal images of the same monitoring area and at the same time from each infrared dual-view thermal imaging device, and preprocesses the two types of images. Noise filtering algorithms (such as Gaussian filtering) are used to remove environmental noise (such as dust and shadows) in the visible light images and temperature noise in the infrared thermal images to reduce interference. Image enhancement algorithms (such as histogram equalization) are used for blurred areas to improve image clarity and ensure that the device outline and temperature distribution can be clearly identified. At the same time, the two types of images are normalized to ensure consistent image resolution, laying the foundation for subsequent fusion.

[0090] The Zhang Zhengyou calibration method was used to perform stereo calibration on the infrared and visible light dual cameras, obtaining a 3×3 homography matrix H. This established a pixel-level coordinate correspondence between the two types of images, achieving alignment within the same field of view. For any pixel coordinate (xir, yir) in the infrared image, it was mapped to the corresponding pixel coordinate (xvis, yvis) in the visible light image through the homography matrix H. Simultaneously, an image recognition algorithm was used to extract device contour features (such as device shape, connection parts, and edge lines) from the visible light image, establishing a device contour feature library. Temperature distribution features (such as temperature gradient, high-temperature regions, and low-temperature regions) were extracted from the infrared thermal image, and the coordinates of temperature anomaly regions were marked. Based on the above pixel-level coordinate mapping relationship and device features, the registration accuracy was further verified and optimized to ensure accurate matching between temperature regions in the infrared thermal image and device parts in the visible light image, with a registration accuracy ≤ 1 pixel, avoiding image shift, misalignment, and other problems. A Laplacian pyramid multi-scale weighted pixel-level fusion algorithm is employed to deeply fuse the temperature grayscale information of the infrared thermal image with the device detail information of the visible light image, generating a dual-view fused image. The fusion formula is as follows: For the infrared image pixel Iirl(i,j) and the visible light image pixel Ivisl(i,j) of the l-th layer of the pyramid, the fused pixel Ifusel(i,j) is:

[0091] Ifusel(i,j)=wirl(i,j)*Iirl(i,j)+wvisl(i,j)*Ivisl(i,j);

[0092] The weight coefficients are set to will(i,j) + wvisl(i,j) = 1. The low-frequency layer uses weight allocation based on region energy, while the high-frequency layer uses weight allocation based on gradient magnitude. Finally, the fused dual-view image is obtained through inverse pyramid transformation. During the fusion process, the specific location, appearance details, and surrounding environment of the device in the visible light image are preserved, while the temperature distribution information of the infrared thermal image is superimposed. A pseudo-color encoding method is used to mark different temperature ranges with different colors (e.g., high temperature areas are marked in red, and normal temperature areas are marked in green) to make the temperature distribution intuitively visible. The fusion algorithm parameters are optimized to avoid problems such as ghosting and blurring in the fused image, ensuring that the fused image is clear and easy to identify.

[0093] In the fused image, areas where the temperature exceeds the preset normal threshold are highlighted (e.g., with a red border or flashing indicator), and the real-time temperature value of that area is also marked. Operators can directly associate the abnormal temperature area with the actual part of the equipment through the dual-view fused image displayed on the back-end computer, quickly locating the fault point (e.g., overheating of moving contacts or loose connections) without having to view infrared thermal images and visible light images separately, greatly improving fault location efficiency. The fused image is synchronously stored in the back-end database and associated with the acquisition time, monitoring zone, and equipment identification, facilitating subsequent traceability and analysis.

[0094] In some embodiments, the real-time online acquisition of key point temperature values ​​and temperature field distribution of high-voltage power supply equipment within each monitoring area using an infrared dual-view thermal imaging device includes: marking the easily heated key points of the high-voltage power supply equipment within each monitoring area, including equipment connection parts, moving contacts, and stationary contacts; assigning a unique identifier and acquisition priority to each key point; activating the fixed-point acquisition mode of the infrared dual-view thermal imaging device, whereby the device automatically focuses on each key point according to the preset key point identifier, and acquires and transmits the temperature value of each key point in real time; activating the full-domain acquisition mode to perform a comprehensive scan of the high-voltage power supply equipment within the monitoring area, acquiring the overall temperature data of the equipment, and generating a temperature field distribution image covering the entire visible area of ​​the equipment; and associating and storing the acquired key point temperature values ​​with the temperature field distribution image to ensure that the temperature data of each key point can be mapped to a specific location in the temperature field distribution image.

[0095] The core technology of this embodiment is to refine the specific implementation of "collecting key point temperature values ​​and temperature field distribution" in step S103. By marking key points, collecting data at fixed points, scanning the entire area, and storing related data, it solves the problems of separation between key point temperature and the overall temperature field, inability to fully grasp the temperature status of equipment, and difficulty in data traceability in existing monitoring methods. It realizes the synchronous collection of key points of equipment prone to overheating and the overall temperature field, providing comprehensive and accurate data support for equipment status assessment. It focuses on the precise monitoring of moving contacts and connection parts with high failure rates in booster station equipment.

[0096] Using backend computer equipment, combined with the operation and maintenance experience of high-voltage equipment in the booster station and historical fault data, the key points of high-voltage power supply equipment in each monitoring zone that are prone to overheating are marked. The key points are marked as equipment connection parts, moving contacts, and stationary contacts (these parts have a high failure rate and are prone to overheating due to poor contact). A unique identifier (such as "Circuit Breaker 1# Moving Contact") and collection priority are set for each key point (moving contacts and connection parts are set as the highest priority). A key point marking ledger is formed, which clarifies the location coordinates, equipment affiliation and normal temperature threshold of each key point.

[0097] The infrared dual-view thermal imaging device is activated in fixed-point acquisition mode. Based on the preset key point markers and acquisition priorities, the device automatically focuses on each key point and acquires and transmits the temperature value of each key point in real time at a preset acquisition frequency (up to 1 time / second). During the acquisition process, the device continuously tracks the position of the key points. If the device experiences slight displacement (such as movement of the moving contact), the device automatically adjusts the focusing position through image recognition algorithms to ensure the continuity and accuracy of key point temperature acquisition. The acquired key point temperature values ​​are verified in real time, and abnormal data (such as sudden values ​​caused by electromagnetic interference) are removed.

[0098] While collecting temperatures at key points, the infrared dual-view thermal imaging device is activated in full-area scanning mode to comprehensively scan the high-voltage power supply equipment within the monitoring zone. The scanning range covers the entire visible area of ​​the equipment (including the equipment body, connecting cables, and auxiliary components), collecting overall temperature data of the equipment. Through a temperature field generation algorithm, the collected full-area temperature data is converted into a temperature field distribution image, which intuitively presents the overall temperature changes, temperature gradients, and high-temperature anomaly areas of the equipment. The resolution of the temperature field distribution image is consistent with that of the dual-view fused image, facilitating subsequent correlation analysis.

[0099] The collected key point temperature values ​​are associated with and stored in the temperature field distribution image. The temperature data of each key point corresponds to the specific location coordinates in the temperature field distribution image, and is labeled with key point identification, collection time, monitoring zone and other information. At the same time, the key point temperature data, temperature field distribution image and dual-view fusion image are associated to form a three-dimensional data ledger of "image-temperature-location", which is stored in the background database. It supports querying by key point identification, equipment type, collection time and other dimensions, which is convenient for subsequent data analysis, fault tracing and status assessment.

[0100] In some embodiments, the temperature field distribution is obtained through any one of point temperature measurement, line temperature measurement, and area temperature measurement, including: when using point temperature measurement, a target temperature measurement point is selected in the temperature field distribution image, the infrared dual-view thermal imaging device automatically focuses on the temperature measurement point, collects the temperature data of the point in real time, and provides real-time feedback; when using line temperature measurement, a target temperature measurement line segment is drawn in the temperature field distribution image, the line segment can cover any continuous part of the device, the device continuously collects temperature along the line segment, obtains the temperature data of each point on the line segment, and generates a line segment temperature distribution curve; when using area temperature measurement, a target temperature measurement area is selected in the temperature field distribution image, the target temperature measurement area covers a designated part of a single device or multiple devices, the infrared dual-view thermal imaging device collects temperature data at all points in the area, statistically analyzes the temperature data in the area, and generates an area temperature distribution heat map; the temperature measurement method can be flexibly switched according to monitoring needs.

[0101] The core technology of this embodiment is to refine the specific implementation of the three temperature measurement modes in step S103: "point temperature measurement, line temperature measurement, and area temperature measurement". By flexibly switching temperature measurement modes, accurately collecting temperature data from different dimensions, and generating visualized temperature measurement results, it solves the problems of existing monitoring methods having a single temperature measurement mode and being unable to adapt to different monitoring needs (such as single-point accurate monitoring, continuous part gradient monitoring, and overall area monitoring). It achieves comprehensive and accurate monitoring of equipment temperature and adapts to the needs of different types of high-voltage equipment and different monitoring scenarios in the booster station.

[0102] When precise temperature measurement of a specific point on the equipment (such as a connecting bolt or moving contact point) is required, the operator selects the target temperature measurement point by clicking on the temperature field distribution image through the visual interface of the back-end computer equipment, and enters the name of the temperature measurement point (such as "busbar connecting bolt 1#"). The back-end system sends control commands to the corresponding infrared dual-view thermal imaging device, which automatically focuses on the temperature measurement point, adjusts the temperature measurement accuracy (temperature measurement accuracy reaches ±2℃ or ±2%), collects the temperature data of the point in real time and synchronously feeds it back to the back-end. The interface displays the coordinates of the temperature measurement point, the real-time temperature value and the temperature change curve. The collected data is automatically stored in the database and supports historical comparison and analysis.

[0103] When it is necessary to monitor the temperature gradient of continuous parts of the equipment (such as the contact segment between moving and stationary contacts, or continuous sections of the busbar), the operator can use a mouse to draw the target temperature measurement line segment in the temperature field distribution image. The line segment can cover any continuous part of the equipment, and the start and end points of the line segment can be set. The device continuously collects temperature data along the temperature measurement line segment, collecting temperature data at each point on the line segment at preset intervals (such as 1 mm / point). After the data collection is completed, the background system generates a temperature distribution curve of the line segment, which intuitively presents the temperature difference and temperature gradient at each point on the line segment, and marks the highest temperature point, lowest temperature point and corresponding coordinates in the curve, which is convenient for analyzing the temperature distribution pattern of continuous parts and judging whether there is a local overheating problem.

[0104] When it is necessary to perform overall temperature monitoring on a single device or a designated area of ​​multiple devices (such as the entire circuit breaker or a cluster of instrument transformers), the operator selects the target temperature measurement area in the temperature field distribution image. This area can cover a single device, multiple devices, or a specific part of the device (such as the circuit breaker body area). The device collects comprehensive temperature data from all points within the area, and statistically analyzes the temperature data (including the highest temperature, lowest temperature, and average temperature). The background system generates a regional temperature distribution heat map, using pseudo-color encoding to present the temperature distribution differences within the area, and highlights abnormal temperature points within the area. At the same time, it statistically analyzes the temperature data within the area and generates a regional temperature measurement report, clearly indicating the temperature distribution and abnormal point information within the area.

[0105] The three temperature measurement modes can be flexibly switched according to monitoring needs. The back-end system supports one-click switching of temperature measurement modes. Operators can select the corresponding temperature measurement mode according to the equipment operating status and monitoring focus. For example, the area temperature measurement mode is used during routine inspections to quickly check the overall temperature of the equipment in the area. After an anomaly is detected, the point temperature measurement and line temperature measurement modes are used to accurately locate the abnormal point and temperature gradient. The data collected by the three temperature measurement modes are synchronized to the centralized monitoring platform in real time and correlated with the dual-view fusion image and key point temperature data to form a comprehensive temperature measurement data system.

[0106] In some embodiments, the real-time monitoring of the acquisition area corresponding to the temperature field distribution, tracking and displaying the highest, lowest, and average temperature values ​​within the acquisition area, includes: receiving temperature field distribution data transmitted by the infrared dual-view thermal imaging device in real time; filtering and statistically analyzing all temperature data within the acquisition area in real time; automatically identifying the highest temperature value and its corresponding location, the lowest temperature value and its corresponding location within the acquisition area, and simultaneously calculating the average temperature of all temperature measurement points within the acquisition area; associating the highest, lowest, and average temperature values ​​with the acquisition area identifier and acquisition time, and displaying them synchronously on the background display interface and the dual-view fused image, updating the temperature data in real time; and re-statistically updating the displayed values ​​when the temperature data within the acquisition area changes, ensuring that operators can monitor the temperature changes in the acquisition area in real time.

[0107] The core technical content of this embodiment is to refine the specific implementation method of "real-time monitoring and display of temperature data" in step S103. By receiving, filtering and statistically analyzing, displaying and updating temperature data in real time, it solves the problems of unintuitive temperature data display, inability to track temperature changes in real time, and difficulty for operators to quickly grasp the temperature status of equipment in existing monitoring methods. It realizes real-time monitoring, accurate display and dynamic updating of temperature data, and provides support for operators to promptly detect temperature anomalies and handle faults.

[0108] The backend computer equipment receives temperature data transmitted by all infrared dual-view thermal imaging devices in real time through a preset communication link (combining industrial-grade wired network and wireless communication to ensure transmission stability and anti-electromagnetic interference capability). This includes temperature values ​​at key points, point / line / area temperature measurement data, and temperature field distribution data. During the reception process, the data is verified in real time, and an abnormal data removal algorithm is used to remove abrupt changes and invalid values ​​caused by transmission interference or device malfunctions, ensuring that the received temperature data is complete and accurate. At the same time, the acquisition time, monitoring zone, device identification, temperature measurement mode, and other related information for each data point are recorded.

[0109] The backend system performs real-time filtering and statistics on all temperature data within the collection area corresponding to the received temperature field distribution; it automatically identifies the highest temperature value and corresponding point coordinates, the lowest temperature value and corresponding point coordinates within the collection area, and uses an average calculation algorithm to calculate the average temperature of all temperature measurement points within the collection area in real time; for key point temperature data, it separately calculates the real-time temperature value and temperature change range of each key point, compares it with the preset normal temperature threshold in real time, and marks key points that exceed the threshold.

[0110] The highest, lowest, and average temperature values ​​obtained from the statistics are associated and bound with the data acquisition area identifier, acquisition time, and equipment identifier, and displayed synchronously on the background display interface and the dual-view fusion image. On the dual-view fusion image, the location and temperature value of the highest and lowest temperature points are marked, and different colors are used to mark temperature ranges, so that operators can intuitively view the temperature distribution and key temperature data of the acquisition area. The background display interface is divided into display modules according to monitoring zones. Each module synchronously displays the dual-view fusion image, temperature field distribution image, key point temperature data, and temperature measurement statistics of that zone, and supports switching between interfaces for viewing.

[0111] The backend system updates temperature data and display content in real time according to a preset frequency (consistent with the device's acquisition frequency, up to 1 time / second). When the temperature data in the acquisition area changes (such as temperature rise, fall, or the appearance of new high-temperature anomalies), the system automatically re-filters and statistically analyzes the temperature data, updates the temperature values ​​and anomaly markers on the display interface and the dual-view fusion image, and records the temperature data change trend to generate a real-time temperature change curve. Operators can intuitively view the temperature change pattern of the equipment through the curve, predict the temperature change trend, and promptly detect potential temperature anomalies.

[0112] In some embodiments, the online real-time monitoring of the temperature field of the high-voltage equipment in the substation based on the fused dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method includes: building a centralized monitoring platform to integrate and display the fused dual-view image, key point temperature values, temperature field distribution data, and various temperature measurement statistics, and dividing the display interface according to monitoring zones; comparing the real-time collected temperature data with the preset normal operating temperature threshold of the equipment, and automatically triggering a prompt signal when the key point temperature value and the highest temperature value exceed the threshold range; and storing the dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method to form a historical database, thereby realizing comprehensive and real-time online monitoring of the temperature field of the high-voltage equipment in the substation.

[0113] The core technology of this embodiment is to refine the specific method of "real-time online monitoring" in step S103. By building a centralized monitoring platform, integrating and displaying data, providing anomaly warnings, and storing and querying historical data, it solves the problems of scattered monitoring data, lack of centralized management, inability to provide anomaly warnings, and difficulty in tracing historical data in existing monitoring methods. It realizes comprehensive and real-time online monitoring of the temperature field of high-voltage equipment in the substation, providing comprehensive data support for equipment condition assessment, fault diagnosis, and maintenance plan formulation, and adapting to the management needs of digital power plants and unmanned substations.

[0114] The backend computer equipment is used to build a centralized monitoring platform for the temperature field of the high-voltage equipment in the booster station. It adopts distributed storage and parallel computing technologies to achieve efficient aggregation, cleaning, storage and management of massive monitoring data. The platform supports multi-channel concurrent display and can simultaneously display dual-view fused images of all monitoring zones, temperature field distribution images, key point temperature data, temperature measurement statistics and equipment operating status. The platform has access control functions, divided into different permission levels such as administrator, maintenance personnel and monitoring personnel. Different personnel can view and operate the corresponding functional modules to ensure system information security.

[0115] The centralized monitoring platform integrates and displays the fused dual-view images, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method. The display interface is divided according to monitoring zones, and operators can view monitoring data for different areas and different devices through interface switching and mouse clicks. The platform supports multiple data display methods, including image display (dual-view fused image, temperature field distribution image), numerical display (real-time temperature value, statistical value), curve display (temperature change trend curve), and report display (temperature measurement report, anomaly report), enabling operators to grasp the temperature status of the equipment from multiple dimensions and intuitively.

[0116] The platform pre-stores normal operating temperature thresholds for various types of high-voltage equipment and key points. The threshold parameters can be flexibly adjusted according to equipment type and operating conditions (such as load size). The platform compares the real-time collected temperature values ​​and maximum temperature values ​​of key points with the preset thresholds in real time. When the temperature data exceeds the threshold range (including warning thresholds and alarm thresholds), the system automatically triggers prompt signals, including screen flashing, audible alarms, and pop-up prompts. At the same time, it pushes the warning information (abnormal equipment identifier, abnormal location, real-time temperature, collection time, and abnormal level) to the operator's terminal (such as mobile phone or computer). For severe abnormalities (sharp temperature rise, exceeding the alarm threshold), the system automatically records the abnormal process, starts the video recording function, and retains dual-view fusion images and temperature data for subsequent fault analysis.

[0117] The centralized monitoring platform automatically stores all real-time monitoring data, including dual-view fusion images, temperature field distribution images, key point temperature data, temperature measurement statistics, and early warning information, forming a historical database with a storage period of no less than one year. The database supports querying historical monitoring data by multiple dimensions such as time (e.g., year, month, day, time period), equipment type, monitoring zone, temperature measurement mode, and anomaly level. Operators can query equipment temperature data and image information for any time period, compare and analyze equipment temperature change trends, and assess equipment operating status. It also supports historical data export, which can be exported to report, image, and other formats, providing comprehensive data support for equipment condition inspection, fault diagnosis, and maintenance plan formulation, ultimately achieving comprehensive, real-time online monitoring of the temperature field of high-voltage equipment in the booster station.

[0118] In some embodiments, the method further includes: embedding a machine learning-based intelligent diagnostic algorithm; pre-collecting temperature data and dual-view image data of the high-voltage power supply equipment in the booster station under different operating conditions and different fault types; constructing an equipment fault sample database; the sample data includes normal operation samples, slightly overheated samples, severely overheated samples, and temperature and image features corresponding to different types of faults; inputting real-time collected fused dual-view images, key point temperature values, temperature field distribution data, and temperature measurement statistics into the intelligent diagnostic algorithm; by comparing the real-time data with the sample features in the fault sample database, extracting temperature change patterns and image anomaly features from the real-time data, identifying the current operating status of the equipment, and determining whether there is a potential overheating hazard and its severity; simultaneously, combining the equipment's historical operating temperature data, using the algorithm to predict the equipment temperature change trend, generating an equipment operating status diagnostic report and maintenance suggestions; and pushing the diagnostic results and maintenance suggestions to the operator's terminal, thereby achieving early warning and intelligent diagnosis of equipment faults and improving the initiative and effectiveness of monitoring.

[0119] This embodiment embeds a machine learning-based intelligent diagnostic algorithm into the monitoring method. By constructing an equipment fault sample database, performing real-time data comparison and analysis, identifying faults and predicting trends, and generating and pushing diagnostic reports, it solves the problems of existing monitoring methods, such as relying on human experience to judge faults, being unable to achieve early warning of faults, having low fault diagnosis efficiency, and lacking closed-loop management. It enables early warning of equipment faults, intelligent diagnosis, and closed-loop handling, improving the initiative and effectiveness of monitoring and adapting to the development trend of smart grids and digital power plants.

[0120] Monitoring data of the high-voltage power supply equipment in the substation under different operating conditions and fault types are collected in advance, including temperature data (temperature at key points, temperature field distribution, and statistical values ​​of temperature measurement), dual-view image data (dual-view fusion image, infrared thermal image, and visible light image), and environmental condition data. Historical fault records of the equipment are also collected (fault type, fault cause, handling measures, and fault consequences) to construct an equipment fault sample database. This database contains standardized fault samples of seven core high-voltage equipment types in the substation, with a total sample size of ≥100,000 images. Classified by fault type, it includes all types of faults such as normal operation samples, poor contact fault samples, overload fault samples, insulation degradation fault samples, and core grounding fault samples, covering temperature and image characteristics under different environmental conditions and load levels. Furthermore, the sample data is continuously supplemented and corrected by combining actual operating data and experience databases of the substation equipment to improve the completeness and accuracy of the sample database.

[0121] An intelligent diagnostic algorithm is constructed using a cascaded deep learning architecture that combines YOLOv8 object detection, dual-channel CNN feature extraction, and CNN-LSTM classification prediction. The algorithm is trained using sample data from a fault sample database. The core structure and training logic of the algorithm are as follows:

[0122] The backbone network uses CSPDarknet53 as the feature extraction backbone network, with an input image size of 640×640. Combined with the CBAM attention mechanism, it enhances the feature focusing ability of the equipment fault area, and the target detection accuracy mAP@0.5≥98%;

[0123] Dual-channel feature extraction is achieved by designing a dual-channel parallel extraction network for infrared temperature features and visible light image features. This network performs in-depth extraction of the temperature distribution features of infrared thermal images and the device appearance features of visible light images, respectively, and outputs multi-dimensional fused features.

[0124] The classification and prediction network uses a CNN-LSTM network to construct fault classification and trend prediction branches. The CNN branch achieves accurate fault type classification, while the LSTM branch predicts fault trends based on time-series temperature data. The fault classification accuracy is ≥95%.

[0125] During algorithm training, a multi-dimensional environmental compensation model is built in combination with interference factors such as equipment load, ambient temperature and humidity, and wind speed to optimize the algorithm's anti-interference ability and ensure accurate fault identification under different working conditions. The algorithm is iteratively optimized regularly using newly added sample data to improve its diagnostic accuracy and adaptability.

[0126] The real-time collected monitoring data (fusion of dual-view images, key point temperature values, temperature field distribution data, temperature measurement statistics, and environmental condition data) is input into the trained intelligent diagnostic algorithm, and the following feature engineering and feature extraction processes are executed: Multi-dimensional feature extraction: Three types of core features are extracted: first, infrared temperature features, including key point temperature rise, temperature gradient, maximum temperature, relative temperature difference, and temperature rise rate; second, visible light appearance features, including abnormal appearance features such as equipment deformation, loose connectors, discharge marks, and component damage; and third, environmental condition features, including ambient temperature and humidity, wind speed, wind direction, and equipment load current; Feature standardization and compensation: The built-in Z-Score feature standardization method is used to normalize the extracted features, while also being based on IEC 62446. The multi-dimensional environmental compensation model established by the infrared temperature measurement standard eliminates the interference of environmental factors on feature values ​​and obtains standardized feature vectors. The algorithm extracts the temperature change pattern and image anomaly features in the real-time data by comparing the real-time standardized feature vectors with the sample features in the fault sample database. It automatically identifies the current operating status of the equipment (normal, slightly abnormal, and severely abnormal), determines whether there is a risk of overheating and the severity of the risk, and identifies potential fault types (such as poor contact of moving contacts, loose connection parts, and insulation deterioration). It calculates the confidence level of the fault occurrence and clarifies the possible development trend of the fault.

[0127] The algorithm combines 72 hours of historical operating temperature data and real-time temperature change trends of the equipment, and uses a CNN-LSTM network to extrapolate and predict the temperature rise trend and probability of failure for the next 7 days. The average absolute error of the temperature rise prediction is ≤2℃. It also employs a three-level hierarchical decision logic to classify the severity of the fault and the warning level: Level 1 Warning: Temperature rise 10-20K / Fault probability 30%-60%, threshold can be customized from 30%-60%; Level 2 Alarm: Temperature rise 20-40K / Fault probability 60%-90%; Level 3 Emergency Alarm: Temperature rise >40K / Fault probability ≥90%. Based on the hierarchical decision results, a warning signal is issued in advance for the corresponding level, and an equipment operation status diagnostic report is generated. The report includes basic equipment information, real-time monitoring data, operation status assessment, fault identification results (fault type, confidence level, fault cause analysis), temperature change trend prediction, warning level, and maintenance suggestions (handling measures, handling priority, precautions). The report format is standardized for easy viewing and use by operators.

[0128] The system pushes diagnostic reports and early warning information (fault type, confidence level, maintenance recommendations) to operator terminals (such as mobile phones, computers, and central control center displays) to remind operators to take timely action. Operators then inspect and handle the equipment according to the maintenance recommendations in the diagnostic report. After handling, they enter the handling results and evaluation opinions into the background system, forming a closed-loop verification. The system automatically records diagnostic results, handling process, handling evaluation, and other information, supplementing the fault sample database for subsequent algorithm iteration and optimization, continuously improving the accuracy and effectiveness of fault diagnosis, and achieving intelligent, closed-loop management of equipment faults.

[0129] Please see Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of the online temperature field monitoring system 200 for high-voltage equipment in a substation provided in this application embodiment. The online temperature field monitoring system 200 is used to execute the steps of the online temperature field monitoring method for high-voltage equipment in a substation as shown in the above embodiments. The online temperature field monitoring system 200 can be a single server or a server cluster, or it can be a terminal, such as a handheld terminal, laptop computer, wearable device, or robot.

[0130] like Figure 3 As shown, the online temperature field monitoring system 200 for high-voltage equipment in the booster station includes:

[0131] Equipment survey unit 201 is used to survey the high-voltage power supply equipment in the substation, determine the installation locations of multiple sets of infrared dual-view thermal imaging devices, and fix the multiple sets of infrared dual-view thermal imaging devices on suitable fireproof partitions or columns in the substation to ensure that the infrared dual-view thermal imaging devices can cover all target high-voltage equipment in the area under their responsibility by their respective monitoring angles; the high-voltage power supply equipment includes at least one of the following: disconnecting switches, busbars, bushings, circuit breakers, instrument transformers, capacitors, and reactors;

[0132] The device start-up unit 202 is used to start multiple infrared dual-view thermal imaging devices to simultaneously acquire visible light images and infrared thermal images of high-voltage power supply equipment in their respective monitoring areas. It synchronously receives the visible light images and infrared thermal images of the same monitoring area and at the same time acquired by each infrared dual-view thermal imaging device, and uses a dual-view fusion processing method to fuse the infrared thermal image and the visible light image in the same field of view to obtain a dual-view image, so that the temperature abnormal area in the infrared thermal image corresponds precisely to the actual location of the equipment in the visible light image.

[0133] The monitoring completion unit 203 is used to acquire, in real time online, the key point temperature values ​​and temperature field distribution of the high-voltage power supply equipment within its respective monitoring area through an infrared dual-view thermal imaging device. The key point temperature values ​​are collected from the connection parts, moving contacts, and stationary contacts of the high-voltage power supply equipment, which are prone to overheating. The overall temperature field distribution covers the entire visible area of ​​the equipment. The temperature field distribution is obtained through any one of point temperature measurement, line temperature measurement, and area temperature measurement. The unit monitors the collection area corresponding to the temperature field distribution in real time, tracks and displays the highest, lowest, and average temperature values ​​within the collection area. Based on the fused dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method, the unit achieves online real-time monitoring of the temperature field of the high-voltage equipment in the booster station.

[0134] In some embodiments, the surveying of high-voltage power supply equipment within the substation to determine the installation locations of multiple infrared dual-view thermal imaging devices includes: adopting a zonal survey mode, dividing the substation into several monitoring zones according to the distribution density and equipment type of the high-voltage power supply equipment, with at least one infrared dual-view thermal imaging device deployed in each monitoring zone; locating each high-voltage power supply device in each monitoring zone, recording the installation height, distribution location, and surrounding obstacles of each device; determining the specific installation coordinates of each infrared dual-view thermal imaging device through simulation monitoring, based on the monitoring range and viewing angle of the infrared dual-view thermal imaging device, ensuring that the monitoring ranges of infrared dual-view thermal imaging devices in adjacent monitoring zones overlap appropriately to avoid monitoring blind spots; and simultaneously considering the distribution of strong electromagnetic fields within the substation, avoiding areas with concentrated strong electromagnetic interference to ensure the stability of the data collected by the infrared dual-view thermal imaging devices.

[0135] In some embodiments, the step of fixing multiple sets of infrared dual-view thermal imaging devices on suitable fireproof partitions or columns within the substation to ensure that the monitoring angle of the infrared dual-view thermal imaging devices can cover all target high-voltage equipment within the area under their responsibility includes: installing suitable fixed brackets on the corresponding fireproof partitions or columns according to the determined installation coordinates of each set of infrared dual-view thermal imaging devices; adjusting the tilt angle and height of the brackets so that the lens of the device faces the core high-voltage power supply equipment within the monitoring zone; after installation, starting the infrared dual-view thermal imaging devices for trial acquisition; checking whether each target high-voltage equipment within the monitoring zone can be clearly seen within the monitoring angle according to the monitoring images of the infrared dual-view thermal imaging devices; fine-tuning the bracket angle or device position for areas not covered by the view; testing the acquisition effect of the infrared dual-view thermal imaging devices under different ambient light conditions to ensure that the infrared dual-view thermal imaging devices can clearly capture equipment images and temperature data in both strong and weak light environments; fixing the device position and ensuring proper installation and reinforcement.

[0136] In some embodiments, the dual-view fusion processing method, which fuses infrared thermal images and visible light images within the same field of view to obtain a dual-view image, ensures that the temperature anomaly area in the infrared thermal image accurately corresponds to the actual location of the device in the visible light image. This includes: preprocessing the visible light image and infrared thermal image received synchronously in the same monitoring area at the same time, enhancing blurred areas to ensure image clarity; extracting the device contour features in the visible light image and the temperature distribution features in the infrared thermal image, establishing the coordinate correspondence between the two types of images, and achieving alignment within the same field of view; using a pixel-level fusion algorithm to fuse the temperature grayscale information of the infrared thermal image with the device detail information of the visible light image to generate a dual-view fused image; highlighting the temperature anomaly area in the fused image while retaining the specific location and appearance details of the device in the visible light image, allowing direct location of the specific device part corresponding to the temperature anomaly area through the fused image, thus achieving rapid and accurate fault location.

[0137] In some embodiments, the real-time online acquisition of key point temperature values ​​and temperature field distribution of high-voltage power supply equipment within each monitoring area using an infrared dual-view thermal imaging device includes: marking the easily heated key points of the high-voltage power supply equipment within each monitoring area, including equipment connection parts, moving contacts, and stationary contacts; assigning a unique identifier and acquisition priority to each key point; activating the fixed-point acquisition mode of the infrared dual-view thermal imaging device, whereby the device automatically focuses on each key point according to the preset key point identifier, and acquires and transmits the temperature value of each key point in real time; activating the full-domain acquisition mode to perform a comprehensive scan of the high-voltage power supply equipment within the monitoring area, acquiring the overall temperature data of the equipment, and generating a temperature field distribution image covering the entire visible area of ​​the equipment; and associating and storing the acquired key point temperature values ​​with the temperature field distribution image to ensure that the temperature data of each key point can be mapped to a specific location in the temperature field distribution image.

[0138] In some embodiments, the temperature field distribution is obtained through any one of point temperature measurement, line temperature measurement, and area temperature measurement, including: when using point temperature measurement, a target temperature measurement point is selected in the temperature field distribution image, the infrared dual-view thermal imaging device automatically focuses on the temperature measurement point, collects the temperature data of the point in real time, and provides real-time feedback; when using line temperature measurement, a target temperature measurement line segment is drawn in the temperature field distribution image, the line segment can cover any continuous part of the device, the device continuously collects temperature along the line segment, obtains the temperature data of each point on the line segment, and generates a line segment temperature distribution curve; when using area temperature measurement, a target temperature measurement area is selected in the temperature field distribution image, the target temperature measurement area covers a designated part of a single device or multiple devices, the infrared dual-view thermal imaging device collects temperature data at all points in the area, statistically analyzes the temperature data in the area, and generates an area temperature distribution heat map; the temperature measurement method can be flexibly switched according to monitoring needs.

[0139] In some embodiments, the real-time monitoring of the acquisition area corresponding to the temperature field distribution, tracking and displaying the highest, lowest, and average temperature values ​​within the acquisition area, includes: receiving temperature field distribution data transmitted by the infrared dual-view thermal imaging device in real time; filtering and statistically analyzing all temperature data within the acquisition area in real time; automatically identifying the highest temperature value and its corresponding location, the lowest temperature value and its corresponding location within the acquisition area, and simultaneously calculating the average temperature of all temperature measurement points within the acquisition area; associating the highest, lowest, and average temperature values ​​with the acquisition area identifier and acquisition time, and displaying them synchronously on the background display interface and the dual-view fused image, updating the temperature data in real time; and re-statistically updating the displayed values ​​when the temperature data within the acquisition area changes, ensuring that operators can monitor the temperature changes in the acquisition area in real time.

[0140] In some embodiments, the online real-time monitoring of the temperature field of the high-voltage equipment in the substation based on the fused dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method includes: building a centralized monitoring platform to integrate and display the fused dual-view image, key point temperature values, temperature field distribution data, and various temperature measurement statistics, and dividing the display interface according to monitoring zones; comparing the real-time collected temperature data with the preset normal operating temperature threshold of the equipment, and automatically triggering a prompt signal when the key point temperature value and the highest temperature value exceed the threshold range; and storing the dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method to form a historical database, thereby realizing comprehensive and real-time online monitoring of the temperature field of the high-voltage equipment in the substation.

[0141] In some embodiments, the method further includes: embedding a machine learning-based intelligent diagnostic algorithm; pre-collecting temperature data and dual-view image data of the high-voltage power supply equipment in the booster station under different operating conditions and different fault types; constructing an equipment fault sample database; the sample data includes normal operation samples, slightly overheated samples, severely overheated samples, and temperature and image features corresponding to different types of faults; inputting real-time collected fused dual-view images, key point temperature values, temperature field distribution data, and temperature measurement statistics into the intelligent diagnostic algorithm; by comparing the real-time data with the sample features in the fault sample database, extracting temperature change patterns and image anomaly features from the real-time data, identifying the current operating status of the equipment, and determining whether there is a potential overheating hazard and its severity; simultaneously, combining the equipment's historical operating temperature data, using the algorithm to predict the equipment temperature change trend, generating an equipment operating status diagnostic report and maintenance suggestions; and pushing the diagnostic results and maintenance suggestions to the operator's terminal, thereby achieving early warning and intelligent diagnosis of equipment faults and improving the initiative and effectiveness of monitoring.

[0142] It should be noted that those skilled in the art will understand that, for the sake of convenience and brevity, the specific working process of the online temperature field monitoring system and its modules for the high-voltage equipment in the booster station described above can be found in the corresponding contents of the various embodiments of the online temperature field monitoring method for the high-voltage equipment in the booster station, and will not be repeated here.

[0143] The aforementioned online monitoring method for the temperature field of high-voltage equipment in booster stations can be implemented as a computer program, which can be used in various ways, such as... Figure 3 It runs on the device shown.

[0144] Please see Figure 4 , Figure 4 This is a schematic block diagram of the structure of a computer device provided in an embodiment of this application. The computer device includes a processor, a memory, and a network interface connected via a device bus, wherein the memory may include a storage medium and internal memory.

[0145] The storage medium can store operating devices and computer programs. The computer program includes program instructions that, when executed, cause the processor to perform any online temperature field monitoring method for the high-voltage equipment in the booster station.

[0146] The processor provides computing and control capabilities, supporting the operation of the entire computer device.

[0147] The internal memory provides an environment for the execution of computer programs stored in non-volatile storage media. When the computer program is executed by the processor, it enables the processor to execute any online monitoring method for the temperature field of high-voltage equipment in a booster station.

[0148] This network interface is used for network communication, such as sending assigned tasks. Those skilled in the art will understand that... Figure 4 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the terminal to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0149] It should be understood that the processor can be a Central Processing Unit (CPU), but it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among these, a general-purpose processor can be a microprocessor or any conventional processor.

[0150] In one embodiment, the processor is configured to run a computer program stored in memory to perform the following steps:

[0151] A survey was conducted on the high-voltage power supply equipment within the substation to determine the installation locations of multiple sets of infrared dual-view thermal imaging devices. These devices were then fixedly installed on suitable fireproof walls or pillars within the substation, ensuring that each monitoring angle of the infrared dual-view thermal imaging device could cover all target high-voltage equipment within its assigned area. The high-voltage power supply equipment included at least one of the following: disconnecting switches, busbars, bushings, circuit breakers, instrument transformers, capacitors, and reactors.

[0152] Multiple infrared dual-view thermal imaging devices are activated to simultaneously acquire visible light images and infrared thermal images of high-voltage power supply equipment within their respective monitoring areas. The visible light images and infrared thermal images of the same monitoring area and at the same time acquired by each infrared dual-view thermal imaging device are received synchronously. The dual-view fusion processing method is used to fuse the infrared thermal image and the visible light image in the same field of view to obtain a dual-view image, so that the temperature abnormal area in the infrared thermal image corresponds precisely to the actual location of the equipment in the visible light image.

[0153] The infrared dual-view thermal imaging device acquires the key point temperature values ​​and temperature field distribution of high-voltage power supply equipment within its respective monitoring area in real time. The key point temperature values ​​are collected from the connection parts, moving contacts, and stationary contacts of the high-voltage power supply equipment, which are prone to heat generation. The overall temperature field distribution covers the entire visible area of ​​the equipment. The temperature field distribution is obtained through point temperature measurement, line temperature measurement, and area temperature measurement. The collection area corresponding to the temperature field distribution is monitored in real time, and the highest, lowest, and average temperature values ​​within the collection area are tracked and displayed. Based on the fused dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method, online real-time monitoring of the temperature field of the high-voltage equipment in the substation is achieved.

[0154] In some embodiments, the surveying of high-voltage power supply equipment within the substation to determine the installation locations of multiple infrared dual-view thermal imaging devices includes: adopting a zonal survey mode, dividing the substation into several monitoring zones according to the distribution density and equipment type of the high-voltage power supply equipment, with at least one infrared dual-view thermal imaging device deployed in each monitoring zone; locating each high-voltage power supply device in each monitoring zone, recording the installation height, distribution location, and surrounding obstacles of each device; determining the specific installation coordinates of each infrared dual-view thermal imaging device through simulation monitoring, based on the monitoring range and viewing angle of the infrared dual-view thermal imaging device, ensuring that the monitoring ranges of infrared dual-view thermal imaging devices in adjacent monitoring zones overlap appropriately to avoid monitoring blind spots; and simultaneously considering the distribution of strong electromagnetic fields within the substation, avoiding areas with concentrated strong electromagnetic interference to ensure the stability of the data collected by the infrared dual-view thermal imaging devices.

[0155] In some embodiments, the step of fixing multiple sets of infrared dual-view thermal imaging devices on suitable fireproof partitions or columns within the substation to ensure that the monitoring angle of the infrared dual-view thermal imaging devices can cover all target high-voltage equipment within the area under their responsibility includes: installing suitable fixed brackets on the corresponding fireproof partitions or columns according to the determined installation coordinates of each set of infrared dual-view thermal imaging devices; adjusting the tilt angle and height of the brackets so that the lens of the device faces the core high-voltage power supply equipment within the monitoring zone; after installation, starting the infrared dual-view thermal imaging devices for trial acquisition; checking whether each target high-voltage equipment within the monitoring zone can be clearly seen within the monitoring angle according to the monitoring images of the infrared dual-view thermal imaging devices; fine-tuning the bracket angle or device position for areas not covered by the view; testing the acquisition effect of the infrared dual-view thermal imaging devices under different ambient light conditions to ensure that the infrared dual-view thermal imaging devices can clearly capture equipment images and temperature data in both strong and weak light environments; fixing the device position and ensuring proper installation and reinforcement.

[0156] In some embodiments, the dual-view fusion processing method, which fuses infrared thermal images and visible light images within the same field of view to obtain a dual-view image, ensures that the temperature anomaly area in the infrared thermal image accurately corresponds to the actual location of the device in the visible light image. This includes: preprocessing the visible light image and infrared thermal image received synchronously in the same monitoring area at the same time, enhancing blurred areas to ensure image clarity; extracting the device contour features in the visible light image and the temperature distribution features in the infrared thermal image, establishing the coordinate correspondence between the two types of images, and achieving alignment within the same field of view; using a pixel-level fusion algorithm to fuse the temperature grayscale information of the infrared thermal image with the device detail information of the visible light image to generate a dual-view fused image; highlighting the temperature anomaly area in the fused image while retaining the specific location and appearance details of the device in the visible light image, allowing direct location of the specific device part corresponding to the temperature anomaly area through the fused image, thus achieving rapid and accurate fault location.

[0157] In some embodiments, the real-time online acquisition of key point temperature values ​​and temperature field distribution of high-voltage power supply equipment within each monitoring area using an infrared dual-view thermal imaging device includes: marking the easily heated key points of the high-voltage power supply equipment within each monitoring area, including equipment connection parts, moving contacts, and stationary contacts; assigning a unique identifier and acquisition priority to each key point; activating the fixed-point acquisition mode of the infrared dual-view thermal imaging device, whereby the device automatically focuses on each key point according to the preset key point identifier, and acquires and transmits the temperature value of each key point in real time; activating the full-domain acquisition mode to perform a comprehensive scan of the high-voltage power supply equipment within the monitoring area, acquiring the overall temperature data of the equipment, and generating a temperature field distribution image covering the entire visible area of ​​the equipment; and associating and storing the acquired key point temperature values ​​with the temperature field distribution image to ensure that the temperature data of each key point can be mapped to a specific location in the temperature field distribution image.

[0158] In some embodiments, the temperature field distribution is obtained through any one of point temperature measurement, line temperature measurement, and area temperature measurement, including: when using point temperature measurement, a target temperature measurement point is selected in the temperature field distribution image, the infrared dual-view thermal imaging device automatically focuses on the temperature measurement point, collects the temperature data of the point in real time, and provides real-time feedback; when using line temperature measurement, a target temperature measurement line segment is drawn in the temperature field distribution image, the line segment can cover any continuous part of the device, the device continuously collects temperature along the line segment, obtains the temperature data of each point on the line segment, and generates a line segment temperature distribution curve; when using area temperature measurement, a target temperature measurement area is selected in the temperature field distribution image, the target temperature measurement area covers a designated part of a single device or multiple devices, the infrared dual-view thermal imaging device collects temperature data at all points in the area, statistically analyzes the temperature data in the area, and generates an area temperature distribution heat map; the temperature measurement method can be flexibly switched according to monitoring needs.

[0159] In some embodiments, the real-time monitoring of the acquisition area corresponding to the temperature field distribution, tracking and displaying the highest, lowest, and average temperature values ​​within the acquisition area, includes: receiving temperature field distribution data transmitted by the infrared dual-view thermal imaging device in real time; filtering and statistically analyzing all temperature data within the acquisition area in real time; automatically identifying the highest temperature value and its corresponding location, the lowest temperature value and its corresponding location within the acquisition area, and simultaneously calculating the average temperature of all temperature measurement points within the acquisition area; associating the highest, lowest, and average temperature values ​​with the acquisition area identifier and acquisition time, and displaying them synchronously on the background display interface and the dual-view fused image, updating the temperature data in real time; and re-statistically updating the displayed values ​​when the temperature data within the acquisition area changes, ensuring that operators can monitor the temperature changes in the acquisition area in real time.

[0160] In some embodiments, the online real-time monitoring of the temperature field of the high-voltage equipment in the substation based on the fused dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method includes: building a centralized monitoring platform to integrate and display the fused dual-view image, key point temperature values, temperature field distribution data, and various temperature measurement statistics, and dividing the display interface according to monitoring zones; comparing the real-time collected temperature data with the preset normal operating temperature threshold of the equipment, and automatically triggering a prompt signal when the key point temperature value and the highest temperature value exceed the threshold range; and storing the dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method to form a historical database, thereby realizing comprehensive and real-time online monitoring of the temperature field of the high-voltage equipment in the substation.

[0161] In some embodiments, the method further includes: embedding a machine learning-based intelligent diagnostic algorithm; pre-collecting temperature data and dual-view image data of the high-voltage power supply equipment in the booster station under different operating conditions and different fault types; constructing an equipment fault sample database; the sample data includes normal operation samples, slightly overheated samples, severely overheated samples, and temperature and image features corresponding to different types of faults; inputting real-time collected fused dual-view images, key point temperature values, temperature field distribution data, and temperature measurement statistics into the intelligent diagnostic algorithm; by comparing the real-time data with the sample features in the fault sample database, extracting temperature change patterns and image anomaly features from the real-time data, identifying the current operating status of the equipment, and determining whether there is a potential overheating hazard and its severity; simultaneously, combining the equipment's historical operating temperature data, using the algorithm to predict the equipment temperature change trend, generating an equipment operating status diagnostic report and maintenance suggestions; and pushing the diagnostic results and maintenance suggestions to the operator's terminal, thereby achieving early warning and intelligent diagnosis of equipment faults and improving the initiative and effectiveness of monitoring.

[0162] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, causes the processor to implement the steps of the online monitoring method for the temperature field of high-voltage equipment in a booster station as provided in any embodiment of this application.

[0163] The computer-readable storage medium may be an internal storage unit of the computer device described in the foregoing embodiments, such as the hard disk or memory of the computer device. The computer-readable storage medium may also be an external storage device of the computer device, such as a plug-in hard disk, SmartMedia Card (SMC), Secure Digital (SD) card, or Flash Card equipped on the computer device.

[0164] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for online monitoring of the temperature field of high-voltage equipment in a booster station, characterized in that, include: A survey was conducted on the high-voltage power supply equipment within the substation to determine the installation locations of multiple sets of infrared dual-view thermal imaging devices. These devices were then fixedly installed on suitable fireproof walls or pillars within the substation, ensuring that the monitoring angle of each device could cover all target high-voltage equipment within its assigned area. The high-voltage power supply equipment included at least one of the following: disconnecting switches, busbars, bushings, circuit breakers, instrument transformers, capacitors, and reactors. Multiple infrared dual-view thermal imaging devices are activated to simultaneously acquire visible light images and infrared thermal images of high-voltage power supply equipment within their respective monitoring areas. The visible light images and infrared thermal images of the same monitoring area and at the same time acquired by each infrared dual-view thermal imaging device are received synchronously. The dual-view fusion processing method is used to fuse the infrared thermal image and the visible light image in the same field of view to obtain a dual-view image, so that the temperature abnormal area in the infrared thermal image corresponds precisely to the actual location of the equipment in the visible light image. The infrared dual-view thermal imaging device acquires the temperature values ​​and temperature field distribution of key points of high-voltage power supply equipment within its respective monitoring area in real time. This includes: marking the easily heated key points of high-voltage power supply equipment in each monitoring area, including equipment connection parts, moving contacts, and stationary contacts, and assigning a unique identifier and acquisition priority to each key point; activating the fixed-point acquisition mode of the infrared dual-view thermal imaging device, which automatically focuses on each key point according to the preset key point identifiers, and acquires and transmits the temperature value of each key point in real time; activating the full-area acquisition mode to comprehensively scan the high-voltage power supply equipment within the monitoring area, acquiring the overall temperature data of the equipment, and generating a temperature field distribution image covering the entire visible area of ​​the equipment; and correlating the acquired key point temperature values ​​with the temperature field distribution image. The system uses linked storage to ensure that the temperature data of each key point can be mapped to a specific location in the temperature field distribution image. Key point temperature values ​​are collected from easily heated locations such as connection points, moving contacts, and stationary contacts of the high-voltage power supply equipment. The overall temperature field distribution covers the entire visible area of ​​the equipment. The temperature field distribution is obtained through point temperature measurement, line temperature measurement, or area temperature measurement. The collected areas corresponding to the temperature field distribution are monitored in real time, tracking and displaying the highest, lowest, and average temperature values ​​within the collected area. Based on the fused dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method, online real-time monitoring of the temperature field of the high-voltage equipment in the substation is achieved.

2. The method according to claim 1, characterized in that, The survey of the high-voltage power supply equipment within the substation, determining the installation locations of multiple infrared dual-view thermal imaging devices, includes: The substation is divided into several monitoring zones according to the distribution density and equipment type of the high-voltage power supply equipment, and at least one infrared dual-view thermal imaging device is deployed in each monitoring zone. The high-voltage power supply equipment in each monitoring zone was located one by one, and the installation height, distribution location and surrounding obstacles of each high-voltage power supply equipment were recorded. By combining the monitoring range and viewing angle of the infrared dual-view thermal imaging device, and through simulation monitoring, the specific installation coordinates of each infrared dual-view thermal imaging device are determined to ensure that the monitoring ranges of infrared dual-view thermal imaging devices in adjacent monitoring zones overlap appropriately and to avoid monitoring blind spots. At the same time, taking into account the distribution of strong electromagnetic areas within the substation, the installation location of the infrared dual-view thermal imaging device is avoided in areas with concentrated strong electromagnetic interference to ensure the stability of the data collected by the infrared dual-view thermal imaging device.

3. The method according to claim 1, characterized in that, The method involves fixing multiple sets of infrared dual-view thermal imaging devices onto suitable fireproof partitions or pillars within the substation, ensuring that the monitoring angle of the infrared dual-view thermal imaging devices can cover all target high-voltage equipment within the area under their responsibility, including: Based on the determined installation coordinates of each infrared dual-view thermal imaging device, install suitable fixed brackets on the corresponding fireproof partition or column, and adjust the tilt angle and height of the brackets so that the lens of the device faces the core high-voltage power supply equipment in the monitoring zone. After installation, start the infrared dual-view thermal imaging device for trial acquisition. Based on the monitoring screen of the infrared dual-view thermal imaging device, check whether each target high-voltage device in the monitoring zone can be clearly seen in the monitoring view. For areas not covered by the view, fine-tune the bracket angle or device position. Test the acquisition effect of the infrared dual-view thermal imaging device under different ambient lighting conditions to ensure that the infrared dual-view thermal imaging device can clearly capture equipment images and temperature data in both strong light and low light environments. Fix the device position and perform installation and reinforcement.

4. The method according to claim 1, characterized in that, The method employs dual-view fusion processing to fuse infrared thermal images and visible light images within the same field of view, thereby obtaining dual-view images. This ensures that temperature anomaly areas in the infrared thermal image accurately correspond to the actual location of the device in the visible light image. This includes: Preprocessing is performed on the visible light image and infrared thermal image received synchronously from the same monitoring area and at the same time, and the blurred areas are enhanced to ensure image clarity; the device outline features in the visible light image and the temperature distribution features in the infrared thermal image are extracted, and the coordinate correspondence between the two types of images is established to achieve alignment within the same field of view. A pixel-level fusion algorithm is used to fuse the temperature grayscale information of infrared thermal images with the device detail information of visible light images to generate a dual-view fused image. In the fused image, the temperature abnormality area is highlighted and marked, while the specific location and appearance details of the device in the visible light image are preserved. The specific part of the device corresponding to the temperature abnormality area can be directly located through the fused image, so as to achieve rapid and accurate location of the fault point.

5. The method according to claim 1, characterized in that, The temperature field distribution is obtained through any one of point temperature measurement, line temperature measurement, and area temperature measurement, including: When point temperature measurement is used, the target temperature measurement point is selected in the temperature field distribution image, and the infrared dual-view thermal imaging device automatically focuses on the temperature measurement point, collects the temperature data of the point in real time and provides real-time feedback. When using line temperature measurement, the target temperature measurement line segment is drawn in the temperature field distribution image. The line segment can cover any continuous part of the equipment. The device continuously collects temperature along the line segment, obtains the temperature data of each point on the line segment, and generates the line segment temperature distribution curve. When using the regional temperature measurement method, the target temperature measurement area is selected in the temperature field distribution image. The target temperature measurement area covers the designated parts of a single device or multiple devices. The infrared dual-view thermal imaging device collects the temperature of all points in the area, counts the temperature data in the area, and generates a regional temperature distribution heat map. The temperature measurement method can be flexibly switched according to the monitoring needs.

6. The method according to claim 1, characterized in that, The real-time monitoring of the temperature field distribution corresponding to the acquisition area, tracking and displaying the highest temperature value, lowest temperature value, and average temperature value within the acquisition area, includes: It receives temperature field distribution data transmitted by an infrared dual-view thermal imaging device in real time and performs real-time filtering and statistics on all temperature data within the acquisition area. It automatically identifies the highest temperature value and corresponding location within the collection area, as well as the lowest temperature value and corresponding location, and simultaneously calculates the average temperature of all temperature measurement points within the collection area. The highest, lowest, and average temperature values ​​are associated with the data acquisition area identifier and acquisition time, and are simultaneously displayed on the background display interface and the dual-view fusion image, updating the temperature data in real time. When the temperature data in the collection area changes, the displayed values ​​are recalculated and updated to ensure that operators can monitor the temperature changes in the collection area in real time.

7. The method according to claim 1, characterized in that, The method of achieving online real-time monitoring of the temperature field of the high-voltage equipment in the booster station based on the fused dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method includes: A centralized monitoring platform was built to integrate and display the fused dual-view images, key point temperature values, temperature field distribution data, and various temperature measurement statistics, with the display interface divided according to monitoring zones. The system compares the real-time collected temperature data with the preset normal operating temperature threshold of the equipment. When the temperature value of key points and the maximum temperature value exceed the threshold range, an alert signal is automatically triggered. The system stores dual-view images, key point temperature values, temperature field distribution data, and the maximum, minimum, and average temperature values ​​corresponding to each temperature measurement method to form a historical database, thereby achieving comprehensive, real-time online monitoring of the temperature field of the high-voltage equipment in the booster station.

8. The method according to claim 1, characterized in that, The method further includes: Embedding machine learning-based intelligent diagnostic algorithms, temperature data and dual-view image data of high-voltage power supply equipment in the booster station under different operating conditions and different fault types are collected in advance to build a fault sample database. The sample data includes normal operation samples, slight overheating samples, severe overheating samples, and temperature and image features corresponding to different types of faults. The real-time collected fused dual-view image, key point temperature value, temperature field distribution data and temperature measurement statistics are input into the intelligent diagnostic algorithm. By comparing the real-time data with the sample features in the fault sample database, the algorithm extracts the temperature change pattern and image anomaly features in the real-time data, identifies the current operating status of the equipment, and determines whether there is an overheating hazard and the severity of the hazard. Simultaneously, by combining historical operating temperature data of the equipment, algorithms are used to predict the temperature change trend of the equipment, generate equipment operation status diagnostic reports and maintenance suggestions, and push the diagnostic results and maintenance suggestions to the operator's terminal, so as to realize early warning and intelligent diagnosis of equipment failures and improve the initiative and effectiveness of monitoring.

9. An online monitoring system for the temperature field of high-voltage equipment in a booster station, characterized in that, The method applied to any one of claims 1-8 comprises: The equipment survey unit is used to survey the high-voltage power supply equipment within the substation, determine the installation locations of multiple sets of infrared dual-view thermal imaging devices, and fix the multiple sets of infrared dual-view thermal imaging devices on suitable fireproof partitions or columns within the substation to ensure that the monitoring angle of the infrared dual-view thermal imaging devices can cover all target high-voltage equipment within the area under their responsibility; the high-voltage power supply equipment includes at least one of the following: disconnecting switches, busbars, bushings, circuit breakers, instrument transformers, capacitors, and reactors; The device start-up unit is used to start multiple infrared dual-view thermal imaging devices to simultaneously acquire visible light images and infrared thermal images of high-voltage power supply equipment in their respective monitoring areas. It synchronously receives the visible light images and infrared thermal images of the same monitoring area and at the same time acquired by each infrared dual-view thermal imaging device, and uses a dual-view fusion processing method to fuse the infrared thermal image and the visible light image in the same field of view to obtain a dual-view image, so that the temperature abnormal area in the infrared thermal image corresponds precisely to the actual location of the equipment in the visible light image. The monitoring completion unit is used to acquire, in real time online, the temperature values ​​and temperature field distribution of key points of high-voltage power supply equipment within its respective monitoring area using an infrared dual-view thermal imaging device. This includes: marking the easily heated key points of the high-voltage power supply equipment within each monitoring area, including equipment connection parts, moving contacts, and stationary contacts; assigning a unique identifier and acquisition priority to each key point; activating the fixed-point acquisition mode of the infrared dual-view thermal imaging device, where the device automatically focuses on each key point according to the preset key point identifiers, acquiring and transmitting the temperature value of each key point in real time; activating the full-area acquisition mode, comprehensively scanning the high-voltage power supply equipment within the monitoring area, acquiring overall temperature data of the equipment, and generating a temperature field distribution image covering the entire visible area of ​​the equipment; and comparing the acquired key point temperature values ​​with the temperature field distribution map. The system performs associative storage to ensure that the temperature data of each key point can be mapped to a specific location in the temperature field distribution image. Key point temperature values ​​are collected from easily heated critical locations such as connection points, moving contacts, and stationary contacts of the high-voltage power supply equipment. The overall temperature field distribution covers the entire visible area of ​​the equipment. The temperature field distribution is obtained through point temperature measurement, line temperature measurement, or area temperature measurement. The collected areas corresponding to the temperature field distribution are monitored in real time, tracking and displaying the highest, lowest, and average temperature values ​​within the collected area. Based on the fused dual-view image, key point temperature values, temperature field distribution data, and the highest, lowest, and average temperature values ​​corresponding to each temperature measurement method, online real-time monitoring of the temperature field of the high-voltage equipment in the booster station is achieved.

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