Bonding strength inspection apparatus and bonding system

Abstract

The present disclosure relates to a bonding strength inspection apparatus and a bonding system capable of inspecting the bonding strength of a bonding portion without destroying an inspection target. The present disclosure provides a bond strength inspection apparatus including: a roughness measuring portion configured to measure a roughness of a bonding portion where a base member and a bonding member are bonded to each other; and a processor configured to determine a bonding strength of the bonding portion based on the roughness.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0138796, filed on October 11, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] This invention relates to a bonding strength testing device and a bonding system for inspecting the bonding strength of joints. The invention specifically relates to bonding systems. Background Technology

[0004] While primary batteries are not designed to be (re)charged, secondary batteries (also known as rechargeable batteries) are designed to be discharged and recharged. Among secondary batteries, low-capacity secondary batteries are widely used in portable small electronic devices such as smartphones, feature phones, laptops, digital cameras, and camcorders, while high-capacity secondary batteries are widely used as power sources for electric motors in hybrid and electric vehicles, and for storing electricity (e.g., household and / or utility-scale power storage). A secondary battery may include positive and / or negative electrodes, an electrode assembly including the positive or negative electrodes, a housing for receiving the electrode assembly, and a cover assembly connected to an opening in the housing to seal the housing.

[0005] The cover assembly includes an exhaust vent, a lower cover, and a sub-plate located below the lower cover and attached to the exhaust vent. If the components are not properly assembled in the cover assembly, the cover assembly may not be able to completely seal the housing.

[0006] This background section is intended to provide a general understanding of the background of this disclosure, and therefore may contain information that does not constitute related (or prior art). Summary of the Invention

[0007] Embodiments of this disclosure provide a bonding strength inspection device capable of inspecting the bonding strength of a joint and / or a bonding system including the bonding strength inspection device.

[0008] Embodiments of this disclosure provide a bonding strength inspection device and / or a bonding system including the bonding strength inspection device for managing the quality of the bonding between the exhaust element and the subplate in a cover assembly.

[0009] Embodiments of this disclosure provide a bonding strength testing apparatus and / or a bonding system including the bonding strength testing apparatus to perform non-destructive testing without damaging the bonding portion during the non-destructive testing.

[0010] Embodiments of this disclosure provide a bonding strength testing device, which includes: a roughness measuring unit for measuring the roughness of the joint between a base component and a bonding component, and a processor for determining the bonding strength of the joint based on the measured roughness.

[0011] Embodiments of this disclosure provide a bonding strength inspection apparatus, comprising: a roughness measuring unit configured to measure the roughness of a bonding joint, wherein a base member and a bonding member are bonded to each other at the bonding joint; and a processor configured to determine the bonding strength of the bonding joint based on the roughness.

[0012] In some implementations, the processor is configured to determine the ratio of the bonding depth of the joint to the thickness of the base member based on the roughness, and wherein the processor is configured to determine the bonding strength based on the ratio.

[0013] In some implementations, the processor is configured to determine that the joint is in a normal engagement state when the ratio is within a predetermined range.

[0014] In some embodiments, the processor is configured to determine that the joint is in an underbonded state when the ratio is less than a predetermined range, and wherein the processor is configured to determine that the joint is in an overbonded state when the ratio is greater than a predetermined range.

[0015] In some embodiments, the bonding strength testing device further includes a memory configured to store data on bonding strength determined based on a ratio, wherein a processor is configured to set a predetermined range based on the data.

[0016] In some implementations, the predetermined range is in the range of about 10% to about 50%.

[0017] In some implementations, the roughness includes the ten-point average roughness (Rz) of the joint.

[0018] Embodiments of this disclosure provide a bonding system, including bonding equipment for bonding a bonding member to a base member and bonding strength inspection equipment for determining the bonding strength of the bonding joint, wherein the base member and the bonding member are bonded at the bonding joint, and the bonding strength inspection equipment includes a roughness measuring unit for measuring the roughness of the bonding joint and a processor for determining the bonding strength of the bonding joint based on the measured roughness.

[0019] Embodiments of this disclosure provide a bonding system, including: a bonding device configured to bond a bonding member to a base member; and a bonding strength checking device configured to determine the bonding strength of a bonding portion, wherein the base member and the bonding member are bonded to each other at the bonding portion, wherein the bonding strength checking device includes: a roughness measuring unit configured to measure the roughness of the bonding portion; and a processor configured to determine the bonding strength based on the roughness.

[0020] In some implementations, the processor is configured to determine the ratio of the bonding depth of the joint to the thickness of the base member based on the roughness, and wherein the processor is configured to determine the bonding strength based on the ratio.

[0021] In some implementations, the processor is configured to determine that the joint is in a normal engagement state when the ratio is within a predetermined range.

[0022] In some embodiments, the processor is configured to determine that the joint is in an underbonded state when the ratio is less than a predetermined range, and wherein the processor is configured to determine that the joint is in an overbonded state when the ratio is greater than a predetermined range.

[0023] In some embodiments, the bonding strength testing device further includes a memory configured to store data on bonding strength determined based on a ratio, wherein a processor is configured to set a predetermined range based on the data.

[0024] In some implementations, the predetermined range is in the range of about 10% to about 50%.

[0025] In some implementations, the roughness includes the ten-point average roughness (Rz) of the joint.

[0026] In some embodiments, the base member includes a first surface facing the bonding member and a second surface located on the opposite side of the first surface, wherein the bonding device is configured to apply heat or pressure to the second surface to bond the first surface and the bonding member.

[0027] In some embodiments, the roughness measuring unit is configured to measure the roughness on the second surface.

[0028] In some embodiments, the bonding device is configured to bond the base component and the bonding component via friction welding.

[0029] In some implementations, the bonding device is configured to control the output power of the bonding base member and the bonding member based on the bonding strength.

[0030] Embodiments of this disclosure provide a bonding system for a cover assembly, the cover assembly including: an upper cover; an exhaust element provided below the upper cover; a lower cover mounted below the exhaust element and having one or more holes formed therein, the one or more holes being exposed downward through at least a portion of the exhaust element; an insulator between the exhaust element and the lower cover; and a sub-plate provided below the lower cover and bonded to the exhaust element through holes, the bonding system including: bonding equipment for bonding the sub-plate and the exhaust element; and bonding strength testing equipment for measuring the roughness of the bonding portion and determining the bonding strength of the bonding portion based on the measured roughness, the sub-plate and the exhaust element being bonded at the bonding portion.

[0031] Embodiments of this disclosure provide a bonding system for a cover assembly, the cover assembly including: an upper cover; an exhaust element disposed below the upper cover; a lower cover disposed below the exhaust element and having one or more holes that expose at least a portion of the exhaust element downwards; an insulator disposed between the exhaust element and the lower cover; and a sub-plate disposed below the lower cover and bonded to the exhaust element via one or more holes. The bonding system includes: a bonding device configured to bond the sub-plate and the exhaust element; and a bonding strength checking device configured to measure the roughness of the bonding joint and to determine the bonding strength of the bonding joint based on the roughness, wherein the sub-plate and the exhaust element are bonded at the bonding joint.

[0032] In some embodiments, the bonding strength testing equipment is configured to determine the ratio of the bonding depth of the joint to the thickness of the base member based on the roughness, and is configured to determine the bonding strength based on the ratio. Attached Figure Description

[0033] The accompanying drawings illustrate embodiments of the present disclosure and further describe a detailed description of the present disclosure, as well as its aspects and features. Therefore, this disclosure should not be construed as limited to the drawings.

[0034] Figure 1 This is a schematic cross-sectional view illustrating a cylindrical secondary battery according to an embodiment of the present disclosure;

[0035] Figure 2 This is a schematic cross-sectional view illustrating a cover assembly according to an embodiment of the present disclosure;

[0036] Figure 3 This is a schematic bottom view illustrating a cover assembly according to an embodiment of the present disclosure;

[0037] Figure 4 This is a schematic block diagram illustrating the components of a combined system according to an embodiment of the present disclosure;

[0038] Figure 5 This is a schematic block diagram illustrating the components of a bonding strength testing device according to an embodiment of the present disclosure;

[0039] Figure 6 This is a flowchart describing the operation of a bonding strength testing device according to an embodiment of the present disclosure;

[0040] Figure 7 This is an enlarged view illustrating the joint depth of the joint in the cover assembly according to an embodiment of the present disclosure;

[0041] Figure 8 The roughness of the joint, measured according to an embodiment of the present disclosure, is shown; and

[0042] Figure 9 This illustrates the bond strength according to an embodiment of the present disclosure, based on the ratio of the bond depth to the thickness of the base member. Detailed Implementation

[0043] Embodiments of this disclosure are described in detail with reference to the accompanying drawings. The terms or words used in this specification and claims should not be construed as having a general or dictionary meaning, but rather as having the meaning and concept consistent with the technical idea of ​​this disclosure, the principle being that the inventor can be his / her own lexicographer to appropriately define the concepts of the terms to best describe his / her invention.

[0044] The embodiments described in this specification and the configurations shown in the accompanying drawings are only some embodiments of this disclosure and do not represent all the technical spirit, aspects, and features of this disclosure. Accordingly, it should be understood that various equivalent solutions and modifications may exist at the time of filing this application, which may replace or modify the embodiments described herein.

[0045] It will be understood that when an element or layer is referred to as being "in," "connected to," or "linked to" another element or layer, it can be directly, connected to, or linked to the other element or layer, or one or more intermediary elements or layers may be present. When an element or layer is referred to as being "directly in," "directly connected to," or "directly linked to" another element or layer, no intermediary element or layer is present. For example, when a first element is described as being "linked" or "connected" to a second element, the first element can be directly linked to or connected to the second element, or the first element can be indirectly linked to or connected to the second element via one or more intermediary elements.

[0046] In the figures, the dimensions of various elements, layers, etc., may be enlarged for clarity. The same reference numerals label the same elements. As used herein, the term “and / or” includes any and all combinations of one or more of the associated enumerated items. Furthermore, the use of “may” when describing embodiments of this disclosure refers to “one or more embodiments of this disclosure.” When expressions such as “at least one of” and “any one” are used before a list of elements, the entire list of elements is modified, not individual elements in the list. When phrases such as “at least one of A, B, and C,” “at least one of A, B, or C,” “at least one selected from the group of A, B, and C,” or “at least one selected from A, B, and C” are used to label a list of elements A, B, and C, the phrase may refer to A, B, and C, such as A, B, C, A and B, A and C, B and C, or A and B and C, any and all suitable combinations or subsets. As used herein, the term “use” and its variations may be considered synonymous with the term “utilize” and its variations, respectively. As used herein, the terms “substantially,” “about,” and similar terms are used as approximations and not as terms of degree, and are intended to explain the inherent variations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art.

[0047] It will be understood that although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion.

[0048] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” are used herein to describe the relationship of an element or feature to another element or feature illustrated in the figures. It will be understood that, in addition to the orientation depicted in the figures, spatial relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features would be oriented as “above” or “above” other elements or features. Therefore, the term “below” can encompass both the above and below orientations. The device may be oriented in other ways (rotated 90 degrees or otherwise), and the spatial relative descriptors used herein should be interpreted accordingly.

[0049] The terminology used herein is for describing embodiments of this disclosure and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular forms “a” and “an” as used herein also include the plural forms. It will be further understood that when the terms “comprising” and variations thereof and / or “including” are used in this specification, it indicates the presence of the described features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0050] Furthermore, any numerical range disclosed and / or set forth herein is intended to include all subranges with the same numerical precision covered within the set forth range. For example, the range “1.0 to 10.0” is intended to include all subranges between the set forth minimum value of 1.0 and the set forth maximum value of 10.0 (and inclusive), i.e., a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as 2.4 to 7.6. Any maximum numerical limit set forth herein is intended to include all lower numerical limits contained herein, and all minimum numerical limits set forth in this specification are intended to include all higher numerical limits contained herein. Accordingly, the applicant reserves the right to amend this specification (including the claims) to expressly set forth any subranges included within the range expressly set forth herein. All such ranges are intended to be inherently described in this specification, and therefore, any amendment to expressly set forth any such subrange will comply with the requirements of patent law.

[0051] Referring to two compared elements, features, etc., as “identical” may mean that they are “substantially identical.” Therefore, the phrase “substantially identical” may include cases where the deviation is considered low in the field, such as a deviation of less than 5%. Additionally, when some parameters are described as uniform in a given region, this may mean that they are uniform in terms of average value.

[0052] Throughout the instruction manual, unless otherwise stated, each element may be singular or plural.

[0053] Placing any element "above (or below)" or "on (below)" another element may mean that any element can be configured to contact the upper (or lower) surface of the element, and that another element can be inserted between the element and any element positioned on (below) the element.

[0054] Additionally, it will be understood that when a component is referred to as a “link,” “connect,” or “attached” to another component, the components can be directly “connected,” “linked,” or “attached” to each other, or another component can be “inserted” between the components.

[0055] Throughout the instruction manual, unless otherwise stated, when “A and / or B” is mentioned, it means A, B, or A and B. That is, “and / or” includes any or all combinations of the listed items. Unless otherwise indicated, when “C to D” is mentioned, it means C and below D.

[0056] The terminology used herein is for describing embodiments of this disclosure and is not intended to limit this disclosure.

[0057] Figure 1 This is a schematic cross-sectional view of a cylindrical secondary battery.

[0058] like Figure 1 As shown in the diagram, a cylindrical lithium-ion secondary battery 100 may include a cylindrical housing 50, an electrode assembly 40, and a cover assembly 60. The cylindrical lithium-ion secondary battery 100 may include a center pin (not shown). Because the cover assembly 60 performs current blocking, it can be referred to as a current blocking device.

[0059] The cylindrical housing 50 may include a base portion having a substantially circular shape and cylindrical sidewalls extending upwards from the circumference of the base portion for a predetermined length. During the manufacture of the secondary battery, the upper portion of the cylindrical housing 50 is open. During the assembly of the secondary battery, the electrode assembly 40 and the center pin may be inserted into the cylindrical housing 50 along with the electrolyte. For example, although not limited thereto, the cylindrical housing 50 may include steel, stainless steel, aluminum, or an aluminum alloy.

[0060] Electrode assembly 40 can be housed in a cylindrical housing 50. Electrode assembly 40 may include: a negative electrode 20, a positive electrode 10, and a separator 30; in negative electrode 20, a negative current collector is coated with a negative electrode active material (e.g., graphite or carbon); in positive electrode 10, a positive current collector is coated with a positive electrode active material (e.g., transition metal oxide (LiCoO2, LiNiO2, or LiMn2O4)); separator 20 is located between negative electrode 20 and positive electrode 10 to prevent short circuits while selectively allowing lithium-ion migration. Negative electrode 20, positive electrode 10, and separator 30 may be wound in a substantially cylindrical shape.

[0061] The cover assembly 60 includes an upper cover. The cover assembly 60 may include a lower cover, a vent, or an insulator. The cover assembly 60 is coupled to an opening in the housing 50 such that the electrode assembly 40 is sealed within the housing 50.

[0062] However, the invention is not limited thereto, and the housing may have a circular shape or a bag shape. The housing may include metal, such as aluminum, aluminum alloy, or nickel-coated steel, or a laminated film or plastic forming the bag.

[0063] The electrode assembly 40 includes a negative electrode 20, a positive electrode 10, and a diaphragm 30 located between the negative electrode 20 and the positive electrode 10. The electrode assembly 40, together with the electrolyte (not shown), is housed in a cylindrical housing 50.

[0064] Positive electrode (10)

[0065] The positive electrode active material may include compounds capable of intercalating and deintercalating lithium (lithiated intercalation compounds). Specifically, composite oxides of lithium and / or metals including cobalt, manganese, nickel, or combinations thereof may be used.

[0066] The composite oxide can be a lithium transition metal composite oxide. Non-limiting examples of composite oxides may include lithium nickel oxides, lithium cobalt oxides, lithium manganese oxides, lithium iron phosphate compounds, cobalt-free nickel manganese oxides, or combinations thereof.

[0067] For example, the following compounds represented by any of the following chemical formulas can be used: LiaA1-bXbO2-cDc (0.90≤a≤1.8, 0≤b≤0.5 and 0≤c≤0.05); LiaMn2-bXbO4-cDc (0.90≤a≤1.8, 0≤b≤0.5 and 0≤c≤0.05); LiaNi1-b-cCobXcO2-αDα (0.90≤a≤1.8, 0≤b≤0.5, 0≤c≤0.5 and 0<α<2); LiaNi1-b-cMnbXcO2-αDα (0.90≤a≤1.8, 0≤b≤0.5, 0≤c≤0.5 and 0<α<2); LiaNibCocL1dGeO2 (0.90≤a≤1.8, 0≤b≤0.9, 0≤c≤0.05 and 0≤c≤0.05). 0.5, 0≤d≤0.5 and 0≤e≤0.1); LiaNiGbO2 (0.90≤a≤1.8 and 0.001≤b≤0.1); LiaCoGbO2 (0.90≤a≤1.8 and 0.001≤b≤0.1); LiaMn1-bGbO2 (0.90≤a≤1.8 and 0.001≤b≤0.1); LiaMn2GbO4 (0.90≤a≤1.8 and 0.001≤b≤0.1); LiaMn1-gGgPO4 (0.90≤a≤1.8 and 0≤g≤0.5); Li(3-f)Fe2(PO4)3 (0≤f≤2); or LiaFePO4 (0.90≤a≤1.8).

[0068] In the above chemical formula, A is Ni, Co, Mn or a combination thereof; X is Al, Ni, Co, Mn, Cr, Fe, Mg, Sr, V, rare earth elements or a combination thereof; D is O, F, S, P or a combination thereof; G is Al, Cr, Mn, Fe, Mg, La, Ce, Sr, V or a combination thereof; and L1 is Mn, Al or a combination thereof.

[0069] The positive electrode 10 for the rechargeable lithium battery 100 may include a current collector and a positive electrode active material layer on the current collector. The positive electrode active material layer may include a positive electrode active material and may further include a binder and / or a conductive material (e.g., an electrically conductive material).

[0070] For example, the positive electrode 10 may include additives that can be used as a sacrificial positive electrode.

[0071] Based on a 100wt% positive electrode active material layer, the amount of positive electrode active material can be from about 90wt% to about 99wt%. Based on a 100wt% positive electrode active material layer, the amounts of binder and conductive material can be from about 0.5wt% to about 5wt%, respectively.

[0072] Adhesives are used to attach positive electrode active material particles to each other or to a current collector. Non-limiting examples of adhesives may include polyvinyl alcohol, carboxymethyl cellulose, hydroxypropyl cellulose, diacetyl cellulose, polyvinyl chloride, carboxylated polyvinyl chloride, polyvinyl fluoride, polymers including ethylene oxide, polyvinylpyrrolidone, polyurethane, polytetrafluoroethylene, polyvinylidene fluoride, polyethylene, polypropylene, styrene-butadiene rubber, (meth)acrylated styrene-butadiene rubber, epoxy resin, (meth)acrylate resin, polyester resin, or nylon.

[0073] Conductive materials ensure conductivity (e.g., electrical conductivity) to the electrodes. Any material that can conduct electrons without causing harmful chemical changes (e.g., without causing undesirable chemical changes in rechargeable lithium batteries) can be used in the battery. Non-limiting examples of conductive materials may include carbon-based materials such as natural graphite, artificial graphite, carbon black, acetylene black, Ketjen black, carbon fibers, carbon nanofibers, and carbon nanotubes; metallic materials containing copper, nickel, aluminum, silver, etc., in the form of metal powder or metal fibers; conductive polymers such as polyphenylene derivatives; or mixtures thereof.

[0074] Al (foil) can be used as a current collector, but is not limited to this.

[0075] Negative electrode (20)

[0076] The negative electrode active material may include materials that can reversibly insert / deintercalate lithium ions, lithium metal, lithium metal alloys, materials that can be doped / dedoped with lithium, or transition metal oxides.

[0077] Materials capable of reversibly embedding / desorbing lithium ions may include carbonaceous negative electrode active materials, for example, crystalline carbon, amorphous carbon or a combination thereof. Crystalline carbon may include graphite, such as amorphous, flaky, platelet, spherical or fibrous natural graphite or artificial graphite. Amorphous carbon may include soft carbon, hard carbon, mesophase pitch carbonized product or calcined coke.

[0078] Lithium metal alloys may include lithium and metals including Na, K, Rb, Cs, Fr, Be, Mg, Ca, Sr, Si, Sb, Pb, In, Zn, Ba, Ra, Ge, Al or Sn.

[0079] Materials capable of doping / dedoping lithium may include Si-based negative electrode active materials or Sn-based negative electrode active materials. Si-based negative electrode active materials may include silicon, silicon-carbon composites, SiOx (0 < x ≤ 2, for example SiO2) or Si-Q alloys (where Q is selected from alkali metals, alkaline earth metals, Group 13 elements, Group 14 elements (excluding Si), Group 15 elements, Group 16 elements, transition metals, rare earth elements or a combination thereof). Sn-based negative electrode active materials may include Sn, SnO2, Sn-based alloys or a combination thereof.

[0080] The silicon-carbon composite may be a composite of silicon and amorphous carbon. According to an embodiment, the silicon-carbon composite may be in the form of silicon particles and amorphous carbon coated on the surface of the silicon particles. For example, the silicon-carbon composite may include secondary particles (cores) in which primary silicon particles are assembled and an amorphous carbon coating (shell) on the surface of the secondary particles. Amorphous carbon may also be between the primary silicon particles, and, for example, the primary silicon particles may be coated with amorphous carbon. The secondary particles may be dispersed in the amorphous carbon matrix.

[0081] The silicon-carbon composite may include crystalline carbon. For example, the silicon-carbon composite may include a core containing crystalline carbon and silicon particles and an amorphous carbon coating on the surface of the core.

[0082] Si-based negative electrode active materials or Sn-based negative electrode active materials may be used in combination with carbonaceous negative electrode active materials. When the second electrode plate is a positive electrode plate, the positive electrode plate may include a positive electrode current collector formed of a thin aluminum foil and a positive electrode active material layer containing lithium-based oxide as a main component coated on at least one surface of the positive electrode current collector. Uncoated regions of the positive electrode, that is, regions where the positive electrode active material layer is not coated, may be formed at both ends of the positive electrode current collector.

[0083] The negative electrode 20 of the rechargeable lithium battery 100 may include a current collector and a negative electrode active material layer on the current collector. The negative electrode active material layer may include a negative electrode active material and may include an adhesive and / or a conductive material (for example, a conductive material).

[0084] For example, the negative electrode active material layer may include about 90 wt% to about 99 wt% of negative electrode active material, about 0.5 wt% to about 5 wt% of binder and about 0 wt% to about 5 wt% of conductive material.

[0085] Adhesives can be used to attach negative electrode active material particles to each other or to a current collector. Adhesives can include non-aqueous adhesives, aqueous adhesives, dry adhesives, or combinations thereof.

[0086] Non-aqueous adhesives may include polyvinyl chloride, carboxylated polyvinyl chloride, polyvinyl fluoride, ethylene-propylene copolymer, polystyrene, polyurethane, polytetrafluoroethylene, polyvinylidene fluoride, polyethylene, polypropylene, polyamide, polyimide, or combinations thereof.

[0087] Waterborne adhesives may include styrene-butadiene rubber, (meth)acrylated styrene-butadiene rubber, (meth)acrylonitrile-butadiene rubber, (meth)acrylic rubber, butyl rubber, fluororubber, polyethylene oxide, polyvinylpyrrolidone, polyepoxychloropropane, polyphosphazene, poly(meth)acrylonitrile, ethylene propylene diene copolymer, polyvinylpyridine, chlorosulfonated polyethylene, latex, polyester resin, (meth)acrylic resin, phenolic resin, epoxy resin, polyvinyl alcohol, or combinations thereof.

[0088] When aqueous binders are used as negative electrode binders, they may include cellulose compounds capable of providing viscosity. Cellulose compounds may include carboxymethyl cellulose, hydroxypropyl methyl cellulose, methyl cellulose, or alkali metal salts thereof. Alkali metals may include Na, K, or Li.

[0089] Dry adhesives can include polymeric materials, i.e., fibers. For example, dry adhesives can include polytetrafluoroethylene, polyvinylidene fluoride, polyvinylidene fluoride-hexafluoropropylene copolymer, polyethylene oxide, or combinations thereof.

[0090] Conductive materials ensure conductivity (e.g., electrical conductivity) to the electrodes. Any material that can conduct electrons without causing harmful chemical changes (e.g., without causing undesirable chemical changes in rechargeable lithium batteries) can be used in the battery. Non-limiting examples of conductive materials may include carbon-based materials such as natural graphite, synthetic graphite, carbon black, acetylene black, Ketjen black, carbon fibers, carbon nanofibers, or carbon nanotubes; metallic materials, including copper, nickel, aluminum, or silver, in the form of metal powders or metal fibers; conductive polymers such as polyphenylene derivatives; or mixtures thereof.

[0091] The negative current collector may include copper foil, nickel foil, stainless steel foil, titanium foil, nickel foam, copper foam, polymer substrate coated with conductive metal, or a combination thereof.

[0092] Diaphragm (30)

[0093] Depending on the type of lithium secondary battery 100, the separator 30 may be present between the positive electrode 10 and the negative electrode 20. The separator 30 may include a multilayer film of polyethylene, polypropylene, polyvinylidene fluoride or two or more layers thereof, or a mixed multilayer film such as a polyethylene / polypropylene two-layer separator, a polyethylene / polypropylene / polyethylene three-layer separator, or a polypropylene / polypropylene / polypropylene three-layer separator.

[0094] The diaphragm 30 may include a porous substrate and a coating on one or both surfaces of the porous substrate, the coating comprising an organic material, an inorganic material, or a combination thereof.

[0095] The porous substrate can be a polymer membrane, including polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate and polybutylene terephthalate, polyacetal, polyamide, polyimide, polycarbonate, polyetherketone, polyaryletherketone, polyetherketone, polyetherimide, polyamideimide, polybenzimidazole, polyethersulfone, polyphenylene ether, cyclic olefin copolymers, polyphenylene sulfide, polyethylene naphthalate, glass fiber, Teflon and polytetrafluoroethylene, or copolymers or mixtures of two or more thereof.

[0096] Organic materials may include polyvinylidene fluoride polymers or (meth)acrylic acid polymers.

[0097] Inorganic materials may include, but are not limited to, inorganic particles selected from Al2O3, SiO2, TiO2, SnO2, CeO2, MgO, NiO, CaO, GaO, ZnO, ZrO2, Y2O3, SrTiO3, BaTiO3, Mg(OH)2, boehmite or combinations thereof.

[0098] Organic and inorganic materials can be combined in a single coating, or coatings containing organic materials and coatings containing inorganic materials can be stacked on top of each other.

[0099] Electrolyte (not shown)

[0100] The electrolyte used in the secondary battery 100 includes a non-aqueous organic solvent and a lithium salt.

[0101] Non-aqueous organic solvents are used as a medium through which ions participating in the electrochemical reactions of the battery can migrate.

[0102] Non-aqueous organic solvents can be carbonates, esters, ethers, ketones, alcohols, or aprotic solvents, or combinations thereof.

[0103] Carbonate solvents may include dimethyl carbonate (DMC), diethyl carbonate (DEC), dipropyl carbonate (DPC), methyl propyl carbonate (MPC), ethyl propyl carbonate (EPC), methyl ethyl carbonate (MEC), ethylene carbonate (EC), propylene carbonate (PC), or butyl carbonate (BC).

[0104] Ester solvents may include methyl acetate, ethyl acetate, n-propyl acetate, dimethyl acetate, methyl propionate, ethyl propionate, decanoic acid lactone, mevalonate lactone, valonate lactone, or caprolactone.

[0105] Ether solvents may include dibutyl ether, tetraethylene glycol dimethyl ether, diethylene glycol dimethyl ether, ethylene glycol dimethyl ether, 2-methyltetrahydrofuran, 2,5-dimethyltetrahydrofuran, or tetrahydrofuran.

[0106] Ketone solvents can include cyclohexanone.

[0107] Alcohol solvents may include ethanol or isopropanol.

[0108] Aprotic solvents may include nitriles such as R-CN (R is a straight-chain, branched, or circular hydrocarbon group having 2 to 20 carbon atoms, and may include double bonds, aromatic rings, or ether groups), amides such as dimethylformamide, dioxolane such as 1,3-dioxolane and 1,4-dioxolane, or sulfolane.

[0109] Each substance can be used individually as a non-aqueous organic solvent, or two or more substances can be mixed and used as a non-aqueous organic solvent. When using carbonate solvents, cyclic carbonates and chain carbonates can be mixed and used. Cyclic carbonates and chain carbonates can be mixed in a volume ratio of 1:1 to 1:9.

[0110] Lithium salts dissolved in organic solvents serve as a source of lithium ions in batteries, allowing for secondary battery operation and facilitating the movement of lithium ions between the positive and negative electrodes. Non-limiting examples of lithium salts may include LiPF6, LiBF4, LiSbF6, LiAsF6, LiClO4, LiAlO2, LiAlCl4, LiPO2F2, LiCl, LiI, LiN(SO3C2F5)2, Li(FSO2)2N (lithium bis(fluorosulfonyl)imide (LiFSI), LiC4F9SO3, LiN(CxF2x+1SO2)(CyF2y+1SO2) (where x and y are integers from 1 to 20), lithium trifluoromethanesulfonate, lithium tetrafluoroethanesulfonate, lithium difluorobis(oxalate)phosphate (LiDFOB), or lithium bis(oxalate)borate (LiBOB).

[0111] Figure 2 This is a schematic cross-sectional view of the cover assembly.

[0112] The cover assembly 60 is coupled to an opening in the housing 50. For example, the cover assembly 60 is coupled to the upper portion of the housing 50 when the opening is provided in the upper portion of the housing 50. For example, the cover assembly 60 is coupled to the lower portion of the housing 50 when the opening is provided in the lower portion of the housing 50.

[0113] The cover assembly 60 seals the internal portion of the housing 50. See also Figure 1 The secondary battery 100 includes an electrode assembly 40 and an electrolyte (not shown) housed in a housing 50. A cover assembly 60 allows the electrode assembly 40 and the electrolyte to be housed in the housing 50.

[0114] The cover assembly 60 prevents heat transfer to adjacent secondary batteries and / or prevents secondary battery 100 from exploding. The cover assembly 60 is electrically connected to electrodes extending from the electrode assembly 40 (e.g., see...). Figure 1 (Described as positive electrode 10 and / or negative electrode 20). Cover assembly 60 allows the electrodes to be electrically connected to the outside so that the secondary battery 100 can receive current from the outside or supply current to the outside.

[0115] The cover assembly 60 includes a lower cover 63 and an exhaust 62 located on one surface of the lower cover 63.

[0116] The cover assembly 60 may include an upper cover 61 provided on the side opposite to the lower cover 63 relative to the vent 62. The cover assembly 60 may include an insulator 64 between the vent 62 and the lower cover 63. The cover assembly 60 may include a subplate 65 connecting the cover assembly 60 and the electrode assembly 40.

[0117] The upper cover 61 may be located at the uppermost side of the cover assembly 60. The upper cover 61 protrudes upward. The upper cover 61 includes a terminal portion disposed at the convex portion and connected to an external circuit. At least a portion of the protruding upper surface of the upper cover 61 may have a flat shape. The upper cover 61 may include one or more vent holes disposed around the terminal portion for venting gas.

[0118] The lower cover 63 is located below the upper cover 61. One or more holes 631 may be present in at least a portion of the lower cover 63. The lower cover 63 may be located below the vent 62.

[0119] The vent 62 may be disposed below the upper cover 61, for example, between the upper cover 61 and the lower cover 63. The vent 62 may protrude downward. The vent 62 includes at least one cutout 621. For example, the cutout 621 may be located at least a portion of the area formed as a downward protrusion in the vent 62. The vent 62 may discharge gases generated in the secondary battery 100 through the cutout 621.

[0120] For example, when the secondary battery 100 is overcharged and / or malfunctions, gas may be generated within the secondary battery 100, increasing the internal pressure of the housing 50. As the internal pressure of the secondary battery 100 increases, the area formed as a downward bulge in the vent 62 may deform upward due to the pressure. Accordingly, the vent 62 can be electrically disconnected from the electrode assembly 40. The vent 62 can be cut along the cut 621. As the vent 62 is cut, the gas in the housing 50 is released. Accordingly, the cover assembly 60 can prevent the secondary battery 100 from potentially exploding.

[0121] An insulator 64 is located between the lower cover 63 and the vent 62. For example, the insulator 64 is positioned along the edge between the lower cover 63 and the vent 62. For example, the insulator 64 may be formed as a ring shape around the edge between the lower cover 63 and the vent 62. Accordingly, the insulator 64 forms a gap between the lower cover 63 and the vent 62.

[0122] Insulator 64 insulates the lower cover 63 from the vent 62. For example, insulator 64 may comprise a resin material such as polyethylene (PE), polypropylene (PP), or polyethylene terephthalate (PET).

[0123] For example, when the internal temperature of the housing 50 reaches the melting point of the insulator 64, the insulator 64 can melt. Gas generated in the housing 50 is introduced through the gap between the lower cover 63 and the exhaust 62. The introduced gas increases the pressure in the space between the lower cover 63 and the exhaust 62, causing the exhaust 62 to rupture. The gas can then be released through the ruptured exhaust 62.

[0124] Subplate 65 is located below lower cover 63. Subplate 65 can be fixed to the lower surface of lower cover 63 to close the hole 631 formed in lower cover 63.

[0125] Subplate 65 is attached to vent 62 through a hole 631 formed in lower cover 63. For example, at least a portion of vent 62 is exposed through hole 631. The portion of vent 62 corresponding to hole 631 may be formed to protrude toward lower cover 63. Accordingly, the protruding portion of vent 62 may be inserted into hole 631 and exposed downward. Subplate 65 is attached to the exposed vent 62.

[0126] Subplate 65 is located on electrode assembly 40. Subplate 65 can be connected to a terminal block (not shown) extending from electrode assembly 40. For example, one surface of subplate 65 can contact vent 62 and / or lower cover 63, and another surface of subplate 65 can contact the terminal block. Subplate 65 can be soldered to the terminal block. The terminal block is electrically connected to [see attached diagram]. Figure 1Each of the described positive electrode 10 and / or negative electrode 20 is formed to extend from each of the positive electrode 10 and / or negative electrode 20. For example, the terminal block includes a positive electrode terminal block coupled to the positive electrode plate of the positive electrode 10, the positive electrode terminal block extending from the positive electrode plate toward the upper side of the electrode assembly 40 and connected to the sub-plate 65.

[0127] With the above configuration, the cover assembly 60 can seal the internal parts of the secondary battery 100 and / or prevent the secondary battery 100 from exploding.

[0128] Figure 3 This is a schematic bottom view of the illustrated cover assembly.

[0129] See also Figure 2 Described, subplate 65 is attached to an exhaust element 62 exposed through a hole 631 formed in the lower cover 63. For example, subplate 65 is attached to exhaust element 62 by welding. Figure 3 In the middle, the joint between the subplate 65 and the exhaust component 62 is indicated by "W".

[0130] The joint W should maintain appropriate bonding strength. If the bonding strength of the joint W is unsatisfactory, the cover assembly 60 may break when it receives a physical force or torque applied in the rotational direction. If the bonding strength of the joint W is too high, the joint W may crack. If the joint W cracks, the secondary battery 100 may short-circuit. Accordingly, it is necessary to check whether the bonding strength of the joint W is appropriate in the manufacturing process.

[0131] Destructive testing has been routinely performed to measure bond strength, in which at least a portion of the bond W is damaged. In this test, resin is molded, a grinding process is performed, the cross-section is magnified using an electron microscope, and the bond depth of the bond W is examined. The bond W may deform during the grinding process. Additionally, the time required for resin molding may be relatively long. Because resin molding and / or grinding are performed manually, measurement discrepancies may occur between different inspectors.

[0132] Accordingly, embodiments of this disclosure provide a method for checking the bonding strength of the joint W, wherein the method is non-destructive and / or does not involve human error in measurement.

[0133] Figure 4 It is a schematic block diagram illustrating the components of the combined system.

[0134] The system 1000 forms a joint.

[0135] The base component and the connecting component are combined to form a joint. For example, the connecting component is combined to the base component to form a joint. For example, the joint includes [see details]. Figure 3The described joint W. For example, the basic components include (see [reference]). Figure 3 Subplate 65 is described. For example, the connecting components include (see [reference]). Figure 2 The exhaust component 62 is described. However, examples of base components and / or connecting components are not limited thereto, and base components and / or connecting components include any materials that are joined to form a joint.

[0136] The bonding system 1000 includes a bonding device 200 and a bonding strength inspection device 300. However, the components included in the bonding system 1000 are not limited to... Figure 4 The components shown in the diagram, and may further include in conjunction with system 1000. Figure 4 Components not shown in the diagram.

[0137] The bonding device 200 bonds the base component and the bonding component. For example, the bonding device 200 bonds the base component and the bonding component by welding. For example, the bonding device 200 bonds the base component and the bonding component by friction welding. For example, the bonding device 200 bonds the base component and the bonding component by ultrasonic welding.

[0138] For example, the connecting device 200 positions the base member and the connecting member such that the base member contacts the connecting member. For example, the connecting device 200 positions the base member and the connecting member such that the base member contacts the connecting member at the location where the joint is formed. For example, the connecting device 200 brings the vent 62 exposed through the hole 631 into contact with the sub-plate 65.

[0139] For example, the bonding device 200 applies heat or pressure to the portions of the base member and the bonding member that come into contact with each other. Accordingly, the bonding device 200 bonds the base member and the bonding member. For example, the bonding device 200 applies heat or pressure to the sub-plate 65 that contacts the exhaust member 62 to bond the exhaust member 62 and the sub-plate 65.

[0140] For example, the bonding device 200 applies pressure and / or ultrasonic vibration to the portions of the base member and the bonding member that are in contact with each other to generate friction at the interface where the base member and the bonding member are in contact. Accordingly, the bonding device 200 can friction weld the base member and the bonding member at the interface.

[0141] The device 200 combines the base component and the connecting component to form a joint that connects the base component and the connecting component.

[0142] The bonding strength testing device 300 checks the bonding strength of the joint formed by the bonding device 200. For example, the bonding strength testing device 300 determines whether the joint W is in a normal bonding state.

[0143] A normal fit condition confirms the quality of the fit. For example, when the fit W between the sub-plate 65 and the exhaust component 62 corresponds to a normal fit condition, the corresponding cover assembly 60 corresponds to a product that can be shipped to the consumer.

[0144] For example, a non-normal bonding state can include an underbonded state and an overbonded state. An underbonded state involves insufficient bonding strength at the joint, where the base component and the bonding component are not sufficiently bonded. For example, when the bonding strength of the joint W where the sub-plate 65 and the vent 62 are bonded to each other is insufficient, no weld marks will form on the joint W, or the vent 62 may not be adequately secured to the sub-plate 65. An overbonded state corresponds to a state where excessive bonding occurs at the joint. For example, an overbonded state includes the occurrence of cracks in the base component and / or the bonding component, or a high probability of cracking. For example, when the joint W where the sub-plate 65 and the vent 62 are bonded to each other is in an overbonded state, cracks may occur in the joint W, or a short circuit may occur in the secondary battery 100.

[0145] The bonding strength testing device 300 measures the roughness of the joint and determines the bonding strength of the joint based on the measured roughness. Accordingly, the bonding strength testing device 300 can quickly and accurately measure the bonding strength of the joint without damaging the joint.

[0146] When the bond strength testing device 300 determines the bond strength, the bonding device 200 can control the output power used to bond the base component and the bonding component based on the determined bond strength. For example, when the bond strength testing device 300 determines that the joint W is in a normal bonding state, the bonding device 200 can maintain the pressure and / or heat output supplied to the joint. For example, when the bond strength testing device 300 determines that the bond strength is insufficient, the bonding device 200 can increase the pressure and / or heat output supplied to the joint. For example, when the bond strength testing device 300 determines that the bond strength is overbonded, the bonding device 200 can reduce the pressure and / or heat output supplied to the joint.

[0147] The combined system 1000 can simultaneously verify the quality of the joint by combining the base components and the joint components. Figure 5 This is a schematic block diagram illustrating the components of a combined strength testing device.

[0148] Figure 6 This is a flowchart describing the operation of the bonding strength testing equipment.

[0149] Combined with strength testing equipment 300 (e.g., including see see) Figure 3 The described bonding strength testing device 300 inspects the bonding joint (e.g., including see [reference]). Figure 3 The bonding strength of the described joint (W).

[0150] The bonding strength inspection device 300 includes a roughness measuring unit 310 and a processor 320. However, the components included in the bonding strength inspection device 300 are not limited to... Figure 5 The ones shown in the diagram, and combined with the strength testing equipment 300, may include Figure 5 Components not shown in the diagram. For example, the bonding strength testing device 300 may include a communication unit or a memory.

[0151] like Figure 6 The roughness measuring unit 310 measures the roughness of the joint (step S101).

[0152] The roughness measuring unit 310 includes, for example, a contact type or a non-contact type roughness measuring unit 310. For example, a contact type roughness measuring unit can measure roughness by detecting changes when scanning the surface of the joint with a probe. For example, a non-contact type roughness measuring unit can measure roughness by obtaining the distribution pattern of an image by emitting a laser beam onto the surface of the joint.

[0153] For example, the roughness measuring unit 310 measures the surface roughness of the joint. For example, the base member (e.g., sub-plate 65) includes a first surface (e.g., facing the joint member (e.g., vent member 62)). Figure 7 The first surface 651 shown in the figure and the second surface located on the opposite side of the first surface (e.g., Figure 7 The second surface 652 is shown in the figure. The roughness measuring unit 310 measures the roughness formed on the second surface. For example, the roughness measuring unit 310 measures the roughness of the area on the second surface corresponding to the joint (e.g., joint W). The bonding device can apply heat or pressure to the second surface to bond the first surface and the bonding member.

[0154] For example, roughness includes a ten-point average roughness Rz. However, roughness is not limited to this and may also include an arithmetic average roughness Ra or a maximum height roughness Rmax. For example, the roughness measuring unit 310 measures the ten-point average roughness Rz of the mating surface.

[0155] like Figure 6 As shown in the figure, the processor 320 determines the bonding strength of the joint based on the measured roughness (step S102).

[0156] The processor 320 controls all or some of the components included in the bonding strength testing device 300. The processor 320 is embedded in the bonding strength testing device 300. The processor 320 may be located outside the bonding strength testing device 300 and may control the components included in the bonding strength testing device 300 via a communication unit (not shown).

[0157] For example, processor 320 includes a central processing unit (CPU), microprocessor (MPU), microcontroller unit (MCU), graphics processing unit (GPU), digital signal processor (DSP), floating-point unit (FPU), application-specific integrated circuit (ASIC), or field-programmable gate array (FPGA).

[0158] For example, processor 320 determines the bonding depth of the joint by measuring the roughness. Processor 320 determines the ratio of the bonding depth to the thickness of the base component. For example, processor 320 determines the ratio of the bonding depth to the thickness of the sub-plate 65. Processor 320 determines the bonding strength of the joint based on the ratio.

[0159] For example, when the determined ratio is within a predetermined range, the processor 320 determines that the joint is in a normal bonding state. For example, when the determined ratio is less than the predetermined range, the processor 320 determines that the joint is in an underbonded state. For example, when the determined ratio is greater than the predetermined range, the processor 320 determines that the joint is in an overbonded state.

[0160] For example, processor 320 can express the bonding strength of the joint as a numerical value based on a determined ratio. For example, bonding strength checking device 300 includes a memory (not shown). The memory stores the relative bonding strength of the joint with respect to a ratio (using, for example, a grade of bonding strength corresponding to a ratio) and / or the absolute bonding strength (using, for example, a measurement of bonding strength according to a ratio). Processor 320 can use the bonding strengths pre-stored in the memory to determine the bonding strength of the joint. Processor 320 can provide not only whether the bonding strength of the joint is normal, but also the degree of bonding strength of the joint.

[0161] The processor 320 can achieve the bonding strength of the joint without damaging the joint.

[0162] Advantageously, the joint strength testing device 300 provides a method for measuring the joint strength without damaging the joint. The joint strength testing device 300 also provides a method for automatically measuring the joint strength by inspecting the joint without measurement bias between inspectors.

[0163] Figure 7 This is an enlarged view depicting the joint depth of the connecting parts in the illustrated cover assembly.

[0164] Figure 8 This is a view showing the measured roughness of the joint.

[0165] The bonding strength testing equipment 300 can inspect the bonding strength of the joint. See also... Figure 5 and Figure 6The described bonding strength inspection device 300 uses a roughness measuring unit 310 to measure the roughness of the bonding joint. The bonding strength inspection device 300 uses a processor 320 to measure the bonding strength of the bonding joint based on the roughness. See also Figure 7 and Figure 8 The basic component is sub-plate 65, and the connecting component is exhaust component 62.

[0166] like Figure 7 As shown in the diagram, a portion of the exhaust member 62 is attached to a subplate 65. The subplate 65 includes a first surface 651 facing the exhaust member 62 and a second surface 652 located on the opposite side of the first surface 651. (See, for example, the attachment device 200). Figure 4 The described bonding device 200) applies heat or pressure to the second surface 652 to bond the first surface 651 and the exhaust member 62.

[0167] The roughness measuring unit 310 measures the roughness of the second surface 652. For example, the roughness measuring unit 310 measures the roughness of the region in which the joint is formed on the second surface 652.

[0168] For example, Figure 8 The measured roughness value of the region on the second surface 652 in which the joint is formed is shown. For example, the roughness Rz of the joint can be 14.644 μm.

[0169] The processor 320 determines the bonding depth of the joint based on the roughness. For example, as... Figure 8 As shown, when the roughness measuring unit 310 measures the roughness, the processor 320 can determine that the bonding depth d of the joint is 14.644 μm. Accordingly, the processor 320 can determine the bonding depth d by substituting the measured roughness value.

[0170] The processor 320 uses the bonding depth d to calculate the ratio (%) of the bonding portion to the base component, which can be a depth ratio. For example, the processor 320 calculates the ratio (%) using Equation 1 below.

[0171] [Equation 1]

[0172] Ratio (%) = (d / D) * 100 (%)

[0173] In Equation 1, d is the bonding depth of the joint. For example, d is... Figure 7 The surface roughness of the joint W in the middle.

[0174] In Equation 1, D is the thickness of the foundation component. For example, D is... Figure 7 The thickness of the sub-plate is 65.

[0175] The processor 320 determines the bonding strength of the joint based on a calculated ratio. For example, the processor 320 can determine the bonding strength of the joint by determining whether the calculated ratio corresponds to a predetermined range. For example, the predetermined range may be in the range of about 10% to about 50%.

[0176] For example, when the calculated ratio is within a predetermined range, the processor 320 determines that the joint is in a normal engagement state. For example, if the calculated ratio is equal to or greater than about 10% and less than or equal to about 50%, the processor 320 can determine that the joint W is in a normal engagement state.

[0177] For example, when the calculated ratio is less than a predetermined range, the processor 320 determines that the joint is in an under-bonded state. For example, when the calculated ratio is less than about 10%, the processor 320 may determine that the joint W is in an under-bonded state.

[0178] For example, when the calculated ratio is greater than a predetermined range, the processor 320 determines that the joint is in an over-bonded state. For example, when the calculated ratio is greater than about 50%, the processor 320 can determine that the joint W is in an over-bonded state.

[0179] Accordingly, the bonding strength inspection device 300 can inspect the bonding strength of the joint by measuring the roughness of the joint.

[0180] Figure 9 It is a view used to describe the bond strength based on the ratio of the bond depth to the thickness of the base component.

[0181] See also Figures 4 to 8 The described bonding strength testing device 300 determines the bonding strength of the joint by calculating the ratio of the bonding depth to the thickness of the base component. The bonding strength testing device 300 determines the bonding strength by comparing a predetermined range with the calculated ratio.

[0182] The bond strength testing device 300 can be set to a predetermined range. The bond strength testing device 300 may include a memory (not shown). For example, the memory may store data regarding the bond strength determined based on the ratio of the bond depth to the thickness of the base component.

[0183] Figure 9 It is a table that shows the data stored in the memory to be read. Figure 9 Data illustrating an example of joining a subplate 65 and an exhaust element 62 by ultrasonic welding to form a joint W. Figure 9 In this context, the ultrasonic depth ratio is a value calculated as the ratio of the bonding depth to the thickness of the foundation component. Figure 9 In the diagram, the weld surface shape shows the surface of the joint W, i.e., the weld marks formed by welding. Figure 9In the diagram, the cross-sectional weld shape shows the cross-section of the weld marks formed in the subplate 65 and the vent 62.

[0184] For example, processor 320 can set a predetermined range based on data stored in memory. For example, processor 320 can set the predetermined range by considering the ratio corresponding to each of the underbonding state, normal bonding state, and overbonding state.

[0185] For example, when the ratio calculated based on pre-stored data is in the range of approximately 5% to approximately 8%, the processor 320 determines that no solder marks have been formed. For example, when the ratio calculated based on pre-stored data is in the range of approximately 10% to approximately 30%, the processor 320 determines that solder marks have been formed but no cracks have occurred. Accordingly, the processor 320 may set the minimum value of the predetermined range to be greater than approximately 8% and less than or equal to approximately 10%. For example, the processor 320 may set the predetermined range to be equal to or greater than approximately 10%.

[0186] For example, when the ratio calculated based on pre-stored data is in the range of approximately 50% to approximately 70% or approximately 80% to approximately 90%, the processor 320 determines that a weld mark has formed and a crack has occurred. Accordingly, the processor 320 may set the maximum value of the predetermined range to be greater than approximately 30% and less than or equal to approximately 50% (or less than approximately 50%). For example, the processor 320 may set the predetermined range to be less than approximately 50%.

[0187] For example, the processor 320 can set a predetermined range equal to or greater than about 10% and less than or equal to about 50%. When the calculated ratio is equal to or greater than about 10% and less than or equal to about 50%, the processor 320 can determine that the bonding strength of the joint is in a normal bonding state.

[0188] However, the method by which the processor 320 sets the predetermined range is not limited to this. For example, the processor 320 may not set the predetermined range separately, and may use a predetermined range pre-stored in memory. For example, the processor 320 may receive the predetermined range from a user (e.g., an inspector checking the bonding strength of a joint) through a communication unit and / or an input unit.

[0189] The bonding strength testing equipment 300 can measure the bonding strength of a joint by measuring only the roughness of the joint.

[0190] Since the bonding system 1000 includes a bonding strength inspection device 300, the quality of the bonding strength of the joint formed by the bonding device 200 can be maintained uniformly.

[0191] Advantageously, the joint strength can be measured without measurement bias between inspectors.

[0192] Advantageously, it can improve the accuracy of test results.

[0193] Advantageously, the bonding strength of the joint can be measured quickly.

[0194] Although this disclosure has been described with reference to the accompanying drawings illustrating aspects thereof, this disclosure is not limited thereto. Various modifications and variations can be made by those skilled in the art within the scope of the technical spirit of this disclosure.

Claims

1. A bonding strength testing device, comprising: A roughness measuring unit is configured to measure the roughness of a joint where a base member and a connecting member are joined together. as well as A processor is configured to determine the bonding strength of the joint based on the roughness.

2. The bonding strength testing device according to claim 1, wherein, The processor is configured to determine a ratio of the bonding depth of the joint to the thickness of the base member based on the roughness, and wherein the processor is configured to determine the bonding strength based on the ratio.

3. The bonding strength testing device according to claim 2, wherein, The processor is configured to determine that the joint is in a normal engagement state when the ratio is within a predetermined range.

4. The bonding strength testing device according to claim 2, wherein, The processor is configured to determine that the joint is in an underbonded state when the ratio is less than a predetermined range, and wherein the processor is configured to determine that the joint is in an overbonded state when the ratio is greater than the predetermined range.

5. The bonding strength testing apparatus according to claim 3 or 4, further comprising a memory configured to store data regarding the bonding strength determined based on the ratio. in, The processor is configured to set the predetermined range based on the data.

6. The bonding strength testing device according to claim 5, wherein, The predetermined range is between 10% and 50%.

7. The bonding strength testing device according to any one of claims 1 to 4, wherein, The roughness includes the ten-point average roughness of the joint.

8. A combined system, comprising: The connecting device is configured to connect the connecting component to the base component; as well as A joint strength testing device is configured to determine the joint strength of the base member and the connecting member joined together at the joint. The bonding strength testing equipment includes: A roughness measuring unit is configured to measure the roughness of the joint; and A processor is configured to determine the bonding strength based on the roughness.

9. The bonding system according to claim 8, wherein, The processor is configured to determine a ratio of the bonding depth of the joint to the thickness of the base member based on the roughness, and wherein the processor is configured to determine the bonding strength based on the ratio.

10. The bonding system according to claim 9, wherein, The processor is configured to determine that the joint is in a normal engagement state when the ratio is within a predetermined range.

11. The bonding system according to claim 9, wherein, The processor is configured to determine that the joint is in an underbonded state when the ratio is less than a predetermined range, and wherein the processor is configured to determine that the joint is in an overbonded state when the ratio is greater than the predetermined range.

12. The bonding system according to claim 10 or 11, wherein, The bonding strength testing device further includes a memory configured to store data on the bonding strength determined based on the ratio, wherein the processor is configured to set the predetermined range based on the data.

13. The bonding system according to claim 12, wherein, The predetermined range is between 10% and 50%.

14. The bonding system according to any one of claims 8 to 11, wherein, The roughness includes the ten-point average roughness of the joint.

15. The bonding system according to any one of claims 8 to 11, wherein, The base component includes a first surface facing the bonding member and a second surface located on the side opposite to the first surface, wherein the bonding device is configured to apply heat or pressure to the second surface to bond the first surface and the bonding member.

16. The bonding system according to claim 15, wherein, The roughness measuring unit is configured to measure the roughness on the second surface.

17. The bonding system according to any one of claims 8 to 11, wherein, The bonding device is configured to bond the base component and the bonding component via friction welding.

18. The bonding system according to any one of claims 8 to 11, wherein, The bonding device is configured to control the output power used to bond the base component and the bonding component based on the bonding strength.

19. A coupling system for a cover assembly, the cover assembly comprising: Top cover; An exhaust vent is located below the upper cover; A lower cover is disposed below the exhaust component and has one or more holes that expose at least a portion of the exhaust component downwards; An insulator is disposed between the exhaust component and the lower cover; and a sub-plate, disposed below the lower cover and coupled to the exhaust element via the one or more holes, the coupling system comprising: The device is configured to combine the sub-plate and the exhaust component; as well as A joint strength testing device is configured to measure the roughness of a joint and to determine the joint strength of the joint based on the roughness, wherein the subplate and the vent are joined at the joint.

20. The bonding system according to claim 19, wherein, The bonding strength testing device is configured to determine the ratio of the bonding depth of the joint to the thickness of the base member based on the roughness, and is configured to determine the bonding strength based on the ratio.

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