Adaptive liquid cooling heat dissipation power server

Abstract

The application provides a self-adaptive liquid cooling heat dissipation computing server, and belongs to the technical field of liquid cooling servers, comprising a processing module, wherein the processing module comprises a processing unit, and the processing unit comprises a liquid cooling assembly and a server mainboard; the liquid cooling assembly comprises a liquid cooling plate, and a temperature sensing seat and an adjusting joint are arranged on the liquid cooling plate; the temperature sensing seat is internally provided with an accommodating cavity, and a liquid-gas phase change medium is arranged in the accommodating cavity; the adjusting joint comprises a joint body, a connecting pipe and an adjusting inner core; the joint body is internally provided with a flow guide cavity; the adjusting inner core is slidably arranged in the flow guide cavity; the adjusting inner core is provided with a flow guide notch; the joint body is provided with a liquid inlet branch pipe and a flow guide pipe; and the liquid inlet branch pipe is in communication with the flow guide pipe through the flow guide notch. The self-adaptive liquid cooling heat dissipation computing server can flexibly adjust the distribution of the liquid cooling medium according to the heat dissipation requirements of different areas, so that the heat dissipation effect of the liquid cooling computing server is guaranteed, and the utilization rate of the liquid cooling medium is improved.

Description

Technical Field

[0001] This invention belongs to the field of liquid-cooled server technology, and in particular relates to an adaptive liquid-cooled heat dissipation computing server. Background Technology

[0002] Liquid-cooled servers are a new generation of computing devices that use liquid as a heat dissipation medium to replace traditional air-cooling technology for server cooling. Because the specific heat capacity and thermal conductivity of liquid heat dissipation medium are both higher than those of air, liquid-cooled servers have better heat dissipation performance than traditional air-cooled servers, thus meeting higher computing power demands and heat generation.

[0003] Common liquid-cooled servers mainly include two types: cold plate liquid cooling and immersion liquid cooling. Cold plate liquid cooling is an indirect liquid cooling technology. During operation, the liquid medium does not come into direct contact with the electronic components on the server motherboard. Instead, the heat generated by the server motherboard is transferred to the circulating liquid medium through efficient heat conduction components such as liquid cooling plates, thereby achieving the purpose of reducing the temperature of the server motherboard.

[0004] However, server motherboards typically house various electronic components (such as CPUs, GPUs, and memory), each generating different amounts of heat during operation. Furthermore, the same electronic component can exhibit varying heat output depending on the computational load when performing different tasks. Therefore, different areas of the server motherboard have varying heat dissipation requirements, and this variation changes with the computational task. Existing cold-plate liquid-cooled servers cannot flexibly adjust the flow rate of the liquid medium according to actual heat dissipation needs, thus affecting the utilization rate of the liquid medium during heat dissipation and failing to guarantee sufficient heat dissipation for high-heat-generating areas on the server motherboard. To address this issue, those skilled in the art may choose to increase the overall flow rate and velocity of the medium within the liquid cooling plate to meet the heat dissipation requirements of high-heat-generating areas. However, such a solution not only increases the power consumption of the liquid cooling system but also further reduces the utilization rate of the liquid medium, resulting in unnecessary waste. Summary of the Invention

[0005] In view of this, the present invention aims to provide an adaptive liquid-cooled computing server to solve the above-mentioned technical problems.

[0006] To achieve the above objectives, the technical solution created by this invention is implemented as follows:

[0007] An adaptive liquid-cooled computing server includes a processing module, the processing module including at least one processing unit, the processing unit including a liquid cooling component and at least one server motherboard, and the server motherboard is detachably mounted on the liquid cooling component.

[0008] The liquid cooling assembly includes multiple liquid cooling plates, with adjacent plates detachably connected. Each liquid cooling plate has a liquid cooling cavity for containing a liquid cooling medium, and each liquid cooling plate also has a temperature sensing seat and an adjusting connector. The temperature sensing seat has a cavity containing a liquid-gas phase change medium. The adjusting connector includes a connector body, a connecting pipe, and an adjusting core. The connector body has a flow guiding cavity, one end of the connecting pipe is connected to the cavity, and the other end of the connecting pipe is connected to the flow guiding cavity. The adjusting core is slidably disposed within the flow guiding cavity. Inside, a piston head is provided inside the connecting pipe, and the piston head is connected to the adjusting inner core; the adjusting inner core is provided with a flow guiding slit, and along the sliding direction of the adjusting inner core, the flow guiding slit has a first end and a second end, the first end is located on the side of the second end away from the piston head, and the width of the flow guiding slit gradually increases from the first end to the second end; the connector body is provided with an inlet branch pipe and a flow guiding pipe, and the liquid cooling plate is provided with an outlet branch pipe that communicates with the liquid cooling cavity; the inlet branch pipe is connected to the flow guiding pipe through the flow guiding slit, and the flow guiding pipe is connected to the liquid cooling cavity;

[0009] When the temperature rises in the area where the server motherboard contacts the liquid cooling plate, the liquid-gas phase change medium inside the cavity gradually changes from liquid to gas, increasing the pressure inside the cavity. This causes the piston head to move the adjusting core away from the cavity. Since the inlet branch pipe is connected to the guide pipe via a flow guide slit, and the slit width gradually increases from the first end to the second end, a larger flow cross-sectional area is achieved between the inlet branch pipe and the guide pipe as the adjusting core moves away from the cavity, thus improving the flow rate. The flow rate of the liquid cooling medium in the liquid cooling cavity enhances the heat dissipation effect of the liquid cooling plate. When the temperature drops in the area where the server motherboard contacts the liquid cooling plate, the liquid-gas phase change medium inside the cavity gradually changes from a gas phase to a liquid phase as the temperature decreases. This reduces the pressure inside the cavity, causing the piston head to move the adjusting core closer to the cavity. This reduces the flow cross-sectional area between the inlet branch pipe and the guide pipe, thus reducing the flow rate of the liquid cooling medium entering the liquid cooling cavity. This allows the liquid cooling medium to flow to other high-heat areas, improving the utilization rate of the liquid cooling medium.

[0010] Furthermore, the liquid cooling plate is provided with a first mounting hole, and the temperature sensing seat is detachably disposed inside the first mounting hole. A first heat insulation sleeve is also provided in the first mounting hole, and the first heat insulation sleeve is located between the inner wall of the first mounting hole and the outer wall of the temperature sensing seat. The liquid cooling plate is provided with a second mounting hole, which is connected to the first mounting hole. The connecting pipe is detachably disposed inside the second mounting hole, and a second heat insulation sleeve is also provided in the second mounting hole, and the second heat insulation sleeve is located between the inner wall of the second mounting hole and the outer wall of the connecting pipe.

[0011] Furthermore, the first mounting hole includes a first limiting section, a receiving section, and a second limiting section connected in sequence. The inner diameters of the first limiting section and the second limiting section are both larger than the inner diameter of the receiving section, and the temperature sensing seat is located inside the receiving section. A heat-conducting limiting plate is provided inside both the first limiting section and the second limiting section, and the outer diameter of the heat-conducting limiting plate is larger than the inner diameter of the receiving section. Each heat-conducting limiting plate is provided with a threaded joint, and the temperature sensing seat is provided with a threaded hole for accommodating the threaded joint.

[0012] Furthermore, a pressure relief hole is provided on the side wall of the connector body away from the piston head, and the pressure relief hole is connected to the flow guiding cavity.

[0013] Furthermore, the liquid-cooled cavity is provided with multiple alternately arranged guide plates, and a guide channel is formed between adjacent guide plates.

[0014] Furthermore, the liquid cooling plate has a heat-conducting surface that contacts the server motherboard, and a thermal grease layer is provided between the heat-conducting surface and the server motherboard; the heat-conducting surface also has multiple mounting holes, and a heat-conducting core is provided inside each mounting hole. The outer wall of the heat-conducting core and the inner wall of the mounting hole are filled with sealant, and the thermal conductivity of the heat-conducting core is greater than that of the liquid cooling plate.

[0015] Furthermore, the inner diameter of the inlet branch pipe is equal to the inner diameter of the guide pipe, the inner diameter of the outlet branch pipe is greater than the inner diameter of the inlet branch pipe, and the cut width at the second end of the guide cut is equal to the inner diameter of the inlet branch pipe.

[0016] Furthermore, the liquid cooling plate is provided with an assembly strip and an assembly groove for accommodating the assembly strip, and the assembly strip and the assembly groove are respectively located on different side walls of the liquid cooling plate.

[0017] Furthermore, the adaptive liquid-cooled computing server includes a circulation pump and a cooling module; the circulation pump has an inlet pipe and an outlet pipe, the inlet branch pipe is connected to the outlet pipe, and the outlet branch pipe is connected to the inlet pipe; the cooling module includes a heat exchange unit and a cooling unit for reducing the temperature of the heat exchange unit, and the heat exchange unit is disposed on the outlet pipe.

[0018] Furthermore, the adaptive liquid-cooled computing server also includes a detection module and a control module; the detection module includes at least one detection unit, and the detection unit is used to collect the current signal of the processing unit; the control module is electrically connected to the detection module, the circulation pump and the cooling unit respectively, and the control module is used to adjust the input power of the circulation pump and the input power of the cooling unit according to the current signals collected by each detection unit in the detection module.

[0019] Compared with existing technologies, the adaptive liquid-cooled computing server described in this invention has the following advantages:

[0020] (1) The adaptive liquid-cooled computing server of the present invention includes a liquid-cooled component comprising multiple liquid-cooled plates. During use, the operator can flexibly adjust the number and distribution of liquid-cooled plates in the liquid-cooled component according to the shape, size, and electronic component distribution of the server motherboard, thereby improving the matching degree between the liquid-cooled component and the server motherboard and facilitating heat dissipation for each electronic component. In addition, the present invention provides a temperature-sensing seat and an adjustment connector on the liquid-cooled plate, wherein the temperature-sensing seat contains a liquid-gas phase change medium, and the adjustment connector contains an adjustment core. When the temperature of the area where the liquid-cooled plate is located changes, the liquid-gas phase change medium inside the temperature-sensing seat can undergo a phase change according to the temperature change, thereby changing the pressure inside the cavity and driving the adjustment core to move. Since the adjustment core is provided with a flow guide cut, and the cut width of the flow guide cut varies in different areas, the flow cross-sectional area between the liquid inlet branch pipe and the flow guide pipe will change when the adjustment core moves, so as to change the flow rate of the liquid-cooled medium entering the liquid-cooled cavity, thereby achieving an accurate match between the flow rate of the liquid-cooled medium and the actual heat dissipation requirements. Compared with existing technologies, this invention can increase the flow rate of liquid cooling medium in high-heat-generating areas of the server motherboard without increasing the power consumption of the liquid cooling system, thereby improving its heat dissipation effect. At the same time, it can reduce the flow rate of liquid cooling medium in low-heat-generating areas of the server motherboard, thereby improving the utilization rate of the liquid cooling medium and thus having better adaptability.

[0021] (2) The adaptive liquid-cooled computing server of the present invention has multiple guide plates inside the liquid-cooled cavity, which can effectively extend the residence time of the liquid cooling medium inside the liquid-cooled cavity, thereby ensuring that the liquid cooling medium produces a good heat absorption effect. Secondly, the present invention has multiple heat-conducting cores on the heat-conducting surface of the liquid cooling plate. By setting the heat-conducting cores, the heat conduction efficiency between the server motherboard and the liquid cooling plate can be improved, thereby improving the heat dissipation efficiency of the server motherboard. In addition, the present invention also has a first heat-insulating sleeve and a second heat-insulating sleeve, which can prevent the flow of the liquid cooling medium from affecting the temperature inside the cavity, and ensure that the liquid-gas phase change medium accurately undergoes phase change according to temperature changes.

[0022] (3) The adaptive liquid-cooled computing server described in this invention can also collect the current signals of each processing unit through the detection module, and adjust the input power of the circulation pump and the input power of the cooling unit according to the current signals. Since the computing load of electronic devices is proportional to their current signals, and the higher the computing load of electronic devices, the greater their heat generation, this invention will judge the heat generation of electronic devices through current signals, so that the input power of the circulation pump and the cooling unit changes with the heat generation of electronic devices, thereby matching the flow rate of the liquid cooling medium and the cooling rate of the heat exchange unit with the actual heat generation, further improving the heat dissipation effect of the server motherboard and effectively balancing power consumption. Attached Figure Description

[0023] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments and descriptions of the invention are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0024] Figure 1 A schematic diagram of the structure of the adaptive liquid-cooled heat dissipation computing server described in the embodiment of the present invention;

[0025] Figure 2 A schematic diagram of the server motherboard and liquid cooling assembly as described in the embodiments of the present invention;

[0026] Figure 3 An exploded view of the server motherboard and liquid cooling assembly described in the embodiments of the present invention;

[0027] Figure 4 An exploded view of the liquid cooling assembly described in the embodiments of the present invention;

[0028] Figure 5 A cross-sectional view of the liquid cooling plate described in the embodiment of the present invention;

[0029] Figure 6 A cross-sectional view of the liquid cooling plate described in the embodiment of the present invention from another angle (the first end of the flow guide cut connects the liquid inlet branch pipe and the flow guide pipe).

[0030] Figure 7 A cross-sectional view of the liquid cooling plate described in the embodiment of the present invention from another angle (the second end of the flow guide cut connects the liquid inlet branch pipe and the flow guide pipe).

[0031] Figure 8 An exploded view of the liquid cooling plate described in the embodiment of the present invention;

[0032] Figure 9 An exploded view of the temperature sensing seat described in the embodiment of the present invention;

[0033] Figure 10 An exploded view of the adjusting joint described in the embodiment of the present invention;

[0034] Figure 11 A schematic diagram of the structure of the adjusting inner core and piston head as described in the embodiment of the present invention;

[0035] Figure 12 This is a schematic diagram of the structure of the adjusting inner core and piston head in an optional embodiment of the present invention.

[0036] Explanation of reference numerals in the attached figures:

[0037] 11-Processing module; 111-Processing unit; 12-Circulating pump; 13-Cooling module; 131-Heat exchange unit; 132-Cooling unit; 14-Detection module; 141-Detection unit; 15-Control module; 2-Server motherboard; 3-Liquid cooling plate; 31-Liquid cooling cavity; 32-Liquid outlet branch pipe; 331-Containing section; 332-First limiting section; 34-Second mounting hole; 35-Guide plate; 36-Heat-conducting core; 37-Assembly strip; 38 - Assembly slot; 4- Temperature sensing seat; 41- Receiving cavity; 42- Heat-conducting limiting plate; 421- Threaded joint; 43- Threaded hole; 5- Joint body; 51- Flow guiding cavity; 52- Liquid inlet branch pipe; 53- Flow guiding pipe; 54- Pressure relief hole; 6- Connecting pipe; 61- Piston head; 7- Adjusting inner core; 71- Flow guiding notch; 711- First end; 712- Second end; 713- Spiral guide vane; 81- First heat insulation sleeve; 82- Second heat insulation sleeve. Detailed Implementation

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0039] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0040] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0041] The invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0042] An adaptive liquid-cooled computing server, such as Figure 1 and Figure 2 As shown, it includes a processing module 11. During operation, the processing module 11 serves as the core component of the computing server, performing computational tasks and providing the server with the ability to process data and execute computational tasks. Specifically, the processing module 11 includes at least one processing unit 111. Operators can flexibly adjust the number of processing units 111 included in the processing module 11 according to the actual computing power requirements of the computing server, so that the actual computing power of the computing server matches the usage needs.

[0043] In this embodiment, each processing unit 111 includes a liquid cooling assembly and at least one server motherboard 2. The server motherboard 2 should be equipped with common electronic devices required for performing computing tasks, such as a GPU (Graphics Processing Unit), CPU (Central Processing Unit), NPU (Neural Processing Unit), FPGA (Field-Programmable Gate Array), and memory. During assembly, the server motherboard 2 can be detachably mounted on the liquid cooling assembly using common connection methods (e.g., snap-fit ​​or screw-fit), so that the liquid cooling assembly can contact the area where the electronic devices on the server motherboard 2 are located. This facilitates the liquid cooling assembly in removing the heat generated by the electronic devices during operation, achieving the purpose of cooling the processing unit 111.

[0044] Correspondingly, such as Figure 2 and Figure 3 As shown, in order to improve the utilization rate of the space around the liquid cooling component, when the processing unit 111 has two server motherboards 2, the two server motherboards 2 can be installed on both sides of the liquid cooling component respectively, and the positioning connection between the two server motherboards 2 can be achieved through the inter-board support.

[0045] In practical applications, server motherboard 2 may simultaneously house various types of electronic components. These different types of components often exhibit differences in heat generation, and even the same electronic component can generate varying amounts of heat depending on the computing load when performing different computational tasks. Therefore, different areas of server motherboard 2 have varying heat dissipation requirements, and this variation changes with the computational task. Existing cold-plate liquid cooling systems cannot flexibly adjust the flow distribution of the liquid medium according to the actual heat dissipation needs of different areas on server motherboard 2. This affects the utilization rate of the liquid medium during heat dissipation and fails to guarantee sufficient heat dissipation for high-heat-generating areas on server motherboard 2.

[0046] To address this issue, the liquid cooling assembly in this embodiment includes multiple liquid cooling plates 3, with adjacent liquid cooling plates 3 detachably connected. Each liquid cooling plate 3 has a liquid cooling cavity 31 for containing the liquid cooling medium. During assembly, the operator can determine the number of liquid cooling plates 3 in the liquid cooling assembly based on the shape and size of the server motherboard 2, and adjust the actual contact area between each liquid cooling plate 3 and the server motherboard 2 according to the distribution of electronic components on the server motherboard 2, so that the liquid cooling assembly matches the server motherboard 2. During use, since each liquid cooling plate 3 contacts different areas on the server motherboard 2, the distribution of the liquid cooling medium in each liquid cooling plate 3 can be adaptively adjusted according to the actual heat dissipation needs of each area. This allows high-heat-generating areas to receive more liquid cooling medium flow and low-heat-generating areas to receive less liquid cooling medium flow, thereby improving the overall heat dissipation effect of the server motherboard 2 and increasing the utilization rate of the liquid cooling medium.

[0047] It should be noted that the liquid cooling medium provided in this embodiment can be deionized water, ethylene glycol aqueous solution, or other common liquid media. Operators can also add other components to the conventional liquid cooling medium as needed to match the physicochemical properties of the liquid cooling medium with the actual requirements of the current application scenario.

[0048] Optionally, to achieve a detachable connection between adjacent liquid cooling plates 3, such as... Figure 4As shown, the liquid cooling plate 3 may be provided with assembly strips 37 and assembly slots 38, and the assembly strips 37 and assembly slots 38 should be located on different side walls of the liquid cooling plate 3. During assembly, the operator can insert the assembly strip 37 on the current liquid cooling plate 3 into the assembly slot 38 of the adjacent liquid cooling plate 3, and complete the splicing between multiple liquid cooling plates 3 one by one by using the assembly strips 37 and assembly slots 38, so that the liquid cooling assembly composed of multiple liquid cooling plates 3 has a similar shape and size to the server motherboard 2. Accordingly, after the splicing between adjacent liquid cooling plates 3 is completed by the assembly strips 37 and assembly slots 38, other means (such as fixing clips or connecting bolts) can be used to strengthen the assembly reliability between adjacent liquid cooling plates 3, thereby improving the overall structural strength of the liquid cooling assembly.

[0049] To achieve flexible distribution of the cooling medium in each liquid cooling plate 3 according to the heat dissipation requirements of different areas on the server motherboard 2, this embodiment provides a temperature sensing seat 4 and an adjustment connector on each liquid cooling plate 3. The temperature sensing seat 4 is used to sense the temperature change in the area where the server motherboard 2 is in contact with the current liquid cooling plate 3, so as to determine the actual heat dissipation demand changes in that area and convert the actual heat dissipation demand changes in that area into pressure changes inside the temperature sensing seat 4. The adjustment connector is used to perform actions based on the pressure changes inside the temperature sensing seat 4, thereby controlling the flow rate of the cooling medium entering the current liquid cooling plate 3, and achieving reasonable distribution of the cooling medium in each liquid cooling plate 3 in the liquid cooling assembly.

[0050] Specifically, such as Figure 5 As shown, the temperature sensing base 4 has an internal cavity 41, and a liquid-gas phase change medium is installed inside the cavity 41. Figure 8 and Figure 10 As shown, the adjusting connector includes: a connector body 5, a connecting pipe 6, and an adjusting inner core 7. The connector body 5 has a flow guiding cavity 51 inside. One end of the connecting pipe 6 is connected to the receiving cavity 41, and the other end of the connecting pipe 6 is connected to the flow guiding cavity 51. The adjusting inner core 7 is slidably disposed inside the flow guiding cavity 51. A piston head 61 is provided inside the connecting pipe 6, and the piston head 61 is connected to the adjusting inner core 7. Figure 11 As shown, the adjusting inner core 7 is provided with a flow guiding slit 71, and along the sliding direction of the adjusting inner core 7, the flow guiding slit 71 has a first end 711 and a second end 712, wherein the first end 711 is located on the side of the second end 712 away from the piston head 61, and the slit width of the flow guiding slit 71 gradually increases from the first end 711 to the second end 712. In addition, in order to facilitate the entry and exit of the liquid cooling medium into and out of the liquid cooling cavity 31, the connector body 5 is also provided with an inlet branch pipe 52 and a flow guiding pipe 53, and the liquid cooling plate 3 is also provided with an outlet branch pipe 32, wherein the inlet branch pipe 52 is connected to the flow guiding pipe 53 through the flow guiding slit 71, the flow guiding pipe 53 is connected to the liquid cooling cavity 31, and the outlet branch pipe 32 is connected to the liquid cooling cavity 31.

[0051] During normal operation, the liquid cooling medium enters the connector body 5 along the inlet branch pipe 52, then flows into the liquid cooling cavity 31 of the current liquid cooling plate 3 along the guide pipe 53, and finally leaves the current liquid cooling plate 3 along the outlet branch pipe 32. Since the heat generated by the electronic components on the server motherboard 2 is transferred to the liquid cooling plate 3, the liquid cooling medium can absorb the heat of the liquid cooling plate 3 when it flows through the current liquid cooling plate 3, thereby achieving indirect liquid cooling heat dissipation for the server motherboard 2.

[0052] When the temperature rises in the area where the server motherboard 2 contacts the liquid cooling plate 3, the heat dissipation demand in this area will increase. At this time, the liquid-gas phase change medium inside the cavity 41 will gradually change from liquid to gas as the temperature rises. Since the volume of the same substance in the gaseous state is greater than that in the liquid state, the pressure inside the cavity 41 will gradually increase as the liquid-gas phase change medium changes from liquid to gas (at this time, the cavity 41 can be considered a positive pressure environment). After the pressure inside the cavity 41 increases, the piston head 61 inside the connecting pipe 6 will move the adjusting core 7 away from the cavity 41 under the pressure. Please refer to the appendix. Figure 6 and attached Figure 7 , Figure 6 This is a schematic diagram showing the structure of the first end 711 of the flow guide cut 71 connecting the liquid inlet branch pipe 52 and the flow guide pipe 53. Figure 7 This is a schematic diagram showing the structure connecting the second end 712 of the guide cut 71 to the inlet branch pipe 52 and the guide pipe 53. When the adjusting inner core 7 moves away from the receiving cavity 41, the connection between the inlet branch pipe 52 and the guide pipe 53 will change from... Figure 6 Towards Figure 7 Changes. Since the cut width of the flow guide slit 71 gradually increases from the first end 711 to the second end 712, adjusting the inner core 7 to move away from the receiving cavity 41 can make the flow cross-sectional area between the liquid inlet branch pipe 52 and the flow guide pipe 53 larger, thereby increasing the flow rate of the liquid cooling medium entering the liquid cooling cavity 31, so as to enhance the heat dissipation effect in the area where the current liquid cooling plate 3 is located.

[0053] Correspondingly, when the temperature drops in the area where the server motherboard 2 contacts the liquid cooling plate 3, the heat dissipation demand in this area will decrease. At this time, the liquid-gas phase change medium inside the cavity 41 will gradually change from a gas phase to a liquid phase as the temperature decreases, thus reducing the pressure inside the cavity 41 (at this time, the cavity 41 can be considered a negative pressure environment). In this state, the piston head 61 inside the connecting pipe 6 will move the adjusting core 7 closer to the cavity 41 under pressure, so that the connection between the liquid inlet branch pipe 52 and the guide pipe 53 will change from... Figure 7 Towards Figure 6This change reduces the flow cross-sectional area between the inlet branch pipe 52 and the guide pipe 53, thereby reducing the flow rate of the liquid cooling medium entering the liquid cooling cavity 31. This allows for a greater distribution of the liquid cooling medium to other high-heat-generating areas, improving the utilization rate of the liquid cooling medium.

[0054] It should be noted that the liquid-gas phase change medium in this embodiment is a substance capable of undergoing a phase change between a liquid and a gas phase according to temperature changes, such as a fluorinated liquid. For example, 3M's PF-5058 fluorinated liquid is used. Since PF-5058 is a mixed liquid, the boiling points of its various components cover a range of 80℃-100℃. Therefore, when PF-5058 is used as the liquid-gas phase change medium in this embodiment, if the temperature around the temperature sensing seat 4 gradually reaches and covers the boiling point range of PF-5058, its internal components will gradually transform into the gas phase as the temperature rises. This allows the pressure inside the cavity 41 to gradually increase with the temperature, thereby driving the piston head 61 and the adjusting inner core 7 to move, and ensuring that the movement stroke of the adjusting inner core 7 matches the actual temperature.

[0055] To effectively balance the pressure difference inside the flow guiding cavity 51 caused by the movement of the adjusting inner core 7, this embodiment may provide a pressure relief hole 54 on the side wall of the connector body 5 away from the piston head 61, and the pressure relief hole 54 should be connected to the flow guiding cavity 51. When the adjusting inner core 7 moves away from the receiving cavity 41, the pressure relief hole 54 can promptly discharge the air inside the flow guiding cavity 51. When the adjusting inner core 7 moves closer to the receiving cavity 41, the pressure relief hole 54 can facilitate the entry of air from the external environment into the flow guiding cavity 51, ensuring that the adjusting inner core 7 can move smoothly.

[0056] In addition, to ensure that the sliding of the adjusting inner core 7 can effectively control the flow rate of the liquid cooling medium entering the liquid cooling cavity 31, during production and processing, the inner diameter of the liquid inlet branch pipe 52 should be equal to the inner diameter of the guide pipe 53, the inner diameter of the liquid outlet branch pipe 32 should be greater than the inner diameter of the liquid inlet branch pipe 52, and the cut width of the second end 712 of the guide cut 71 should be equal to the inner diameter of the liquid inlet branch pipe 52.

[0057] Optionally, to facilitate the assembly of the temperature sensing base 4 and the adjusting connector with the liquid cooling plate 3, this embodiment may provide a first mounting hole and a second mounting hole 34 on the liquid cooling plate 3, with the second mounting hole 34 connected to the first mounting hole. During assembly, the operator can first place the temperature sensing base 4 into the first mounting hole, and then insert the connecting pipe 6 of the adjusting connector along the second mounting hole 34 into the first mounting hole, finally connecting the connecting pipe 6 to the temperature sensing base 4 to complete the installation. Correspondingly, to prevent the liquid cooling medium flowing inside the liquid cooling cavity 31 from affecting the temperature of the temperature sensing base 4 and the connecting pipe 6, a first heat insulation sleeve 81 may also be provided in the first mounting hole, and a second heat insulation sleeve 82 may also be provided in the second mounting hole 34. During assembly, the first heat insulation sleeve 81 should be located between the inner wall of the first mounting hole and the outer wall of the temperature sensing seat 4, and the second heat insulation sleeve 82 should be located between the inner wall of the second mounting hole 34 and the outer wall of the connecting pipe 6, so that the temperature sensing seat 4 and the connecting pipe 6 form a temperature isolation with the liquid cooling plate 3, ensuring that the liquid-gas phase change medium can accurately change phase according to the temperature.

[0058] In addition, to prevent the temperature sensing base 4 from detaching from the first mounting hole and to enhance its temperature sensing capability, the first mounting hole may include a first limiting segment 332, a receiving segment 331, and a second limiting segment connected in sequence. The inner diameters of both the first limiting segment 332 and the second limiting segment are larger than the inner diameter of the receiving segment 331, and the temperature sensing base 4 is located inside the receiving segment 331. Simultaneously, a heat-conducting limiting plate 42 made of metal or other materials with good thermal conductivity can be provided inside both the first limiting segment 332 and the second limiting segment, and the outer diameter of the heat-conducting limiting plate 42 is larger than the inner diameter of the receiving segment 331. Figure 9 As shown, each heat-conducting limiting plate 42 is provided with a threaded connector 421, and the temperature sensing seat 4 is provided with a threaded hole 43 for accommodating the threaded connector 421. After the temperature sensing seat 4 is successfully installed into the receiving section 331, the operator can screw the threaded connector 421 of the heat-conducting limiting plate 42 into the threaded hole 43, thereby limiting the temperature sensing seat 4 inside the first mounting hole with the help of the heat-conducting limiting plate 42, and improving the heat conduction effect between the temperature sensing seat 4 and the server motherboard 2.

[0059] As an optional implementation method of this embodiment, such as Figure 12As shown, multiple spiral guide vanes 713 can be provided on the inner wall of the second end 712 of the guide cut 71. The normal direction of each spiral guide vane 713 should be parallel to the line connecting the liquid inlet branch pipe 52 and the guide pipe 53, and the multiple spiral guide vanes 713 should be arranged spirally on the central periphery of the second end 712 of the guide cut 71. In practical applications, when the liquid inlet branch pipe 52 and the guide pipe 53 are connected through the second end 712 of the guide cut 71, it proves that the area where the liquid cooling plate 3 is located has extremely high heat dissipation requirements. To ensure that the liquid cooling medium entering the liquid cooling plate 3 at this time produces a better heat exchange effect, this embodiment will adjust the flow state of the liquid cooling medium through multiple spiral guide vanes 713. When the liquid cooling medium flows through the area where multiple spiral guide vanes 713 are located, the presence of the spiral guide vanes 713 can change the liquid cooling medium from the common natural flow state to a swirling state. Because the flow of the liquid cooling medium is more turbulent in the swirling state, it is more conducive to the rapid absorption of heat by the liquid cooling medium, thereby improving the heat dissipation effect of the current liquid cooling plate 3.

[0060] As another optional implementation of this embodiment, in order to prolong the residence time of the liquid cooling medium inside the liquid cooling cavity 31, such as... Figure 5 As shown, the liquid-cooled cavity 31 may be provided with multiple alternately arranged guide plates 35, and a flow channel is formed between adjacent guide plates 35. When the liquid cooling medium enters the liquid-cooled cavity 31, it will flow along the flow channel, thus enabling the liquid cooling medium to flow evenly through various areas inside the liquid-cooled cavity 31 and providing sufficient heat exchange time between the liquid cooling medium and the liquid cooling plate 3, thereby fully utilizing its heat absorption effect.

[0061] In addition, to facilitate the rapid and efficient transfer of heat from the server motherboard 2 to the liquid cooling plate 3, the liquid cooling plate 3 in this embodiment may also have a heat-conducting surface. After the server motherboard 2 and the liquid cooling components are assembled, the heat-conducting surfaces on each liquid cooling plate 3 will come into contact with the server motherboard 2, facilitating heat conduction through the heat-conducting surfaces. Furthermore, a thermal grease layer may be provided between the heat-conducting surface and the server motherboard 2, thereby enhancing the heat conduction effect. Additionally, this embodiment may also have multiple mounting holes on the heat-conducting surface, each mounting hole containing a heat-conducting core 36 with a thermal conductivity greater than that of the liquid cooling plate 3. For example, when the liquid cooling plate 3 is made of pure aluminum (common pure aluminum has a thermal conductivity of approximately 200 W / m·K), the heat-conducting core 36 provided in this embodiment may be made of pure copper (common pure copper has a thermal conductivity of approximately 400 W / m·K). In this case, the heat-conducting core 36 can transfer heat more quickly and effectively reduce the overall weight and manufacturing cost of the liquid cooling plate 3.

[0062] It should be noted that during processing, sealant should be filled between the outer wall of the heat-conducting core 36 and the inner wall of the assembly hole to prevent the liquid cooling medium from leaking out along the gap between the heat-conducting core 36 and the assembly hole.

[0063] like Figure 1 As shown, the adaptive liquid-cooled computing server provided in this embodiment may further include a circulation pump 12 and a cooling module 13. The circulation pump 12 is used to drive the liquid cooling medium to circulate, and the cooling module 13 is used to cool the liquid cooling medium to facilitate its recycling. Specifically, the circulation pump 12 in this embodiment should have an inlet pipe and an outlet pipe. During assembly, the inlet branch pipe 52 of the adjusting joint on each liquid cooling plate 3 should be connected to the outlet pipe, and the outlet branch pipe 32 on each liquid cooling plate 3 should be connected to the inlet pipe, so that the circulation pump 12 can drive the liquid cooling medium to circulate in the device after starting. The cooling module 13 may include a heat exchange unit 131 and a cooling unit 132. The heat exchange unit 131 is disposed on the outlet pipe, and the cooling unit 132 is disposed on one side of the heat exchange unit 131. The cooling unit 132 is used to reduce the temperature of the heat exchange unit 131, thereby cooling the liquid cooling medium flowing through the heat exchange unit 131. It should be noted that the heat exchange unit 131 provided in this embodiment can be a finned heat sink commonly used in liquid cooling. The heat exchange unit 131 should have a channel hole to accommodate the outflow pipe or an internal base pipe connected in series with the outflow pipe, and should have multiple fins. The cooling unit 132 can be a common cooling fan, thereby reducing the temperature of the heat exchange unit 131 through air cooling, or it can be other common refrigeration equipment with cooling capacity, thereby reducing the temperature of the heat exchange unit 131 by means of the cooling capacity generated by the cooling unit 132.

[0064] In addition, to reasonably balance the heat dissipation and power consumption of this device, and to adjust the heat dissipation capacity of this device in combination with the actual computing load of the processing module 11, the adaptive liquid-cooled computing server may also include a detection module 14 and a control module 15. The detection module 14 may include at least one detection unit 141 for collecting current signals from the processing unit 111, and the number of detection units 141 should match the number of processing units 111, so that each detection unit 141 can collect the current signal of each processing unit 111 in a one-to-one correspondence. The control module 15 is used to adjust the input power of the circulating pump 12 and the input power of the cooling unit 132 according to the current signals collected by each detection unit 141 in the detection module 14. During assembly, the control module 15 should be electrically connected to the detection module 14, the circulating pump 12, and the cooling unit 132 respectively via data cables to facilitate signal transmission.

[0065] For example, to acquire the current signal of the processing unit 111, the detection unit 141 provided in this embodiment can be a current detector installed on the server motherboard 2, or an existing current detection device installed on the power supply line of the server motherboard 2 or the processing unit 111. The control module 15 can be a common controller (such as a microcontroller or PLC). The working principle and specific structure of the above devices are well known, so they will not be described in detail here.

[0066] Since the current signal of processing unit 111 increases with its computing load, and the heat generated by processing unit 111 is also proportional to its computing load, a higher current signal indicates higher heat generation. To prevent processing unit 111 from throttling under high heat generation, the circulation pump 12 and cooling unit 132 in this embodiment should have higher input power to achieve faster circulation and cooling of the liquid cooling medium, thereby reducing the temperature of processing unit 111 in a timely manner. However, maintaining high input power for circulation pump 12 and cooling unit 132 for an extended period would significantly increase the power consumption of the device, resulting in unnecessary waste. Furthermore, the correlation between current signal changes and heat generation varies depending on the hardware type and the processing unit 111 performing different tasks. Therefore, simply increasing the input power of circulation pump 12 and cooling unit 132 at the point where the current signal collected by control module 15 increases would lead to poor control accuracy.

[0067] To solve the above problems, in this embodiment, the control module 15 adjusts the input power of the circulating pump 12 and the input power of the cooling unit 132 based on the current signals collected by each detection unit 141 in the detection module 14, which may include the following steps:

[0068] Step S1: Obtain the hardware type and task type of the processing unit 111, determine the hardware coefficient and task coefficient based on the hardware type and task type of the processing unit 111, and calculate the weight coefficient of the processing unit 111 based on the hardware coefficient, task coefficient and the current signal collected by the detection unit 141.

[0069] Step S2: Calculate the comprehensive current parameters based on the weighting coefficients of each processing unit 111 and the current signals collected by each detection unit 141.

[0070] Step S3: Adjust the input power of the circulating pump 12 and the input power of the cooling unit 132 according to the comprehensive current parameters.

[0071] Specifically, in step S1, the weighting coefficient of processing unit 111 is calculated based on the hardware type and task type, which can be done using the following formula:

[0072]

[0073] In the above formula, For the first The weighting coefficients of each processing unit. For hardware coefficients, For task coefficients, For the first Current signal of each processing unit For the first The preset reference current for each processing unit , and All are weighted coefficients, and + + =1, > > .

[0074] It should be noted that after obtaining the hardware type and task type of the processing unit 111, the hardware coefficient and task coefficient of the current processing unit 111 can be determined according to the preset hardware coefficient table and the preset task coefficient table.

[0075] For example, the preset hardware coefficient table is as follows:

[0076]

[0077] The preset task coefficient table is as follows:

[0078]

[0079] The weighting coefficient calculation method of the processing unit 111 described above can not only effectively consider the influence of hardware type and task type, but also introduce dynamic load items. This allows the weights of the processing unit 111 to be adjusted according to the real-time computing load, thereby improving the accuracy of the weight coefficient calculation.

[0080] In step S2, the comprehensive current parameters are calculated based on the weighting coefficients of each processing unit 111 and the current signals collected by each detection unit 141, using the following formula:

[0081]

[0082] In the above formula, For comprehensive current parameters, It is the sum of the products of the weighting coefficients of each processing unit and the current signal. It is the sum of the weight coefficients of each processing unit. The preset hotspot impact factor ranges from 0.1 to 0.3. This is the maximum current signal acquired by the detection module. This is the average value of the current signals collected by each detection unit.

[0083] In the above formula for calculating the comprehensive current parameters, This is a weighted average current term, used to reflect the overall workload level of the processing module. This is a hotspot correction item, used in... Significantly higher than Time increases The value is set to ensure that the system responds quickly to local overheating.

[0084] In step S3, the input power of the circulating pump 12 and the input power of the cooling unit 132 are adjusted according to the comprehensive current parameters, which can be done using the following formula:

[0085]

[0086]

[0087]

[0088]

[0089]

[0090]

[0091] In the above formula, Input power to the circulating pump, Input power to the cooling unit, This refers to the standby power of the circulating pump. This refers to the standby power of the cooling unit. This is the power gain coefficient of the circulating pump. This represents the gain coefficient of the cooling unit. For comprehensive current parameters, and These are the minimum starting power and maximum allowable power of the circulating pump, respectively. and These are the minimum starting power and maximum allowable power of the cooling unit, respectively. This is the preset maximum allowable current parameter.

[0092] During the adjustment of the input power of the circulating pump 12 and the input power of the cooling unit 132, the input power of the circulating pump 12 and the comprehensive current parameters are... It is directly proportional, thus ensuring that the overall current parameters are consistent. During the upward movement, the input power of the circulating pump 12 is increased in a timely manner, thereby accelerating the flow rate of the liquid cooling medium. At the same time, the input power adjustment of the cooling unit 132 can be coordinated with the input power adjustment of the circulating pump 12 to ensure that the cooling rate of the liquid cooling medium matches its flow rate, which not only ensures the effectiveness of the cooling of the liquid cooling medium, but also avoids energy waste.

[0093] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An adaptive liquid-cooled computing server, comprising a processing module (11), the processing module (11) comprising at least one processing unit (111), the processing unit (111) comprising a liquid cooling component and at least one server motherboard (2), and the server motherboard (2) being detachably mounted on the liquid cooling component, characterized in that: The liquid cooling assembly includes multiple liquid cooling plates (3), adjacent liquid cooling plates (3) are detachably connected, each liquid cooling plate (3) has a liquid cooling cavity (31) for containing liquid cooling medium, and each liquid cooling plate (3) is provided with a temperature sensing seat (4) and an adjustment connector; the temperature sensing seat (4) has a cavity (41) inside, and a liquid-gas phase change medium is installed inside the cavity (41); the adjustment connector includes: a connector body (5), a connecting pipe (6) and an adjustment core (7), the connector body (5) has a flow guiding cavity (51) inside, one end of the connecting pipe (6) is connected to the cavity (41), and the other end of the connecting pipe (6) is connected to the flow guiding cavity (51). The liquid cooling plate (3) is provided with a first mounting hole, and the temperature sensing seat (4) is detachably disposed inside the first mounting hole. A first heat insulation sleeve (81) is also provided in the first mounting hole, and the first heat insulation sleeve (81) is located between the inner wall of the first mounting hole and the outer wall of the temperature sensing seat (4). The liquid cooling plate (3) is provided with a second mounting hole (34), and the second mounting hole (34) is connected to the first mounting hole. The connecting pipe (6) is detachably disposed inside the second mounting hole (34). A second heat insulation sleeve (82) is also provided in the second mounting hole (34), and the second heat insulation sleeve (82) is located between the inner wall of the second mounting hole (34) and the outer wall of the connecting pipe (6). Between the outer walls of the connector body (5); the adjusting inner core (7) is slidably disposed inside the flow guiding cavity (51), and a piston head (61) is provided inside the connecting pipe (6), and the piston head (61) is connected to the adjusting inner core (7); the adjusting inner core (7) is provided with a flow guiding cut (71), and along the sliding direction of the adjusting inner core (7), the flow guiding cut (71) has a first end (711) and a second end (712), the first end (711) is located on the side of the second end (712) away from the piston head (61), and the cut width of the flow guiding cut (71) gradually increases from the first end (711) to the second end (712); the connector body (5) is provided with an inlet branch pipe ( 52) and guide pipe (53), the liquid cooling plate (3) is provided with an outlet branch pipe (32) connected to the liquid cooling cavity (31), the inlet branch pipe (52) is connected to the guide pipe (53) through the guide cut (71), and the guide pipe (53) is connected to the liquid cooling cavity (31); the inner wall of the second end (712) of the guide cut (71) is also provided with a plurality of spiral guide vanes (713), the normal direction of each spiral guide vane (713) is parallel to the line connecting the inlet branch pipe (52) and the guide pipe (53), and the plurality of spiral guide vanes (713) are arranged in a spiral shape on the central periphery of the second end (712) of the guide cut (71).

2. The adaptive liquid-cooled computing server according to claim 1, characterized in that: The first mounting hole includes a first limiting section (332), a receiving section (331), and a second limiting section connected in sequence. The inner diameters of the first limiting section (332) and the second limiting section are both larger than the inner diameter of the receiving section (331), and the temperature sensing seat (4) is located inside the receiving section (331). A heat-conducting limiting plate (42) is provided inside the first limiting section (332) and the second limiting section, and the outer diameter of the heat-conducting limiting plate (42) is larger than the inner diameter of the receiving section (331). Each heat-conducting limiting plate (42) is provided with a threaded joint (421), and a threaded hole (43) for receiving the threaded joint (421) is provided on the temperature sensing seat (4).

3. The adaptive liquid-cooled computing server according to claim 1, characterized in that: The connector body (5) has a pressure relief hole (54) on the side wall away from the piston head (61), and the pressure relief hole (54) is connected to the flow guiding cavity (51).

4. The adaptive liquid-cooled computing server according to claim 1, characterized in that: The liquid-cooled cavity (31) is provided with multiple alternately arranged guide plates (35), and a guide channel is formed between adjacent guide plates (35).

5. The adaptive liquid-cooled computing server according to claim 1, characterized in that: The liquid cooling plate (3) has a heat-conducting surface, which is in contact with the server motherboard (2), and a heat-conducting silicone grease layer is provided between the heat-conducting surface and the server motherboard (2); the heat-conducting surface is also provided with a plurality of mounting holes, and a heat-conducting core (36) is provided inside each mounting hole. The outer wall of the heat-conducting core (36) and the inner wall of the mounting hole are filled with sealant, and the thermal conductivity of the heat-conducting core (36) is greater than that of the liquid cooling plate (3).

6. The adaptive liquid-cooled computing server according to claim 1, characterized in that: The inner diameter of the inlet branch pipe (52) is equal to the inner diameter of the guide pipe (53), the inner diameter of the outlet branch pipe (32) is greater than the inner diameter of the inlet branch pipe (52), and the cut width of the second end (712) of the guide cut (71) is equal to the inner diameter of the inlet branch pipe (52).

7. The adaptive liquid-cooled computing server according to claim 1, characterized in that: The liquid cooling plate (3) is provided with an assembly strip (37) and an assembly groove (38) for accommodating the assembly strip (37), and the assembly strip (37) and the assembly groove (38) are respectively located on different side walls of the liquid cooling plate (3).

8. The adaptive liquid-cooled computing server according to claim 1, characterized in that: The adaptive liquid-cooled computing server includes a circulation pump (12) and a cooling module (13); the circulation pump (12) has an inlet pipe and an outlet pipe, the inlet branch pipe (52) is connected to the outlet pipe, and the outlet branch pipe (32) is connected to the inlet pipe; the cooling module (13) includes a heat exchange unit (131) and a cooling unit (132) for reducing the temperature of the heat exchange unit (131), and the heat exchange unit (131) is disposed on the outlet pipe.

9. The adaptive liquid-cooled computing server according to claim 8, characterized in that: The adaptive liquid-cooled heat dissipation computing server also includes a detection module (14) and a control module (15); the detection module (14) includes at least one detection unit (141), and the detection unit (141) is used to collect the current signal of the processing unit (111); the control module (15) is electrically connected to the detection module (14), the circulation pump (12) and the cooling unit (132) respectively, and the control module (15) is used to adjust the input power of the circulation pump (12) and the input power of the cooling unit (132) according to the current signal collected by each detection unit (141) in the detection module (14).

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