Solid-state packaging voltage doubling rectifying module of X-ray high-voltage generator and medical equipment

Abstract

The invention relates to the technical field of high-voltage equipment, and discloses an X-ray high-voltage generator solid-state packaging voltage-doubling rectifying module and medical device.The X-ray high-voltage generator solid-state packaging voltage-doubling rectifying module comprises a rectifying voltage-doubling unit, a heat dissipation unit and a packaging body, and the rectifying voltage-doubling unit comprises a circuit board and a diode which are connected; the heat dissipation unit comprises a metal piece, the outer surface of the metal piece comprises a spherical surface portion, the metal piece is connected with the diode, the metal piece and the diode are located on the two sides of the circuit board respectively, and the packaging body is solid and packages at least part of the rectification voltage-multiplying unit and the heat dissipation unit. Through the mutual cooperation of the metal piece and the packaging body, a heat dissipation structure of solid packaging is realized, and through the arrangement of the metal piece with electric field shimming and heat storage functions, the solid-state packaging voltage doubling rectifier module of the X-ray high-voltage generator still has good heat dissipation performance and uniform electric field distribution characteristics under a solid packaging condition, and the solid-state packaging voltage doubling rectifier module of the X-ray high-voltage generator has good heat dissipation performance. And the insulation reliability and long-term operation stability of the high-voltage module are improved.

Description

Technical Field

[0001] This application relates to the field of high voltage equipment technology, and in particular to a solid-state packaged voltage multiplier rectifier module for an X-ray high voltage generator and a medical device. Background Technology

[0002] In related technologies, X-ray high-voltage voltage multiplier rectifier modules typically use insulating oil as the primary insulating and heat dissipation medium. This type of oil-sealed structure usually requires a separate oil tank, resulting in a large overall size of the high-voltage module. This not only occupies equipment installation space but also increases the difficulty of transportation, installation, and system integration. Furthermore, oil-sealed high-voltage modules require regular replacement of the insulating oil and leakage detection during long-term operation, making the maintenance process complex and time-consuming. Summary of the Invention

[0003] This application aims to address at least one of the technical problems existing in the prior art or related technologies.

[0004] The first aspect of this application proposes a solid-state packaged voltage multiplier rectifier module for an X-ray high voltage generator. The solid-state packaged voltage multiplier rectifier module for an X-ray high voltage generator includes: a voltage multiplier unit, a heat dissipation unit, and a package. The voltage multiplier unit includes a circuit board and a diode connected to each other. The heat dissipation unit includes a metal component with a spherical outer surface. The metal component is connected to the diode. The metal component and the diode are located on opposite sides of the circuit board. The package is solid and encapsulates at least part of the voltage multiplier unit and the heat dissipation unit.

[0005] In some of the technical solutions provided in this application, the heat dissipation unit further includes: a heat-conducting pillar, the first end of which extends into the metal part, and the second end of which extends out of the metal part and extends in a direction away from the circuit board.

[0006] In some of the technical solutions provided in this application, the solid-state packaged voltage multiplier rectifier module for X-ray high voltage generator further includes: a heat sink housing, the package being located inside the heat sink housing, and the second end of the heat-conducting pillar being connected to the heat sink housing, the heat-conducting pillar being used to transfer the heat generated by the diode to the heat sink housing.

[0007] In some of the technical solutions provided in this application, the heat dissipation unit also includes: thermally conductive adhesive, which fills the gap between the thermally conductive pillar and the metal part.

[0008] In some of the technical solutions provided in this application, the heat dissipation unit further includes: a heat-conducting plate, which is connected to the circuit board; a metal component and a diode are respectively connected to the heat-conducting plate; and the heat-conducting plate is located between the metal component and the diode.

[0009] In some of the technical solutions provided in this application, any metal component is connected to multiple diodes in parallel.

[0010] In some of the technical solutions provided in this application, there are multiple metal parts, which form multiple rows and columns.

[0011] In some of the technical solutions provided in this application, the diameter of the spherical surface is 8mm to 18mm.

[0012] In some of the technical solutions provided in this application, the outer wall of the heat dissipation shell is provided with heat dissipation fins.

[0013] The second aspect of the technical solution of this application proposes a medical device, which includes: an X-ray high voltage generator solid-state packaged voltage multiplier rectifier module provided in any of the above embodiments.

[0014] Compared with related technologies, the present invention has at least the following beneficial effects: By cooperating with the metal components and the package, a heat dissipation structure for solid-state packaging is achieved. By incorporating metal components that function as both electric field homogenizers and heat storage devices, the solid-state packaged voltage multiplier rectifier module for X-ray high-voltage generators maintains excellent heat dissipation performance and uniform electric field distribution characteristics even under solid-state packaging conditions. This reduces heat accumulation in the rectifier multiplier unit, delays insulation aging of the package, and improves the insulation reliability and long-term operational stability of the solid-state packaged voltage multiplier rectifier module for X-ray high-voltage generators. It also solves the problem of heat dissipation being difficult to achieve in a timely manner due to the limited thermal conductivity of solid-state packaging materials, thus enhancing the engineering practicality of the solid-state packaged voltage multiplier rectifier module for X-ray high-voltage generators. Attached Figure Description

[0015] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of some embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 A cross-sectional view of a rectifier voltage multiplier unit and a heat dissipation unit according to an embodiment of this application; Figure 2 One of the front views of the rectifier voltage multiplier unit and heat dissipation unit provided in this application; Figure 3 One of the partial axial views of the rectifier voltage multiplier unit and heat dissipation unit provided in this application; Figure 4 A second partial axial view of a rectifier voltage multiplier unit and a heat dissipation unit provided in one embodiment of this application; Figure 5 An overall axial view of a rectifier voltage multiplier unit and a heat dissipation unit according to an embodiment of this application; Figure 6A schematic diagram of the structure of a rectifier voltage multiplier unit according to an embodiment of this application; Figure 7 A schematic diagram of the structure of a diode according to an embodiment of this application; Figure 8 A cross-sectional view of a diode provided in one embodiment of this application; Figure 9 A partial structural schematic diagram of a diode according to an embodiment of this application; Figure 10 It shows Figure 9 A sectional view cut along section AA. Figure 11 One of the structural schematic diagrams of a solid-state packaged voltage multiplier rectifier module for an X-ray high-voltage generator provided in this application; Figure 12 A partial structural schematic diagram of a solid-state packaged voltage multiplier rectifier module for an X-ray high-voltage generator according to an embodiment of this application; Figure 13 A second schematic diagram of the structure of a solid-state packaged voltage multiplier rectifier module for an X-ray high-voltage generator according to an embodiment of this application; Figure 14 A third schematic diagram of the structure of a solid-state packaged voltage multiplier rectifier module for an X-ray high-voltage generator according to an embodiment of this application; Figure 15 A cross-sectional view of a solid-state packaged voltage multiplier rectifier module for an X-ray high voltage generator according to an embodiment of this application; Figure 16 A bottom view of a rectifier voltage multiplier unit and a heat dissipation unit according to an embodiment of this application; Figure 17 A second front view of the rectifier voltage multiplier unit and heat dissipation unit provided in one embodiment of this application; Figure 18 A third partial axial view of a rectifier voltage multiplier unit and a heat dissipation unit provided in one embodiment of this application.

[0016] in, Figures 1 to 18 The correspondence between the reference numerals and component names in the attached drawings is as follows: 10. Solid-state packaged voltage multiplier rectifier module for X-ray high voltage generator; 100. Rectifier and voltage multiplier unit; 110. Circuit board; 111. Mounting hole; 120. Diode; 121. PN junction; 123. Thermal conductive plate; 122. Lead wire; 130. Electrode; 200. Heat dissipation unit; 210. Metal part; 220. Thermal conductive pillar; 230. Thermal conductive adhesive; 240. Thermal conductive plate; 300. Package; 400. Heat dissipation shell; 410. Heat dissipation fins. Detailed Implementation

[0017] To better understand the above technical solutions, the technical solutions of the embodiments of this application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments of this application and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this application, rather than limitations on the technical solutions of this application. In the absence of conflict, the embodiments of this application and the technical features in the embodiments can be combined with each other.

[0018] The first aspect of this application provides a solid-state packaged voltage multiplier rectifier module 10 for an X-ray high-voltage generator, such as... Figures 1 to 10 ,as well as Figure 15 As shown, the solid-state packaged voltage multiplier rectifier module 10 of the X-ray high voltage generator includes: a voltage multiplier unit 100, a heat dissipation unit 200, and a package 300. The voltage multiplier unit 100 includes a circuit board 110 and a diode 120 connected to each other. The heat dissipation unit 200 includes a metal part 210. The outer surface of the metal part 210 includes a spherical part. The metal part 210 is connected to the diode 120. The metal part 210 and the diode 120 are located on both sides of the circuit board 110, respectively. The package 300 is solid and encapsulates at least part of the voltage multiplier unit 100 and the heat dissipation unit 200.

[0019] In this embodiment, the solid-state packaged voltage multiplier rectifier module 10 of the X-ray high-voltage generator can be used in medical equipment, security inspection equipment, and environmental protection equipment. The circuit board 110 can be a PCB (Printed Circuit Board). The diode 120 is connected to the voltage multiplier circuit of the circuit board 110. The circuit board 110 is provided with an electrode 130 for receiving AC voltage. The diode 120 uses its unidirectional conductivity to guide the AC input voltage to charge the capacitor in the voltage multiplier circuit, thereby achieving the voltage multiplication function. This realizes the rectification and voltage multiplication conversion of AC voltage to high-voltage DC voltage, meeting the power supply requirements of high-voltage power application scenarios. The diode 120 can be a high-voltage silicon carbide (SiC) diode 120. The diode 120 has stacked PN junctions. As the main heat-generating device of the voltage multiplier unit 100, the diode 120 has high thermal conductivity, enabling it to quickly transfer the internal heat generated under high-power operation conditions to the package 300 and the heat dissipation unit 200.

[0020] The rectifier voltage multiplier unit 100 has a metal component 210 in its heat-generating area. The metal component 210 is located on the back of the circuit board 110, and the diode 120 is located on the front of the circuit board 110. The metal component 210 is soldered to the lead 122 of the diode 120. The metal component 210 can be made of copper and includes at least a partially spherical structure, such that the outer surface of the metal component 210 includes a spherical portion. For example, the shape of the metal component 210 is spherical, forming a metal sphere, or the metal component 210 is a partially spherical structure formed by cutting a sphere through one or more planes. On the one hand, the metal component 210 has high thermal conductivity, which can quickly conduct the heat generated by the PN junction 121 of the diode 120 during operation and diffuse it evenly, thereby reducing the heat load on the diode 120 and the surrounding area. Furthermore, the high volumetric heat capacity of the metal component 210 can act as a buffer when heat is concentrated, realizing heat absorption and buffering, temporarily absorbing some heat energy, reducing instantaneous temperature rise, and improving the thermal stability of the device. On the other hand, the smooth spherical structure of the metal component 210 can effectively eliminate the tip effect, reduce the local excessive field strength, and make the electric field distribution of the rectifier voltage multiplier unit 100 more uniform. With any spherical surface located at the top of the metal component 210, and the spherical surfaces of each metal component 210 facing each other, the uniformity of the electric field is further improved.

[0021] For example, the outer surface of the metal part 210 may be provided with a thermally conductive coating, which may be made of graphene material, and the thermally conductive coating is used to improve the heat dissipation efficiency of the metal part 210.

[0022] The insulating material of the encapsulation body 300 can be epoxy resin or silicone. The solid encapsulation body 300 wraps around the rectifier voltage multiplier unit 100 and the heat dissipation unit 200 to encapsulate the rectifier voltage multiplier unit 100 and the heat dissipation unit 200. Compared with the traditional oil seal structure in related technologies, it reduces the installation space occupied by the oil tank and simplifies the maintenance process of the encapsulation body 300.

[0023] The interaction between the metal component 210 and the package 300 achieves a heat dissipation structure for solid-state packaging. By incorporating the metal component 210, which combines electric field uniformity and heat storage functions, the solid-state packaged voltage multiplier rectifier module 10 for X-ray high-voltage generators maintains excellent heat dissipation performance and uniform electric field distribution characteristics even under solid-state packaging conditions. This reduces heat accumulation in the rectifier multiplier unit 100, delays insulation aging of the package 300, and improves the insulation reliability and long-term operational stability of the solid-state packaged voltage multiplier rectifier module 10 for X-ray high-voltage generators. It solves the problem of heat dissipation being difficult to achieve in a timely manner due to the limited thermal conductivity of solid-state packaging materials, thus enhancing the engineering practicality of the solid-state packaged voltage multiplier rectifier module 10 for X-ray high-voltage generators.

[0024] In some embodiments provided in this application, such as Figures 1 to 5As shown, the heat dissipation unit 200 also includes a heat-conducting pillar 220, the first end of which extends into the metal part 210, and the second end of which extends out of the metal part 210 and extends in a direction away from the circuit board 110.

[0025] In this embodiment, the heat-conducting column 220 can be a solid column or a hollow column, and the material of the heat-conducting column 220 can be ceramic, forming a ceramic rod or a ceramic tube. A heat-conducting column 220 extending outward is coaxially provided inside the metal part 210, penetrating the metal part 210 and extending outward from the spherical surface, forming a rapid heat conduction channel. Utilizing the excellent insulation and thermal conductivity of ceramic material, the risk of leakage under high-voltage conditions is avoided, the heat transfer path is extended, and the heat on the metal part 210 is further dissipated outward, improving the heat conduction efficiency of the heat dissipation unit 200.

[0026] In some embodiments provided in this application, such as Figures 11 to 15 As shown, the solid-state packaged voltage multiplier rectifier module 10 of the X-ray high voltage generator also includes: a heat sink 400, a package 300 located inside the heat sink 400, and a second end of a heat-conducting pillar 220 connected to the heat sink 400. The heat-conducting pillar 220 is used to transfer the heat generated by the diode 120 to the heat sink 400.

[0027] In this embodiment, a package 300 is cast inside the heat sink 400 for solid encapsulation. The heat sink 400 is made of metal and is in contact with the second end of the heat-conducting pillar 220. By constructing a complete heat dissipation path from the diode 120 to the heat sink 400, the heat generated by the diode 120 is transferred step by step through the metal part 210 and the heat-conducting pillar 220 to the heat sink 400 with a larger surface area, thereby diffusing the heat to the external environment. This significantly improves the overall heat dissipation capacity of the solid-state packaged voltage doubler rectifier module 10 of the X-ray high voltage generator, reduces the internal operating temperature of the rectifier voltage doubler unit 100, and extends the service life of the solid-state packaged voltage doubler rectifier module 10 of the X-ray high voltage generator.

[0028] In some embodiments provided in this application, such as Figure 1 As shown, the heat dissipation unit 200 also includes thermally conductive adhesive 230, which fills the gap between the thermally conductive pillar 220 and the metal part 210.

[0029] In this embodiment, the thermally conductive adhesive 230 possesses high thermal conductivity, electrical insulation, high voltage resistance, and high temperature resistance. For example, the material of the thermally conductive adhesive 230 can be silicone, epoxy resin, boron nitride, or aluminum oxide. The thermally conductive adhesive 230 in the gap between the thermally conductive pillar 220 and the metal part 210 can eliminate the contact thermal resistance generated by the gap, enhance the heat conduction efficiency between the thermally conductive pillar 220 and the metal part 210, and ensure rapid heat transfer. At the same time, the thermally conductive adhesive 230 enhances the connection strength between the thermally conductive pillar 220 and the metal part 210 when filling the gap, improving the structural reliability of the heat dissipation unit 200.

[0030] In some embodiments provided in this application, such as Figures 1 to 4 As shown, the heat dissipation unit 200 also includes: a heat-conducting plate 240, which is connected to the circuit board 110; a metal component 210 and a diode 120 are respectively connected to the heat-conducting plate 240; and the heat-conducting plate 240 is located between the metal component 210 and the diode 120.

[0031] In this embodiment, a heat-conducting plate 240 is provided on the circuit board 110. For example, the circuit board 110 has mounting holes 111, and the heat-conducting plate 240 is located within the mounting holes 111. The heat-conducting plate 240 is perpendicular to the heat-conducting pillars 220. The heat-conducting plate 240 is made of a metal material, for example, copper. The metal component 210 and the diode 120 are respectively connected to both sides of the heat-conducting plate 240. The diode 120 is soldered to the bottom surface of the heat-conducting plate 240, and the pads of adjacent diodes 120 on the heat-conducting plate 240 are connected to expand the thermally conductive contact pads. The heat generated by the diode 120 is first transferred to the heat-conducting plate 240 for initial dispersion to avoid local heat accumulation. Then, the heat-conducting plate 240 conducts the heat to the metal component 210. Furthermore, the heat-conducting plate 240 helps to fix the relative positions of the diode 120 and the metal part 210, and increases the connection area of ​​the diode 120 and the metal part 210 respectively, thereby improving the stability of the connection between the rectifier voltage multiplier unit 100 and the heat dissipation unit 200 and ensuring the structural stability of the solid-state packaged voltage multiplier rectifier module 10 of the X-ray high voltage generator.

[0032] For example, the heat-conducting plate 240 has multiple heat dissipation grooves on the side away from the diode 120. The heat dissipation grooves are used to increase the contact area between the heat-conducting plate 240 and the package 300, thereby enhancing the heat dissipation effect.

[0033] In some embodiments provided in this application, such as Figures 1 to 4 ,as well as Figures 16 to 18 As shown, any metal component 210 is connected to a plurality of diodes 120 connected in parallel.

[0034] In this embodiment, multiple diodes 120 connected in parallel share the heat dissipation metal component 210, achieving centralized utilization of the metal component 210, reducing the number of metal components 210, and lowering the production cost and space occupied by the heat dissipation unit 200. Furthermore, the parallel arrangement of the diodes 120 effectively improves the current carrying capacity of the rectifier voltage multiplier unit 100, balancing the dual requirements of high-voltage output and power enhancement.

[0035] In some embodiments, such as Figures 16 to 18 Multiple diodes 120 are arranged horizontally, with each diode 120 adjacent to a heat-conducting plate 240 to reduce the thickness of the rectifier voltage multiplier unit 100. In other embodiments, such as Figures 2 to 4 Multiple diodes 120 are arranged in a direction away from the heat-conducting plate 240, that is, the diodes 120 are arranged vertically to meet different installation requirements of the diodes 120. In some embodiments provided in this application, such as Figure 5 As shown, there are multiple metal parts 210, which form multiple rows and columns.

[0036] In this embodiment, multiple metal components 210 are distributed on the circuit board 110 in a multi-row, multi-column array. For example, the metal components 210 can be arranged in a 2×4, 3×6, or 4×8 pattern. This improves the uniformity and dispersion of the metal components 210, allowing heat to be evenly distributed and preventing excessive heat concentration in local areas. Furthermore, the array layout is compatible with modular production and assembly processes, facilitating mass production and improving production efficiency.

[0037] In some embodiments provided in this application, the diameter of the spherical surface is 8 mm to 18 mm.

[0038] In this embodiment, the diameter of the spherical part of the metal component 210 is limited to a reasonable range. While ensuring that the metal component 210 has sufficient heat dissipation surface area to meet heat dissipation requirements and uniform electric field function, it avoids the overall size of the module from increasing due to the excessive size of the metal component 210. This achieves a balance between heat dissipation performance and module miniaturization, making it suitable for application scenarios with strict size requirements, such as medical equipment.

[0039] For example, the diameter of the heat-conducting pillar 220 is 1 / 5 to 1 / 3 of the diameter of the spherical surface.

[0040] In some embodiments provided in this application, such as Figure 14 and Figure 15 As shown, the outer wall of the heat dissipation housing 400 is provided with heat dissipation fins 410.

[0041] In this embodiment, the inner wall of the heat sink 400 is lined with thermally conductive ceramic, and the outer wall of the heat sink 400 is provided with heat dissipation fins 410. The thermally conductive ceramic utilizes its electrical insulation properties to block the conductive path between the housing and the internal high-voltage components, preventing high-voltage breakdown or leakage accidents and ensuring the safe operation of the X-ray high-voltage generator solid-state packaged voltage doubler rectifier module 10 under high-voltage conditions. Furthermore, the thermally conductive ceramic utilizes its high thermal conductivity to quickly transfer the heat absorbed by the package to the heat sink 400, preventing heat accumulation and improving overall heat dissipation efficiency. The heat dissipation fins 410 significantly increase the contact area between the heat sink 400 and the air, expanding the heat dissipation area of ​​the heat sink 400, allowing the heat on the heat sink 400 to be quickly dissipated to the surrounding environment, improving the heat dissipation efficiency of the heat sink 400, further reducing the operating temperature of the X-ray high-voltage generator solid-state packaged voltage doubler rectifier module 10, and enabling the X-ray high-voltage generator solid-state packaged voltage doubler rectifier module 10 to stably adapt to the heat dissipation requirements under high-power conditions.

[0042] In one specific embodiment, a high-voltage silicon carbide diode 120 is disposed on one side of a circuit board 110, and a metal part 210 is disposed on the other side of the circuit board 110. The metal part 210 is spherical and is formed by cutting it with two parallel planes, so that the opposite sides of the metal part 210 form a first plane and a second plane respectively. The first plane is connected to the heat-conducting plate 240. An extended insulating heat-conducting column 220 is embedded in the hollow interior of the metal part 210. The heat-conducting column 220 extends out of the second plane and is connected to the heat dissipation shell 400. The heat-conducting column 220 and the metal part 210 are filled and fixed by thermally conductive adhesive 230. Figure 15 The arrows indicate the direction of heat flow. T-shaped heat-conducting plates 123 are located on both sides of the PN junction 121. The PN junction 121 is connected to the lead wire 122 via the heat-conducting plates 123. The lead wire 122 is made of copper. The heat generated by the high-voltage PN junction 121 of the diode 120 is transferred to the T-shaped heat-conducting plates 123 on both sides, and then sequentially through the thickened lead wire 122 to the pads on the bottom surface of the heat-conducting plate 240 and the heat-conducting plate 240 itself. The high-heat-capacity metal component 210 stores and dissipates the heat. The heat inside the metal component 210 is transferred to the heat sink 400 via the heat-conducting pillar 220. The heat generated by the diode 120 during operation is sequentially conducted through the heat-conducting plate 240, the metal component 210, the heat-conducting pillar 220, and the heat sink 400, allowing the heat to be dissipated to the external environment under solid-state packaging conditions, thereby improving the overall thermal conductivity of the solid-state packaged voltage multiplier rectifier module 10 of the X-ray high-voltage generator.

[0043] A second aspect of this application provides a medical device comprising: an X-ray high voltage generator solid-state packaged voltage multiplier rectifier module 10 provided in any of the above embodiments.

[0044] In this embodiment, the solid-state packaged voltage multiplier rectifier module 10 of the X-ray high-voltage generator is applied to a medical device. Utilizing the excellent heat dissipation and high stability of the solid-state packaged voltage multiplier rectifier module 10, it provides reliable high-voltage power support for the medical device, ensuring its precise operation and safe use. The medical device can be an X-ray generator, a high-pressure physiotherapy device, or a CT scanner. It should be noted that since the medical device includes the solid-state packaged voltage multiplier rectifier module 10 of the X-ray high-voltage generator provided in any of the above embodiments, it possesses all the beneficial technical effects of the solid-state packaged voltage multiplier rectifier module 10. To avoid repetition, these effects will not be elaborated upon here.

[0045] In this invention, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "link," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "link" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0046] In the description of this invention, it should be understood that the terms "upper," "lower," "left," "right," "front," "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0047] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0048] The above are merely some embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A solid-state packaged voltage multiplier rectifier module for an X-ray high-voltage generator, characterized in that, include: A rectifier voltage multiplier unit, comprising a circuit board and diodes connected in series; A heat dissipation unit includes a metal component, the outer surface of which includes a spherical portion. The metal component is connected to the diode, and the metal component and the diode are located on opposite sides of the circuit board. The package is solid and encapsulates at least a portion of the rectifier voltage multiplier unit and the heat dissipation unit.

2. The solid-state packaged voltage multiplier rectifier module for X-ray high-voltage generator according to claim 1, characterized in that, The heat dissipation unit also includes: A heat-conducting pillar, the first end of which extends into the metal component, and the second end of which extends out of the metal component and extends in a direction away from the circuit board.

3. The solid-state packaged voltage multiplier rectifier module for X-ray high-voltage generator according to claim 2, characterized in that, Also includes: A heat dissipation housing, wherein the package is located inside the heat dissipation housing, and the second end of the heat-conducting pillar is connected to the heat dissipation housing, wherein the heat-conducting pillar is used to transfer the heat generated by the diode to the heat dissipation housing.

4. The solid-state packaged voltage multiplier rectifier module for X-ray high-voltage generator according to claim 2, characterized in that, The heat dissipation unit also includes: Thermally conductive adhesive, which fills the gap between the thermally conductive pillar and the metal component.

5. The solid-state packaged voltage multiplier rectifier module for X-ray high-voltage generator according to claim 1, characterized in that, The heat dissipation unit also includes: A heat-conducting plate is connected to the circuit board, and the metal component and the diode are respectively connected to the heat-conducting plate, with the heat-conducting plate located between the metal component and the diode.

6. The solid-state packaged voltage multiplier rectifier module for X-ray high-voltage generator according to any one of claims 1 to 5, characterized in that, Each of the metal components is connected to a plurality of diodes connected in parallel.

7. The solid-state packaged voltage multiplier rectifier module for X-ray high-voltage generator according to any one of claims 1 to 5, characterized in that, The number of metal parts is multiple, and the multiple metal parts form multiple rows and columns.

8. The solid-state packaged voltage multiplier rectifier module for X-ray high-voltage generator according to any one of claims 1 to 5, characterized in that, The diameter of the spherical surface is 8 mm to 18 mm.

9. The solid-state packaged voltage multiplier rectifier module for X-ray high voltage generator according to claim 3, characterized in that, The outer wall of the heat dissipation shell is provided with heat dissipation fins.

10. A medical device, characterized in that, include: The solid-state packaged voltage multiplier rectifier module for X-ray high voltage generator as described in any one of claims 1 to 9.

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