3D flow channel liquid cooling radiator and radiating structure thereof

Abstract

The invention belongs to the technical field of radiators, and particularly relates to a 3D flow channel liquid cooling radiator and a radiating structure thereof, and the radiator comprises a plurality of first radiating fins and a plurality of second radiating fins; the first cooling fins and the second cooling fins are arranged at intervals to form a radiator body, a plurality of first circulation holes are formed in the first cooling fins, a plurality of second circulation holes are formed in the second cooling fins, and the first circulation holes and the second circulation holes are arranged in a staggered mode. A plurality of disorderly staggered 3D liquid flow channels are formed in the radiator, and a liquid inlet and a liquid outlet are formed in the radiator body. Through the arrangement of the first circulation holes and the second circulation holes which are arranged in a staggered mode, a plurality of disorderly staggered 3D liquid flow channels are formed in the radiator, the contact area of cooling liquid and the radiator is remarkably increased through the design, the flow channels are more complex and zigzag, and therefore better heat dissipation efficiency and effect are achieved; and normal use of a high-power chip can be satisfied.

Description

Technical Field

[0001] This invention belongs to the field of heat sink technology, and particularly relates to a 3D three-dimensional flow channel liquid-cooled heat sink and its heat dissipation structure. Background Technology

[0002] As the performance of various communication and industrial electronic products improves, chip power is increasing, and heat flux density is also rising, necessitating heat dissipation to ensure the proper functioning of the chips. The higher the chip's performance, the more heat it generates; therefore, heat dissipation devices play a crucial role in electronic products.

[0003] Existing heat sinks use a single-cavity linear liquid cooling structure to remove heat from the chip through water cooling channels to achieve the purpose of cooling. However, this cooling method is not very efficient and can only meet the heat dissipation needs of low-power chips, but cannot meet the heat dissipation needs of high-power chips, thus affecting the normal use of high-power chips. Summary of the Invention

[0004] The purpose of this invention is to provide a 3D three-dimensional flow channel liquid cooler and its heat dissipation structure, which aims to solve the problem of low heat dissipation efficiency of the single-cavity linear liquid cooling structure in the prior art.

[0005] To achieve the above objectives, this invention provides a 3D three-dimensional liquid cooling radiator, comprising multiple first heat sinks and multiple second heat sinks. The multiple first heat sinks and multiple second heat sinks are arranged alternately to form a radiator body. The first heat sinks are provided with multiple first flow holes, and the second heat sinks are provided with multiple second flow holes. The multiple first flow holes and multiple second flow holes are staggered. The two sides of the radiator body are respectively provided with cover plates, which enclose the interior of the radiator body. The multiple staggered first flow holes and second flow holes form multiple disordered and intersecting 3D three-dimensional liquid flow channels inside the radiator. After the refrigerant flows into one of the first flow holes of the first heat sink, it can flow out from at least two second flow holes of the adjacent second heat sink. The radiator body is provided with an inlet and an outlet. The refrigerant flows in from the inlet, flows through the multiple disordered and intersecting 3D three-dimensional liquid flow channels, and flows out from the outlet, thereby carrying away the heat absorbed by the radiator body.

[0006] Optionally, the shapes of the plurality of first flow holes and the plurality of second flow holes are regular shapes, irregular shapes, or combinations thereof; the regular shapes include circles, squares, polygons, or aluminum honeycomb shapes.

[0007] Optionally, a plurality of first flow holes and a plurality of second flow holes are arranged in multiple rows along the long sides of the first heat sink and the second heat sink, respectively.

[0008] Optionally, each of the first heat sink and each of the second heat sinks has corresponding through holes at both ends, which are used to facilitate positioning and assembly.

[0009] Optionally, both the first flow hole and the second flow hole are arranged in a multi-row, multi-column array, and the orthographic projection of any first flow hole on the adjacent second heat sink partially overlaps with at least two different columns of the second flow hole.

[0010] Optionally, there are two liquid inlets and one liquid outlet. The liquid inlets are located on both sides of the radiator body, and the liquid outlet is located in the middle of the radiator body.

[0011] Optionally, the 3D three-dimensional flow channel liquid cooling radiator is characterized in that it further includes a base plate, one side of which is provided with a plurality of placement positions, each placement position being provided with the radiator body, the placement position being provided with a first slot and a second slot, when the radiator body is placed in the placement position, the first slot is covered by the liquid inlet, the second slot is covered by the liquid outlet, the other side of the base plate is provided with a first opening and a second opening, the first slot is connected to the first opening, and the second slot is connected to the second opening.

[0012] Optionally, the other side of the base plate is provided with an inlet pipe and an outlet pipe, the inlet pipe being connected to the first opening and the outlet pipe being connected to the second opening.

[0013] Optionally, the base plate is provided with a first flow cavity and a second flow cavity. One end of the first flow cavity is connected to a first slot and the other end is connected to the first opening. One end of the second flow cavity is connected to a second slot and the other end is connected to the second opening.

[0014] Optionally, the first opening and the second opening can be arranged side by side or spaced apart.

[0015] Compared with the prior art, the 3D three-dimensional flow channel liquid cooling radiator and its heat dissipation structure provided in the embodiments of the present invention have at least one of the following technical effects: By setting multiple interlocking first and second flow holes, multiple disordered and interlocking 3D liquid flow channels are formed inside the heat sink. This design significantly increases the contact area between the coolant and the heat sink, and the flow channels are more complex and tortuous. Compared with the traditional single-cavity straight liquid cooling structure, this structure can remove heat more efficiently, thereby achieving better heat dissipation efficiency and effect, which can meet the normal use of high-power chips. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the main structure of the heat sink of the present invention.

[0018] Figure 2 This is an exploded view of the main structure of the radiator of the present invention.

[0019] Figure 3 This is a schematic cross-sectional view of the heat sink body of the present invention.

[0020] Figure 4 This is a schematic diagram of the structure of the first and second flow holes of different shapes according to the present invention.

[0021] Figure 5 This is a schematic diagram of the structure of the first and second flow holes of different shapes according to the present invention.

[0022] Figure 6 This is a schematic diagram of the structure of the first and second flow holes of different shapes according to the present invention.

[0023] Figure 7 This is a schematic diagram of the structure of the first and second flow holes of different shapes according to the present invention.

[0024] Figure 8 This is a schematic diagram of the first embodiment of the heat dissipation structure of the present invention.

[0025] Figure 9 This is a partial structural diagram of the first embodiment of the heat dissipation structure of the present invention.

[0026] Figure 10 This is a cross-sectional schematic diagram of the first embodiment of the heat dissipation structure of the present invention.

[0027] Figure 11 This is a schematic diagram of the second embodiment of the heat dissipation structure of the present invention.

[0028] Figure 12 This is a partial structural diagram of the second embodiment of the heat dissipation structure of the present invention.

[0029] Figure 13 This is a cross-sectional schematic diagram of the second embodiment of the heat dissipation structure of the present invention.

[0030] Figure 14 This is a schematic diagram of several heat dissipation structures of the present invention.

[0031] The following are the labeling elements in the figure: 100, First heat sink; 110, First flow hole; 120, Opening; 130, Micro-hole; 200, Second heat sink; 210, Second flow hole; 300. Radiator body; 310. Cover plate; 320. 3D liquid flow channel; 330. Liquid inlet; 340. Liquid outlet; 400, base plate; 410, placement position; 420, first opening; 430, second opening; 440, liquid inlet pipe; 450, liquid outlet pipe; 460, first groove; 470, second groove; 480, first flow chamber; 490, second flow chamber. Detailed Implementation

[0032] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain embodiments of the present invention, and should not be construed as limiting the present invention.

[0033] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0035] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0036] In one embodiment of the present invention, according to Figure 1-14 As shown, a 3D three-dimensional flow channel liquid cooling heat sink is used for heat dissipation of high-power chips, including multiple first heat sinks 100 and multiple second heat sinks 200; the multiple first heat sinks 100 and multiple second heat sinks 200 are arranged alternately, that is, a second heat sink 200 is arranged after a first heat sink 100, then another first heat sink 100, then another second heat sink 200, and so on, to form the heat sink body 300.

[0037] The first heat sink 100 is provided with a plurality of first flow holes 110, and the second heat sink 200 is provided with a plurality of second flow holes 210. The plurality of first flow holes 110 and the plurality of second flow holes 210 are arranged alternately. The two sides of the heat sink body 300 are respectively provided with cover plates 310, and the two cover plates 310 seal the interior of the heat sink body 300.

[0038] Multiple interleaved first flow holes 110 and second flow holes 210 form multiple disordered interleaved 3D liquid flow channels 320 inside the radiator. After the refrigerant flows into one of the first flow holes 110 of the first heat sink 100, it can flow out from at least two second flow holes 210 of the adjacent second heat sink 200, and some can flow out from three second flow holes 210 of the adjacent second heat sink 200. As the most preferred option, it can flow out from four second flow holes 210 of the adjacent second heat sink 200.

[0039] The radiator body 300 is provided with a liquid inlet 330 and a liquid outlet 340. The refrigerant flows in from the liquid inlet 330, flows through multiple disordered and intersecting 3D liquid channels 320 and flows out from the liquid outlet 340, thereby carrying away the heat absorbed by the radiator body 300.

[0040] Specifically, by setting multiple interleaved first flow holes 110 and second flow holes 210, multiple disordered interleaved 3D liquid flow channels 320 are formed inside the heat sink. This design significantly increases the contact area between the coolant and the heat sink, and the flow channels are more complex and tortuous. Compared with the traditional single-cavity straight liquid cooling structure, this structure can remove heat more efficiently, thereby achieving better heat dissipation efficiency and effect, which can meet the normal use of high-power chips.

[0041] Specifically, the reason why it is called a disordered interlaced 3D liquid flow channel 320 is because it does not move horizontally or vertically like a traditional single-cavity linear liquid cooling structure, but moves in a disordered manner up, down, left, and right, hence the name 3D liquid flow channel 320.

[0042] Furthermore, as the coolant flows through multiple disordered and intersecting 3D channels, its flow direction is constantly and randomly changed, easily transforming from a laminar flow state to a strong turbulent flow state. This intense turbulence effect can completely disrupt the steady-state thermal boundary layer inside the coolant, causing the low-temperature liquid in the core region to mix and displace the high-temperature liquid at the channel walls, thereby increasing the convective heat transfer coefficient to an unprecedented level and achieving a qualitative leap in heat transfer efficiency.

[0043] Furthermore, the coolant flows randomly and along multiple paths in three-dimensional space, eliminating fixed flow channels or dead zones within the heatsink. In traditional parallel flow channels, the coolant preferentially chooses the path with the least flow resistance, leading to uneven flow distribution and the creation of localized hot spots. The staggered flow channel structure of this invention forces the coolant to "diffuse" in three-dimensional space, effectively giving the heatsink a thorough, dead-zone-free "shower." This ensures a highly uniform temperature distribution throughout the entire heatsink body 300, especially on the bottom surface in contact with the chip, fundamentally preventing high-power chips from failing due to localized overheating.

[0044] Furthermore, multiple interleaved and staggered first and second heat sinks 200, together with the side cover plates 310, form a high-strength three-dimensional truss structure. This dense, staggered support design evenly distributes the pressure inside the flow channel throughout the entire radiator body 300, enabling it to withstand extremely high coolant pressure without deformation. This not only improves the product's reliability and lifespan but also allows the system to use pumps with higher flow rates to further enhance heat dissipation performance.

[0045] Furthermore, the numerous flow holes on each heatsink create a huge specific surface area. When the coolant flows through these interlaced holes, it actually exchanges heat with all the inner surfaces of the entire heatsink. This 3D structure maximizes the effective heat dissipation area, far surpassing traditional heatsink fins that can only provide a two-dimensional plane.

[0046] In another embodiment of the invention, such as Figure 2-7 As shown, the shapes of the plurality of first flow holes 110 and the plurality of second flow holes 210 are regular shapes, irregular shapes, or combinations thereof; regular shapes include circles, squares, polygons, or aluminum honeycomb shapes.

[0047] Specifically, the shapes of the first flow hole 110 and the second flow hole 210 can be varied, including but not limited to, such as Figure 5 The circle shown Figure 6 The rectangle shown Figure 2 The combination of square and semicircle shown Figure 4 The dumbbell shape and the combination of ellipse shown can be regular shapes such as pentagrams and diamonds, and irregular shapes such as crescents and bull heads.

[0048] Furthermore, both the first flow hole 110 and the second flow hole 210 are arranged in a multi-row, multi-column array. The orthographic projection of any first flow hole 110 onto the adjacent second heat sink 200 partially overlaps with at least two different columns of second flow holes 210. At this time, after the coolant flows into one of the first flow holes 110 of the first heat sink 100, it can flow out from at least two second flow holes 210 of the adjacent second heat sink 200, thus forming multiple disordered and intersecting 3D liquid flow channels 320. This design significantly increases the contact area between the coolant and the heat sink, and the flow channels are more complex and tortuous. This structure can remove heat more efficiently, thereby achieving better heat dissipation efficiency and effect.

[0049] Furthermore, such as Figure 7 As shown, the first flow-through hole 110 and the second flow-through hole 210 are composed of multiple micropores 130. These micropores 130 further disperse the liquid and increase the contact area between the liquid and the first heat sink 100 and the second heat sink 200, resulting in better heat dissipation. The shapes that the multiple micropores 130 can form are diverse, including but not limited to... Figure 5 The circle shown Figure 6 The rectangle shown Figure 2 The combination of square and semicircle shown Figure 4 The dumbbell shape and the combination of ellipse shown can be regular shapes such as pentagrams and diamonds, and irregular shapes such as crescents and bull heads.

[0050] In another embodiment of the invention, such as Figure 2-6 As shown, multiple first flow holes 110 and multiple second flow holes 210 are arranged in multiple rows along the long sides of the first heat sink 100 and the second heat sink 200. This allows the area of ​​the internal liquid flow channel to be as large as possible, thereby increasing the heat exchange area and accelerating the heat dissipation efficiency.

[0051] In another embodiment of the invention, such as Figure 1 and 2 As shown, each of the first heat sink 100 and each of the second heat sink 200 has corresponding openings 120 at both ends, which are used to facilitate positioning and assembly.

[0052] In another embodiment of the invention, such as Figure 1 As shown, there are two liquid inlets 330 and one liquid outlet 340. The liquid inlets 330 are distributed on both sides of the radiator body 300, and the liquid outlet 340 is distributed in the middle of the radiator body 300.

[0053] Specifically, this layout achieves a symmetrical flow field and uniform heat dissipation, effectively solving the problems of dead zones in coolant flow and uneven temperature that may occur on large-sized heat dissipation surfaces. Two inlets 330 inject low-temperature coolant from both sides, converging towards the center and exiting from the central outlet 340. This flow pattern creates a roughly symmetrical velocity and temperature field inside the radiator. As the coolant flows outwards and towards the center, its temperature gradually increases after absorbing heat. However, because the flow path length is essentially symmetrical, the "journey" from the left and right sides of the radiator to the central outlet 340 is similar, resulting in a very uniform temperature distribution across the entire radiator surface.

[0054] Compared to a long flow channel design with a single inlet and single outlet, this "center outlet, two-sided inlet" structure shortens the effective flow path of the coolant by nearly half. Flow channel length is a key factor affecting flow resistance. A shorter path means significantly reduced resistance to coolant flow. At the same pumping power, higher flow rates can be supported, resulting in faster coolant velocity, a stronger convective heat transfer coefficient, and higher overall heat dissipation efficiency.

[0055] This design ensures that the coolant flowing through the edge areas of the radiator can also be effectively utilized, avoiding the problem of coolant easily flowing away directly from the shortcut in traditional single-sided inlet / outlet designs, leading to poor heat dissipation in the edge areas. Because the outlet 340 is in the center, coolant entering from both sides must flow through the entire flow channel network of the half-section before exiting. This ensures that the flow channels in all areas of the radiator are filled with active, constantly renewed coolant, eliminating dead zones and maximizing the utilization of the heat dissipation area.

[0056] This structure is particularly suitable for modern high-power chips (such as GPUs and CPUs), whose core heat-generating areas are typically located in the middle of the chip. The middle of the heatsink is usually the area with the most concentrated heat and the highest temperature. Placing the outlet 340 here means that the coolant with the highest flow rate and temperature rise is collected in the hottest area. Although its temperature is higher than the inlet, the high flow rate and large volume can still efficiently "pump" away the heat and prevent heat buildup.

[0057] In another embodiment of the invention, such as Figure 7-13As shown, a heat dissipation structure further includes a base plate 400. One side of the base plate 400 has multiple placement positions 410, and each placement position 410 has a heat sink body 300. The placement position 410 has a first slot 460 and a second slot 470. When the heat sink body 300 is placed in the placement position 410, the first slot 460 covers the liquid inlet 330, and the second slot 470 covers the liquid outlet 340. The other side of the base plate 400 has a first opening 420 and a second opening 430. The first slot 460 is connected to the first opening 420, and the second slot 470 is connected to the second opening 430. The other side of the base plate 400 has a liquid inlet pipe 440 and a liquid outlet pipe 450. The liquid inlet pipe 440 is connected to the first opening 420, and the liquid outlet pipe 450 is connected to the second opening 430. The base plate 400 is provided with a first flow cavity 480 and a second flow cavity 490. One end of the first flow cavity 480 is connected to the first slot 460 and the other end is connected to the first opening 420. One end of the second flow cavity 490 is connected to the second slot 470 and the other end is connected to the second opening 430.

[0058] Specifically, the refrigerant enters through the inlet pipe 440, flows through the first opening 420, enters the first flow chamber 480, and then enters the two first slots 460 through the first flow chamber 480. From the two first slots 460, it enters the two inlet ports 330, circulates through the radiator body 300, flows out from the outlet port 340, flows into the second slot 470, enters the second flow chamber 490, flows through the second opening 430, and flows out from the outlet pipe 450.

[0059] Furthermore, the purpose of setting the first slot 460, the second slot 470, the first flow chamber 480, and the second flow chamber 490 is to ensure that the flow rate enters the two liquid inlets 330 of the radiator body 300 evenly, preventing stagnant water zones and ensuring that the entire radiator body 300 is utilized evenly. Simultaneously, the symmetrical arrangement of the first flow chamber 480 also ensures that the flow rate enters the two liquid inlets 330 of the radiator body 300 evenly. If one path is longer than the other, insufficient flow rate along the longer path will occur, resulting in uneven cooling performance of the radiator body 300.

[0060] In another embodiment of the invention, such as Figure 7 and 12 As shown, the first opening 420 and the second opening 430 can be arranged side by side or spaced apart. Figure 6-8 In the first embodiment of the heat dissipation structure, the first opening 420 and the second opening 430 can be arranged side by side. This side-by-side arrangement simplifies connection, optimizes system layout, and results in a neat and aesthetically pleasing appearance. Figure 9-11 In the second embodiment of the heat dissipation structure, the first opening 420 and the second opening 430 can be arranged at intervals. The interval arrangement can make the area of ​​the second flow cavity 490 larger, maximize the flow of coolant, and improve the heat exchange efficiency.

[0061] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention and should not be construed as limiting the specific implementation of the invention to these descriptions. For those skilled in the art, the architectural form of this invention can be flexibly varied without departing from its conceptual framework, leading to the derivation of a series of products. Any simple deductions or substitutions should be considered as falling within the patent protection scope defined by the submitted claims.

Claims

1. A 3D liquid cooling radiator for heat dissipation of high-power chips, comprising multiple first heat sinks and multiple second heat sinks; the multiple first heat sinks and multiple second heat sinks are arranged alternately to form a radiator body, the first heat sinks are provided with multiple first flow holes, the second heat sinks are provided with multiple second flow holes, the multiple first flow holes and the multiple second flow holes are staggered, the two sides of the radiator body are respectively provided with cover plates, the two cover plates seal the interior of the radiator body, the multiple staggered first flow holes and second flow holes form multiple disordered staggered 3D liquid flow channels inside the radiator, after the refrigerant flows into one of the first flow holes of the first heat sink, it can flow out from at least two second flow holes of the adjacent second heat sink, the radiator body is provided with a liquid inlet and a liquid outlet, the refrigerant flows in from the liquid inlet, flows through the multiple disordered staggered 3D liquid flow channels and flows out from the liquid outlet, thereby carrying away the heat absorbed by the radiator body.

2. The 3D three-dimensional flow channel liquid-cooled heat sink according to claim 1, characterized in that, The shapes of the plurality of first flow holes and the plurality of second flow holes are regular shapes, irregular shapes, or combinations thereof; the regular shapes include circles, squares, polygons, or aluminum honeycomb shapes.

3. The 3D three-dimensional flow channel liquid-cooled heat sink according to claim 2, characterized in that, Multiple first flow holes and multiple second flow holes are arranged in multiple rows along the long sides of the first heat sink and the second heat sink, respectively.

4. The 3D three-dimensional flow channel liquid-cooled heat sink according to claim 1, characterized in that, Each of the first heat sink and each of the second heat sinks has corresponding through holes at both ends, which are used to facilitate positioning and assembly.

5. The 3D three-dimensional flow channel liquid-cooled heat sink according to claim 1, characterized in that, Both the first flow hole and the second flow hole are arranged in a multi-row, multi-column array, and the orthographic projection of any first flow hole on the adjacent second heat sink partially overlaps with at least two different columns of the second flow hole.

6. The 3D three-dimensional flow channel liquid-cooled heat sink according to claim 1, characterized in that, The number of liquid inlets is two, and the number of liquid outlets is one. The liquid inlets are respectively distributed on both sides of the radiator body, and the liquid outlet is distributed in the middle of the radiator body.

7. A heat dissipation structure comprising a plurality of 3D three-dimensional flow channel liquid-cooled heat sinks as described in any one of claims 1-6, characterized in that, It also includes a base plate, one side of which is provided with multiple placement positions, each placement position is provided with the radiator body, each placement position is provided with a first slot and a second slot, when the radiator body is placed in the placement position, the first slot is covered by the liquid inlet and the second slot is covered by the liquid outlet, the other side of the base plate is provided with a first opening and a second opening, the first slot is connected to the first opening and the second slot is connected to the second opening.

8. The heat dissipation structure according to claim 7, characterized in that, The other side of the base plate is provided with an inlet pipe and an outlet pipe. The inlet pipe is connected to the first opening, and the outlet pipe is connected to the second opening.

9. The heat dissipation structure according to claim 7, characterized in that, The base plate is provided with a first flow cavity and a second flow cavity. One end of the first flow cavity is connected to the first slot and the other end is connected to the first opening. One end of the second flow cavity is connected to the second slot and the other end is connected to the second opening.

10. The heat dissipation structure according to claim 9, characterized in that, The first opening and the second opening can be arranged side by side or spaced apart.

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