High heat flux assembly enclosure for signal processor

Abstract

The application discloses a high-heat-flow-density assembled closed cabinet of a signal processor and belongs to the technical field of signal processor heat dissipation. The application comprises symmetrically arranged upper half cabinet components and lower half cabinet components, wherein the upper half cabinet components and the lower half cabinet components each comprise a mounting cabinet and a heat dissipation cabinet, the heat dissipation cabinet is internally provided with a plurality of partitions, the plurality of partitions form a plurality of air ducts inside the heat dissipation cabinet, at least one side of the heat dissipation cabinet is made of cold plate material, one side made of cold plate material is connected with one end of the mounting cabinet, the other end of the mounting cabinet is externally provided with a fixing plate, the fixing plate is used for fixedly connecting the upper cabinet and the lower cabinet, a screw rod is arranged in each air duct inside the heat dissipation cabinet, both ends of the screw rod are rotatably connected with both end portions of the air duct, and one end of the screw rod is provided with a driving motor. The technical scheme is used to solve the problems of poor sealing effect and poor heat dissipation effect of the existing signal processor cabinet.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology for signal processors, specifically relating to a high heat flux density assembled sealed chassis for signal processors. Background Technology

[0002] Currently, the mainstream thermal management solutions for signal processors generally employ forced air cooling technology. Its typical design is based on an open airflow structure: a directional ventilation path is set inside the equipment chassis, with all high-power functional modules arranged linearly along this airflow path, each module equipped with a finned cold plate. Cooling fans drive cooling air into the chassis inlet, flowing sequentially through the cold plate fin array of each module, carrying away the heat generated by the modules through convection heat transfer, and finally, the hot air is exhausted from the chassis outlet. This solution has a relatively simple structure and low cost, and is suitable for certain indoor environments.

[0003] However, this internal airflow-based cooling architecture faces significant limitations in practical applications, especially in complex and harsh environments. The primary problem lies in the insufficient sealing of the chassis. Since cooling air must flow directly through the chassis and come into contact with all electronic modules, the chassis must have large inlet and outlet vents and maintain internal airflow channels. This makes it difficult to achieve a high level of protection. In humid, salt spray, or dusty working environments, untreated air carrying moisture and corrosive particles directly contacts precision electronic components, which can easily cause circuit corrosion, short circuits, or decreased insulation performance, seriously threatening the long-term reliability and lifespan of the equipment.

[0004] Secondly, this architecture suffers from an inherent and difficult-to-overcome problem of uneven heat dissipation gradients, namely the "upstream heating downstream" heat accumulation effect. When cooling air flows through the first or first few high-heat-power modules at the beginning of the airflow, it absorbs a large amount of heat, causing a significant step increase in its own temperature. Subsequently, this preheated air, with its significantly reduced heat-carrying capacity, continues to flow as a cooling medium to downstream modules. As a result, modules at different physical locations in the airflow experience drastically different thermal environments: upstream modules enjoy the initial low-temperature air and have optimal heat dissipation conditions; while mid- and downstream modules, especially those at the very end of the airflow, are forced to use air that has already been "heated" by the upstream for cooling, leading to a sharp decline in heat dissipation efficiency. This uneven cooling effect directly results in a significant temperature gradient within the device, with end modules often becoming overheating hotspots. This not only forces the overall heat dissipation design to accommodate the most unfavorable operating conditions, wasting heat dissipation resources and creating a bottleneck in overall heat dissipation capacity, but also triggers chip frequency throttling, system instability, and even overheat protection shutdowns due to excessively high local temperatures, fundamentally limiting the full performance and long-term stable operation of the device. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to provide a high heat flux density assembled hermetic chassis for signal processors, so as to solve the problems of poor sealing and poor heat dissipation of existing signal processor chassis.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] This invention relates to a high heat flux density assembled sealed chassis for a signal processor, comprising a symmetrically arranged upper and lower chassis assembly. Each assembly includes a mounting box and a heat dissipation box. The heat dissipation box contains several partitions forming several air ducts. At least one side of the heat dissipation box is made of cold-rolled steel plate, and this side is connected to one end of the mounting box. A fixing plate is located on the outer side of the other end of the mounting box, used to fix the upper and lower chassis together. Each air duct inside the heat dissipation box contains a screw, with both ends rotatably connected to the ends of the air ducts. One end of the screw has a drive motor, and a nut slider is threaded onto the screw. A cooling fan is mounted on the nut slider, and the drive motor drives the nut slider to move on the screw, thereby controlling the relative position of the cooling fan within the air ducts.

[0008] The nut slider is provided with a mounting ring, which is connected to the nut slider. The cooling fan is disposed inside the mounting ring. The cooling fan is provided with a first rotating shaft and a second rotating shaft opposite to each other. The first rotating shaft and the second rotating shaft are arranged perpendicular to the connection surface between the heat sink and the mounting box. One end of the first rotating shaft and the second rotating shaft are fixed to the outer housing of the cooling fan. The other ends of the first rotating shaft and the second rotating shaft are rotatably connected to the mounting ring and extend to the outside of the mounting ring. A first limiting spring and a second limiting spring are respectively sleeved on the first rotating shaft and the second rotating shaft. The first limiting spring and the second limiting spring are disposed between the mounting ring and the cooling fan, and the two ends of the first limiting spring and the second limiting spring are respectively fixed to the mounting ring and the cooling fan. A rotating rack is provided on the side wall of the air duct away from the drive motor. The rotating rack is fixed to the side wall of the air duct. A rotating gear is provided on the other end of the first rotating shaft. When the rotating gear moves to the position of the rotating rack, it can mesh and rotate on the rotating rack.

[0009] Furthermore, the mounting ring is provided with a third rotating shaft, which is arranged parallel to the connection surface of the mounting box and the heat dissipation box. One end of the third rotating shaft is fixed to the outer surface of the mounting ring, and the other end of the third rotating shaft is rotatably connected to the nut slider. A third limiting spring is sleeved on the third rotating shaft, and the two ends of the third limiting spring are respectively fixed to the nut slider and the mounting ring. A first traction rope and a second traction rope are respectively provided on the third rotating shaft. One end of the first traction rope and the second traction rope are respectively fixed to the third rotating shaft, and the other ends of the first traction rope and the second traction rope extend to the outer sides of both ends of the air duct. A winding motor is provided on the outer sides of both ends of the air duct. The winding motor is fixed to the heat dissipation box, and a winding roller is provided on the output end of the winding motor. The other ends of the first traction rope and the second traction rope are respectively wound around the winding rollers on the outer sides of both ends of the air duct.

[0010] Furthermore, a limiting rack is provided on the inner wall of the air duct end near the drive motor. When the limiting rack contacts the flip gear, it can limit the rotation of the first rotating shaft.

[0011] Furthermore, each end of the screw is provided with a first connecting block, the first connecting block is fixed to the heat sink, the two ends of the screw are rotatably connected to the first connecting block, and the drive motor is fixed to the first connecting block.

[0012] Furthermore, a second connecting block is provided on the outer side of both ends of the air duct, the second connecting block is fixed on the heat dissipation box, and the wound motor is fixed on the second connecting block.

[0013] Furthermore, each of the second connecting blocks is provided with a guide block, one end of which is fixed to the second connecting block, and the other ends of the two second connecting blocks are slidably connected to the first traction rope and the second traction rope, respectively.

[0014] Furthermore, the nut slider is provided with at least one optical rod, the two ends of which are fixed to the outer sides of the two ends of the air duct, and the nut slider is slidably connected to the optical rod.

[0015] The beneficial effects of this invention are as follows:

[0016] In this technical solution, firstly, by incorporating the cold plate as part of the air duct, the heat from the modules inside the mounting box can be efficiently and directly transferred to the air duct. The external airflow within the air duct directly acts on the surface of the cold plate. This design achieves the shortest heat dissipation path and the lowest thermal resistance, ensuring the heat dissipation requirements of the modules during normal operation and reducing the thermal failure of electronic components. Simultaneously, the mounting box and the heat dissipation box are separated by a side plate made of cold plate material. Heat is guided into the air duct through thermal conduction, allowing the cold air to only dissipate heat within the air duct, meaning that the cold air does not enter the chassis, thus ensuring the airtightness of the chassis.

[0017] Secondly, the cooling fan is driven to move within the air duct by the action of the screw and the threaded slider. Through the ingenious arrangement of the rotating rack, rotating gear, first limit spring and second limit spring, the cooling fan can automatically switch the air outlet direction when it moves to the two ends of the air duct. In this way, the two ends of the air duct can be used alternately as heat dissipation terminals, which can effectively compensate for the problem of reduced heat exchange capacity at the end caused by the air being heated along the way, making the heat dissipation capacity of the entire air duct more uniform and efficient.

[0018] Other advantages, objectives, and features of the invention will be set forth in the following description and will be apparent to those skilled in the art in some respects, or may be learned by practice of the invention. The objectives and other advantages of the invention can be realized and obtained through the following description. Attached Figure Description

[0019] To make the objectives, technical solutions, and beneficial effects of this invention clearer, the following figures are provided for illustration:

[0020] Figure 1 This is a three-dimensional schematic diagram of the high heat flux density assembled sealed enclosure of the present invention;

[0021] Figure 2 This is a schematic cross-sectional view of the high heat flux density assembled sealed enclosure of the present invention;

[0022] Figure 3 This is a three-dimensional schematic diagram of the arrangement of relevant components in the air duct of the high heat flux density assembled sealed enclosure of the present invention;

[0023] Figure 4 For the present invention Figure 3 A magnified view of a portion of point A in the middle;

[0024] Figure 5 This is a schematic cross-sectional view of the relevant components inside the air duct of the high heat flux density assembled sealed enclosure of the present invention.

[0025] The following labels are shown in the attached diagram:

[0026] 1. Mounting box; 2. Heat dissipation box; 3. Partition plate; 4. Heat-conducting side plate; 5. Fixing plate; 6. Fixing bolt; 7. First connecting block; 8. Screw; 9. Nut slider; 10. Smooth rod; 11. Mounting ring; 12. Cooling fan; 13. Fan blade; 14. Third rotating shaft; 15. Third limiting spring; 16. Reversing rack; 17. First rotating shaft; 18. Reversing gear; 19. First limiting spring; 20. Second rotating shaft; 21. Second limiting spring; 22. First traction rope; 23. Second traction rope; 24. Guide block; 25. Winding motor; 26. Winding roller; 27. Drive motor; 28. Limiting rack; 29. ​​Mounting cavity; 30. Air duct; 31. Second connecting block. Detailed Implementation

[0027] like Figures 1-5 As shown, the high heat flux density assembled sealed chassis of the signal processor of the present invention includes a symmetrically arranged upper chassis assembly and a lower chassis assembly. Both the upper and lower chassis assemblies include a mounting box 1 and a heat dissipation box 2. Both the mounting box 1 and the heat dissipation box 2 can be understood as hollow rectangular boxes with open ends. The cavity inside the mounting box 1 serves as the mounting cavity 29 for each module of the signal processor (it is easy to understand that during installation, a thermally conductive medium, such as thermal grease, needs to be applied between each module and the heat-conducting plate to further improve heat transfer). The heat dissipation box 2 has several partitions 3 inside, forming several air ducts 30. At least one side of the heat dissipation box 2 is made of a cold plate material, defined in this specific embodiment as a thermally conductive side plate 4. The portion of the thermally conductive side plate 4 located within the air ducts 30 may also be provided with several heat dissipation fins. The material is a heat conduction material in the existing technology, such as copper plate or aluminum plate, and one side made of cold plate material is connected to one end of the mounting box 1. The other side of the mounting box 1 is provided with a fixing plate 5, and the fixing plate 5 is provided with fixing bolts 6 to fix the upper box and the lower box. Of course, it is easy to understand that in order to achieve a better sealing effect during fixing, a sealing ring can be set between the two fixing plates 5. The air duct 30 inside the heat dissipation box 2 is provided with screws 8. The two ends of the screws 8 are rotatably connected to the two ends of the air duct 30. One end of the screw 8 is provided with a drive motor 27. The screw 8 is provided with a nut slider 9, which is threaded to the screw 8. The nut slider 9 is provided with a cooling fan 12. The drive motor 27 is used to drive the nut slider 9 to move on the screw 8, thereby controlling the relative position of the cooling fan 12 in the air duct 30.

[0028] A mounting ring 11 is provided on the nut slider 9, and the mounting ring 11 is connected to the nut slider 9. The cooling fan 12 is disposed inside the mounting ring 11. The cooling fan 12 is provided with a first rotating shaft 17 and a second rotating shaft 20 opposite to each other. The first rotating shaft 17 and the second rotating shaft 20 are arranged perpendicular to the connection surface between the heat sink 2 and the mounting box 1. One end of the first rotating shaft 17 and the second rotating shaft 20 is fixed to the outer housing of the cooling fan 12 (including the internal fan blades 13), and the other end of the first rotating shaft 17 and the second rotating shaft 20 are rotatably connected to the mounting ring 11 and extend to the outside of the mounting ring 11. The first rotating shaft 17 and the second rotating shaft 20 are respectively provided with a first rotating shaft 17 and a second rotating shaft 20. A first limiting spring 19 and a second limiting spring 21 are respectively fitted on the two rotating shafts 20. The first limiting spring 19 and the second limiting spring 21 are located between the mounting ring 11 and the cooling fan 12, and the two ends of the first limiting spring 19 and the second limiting spring 21 are respectively fixed to the mounting ring 11 and the cooling fan 12. A rotating rack 16 is provided on the side wall of the air duct 30 away from the drive motor 27. The rotating rack 16 is fixed on the side wall of the air duct 30. A rotating gear 18 is provided on the other end of the first rotating shaft 17. When the rotating gear 18 moves to the position of the rotating rack 16, it can mesh and rotate on the rotating rack 16.

[0029] The working principle of the above technical solution is as follows:

[0030] After the cooling fan 12 has been operating at one end of the air duct 30 near the drive motor 27 for a period of time (this can be adjusted according to actual settings), the drive motor 27 can drive the screw 8 to rotate, causing the nut slider 9 to move on the screw 8, thereby driving the cooling fan 12 mounted on it to move towards the other end of the air duct 30. When the flip gear 18 moves to contact the flip rack 16, the flip gear 18 will mesh and rotate on the flip rack 16, thereby driving the first rotating shaft 17 to rotate (at this time, the first limiting spring 19 and the second limiting spring 21 are twisted), thereby driving the cooling fan 12 to rotate. After rotating 180°, the drive motor 27 stops working until the current working time ends. Then, the drive motor 27 starts again, driving the cooling fan 12 to reset to the initial setting end of the air duct 30. During this process, the flip gear 18 will disengage from the flip rack 16. After disengagement, under the reset action of the first limit spring 19 and the second limit spring 21, the first rotating shaft 17 and the second rotating shaft 20 will be driven to reset to the initial position. This can be understood as flipping the cooling fan 12 180°, that is, restoring it to the initial air supply direction, thereby realizing the movement of the cooling fan 12 and the switching of the air supply direction.

[0031] It is easy to understand that, in the above process, through clever structural design, the first limiting spring 19 and the second limiting spring 21 serve two purposes: firstly, as limiting components, they provide resistance to the rotation of the cooling fan 12 during operation, preventing it from rotating and thus changing its airflow direction; secondly, they act as the driving force for the cooling fan 12 to return to its initial airflow direction when it resets. It is easy to understand that the first limiting spring 19 and the second limiting spring 21 can be either columnar springs or torsion springs. The torsion spring setting method is existing technology and will not be elaborated on here. At the same time, the guide of the cooling fan 12 can be set along the screw 8, or it can be used in conjunction with the cable drag chain in the existing technology to further improve the guide layout effect.

[0032] In the above technical solution, firstly, by setting the cold plate as part of the air duct 30, the heat of the module inside the mounting box 1 can be efficiently and directly transferred into the air duct 30, and the external airflow in the air duct 30 can directly act on the surface of the cold plate. This design can obtain the shortest heat dissipation path and the minimum thermal resistance, ensuring the heat dissipation requirements when the module is working normally, reducing the thermal failure of electronic components, and meeting reliability requirements. Secondly, the cooling fan 12 is driven to move in the air duct 30 by the action of the screw 8 and the threaded slider. Through the ingenious setting of the rotating rack 16, the rotating gear 18, the first limit spring 19 and the second limit spring 21, the cooling fan 12 can automatically switch the air outlet direction when it moves to the two ends of the air duct 30. In this way, the two ends of the air duct 30 are alternately used as heat dissipation ends, which can effectively compensate for the problem of the decrease in end heat exchange capacity caused by the air being heated along the way, making the heat dissipation capacity of the entire air duct 30 more uniform and efficient.

[0033] In one feasible embodiment, a third rotating shaft 14 is provided on the mounting ring 11. The third rotating shaft 14 is arranged parallel to the connecting surface of the mounting box 1 and the heat sink 2. One end of the third rotating shaft 14 is fixed to the outer surface of the mounting ring 11, and the other end of the third rotating shaft 14 is rotatably connected to the nut slider 9. A third limiting spring 15 is sleeved on the third rotating shaft 14. The two ends of the third limiting spring 15 are respectively fixed to the nut slider 9 and the mounting ring 11. A first traction rope 22 and a second traction rope 23 are respectively provided on the third rotating shaft 14. One end of the first traction rope 22 and the second traction rope 23 are respectively fixed to the third rotating shaft 14. The other ends of the first traction rope 22 and the second traction rope 23 extend to the outer sides of both ends of the air duct 30. A winding motor 25 is provided on the outer sides of both ends of the air duct 30. The winding motor 25 is fixed to the heat sink 2. A winding roller 26 is provided on the output end of the winding motor 25. The other ends of the first traction rope 22 and the second traction rope 23 are respectively wound around the winding roller 26 on the outer sides of both ends of the air duct 30.

[0034] The working principle of the above technical solution is as follows:

[0035] When the load of the high-power module of the signal processor suddenly increases and generates more heat, the heat is conducted through the mounting box 1 to the side wall of the heat sink 2 (which can be integrated) made of cold plate material, which is closely connected to it. Based on the real-time heat distribution data fed back by the temperature sensor network deployed inside the air duct 30 or on the board, the system generates instructions from the control unit. After receiving the instructions, the drive motor 27 drives the screw 8 to rotate, and drives the nut slider 9 and the fan on it to move along the axial direction of the screw 8, accurately positioning the area of ​​overheating or high heat load. After reaching the designated area, it is only necessary to control the winding motors 25 on both sides to work. It is easy to understand that at this time, one winding motor 25 takes in the wire and the other winding motor 25 releases the wire, which can drive the mounting ring 11 to rotate and tilt, so that the exhaust direction of the cooling fan 12 is directed towards the high-heat area, performing precise and efficient directional heat dissipation. After the heat dissipation is completed, it is then reset to one end of the air duct 30 for normal air supply and heat dissipation.

[0036] It is easy to understand that when the cooling fan 12 moves, the first traction rope 22 and the second traction rope 23 need to cooperate by winding and unwinding to avoid movement interference. During this process, the mounting ring 11 will not rotate because it is restricted by the first traction rope 22 and the second traction rope 23 (which can be elastic ropes and are in a taut state at this time). This ensures the contact and meshing effect of the flip gear 18 and the flip rack 16. At the same time, the third limit spring 15 also plays a role in restricting the rotation of the mounting ring 11 and resetting it after rotation. This will not be elaborated on here.

[0037] In this technical solution, the cooling fan 12 can not only provide normal airflow and heat dissipation at the end of the air duct 30 (the airflow direction of the cooling fan 12 is parallel to the side of the cold plate material, and heat is carried away by airflow through heat exchange), but it can also become a patrolling "fire brigade" that can move to a local high-heat area for targeted and strong cooling (the cooling fan 12 rotates, so that the airflow direction is directed towards the high-heat area, and the airflow impacts the surface vertically or obliquely. At the impact point (stagnation point), the thermal boundary layer is completely destroyed and compressed to an extreme thinness, thereby better removing heat). This fundamentally solves the problem of local overheating caused by uneven heat source distribution or dynamic changes, and further improves the thermal safety and stability of the system.

[0038] In one feasible approach, a limiting rack 28 is provided on the inner wall of the end of the air duct 30 near the drive motor 27. When the limiting rack 28 contacts the flip gear 18, it can restrict the rotation of the first rotating shaft 17. The flip gear 18 does not rotate on the limiting rack 28, but only contacts it. By restricting the rotation of the flip gear 18, the problem of rotation when the cooling fan 12 is working can be avoided.

[0039] In one feasible embodiment, a first connecting block 7 is provided at both ends of the screw 8, the first connecting block 7 is fixed to the heat sink 2, and both ends of the screw 8 are rotatably connected to the first connecting block 7. The drive motor 27 is fixed to the first connecting block 7. A second connecting block 31 is provided on the outer side of both ends of the air duct 30, the second connecting block 31 is fixed to the heat sink 2, and the wound motor 25 is fixed to the second connecting block 31.

[0040] In one feasible embodiment, each of the second connecting blocks 31 is provided with a guide block 24. One end of the guide block 24 is fixed to the second connecting block 31, and the other ends of the two second connecting blocks 31 are slidably connected to the first traction rope 22 and the second traction rope 23, respectively. The guide block 24 can guide and restrict the movement path of the first traction rope 22 and the second traction rope 23, thereby improving the traction effect.

[0041] In one feasible embodiment, the nut slider 9 is provided with at least one smooth rod 10, the two ends of which are fixed to the outer sides of the two ends of the air duct 30. The nut slider 9 is slidably connected to the smooth rod 10, and the smooth rod 10 can restrict the rotation of the nut slider 9 to ensure the movement effect of the nut slider 9 on the screw 8.

[0042] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made to it in form and detail without departing from the scope defined by the claims of the present invention.

Claims

1. A high heat flux density assembled sealed chassis for a signal processor, characterized in that: The device includes a symmetrically arranged upper and lower housing assembly, each comprising a mounting box (1) and a heat dissipation box (2). The heat dissipation box (2) has several partitions (3) inside, forming several air ducts (30). At least one side of the heat dissipation box (2) is made of cold-rolled steel, and this side is connected to one end of the mounting box (1). A fixing plate (5) is provided on the outer side of the other end of the mounting box (1), which is used to connect the upper and lower housings. The body is fixedly connected; each of the air ducts (30) inside the heat dissipation box (2) is provided with a screw (8), the two ends of the screw (8) are rotatably connected to the two ends of the air duct (30), one end of the screw (8) is provided with a drive motor (27), the screw (8) is provided with a nut slider (9), the nut slider (9) is threadedly connected to the screw (8), the nut slider (9) is provided with a cooling fan (12), the drive motor (27) is used to drive the nut slider (9) to move on the screw (8), thereby controlling the relative position of the cooling fan (12) in the air duct (30); The nut slider (9) is provided with a mounting ring (11), which is connected to the nut slider (9). The cooling fan (12) is disposed inside the mounting ring (11). The cooling fan (12) is provided with a first rotating shaft (17) and a second rotating shaft (20) opposite to each other. The first rotating shaft (17) and the second rotating shaft (20) are arranged perpendicular to the connection surface between the heat sink (2) and the mounting box (1). One end of the first rotating shaft (17) and the second rotating shaft (20) is fixed to the outer shell of the cooling fan (12). The other ends of the first rotating shaft (17) and the second rotating shaft (20) are rotatably connected to the mounting ring (11) and extend to the outside of the mounting ring (11). A first limiting spring (19) and a second limiting spring (21) are respectively fitted on the 20). The first limiting spring (19) and the second limiting spring (21) are located between the mounting ring (11) and the cooling fan (12). The two ends of the first limiting spring (19) and the second limiting spring (21) are respectively fixed on the mounting ring (11) and the cooling fan (12). A rotating rack (16) is provided on the side wall of the air duct (30) away from the drive motor (27). The rotating rack (16) is fixed on the side wall of the air duct (30). A rotating gear (18) is provided on the other end of the first rotating shaft (17). When the rotating gear (18) moves to the position of the rotating rack (16), it can mesh and rotate on the rotating rack (16).

2. The high heat flux density assembled sealed chassis of the signal processor according to claim 1, characterized in that: The mounting ring (11) is provided with a third rotating shaft (14), which is parallel to the connection surface of the mounting box (1) and the heat dissipation box (2). One end of the third rotating shaft (14) is fixed to the outer surface of the mounting ring (11), and the other end of the third rotating shaft (14) is rotatably connected to the nut slider (9). A third limiting spring (15) is sleeved on the third rotating shaft (14), and the two ends of the third limiting spring (15) are respectively fixed to the nut slider (9) and the mounting ring (11). A first traction rope (22) and a second traction rope (23) are respectively provided on the third rotating shaft (14). One end of the first traction rope (22) and the second traction rope (23) are respectively fixed on the third rotating shaft (14). The other ends of the first traction rope (22) and the second traction rope (23) extend to the outer sides of both ends of the air duct (30). Both ends of the air duct (30) are provided with a winding motor (25). The winding motor (25) is fixed on the heat dissipation box (2). The output end of the winding motor (25) is provided with a winding roller (26). The other ends of the first traction rope (22) and the second traction rope (23) are respectively wound around the winding roller (26) on the outer sides of both ends of the air duct (30).

3. The high heat flux density assembled sealed chassis of the signal processor according to claim 1, characterized in that: A limiting rack (28) is provided on the inner wall of the end of the air duct (30) near the drive motor (27). When the limiting rack (28) contacts the reversing gear (18), it can limit the rotation of the first rotating shaft (17).

4. The high heat flux density assembled sealed chassis of the signal processor according to claim 1, characterized in that: The screw (8) has a first connecting block (7) on both ends. The first connecting block (7) is fixed on the heat sink (2). The two ends of the screw (8) are rotatably connected to the first connecting block (7). The drive motor (27) is fixed on the first connecting block (7).

5. The high heat flux density assembled hermetic chassis of the signal processor according to claim 2, characterized in that: The air duct (30) has a second connecting block (31) on both sides. The second connecting block (31) is fixed on the heat sink (2). The wound motor (25) is fixed on the second connecting block (31).

6. The high heat flux density assembled hermetic chassis of the signal processor according to claim 5, characterized in that: Each of the second connecting blocks (31) is provided with a guide block (24). One end of the guide block (24) is fixed to the second connecting block (31), and the other ends of the two second connecting blocks (31) are slidably connected to the first traction rope (22) and the second traction rope (23), respectively.

7. The high heat flux density assembled hermetic chassis of the signal processor according to claim 1, characterized in that: The nut slider (9) is provided with at least one light rod (10), the two ends of the light rod (10) are fixed to the outer sides of the two ends of the air duct (30), and the nut slider (9) is slidably connected to the light rod (10).

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