Transfer device, manufacturing method, micro light-emitting diode transfer method and display panel
By setting adhesive protrusions on the substrate of the transfer device and opening through-holes in the protective layer, only the adhesive protrusions are exposed for adsorbing micro LEDs, thus solving the problem of mis-adsorption in the prior art and achieving higher pick-up accuracy and transfer efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHENGDU VISTAR OPTEOLECTRONICS CO LTD
- Filing Date
- 2024-10-11
- Publication Date
- 2026-04-14
AI Technical Summary
Existing transfer devices are prone to accidentally attracting micro-LEDs from non-transfer areas when transferring micro-LEDs, resulting in insufficient pickup accuracy.
Design a transfer device including a substrate and a protective layer. The substrate has adhesive protrusions, and the protective layer has through openings, exposing only the adhesive protrusions for adsorbing micro light-emitting diodes, while the other areas are covered by the protective layer to reduce the probability of mis-adsorption.
This improves the pickup accuracy of micro LEDs, reduces the probability of false pickups, and increases transfer efficiency and device lifespan.
Smart Images
Figure CN121865779A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of display technology, and in particular relates to a transfer device, manufacturing method, micro-light-emitting diode transfer method, and display panel. Background Technology
[0002] Micro-LEDs are devices with dimensions ranging from a few micrometers to hundreds of micrometers. Because they are much smaller than ordinary LEDs, the distance between two adjacent pixels can be reduced from the millimeter level to the micrometer level. Therefore, it is possible to realize micro-LED display panels using micro-LED arrays.
[0003] In the prior art, the fabrication of micro-light-emitting diode (LED) display panels typically involves first forming micro-light-emitting diodes on a supply substrate, then transferring the micro-light-emitting diodes to a receiving substrate using a transfer device, and finally encapsulating the receiving substrate to form the micro-light-emitting diode display panel.
[0004] Currently, the transfer device has adhesive properties on the entire surface facing the micro LED, which may cause micro LEDs in non-transfer areas to be accidentally adsorbed during the transfer process. Summary of the Invention
[0005] This application provides a transfer device that can improve the pickup accuracy of micro light-emitting diodes.
[0006] The first aspect of this application provides a transfer device, which includes a substrate and a protective layer. The substrate includes a base plate and at least one first adhesive protrusion located on one side of the base plate. The protective layer is connected to the substrate and is located on the same side of the base plate as the first adhesive protrusion. The protective layer has an opening that penetrates the protective layer along the thickness direction of the transfer device. The orthographic projection of the first adhesive protrusion on the base plate and the orthographic projection of the opening on the base plate at least partially overlap.
[0007] According to an embodiment of the first aspect of this application, the first adhesive protrusion includes: a working surface, which is spaced apart from the substrate along the thickness direction, wherein the orthographic projection of the working surface on the substrate overlaps with orthographic projection of the opening on the substrate or is located within orthographic projection of the opening on the substrate; a connecting surface, which connects the working surface and the substrate, wherein the orthographic projection of the working surface on the substrate is located outside orthographic projection of the connecting surface on the substrate; optionally, the orthographic projection of the connecting surface on the substrate and the orthographic projection of the protective layer on the substrate at least partially overlap.
[0008] According to an embodiment of the first aspect of this application, the orthographic projection of the working surface on the substrate overlaps with the orthographic projection of the opening on the substrate, and the orthographic projection of the opening on the substrate is located outside the orthographic projection of the connecting surface on the substrate; optionally, the orthographic projection of the working surface on the substrate is located within the orthographic projection of the protective layer on the substrate.
[0009] According to an embodiment of the first aspect of this application, the adhesiveness of the protective layer is less than that of the first adhesive protrusion, and the adhesiveness of the protective layer is less than that of the substrate; optionally, the substrate and the first adhesive protrusion are made of the same material; optionally, the adhesiveness of the substrate is greater than or equal to 20 N / cm. 2 The adhesiveness of the protective layer is less than or equal to 5 N / cm. 2 .
[0010] According to an embodiment of the first aspect of this application, the substrate includes a plurality of first adhesive protrusions located on the same side of the substrate; the protective layer is provided with a plurality of openings, which are respectively corresponding to the plurality of first adhesive protrusions; optionally, the plurality of first adhesive protrusions are arranged in rows and columns.
[0011] According to an embodiment of the first aspect of this application, the substrate further includes at least one second adhesive protrusion, the second adhesive protrusion being located on the same side of the substrate as the first adhesive protrusion, and the orthographic projection of the second adhesive protrusion onto the substrate being located within the orthographic projection of the protective layer onto the substrate; optionally, a plurality of second adhesive protrusions are disposed around the first adhesive protrusion.
[0012] A second aspect of this application provides a method for manufacturing a transfer device, comprising: providing a mold having a base groove and at least one mold groove located within the base groove; disposing of a first material within the base groove and the mold groove; curing and demolding the first material to obtain a substrate, the substrate including a substrate and at least one first adhesive protrusion located on one side of the substrate; preparing a protective layer on the side of the first adhesive protrusion facing away from the substrate; and preparing an opening on the protective layer, wherein the orthographic projection of the first adhesive protrusion onto the substrate and the orthographic projection of the opening onto the substrate at least partially overlap.
[0013] According to an embodiment of the second aspect of this application, the step of forming an opening on a protective layer, wherein the orthographic projection of the first adhesive protrusion on the substrate and the orthographic projection of the opening on the substrate at least partially overlap, includes: forming an opening on the protective layer by means of a laser, wherein the orthographic projection of the first adhesive protrusion on the substrate and the orthographic projection of the opening on the substrate at least partially overlap.
[0014] A third aspect of this application provides a method for transferring micro-light-emitting diodes, comprising: providing a supply substrate on which micro-light-emitting diodes are disposed; transferring the micro-light-emitting diodes on the supply substrate to a receiving substrate using a transfer device as described above, and making the micro-light-emitting diodes correspond one-to-one with thin-film transistors on the receiving substrate used to drive the micro-light-emitting diodes to emit light.
[0015] The fourth aspect of this application provides a display panel fabricated using the micro-light-emitting diode transfer method described above.
[0016] The transfer device of this application includes a substrate and a protective layer. The substrate includes a base plate and at least one first adhesive protrusion located on one side of the base plate. The protective layer is connected to the substrate and is located on the same side of the base plate as the first adhesive protrusion. The protective layer has an opening that penetrates the protective layer along the thickness direction of the transfer device. The orthographic projection of the first adhesive protrusion onto the base plate and the orthographic projection of the opening onto the base plate at least partially overlap. By covering one side of the substrate with a protective layer and opening the protective layer to expose the first adhesive protrusion, this application ensures that only the exposed first adhesive protrusion of the transfer device can adsorb micro-light-emitting diodes (LEDs), while other positions are covered by the protective layer and do not adsorb LEDs. This reduces the probability of mis-picking the LEDs and thus improves the picking accuracy of the transfer device for the LEDs. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a side view of a transfer device, a supply substrate, and a micro light-emitting diode provided in the first aspect of this application.
[0019] Figure 2 yes Figure 1 A cross-sectional view of the transfer device at section AA;
[0020] Figure 3 It is another kind Figure 1 A cross-sectional view of the transfer device at section AA;
[0021] Figure 4 It is yet another kind Figure 1 A cross-sectional view of the transfer device at section AA;
[0022] Figure 5 Is it another kind? Figure 1 A cross-sectional view of the transfer device at section AA;
[0023] Figure 6 Is it another kind? Figure 1 A cross-sectional view of the transfer device at section AA;
[0024] Figure 7 This is a schematic flowchart of a method for manufacturing a transfer device according to a second aspect embodiment of this application;
[0025] Figure 8 This is a cross-sectional view of a mold used in a manufacturing method of a transfer device according to a second aspect embodiment of this application;
[0026] Figure 9 This is a schematic flowchart of a micro-light-emitting diode transfer method provided in the third aspect embodiment of this application.
[0027] Figure label:
[0028] 10. Transfer device; 101. Supply substrate; 20. Micro light-emitting diode; 30. Mold; 301. Base groove; 302. Mold groove;
[0029] 100, Substrate; 110, Base plate; 120, First adhesive protrusion; 121, Working surface; 122, Connecting surface; 130, Second adhesive protrusion;
[0030] 200. Protective layer; 210. Opening;
[0031] z, thickness direction. Detailed Implementation
[0032] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.
[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.
[0034] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.
[0035] The applicant discovered that in the prior art, the transfer device has adhesive properties on the entire surface facing the micro-LED, which may cause micro-LEDs in non-transfer areas to be accidentally adsorbed during transfer.
[0036] In view of the above problems, the applicant proposes a transfer device for transferring micro light-emitting diodes to be transferred on a supply substrate to a receiving substrate. The transfer device includes a substrate and a protective layer. The substrate includes a substrate and at least one first adhesive protrusion located on one side of the substrate. The protective layer and the first adhesive protrusion are located on the same side of the substrate. The protective layer has an opening that penetrates the protective layer along the thickness direction of the transfer device. The orthographic projection of the first adhesive protrusion on the substrate and the orthographic projection of the opening on the substrate at least partially overlap.
[0037] The transfer device provided in this application covers one side of the substrate with a protective layer and opens an opening on the protective layer to expose the first adhesive protrusion. This allows the transfer device to only adsorb the micro LEDs through the exposed first adhesive protrusion, while other positions are covered by the protective layer and do not adsorb the micro LEDs. This reduces the probability of the micro LEDs being mispicked and thus improves the picking accuracy of the transfer device for the micro LEDs.
[0038] The transfer device provided in the embodiments of this application will now be described with reference to the accompanying drawings. It should be noted that in the drawings, the z-direction represents the thickness direction of the transfer device. For ease of drawing, the dimensions in the drawings are not necessarily proportional to the actual dimensions.
[0039] Please refer to Figure 1 and Figure 2 , Figure 1 This is a side view of a transfer device, a supply substrate, and a micro light-emitting diode provided in the first aspect of this application. Figure 2 yes Figure 1 A schematic cross-sectional view of the transfer device at section AA.
[0040] like Figure 1 and Figure 2As shown, a first aspect of this application provides a transfer apparatus 10 for transferring a micro-light-emitting diode 20 to be transferred from a supply substrate 101 to a receiving substrate (not shown). The transfer apparatus 10 includes a substrate 100 and a protective layer 200. The substrate 100 includes a substrate 110 and at least one first adhesive protrusion 120 located on one side of the substrate 110. The protective layer 200 is connected to the substrate 100 and is located on the same side of the substrate 110 as the first adhesive protrusion 120. The protective layer 200 has an opening 210 extending through the protective layer 200 along the thickness direction of the transfer apparatus (the z-direction in the figure). The orthographic projection of the first adhesive protrusion 120 onto the substrate 110 at least partially overlaps with the orthographic projection of the opening 210 onto the substrate 110.
[0041] Optionally, the first adhesive protrusion 120 has strong adhesion, and when it contacts the micro-LED 20, it can attract the micro-LED 20 by the van der Waals forces between them. The adhesiveness of the protective layer 200 is less than that of the first adhesive protrusion, and also less than that of the substrate 110. Due to its lower adhesiveness, the protective layer 200 does not attract the micro-LED 20 when it contacts it. The protective layer 200 at least covers a portion of the substrate 110, so that the portion covered by the protective layer 200 will not attract the micro-LED 20 even if it comes into contact with it.
[0042] Optionally, the substrate 110 and the first adhesive protrusion 120 are made of the same material, and the substrate 110 and the first adhesive protrusion 120 are prepared in the same process.
[0043] The transfer device 10 of this embodiment covers one side of the substrate 100 with a protective layer 200 and has an opening 210 on the protective layer 200 exposing the first adhesive protrusion 120. This ensures that only the exposed first adhesive protrusion 120 of the transfer device 10 can attract the micro-light-emitting diode 20, while other positions covered by the protective layer 200 do not attract the micro-light-emitting diode 20. This reduces the probability of the micro-light-emitting diode 20 being mispicked, thereby improving the picking accuracy of the transfer device 10 for the micro-light-emitting diode 20. Please refer to... Figure 2 and Figure 3 , Figure 3 It is another kind Figure 1 A schematic cross-sectional view of the transfer device at section AA.
[0044] In some optional embodiments, the first adhesive protrusion 120 includes a working surface 121 and a connecting surface 122. The working surface 121 is spaced apart from the substrate 110 along the thickness direction z. The orthographic projection of the working surface 121 onto the substrate 110 overlaps with or is located within the orthographic projection of the opening 210 onto the substrate 110. The connecting surface 122 connects the working surface 121 and the substrate 110. The orthographic projection of the working surface 121 onto the substrate 110 is located outside the orthographic projection of the connecting surface 122 onto the substrate 110.
[0045] Optionally, the cross-sectional area of the first adhesive protrusion 120 in the thickness direction z gradually increases in the direction close to the substrate 110, which can be understood as the first adhesive protrusion 120 being a trapezoidal protrusion that gradually decreases in the direction away from the substrate 110.
[0046] Optional, such as Figure 3 As shown, the orthographic projection of the working surface 121 onto the substrate 110 lies within the orthographic projection of the opening 210 onto the substrate 110. The orthographic projection of the connecting surface 122 onto the substrate 110 at least partially overlaps with the orthographic projection of the opening 210 onto the substrate 110. The orthographic projection of the connecting surface 122 onto the substrate 110 at least partially overlaps with the orthographic projection of the protective layer 200 onto the substrate 110. The opening 210 is slightly larger than the working surface 121, exposing a portion of the connecting surface 122, but not completely exposing the first adhesive protrusion 120.
[0047] Optional, such as Figure 2 As shown, the orthographic projection of the working surface 121 onto the substrate 110 overlaps with the orthographic projection of the opening 210 onto the substrate 110. The orthographic projection of the opening 210 onto the substrate 110 is outside the orthographic projection of the connecting surface 122 onto the substrate 110. The orthographic projection of the connecting surface 122 onto the substrate 110 is within the orthographic projection of the protective layer 200 onto the substrate 110. The size of the opening 210 is the same as that of the working surface 121. The protective layer 200 only exposes the working surface 121, and the connecting surface 122 is completely covered by the protective layer 200.
[0048] The transfer device 10 of this application embodiment makes the size of the opening 210 the same as or slightly larger than the working surface 121, so that the working surface 121 is fully exposed. While the protective layer 200 covers other positions, it increases the adsorption force of the working surface 121 on the micro light-emitting diode 20.
[0049] Please refer to Figure 4 , Figure 4 It is yet another kind Figure 1 A schematic cross-sectional view of the transfer device at section AA.
[0050] like Figure 4 As shown, in some optional embodiments, the opening 210 is located within the orthographic projection of the working surface 121 on the substrate 110, and the connecting surface 122 is located within the orthographic projection of the protective layer 200 on the substrate 110.
[0051] In the transfer device 10 of this application embodiment, the opening 210 of the protective layer 200 only exposes a portion of the working surface 121, while the connecting surface 122 and another portion of the working surface 121 are covered by the protective layer 200. During the transfer of the micro-light-emitting diode 20, even if the upper surface of the protective layer 200 is higher than the working surface 121 due to covering part of the working surface 121, the protective layer 200 has a certain elasticity. When the protective layer 200 comes into contact with the micro-light-emitting diode 20 and is squeezed, it will undergo a certain compressive deformation, ultimately allowing the working surface 121 to still contact and adsorb the micro-light-emitting diode 20, thus realizing the transfer function of the transfer device 10.
[0052] In some alternative embodiments, the viscosity of substrate 100 is greater than or equal to 20 N / cm. 2 The adhesiveness of the protective layer 200 is less than or equal to 5 N / cm. 2 .
[0053] Optionally, the substrate 100 is made of high-viscosity PDMS (polydimethylsiloxane), and the protective layer 200 is made of low-viscosity PDMS.
[0054] Optionally, the material of the protective layer 200 can also be other materials with a viscosity less than or equal to 5 N / cm. 2 Polymer materials, metallic materials, etc.
[0055] The transfer device 10 of this application embodiment achieves a substrate 100 viscosity greater than or equal to 20 N / cm. 2 The adhesiveness of the protective layer 200 is less than or equal to 5 N / cm. 2 This ensures that the first adhesive protrusion 120 is sufficiently adhesive to attract the micro-LED 20, while the protective layer 200 does not attract the micro-LED 20. By using PDMS with different adhesive properties for the protective layer 200 and the substrate 100, respectively, the protective layer 200 and the substrate 100 are made of the same type of material, which improves the connection strength between the protective layer 200 and the substrate 100 and reduces the risk of the protective layer 200 falling off the substrate 100.
[0056] Please refer to Figure 5 , Figure 5 Is it another kind? Figure 1 A schematic cross-sectional view of the transfer device at section AA.
[0057] like Figure 5 As shown, in some optional embodiments, the substrate 100 includes a plurality of first adhesive protrusions 120 located on the same side of the substrate 110. The protective layer 200 is provided with a plurality of openings 210, which are respectively disposed in a one-to-one correspondence with the plurality of first adhesive protrusions 120.
[0058] Optionally, multiple first adhesive protrusions 120 are arranged in rows and columns.
[0059] The transfer device 10 of this application embodiment includes a substrate 100 comprising a plurality of first adhesive protrusions 120 and a protective layer 200 having a plurality of openings 210 corresponding to the first adhesive protrusions 120, thereby enabling the transfer device 10 to transfer a plurality of micro light-emitting diodes 20 at one time, thereby improving the transfer efficiency of the transfer device 10.
[0060] Please refer to Figure 6 , Figure 6 Is it another kind? Figure 1 A schematic cross-sectional view of the transfer device at section AA.
[0061] like Figure 6 As shown, in some optional embodiments, the substrate 100 further includes at least one second adhesive protrusion 130, which is located on the same side of the substrate 110 as the first adhesive protrusion 120, and the orthographic projection of the second adhesive protrusion 130 onto the substrate 110 is within the orthographic projection of the protective layer 200 onto the substrate 110.
[0062] Optionally, a plurality of second adhesive protrusions 130 are arranged around the first adhesive protrusion 120.
[0063] Optionally, the second adhesive protrusion 130 has the same adhesiveness as the first adhesive protrusion 120. The shape and size of the second adhesive protrusion 130 can be referenced from the first adhesive protrusion 120, and will not be described again here.
[0064] The transfer device 10 of this application embodiment provides a plurality of second adhesive protrusions 130 on the same side of the substrate 110 as the first adhesive protrusion 120. The second adhesive protrusions 130 are covered by a protective layer 200. When the first adhesive protrusion 120 normally adsorbs the micro light-emitting diode 20, the second adhesive protrusions 130 being covered by the protective layer 200 will not affect the adsorption of the micro light-emitting diode 20. When the first adhesive protrusion 120 is damaged and its viscosity is reduced, it can no longer adsorb the micro light-emitting diode 20. A new opening can be made on the protective layer 200 to expose the second adhesive protrusions 130 as a replacement for the first adhesive protrusion 120, thereby improving the service life of the transfer device 10.
[0065] Please refer to Figure 7 and Figure 8 , Figure 7 This is a schematic flowchart of a method for manufacturing a transfer device according to a second aspect embodiment of this application; Figure 8 This is a cross-sectional structural schematic diagram of a mold in a manufacturing method of a transfer device provided in the second aspect of this application.
[0066] like Figure 2 , Figure 7 and Figure 8 As shown, an embodiment of the second aspect of this application provides a method for manufacturing a transfer device 10, comprising:
[0067] Step S01: Provide a mold 30, which has a base groove 31 and at least one mold groove 302 located in the base groove 301.
[0068] Step S02: Place the first material in the base groove 301 and the mold groove 302.
[0069] Step S03: The first material is cured and demolded to obtain a substrate 100, which includes a base plate 110 and at least one first adhesive protrusion 120 located on one side of the base plate 110.
[0070] Step S04: Prepare a protective layer 200 on the side of the first adhesive protrusion 120 that is away from the substrate 110.
[0071] In step S05, an opening 210 is prepared on the protective layer 200, and the orthographic projection of the first adhesive protrusion 120 on the substrate 110 at least partially overlaps with the orthographic projection of the opening 210 on the substrate 110.
[0072] Optionally, the first material is a highly viscous liquid PDMS. In step S02, before placing the first material in the base tank 301, a layer of release agent may also be sprayed into the base tank 301. In step S03, the first material is cured to obtain a substrate 100, wherein the first material located in the mold groove 302 is cured and forms viscous protrusions, and the number and position of the mold grooves 302 match the viscous protrusions.
[0073] Optionally, the protective layer 200 in step S04 can be prepared by spin coating.
[0074] The manufacturing method of the transfer device 10 in this application embodiment involves preparing a protective layer 200 on the surface of a substrate 100 to cover the substrate 100, and opening 210 on the protective layer 200 to expose the first adhesive protrusion 120. This allows the transfer device 10 to only adsorb the micro-light-emitting diode 20 through the exposed first adhesive protrusion 120, while other positions are covered by the protective layer 200 and do not adsorb the micro-light-emitting diode 20. This reduces the probability of the micro-light-emitting diode 20 being mispicked, thereby improving the picking accuracy of the micro-light-emitting diode 20 by the transfer device 10.
[0075] In some optional embodiments, step S05 includes:
[0076] An opening 210 is formed on the protective layer 200 by laser, and the orthographic projection of the first adhesive protrusion 120 on the substrate 110 at least partially overlaps with the orthographic projection of the opening 210 on the substrate 110.
[0077] Please refer to Figure 9 , Figure 9 This is a schematic flowchart of a micro-light-emitting diode transfer method provided in the third aspect embodiment of this application.
[0078] like Figure 9 As shown, an embodiment of the third aspect of this application provides a method for transferring a micro light-emitting diode 20, comprising:
[0079] Step S101: Provide a supply substrate 101, on which a micro light-emitting diode 20 is housed.
[0080] In step S102, the micro-light-emitting diodes on the supply substrate 101 are transferred to the receiving substrate using the transfer device 10 provided in the embodiment of the first aspect of this application, and the micro-light-emitting diodes 20 are made to correspond one-to-one with the thin-film transistors on the receiving substrate used to drive the micro-light-emitting diodes 20.
[0081] An embodiment of the fourth aspect of this application provides a display panel fabricated using the transfer method of the micro-light-emitting diode 20 provided in the embodiment of the third aspect of this application.
[0082] Since the display panel provided in the fourth aspect embodiment of the present invention is prepared using the micro light-emitting diode 20 transfer method of the third aspect embodiment described above, the display panel provided in the fourth aspect embodiment of the present application has the beneficial effects of the transfer method of any of the third aspects embodiments described above, which will not be repeated here.
[0083] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.
Claims
1. A transfer device, characterized in that, include: The substrate includes a base plate and at least one first adhesive protrusion located on one side of the base plate; A protective layer is connected to the substrate and located on the same side of the substrate as the first adhesive protrusion. The protective layer has an opening that penetrates the protective layer along the thickness direction of the transfer device. The orthographic projection of the first adhesive protrusion on the substrate and the orthographic projection of the opening on the substrate at least partially overlap.
2. The transfer device according to claim 1, characterized in that, The first viscous protrusion includes: The working surface is spaced apart from the substrate along the thickness direction, and the orthographic projection of the working surface on the substrate overlaps with or the orthographic projection of the opening on the substrate or is located within the orthographic projection of the opening on the substrate. A connecting surface connects the working surface and the substrate, wherein the orthographic projection of the working surface onto the substrate is located outside the orthographic projection of the connecting surface onto the substrate; Preferably, the orthographic projection of the connecting surface on the substrate and the orthographic projection of the protective layer on the substrate at least partially overlap.
3. The transfer device according to claim 2, characterized in that, The orthographic projection of the working surface on the substrate overlaps with the orthographic projection of the opening on the substrate, and the orthographic projection of the opening on the substrate is located outside the orthographic projection of the connecting surface on the substrate. Preferably, the orthographic projection of the working surface onto the substrate is located within the orthographic projection of the protective layer onto the substrate.
4. The transfer device according to claim 1, characterized in that, The adhesiveness of the protective layer is less than that of the first adhesive protrusion, and the adhesiveness of the protective layer is less than that of the substrate. Preferably, the substrate and the first adhesive protrusion are made of the same material; Preferably, the substrate has a viscosity greater than or equal to 20 N / cm. 2 The viscosity of the protective layer is less than or equal to 5 N / cm. 2 .
5. The transfer device according to claim 1, characterized in that, The substrate includes a plurality of the first adhesive bumps, the plurality of the first adhesive bumps being located on the same side of the substrate; The protective layer is provided with a plurality of openings, and the plurality of openings are provided in a one-to-one correspondence with the plurality of first adhesive protrusions; Preferably, the plurality of the first adhesive protrusions are arranged in rows and columns.
6. The transfer device according to claim 1, characterized in that, The substrate further includes at least one second adhesive protrusion, the second adhesive protrusion being located on the same side of the substrate as the first adhesive protrusion, and the orthographic projection of the second adhesive protrusion onto the substrate being located within the orthographic projection of the protective layer onto the substrate. Preferably, a plurality of the second adhesive protrusions are arranged around the first adhesive protrusion.
7. A method for manufacturing a transfer device, characterized in that, include: A mold is provided, the mold having a base groove and at least one mold groove located within the base groove; A first material is placed in the base groove and the mold groove; The first material is cured and demolded to obtain a substrate, the substrate comprising a substrate and at least one first adhesive protrusion located on one side of the substrate; A protective layer is prepared on the side of the first adhesive protrusion facing away from the substrate; An opening is formed on the protective layer, wherein the orthographic projection of the first adhesive protrusion on the substrate and the orthographic projection of the opening on the substrate at least partially overlap.
8. The method for manufacturing the transfer device according to claim 7, characterized in that, The step of forming an opening on the protective layer, wherein the orthographic projection of the first adhesive protrusion on the substrate and the orthographic projection of the opening on the substrate at least partially overlap, includes: An opening is created on the protective layer by laser, wherein the orthographic projection of the first adhesive protrusion on the substrate and the orthographic projection of the opening on the substrate at least partially overlap.
9. A method for transferring micro-light-emitting diodes, characterized in that, include: A supply substrate is provided, on which micro light-emitting diodes are housed; The micro-light-emitting diodes on the supply substrate are transferred to the receiving substrate by the transfer device as described in any one of claims 1 to 6, and the micro-light-emitting diodes correspond one-to-one with the thin-film transistors on the receiving substrate used to drive the micro-light-emitting diodes to emit light.
10. A display panel, characterized in that, It is prepared using the transfer method for micro-light-emitting diodes as described in claim 9.