Combined thin film package in flexible display device and method of manufacturing same

Abstract

A flexible display device (1) includes an organic light emitting layer (2) and a thin film encapsulation (TFE) layer (3) providing a combined function of encapsulation, polarization and color filtering by embedding a black matrix layer (4) and a color filter layer (5) within an organic layer (33) between a first inorganic layer (31) and a second inorganic layer (32). The black matrix layer (4) preferably comprises a metal layer to additionally form a dielectric-metal-dielectric (DMD) structure in combination with the first inorganic layer (31) and the second inorganic layer (32), so as to obtain additional flexibility. The black matrix layer (4) preferably further comprises a wire mesh (41) to form a polarizer layer within the TFE layer (3) to improve display performance and reduce display stack thickness.

Description

[0001] This application is a divisional application. The original application has the application number 202080103473.8 and the original application date is September 2, 2020. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This invention relates to display devices, and more specifically, to flexible display devices. Specifically, this invention relates to a novel thin-film encapsulation layer for flexible OLED display devices and a method for manufacturing the same. Background Technology

[0003] With the advancement of the information society, various requirements have recently been placed on image display on devices. As a result, various display devices are being used and manufactured, such as liquid crystal display (LCD) devices, plasma display panel (PDP) devices, and organic light-emitting display (OLED) devices.

[0004] OLED is a flat light-emitting technology that uses a series of organic thin films between two conductors. When an electric current is applied, it emits bright light. Therefore, OLED is a backlight-free emitting display, making it thinner and more efficient than LCD displays, which require white backlighting. OLED displays offer advantages such as low power consumption, high brightness, fast response time, wide viewing angle, and light weight, and are widely used in devices such as mobile communication terminals, personal digital assistants (PDAs), and portable computers. OLED displays are divided into passive matrix and active matrix types. Active matrix OLED displays use thin-film transistors (TFTs) to drive the OLED. OLED display modules also require additional layers to achieve durability, user interface, and optical functions. These typically include at least one cover window (CW), touch sensor (TS), and circular polarizer (CP), which must be laminated together with an optically clear adhesive (OCA) or liquid optically clear adhesive (LOCA) to achieve optimal contrast, brightness, and mechanical durability.

[0005] Because the organic materials in OLED displays are highly sensitive to oxygen and moisture, encapsulation layers are crucial for protecting the device and ensuring the required lifespan. In early generations, OLED displays were rigid, sealed within a glass barrier. However, these early OLED displays could not guarantee flexible form factors, a need that is rising. Specifically, there is an increasing demand for display-based consumer electronics, coupled with consumers' preference for energy-efficient and flexible gadgets.

[0006] To address this issue, the structure of the display stack was fundamentally redesigned, and the concept of flexible displays was developed. In this concept, the main rigid components, namely the substrate glass and the cover glass, are replaced by flexible components. The substrate is replaced by a high-temperature resistive polyimide film, while the cover glass is replaced by a thin film encapsulation (TFE) layer.

[0007] The primary goal of the TFE layer is to prevent water and oxygen from diffusing into the OLED layer. Therefore, the TFE layer has very strict requirements regarding water permeability. Typically, a TFE layer comprises multiple layers, including inorganic and organic layers. In most cases, a three-layer structure offers the best performance, where two inorganic layers are usually deposited using chemical vapor deposition (CVD), hence the designations "CVD 1" and "CVD 2" layers. These CVD layers (i.e., the inorganic layers) are primarily composed of silicon oxide or nitrides, providing the main barrier properties. The organic layer is mainly based on acrylic acid-based organic compounds, providing flexibility. Another important function of the organic layer is to cover particles. During the deposition of the first CVD layer, some particles ranging from 3 μm to 5 μm in size may deposit on the surface. When these particles move, they can mechanically damage the encapsulation layer and cause OLED display malfunctions. To prevent the movement of these particles, the first CVD layer is covered with an organic component before the deposition of the second CVD layer. The organic component is typically colorless and has a very defined reflectance index to provide optimal light from the OLED device.

[0008] The problem with flexible display panels is that when the laminated structure of a flexible display is bent (bent, folded, rolled, etc.), displacement occurs due to the difference between the inner and outer perimeters. In other words, when the display stack is bent, the distance measured on the outer perimeter is longer than the distance measured on the inner perimeter. Depending on the film properties such as modulus and thickness, two fundamentally different cases (or a mixture of both) can be observed.

[0009] In the first case, when the moduli of the layers are close to each other, the strain distribution is equal, forming a neutral plane (NP). NP means that the strain in that layer is equal to 0. Tensile strain may form above the NP, while compressive strain may form below the NP. In the case of a single NP, very high strain (stress) may occur in the outermost layer, which causes the film to deform, and the display panel may crack in areas far from the NP.

[0010] In the second case, the moduli of the layers (films) can be very different, leading to the formation of multiple NPs in the laminated stack. Although the strain on the film is significantly reduced in the latter case, the shear strain in the adhesive layer can become a very significant problem. High shear strain leads to delamination, creep, and failure of the adhesive layer.

[0011] Another problem can occur when a flexible display is bent (bent, rolled, folded) and the strain in the TFE layer exceeds the critical strain value. This is because TFE comprises thin inorganic layers (primarily SiNx and SiO2, sometimes SiOxNy). The critical strain of these films depends on the thickness, but in most cases (0.6 μm to 1 μm), cracks begin at a strain of 0.6%. Therefore, if the strain in the TFE layer exceeds 0.6%, the display will crack and fail.

[0012] Another problem with this type of display device is that, to ensure sufficient contrast and avoid color washing effects, the display stack must include a polarizer (POL) layer. However, this POL layer has a relatively high modulus, thus significantly increasing the stiffness of the flexible display. The POL layer also increases the overall thickness, which may lead to increased shared strain, potentially causing display stack failures. Furthermore, the POL layer has a low yield point and is prone to cracking, especially at lower temperatures. While reducing the POL layer thickness helps address the stiffness issue, it also leads to poor reliability, particularly in high-temperature and high-humidity environments.

[0013] These issues limit the widespread application of flexible displays, reduce manufacturing yield, decrease reliability, increase costs, and potentially significantly shorten the lifespan of flexible display devices. Therefore, addressing these problems is imperative, and technological solutions are highly anticipated. Summary of the Invention

[0014] The aim is to provide an improved display device and a method for manufacturing the same, which overcomes or at least reduces the aforementioned problems by providing an improved thin-film encapsulation solution.

[0015] The above and other objectives are achieved through the features of the independent claim. Other implementations are apparent from the dependent claims, the description, and the drawings.

[0016] According to a first aspect, a display device is provided, comprising: a light-emitting layer; an encapsulation layer disposed above the light-emitting layer; a black matrix layer disposed above the light-emitting layer; and a color filter layer disposed above the light-emitting layer; wherein at least one of the black matrix layer and the color filter layer is embedded within the encapsulation layer.

[0017] Providing a black matrix (BM) layer and a color filter (CF) layer within the display stack allows for the elimination of the polarizer (POL) layer from the display device, thereby eliminating the aforementioned problems caused by the POL layer, such as increased stiffness and significantly reduced yield point. This approach also reduces the overall thickness of the display stack while improving the mechanical properties of the encapsulation layer itself.

[0018] Eliminating the POL layer, which can absorb up to 50% of the light, further improves the energy efficiency of display devices, as it allows for the same brightness with 50% of the energy consumed by the POL layer. This, in turn, extends battery life and the general lifespan of the display, especially for OLED devices.

[0019] Furthermore, embedding the BM layer and / or CF layer into the encapsulation layer can avoid technical problems related to color washing effects caused by light locking and contrast differences between subpixels when using a combination of BM+CF layers to replace the POL layer, while also further reducing the overall thickness of the display stack.

[0020] Moving the color filter layer, which is typically embedded in the layer on top of the encapsulation layer, within the encapsulation layer further improves the viewing angle of the display device, thereby enhancing the user experience.

[0021] Therefore, this packaging arrangement combines several key functions of the display device (encapsulation, color filtering, polarization) into a compact solution.

[0022] In one embodiment, the encapsulation layer is arranged adjacent to the light-emitting layer to ensure that the total thickness of the display stack is reduced.

[0023] In one possible implementation of the first aspect, the encapsulation layer is a thin film encapsulation (TFE) layer, comprising: a first inorganic layer; a second inorganic layer disposed above the first inorganic layer; and an organic layer disposed between the first inorganic layer and the second inorganic layer; wherein at least one of the black matrix layer and the color filter layer is embedded within the organic layer. The use of a TFE layer in a display device ensures optimal resistance to the diffusion of water and oxygen into the light-emitting layer.

[0024] In one embodiment, the first inorganic layer is an inorganic membrane comprising any one of SiO2, SiNx, or Al2O3, thereby ensuring optimal water permeability and mechanical properties.

[0025] In one embodiment, the second inorganic layer is an inorganic membrane comprising any one of SiNx, SiOx, SiNxOy, or Al2O3, thereby ensuring optimal water permeability and mechanical properties.

[0026] In another possible implementation of the first aspect, the black matrix layer includes at least one metal layer; both the first inorganic layer and the second inorganic layer are dielectric layers; and the black matrix layer is embedded within the organic layer to combine with the first inorganic layer and the second inorganic layer to form a dielectric-metal-dielectric structure. Embedding at least one metal layer within the TFE structure as a dielectric-metal-dielectric (DMD) structure improves the crack resistance and mechanical durability of the display device by enhancing barrier properties, mechanical flexibility, and heat dissipation. These are fundamental requirements for display device packaging, especially for OLED displays.

[0027] In one embodiment, the multiple metal layers include any one or a combination of aluminum, silver, titanium, chromium, molybdenum, tungsten, and copper, thereby ensuring optimal mechanical and thermal properties.

[0028] In another possible implementation of the first aspect, the black matrix layer comprises a wire mesh arranged to convert the unpolarized beam into a polarized beam by transmitting only the vertical component of the unpolarized beam and absorbing or reflecting the horizontal component of the unpolarized beam. Using a wire mesh can improve display performance and reduce any problems caused by emission from a standard polarizer layer as described above, by using the black matrix layer as a metal mesh polarizer layer to reduce light locking and ambient light reflection, which can convert any unpolarized beam into a beam with a single linear polarization.

[0029] In one embodiment, the wire mesh is arranged with a grid size of up to 500 nm and a width of up to 500 nm, which ensures optimal performance and reduces ambient light reflection.

[0030] In another possible implementation of the first aspect, the display device further includes a polarizer layer embedded within the encapsulation layer and arranged to cover at least one of the black matrix layer and the color filter layer. Adding a polarizer layer helps to further reduce the problems caused by the emission standard polarizer layer as described above by reducing light locking.

[0031] In another possible implementation of the first aspect, the polarizer layer is an inorganic layer of a high-reflectivity refractive index material, thereby providing quarter-polarizer functionality.

[0032] In one embodiment, the polarizer layer is arranged with a thickness between 1 nm and 10 nm and is made of at least one of TiO2 or Al2O2, which ensures optimal layer thickness and mechanical properties for the display stack.

[0033] In another possible implementation of the first aspect, the polarizer layer comprises a colorless polymer with a refractive index between 1.2 and 1.6, which ensures optimal reduction light locking and improves display performance.

[0034] In another possible implementation of the first aspect, the encapsulation layer further includes a planarization layer that covers at least one of the black matrix layer and the color filter layer and forms a flat top surface, thereby ensuring optimal support surface for the second inorganic (chemical vapor deposition, CVD) layer of the encapsulation layer.

[0035] In one embodiment, the planarization layer comprises a colorless acrylic monomer to ensure optimal optical performance.

[0036] In another possible implementation of the first aspect, the display device further includes a substrate; and circuitry disposed between the substrate and the light-emitting layer, the circuitry including a plurality of thin-film transistors to achieve an optimal display arrangement for the display device.

[0037] In another possible implementation of the first aspect, the substrate is a flexible substrate and the display device is a flexible display device, thereby ensuring increased flexibility.

[0038] In one embodiment, the substrate is made of polyimide, which further ensures optimal mechanical flexibility and strain resistance.

[0039] In another possible implementation of the first aspect, the light-emitting layer includes a first electrode; a second electrode; and an electroluminescent layer disposed between the first electrode and the second electrode, wherein the first electrode is connected to at least one of the plurality of thin-film transistors, which ensures optimal display performance of the device.

[0040] In another possible implementation of the first aspect, the color filter layer comprises color filters of different colors, wherein adjacent color filters of different colors are in contact with each other, which ensures optimal display performance.

[0041] In another possible implementation of the first aspect, the display device further includes a touch screen panel disposed above the encapsulation layer, thereby enabling additional touch functionality of the display device.

[0042] In another possible implementation of the first aspect, the display device further includes a cover window arranged as an outer layer of the display device, the cover window being attached to any of the encapsulation layers, or a touchscreen panel disposed above the encapsulation layers, by pressure-sensitive adhesive. This ensures optimal arrangement and mechanical protection of the display stack layers.

[0043] In one embodiment, the light-emitting layer is an organic light-emitting layer, and the display device is an organic light-emitting device, which ensures optimal display performance.

[0044] According to a second aspect, a method for manufacturing a display device is provided, the method comprising forming a light-emitting layer; forming an encapsulation layer on the light-emitting layer; wherein forming the encapsulation layer comprises forming a pattern of at least one of a black matrix layer and a color filter layer embedded in the encapsulation layer.

[0045] Forming a black matrix (BM) layer and a color filter (CF) layer within the display stack allows for the elimination of the polarizer (POL) layer from the display device, thereby eliminating the aforementioned problems caused by the POL layer, such as increased stiffness and significantly reduced yield point. This approach also reduces the overall thickness of the display stack while improving the mechanical properties of the encapsulation layer itself.

[0046] Eliminating the POL layer, which can absorb up to 50% of the light, further improves the energy efficiency of display devices, as it allows for the same brightness with 50% of the energy consumed by the POL layer. This, in turn, extends battery life and the general lifespan of the display, especially for OLED devices.

[0047] Furthermore, forming the BM layer and / or CF layer in the encapsulation layer can avoid technical problems related to color washing effects caused by light locking and contrast difference between subpixels when using a combination of BM+CF layers to replace the POL layer, while also further reducing the overall thickness of the display stack.

[0048] Moving the color filter layer, which is typically embedded in the layer on top of the encapsulation layer, within the encapsulation layer further improves the viewing angle of the display device, thereby enhancing the user experience.

[0049] In one possible implementation of the second aspect, forming the encapsulation layer includes: forming a first inorganic layer; forming a pattern of a black matrix layer on the first inorganic layer, the pattern including gaps; forming a color filter layer by distributing color filters in the gaps; forming an organic layer with a flat top surface on top of the aforementioned layers; and forming a second inorganic layer on the flat top surface of the organic layer. Forming the encapsulation layer by forming a black matrix pattern with gaps and distributing color filters in the gaps ensures optimal manufacturing precision and reduces potential defects. Furthermore, creating the flat top surface of the organic layer provides an optimal support surface for the second inorganic layer.

[0050] In another possible implementation of the second aspect, the formation of either the first inorganic layer or the second inorganic layer includes chemical vapor deposition until the thickness is between 0.1 μm and 6 μm, more preferably between 1 μm and 2 μm, which ensures optimal display stack thickness and mechanical properties.

[0051] In another possible implementation of the second aspect, forming either the first inorganic layer or the second inorganic layer includes atomic layer deposition up to a thickness between 20 nm and 200 nm, more preferably between 50 nm and 80 nm, which ensures optimal display stack thickness and mechanical properties.

[0052] In another possible implementation of the second aspect, forming the pattern of the black matrix layer includes forming multiple metal layers; the color filter layer is a dielectric layer; and forming the encapsulation layer includes embedding the black matrix layer and the color filter layer within the encapsulation layer in a dielectric-metal-dielectric arrangement. Embedding multiple metal layers within a TFE structure as a dielectric-metal-dielectric (DMD) structure improves the crack resistance and mechanical durability of the display device by enhancing barrier properties, mechanical flexibility, and heat dissipation. These are fundamental requirements for display device encapsulation, especially for OLED displays.

[0053] In another possible implementation of the second aspect, the pattern forming the black matrix layer includes fabricating a wire mesh arranged to convert an unpolarized beam into a polarized beam by transmitting only the vertical component of the unpolarized beam and absorbing or reflecting the horizontal component of the unpolarized beam. Using a wire mesh can improve display performance and reduce any problems caused by emission from a standard polarizer layer as described above, by using the black matrix layer as a metal mesh polarizer layer to reduce light locking and ambient light reflection, which can convert any unpolarized beam into a beam with a single linear polarization.

[0054] In one embodiment, manufacturing the wire mesh includes at least one of selective ALD process direct deposition, FMM mask deposition, or sputtering followed by etching, which ensures optimal manufacturing accuracy and reduces display stack thickness.

[0055] In another possible implementation of the second aspect, forming the color filter layer involves depositing material using any of the following methods: dyeing, pigment deposition, printing, or electrodeposition, up to a thickness of 3 μm to 4 μm.

[0056] In one embodiment, forming the filter layer includes dyeing, wherein the material used to form the filter includes at least one of gelatin, casein, and synthetic products such as polyvinyl alcohol and polyvinylpyrrolidone.

[0057] In another possible embodiment, the color filter layer comprises pigment deposition, and the material used as the matrix comprises any one of acrylic or epoxy acrylate photopolymer materials.

[0058] In another possible embodiment, forming the color filter layer includes printing using any of the methods of screen printing, flexographic printing, offset printing, or gravure printing.

[0059] In another possible implementation of the second aspect, forming the encapsulation layer includes forming a polarizer layer arranged to cover a pattern of at least one of a black matrix layer and a color filter layer embedded within the encapsulation layer. Adding a polarizer layer helps to further reduce the problems caused by the emission standard polarizer layer as described above by reducing light locking.

[0060] In another possible implementation of the second aspect, the method of manufacturing a display device further includes providing a substrate; forming a circuit between the substrate and the light-emitting layer, the circuit including a plurality of thin-film transistors, thereby achieving an optimal display arrangement of the display device.

[0061] In another possible implementation of the second aspect, the method of manufacturing the display device further includes placing a touch screen panel above the encapsulation layer to enable additional touch functionality of the display device.

[0062] In another possible implementation of the second aspect, the method of manufacturing the display device further includes arranging a cover window as an outer layer of the display device, the cover window being attached to any of the encapsulation layers, or a touchscreen panel disposed above the encapsulation layer, by a pressure-sensitive adhesive. This ensures optimal arrangement and mechanical protection of the display stack layers.

[0063] These and other aspects will be apparent in one or more embodiments described below. Attached Figure Description

[0064] In the following detailed sections of the invention, aspects, embodiments, and implementations will be explained in more detail with reference to exemplary embodiments shown in the accompanying drawings, in which:

[0065] Figure 1 A schematic cross-section of a display device provided in one embodiment of the first aspect is shown; Figure 2 A schematic cross-section of a display device provided in another embodiment of the first aspect is shown; Figure 3 A schematic cross-section of the encapsulation layer of a display device provided in another embodiment of the first aspect is shown; Figure 4 A schematic cross-section of the encapsulation layer of a display device provided in another embodiment of the first aspect is shown; Figure 5 A schematic cross-section and top view of the encapsulation layer of a display device provided in another embodiment of the first aspect are shown; Figure 6 A schematic diagram illustrating the function of the wire mesh of a display device provided in another embodiment of the first aspect is shown; Figures 7A to 7D The steps of the method provided by the embodiment of the second aspect are shown. Detailed Implementation

[0066] In the following detailed description, numerous specific details are set forth by way of example in order to provide a thorough understanding of the relevant invention. However, it will be apparent to those skilled in the art that the invention can be practiced without these specific details. In other instances, well-known methods, processes, systems, components, and / or circuits have been described at a relatively high level but without detailed description to avoid unnecessarily obscuring aspects of the invention.

[0067] Furthermore, when a first portion, such as a layer, film, region, or plate, is disposed on a second portion, the first portion can not only be directly located on the second portion, but one or more third portions can be inserted between them. Furthermore, when it is indicated that a first portion, such as a layer, film, region, or plate, is formed on the second portion, the surface of the second portion forming the first portion is not limited to the upper surface of the second portion, but may include other surfaces such as the side surface or lower surface of the second portion. In the following, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0068] Figure 1 The present invention illustrates a display device 1 provided by an exemplary embodiment of the present invention, which includes a light-emitting layer 2 and an encapsulation layer 3 disposed above the light-emitting layer 2.

[0069] Display device 1 may be a liquid crystal display (LCD), an electrophoretic display (EPD), an electrowetting display (EWD), or a light-emitting diode (LED) display. In one embodiment, the light-emitting layer 2 is an organic light-emitting layer, and display device 1 is an organic light-emitting diode (OLED) display.

[0070] In one embodiment, the display device 1 is a flexible organic light-emitting diode (FOLED) display device, including a flexible plastic substrate on which electroluminescent organic semiconductors are deposited, thereby enabling the device to bend or roll while still functioning.

[0071] The encapsulation layer 3 is used to prevent water and oxygen from diffusing into the light-emitting layer 2. In one embodiment, the water permeability of the encapsulation layer 3 is less than 5*10^-6 grams of water per square meter per day. In one embodiment, the encapsulation layer 3 is arranged adjacent to the light-emitting layer 2, while in other possible embodiments, intermittent layers may be present. The encapsulation layer 3 itself may include multiple layers, including inorganic and organic layers, as described below.

[0072] Display device 1 also includes a black matrix layer 4 and a color filter layer 5. The color filter layer 5 may include... Figure 5 The diagram shows color filters 51 of different colors, wherein adjacent color filters 51 of different colors may or may not be in contact with each other. Color filters 51 can be used to generate red (R), green (G), and blue (B) pixels.

[0073] The black matrix layer 4 can be arranged in a pattern between the individual color filters of the color filter layer 5, and can include any material suitable for reducing light leakage, such as chromium or molybdenum.

[0074] Both the black matrix layer 4 and the color filter layer 5 are disposed above the light-emitting layer 2, and at least one of the black matrix layer 4 and the color filter layer 5 is embedded within the encapsulation layer 3. In one embodiment, both the black matrix layer 4 and the color filter layer 5 are embedded within the encapsulation layer 3, such as... Figure 1As shown. This allows the polarizer (POL) layer to be eliminated from the display device, thereby eliminating potential problems caused by the POL layer, such as increased stiffness and significantly reduced yield point of display device 1, as well as reducing the overall thickness of the display stack and improving the mechanical properties of the encapsulation layer 3 itself. Furthermore, embedding the black matrix layer 4 and the color filter layer 5 within the encapsulation layer 3 avoids the technical problems associated with color washing effects due to light locking and contrast differences between subpixels that occur when using a combination of the black matrix layer 4 and the color filter layer 5 to replace the POL layer. Moving the color filter layer 5 within the encapsulation layer 3 further improves the viewing angle of display device 1, such as... Figure 3 As shown by (dashed arrow).

[0075] like Figure 1 As shown, the black matrix layer 4 can be arranged in the same plane as the color filter layer 5. Alternatively, the black matrix layer 4 can be arranged in a different plane than the color filter layer 5, such as... Figures 2 to 5 As shown.

[0076] Figure 2 Another exemplary embodiment of the present invention is shown, wherein the encapsulation layer 3 is arranged as a thin-film encapsulation (TFE) layer, the TFE layer comprising a first inorganic layer 31, a second inorganic layer 32 disposed above the first inorganic layer 31, and an organic layer 33 disposed between the first inorganic layer 31 and the second inorganic layer 32. In this embodiment, the black matrix layer 4 and / or the color filter layer 5 are embedded within the organic layer 33. The first inorganic layer 31 may be arranged as an inorganic film comprising any one of SiO2, SiNx, or Al2O3. The second inorganic layer 32 may be arranged as an inorganic film comprising any one of SiNx, SiOx, SiNxOy, or Al2O3.

[0077] In one embodiment, the encapsulation layer 3 may further include a polarizer layer 6, which is arranged to cover at least one of the black matrix layer 4 and / or the color filter layer 5. The polarizer layer 6 may be an inorganic layer of a high reflectance index material (e.g., TiO2 or Al2O2) to provide quarter-polarizer functionality. The polarizer layer 6 may be arranged within the encapsulation layer 3 with a thickness between 1 nm and 10 nm. In one embodiment, the polarizer layer 6 comprises a colorless polymer with a refractive index between 1.2 and 1.6.

[0078] In one embodiment, the encapsulation layer 3 may further include a planarization layer 7, which covers at least one of the black matrix layer 4 and the color filter layer 5 and forms a flat top surface, such as... Figure 7D As shown. The planarization layer 7 may include colorless acrylic monomers for optimal optical performance.

[0079] like Figure 2 and Figure 3As shown, the display device 1 may also include a substrate 8 and a circuit 9 disposed between the substrate 8 and the light-emitting layer 2.

[0080] The substrate 8 is not specifically limited to any particular material, as long as the material can perform the function intended for the substrate 8. For example, the substrate 8 can be formed from insulating materials such as glass, plastic, or crystal. Organic polymers used to form the substrate 8 can include polyimide (PI), polycarbonate (PC), polyethylene glycol diester (PET), polyethylene (PE), polypropylene (PP), polysulfone (PSF), methyl methacrylate (PMMA), triacetyl cellulose (TAC), cyclo-olefin polymers (COP), and cyclo-olefin copolymers (COC). The substrate 8 can be selected with consideration of mechanical strength, thermal stability, transparency, surface roughness, operability, and water resistance.

[0081] In a possible embodiment, the substrate 8 may be a flexible substrate that enables the display device 1 to be used as a flexible display device 1. In one embodiment, the substrate 8 may be made of polyimide.

[0082] like Figure 3 As further shown, circuit 9 may include a plurality of thin-film transistors 10, and light-emitting layer 2 may include a first electrode 21, a second electrode 22, and an electroluminescent layer 23 disposed between the first electrode 21 and the second electrode 22. Figure 3 As shown, the first electrode 21 can be connected to at least one of the thin-film transistors 10.

[0083] like Figure 3As shown, the display device 1 may further include a touchscreen panel 11 disposed above the encapsulation layer 3 and a cover window 12 serving as the outer layer of the display device 1. The touchscreen panel 11 can recognize user touch, user proximity touch, object touch (e.g., a stylus), or object proximity touch. Proximity touch can refer to a phenomenon in which the touchscreen panel 11 recognizes the location of a user or object approaching the touchscreen panel 11 as a touch, even if the user or object does not directly touch the touchscreen panel 11. The touchscreen panel 11 may be disposed at least partially on the thin film encapsulation (TFE) layer 3 by a transfer process. In an embodiment, the detection electrodes of the touchscreen panel 11 may be formed by a transfer process.

[0084] The cover window 12 can be attached to either or both of the encapsulation layer 3 and the touch screen panel 11 via pressure-sensitive adhesive (PSA) 13.

[0085] Figure 4 Another exemplary embodiment of the invention is shown, wherein the black matrix layer 4 includes at least one metal layer. In possible embodiments, the black matrix layer 4 may include any one or a combination of aluminum, silver, titanium, chromium, molybdenum, tungsten, and copper layers.

[0086] In this embodiment, the first inorganic layer 31 and the second inorganic layer 32 are both arranged as dielectric layers, and the black matrix layer 4 is embedded in the organic layer 33 to combine with the first inorganic layer 31 and the second inorganic layer 32 to form a dielectric-metal-dielectric (DMD) structure. This DMD arrangement improves the crack resistance and mechanical durability of the display device 1 by improving barrier properties, mechanical flexibility and heat dissipation. These properties are basic requirements for the packaging of the display device 1, especially for OLED displays.

[0087] Figure 5 Another exemplary embodiment of the invention is shown, wherein the black matrix layer 4 includes a wire mesh 41 arranged to convert the unpolarized beam 14 into a polarized beam 15 by transmitting only the vertical component of the unpolarized beam 14 and absorbing or reflecting the horizontal component of the unpolarized beam 14. This function of the wire mesh 41 arrangement in the black matrix layer 4... Figure 6 The diagram further illustrates an unpolarized beam 14, the horizontal component of which is absorbed and / or reflected by a wire mesh 41 to produce a polarized beam 15.

[0088] In one embodiment, the wire mesh 41 is arranged with a mesh size of up to 500 nm and a width of up to 500 nm to achieve optimal polarization.

[0089] In one possible embodiment, combined with Figures 1 to 5 The features shown and explained are that the black matrix layer 4 and the color filter layer 5 are both embedded in the organic layer 33 of the TFE encapsulation layer 3, so that the black matrix layer 4 is combined with the first inorganic layer 31 and the second inorganic layer 32 to form a DMD structure. The black matrix layer 4 is also arranged in the wire mesh 41 to convert the unpolarized beam 14 into a polarized beam 15, thereby providing polarization function for the TFE encapsulation layer 3. In addition, the thickness is reduced and the mechanical and optical properties are improved.

[0090] Figures 7A to 7D The steps of a method for manufacturing a display device 1 provided by another exemplary embodiment of the present invention are illustrated. For simplicity, steps and features that are the same or similar to those previously described or shown herein are indicated by the same reference numerals as previously used.

[0091] Figure 7A The first manufacturing step is shown, wherein a light-emitting layer 2 is first formed, and then an encapsulation layer 3 is formed on the light-emitting layer 2. Specifically, as a first step in forming the encapsulation layer 3, a first inorganic layer 31 is formed on the light-emitting layer 2.

[0092] In one embodiment, forming the first inorganic layer 31 includes chemical vapor deposition (CVD) until the thickness is between 0.1 μm and 6 μm, more preferably between 1 μm and 2 μm. In another embodiment, forming the first inorganic layer 31 includes atomic layer deposition (ALD) until the thickness is between 20 nm and 200 nm, more preferably between 50 nm and 80 nm.

[0093] In formation Figure 7B In the subsequent steps of the encapsulation layer 3 shown, a pattern of the black matrix layer 4 is formed on the first inorganic layer 31, the pattern including gaps 42, as shown. Figure 5 As shown. The steps for forming the pattern of the black matrix layer 4 may include direct deposition via selective ALD process, FMM mask deposition, or sputtering followed by etching.

[0094] In one embodiment, forming the pattern of the black matrix layer 4 includes forming multiple metal layers. In this embodiment, also as... Figure 4 As shown, the first inorganic layer 31 and the second inorganic layer 32 are both dielectric layers. The encapsulation layer 3 includes embedding the black matrix layer 4 into the encapsulation layer 3 and combining it with the first inorganic layer 31 and the second inorganic layer 32 in a dielectric-metal-dielectric (DMD) arrangement to improve the crack resistance and mechanical durability of the display device 1.

[0095] In another possible embodiment, optionally in conjunction with the above-described dielectric-metal-dielectric DMD arrangement, the pattern forming the black matrix layer 4 includes fabricating a wire mesh 41, which is arranged to convert the unpolarized beam 14 into a polarized beam 15 by transmitting only the vertical component of the unpolarized beam 14 and absorbing or reflecting the horizontal component of the unpolarized beam 14, such as... Figure 6 As shown. In one possible embodiment, the wire mesh 41 is formed with a mesh size of up to 500 nm and a width of up to 500 nm to obtain optimal polarization performance.

[0096] In formation Figure 7C In a subsequent step of the encapsulation layer 3 shown, a color filter layer 5 is formed by placing color filters 51 in the previously formed gaps 42 of the black matrix layer 4. The gaps 42 may be formed as part of a wire mesh 41. Forming the color filter layer 5 may include depositing material using any of the following methods: dyeing, pigment deposition, printing, or electrodeposition, up to a thickness of 3 μm to 4 μm.

[0097] In embodiments where the formation of the color filter layer 5 includes dyeing, the material used to form the color filter 51 may include at least one of gelatin, casein, and synthetic products such as polyvinyl alcohol (PVA) and polyvinylpyrrolidone.

[0098] In embodiments where the formation of the color filter layer 5 includes pigment deposition, the material used as the matrix may include any one of acrylic or epoxy acrylate photopolymer materials.

[0099] In embodiments where the formation of the color filter layer 5 includes printing, any method of screen printing, flexographic printing, offset printing, or gravure printing can be used.

[0100] In formation Figure 7D In a subsequent step of the encapsulation layer 3 shown, an organic layer 33 having a flat top surface is formed on top of the preceding layers (black matrix layer 4 and color filter layer 5). In one embodiment, the flat top surface is arranged as a planarization layer 7 and includes colorless acrylic monomers flattened on its top surface.

[0101] In one embodiment, forming the encapsulation layer 3 may further include the step of forming a polarizer layer 6 as described in detail above, the polarizer layer 6 being arranged to cover a pattern of a black matrix layer 4 and a color filter layer 5 embedded within the encapsulation layer 3.

[0102] Finally, a second inorganic layer 32 is formed on the flat top surface of the organic layer 33. In one embodiment, forming the second inorganic layer 32 includes chemical vapor deposition (CVD) until the thickness is between 0.1 μm and 6 μm, more preferably between 1 μm and 2 μm. In another embodiment, forming the second inorganic layer 32 includes atomic layer deposition (ALD) until the thickness is between 20 nm and 200 nm, more preferably between 50 nm and 80 nm.

[0103] like Figure 3 As shown, a method for manufacturing a display device 1 according to another exemplary embodiment of the present invention may further include providing a substrate 8 and forming a circuit 9 between the substrate 8 and the light-emitting layer 2, the circuit 9 including a plurality of thin-film transistors 10.

[0104] In another embodiment, such as Figure 3 As shown, the touch screen panel 11 can be disposed above the encapsulation layer 3.

[0105] In another embodiment, such as Figure 3 As shown, the cover window 12 can be arranged as the outer layer of the display device 1. The cover window 12 can be connected to the encapsulation layer 3 and / or the touch screen panel 11 disposed above the encapsulation layer 3 by pressure sensitive adhesive (PSA) 13.

[0106] This document has described various aspects and implementations in conjunction with various embodiments. However, those skilled in the art, upon studying the accompanying drawings, disclosure, and appended claims, will be able to understand and implement other variations of the disclosed embodiments in practicing the claimed subject matter. In the claims, the word "comprising" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit may perform the functions of several items listed in the claims. The listing of measures in mutually different dependent claims does not imply that a combination of these measures cannot be used to obtain an advantage. Computer programs may be stored or distributed on suitable media, such as optical storage media or solid-state media provided together with or as part of other hardware, and may also be distributed in other forms, such as via the Internet or other wired or wireless telecommunications systems.

[0107] The reference numerals used in the claims should not be interpreted as limiting the scope.

Claims

1. A display device (1), characterized in that, include: Emissive layer (2); An encapsulation layer (3) is disposed above the light-emitting layer (2); A black matrix layer (4) is disposed above the light-emitting layer (2); A color filter layer (5) is disposed above the light-emitting layer (2); In this process, at least one of the black matrix layer (4) and the color filter layer (5) is embedded in the encapsulation layer (3); The encapsulation layer (3) is a thin film encapsulation (TFE) layer, which includes: First inorganic layer (31); The second inorganic layer (32) is disposed above the first inorganic layer (31); An organic layer (33) is disposed between the first inorganic layer (31) and the second inorganic layer (32); wherein At least one of the black matrix layer (4) and the color filter layer (5) is embedded within the organic layer (33); The encapsulation layer (3) further includes: A planarization layer (7) covers at least one of the black matrix layer (4) and the color filter layer (5) and forms a flat top surface.

2. The display device (1) according to claim 1, characterized in that, The black matrix layer (4) includes at least one metal layer; Both the first inorganic layer (31) and the second inorganic layer (32) are dielectric layers; The black matrix layer (4) is embedded within the organic layer (33) to combine with the first inorganic layer (31) and the second inorganic layer (32) to form a dielectric-metal-dielectric (DMD) structure.

3. The display device (1) according to claim 1 or 2, characterized in that, The black matrix layer (4) includes a wire mesh (41) arranged to convert the unpolarized beam (14) into a polarized beam (15) by transmitting only the vertical component of the unpolarized beam (14) and absorbing or reflecting the horizontal component of the unpolarized beam (14).

4. The display device (1) according to any one of claims 1 to 3, characterized in that, Also includes: A polarizer layer (6) is embedded within the encapsulation layer (3) and is arranged to cover at least one of the black matrix layer (4) and the color filter layer (5).

5. The display device (1) according to claim 4, characterized in that, The polarizer layer (6) is an inorganic layer of a high reflectivity material.

6. The display device (1) according to claim 4 or 5, characterized in that, The polarizer layer (6) comprises a colorless polymer with a refractive index between 1.2 and 1.

6.

7. The display device (1) according to any one of claims 1 to 6, characterized in that, Also includes: Substrate (8); A circuit (9) is disposed between the substrate (8) and the light-emitting layer (2), the circuit (9) including a plurality of thin-film transistors (10).

8. The display device (1) according to any one of claims 1 to 7, characterized in that, The substrate (8) is a flexible substrate, and the display device (1) is a flexible display device (1).

9. The display device (1) according to any one of claims 1 to 8, characterized in that, Also includes: A touch screen panel (11) is disposed above the encapsulation layer (3).

10. The display device (1) according to any one of claims 1 to 9, characterized in that, Also includes: A cover window (12) is arranged as the outer layer of the display device (1), and the cover window (12) is connected to any of the encapsulation layers (3) or the touch screen panel (11) disposed above the encapsulation layer (3) by pressure sensitive adhesive (13).

11. A method for manufacturing a display device (1), characterized in that, The method includes: Forming a light-emitting layer (2); An encapsulation layer (3) is formed on the light-emitting layer (2); The formation of the encapsulation layer (3) includes forming a pattern of at least one of a black matrix layer (4) and a color filter layer (5) embedded within the encapsulation layer (3); The first inorganic layer is formed (31); A pattern of a black matrix layer (4) is formed on the first inorganic layer (31), the pattern including gaps (42). A color filter layer (5) is formed by providing a color filter (51) in the gap (42); An organic layer (33) with a flat top surface is formed on top of the above layer. A second inorganic layer (32) is formed on the flat top surface of the organic layer (33). A planarization layer (7) is formed, which is configured to cover at least one of the black matrix layer (4) and the color filter layer (5) and has a flat top surface.

12. The method according to claim 11, characterized in that, Forming either the first inorganic layer (31) or the second inorganic layer (32) includes chemical vapor deposition (CVD) up to a thickness between 0.1 μm and 6 μm, more preferably between 1 μm and 2 μm.

13. The method according to any one of claims 11 or 12, characterized in that, Forming either the first inorganic layer (31) or the second inorganic layer (32) includes atomic layer deposition (ALD) up to a thickness between 20 nm and 200 nm, more preferably between 50 nm and 80 nm.

14. The method according to any one of claims 11 to 13, characterized in that, The pattern forming the black matrix layer (4) includes forming multiple metal layers; Both the first inorganic layer (31) and the second inorganic layer (32) are dielectric layers; The formation of the encapsulation layer (3) includes embedding the black matrix layer (4) into the encapsulation layer (3) and combining it with the first inorganic layer (31) and the second inorganic layer (32) in a dielectric-metal-dielectric (DMD) arrangement.

15. The method according to any one of claims 11 to 14, characterized in that, The pattern forming the black matrix layer (4) includes manufacturing a wire mesh (41) which is arranged to convert the unpolarized light (14) into a polarized light beam (15) by transmitting only the vertical component of the unpolarized light beam (14) and absorbing or reflecting the horizontal component of the unpolarized light beam (14).

16. The method according to any one of claims 11 to 15, characterized in that, Forming the color filter layer (5) involves depositing material using any one of dyeing, pigment deposition, printing, or electrodeposition methods until the thickness is 3 μm to 4 μm.

17. The method according to any one of claims 11 to 16, characterized in that, Forming the encapsulation layer (3) includes: A polarizer layer (6) is formed, the polarizer layer (6) being arranged to cover the pattern of at least one of the black matrix layer (4) and the color filter layer (5) embedded in the encapsulation layer (3).

18. The method according to any one of claims 11 to 17, characterized in that, Also includes: Provide a substrate (8); A circuit (9) is formed between the substrate (8) and the light-emitting layer (2), the circuit (9) including a plurality of thin-film transistors (10).

19. The method according to any one of claims 11 to 18, characterized in that, Also includes: A touch screen panel (11) is disposed above the encapsulation layer (3).

20. The method according to any one of claims 11 to 19, characterized in that, Also includes: The cover window (12) is arranged as the outer layer of the display device (1), and the cover window (12) is attached to any of the encapsulation layers (3) or the touch screen panel (11) disposed above the encapsulation layer (3) by pressure sensitive adhesive (13).

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