Wafer cutting and two-fluid cleaning integrated device

Abstract

The invention relates to the field of component processing, and discloses a wafer cutting and two-fluid cleaning integrated device, which comprises chain type traction pieces positioned on opposite racks and used for providing reciprocating traction force in a closed loop state; the bearing reciprocating mechanism is located on the oppositely-arranged machine frame and matched with the inner side guide bars of the oppositely-arranged center guide frame and the chain type traction piece to provide a bearing platform for cutting and cleaning of the wafer. The linkage cutting mechanism is located on the oppositely-arranged machine frame and matched with a top shaft of the oppositely-arranged machine frame, the limiting sliding rail and a pushing shaft of the traction material bearing table to be used for following the bearing reciprocating mechanism for bearing the wafer to move and conduct cutting. Through a closed-loop guide rail and a chain type traction system, the bearing reciprocating mechanism automatically and circularly runs, and the whole process of cutting, cleaning and resetting can be completed without manual intervention. The multiple bearing mechanisms are distributed at equal intervals, the productivity can be improved by multiple times, dependence on operators is reduced through full-automatic operation, the production rhythm can be flexibly controlled, and different batch order requirements can be met.

Description

Technical Field

[0001] This invention relates to the field of component processing technology, specifically to an integrated device for wafer dicing and two-fluid cleaning. Background Technology

[0002] With the rapid development of semiconductor technology, the performance requirements for chips are becoming increasingly stringent. Gold-backed wafers have important applications in fields such as semiconductor packaging. During chip packaging, the manufacturing precision and quality control of gold-backed wafers become crucial for achieving better electrical connections and heat dissipation.

[0003] Furthermore, wafer dicing and cleaning are two independent processes, usually completed by two separate machines. After dicing, the wafer needs to be removed from the dicing machine manually or by a transfer machine and transported to the cleaning machine via a transfer fixture (such as a basket) for loading and alignment. Dicing is faster than cleaning or vice versa, forming a bottleneck in the process. Overall production capacity is limited by the slowest link. Each independent loading and unloading process exposes the wafer to the cleanroom environment, increasing the risk of airborne particle settling (AMC). At the same time, each gripping by the robotic arm or chuck and loading into the basket in the cleaning tank can cause chipping at the wafer edge or mechanical damage to the surface. A dicing machine and a cleaning machine (and possibly a dryer) and the required operating and maintenance space occupy a large area. In the extremely expensive semiconductor cleanroom, each square meter represents a huge construction and operating cost. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an integrated wafer dicing and two-fluid cleaning device, which solves the problems of low efficiency and increased contamination caused by the traditional separate wafer dicing and cleaning operations.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an integrated wafer dicing and two-fluid cleaning device, comprising:

[0006] Opposing racks are used for fixing and installing the structure of wafer dicing and two-fluid cleaning equipment;

[0007] The opposing center guide frame and the U-shaped guide frame are located on the opposing frame and are used to form a closed-loop guide rail structure on the opposing frame;

[0008] The chain traction component is located on the opposing frame and is used to provide reciprocating traction force in a closed loop.

[0009] The reciprocating mechanism is located on the opposing frame, and together with the inner guide bar of the opposing center guide frame and the chain traction component, it provides a carrying platform for wafer cutting and cleaning.

[0010] The linkage cutting mechanism is located on the opposing frame and works with the top shaft, limit slide rail and push shaft of the traction support table of the opposing frame to follow the displacement of the supporting reciprocating mechanism of the wafer and to perform cutting.

[0011] The two-fluid cleaning mechanism is located on the opposing frame, and works with the guide rail groove of the opposing central guide frame and the rear top plate of the traction support platform to follow the displacement of the support reciprocating mechanism that carries the wafer and perform two-fluid cleaning.

[0012] Preferably, the opposing frame is a wall-mounted structure with opposing distributions, and the limiting slide rail is fixed to the top center of the opposing frame. The top shaft structure of the opposing frame is distributed on the inner side of the end of the limiting slide rail. The chain traction component is mounted on the inner side of the opposing frame. The bearing reciprocating mechanism consists of multiple sets, which are equidistantly distributed on the chain traction component and placed inside the opposing frame. The linkage cutting mechanism is slidably mounted on the top of the opposing frame. The two-fluid cleaning mechanism is movably mounted on the opposing center guide frame and placed inside the opposing frame.

[0013] Preferably, the opposing center guide frame is fixed in the middle of the opposing frame, and the guide bar is set on the inner side of the top of the opposing center guide frame, forming an upper guide structure with a closed-loop guide rail structure, and there is an intermittent area between it and the side wall of the U-shaped guide frame. The guide rail grooves of the opposing center guide frame are distributed at the bottom of the opposing center guide frame, and a trapezoidal guide block is provided at the end of the bottom wall of the opposing center guide frame.

[0014] Preferably, the U-shaped guide frame partially surrounds the bottom wall and both sides of the opposing frame, with baffle structures on both sides and a guide rail at the bottom, forming a lower guide structure with a closed-loop guide rail structure.

[0015] Preferably, the bearing reciprocating mechanism includes a traction bearing platform, a linkage chain, and a bearing plate frame. The push shaft of the traction bearing platform is fixed relative to the side wall in the forward direction, and the rear top plate is distributed relative to the side of the traction bearing platform away from the push shaft structure. Vertically extending side plates are fixed on both sides of the traction bearing platform, and an embedded groove is provided on the top. Opposing guide wheel frames are fixed relative to the bottom of the traction bearing platform, and the bottom end of the opposing guide wheel frames is a cross-extending guide wheel structure. The opposing guide wheel frames are used to support displacement on the closed-loop guide track structure. The linkage chain is a link-type structure, distributed on both sides of the traction bearing platform, and hinged to the link of the chain traction component. At the same time, the fixed plate structure inside the linkage chain is rotated and sleeved with the opposing guide wheel frame.

[0016] Preferably, the linkage cutting mechanism includes a positioning slide table, which slides on the limiting slide rail of the opposing frame via slide rails on both sides. A reset spring is embedded between the positioning slide table and the inner wall of the opposing frame, and the positioning slide table is located above the displacement trajectory of the reciprocating mechanism. A front guide rail frame is fixed to the front side of the positioning slide table in the displacement direction, and a trapezoidal traction member is embedded and slidable inside the front guide rail frame. The trapezoidal traction member is placed on the displacement trajectory of the traction bearing platform push shaft, and the inclined surface of the trapezoidal traction member is located at the top shaft height of the opposing frame. A horizontal rail frame is fixed to the top of the positioning slide table.

[0017] Preferably, the two-fluid cleaning mechanism includes a support frame. The support frame slides along the bottom wall of the opposing central guide frame on both sides via pulley structures. A stop bar structure is fixed to the front side of the support frame in the displacement direction and is placed on the displacement trajectory of the rear top plate of the traction receiving platform. A side suspension platform is fixed to the side wall of the support frame. Side top plates are fixed to both sides of the support frame and are embedded in the guide rail groove of the opposing central guide frame. A reset spring is connected between the side plate and the inner wall of the guide rail groove. A push extension plate is fixed to the side wall of the support frame away from the side suspension platform and is placed on the displacement trajectory of the rear top plate of the traction receiving platform.

[0018] Preferably, the support plate directly supports the wafer to be processed and can be embedded into the embedding slot.

[0019] Preferably, a single-axis cutting platform is mounted on the top of the horizontal rail frame and slides thereon, and the output part of the single-axis cutting platform is provided with a cutting end.

[0020] Preferably, the bearing platform is internally fixed with equidistantly distributed air guide pipes and liquid guide pipes, and the air guide pipes and liquid guide pipes are arranged alternately. At the same time, each of them is provided with a spray head at the top. The side-mounted suspension platform is internally fixed with equidistantly distributed wiping guide rollers.

[0021] This invention provides an integrated device for wafer dicing and two-fluid cleaning. It has the following advantages:

[0022] 1. This invention features a high degree of automation and continuous production: The equipment uses a closed-loop guide rail and chain traction system to enable the reciprocating bearing mechanism to operate automatically in a cyclical manner, completing the entire process of cutting, cleaning, and resetting without manual intervention. Multiple sets of bearing mechanisms are equidistantly distributed to form a continuous production line. When one set enters the cleaning stage, the next set has already begun cutting, achieving parallel operation. This eliminates the wafer handling and alignment waiting time between traditional single-station equipment, resulting in a compact production cycle and increased capacity several times over. Fully automated operation reduces reliance on operators, and the production rhythm can be flexibly controlled by adjusting the chain traction speed and the spacing between mechanisms to adapt to different batch order requirements.

[0023] 2. This invention features integrated spatial layout and process integration: It integrates the two key processes of cutting and cleaning into the same equipment, and realizes the spatial transformation of the mechanism in the horizontal and vertical directions through the U-shaped guide frame track, so that the wafer can complete all processing within the closed track without intermediate transfer tools or external handling. It is suitable for semiconductor production lines with high cleanroom costs. The wafer is processed in a closed system, reducing the chance of exposure to environmental particles, which helps to maintain the cleanliness of the wafer surface. It eliminates the need for complex wafer transfer machines or buffer stations, reducing system complexity and the number of failure points.

[0024] 3. This invention features precise motion control and posture stability: When the carrying mechanism switches between the upper and lower tracks, it maintains the wafer horizontally upward through the vertical guidance of the opposing guide wheel frame and the U-shaped guide frame, avoiding wafer displacement or tilting. Mechanical triggering mechanisms such as the push shaft, top shaft, and trapezoidal guide block ensure that the cutting and cleaning mechanisms contact / disengage in the correct positions, resulting in high repeatability. The cleaning mechanism moves synchronously with the carrying mechanism, and the relative position of the nozzle and the wafer is fixed, resulting in high cleaning uniformity and stable wafer horizontal posture. This reduces the risk of cutting edge chipping and deviation, which is especially important for ultra-thin wafers. The constant position of the two-fluid jet, combined with the physical contact of the wiping guide roller, can effectively remove cutting residue and reduce particulate contamination.

[0025] 4. This invention features a modular triggering and automatic reset mechanism: the top shaft presses against the trapezoidal inclined surface, causing the cutting mechanism to lift and disengage; the reset spring ensures its rapid return to position; the trapezoidal guide block lifts the front wheel of the cleaning mechanism, separating it from the bearing mechanism; and the reset spring pulls it back to the origin. No complex electrical control signals are required; state switching is achieved through the interaction of the track geometry and the mechanical components. The mechanical structure is more resistant to dust and vibration environments than sensors / electrical controls, resulting in a lower failure rate. The modular design allows the cutting head and cleaning components to be independently disassembled and maintained without affecting other modules.

[0026] 5. This invention has flexible production and expansion potential: the standard track formed by the U-shaped guide frame and the opposing center guide frame can be adapted to different sizes of carrier mechanisms, and the cutting mechanism (such as blade, laser) and cleaning mechanism can be adjusted according to process requirements. By increasing the number of carrier mechanisms, the number of wafers processed at the same time can be easily expanded. Attached Figure Description

[0027] Figure 1 This is a three-dimensional schematic diagram of the main structure of the present invention. Figure 1 ;

[0028] Figure 2 This is a three-dimensional schematic diagram of the main structure of the present invention. Figure 2 ;

[0029] Figure 3 This is a three-dimensional schematic diagram of the main structure of the present invention. Figure 3 ;

[0030] Figure 4 This is a schematic diagram of the installation state of the bearing reciprocating mechanism structure of the present invention. Figure 1 ;

[0031] Figure 5 This is a schematic diagram of the installation state of the chain traction component structure of the present invention;

[0032] Figure 6 This is a schematic diagram of the installation state of the bearing reciprocating mechanism structure of the present invention. Figure 2 ;

[0033] Figure 7 This is a schematic diagram of the bearing reciprocating mechanism of the present invention;

[0034] Figure 8 This is a schematic diagram of the installation state of the linkage cutting mechanism structure of the present invention;

[0035] Figure 9 This is a schematic diagram of the linkage cutting mechanism of the present invention;

[0036] Figure 10 This is a schematic diagram of the installation state of the two-fluid cleaning mechanism of the present invention;

[0037] Figure 11 This is a schematic diagram of the two-fluid cleaning mechanism of the present invention.

[0038] Figure 12 This is a schematic diagram of the two-fluid cleaning mechanism of the present invention. Figure 1 ;

[0039] Figure 13 This is a schematic diagram of the two-fluid cleaning mechanism of the present invention. Figure 2 .

[0040] The components include: 1. Opposing frame; 2. Opposing center guide frame; 3. U-shaped guide frame; 4. Chain traction component; 5. Bearing reciprocating mechanism; 6. Linked cutting mechanism; 7. Two-fluid cleaning mechanism; 51. Traction support platform; 52. Embedded slot; 53. Opposing guide wheel frame; 54. Linked chain component; 55. Bearing plate frame; 61. Positioning slide; 62. Front guide rail frame; 63. Trapezoidal traction component; 64. Horizontal rail frame; 65. Single-axis cutting platform; 66. Cutting end; 67. Reset circlip one; 71. Bearing platform; 72. Side suspension platform; 73. Side top plate; 74. Reset circlip two; 75. Push extension plate; 76. Air guide pipe; 77. Liquid guide pipe; 78. Wiping guide roller. Detailed Implementation

[0041] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Please see the appendix Figure 1 - Appendix Figure 3This invention provides an integrated wafer dicing and two-fluid cleaning device, comprising: a counter-frame 1 for fixing and installing the wafer dicing and two-fluid cleaning device structure; a counter-center guide frame 2 and a U-shaped guide frame 3 located on the counter-frame 1, forming a closed-loop guide track structure on the counter-frame 1; the counter-center guide frame 2 is relatively fixed in the middle of the counter-frame 1, and guide bars are arranged on the inner top of the counter-center guide frame 2, forming the upper guide structure of the closed-loop guide track structure, and there is an intermittent area between it and the side wall of the U-shaped guide frame 3; guide rail grooves of the counter-center guide frame 2 are distributed at the bottom of the counter-center guide frame 2; a trapezoidal guide block is provided at the end of the bottom wall of the counter-center guide frame 2; and the U-shaped guide frame 3 partially surrounds the bottom wall and both sides of the counter-frame 1. The device features baffle structures on both sides and a guide rail at the bottom, forming a lower guide structure with a closed-loop guide rail configuration. A chain traction component 4 is located on the opposing frame 1, providing reciprocating traction in a closed-loop state. The opposing frame 1 is a wall-mounted structure with opposing distributions, and the limiting slide rails are relatively fixed at the top center of the opposing frame 1. The top shaft structure of the opposing frame 1 is relatively distributed on the inner side of the end of the limiting slide rails. The chain traction component 4 is mounted on the inner side of the opposing frame 1. Multiple sets of reciprocating mechanisms 5 are equidistantly distributed on the chain traction component 4 and placed within the opposing frame 1. The linkage cutting mechanism 6 is slidably mounted on the top of the opposing frame 1, and the two-fluid cleaning mechanism 7 is movably mounted on the opposing central guide frame 2 and placed within the opposing frame 1. This equipment is primarily designed for wafer fabrication. The entire equipment, including the cutting and subsequent two-fluid cleaning operations, is assembled and fixed using a counter-frame 1. The counter-frame 1 itself has a two-sided wall panel structure, and the centrally mounted counter-center guide frame 2, together with the U-shaped guide frame 3 at the bottom of the counter-frame 1, forms a closed-loop guide rail structure. Multiple sets of equidistant reciprocating bearing mechanisms 5 are pulled back and forth on the closed-loop guide rail structure by chain traction components 4. The counter-center guide frame 2 includes upper and lower rail structures, with its upper inner rail forming the upper rail of the closed-loop guide rail structure. There are passage areas between it and the sides of the U-shaped guide frame 3. Each set of reciprocating bearing mechanisms 5 can be pulled by the chain traction component 4 and moved horizontally along the inner rail of the counter-center guide frame 2, while aligning with the linkage cutting mechanism 6. Then, the push shaft of the reciprocating mechanism 5 is used to push the linkage cutting mechanism 6 to move. While moving, the linkage cutting mechanism 6 cuts the wafer carried on the reciprocating mechanism 5 until it comes into contact with one side of the U-shaped guide frame 3. The linkage cutting mechanism 6 will then disengage from the reciprocating mechanism 5 due to the top shaft structure installed on the top of the opposing frame 1 and automatically return to its original starting point. At the same time, the reciprocating mechanism 5 is also at the end of the chain traction component 4 and is continuously pulled in the opposite direction by the chain traction component 4. It passes through the area between the inner rail of the opposing center guide frame 2 and the side of the U-shaped guide frame 3 and descends horizontally until it lands on the bottom guide rail of the U-shaped guide frame 3 and moves in the opposite direction along the guide rail.Once aligned vertically with the two-fluid cleaning mechanism 7, the two-fluid cleaning mechanism 7 is pushed to follow the displacement. Simultaneously, the two-fluid cleaning mechanism 7 performs two-fluid cleaning on the already cut wafers. When the two-fluid cleaning mechanism 7 reaches the end of the opposing center guide frame 2, the trapezoidal guide block at the end of the opposing center guide frame 2 causes the contact end between the two-fluid cleaning mechanism 7 and the bearing reciprocating mechanism 5 to rise. After disengaging from the bearing reciprocating mechanism 5, it automatically returns to its original position. The subsequent bearing reciprocating mechanism 5 also operates according to the trajectory of the bearing reciprocating mechanism 5, automatically displacing sequentially while performing the integrated cutting and two-fluid cleaning operation.

[0043] Please see the appendix Figure 1 - Appendix Figure 7 The reciprocating bearing mechanism 5 is located on the opposing frame 1. It works in conjunction with the inner guide bars of the opposing center guide frame 2 and the chain traction component 4 to provide a bearing platform for wafer cutting and cleaning. The reciprocating bearing mechanism 5 includes a traction bearing platform 51, a linkage chain 54, and a bearing plate frame 55. The push shaft of the traction bearing platform 51 is relatively fixed to the side wall in the forward direction, and the rear top plate is relatively distributed on the side of the traction bearing platform 51 away from the push shaft structure. Vertically extending side plates are fixed on both sides of the traction bearing platform 51, and an embedded slot 52 is provided on the top. Opposing guide wheel frames 53 are relatively fixed at the bottom of the traction bearing platform 51, and the bottom end of the opposing guide wheel frames 53 is a cross-extending guide wheel structure. The opposing guide wheel frames 53 support displacement on the closed-loop guide rail structure. The linkage chain 54 is a link-type structure, distributed on both sides of the traction bearing platform 51, and hinged to the links of the chain traction component 4. Simultaneously, the fixed plate structure inside the linkage chain 54 rotates and engages with the opposing guide wheel frames 53. The support plate frame 55 directly supports the wafer to be processed and can be embedded into the embedding slot 52. The wafer is placed on the support plate frame 55 and fixed in the embedding slot 52 at the top of the traction support platform 51. When the horizontal displacement is started, the chain traction component 4 pulls the traction support platform 51 through the hinged linkage chain 54. The cross guide wheel at the bottom of the opposing guide wheel frame 53 slides horizontally along the inner guide bar at the top of the opposing center guide frame 2, so that the bearing reciprocating mechanism 5 is kept in a horizontal state and moves forward. The bearing reciprocating mechanism 5 is at the end of the chain traction and is pulled in the opposite direction into the gap between the opposing center guide frame 2 and the side wall of the U-shaped guide frame 3. The side wall of the traction support platform 51 slides vertically down along the side wall baffle of the U-shaped guide frame 3 until the opposing guide wheel frame 53 installed at its bottom falls into the bottom guide rail of the U-shaped guide frame 3. Due to the vertical guidance of the U-shaped guide frame 3, the bearing reciprocating mechanism 5 can always maintain horizontality when it enters the bottom guide rail of the U-shaped guide frame 3, and the wafer to be processed can always face upward.

[0044] Please see the appendix Figure 1 - Appendix Figure 9The linkage cutting mechanism 6 is located on the opposing frame 1. It works in conjunction with the top shaft, limiting slide rail, and push shaft of the traction support platform 51 of the opposing frame 1 to follow the displacement of the wafer-carrying reciprocating mechanism 5 and perform cutting. The linkage cutting mechanism 6 includes a positioning slide 61, which slides on the limiting slide rail of the opposing frame 1 via slide rails on both sides. A reset spring 67 is embedded between the positioning slide 61 and the inner wall of the opposing frame 1, and it is located above the displacement trajectory of the reciprocating mechanism 5. A front guide rail frame 62 is fixed relative to the front side of the positioning slide 61 in the displacement direction. A trapezoidal traction member 63 is embedded and slides inside the front guide rail frame 62. The trapezoidal traction member 63 is placed on the displacement trajectory of the push shaft of the traction support platform 51, and the inclined surface of the trapezoidal traction member 63 is located at the height of the top shaft of the opposing frame 1. A horizontal rail frame 64 is fixed at the top, and a single-axis cutting platform 65 is mounted on the top of the horizontal rail frame 64. The output part of the single-axis cutting platform 65 is equipped with a cutting end 66. When the push shaft of the traction support table 51 contacts the trapezoidal traction member 63, it pushes it to move backward. The trapezoidal traction member 63 drives the positioning slide table 61 to slide synchronously along the limiting slide rail of the opposing frame 1, while overcoming the tension of the reset snap ring 67. The single-axis cutting platform 65 moves laterally on the horizontal rail frame 64, and at the same time, the cutting end 66 cuts the wafer. When the carrying reciprocating mechanism 5 reaches the side wall of the U-shaped guide frame 3, the top shaft of the opposing frame 1 presses against the inclined surface of the trapezoidal traction member 63, forcing the cutting mechanism to rise. The cutting mechanism disengages from the push shaft of the carrying reciprocating mechanism 5, and the reset snap ring 67 pulls the cutting mechanism back to the initial position.

[0045] Please see the appendix Figure 1 - Appendix Figure 13The two-fluid cleaning mechanism 7 is located on the opposing frame 1. It works in conjunction with the guide rail groove of the opposing central guide frame 2 and the rear top plate of the traction support platform 51 to follow the displacement of the supporting reciprocating mechanism 5 that carries the wafer and to perform two-fluid cleaning. The two-fluid cleaning mechanism 7 includes a support platform 71. The support platform 71 slides along the bottom wall of the opposing central guide frame 2 through pulley structures on both sides. The front side of the support platform 71 is fixed with abutment strip structure in the displacement direction and is placed on the displacement trajectory of the rear top plate of the traction support platform 51. A side suspension platform 72 is fixed to the side wall of the support platform 71, and side top plates 73 are fixed to both sides of the support platform 71. Furthermore, the side-mounted top plate 73 is embedded into the guide rail groove of the opposing center guide frame 2, and a reset snap ring 74 is connected between it and the inner wall of the guide rail groove. A push extension plate 75 is fixed to the side wall of the bearing platform 71 away from the side-mounted suspension platform 72, and is placed on the displacement trajectory of the rear top plate of the traction bearing platform 51. Equally spaced air guide pipes 76 and liquid guide pipes 77 are fixed inside the bearing platform 71, and the air guide pipes 76 and liquid guide pipes 77 are staggered. Both are equipped with spray nozzles at the top. Equally spaced wiping guide rollers 78 are fixed inside the side-mounted suspension platform 72. The bearing reciprocating mechanism 5 moves in the opposite direction along the bottom track of the U-shaped guide frame to the cleaning station, pulling... The rear top plate of the receiving platform 51 pushes the push extension plate 75 of the two-fluid cleaning mechanism 7, causing the cleaning mechanism to move synchronously. Meanwhile, the air guide pipe 76 installed on the bearing platform 71 sprays high-speed gas, and the liquid guide pipe 77 sprays cleaning fluid. The two mix on the wafer surface to form a two-fluid mixture, removing cutting residue. The wiping guide roller 78 rotates and contacts the wafer surface to assist in removing particulate impurities. During the cleaning process, the side top plate 73 slides along the guide rail groove of the opposing center guide frame 2 to ensure trajectory stability. When the bearing reciprocating mechanism 5 drives the two-fluid cleaning mechanism 7 to move to the end of the opposing center guide frame 2, the trapezoidal guide block on the bottom wall of the center guide frame 2... The front guide wheel structure of the support platform 71 is lifted, thereby driving the front end of the support platform 71 to lift up and disengage from the rear top plate of the support reciprocating mechanism 5. The reset snap ring 74 retracts, pulling the two-fluid cleaning mechanism 7 back to its initial position. After disengaging from the cleaning mechanism, the support reciprocating mechanism 5 continues to move along the bottom track of the U-shaped guide frame 3 to the starting point. Through the traction of the chain traction component, the opposing guide wheel frame 53 slides vertically upward along the side wall of the U-shaped guide frame and re-enters the top horizontal track of the opposing center guide frame 2, ready for the next cut. Multiple sets of support reciprocating mechanisms 5 cycle in sequence to realize a fully automated production line operation of cutting → cleaning → return.

[0046] Working Principle: This equipment is mainly designed for wafer dicing and subsequent two-fluid cleaning operations. The entire equipment is assembled and fixed using a counter-mounted frame 1, which itself has a two-sided wall panel structure. A centrally mounted counter-mounted guide frame 2, together with a U-shaped guide frame 3 at the bottom of the counter-mounted frame 1, forms a closed-loop guide rail structure. Multiple equidistantly spaced reciprocating mechanisms 5 are pulled back and forth on the closed-loop guide rail structure by chain traction components 4. The counter-mounted center guide frame 2 includes upper and lower rail structures. Its upper inner rails form the upper rail of the closed-loop guide rail structure, and there are passage areas between it and the sides of the U-shaped guide frame 3. Each reciprocating mechanism 5 can be pulled by the chain traction component 4 and moved horizontally along the inner rail of the counter-mounted center guide frame 2, while simultaneously... After the linkage cutting mechanism 6 is aligned, it is pushed to move by the push shaft of the carrying reciprocating mechanism 5. While moving, the linkage cutting mechanism 6 cuts the wafer carried on the carrying reciprocating mechanism 5 until it comes into contact with one side of the U-shaped guide frame 3. The linkage cutting mechanism 6 will then disengage from the carrying reciprocating mechanism 5 due to the top shaft structure added to the top of the opposing frame 1 and automatically return to its original starting point. At the same time, the carrying reciprocating mechanism 5 is also at the end of the traction of the chain traction member 4 and is continuously pulled in the opposite direction by the chain traction member 4. It passes through the area between the inner rail of the opposing center guide frame 2 and the side of the U-shaped guide frame 3 and descends horizontally until it lands on the bottom guide rail of the U-shaped guide frame 3 and moves in the opposite direction along the guide rail. The wafer is displaced until it aligns vertically with the two-fluid cleaning mechanism 7, at which point the two-fluid cleaning mechanism 7 follows the displacement. Simultaneously, the two-fluid cleaning mechanism 7 performs two-fluid cleaning on the already cut wafer. When the two-fluid cleaning mechanism 7 reaches the end of the opposing center guide frame 2, the trapezoidal guide block at the end of the opposing center guide frame 2 causes the contact end between the two-fluid cleaning mechanism 7 and the bearing reciprocating mechanism 5 to rise. After disengaging from the bearing reciprocating mechanism 5, it automatically returns to its original position. The subsequent bearing reciprocating mechanism 5 also operates along the trajectory of the bearing reciprocating mechanism 5, automatically displacing sequentially while performing integrated cutting and two-fluid cleaning operations. The wafer is placed on the support plate frame 55 and fixed in the embedding slot 52 at the top of the traction support platform 51. The horizontal displacement is initiated, and the chain traction component 4 pulls the traction support platform 51 through the hinged linkage chain 54. The cross guide wheels at the bottom of the opposing guide wheel frame 53 slide horizontally along the inner guide bar at the top of the opposing center guide frame 2, keeping the bearing reciprocating mechanism 5 in a horizontal state and moving forward. When the push shaft of the traction support platform 51 contacts the trapezoidal traction component 63, it pushes it to move backward. The trapezoidal traction component 63 drives the positioning slide table 61 to slide synchronously along the limit slide rail of the opposing frame 1, while overcoming the tension of the reset snap ring 67. The single-axis cutting platform 65 moves laterally on the transverse rail frame 64, and at the same time, the cutting end 66 cuts the wafer. When the bearing reciprocating mechanism 5 reaches the side wall of the U-shaped guide frame 3, the top shaft at the top of the opposing frame 1 presses against the inclined surface of the trapezoidal traction component 63, forcing the cutting mechanism to lift up.The cutting mechanism disengages from the push shaft of the reciprocating mechanism 5, and the reset snap ring 67 pulls the cutting mechanism back to its initial position. Meanwhile, the reciprocating mechanism 5, at the end of the chain traction, is pulled in the opposite direction into the gap between the opposing center guide frame 2 and the side wall of the U-shaped guide frame 3. The side wall of the traction support platform 51 slides vertically down along the side wall baffle of the U-shaped guide frame 3 until the opposing guide wheel frame 53 installed at its bottom falls onto the bottom guide rail of the U-shaped guide frame 3. Due to the vertical guidance of the U-shaped guide frame 3, the reciprocating mechanism 5 can maintain horizontality when entering the bottom guide rail of the U-shaped guide frame 3, and the wafer to be processed can always face upwards. The reciprocating mechanism 5 moves in the opposite direction along the bottom rail of the U-shaped guide frame to the cleaning station. The rear top plate of the traction support platform 51 pushes the push extension plate 75 of the two-fluid cleaning mechanism 7, causing the cleaning mechanism to move synchronously. The gas pipe 76 installed on the support platform 71 sprays high-speed gas, and the liquid pipe 77 sprays cleaning liquid. The two mix on the wafer surface to form a two-fluid system. The machine removes cutting residue and wipes the wafer surface by rotating the guide roller 78 to assist in removing particulate impurities. During the cleaning process, the side top plate 73 slides along the guide rail groove of the opposing center guide frame 2 to ensure a stable trajectory. When the bearing reciprocating mechanism 5 drives the two-fluid cleaning mechanism 7 to the end of the opposing center guide frame 2, the trapezoidal guide block on the bottom wall of the center guide frame 2 lifts the front guide wheel structure of the bearing platform 71, thereby driving the front end of the bearing platform 71 to lift up and disengage from the rear top plate of the bearing reciprocating mechanism 5. The reset snap ring 74 retracts, pulling the two-fluid cleaning mechanism 7 back to its initial position. After disengaging from the cleaning mechanism, the bearing reciprocating mechanism 5 continues to move along the bottom track of the U-shaped guide frame 3 to the starting point. Through the traction of the chain traction component, the opposing guide wheel frame 53 slides vertically upward along the side wall of the U-shaped guide frame and re-enters the top horizontal track of the opposing center guide frame 2, ready for the next cut. Multiple sets of bearing reciprocating mechanisms 5 cycle in sequence to achieve a fully automated production line operation of cutting → cleaning → return.

[0047] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated device for wafer dicing and two-fluid cleaning, characterized in that, include: Opposing frame (1) is used for fixing and installing the structure of the wafer dicing and two-fluid cleaning device; The opposing center guide frame (2) and the U-shaped guide frame (3) are located on the opposing frame (1) to form a closed-loop guide rail structure on the opposing frame (1); The chain traction component (4) is located on the opposing frame (1) and is used to provide reciprocating traction force in a closed loop state; The reciprocating bearing mechanism (5) is located on the opposing frame (1), and together with the inner guide bar of the opposing center guide frame (2) and the chain traction component (4), it is used to provide a bearing platform for wafer cutting and cleaning. The linkage cutting mechanism (6) is located on the opposing frame (1), and works with the top shaft, the limiting slide rail and the push shaft of the traction bearing platform (51) of the opposing frame (1) to follow the displacement of the bearing reciprocating mechanism (5) that carries the wafer and to cut it. The two-fluid cleaning mechanism (7) is located on the opposing frame (1), and is used in conjunction with the guide rail groove of the opposing center guide frame (2) and the rear top plate of the traction support platform (51) to follow the displacement of the support reciprocating mechanism (5) that carries the wafer and to perform two-fluid cleaning.

2. The integrated wafer dicing and two-fluid cleaning apparatus according to claim 1, characterized in that, The opposing frame (1) is a wall-mounted structure with opposing distributions, and the limiting slide rail is fixed at the top center of the opposing frame (1). The top shaft structure of the opposing frame (1) is distributed on the inner side of the end of the limiting slide rail. The chain traction component (4) is mounted on the inner side of the opposing frame (1). The bearing reciprocating mechanism (5) consists of multiple sets, which are equally distributed on the chain traction component (4) and placed inside the opposing frame (1). The linkage cutting mechanism (6) is slidably arranged on the top of the opposing frame (1). The two-fluid cleaning mechanism (7) is movably arranged on the opposing center guide frame (2) and placed inside the opposing frame (1).

3. The integrated wafer dicing and two-fluid cleaning apparatus according to claim 1, characterized in that, The opposing center guide frame (2) is fixed in the middle of the opposing frame (1), and the guide bar is set on the inner side of the top of the opposing center guide frame (2) to form an upper guide structure of a closed-loop guide rail structure. There is an intermittent area between it and the side wall of the U-shaped guide frame (3). The guide rail groove of the opposing center guide frame (2) is distributed at the bottom of the opposing center guide frame (2), and a trapezoidal guide block is provided at the end of the bottom wall of the (2).

4. The integrated wafer dicing and two-fluid cleaning apparatus according to claim 1, characterized in that, The U-shaped guide frame (3) partially surrounds the bottom wall and both sides of the opposing frame (1), with baffle structures on both sides and a guide rail at the bottom, forming a lower guide structure with a closed-loop guide rail structure.

5. The integrated wafer dicing and two-fluid cleaning apparatus according to claim 1, characterized in that, The reciprocating bearing mechanism (5) includes a traction bearing platform (51), a linkage chain (54), and a bearing plate frame (55). The push shaft of the traction bearing platform (51) is fixed to the side wall in the forward direction, and the rear top plate is distributed on the side of the traction bearing platform (51) away from the push shaft structure. The traction bearing platform (51) has vertically extending side plates fixed on both sides, and an embedded slot (52) is provided on the top. The bottom of the traction bearing platform (51) has opposing guide wheel frames (53) fixed, and the bottom end of the opposing guide wheel frames (53) is a cross-extending guide wheel structure. The displacement is supported on the closed-loop guide track structure by the opposing guide wheel frames (53). The linkage chain (54) is a link structure, distributed on both sides of the traction bearing platform (51), and hinged to the link of the chain traction component (4). At the same time, the fixed plate structure inside the linkage chain (54) rotates and sleeves with the opposing guide wheel frame (53).

6. The integrated wafer dicing and two-fluid cleaning apparatus according to claim 1, characterized in that, The linkage cutting mechanism (6) includes a positioning slide (61), which slides on the limiting slide rail of the opposing frame (1) through slide rails on both sides, and a reset snap ring (67) is embedded between it and the inner wall of the opposing frame (1), and is located above the displacement trajectory of the bearing reciprocating mechanism (5). The front side of the positioning slide (61) in the displacement direction is fixed with a front guide rail frame (62), and a trapezoidal traction member (63) is embedded and slidable inside the front guide rail frame (62). The trapezoidal traction member (63) is placed on the displacement trajectory of the push shaft of the traction bearing platform (51), and the inclined surface of the trapezoidal traction member (63) is located at the top shaft height of the opposing frame (1). A horizontal rail frame (64) is fixed on the top of the positioning slide (61).

7. The integrated wafer dicing and two-fluid cleaning apparatus according to claim 1, characterized in that, The two-fluid cleaning mechanism (7) includes a support frame (71). The support frame (71) slides along the bottom wall of the opposing center guide frame (2) through a pulley structure on both sides. The front side of the support frame (71) is fixed with a backing strip structure and is placed on the displacement trajectory of the rear top plate of the traction support platform (51). The side wall of the support frame (71) is fixed with a side suspension platform (72). The two sides of the support frame (71) are fixed with side top plates (73). The side top plates (73) are embedded in the guide rail groove of the opposing center guide frame (2) and are connected to the inner wall of the guide rail groove with a reset snap ring (74). The side wall of the support frame (71) away from the side suspension platform (72) is fixed with a push extension plate (75) and is placed on the displacement trajectory of the rear top plate of the traction support platform (51).

8. The integrated wafer dicing and two-fluid cleaning apparatus according to claim 5, characterized in that, The support plate (55) directly supports the wafer to be processed and can be embedded into the embedding slot (52).

9. The integrated wafer dicing and two-fluid cleaning apparatus according to claim 6, characterized in that, A single-axis cutting platform (65) is mounted on the top of the horizontal rail frame (64), and the output part of the single-axis cutting platform (65) is provided with a cutting end (66).

10. The integrated wafer dicing and two-fluid cleaning apparatus according to claim 7, characterized in that, The bearing platform (71) is fixed with equidistant air pipes (76) and liquid pipes (77), and the air pipes (76) and liquid pipes (77) are arranged alternately. At the same time, the top of each is provided with a spray head. The side-mounted suspension platform (72) is fixed with equidistant wiping guide rollers (78).

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