Heating element, preparation method, atomizer and electronic atomization device

Abstract

The invention discloses a heating element, a preparation method, an atomizer and an electronic atomization device. Belongs to the technical field of electronic atomization. The heating element comprises a heating substrate, a lead and a transition layer which are integrally formed; wherein the transition layer is formed between the heating substrate and the lead, and the standard electrode potential of the transition layer is located between the standard electrode potential of the heating substrate and the standard electrode potential of the lead. Wherein the transition layer can be used for dividing the original larger potential difference between the heating substrate and the lead into two smaller potential differences, so that the electromotive force for driving galvanic corrosion of the heating substrate and the lead is reduced, the corrosion condition between the heating substrate and the lead can be delayed, and the service life of the heating element is prolonged; equivalently, the service life of the electronic atomization device is prolonged.

Description

Technical Field

[0001] This application relates to the field of electronic atomization technology, specifically to a heating element, a preparation method, an atomizer, and an electronic atomization device. Background Technology

[0002] In electronic atomization devices, the atomizer is the core component for heating and atomizing liquids. Its structure typically includes a heating substrate and two leads (or "pins") for conducting electricity. The heating substrate is usually made of an alloy with high resistivity, while the leads are usually made of pure metal to achieve good conductivity and solderability.

[0003] Because the heating element and the leads are two metals with different standard electrode potentials, when they are joined together by welding (such as spot welding) and simultaneously immersed in a conductive electrolyte (i.e., an atomizing liquid that produces acidic substances after high-temperature degradation), the metal with the lower potential (the anode, usually the leads) corrodes more rapidly. This causes the weld joint between the heating element and the leads to breakage quickly, leading to atomizer failure. Therefore, current electronic atomizing devices have a relatively short lifespan. Summary of the Invention

[0004] This application provides a heating element, a preparation method, an atomizer, and an electronic atomizing device to solve the problem of the short service life of current electronic atomizing devices.

[0005] In some embodiments, a heating element is provided, including an integrally formed heating substrate, leads, and a transition layer; wherein the transition layer is formed between the heating substrate and the leads, and the standard electrode potential of the transition layer is located between the standard electrode potential of the heating substrate and the standard electrode potential of the leads.

[0006] In some embodiments, the material of the heating substrate includes a nickel-chromium alloy, the material of the lead wire includes nickel, and the material of the transition layer includes one or more of titanium and nickel-chromium-iron alloy; And / or, the material of the heating substrate includes an iron-chromium-aluminum alloy, the material of the lead wire includes nickel or a nickel-chromium alloy or stainless steel, and the material of the transition layer includes nickel or a nickel-chromium alloy or a nickel-iron alloy; And / or, the material of the heating substrate includes stainless steel, the material of the leads includes stainless steel and copper, and the material of the transition layer includes nickel.

[0007] In some embodiments, the heating element further includes an inert material encapsulation layer that at least covers the outer surface of the transition layer.

[0008] In some embodiments, the material of the inert material encapsulation layer includes one or more of zirconia-based ceramic slurry, alumina-based ceramic slurry, fluoropolymer coating, silicone, or insulating glass glaze.

[0009] In some embodiments, a method for preparing a heating element is provided, for preparing the heating element described in the above embodiments, the method comprising: Obtain the heating substrate and leads; A transition layer is covered on the end face of at least one of the first end of the heating substrate and the first end of the lead, wherein the standard electrode potential of the transition layer is located between the standard electrode potential of the heating substrate and the standard electrode potential of the lead; The heating element is obtained by welding the first end of the heating substrate and the first end of the lead wire.

[0010] In some embodiments, the end face covering at least one of the first end of the heating substrate and the first end of the lead includes: The transition layer is applied to the end face of at least one of the first end of the heating substrate and the first end of the lead using a physical vapor deposition or electroplating process.

[0011] In some embodiments, after welding the first end of the heating substrate and the first end of the lead, the method further includes: An inert encapsulation material is coated onto the outer surface of the transition layer to form a coating layer; The coating layer is sintered in a first temperature range, which is greater than 800°C, to form an inert material encapsulation layer.

[0012] In some embodiments, an atomizer is provided, including the heating element described in the above embodiments, the heating element being used to heat and atomize the atomizing matrix into an aerosol.

[0013] In some embodiments, an electronic atomizing device is provided, including a power supply component and an atomizer as described above connected to the power supply component, the power supply component being used to provide electrical energy to the atomizer.

[0014] In the heating element provided in this application, since the standard electrode potential of the transition layer is located between the standard electrode potential of the heating substrate and the standard electrode potential of the lead, the standard electrode potential of the transition layer can act as a buffer for the standard electrode potential of the heating substrate and the standard electrode potential of the lead, dividing the originally large potential difference between the heating substrate and the lead into two smaller potential differences. This reduces the electromotive force driving the galvanic corrosion of the heating substrate and the lead, which can delay the corrosion between the heating substrate and the lead, thereby extending the service life of the heating element, which is equivalent to extending the service life of the electronic atomizing device. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the heating element in one embodiment; Figure 2 This is a schematic flowchart of a method for preparing a heating element in one embodiment; Figure 3 This is a schematic diagram of the structure of an electronic atomizing device in one embodiment; The accompanying diagrams are labeled as follows: 101-Heating substrate, 102-Lead wire, 103-Transition layer, 104-Inert material encapsulation layer, 10-Power supply component, 20-Atomizer. Detailed Implementation

[0016] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0017] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0018] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. Unless otherwise specified, the terms "connection" and "linkage" used in this application include both direct and indirect connections (linkages).

[0019] Current electronic atomization devices suffer from a short lifespan.

[0020] In this application, the transition layer 103 can extend the service life of the heating element, which is equivalent to extending the service life of the electronic atomizing device.

[0021] Please refer to Figure 1 In some embodiments, a heating element is provided, including an integrally formed heating substrate 101, a lead wire 102, and a transition layer 103.

[0022] The transition layer 103 is formed between the heating substrate 101 and the lead wire 102, such as Figure 1 As shown, the first end of the heating substrate 101 is connected to the first end of the lead 102, and at least one of the first ends of the heating substrate 101 and the first end of the lead 102 is covered with a transition layer 103. The standard electrode potential of the transition layer 103 is located between the standard electrode potential of the heating substrate 101 and the standard electrode potential of the lead 102.

[0023] The heating substrate 101 can be a heating wire, heating sheet, heating mesh, or other heating element, which will not be described in detail in this application.

[0024] The aforementioned first end corresponds to the end to be welded. A transition layer 103 can be applied to the end face of the welding end of the heating substrate 101 or the end face of the welding end of the lead 102, or a transition layer 103 can be applied to the end faces of both welding ends simultaneously. Then, the first end of the heating substrate 101 and the first end of the lead 102 are welded together, thereby forming... Figure 1 The structure shown depicts a transition layer 103 disposed between the heating substrate 101 and the lead wire 102. The thickness of the transition layer 103 can be 1µm to 10µm.

[0025] In the traditional structure, the heating substrate 101 is in direct contact with the lead wire 102, forming a potential difference ΔE. After the introduction of the transition layer 103, the galvanic cell is decomposed into two potential differences (ΔE) between "heating substrate 101 / transition layer 103" and "transition layer 103 / lead 102". and ΔE Smaller galvanic cells. Since the corrosion rate is exponentially related to the potential difference, even ΔE + ΔE = ΔE The overall corrosion rate will also be significantly reduced.

[0026] In other words, since the standard electrode potential of the transition layer 103 is located between the standard electrode potential of the heating substrate 101 and the standard electrode potential of the lead 102, the standard electrode potential of the transition layer 103 can act as a potential "step" buffer for the standard electrode potentials of the heating substrate 101 and the lead 102, reducing the large potential difference between the heating substrate 101 and the lead 102 into two smaller potential differences. This reduces the electromotive force driving the galvanic corrosion of the heating substrate 101 and the lead 102, thus delaying the corrosion between the heating substrate 101 and the lead 102, thereby extending the service life of the heating element, which is equivalent to extending the service life of the electronic atomizing device.

[0027] In addition, by delaying the corrosion between the heating substrate 101 and the lead wire 102, the amount of metal ions (especially nickel ions from the lead wire 102) precipitated during the corrosion process can be reduced, preventing a large number of metal ions from migrating to the atomizing liquid in a short period of time, thereby delaying the discoloration of the atomizing liquid and reducing safety hazards.

[0028] In some embodiments, the heating substrate 101 is made of a nickel-chromium alloy, the lead wire 102 is made of nickel, and the transition layer 103 is made of one or more of titanium and nickel-chromium-iron alloy. Understandably, the material of the transition layer 103 is determined by the materials of the heating substrate 101 and the lead wire 102. For a system where the heating substrate 101 is made of NiCr (-0.25V) and the lead wire 102 is made of Ni (-0.23V), the transition layer 103 can be made of titanium or a nickel-chromium-iron alloy with a closer potential (such as Inconel 600). The potential difference between NiCr and Ni is already very small (0.02V), theoretically resulting in very slight corrosion. Furthermore, using a nickel-chromium-iron alloy further reduces the potential difference, which can further weaken galvanic corrosion, thereby extending the service life of the heating element.

[0029] In some embodiments, the heating substrate 101 is made of an iron-chromium-aluminum alloy, the lead wire 102 is made of nickel, a nickel-chromium alloy, or stainless steel, and the transition layer 103 is made of nickel, a nickel-chromium alloy, or a nickel-iron alloy. The standard electrode potentials are arranged as follows: the heating substrate 101 (iron-chromium-aluminum alloy) is negatively biased, the transition layer 103 (nickel, nickel-chromium alloy, or nickel-iron alloy) is in the middle, and the lead wire 102 (nickel, nickel-chromium alloy, or stainless steel) is positively biased. This reduces the potential difference between the heating substrate 101, the transition layer 103, and the lead wire 102. Furthermore, the iron-chromium-aluminum alloy itself has a good high-temperature oxide film, which is beneficial for preventing corrosion in the internal heating zone.

[0030] In some embodiments, the heating substrate 101 is made of stainless steel, the lead wire 102 is made of stainless steel and copper (the stainless steel material used in the lead wire 102 is similar to or the same as the stainless steel material used in the heating substrate 101), and the transition layer 103 is made of nickel. The standard electrode potential relationship is: heating substrate 101 (stainless steel), transition layer 103 (nickel), lead wire 102 (stainless steel and copper). This reduces the potential difference between the heating substrate 101, transition layer 103, and lead wire 102.

[0031] In some embodiments, the heating element further includes an inert material encapsulation layer 104, which at least covers the outer surface of the transition layer 103.

[0032] like Figure 1 As shown, an inert material encapsulation layer 104 is disposed on the outer surface of the transition layer 103. This inert material is chemically inert to the atomizing liquid where the heating substrate 101 and the lead wire 102 are located. The inert material encapsulation layer 104 acts as a robust physical barrier, preventing the three elements constituting a galvanic cell—anode, cathode, and electrolyte (atomizing liquid)—from being simultaneously satisfied. Since corrosive liquids cannot come into contact with the most electrochemically active dissimilar metal interface, the galvanic corrosion circuit is completely cut off, corrosion cannot occur, and thus the service life of the heating element can be extended.

[0033] Furthermore, the transition layer 103 and the inert material encapsulation layer 104 work synergistically. Even if the inert material encapsulation layer 104 has microscopic defects or develops cracks after long-term use, the transition layer 103 can significantly delay corrosion. Meanwhile, the inert material encapsulation layer 104 completely breaks the galvanic corrosion circuit, preventing corrosion from occurring. The combination of these two elements ensures the high stability and safety of the connection point between the heating substrate 101 and the lead wire 102 throughout its entire service life.

[0034] In some embodiments, the inert material encapsulation layer 104 also covers the outer surface of the first end of the heating substrate 101 and the outer surface of the first end of the lead 102.

[0035] like Figure 1 As shown, the inert material encapsulation layer 104, in addition to covering the transition layer 103, extends to both ends of the transition layer 103, covering a portion of the heating substrate 101 and the lead wire 102. Through the above arrangement, the coverage area is expanded without affecting the normal operation of the heating substrate 101 and the lead wire 102, thereby improving the protection effect.

[0036] In some embodiments, the material of the inert material encapsulation layer 104 includes one or more of zirconia-based ceramic slurry, alumina-based ceramic slurry, fluoropolymer coating, silicone, or insulating glass glaze. To meet protection requirements, the inert material encapsulation layer 104 needs to possess characteristics such as high temperature resistance (greater than 300°C), electrical insulation, dense and non-porous structure, and chemical inertness to the atomizing liquid. Materials such as zirconia-based ceramic slurry, alumina-based ceramic slurry, fluoropolymer coating, silicone, or insulating glass glaze can be used. In addition to the above characteristics, these materials also possess excellent mechanical strength and impact resistance, which can further enhance the protective performance.

[0037] The following is a comparative example comparing the embodiments of this application with related technologies: A galvanic corrosion testing system was constructed by using different connection point structures as working electrodes and a large-area, identical heating wire material (Ni80) as the counter electrode, both immersed in a conductive electrolyte. The galvanic current (Igal) and galvanic potential (Egal) between the two were monitored using an electrochemical workstation. A higher Igal value indicates a faster galvanic corrosion rate.

[0038] Example (of this application): Structure: A 3μm titanium transition layer is deposited between the Ni80 heating wire and the pure nickel lead through PVD, and the outer layer of the solder joint is encapsulated with zirconia ceramic paste.

[0039] Test results: The steady-state galvanic current Igal was measured to be 0.08 µA / cm².

[0040] Comparative Example 1 (Traditional Structure): Structure: The Ni80 heating wire is directly spot-welded to the pure nickel lead wire without any protection.

[0041] Test results: The steady-state galvanic current Igal was measured to be 12.5 µA / cm².

[0042] Comparative Example 2 (transition layer only): Structure: Same as the embodiment, but without ceramic encapsulation.

[0043] Test results: The steady-state galvanic current Igal was measured to be 2.1 µA / cm².

[0044] Comparative Example 3 (Encapsulation layer only): Structure: Same as Comparative Example 1, but the solder joints that were directly soldered were ceramic-encapsulated.

[0045] Test results: The steady-state galvanic current Igal was measured to be 0.4 µA / cm².

[0046] Data Analysis: Compared with the comparative example and Comparative Example 1, the complete protective structure of this application reduces the galvanic corrosion current from 12.5 µA / cm² to 0.08 µA / cm², and the corrosion rate is reduced by more than 150 times (i.e. more than two orders of magnitude), which is extremely effective.

[0047] Demonstration of synergistic effect: Comparing the examples and Comparative Examples 2 and 3, it can be seen that using the transition layer alone (Comparative Example 2) or the encapsulation layer alone (Comparative Example 3) can suppress corrosion to a certain extent, but their effect is far less than that of the complete structure combining both (Example). This fully demonstrates the powerful synergistic effect between the two protection mechanisms of "potential buffering" and "physical isolation".

[0048] In some embodiments, a method for preparing a heating element is provided, such as... Figure 2 As shown, it includes the following steps: Step 201: Obtain the heating substrate 101 and the lead wire 102; Step 202: A transition layer 103 is covered on the end face of at least one of the first end of the heating substrate 101 and the first end of the lead 102, wherein the standard electrode potential of the transition layer 103 is located between the standard electrode potential of the heating substrate 101 and the standard electrode potential of the lead 102. Step 203: Weld the first end of the heating substrate 101 and the first end of the lead wire 102 to obtain the heating element.

[0049] The materials used for the heating substrate 101, lead wire 102, and transition layer 103 have been described in the above embodiments and will not be repeated here. A transition layer 103 is applied to the end face of the welding end of the heating substrate 101 or the end face of the welding end of the lead wire 102, or a transition layer 103 may be applied to the end faces of both welding ends simultaneously. Then, the first end of the heating substrate 101 and the first end of the lead wire 102 are welded together, thereby forming a structure as shown in the figure. Figure 1 The structure shown depicts a transition layer 103 disposed between the heating substrate 101 and the lead wire 102. The standard electrode potential of the transition layer 103 can act as a potential "step" buffer for the standard electrode potentials of the heating substrate 101 and the lead wire 102, reducing the originally large potential difference between the heating substrate 101 and the lead wire 102 into two smaller potential differences. This reduces the electromotive force driving the galvanic corrosion of the heating substrate 101 and the lead wire 102, thus delaying the corrosion between the heating substrate 101 and the lead wire 102, thereby extending the service life of the heating element, which is equivalent to extending the service life of the electronic atomizing device.

[0050] In some embodiments, a transition layer 103 is covered on the end face of at least one of the first end of the heating substrate 101 and the first end of the lead 102, including: covering the end face of at least one of the first end of the heating substrate 101 and the first end of the lead 102 with a transition layer 103 using a physical vapor deposition or electroplating process.

[0051] Physical vapor deposition (PVD) includes various types such as evaporation, sputtering, and ion plating. It is a method of vaporizing materials under vacuum conditions and depositing them onto the substrate surface to form a dense thin film. The resulting film is free of impurities, has a uniform and very dense structure with very few pores, provides good protection and isolation, and forms a good interface bond. The film will not fall off and is suitable for subsequent heat treatment, welding, and other operations.

[0052] Precision electroplating is a process that uses an external current to reduce metal ions on the surface of a substrate to form a metal / alloy coating. It not only provides a high-quality surface for welding processes, but also allows for the simultaneous processing of multiple parts in batches. The process is mature and stable, and has wide industrial applications.

[0053] In some embodiments, after welding the first end of the heating substrate 101 and the first end of the lead 102, the method further includes: coating an inert encapsulation material onto the outer surface of the transition layer 103 to form a coating layer; and sintering the coating layer in a first temperature range to form an inert material encapsulation layer 104, wherein the first temperature range is greater than 800°C.

[0054] The composition of the inert encapsulation material has been described in the above embodiments and will not be repeated here. The inert encapsulation material can be precisely applied to the transition layer 103 using a micro-dispensing device, followed by high-temperature sintering (e.g., >800℃ for ceramics, >600℃ for glass glaze) to form an inert material encapsulation layer 104 with a thickness of 50µm to 200µm. In this process, the micro-dispensing device precisely controls the amount and location of the inert encapsulation material, allowing for minimal coating only on critical areas requiring protection (transition layer 103), greatly reducing material waste and unnecessary coverage. After high-temperature sintering, the coating layer transforms into a highly dense, non-porous (almost no pinholes or cracks) continuous shell, exhibiting excellent water tightness, air tightness, and the ability to block harmful ions and atomizing media, thus improving the reliability and lifespan of the heating element.

[0055] In some embodiments, an atomizer is provided, including a heating element as described in the above embodiments. The heating element can be used to heat and atomize the atomizing liquid into an aerosol. Since the atomizer includes the heating element of the above embodiments, it can achieve at least all the beneficial effects of the above embodiments, which will not be repeated here.

[0056] In some embodiments, an electronic atomizing device is provided, such as Figure 3As shown, the electronic atomizing device includes a power supply component 10 and an atomizer 20 as described in the above embodiment, which is connected to the power supply component 10. The power supply component 10 provides electrical energy to the atomizer 20. The power supply component 10 and the atomizer 20 can be fixedly connected or detachably connected. When the atomizer 20 and the power supply component 10 are detachably connected, the atomizer 20 and the power supply component 10 can be replaced depending on the usage. Since the electronic atomizing device includes the heating element of the above embodiment, it can at least achieve all the beneficial effects of the above embodiment, which will not be repeated here.

[0057] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A heat generating element, characterized by, It includes an integrally formed heating substrate, leads, and a transition layer; wherein the transition layer is formed between the heating substrate and the leads, and the standard electrode potential of the transition layer is located between the standard electrode potential of the heating substrate and the standard electrode potential of the leads.

2. The heat generating element of claim 1, wherein The material of the heating substrate includes a nickel-chromium alloy, the material of the lead wire includes nickel, and the material of the transition layer includes one or more of titanium and nickel-chromium-iron alloy. And / or, the material of the heating substrate includes an iron-chromium-aluminum alloy, the material of the lead wire includes nickel or a nickel-chromium alloy or stainless steel, and the material of the transition layer includes nickel or a nickel-chromium alloy or a nickel-iron alloy; And / or, the material of the heating substrate includes stainless steel, the material of the leads includes stainless steel and copper, and the material of the transition layer includes nickel.

3. The heat generating element of claim 1, wherein The heating element further includes an inert material encapsulation layer, which at least covers the outer surface of the transition layer.

4. The heat-generating element of claim 3, wherein The material of the inert material encapsulation layer includes one or more of the following: zirconia-based ceramic slurry, alumina-based ceramic slurry, fluoropolymer coating, silicone, or insulating glass glaze.

5. A method of producing a heat-generating element, characterized by The method for preparing the heating element as described in any one of claims 1 to 4 includes: Obtain the heating substrate and leads; A transition layer is provided on the end face of at least one of the first end of the heating substrate and the first end of the lead, wherein the standard electrode potential of the transition layer is located between the standard electrode potential of the heating substrate and the standard electrode potential of the lead; The heating element is obtained by welding the first end of the heating substrate and the first end of the lead wire.

6. The method for preparing the heating element as described in claim 5, characterized in that, The transition layer covering the end face of at least one of the first end of the heating substrate and the first end of the lead includes: The transition layer is applied to the end face of at least one of the first end of the heating substrate and the first end of the lead using a physical vapor deposition or electroplating process.

7. The method for preparing the heating element as described in claim 5, characterized in that, After welding the first end of the heating substrate and the first end of the lead, the preparation method further includes: An inert encapsulation material is coated onto the outer surface of the transition layer to form a coating layer; The coating layer is sintered in a first temperature range, which is greater than 800°C, to form an inert material encapsulation layer.

8. An atomizer, characterized in that, Includes a heating element as described in any one of claims 1 to 4, wherein the heating element is used to heat and atomize the atomizing matrix into an aerosol.

9. An electronic atomizing device, characterized in that, The device includes a power supply component and an atomizer as described in claim 8, connected to the power supply component, wherein the power supply component is used to provide electrical energy to the atomizer.

Images