Laser processing apparatus and method for adjusting the focal position of laser

Abstract

The invention provides a laser processing apparatus and a laser focal position adjusting method using the same. A laser processing device (100) is provided with at least a laser oscillator that generates a laser beam (LB), a laser head (60) that irradiates the laser beam (LB) toward a workpiece, and a manipulator (40) to which the laser head (60) is attached. The manipulator (40) has a robot arm (41), a tip shaft (J6) that is rotatable about an axis (RA) and is provided at the tip of the robot arm (41), and a connection member (50) that connects the tip shaft (J6) and the laser head (60). The connection member (50) is provided with a measuring instrument attachment part (51a) for detachably attaching the measuring instrument (80). The measuring instrument (80) has a reference point corresponding to the focal position of the laser beam (LB).

Description

[0001] This application is a divisional application of the invention patent application filed on October 6, 2021, with application number 202180066454.7 and entitled "Laser Processing Apparatus and Method for Adjusting the Focus Position of a Laser Using the Same". Technical Field

[0002] This invention relates to a laser processing apparatus and a method for adjusting the focal position of a laser using the laser processing apparatus. Background Technology

[0003] Previously, it was widely known that laser processing was performed using a robot that moved a laser head simultaneously. In this case, in order to perform the desired processing, the focal position of the actual laser emitted from the laser head needed to be consistent with the focal position of the laser set by the robot or its control unit.

[0004] Patent Document 1 discloses a laser processing apparatus using an electric scanner. By adjusting the position of the condenser lens using a lens drive mechanism provided in the electric scanner, the focal point alignment along the optical axis of the laser can be performed with good accuracy. Furthermore, the focal point position can be adjusted with good accuracy relative to a direction orthogonal to the optical axis using a current mirror connected to a motor.

[0005] In addition, Patent Document 2 proposes a method for laser focus alignment using a fixture with slits and pin holes.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 2019-093399

[0009] Patent Document 2: Japanese Patent Application Publication No. 2020-104168 Summary of the Invention

[0010] The problem that the invention aims to solve

[0011] However, the electrical scanner disclosed in Patent Document 1 is expensive. On the other hand, in a cheaper laser processing apparatus that does not have an electrical scanner, it is necessary to move the laser head itself to match the actual laser focal position with a focal position set by a robot, or to measure the actual laser focal position and have the robot set that focal position. However, this requires cumbersome and complex operations and is costly.

[0012] Furthermore, in the method disclosed in Patent Document 2, the configuration of the slit and pin hole needs to be determined with high precision in order to align the laser focus, but in reality, such an operation is quite difficult.

[0013] The present invention was made in view of the above points, and its object is to provide a laser processing apparatus that can determine the focal position of a laser with good accuracy through a simple and inexpensive structure, and a method for adjusting the focal position of a laser using the laser processing apparatus.

[0014] Solution for solving the problem

[0015] To achieve the above objectives, the laser processing apparatus of the present invention is characterized in that it comprises at least: a laser oscillator that generates at least a laser beam; a laser head that directs the laser beam toward a workpiece; and a multi-joint robot on which the laser head is mounted, the multi-joint robot comprising at least: a robotic arm; an end effector capable of rotating about a predetermined axis and disposed at the front end of the robotic arm; and a connecting member that connects the end effector to the laser head, wherein the connecting member is provided with a measuring instrument mounting portion for detachably mounting a measuring instrument, the measuring instrument having a reference point corresponding to the focal position of the laser beam.

[0016] The laser focal position adjustment method of the present invention uses the laser processing apparatus, characterized in that the laser focal position adjustment method includes at least the following steps: a first step, installing the measuring instrument on the connecting component mounted on the end shaft; a second step, after the first step, emitting a guiding laser from the laser head; a third step, during the execution of the second step, determining whether the distance between the irradiation position of the guiding laser on the measuring instrument and the reference point is within a specified range; if the determination result in the third step is negative, adjusting the position of the laser head relative to the end shaft and returning to the first step, repeating a series of steps until the determination result in the third step becomes positive.

[0017] Invention Effects

[0018] According to the present invention, the focal position of a laser can be determined with good accuracy through a simple and inexpensive structure. Attached Figure Description

[0019] Figure 1 This is a schematic structural diagram of the laser processing apparatus according to the embodiment.

[0020] Figure 2 This is an enlarged view of the main part of the manipulator.

[0021] Figure 3 This is an exploded perspective view of the connecting component that connects the laser head to the end shaft.

[0022] Figure 4A It is a 3D view of the measuring instrument.

[0023] Figure 4B It is by Figure 4A An enlarged view of the area enclosed by the dotted line.

[0024] Figure 5 This is a flowchart showing the sequence of laser focus position adjustments.

[0025] Figure 6A This is a schematic diagram illustrating a situation where the distance between the laser beam's irradiation position and the measuring instrument's reference point exceeds a specified range.

[0026] Figure 6B This is a schematic diagram showing the sequence of position adjustments of the laser head relative to the end axis.

[0027] Figure 6C This is a schematic diagram showing the situation where the distance between the irradiation position of the guiding laser and the reference point of the measuring instrument is within a specified range.

[0028] Figure 7A It is a 3D view of other measuring instruments.

[0029] Figure 7B It is by Figure 7A An enlarged view of the area enclosed by the dotted line.

[0030] Explanation of reference numerals in the attached figures

[0031] 10 Laser Oscillators

[0032] 20 optical units

[0033] 21. Shell

[0034] 22 Condensing Lens

[0035] 23 Gates

[0036] 30 fiber optic cables

[0037] 40 Manipulator

[0038] 41. Robotic Arm

[0039] 42 Cables

[0040] 50 Connecting components

[0041] 51 First Component

[0042] 51a Measuring Instrument Installation Section

[0043] 51a2 Flat surface

[0044] 51a1 Through Hole

[0045] 51b First bolt hole

[0046] 51c Second Bolt Hole

[0047] 51d Third bolt hole

[0048] 52 Second Component

[0049] 52b First positioning hole

[0050] 52c Second positioning hole

[0051] 52d Third positioning hole

[0052] 52e Installation Department

[0053] 53 Third Component

[0054] 53a Fourth bolt hole

[0055] 53b Fifth bolt hole

[0056] 54a~54e First bolt~Fifth bolt

[0057] 60 laser head

[0058] 71 Laser Control Department

[0059] 72. Control Unit

[0060] 73 Teach pendant

[0061] 80 Measuring Instrument

[0062] 81 Head

[0063] 81a convex part

[0064] 81b flange

[0065] 82, 86 Legs

[0066] 83. Notch

[0067] 84 Centerline

[0068] 85 and 87 benchmark points

[0069] 100 Laser processing equipment

[0070] 200 workpieces

[0071] J1~J5 First joint axis~Fifth joint axis

[0072] J6 Sixth Joint Axis (End Axis)

[0073] LB Laser

[0074] GLB guiding laser. Detailed Implementation

[0075] The embodiments of the present invention will now be described with reference to the accompanying drawings. It should be noted that the following description of preferred embodiments is merely illustrative and is not intended to limit the present invention, its applications, or its uses.

[0076] (Implementation Method 1)

[0077] [Structure of laser processing equipment]

[0078] Figure 1 A schematic structural diagram of the laser processing apparatus according to this embodiment is shown. It should be noted that, in the following description, the travel direction of the laser LB within the optical unit 20 will sometimes be referred to as the X direction. Figure 1 The direction intersecting the X direction on the surface of the workpiece 200 shown is called the Y direction. Sometimes, the directions intersecting both the X and Y directions are called the Z direction. Additionally, in the manipulator 40... Figure 1 In the static posture shown, for the Z direction, the side where the laser head 60 is located is sometimes referred to as the upper or upper side, and the side where the workpiece 200 is located is sometimes referred to as the lower or lower side. Similarly, in the same state, for the X direction, the side where the manipulator 40 is located is sometimes referred to as the front or front side, and the side where the robotic arm 41 is located is sometimes referred to as the rear or rear side.

[0079] like Figure 1 As shown, the laser processing apparatus 100 includes a laser oscillator 10, an optical unit 20, a manipulator 40, an optical fiber 30, and a laser head 60. Additionally, the laser processing apparatus 100 includes a laser control unit 71, a manipulator control unit 72, and a teach pendant 73.

[0080] The laser oscillator 10 generates a laser LB and emits the laser LB toward the optical unit 20. In this embodiment, the wavelength of the laser LB is in the range of 900nm to 1000nm, and the output is in the range of 1kW to 5kW. However, it is not particularly limited to this, and other values ​​can be taken. In addition, the laser oscillator 10 is equipped with other laser sources (not shown), and emits a guiding laser GLB from other laser sources. The wavelength of the guiding laser GLB is about 650nm, and the output is in the range of several mW to tens of mW. The optical axis of the guiding laser GLB is approximately aligned with the optical axis of the laser LB.

[0081] It should be noted that in this application specification, "generally consistent" or "generally orthogonal" means that the comparative objects are consistent or orthogonal in a manner that includes the processing tolerances and assembly tolerances of the components constituting the laser processing apparatus 100. It does not mean that the comparative objects are consistent or orthogonal in a strict sense.

[0082] The optical unit 20 has a condenser lens 22 and a gate 23 inside the housing 21. The condenser lens 22 focuses the laser LB incident inside the housing 21 and directs it into the optical fiber 30. The gate 23 is configured to move between the optical path and the outside of the laser LB, and its opening and closing action controls the incident state of the laser LB onto the optical fiber 30. It should be noted that, in order to match the focusing position of the laser LB with the incident end face of the optical fiber 30, a focusing position adjustment mechanism (not shown) can be provided in the optical unit 20.

[0083] Manipulator 40 is a known vertical six-axis robot having first joint axes J1 to sixth joint axes J6. It should be noted that, in the following description, the sixth joint axis J6 will sometimes be referred to as the end effector axis J6. The end effector axis J6 is located at the tip of the robotic arm 41. Furthermore, the end effector axis J6 is configured to rotate around a predetermined axis RA (see reference RA). Figure 1 , 2 Rotate. It should be noted that cable 42 houses the cooling hose (not shown) of the laser head 60, thermal control switch, and other I / O lines (not shown).

[0084] Optical fiber 30 is connected to optical unit 20 and laser head 60, and transmits the laser LB incident from optical unit 20 to laser head 60. It should be noted that, although not shown in the figure, optical fiber 30 has one or more cores that serve as waveguides for the laser LB.

[0085] The laser head 60 is mounted on the manipulator 40, specifically on the end shaft J6 via the connecting component 50. The laser head 60 irradiates the workpiece 200 with the laser LB transmitted from the fiber 30, performing laser processing on the workpiece 200. Furthermore, the laser head 60 internally has an optical system (not shown), such as a collimating lens and a focusing lens, which, after converting the laser LB into parallel light, focuses it onto the surface of the workpiece 200.

[0086] The laser head 60 rotates along with the rotation of the end shaft J6, moving on a circumference with a radius corresponding to the length of the connecting member 50. The configuration of the laser head 60, the end shaft J6, and the connecting member 50 is set such that the focal position of the laser LB emitted from the laser head 60 does not change with the rotation of the laser head 60. In other words, the configuration of the laser head 60, the end shaft J6, and the connecting member 50 is set such that the focal position of the laser LB is located on the rotation axis RA of the end shaft J6. Therefore, for example, when the manipulator 40 is pivoted, the accuracy of the movement becomes good. That is, when laser processing of the workpiece 200 is performed while the end shaft J6 is rotated, appropriate laser processing of the specified processing point can be performed without changing the focal position of the laser LB.

[0087] The laser control unit 71 is electrically connected to the laser oscillator 10 and controls the operation of the laser oscillator 10. It also controls the operation of the power supply (not shown) connected to the laser oscillator 10. Specifically, the laser oscillator 10 controls the output and oscillation time of the laser LB, and also controls the timing of the start and stop of oscillation for the laser LB and the guide laser GLB.

[0088] The manipulator control unit 72 is electrically connected to the manipulator 40 and controls the operation of the manipulator 40. Specifically, the manipulator control unit 72 controls the movement speed and movement of the laser head 60 connected to the manipulator 40 by controlling the rotation speed and rotation amount of the motors (not shown) that are respectively connected to the first joint axis J1 to the sixth joint axis J6.

[0089] It should be noted that the manipulator control unit 72 controls the operation of the manipulator 40 based on a pre-prepared action program or parameters input from the teach pendant 73. It should also be noted that the manipulator control unit 72 stores the focal position of the laser LB emitted from the laser head 60.

[0090] The teach pendant 73 is a device used to store prescribed actions in the manipulator control unit 72. The operator uses the teach pendant 73 to actually operate the manipulator 40 and stores various parameters in the manipulator control unit 72, such as the rotation amount of motors (not shown) connected to the first joint axis J1 to the sixth joint axis J6 from one teach point to the next. Furthermore, the operator can re-execute the actions stored in the manipulator control unit 72 with the manipulator 40, and make minor corrections to various parameters as needed using the teach pendant 73, storing these parameters again in the manipulator control unit 72.

[0091] [Structure of the manipulator and measuring instrument]

[0092] Figure 2 An enlarged view showing the main parts of the manipulator is shown. Figure 3 An exploded perspective view of the connecting component that connects the laser head to the end shaft is shown. Figure 4A A three-dimensional view of the measuring instrument is shown. Figure 4B Shown by Figure 4A An enlarged view of the area enclosed by the dotted line. It should be noted that... Figure 2 This shows the state before the measuring instrument 80 is installed in the measuring instrument mounting section 51a.

[0093] like Figure 2 As shown, the laser head 60 is mounted to the end shaft J6 via the connecting member 50. Additionally, as... Figure 3 As shown, the connecting component 50 is composed of the first component 51 to the third component 53.

[0094] like Figure 2As shown, a measuring instrument mounting section 51a is provided on the first component 51. The measuring instrument mounting section 51a consists of a flat surface 51a2 of the first component 51 and a guide plate along the first component 51. Figure 2 A through hole 51a1 extending through the Z direction is formed. The aforementioned axis RA, which serves as the rotation axis of the end shaft J6, is an imaginary line passing through the center of the through hole 51a1 and approximately orthogonal to the flat surface 51a2. Furthermore, as... Figure 2 As shown, the measuring instrument 80 is mounted on the lower part of the through hole 51a1. Additionally, the end shaft J6 is mounted on the upper part of the through hole 51a1.

[0095] like Figure 3 As shown, the first component 51 has a plurality of first bolt holes 51b surrounding the through hole 51a1. First bolts 54a are inserted into the plurality of first bolt holes 51b respectively. By fastening the first bolts 54a together, the first component 51 is mounted and fixed to the end shaft J6.

[0096] The second component 52 has a recess 52a at its rear in the X direction. Additionally, the second component 52 has a mounting portion 52e at its front in the X direction. When viewed from the front, the mounting portion 52e is quadrilateral in shape.

[0097] Furthermore, the second component 52 has first positioning holes 52b to third positioning holes 52d. Two first positioning holes 52b are formed on the side surface of the second component 52, spaced apart from each other along the Z direction. The inner diameter of the first positioning hole 52b is longer in the X direction than in the Z direction. Two second positioning holes 52c are formed on the upper surface of the second component 52, spaced apart from each other along the Y direction. The inner diameter of the second positioning hole 52c is longer in the X direction than in the Y direction. Third positioning holes 52d are formed at the four corners of the mounting portion 52e of the second component 52. The inner diameter of the third positioning hole 52d is longer in the Y direction than in the Z direction.

[0098] In the first component 51, a second bolt hole 51c and a third bolt hole 51d are provided at locations corresponding to the first positioning hole 52b and the second positioning hole 52c of the second component 52, respectively. The third component 53 is a plate-shaped component mounted on the side of the laser head 60. In the third component 53, a fourth bolt hole 53a is provided at a location corresponding to the third positioning hole 52d of the second component 52. Additionally, the third component 53 has multiple fifth bolt holes 53b. Fifth bolts 54e are inserted into each of the multiple fifth bolt holes 53b. By tightening the fifth bolts 54e, the third component 53 is thus mounted and fixed to the laser head 60.

[0099] With the connecting component 50 assembled, the recess 52a of the second component 52 accommodates the front portion of the first component 51. Furthermore, the mounting portion 52e of the second component 52 abuts against the surface of the third component 53. A second bolt 54b is inserted into the first positioning hole 52b and the second bolt hole 51c, and a third bolt 54c is inserted into the second positioning hole 52c and the third bolt hole 51d. By tightening the second bolt 54b and the third bolt 54c, the second component 52 is mounted to the first component 51. A fourth bolt 54d is inserted into the third positioning hole 52d and the fourth bolt hole 53a. By tightening the fourth bolt 54d, the second component 52 is mounted to the third component 53.

[0100] The positional relationship between the first component 51 and the second component 52 is adjusted by the positions of the second bolt 54b and the third bolt 54c, which are respectively inserted into the first positioning hole 52b and the second positioning hole 52c. For example, if it is desired to shift the second component 52 forward relative to the first component 51 in the X direction, the second bolt 54b and the third bolt 54c are inserted into the first positioning hole 52b and the second positioning hole 52c at positions forward of the center in the X direction, respectively, and the second bolt 54b and the third bolt 54c are tightened to install the second component 52 onto the first component 51. Similarly, the positional relationship between the second component 52 and the third component 53 is adjusted by the position of the fourth bolt 54d, which is inserted into the third positioning hole 52d. For example, if it is desired to shift the second component 52 relative to the third component 53 in the Y direction, the fourth bolt 54d is inserted into the third positioning hole 52d at a position forward of the center in the Y direction, and the fourth bolt 54d is tightened to install the second component 52 onto the third component 53.

[0101] The measuring instrument 80 is a component used to confirm the focal position of the laser LB. For example... Figure 4A As shown, the measuring instrument 80 consists of a head 81 and a leg 82 extending linearly from the head 81. The head 81 consists of a protrusion 81a and a flange 81b surrounding the protrusion 81a. With the protrusion 81a received in the through hole 51a1 and the upper surface of the flange 81b abutting against the flat surface 51a2 of the first component 51, the flange 81b is threadedly fastened to the first component 51. Furthermore, by loosening the threaded fastening between the flange 81b and the first component 51, the measuring instrument 80 can be easily detached from the measuring instrument mounting portion 51a. That is, the measuring instrument 80 is mounted to the measuring instrument mounting portion 51a in a detachable manner.

[0102] like Figure 4BAs shown, the leg 82 is a cylindrical member with a notch 83 in the middle portion along the Z direction. A center line 84 extending along the Z direction is formed in the center of the notch 83. It should be noted that in this embodiment, the center line 84 is a drawing line formed by scribing on the surface of the notch 83. With the measuring instrument 80 mounted on the measuring instrument mounting part 51a, the center line 84 of the notch 83 is approximately aligned with the axis RA. In this state, the measuring instrument 80 is positioned at the intersection with the optical path of the laser LB emitted from the laser head 60. The intersection of the lower end of the notch 83 in the Z direction and the center line 84 of the notch 83 becomes a reference point 85 corresponding to the focal position of the laser LB.

[0103] As described later, the measuring instrument 80 is mounted on the connecting part 50, and the focus position of the laser LB is adjusted. Alternatively, during normal laser processing, the measuring instrument 80 is naturally removed from the measuring instrument mounting part 51a.

[0104] [Sequence of laser focus adjustment]

[0105] Figure 5 A flowchart showing the sequence of laser focus position adjustments. Figure 6A This diagram illustrates a situation where the distance between the irradiation position of the guiding laser and the reference point of the measuring instrument exceeds a specified range. Figure 6B A schematic diagram showing the sequence of laser head position adjustments relative to the end axis is provided. Figure 6C This diagram illustrates a scenario where the distance between the irradiation position of the guiding laser and the reference point of the measuring instrument is within a specified range.

[0106] With the laser LB emitted from the laser head 60, the manipulator 40 moves the laser head 60 along a predetermined trajectory, thereby enabling the desired laser processing of the workpiece 200. At this time, the focal position of the laser LB needs to be located on or near the surface of the workpiece 200 to be processed.

[0107] However, when the laser head 60 is removed from the manipulator 40 for maintenance or other reasons and then reinstalled, the laser head 60 sometimes shifts in position relative to the end axis J6 of the manipulator 40. Due to this positional shift, the focal position of the laser LB sometimes deviates from the position set by the manipulator control unit 72. When this occurs, there is a possibility that the weld width, the diameter of the hole during drilling, or the cutting width during cutting may deviate from the desired range, resulting in processing defects.

[0108] Therefore, when the laser head 60 is removed from the operator 40 or other maintenance is performed, it is necessary to confirm whether the focal position of the laser LB is in the desired position. If the focal position of the laser LB has deviated from the position set by the operator control unit 72, adjustment work is required to restore it. It should be noted that after maintenance of the laser processing apparatus 100, when the parameters of the operating program of the operator 40 are reset again via the teach pendant 73, as shown in this embodiment, it is also necessary to confirm the focal position of the laser LB and adjust it as needed.

[0109] In this embodiment, by mounting the measuring instrument 80 to the measuring instrument mounting section 51a and confirming the irradiation position of the guiding laser GLB relative to the reference point 85, the focal position of the laser LB is confirmed, and the focal position is adjusted as needed. Hereinafter, using... Figure 5 as well as Figures 6A-6C Further explanation is needed.

[0110] like Figure 5 As shown, when confirming the focal position of the laser LB, the measuring instrument 80 is mounted on the measuring instrument mounting section 51a of the first component 51 (step S1 (first step)). In this state, a guiding laser GLB is generated using the laser oscillator 10, and the guiding laser GLB is transmitted to the laser head 60 via the optical unit 20 and the optical fiber 30. The transmitted guiding laser GLB is emitted towards the outside of the laser head 60. The optical path of the guiding laser GLB is approximately the same as the optical path of the laser LB. Therefore, it can be said that the measuring instrument 80 is positioned at a position where it intersects with the optical path of the guiding laser GLB emitted from the laser head 60. That is, the guiding laser GLB is irradiated onto the measuring instrument 80 (step S2 (second step)).

[0111] In addition, when the focal position of the laser LB is at the position set by the manipulator control unit 72, the guide laser GLB is irradiated onto the reference point 85 of the measuring instrument 80.

[0112] Therefore, during the execution of step S2, it is determined whether the guiding laser GLB is illuminating the reference point 85. More specifically, it is determined whether the distance between the illuminating position of the guiding laser GLB on the measuring instrument 80 and the reference point 85 is within a specified range (step S3 (third step)).

[0113] The judgment result in the third step is positive, that is, the distance between the irradiation position of the guiding laser GLB on the measuring instrument 80 and the reference point 85 is within the specified range (refer to...). Figure 6C If the laser LB is located at the position set by the manipulator control unit 72, the operation is terminated.

[0114] On the other hand, if the result of the third step is negative, that is, if the distance between the irradiation position of the guiding laser GLB on the measuring instrument 80 and the reference point 85 exceeds the specified range, then... Figure 6A In the case shown, it is determined that the focal position of the laser LB has deviated from the position set by the manipulator control unit 72. In this case, the focal position of the laser LB is corrected by adjusting the position of the laser head 60 relative to the end shaft J6 (step S4 (fourth step)). Specifically, the measuring instrument 80 is removed from the end shaft J6. Furthermore, the positional relationship of the first component 51 to the third component 53 included in the connecting component 50 is adjusted to correct the focal position of the laser LB. Specifically, as described above, the insertion positions of the second bolt 54b to the fourth bolt 54d at the first positioning hole 52b to the third positioning hole 52d of the second component 52 are adjusted, such as... Figure 6B As shown, the positional relationship between the first component 51 and the third component 53 is adjusted, thereby adjusting the position of the laser head 60 relative to the end axis J6.

[0115] After step S4 is completed, return to step S1 and repeat the series of steps until the judgment result of the third step is affirmative.

[0116] It should be noted that the distance between the illumination position of the guiding laser GLB on the measuring instrument 80 and the reference point 85 is preferably zero. However, in cases where there is chromatic aberration in the condenser lens 22 or the optical system inside the laser head 60, or when there is a misalignment between the optical paths of the guiding laser GLB and the laser LB, the distance between the illumination position of the guiding laser GLB on the measuring instrument 80 and the reference point 85 may not be zero, and the aforementioned specified range may be a finite value. It should be noted that this specified range is appropriately determined based on the laser processing method, the specifications required by the laser processing apparatus 100, etc.

[0117] [Effects, etc.]

[0118] As explained above, the laser processing apparatus 100 of this embodiment includes at least a laser oscillator 10 that generates laser LB, a laser head 60 that irradiates the laser LB toward the workpiece 200, and a manipulator (multi-joint robot) 40 on which the laser head 60 is mounted.

[0119] The manipulator 40 has at least a robotic arm 41, an end shaft J6 that is rotatable about a predetermined axis RA and is disposed at the front end of the robotic arm 41, and a connecting member 50 that connects the end shaft J6 to the laser head 60.

[0120] The connecting part 50 is provided with a measuring instrument mounting part 51a for mounting the measuring instrument 80 in a detachable manner. The measuring instrument 80 has a reference point 85 corresponding to the focal position of the laser LB.

[0121] According to this embodiment, the focal position of the laser LB can be determined with good accuracy through a simple and inexpensive structure. In addition, when the optical axis of the laser LB changes, for example when replacing the laser oscillator 10, fiber optic cable 30, or laser head 60, there is no need to modify the operation program of the manipulator 40.

[0122] The connecting member 50 has a first member 51 to a third member 53, and the first member 51 is mounted on the end shaft J6. In addition, a measuring instrument mounting part 51a is provided on the first member 51.

[0123] The laser processing apparatus 100 is configured to adjust the focal position of the laser LB by adjusting the positional relationship between the first component 51 to the third component 53 included in the connecting component 50.

[0124] According to this embodiment, the focal position of the laser LB can be adjusted with good accuracy through a simple and inexpensive structure.

[0125] With the measuring instrument 80 mounted on the measuring instrument mounting section 51a, the center line 84 extending along the length direction of the measuring instrument 80 is approximately aligned with the rotation axis RA of the end shaft J6. Furthermore, a reference point 85 is provided on the center line 84.

[0126] Therefore, the focal position of the laser LB can be determined easily and inexpensively.

[0127] The measuring instrument 80 is a cylindrical component with a notch 83 in the middle part along the length direction, i.e., the Z direction. The intersection of the lower end of the notch 83 and the center line 84 of the notch 83 extending along the Z direction is the reference point 85.

[0128] Therefore, when the guiding laser GLB is irradiated onto the measuring instrument 80, it is possible to reliably determine whether the guiding laser GLB is irradiating the reference point 85.

[0129] Typically, when determining whether the guiding laser GLB is illuminating the reference point 85, the operator wearing protective gear makes a visual judgment or uses a camera to measure the distance between the illuminating position of the guiding laser GLB at the measuring instrument 80 and the reference point 85.

[0130] When reference point 85 is displayed on a plane, for example, when reference point 85 is displayed as an image on a plane parallel to axis RA, it may be difficult to determine whether the guide laser GLB is illuminating reference point 85, depending on the intensity of the guide laser GLB and the sensitivity of the camera.

[0131] On the other hand, when the aforementioned intersection point is used as the reference point 85, when the guide laser GLB is irradiated toward the reference point 85, the guide laser GLB scatters, and the reflected light expands. When the guide laser GLB is offset from the reference point 85 and irradiates the portion of the notch 83 or the leg 82 located below the notch 83, the scattering of the guide laser GLB decreases, and consequently, the expansion of the reflected light decreases.

[0132] In this way, by also evaluating the extent of the spread of the reflected light from the guiding laser GLB, it is possible to reliably and with good accuracy determine whether the guiding laser GLB is illuminating the reference point 85.

[0133] The laser LB focal position adjustment method of this embodiment includes step S1 (first step) of mounting a measuring instrument 80 on the connecting member 50 mounted on the end shaft J6, and step S2 (second step) of emitting a guiding laser GLB from the laser head 60 after step S1.

[0134] It also includes step S3 (third step) during the execution of step S2, which determines whether the distance between the irradiation position of the guiding laser GLB on the measuring instrument 80 and the reference point 85 is within a specified range.

[0135] If the judgment result in step S3 is negative, then adjust the position of the laser head 60 relative to the end axis J6 (step S4), and return to step S1. Repeat a series of steps until the judgment result in step S3 becomes positive.

[0136] According to this embodiment, the focal position of the laser LB can be adjusted easily and inexpensively.

[0137] Furthermore, by adjusting the positional relationship between the first component 51 to the third component 53 included in the connecting component 50, the focal position of the laser LB can be adjusted with good precision.

[0138] Furthermore, when the optical axis of the laser LB changes, such as when replacing the laser oscillator 10, fiber 30, or laser head 60, there is no need to modify the operating program of the manipulator 40, thus reducing the maintenance time of the laser processing apparatus 100. Additionally, it can suppress increases in maintenance costs.

[0139] (Other implementation methods)

[0140] In the implementation method, take Figure 4A as well as Figure 4B The measuring instrument 80 shown is an example, but its shape is not particularly limited to this. For example, as Figure 7AAs shown in 7B, the leg 86 of the measuring instrument 80 can also be prismatic. Additionally, the reference point 87 can also be a cross shape formed on the side of the leg 86. It should be noted that the reference point 87 is preferably as follows... Figure 7B As shown, the leg 86 is recessed inward or protrudes outward from its side. Therefore, when the guide laser GLB illuminates the reference point 87, the extent of the reflected light from the guide laser GLB can be evaluated simultaneously, and it can be reliably and accurately determined whether the guide laser GLB illuminates the reference point 87.

[0141] Furthermore, the shape of the reference point is not limited to Figure 4B , Figure 7B The example shown. For example, multiple recesses or protrusions can be provided on the measuring instrument 80, and the intersection of the multiple recesses or protrusions can be used as a reference point 87.

[0142] Furthermore, in this embodiment, an example is shown where the connecting member 50 is composed of the first member 51 to the third member 53, but it is not particularly limited to this. For example, the third member 53 may be omitted, and the second member 52 may be directly mounted to the laser head 60. Alternatively, the connecting member 50 may have other members besides the first member 51 to the third member 53.

[0143] Furthermore, in this embodiment, an example of a robot with six joint axes J1 to J6 as the manipulator 40 is shown, but it is not particularly limited to this. For example, it could also be a multi-joint robot with three or more joint axes as the manipulator 40. In this case, the end effector axis can also rotate about a predetermined axis and is provided at the front end of the robotic arm 41.

[0144] In addition, in the embodiment, an example is shown where the laser oscillator 10 has a laser source that generates the guiding laser GLB, but this laser source may also be provided separately from the laser oscillator 10. The optical axis of the guiding laser GLB incident on the optical fiber 30 should be approximately aligned with the optical axis of the laser LB.

[0145] Industrial applicability

[0146] The laser processing apparatus of the present invention is useful because it can determine the focal position of the laser with good accuracy through a simple and inexpensive structure.

Claims

1. A laser processing apparatus, characterized in that, The laser processing apparatus shall at least include: A laser oscillator that at least generates laser light; A laser head that directs the laser beam toward the workpiece; and A multi-jointed robot equipped with the aforementioned laser head. The multi-joint robot has at least the following characteristics: robotic arm; An end shaft, capable of rotating about a predetermined axis, is disposed at the front end of the robotic arm; and A connecting component that connects the end shaft to the laser head. The connecting component is provided with a measuring instrument mounting part, which is used to mount the measuring instrument in a detachable manner. The measuring instrument has a reference point corresponding to the focal position of the laser.

2. The laser processing apparatus according to claim 1, characterized in that, The measuring instrument is provided with multiple recesses or protrusions. The intersection of the plurality of concave or convex portions is the reference point.

3. The laser processing apparatus according to claim 1 or 2, characterized in that, The connecting component has at least a first component and a second component. The first component is mounted on the end shaft. The measuring instrument mounting part is disposed on the first component.

4. The laser processing apparatus according to claim 3, characterized in that, The laser processing apparatus is configured such that the focal point of the laser can be adjusted by adjusting the positional relationship between the multiple components included in the connecting component.

5. The laser processing apparatus according to any one of claims 1 to 4, characterized in that, With the measuring instrument mounted on the measuring instrument mounting part, the center line of the measuring instrument extending along its length is approximately aligned with the axis. The reference point is set on the center line.

6. A method for adjusting the focal position of a laser, using the laser processing apparatus of claim 5, characterized in that, The laser focus position adjustment method includes at least the following: The first step is to install the measuring instrument on the connecting component that is mounted on the end shaft; The second step is to emit a guiding laser from the laser head after the first step; as well as The third step, during the execution of the second step, is to determine whether the distance between the irradiation position of the guiding laser on the measuring instrument and the reference point is within a specified range. If the judgment result in the third step is negative, then the position of the laser head relative to the end axis is adjusted, and the process returns to the first step, repeating a series of steps until the judgment result in the third step becomes positive.

Images