Integrated circuit element inspection method, integrated circuit element inspection device, and integrated circuit element manufacturing apparatus

Abstract

The invention relates to an integrated circuit element inspection method, an integrated circuit element inspection device and integrated circuit element manufacturing equipment, and the integrated circuit element inspection method enables the integrated circuit element manufacturing equipment to carry an integrated circuit element through a carrying disc, and after the integrated circuit element is subjected to a press-fit process, the integrated circuit element is subjected to the press-fit process. An inspection process is performed on the integrated circuit element. In the inspection process, the integrated circuit element manufacturing equipment conveys a carrying disc to an inspection area, and an upper cover and a substrate of the integrated circuit element are respectively imaged by a first imaging mechanism and a second imaging mechanism which are positioned above and below the inspection area. Therefore, after the lamination process, the image taking inspection of the upper cover and the substrate can be performed on the integrated circuit element, and the flaws of the laminated integrated circuit element can be immediately found so as to perform high-quality manufacturing.

Description

Technical Field

[0001] This invention relates to an inspection method, inspection apparatus, and manufacturing equipment, and particularly to an integrated circuit (IC) component inspection method, integrated circuit component inspection apparatus, and integrated circuit component manufacturing equipment. Background Technology

[0002] Patent No. I568324, "Method and Apparatus for Placing Heat Sinks," discloses a prior art integrated circuit element packaging process. It forms a process flow path between a loading mechanism and a loading and unloading mechanism. The process flow path is arranged sequentially from the loading mechanism to the loading and unloading mechanism, including a coating device, a first detection device, a wafer placement device, a pressing device, and a second detection device. The substrate with the wafers on the carrier tray is processed in sequence on a production line connected in series: coating step → first detection step → heat sink placement step → pressing and curing step → second detection step.

[0003] As the precision of integrated circuit components (ICs) increases, defects that occur during the pre-processing of ICs by various equipment can affect their quality. Although previous technologies included corresponding inspections after the adhesive application and lamination / curing steps, these are no longer sufficient to meet current quality requirements. For example, the second inspection step can only inspect the laminated heat sink, but not the laminated substrate. Therefore, previous technologies still have room for improvement. Summary of the Invention

[0004] Therefore, the object of the present invention is to provide a method for inspecting integrated circuit elements that can improve upon at least one of the disadvantages of prior art.

[0005] Therefore, the integrated circuit element inspection method of the present invention includes:

[0006] An integrated circuit element manufacturing apparatus is used to mount an integrated circuit element on a tray. The integrated circuit element includes a substrate, a chip disposed on the substrate, and a cover disposed on the substrate and covering the chip.

[0007] After the integrated circuit element manufacturing equipment performs a bonding process on the integrated circuit element, it then performs an inspection process on the integrated circuit element. The inspection process includes: transporting the tray carrying the integrated circuit element to an inspection area; having the integrated circuit element manufacturing equipment take an image of the top cover of the integrated circuit element using a first imaging mechanism that moves above the inspection area; and having the integrated circuit element manufacturing equipment take an image of the substrate of the integrated circuit element using a second imaging mechanism that moves below the inspection area.

[0008] Another object of the present invention is to provide an integrated circuit element inspection device that can improve upon at least one of the disadvantages of the prior art.

[0009] Therefore, the integrated circuit element inspection device of the present invention is provided on one side of an integrated circuit element pressing device, and is provided with a machine base, and a carrier unit, a first image acquisition unit and a second image acquisition unit provided on the machine base.

[0010] The carrier unit is provided with an inspection channel for conveying a tray containing an integrated circuit element. The inspection channel is connected to one end of a conveying channel of the integrated circuit element pressing device. The first imaging unit is provided with a first moving mechanism on the machine base and a first imaging mechanism on the first moving mechanism. The first moving mechanism can drive the first imaging mechanism to move above the inspection channel. The first imaging mechanism can be used to capture an image of the upper side of the integrated circuit element. The second imaging unit is provided with a second moving mechanism on the machine base and a second imaging mechanism on the second moving mechanism. The second moving mechanism can drive the second imaging mechanism to move below the inspection channel. The second imaging mechanism can be used to capture an image of the lower side of the integrated circuit element.

[0011] Therefore, the integrated circuit element inspection apparatus of the present invention can be used to perform the inspection process of the integrated circuit element inspection method described above.

[0012] Another object of the present invention is to provide an integrated circuit element manufacturing apparatus that can improve upon at least one of the disadvantages of the prior art.

[0013] Therefore, the integrated circuit element manufacturing apparatus of the present invention can be used to perform the integrated circuit element inspection method as described above.

[0014] The advantages of this invention are: by providing the first imaging unit and the second imaging unit on the upper and lower sides of the inspection channel respectively through the structure design of the integrated circuit element inspection device, the top cover and the substrate of the integrated circuit element can be inspected after the integrated circuit element has undergone the lamination process, and defects of the integrated circuit element after lamination can be detected in real time for high-quality manufacturing. Attached Figure Description

[0015] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, wherein:

[0016] Figure 1 This is a perspective view illustrating the structure of an embodiment of the integrated circuit element manufacturing apparatus of the present invention;

[0017] Figure 2 It is a three-dimensional view illustrating the structure of an integrated circuit element manufactured in this embodiment;

[0018] Figure 3 It is a 3D exploded view illustrating the structure of the integrated circuit components;

[0019] Figure 4 This is an exploded three-dimensional view illustrating the structure of a carrier disk used in this embodiment;

[0020] Figure 5 This is a schematic diagram illustrating a pressing process and an inspection process in this embodiment.

[0021] Figure 6 This is a three-dimensional view illustrating a carrier unit structure of this embodiment;

[0022] Figure 7 This is a side sectional view illustrating the situation where a stop member of the carrier unit in this embodiment is in a stop position;

[0023] Figure 8 It is similar Figure 7 The view illustrates the stop when it is in a released position;

[0024] Figure 9 This is a perspective view illustrating the structure of a first image-capturing unit in this embodiment;

[0025] Figure 10 It is a schematic diagram illustrating the process of capturing an image of an integrated circuit element on the carrier disk using the first imaging unit;

[0026] Figure 11 This is a perspective view illustrating the structure of a second imaging unit in this embodiment; and

[0027] Figure 12 It is a schematic diagram illustrating the process of capturing an image of an integrated circuit element on the carrier disk using the second imaging unit.

[0028] [Symbol Explanation]

[0029] 200: Integrated circuit component manufacturing equipment

[0030] 3: Integrated circuit element pressing device

[0031] 30: Teleportation Channel

[0032] 31: Lower die

[0033] 32: Upper mold

[0034] 4: Integrated circuit component inspection device

[0035] 41: Machine

[0036] 410: Moving Range

[0037] 42: Bearing unit

[0038] 43: Carrier Body

[0039] 431: Through Section

[0040] 432: Inspect the flow channel

[0041] 433: Entry point

[0042] 434: Export end

[0043] 435: Inspection Area

[0044] 44: Stopping assembly

[0045] 441: Stopping component

[0046] 442: Drive unit

[0047] 443: Oscillating component

[0048] 45: First image capturing unit

[0049] 450: Axis

[0050] 451: First moving mechanism

[0051] 452: First imaging institution

[0052] 453: First Image Capturer

[0053] 454: Upper coaxial light source

[0054] 455: Ring light source

[0055] 456: Light-emitting components

[0056] 457: Bar Light Source

[0057] 46: Second imaging unit

[0058] 460: Axis

[0059] 461: Second moving mechanism

[0060] 462: Second imaging mechanism

[0061] 463: Second image sensor

[0062] 464: Lower coaxial light source

[0063] 465: Multi-layered ring light source

[0064] 466: Light-emitting components

[0065] 800: Integrated circuit element

[0066] 801: Substrate

[0067] 802: Chip

[0068] 803: Top Cover

[0069] 804: Thermal interface material

[0070] 805: Adhesive

[0071] 900: Carrier disk

[0072] 901: Placement area

[0073] 902: Cut-out section Detailed Implementation

[0074] See Figure 1 , Figure 2 , Figure 3 An embodiment of the integrated circuit element inspection method of the present invention is applicable to an integrated circuit element manufacturing apparatus 200, thereby enabling the integrated circuit element manufacturing apparatus 200 to manufacture and inspect an integrated circuit element 800. The integrated circuit element 800 includes a substrate 801, a wafer 802 mounted on the substrate 801, and a top cover 803 pressed and fixed on the substrate 801 and covering and abutting the wafer 802.

[0075] See Figure 4 During the manufacturing process of the integrated circuit element 800, the integrated circuit element 800 is mounted on a carrier 900. The carrier 900 has multiple mounting sections 901 and multiple cutout sections 902 corresponding to the mounting sections 901. Each mounting section 901 can be used to mount one integrated circuit element 800. Each cutout section 902 exposes most of the bottom surface and four corners of the substrate 801 of the corresponding integrated circuit element 800 facing downwards.

[0076] See Figure 1 , Figure 3 , Figure 4 The integrated circuit element manufacturing equipment 200 is provided with an integrated circuit element pressing device 3 and an integrated circuit element inspection device 4 located downstream of the integrated circuit element pressing device 3.

[0077] In practice, the integrated circuit element manufacturing equipment 200 also includes a loading device (not shown), a thermal interface material application device (not shown), a coating device (not shown), and a wafer placement device (not shown) located upstream of the integrated circuit element pressing device 3, and a loading and unloading device (not shown) located downstream of the integrated circuit element inspection device 4. The loading device can be used to load the carrier tray 900, which already contains a plurality of substrates 801, each of which has a wafer 802 disposed on it. The loading device transports the carrier tray 900 to the thermal interface material application device. The thermal interface material application apparatus applies a thermal interface material 804 (TIM) onto the wafer 802, such as a film, metal, or liquid metal, and is made of materials such as indium, graphite, silicon, gold, silver, copper, tin, or lead, for heat transfer between the wafer 802 and the cover 803. The coating apparatus applies adhesive 805 onto the substrate 801 for bonding between the substrate 801 and the cover 803. The die-mounting apparatus places multiple covers 803 onto the adhesive-coated substrate 801, covering the wafer 802 with each cover 803. The die-mounting apparatus then transports the carrier tray 900 to the integrated circuit element bonding apparatus 3 for a bonding process. The integrated circuit element pressing device 3 conveys the carrier tray 900 to the integrated circuit element inspection device 4 for an inspection process. The loading and unloading device can be used to receive the carrier tray 900 output by the integrated circuit element inspection device 4.

[0078] Since the loading and unloading device, the heat transfer material application device, the coating device, the sheeting device, and the loading and unloading device are not the focus of this invention, they will not be described in detail.

[0079] See Figure 1 , Figure 5 When the integrated circuit element pressing device 3 performs the pressing process, a lower pressing mold 31 presses against the substrate 801 on the carrier 900, and an upper pressing mold 32 moves downward toward the lower pressing mold 31, so that the upper pressing mold 32 applies pressure to the upper cover 803 against the substrate 801, causing the upper cover 803 to adhere to the substrate 801. Then, the integrated circuit element pressing device 3 transports the carrier 900, which has completed the pressing process, to the integrated circuit element inspection device 4 through a conveying channel 30.

[0080] See Figure 1The integrated circuit element inspection device 4 includes a machine base 41 adjacent to the integrated circuit element pressing device 3, and a support unit 42, a first image acquisition unit 45 and a second image acquisition unit 46 disposed on the machine base 41. A moving section 410 is recessed on the top surface of the machine base 41.

[0081] See Figure 1 , Figure 6 The support unit 42 has a support body 43 located on the top side of the machine base 41 and above the moving section 410, and a stop component 44 located on the support body 43.

[0082] The carrier body 43 has a through section 431 extending vertically, and an inspection channel 432 extending through the through section 431 and spanning above the moving section 410. The inspection channel 432 has an inlet end 433 for loading the tray 900 and an outlet end 434 for outputting the tray 900. The inlet end 433 of the inspection channel 432 corresponds to one end of the conveying channel 30 and can be used to receive the tray 900 from the conveying channel 30. The inspection channel 432 also has an inspection area 435 located between the inlet end 433 and the outlet end 434, for temporarily holding the tray 900 for inspection. In this embodiment, the carrier body 43 carries and transports the tray 900 via a transmission belt mechanism; however, since there are many ways to carry and transport the tray 900, the implementation is not limited to the above method.

[0083] See Figure 6 , Figure 7 , Figure 8 The stop assembly 44 includes a stop member 441 and a drive member 442 spaced apart along the longitudinal direction of the inspection channel 432 and pivotally mounted on the support body 43, and a swing member 443 extending between the stop member 441 and the drive member 442 and pivotally mounted on the support body 43. The swing member 443 is generally V-shaped with its opening facing upwards, and its bent section is pivotally mounted on the support body 43. The stop member 441 is adjacent to the inspection area 435 and located on the side of the inspection area 435 away from the inlet end 433. The stop member 441 is generally rod-shaped, with one end pivotally connected to the support body 43 and the other end pivotally connected to one end of the swing member 443. In this embodiment, the drive member 442 is a telescopic cylinder that can be driven to extend and retract, with one end pivotally mounted on the support body 43 near the outlet end 434 and the other end pivotally connected to the other end of the swing member 443.

[0084] The drive member 442 can be driven to extend and retract, thereby causing the swing member 443 to pivot up and down relative to the carrier body 43, which in turn drives the stop member 441 to a position higher than the inspection channel 432, thus stopping the tray 900 moving towards the outlet end 434 and temporarily stopping it in the stop position of the inspection area 435 (e.g., Figure 7 (as shown), and a release position (e.g., below the inspection channel 432, allowing the tray 900 to be conveyed to the outlet end 434) Figure 8 (As shown) the vertical swing change.

[0085] Since there are many driving methods that can be used to drive the stop 441 to change between the stop position and the release position, the driving structure design of the stop assembly 44 is not limited to the above-described form in practice.

[0086] See Figure 1 , Figure 9 , Figure 10 The first imaging unit 45 includes a first moving mechanism 451 located on the top side of the machine base 41, and a first imaging mechanism 452 located on the first moving mechanism 451. The first moving mechanism 451 can be controlled to drive the first imaging mechanism 452 to move in three dimensions above the inspection area 435, that is, to move horizontally (forward, backward, left, right) and vertically. In this embodiment, the first moving mechanism 451 is composed of multiple linear slide rails arranged in three dimensions. However, since there are many types of moving mechanisms that can be used to drive the first imaging mechanism 452 to move in three dimensions, the structural design of the first moving mechanism 451 is not limited to the above-described form or the illustrated form. Furthermore, in another embodiment of the present invention, the first moving mechanism 451 can also be modified to only drive the first imaging mechanism 452 to move in two dimensions.

[0087] The first image capturing mechanism 452 includes a first image capture device 453, an upper coaxial light source 454, a ring light source 455, and multiple strip light sources 457 arranged at the same height, which are coaxially arranged along an axis 450 and arranged sequentially from top to bottom.

[0088] The upper coaxial light source 454 is an external coaxial light source element, which can be used to refract the generated light downwards toward the carrier disk 900 to illuminate the integrated circuit element 800 on the carrier disk 900. The ring light source 455 is provided with a plurality of light-emitting elements 456 arranged around the axis 450. The light-emitting elements 456 can cooperate to provide radially inward and downward ring illumination to the integrated circuit element 800 on the carrier disk 900. The number of the strip light sources 457 is four (only two are shown due to viewing angle), and they are arranged in a rectangular ring around the axis 450. Each strip light source 457 can illuminate the integrated circuit element 800 on the carrier disk 900 obliquely downwards toward the axis 450. The upper coaxial light source 454, the ring light source 455, and the strip light sources 457 can provide one or more of the following illuminations as needed: red light, blue light, white light, infrared light, ultraviolet light, etc.

[0089] In this embodiment, each strip light source 457 is pivotally mounted at both ends to the first moving mechanism 451 and can be driven to pivot up and down relative to the first moving mechanism 451 to adjust the illumination angle. However, in practice, it is not necessary for the strip light source 457 to have an adjustable illumination angle.

[0090] The first image sensor 453 can be used in conjunction with the upper coaxial light source 454, the ring light source 455, and the strip light source 457 to capture images downwards towards the upper side of each integrated circuit element 800 carried on the carrier 900, that is, to capture images of the upper cover 803 of each integrated circuit element 800. In practice, during the image capturing process of the first image sensor 453, the upper coaxial light source 454, the ring light source 455, and the strip light source 457 can be turned on simultaneously, or only one or two of them can be turned on.

[0091] See Figure 1 , Figure 11 and Figure 12 The second imaging unit 46 includes a second moving mechanism 461 located in the moving section 410 of the machine base 41, and a second imaging mechanism 462 located in the second moving mechanism 461. The second moving mechanism 461 can be controlled to drive the second imaging mechanism 462 to move in three dimensions below the inspection area 435, that is, to move horizontally (forward, backward, left, right) and vertically. The architectural design of the second moving mechanism 461 is generally the same as that of the first moving mechanism 451, and will not be described in detail. Furthermore, since there are many types of second moving mechanisms 461, their implementation is not limited to the illustrated style.

[0092] The second image-capturing mechanism 462 includes a second image sensor 463, a lower coaxial light source 464, and a multi-layer ring light source 465, which are coaxially arranged along an axis 460 and arranged sequentially from bottom to top.

[0093] The lower coaxial light source 464 is an external coaxial light source element, which can be used to refract the generated light upwards toward the carrier disk 900 to illuminate the lower side of the carrier disk 900. The multi-layer ring light source 465 is provided with multiple light-emitting elements 466 arranged in a ring around the axis 460. The light-emitting elements 466 can cooperate to provide radially inward and inclined upward ring illumination to the lower side of the carrier disk 900. The inner diameter of each layer of the multi-layer ring light source 465 gradually increases from bottom to top, and the upward illumination angle of the light-emitting elements 466 in each layer is different. The lower coaxial light source 464 and the multi-layer ring light source 465 can provide one or more types of illumination such as red light, blue light, white light, infrared light, and ultraviolet light as needed. In this embodiment, the multi-layer ring light source 465 has a three-layer structure design, but in practice, the number of layers of the multi-layer ring light source 465 can be increased or decreased as needed.

[0094] The second image sensor 463 can be used in conjunction with the lower coaxial light source 464 and the multi-layer ring light source 465 to capture images upwards towards the underside of each integrated circuit element 800 carried on the carrier disk 900, that is, to capture images of the substrate 801 of each integrated circuit element 800. In practice, during the image capturing process of the second image sensor 463, the lower coaxial light source 464 and the multi-layer ring light source 465 can be turned on simultaneously, or only one of them can be turned on.

[0095] This embodiment of the integrated circuit element inspection method of the present invention, when performed in conjunction with the integrated circuit element manufacturing equipment 200, includes the following steps:

[0096] The integrated circuit element manufacturing equipment 200 places the integrated circuit element 800 to be subjected to the pressing process on a carrier plate 900.

[0097] See Figure 5 The integrated circuit element manufacturing equipment 200 uses an integrated circuit element pressing device 3 to perform a pressing process on the integrated circuit element 800 on the carrier 900. Then, the integrated circuit element pressing device 3 transfers the carrier 900, now having undergone the pressing process, to the integrated circuit element inspection device 4. Next, the integrated circuit element inspection device 4 performs an inspection process, capturing images of each integrated circuit element 800 on the carrier 900. This inspection process includes the following steps.

[0098] See Figure 5 , Figure 6 , Figure 7The integrated circuit element inspection device 4 transports the tray 900, which carries the integrated circuit element 800, to the inspection area 435. In this embodiment, the stop assembly 44 is actuated, causing the stop member 441 to change to the stop position. Then, the carrier body 43 transports the tray 900 from the inlet end 433 to the outlet end 434 of the inspection channel 432. When the tray 900 is blocked by the stop member 441, the tray 900 is positioned in the inspection area 435.

[0099] See Figure 5 , Figure 9 , Figure 11 The first moving mechanism 451 of the integrated circuit element inspection device 4 moves the first imaging mechanism 452 above the inspection area 435, and the first imaging mechanism 452 moves downward to capture an image of the top cover 803 of each integrated circuit element 800 on the carrier 900. For example, the first moving mechanism 451 moves the first imaging mechanism 452 to the four sides or corners of each top cover 803 and captures images of each side or corner of the top cover 803 to inspect for defects such as scratches or misalignments on the top cover 803. However, this is not a limitation in implementation.

[0100] The second moving mechanism 461 of the integrated circuit element inspection device 4 adjusts the second imaging mechanism 462, and the second imaging mechanism 462 moves upward to capture an image of the substrate 801 of each integrated circuit element 800 on the carrier disk 900, for example, capturing an image of the portion of the substrate 801 exposed in the cutout area 902, in order to inspect for defects such as scratches on the substrate 801. The first imaging mechanism 452 and the second imaging mechanism 462 can be moved to the inspection area 435 one after the other to inspect the upper and lower sides of the integrated circuit element 800 one after the other, or they can be moved to the inspection area 435 simultaneously to inspect the upper and lower sides of the integrated circuit element 800 at the same time.

[0101] See Figure 6 , Figure 8 After the integrated circuit element inspection device 4 has completed image acquisition of the integrated circuit element 800 by the first image acquisition mechanism 452 and the second image acquisition mechanism 462, it drives the stop member 441 of the stop assembly 44 to change to the release position. Then, it drives the carrier body 43 to output the carrier tray 900 from the outlet end 434 of the inspection channel 432.

[0102] In summary, by setting the integrated circuit element inspection device 4 downstream of the integrated circuit element pressing device 3, and by providing the first image acquisition unit 45 and the second image acquisition unit 46 on the upper and lower sides of the inspection channel 432 respectively, the integrated circuit element inspection device 4 can perform image inspection of the top cover 803 and the substrate 801 of the integrated circuit element 800 after the pressing process using the first image acquisition unit 45 and the second image acquisition unit 46. This allows for the immediate detection of defects in the integrated circuit element 800 after pressing, enabling high-quality manufacturing.

[0103] Therefore, the integrated circuit element inspection method, the integrated circuit element inspection device 4, and the integrated circuit element manufacturing equipment 200 of the present invention are indeed quite innovative creations and can indeed achieve the purpose of the present invention.

[0104] The above description is merely an embodiment of the present invention and should not be construed as limiting the scope of the present invention. Any simple equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the patent specification of the present invention shall still fall within the scope of the patent of the present invention.

Claims

1. A method for inspecting integrated circuit components, comprising: An integrated circuit manufacturing apparatus places an integrated circuit element on a tray. The integrated circuit element includes a substrate, a chip disposed on the substrate, and a cover disposed on the substrate and covering the chip. After the integrated circuit element manufacturing equipment performs a pressing process on the integrated circuit element, the integrated circuit element manufacturing equipment then performs an inspection process on the integrated circuit element, the inspection process including: The integrated circuit element manufacturing equipment transports the tray carrying the integrated circuit element to an inspection area; The integrated circuit element manufacturing equipment is moved to a first imaging mechanism above the inspection area to take an image of the top cover of the integrated circuit element; and The integrated circuit manufacturing equipment moves to a second imaging mechanism below the inspection area to capture an image of the substrate of the integrated circuit element.

2. The method for inspecting integrated circuit components as described in claim 1, wherein, The inspection area is located on an inspection channel, which has an inlet end and an outlet end. The tray carrying the integrated circuit element is input into the inspection channel through the inlet end and transported to the inspection area. The integrated circuit element inspection method also causes the integrated circuit element manufacturing equipment to drive the tray carrying the integrated circuit element out from the outlet end of the inspection channel after the first imaging mechanism and the second imaging mechanism have completed imaging the integrated circuit element.

3. The method for inspecting integrated circuit components as described in claim 1, wherein, The integrated circuit element manufacturing equipment uses an integrated circuit element pressing device and an integrated circuit element inspection device to perform the pressing process and the inspection process, respectively.

4. The method for inspecting integrated circuit components as described in claim 1, wherein, When performing the lamination process, the integrated circuit element manufacturing equipment uses a lower die to press against the substrate of the integrated circuit element, and an upper die to apply pressure to the upper cover of the integrated circuit element, pressing it against the substrate.

5. The method for inspecting integrated circuit components as described in claim 1, wherein, The first imaging mechanism uses a first image sensor, a coaxial light source, a ring light source, and multiple strip light sources located at the same height and with adjustable illumination angles to capture an image of the top cover.

6. The method for inspecting integrated circuit components as described in claim 1, wherein, The second imaging mechanism uses a second imager, a coaxial light source, and a multi-layer ring light source to capture an image of the substrate.

7. The method for inspecting integrated circuit components as described in claim 1, wherein, The carrier disk has a mounting area for mounting the integrated circuit element and a cutout area corresponding to the mounting area. The substrate of the integrated circuit element is exposed in the cutout area, and the second imaging mechanism captures an image of the substrate through the cutout area.

8. An integrated circuit element inspection device, disposed on one side of an integrated circuit element pressing device, and equipped with: One machine; A carrying unit is provided on the machine base and is provided with an inspection channel for conveying a tray on which an integrated circuit element is placed. The inspection channel is connected to one end of a conveying channel of the integrated circuit element pressing device. A first image-capturing unit includes a first moving mechanism mounted on the machine base and a first image-capturing mechanism mounted on the first moving mechanism. The first moving mechanism can drive the first image-capturing mechanism to move above the inspection flow channel. The first image-capturing mechanism can be used to capture an image of the upper side of the integrated circuit element. A second imaging unit is provided with a second moving mechanism on the machine base and a second imaging mechanism on the second moving mechanism. The second moving mechanism can drive the second imaging mechanism to move below the inspection flow channel. The second imaging mechanism can be used to capture an image of the lower side of the integrated circuit element.

9. The integrated circuit element inspection device as claimed in claim 8, wherein, The top surface of the machine is recessed with a moving section for the second imaging mechanism to move, and the inspection channel spans above the moving section.

10. The integrated circuit element inspection apparatus as claimed in claim 8, wherein, The carrier unit has a carrier body that defines the inspection channel and a stop assembly disposed on the carrier body. The inspection channel has an inspection area for the tray to be temporarily detained. The stop assembly can selectively stop the tray to be temporarily detained in the inspection area. The stop assembly has a stop member pivotally disposed on the carrier body and adjacent to the inspection area, a drive member disposed at one end of the carrier body and away from the inspection area, and a swing member pivotally connected between the stop member and the drive member.

11. The integrated circuit element inspection apparatus as claimed in claim 8, wherein, The first image-capturing mechanism consists of, from top to bottom, a first image sensor, an upper coaxial light source, a ring-shaped light source, and multiple strip light sources located at the same height with adjustable illumination angles.

12. The integrated circuit element inspection apparatus as claimed in claim 8, wherein, The second imaging mechanism consists of a second image sensor, a coaxial light source, and a multi-layer ring light source, arranged sequentially from bottom to top.

13. An integrated circuit element inspection apparatus, which can be used to perform the inspection process of the integrated circuit element inspection method as described in any one of claims 1 to 7.

14. An integrated circuit element manufacturing apparatus for performing the integrated circuit element inspection method as described in any one of claims 1 to 7.

Images