Intelligent self-diagnostic scheme for predictable failure and extended reliability in embedded systems

Abstract

Methods and systems are described herein for monitoring and diagnosing the health of a processing unit within an embedded system using a power management integrated circuit (PMIC). The PMIC measures the current power consumption and temperature of the processing unit and compares these measurements to expected ranges derived from mission profile, mode of operation, and / or historical data. If the measurement is determined to be outside the expected range, a warning is generated to prompt a corrective action.

Description

Background Technology

[0001] Advances in vehicles and other technologies have enabled the widespread integration of embedded systems with one or more processing units. These processing units include microcontroller units (MCUs) and other electronic control units, such as those found in various embedded systems in modern vehicles. For example, in modern vehicles, MCUs manage a wide range of functions, from engine control to advanced driver assistance systems (ADAS). The reliability and lifespan of these electronic components contribute to the safety and performance of automobiles and other embedded systems.

[0002] One challenge associated with embedded systems is detecting and predicting potential failures in processing units due to aging and current drift effects. Over time, the performance of these devices (like other semiconductor devices) can degrade due to various factors such as temperature fluctuations, electrical stress, and material fatigue. This degradation can lead to increased leakage current, changes in transistor threshold voltage, and ultimately, functional failure.

[0003] Conventional methods for monitoring the health of processing units in embedded systems typically rely on periodic maintenance and diagnostics performed between service intervals. However, these methods often fail to provide sufficient warnings to prevent unexpected failures, which can compromise the safety and reliability of the embedded system. Furthermore, the lack of real-time monitoring capabilities makes it difficult to track the operating conditions and usage patterns that lead to the aging of these electronic components. Attached Figure Description

[0004] This disclosure will be better understood by referring to the accompanying drawings, which will make its many features and advantages clear to those skilled in the art. The same reference numerals are used in different drawings to indicate similar or identical items.

[0005] Figure 1 An aging curve is shown, illustrating the aging and drift effects on an embedded system.

[0006] Figure 2 A block diagram of an embedded system for monitoring and reporting aging effects using a power management integrated circuit, according to some embodiments, is shown.

[0007] Figure 3 A block diagram of a system for monitoring power and thermal conditions within an embedded processor, according to some embodiments, is shown.

[0008] Figure 4 This is a flowchart of an operating routine according to some embodiments.

[0009] Figure 5 This is a flowchart of an operating routine according to some embodiments. Detailed Implementation

[0010] Embedded systems are dedicated computing systems designed to perform specific functions or tasks within a larger system. Unlike general-purpose computers, embedded systems are typically integrated into the hardware they control and are often subject to real-time computing constraints. These systems typically comprise a combination of hardware and software, where a single embedded processing unit includes one or more processors, memory, input / output (I / O) interfaces, and executable instruction code, which is typically stored in firmware and designed to enable the processing unit to perform specific, predefined tasks. Embedded systems are commonly found in a wide variety of applications, including automotive and other vehicle systems, industrial machinery, consumer electronics, and medical devices, where they can perform critical and non-critical control, monitoring, and processing functions.

[0011] One challenge in maintaining embedded systems is the need for accurate and continuous measurement of parameters within the processing unit, such as core current and temperature. These parameters are affected by a variety of factors, including operating modes, environmental conditions, and the inherent characteristics of the semiconductor materials used in the processing unit, which can cause current drift. As used herein, current drift (or simply drift) is the gradual change over time in the amount of current drawn by a circuit or component, typically due to factors such as aging, temperature variations, or material degradation. Current drift can indicate potential problems, such as increased leakage current, changes in component characteristics, or faults in the power regulation system. Monitoring current drift is important for assessing the health and reliability of electronic systems because significant deviations from expected current levels can indicate potential problems that could lead to functional failure. Predicting potential failures and implementing preventative measures becomes challenging without accurate and timely data.

[0012] As used in this article, a mission profile is a detailed specification of the expected operating conditions and usage patterns of a system or component throughout its lifespan. In various scenarios, a mission profile includes parameters of the system or component, such as temperature range, voltage levels, load conditions, operating patterns, and the duration of exposure to these conditions. A mission profile serves as a benchmark against which the actual performance and aging of a system or component can be measured. For example, in the context of automotive or other vehicle-embedded systems, a mission profile helps define the environmental and operational stresses the system is expected to endure, allowing for the prediction of potential failures and the implementation of preventative maintenance strategies. Typically, mission profile parameters specify the operating conditions and usage patterns during the indicated lifespan. However, collecting and analyzing system monitoring data on such mission profile parameters in real time is a complex task requiring robust data acquisition and processing capabilities.

[0013] Embodiments of the technologies described herein implement diagnostic and predictive maintenance systems that can monitor the health of embedded processing units in real time, accurately measure key parameters, and analyze task profile information to predict potential failures. These embodiments include methods for real-time monitoring of key parameters (e.g., voltage, temperature, and current) and analysis of task profiles to assess the long-term reliability of the integrated system. By utilizing integrated sensors, data processing units, and communication interfaces, the described technologies enable proactive maintenance strategies, allowing for early detection of potential failures and corrective actions implemented before critical issues arise. The described embodiments can be applied to a variety of automotive and industrial applications to enhance the safety, effectiveness, and durability of electronic systems.

[0014] For ease of explanation, the examples described herein may refer to processing units of the microcontroller unit (MCU) type. It should be understood that in various embodiments and scenarios, the techniques described herein can be used and combined with other types of processing units, such as real-time processing units (RTPUs), digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), central processing units (CPUs), etc.

[0015] Figure 1 A aging curve 100 is plotted, which illustrates the aging and drift effects on the MCU by depicting the relationship between leakage current and timing margin during the MCU's operating time. The curve 100 includes an x-axis representing operating time and a y-axis representing both leakage current and timing margin, and provides a comparison between actual measurements and linear interpolation to predict functional errors.

[0016] As used herein, timing margin refers to the buffer time available within the MCU's operating cycle before a timing failure occurs. It represents the difference between the actual operating time required for a task and the maximum allowable time for the task to complete error-free. A larger timing margin indicates a more reliable system with greater tolerance for processing time variations, while a smaller timing margin indicates a higher risk of timing-related errors. In the context of the diagnostic schemes described herein, monitoring timing margin enables the detection of aging effects that may cause operational delays in the MCU, potentially leading to functional failures.

[0017] exist Figure 1 In the example, the timing margin is shown along the y-axis on the left side of the aging curve in the presence of leakage current, and decreases as the leakage current increases. The dual representation of timing margin and leakage current on the y-axis highlights their inverse relationship and the impact of increased leakage current on the timing performance of the MCU.

[0018] The actual measured value of the leakage current is indicated by the leakage current measurement curve 110, which represents the leakage current actually observed in the MCU during a certain operating time period. As the operating time increases, the actual leakage current is shown to increase, thus indicating the aging effect on the MCU.

[0019] The linear interpolation curve 120 represents the expected trend of leakage current based on the initial measurement, and is projected over time to estimate the expected increase in leakage current.

[0020] Based on the linear interpolation curve 120, a functional error is predicted at an operating time of 140. This point marks a threshold of 150, at which an increase in leakage current (or a decrease in timing margin due to aging effects) is expected to cause a functional failure in the MCU.

[0021] Figure 2 A block diagram of an embedded system 200 for monitoring and reporting aging effects in an MCU using a power management integrated circuit (PMIC) is shown according to some embodiments. System 200 includes a PMIC 210 and an MCU 260.

[0022] In the depicted embodiment, PMIC 210 is connected to a power source (e.g., a battery) 201 and includes a pre-regulator 212 that steps down the voltage from the battery level to a regulated pre-regulated voltage (VPRE) 214. This VPRE 214 is then supplied to a buck converter 216. As used herein, a buck converter is a type of DC-DC power converter configured to effectively reduce the voltage level in a power supply system, thereby allowing a lower, stable voltage to be delivered to sensitive components such as MCU 260. In the depicted embodiment, buck converter 216 further steps down the voltage to the core supply voltage (Vcore) 202 of MCU 260.

[0023] PMIC 210 also incorporates a temperature sensor 218, which provides junction temperature data to PMIC processing logic 222.

[0024] PMIC processing logic 222 manages various control and monitoring operations within PMIC 210, including power output regulation, ADC conversion initiation, and sensor data processing. This logic ensures that PMIC 210 operates effectively under varying operating conditions, including changing temperature and load. It may also include algorithms for filtering noise from sensor data, controlling switching frequencies, and processing communication protocols with MCU 260. In the depicted embodiment, PMIC 210 is configured to measure the current power consumption and current temperature (e.g., junction temperature) of MCU 260 and / or PMIC 210, and, based on the current operating mode of MCU 260, task profile information, and historical data, instructs that those measured information be provided to MCU 260 for further processing.

[0025] Analog-to-digital converter (ADC) 220 converts analog signals (e.g., analog current and temperature measurements) into digital signals for processing by PMIC 210 (via PMIC processing logic 222) and MCU 260. In some embodiments, ADC 220 receives current monitoring information from current measurement 226, which is taken from the output Vcore 202 of buck converter 216. In other embodiments, ADC 220 receives current monitoring data 227 and temperature monitoring data 228 from Vcore 204, which is fed from VPRE 214. In any alternative configuration, junction temperature sensor 264 provides its temperature reading 266 to ADC 220.

[0026] The converted digital ambient signal 230 is then transmitted to the MCU 260 via the Serial Peripheral Interface (SPI) and / or the Internal Integrated Circuit (I2C) bus 224. In various embodiments, other types of communication buses may be utilized. The SPI / I2C bus 224 is a communication interface that allows the PMIC 210 to transmit data to the MCU 260. SPI is a synchronous serial communication protocol primarily used for short-range communication in embedded systems. I2C is another synchronous communication protocol that allows multiple slave devices to be controlled by a single master. Both SPI and I2C enable the exchange of information between the PMIC 210 and the MCU 260, thereby ensuring the accurate delivery of the data required for monitoring and analysis.

[0027] Depending on the alternative system configuration employed, MCU 260 receives its operating core voltage as Vcore 202 or as Vcore 204. MCU 260 also receives temperature data from both PMIC 210 (via ambient signal 230) and internal junction temperature sensor 264. In various embodiments, temperature sensor 264 may be located elsewhere or may be used in conjunction with one or more other sensors (e.g., one or more sensors located external to the MCU) to collect ambient temperature information. Based on this information, MCU 260 is configured to determine, for example, based on task profile data 268 associated with the current operating mode of MCU 260 and / or the MCU, and / or based on historical data associated with the current operating mode of the MCU and / or its current operating mode, whether the measured current power consumption and current temperature are within the expected range of MCU 260.

[0028] In some embodiments, MCU 260 is configured to determine its expected power consumption range and / or expected temperature range based on predicted failures of the MCU. This prediction can be derived from historical performance data, task profile information, and real-time measurements collected during various operating modes. In some embodiments, MCU 260 utilizes this information to dynamically adjust the expected power consumption and / or temperature range, taking into account known aging effects or degradation modes that may lead to failure. For example, as MCU 260 approaches a predicted failure point, the expected power consumption range and temperature range can be tightened, allowing the system to detect deviations indicating further progression toward failure. This dynamic adjustment enables monitoring of the health status of MCU 260 with increased sensitivity as the probability of failure increases, thereby enabling proactive maintenance or shutdown before critical system failures occur.

[0029] Information regarding the maximum Vcore current and temperature, such as that reported by PMIC 210, is stored in MCU 260 as Maximum Vcore Current / Temperature Information 262. During operation, MCU 260 compares data received from junction temperature sensor 264 with task profile data 268 stored in its memory. Task profile data 268 includes expected maximum current versus temperature data, derived from the operating conditions the MCU is expected to encounter during its lifetime. Task profile data 268 enables the MCU to determine whether it is operating within its expected parameters or whether it is experiencing conditions that may accelerate aging or lead to potential failure. This information provides a reference for comparison with actual measurements.

[0030] The comparison determines aging information 270, which represents the difference between reference current and temperature values ​​from the mission profile and actual measurements from the PMIC 210. This aging information 270 provides insight into the current state of the MCU, thereby identifying any deviations that may indicate aging or impending failure.

[0031] MCU 260 includes a communication interface 274 that transmits aging information 270 to a telematics control unit 280. This unit, as part of the vehicle's telematics system, forwards one or more signals instructing the aging information 270 to one or more destinations. For example, in some embodiments and scenarios, the telematics control unit 280 may warn one or more entities associated with MCU 260 and / or PMIC 210, such as the MCU or the manufacturer of the merged vehicle, even if said entities are located away from the MCU. In some embodiments, the warned entity includes the driver (e.g., by activating an onboard warning system to instruct the driver to schedule maintenance operations or other modifications for the merged vehicle). In this way, MCU 260 (via communication interface 274) provides aging information 270 for remote diagnostics and / or maintenance planning.

[0032] Figure 3 A block diagram of a system 300 for monitoring power and thermal conditions within an embedded processor 370 (e.g., in some embodiments and scenarios, it may be part of a larger embedded system, not shown). System 300 integrates various monitoring components and communication paths to ensure reliable operation of processor 370 over time. This diagram depicts the interactions between PMIC 310, MCU 360, and processor 370 for monitoring voltage and temperature, and how this information is stored and transmitted for further action and / or analysis.

[0033] In the depicted embodiment, PMIC 310 includes an analog-to-digital converter (ADC) 320 that converts analog signals related to voltage and temperature into digital data. ADC 320 receives input from one or more monitoring points within the system, such as one or more current monitors, temperature sensors, etc. PMIC 310 supplies power 318 to processor 370 via the MCU's power grid 374. Additionally, PMIC 310 communicates with MCU 360 via I2C bus 322, thereby facilitating data exchange and control signaling between PMIC 310 and processor 370.

[0034] The processor 370 is housed within the MCU 360, which also includes an MCU temperature sensor 364 that monitors the thermal conditions around the processor 370. This sensor provides real-time temperature data to the processor 370, thereby helping to assess the system's thermal performance and detect potential overheating problems.

[0035] The power grid 374 within the MCU 360 distributes the power supplied by the PMIC 310 to the processor 370 and other components. In various embodiments, the processor 370 can be any type of hardware processor, such as a microcontroller, real-time processing unit, or similar device.

[0036] In the depicted embodiments, MCU 360 utilizes system bus 378 as a communication path, enabling data exchange between processor 370 and other components, and (in some scenarios) with external devices. Specifically, system bus 378 facilitates communication between processor 370 and memory 380. In some embodiments, memory 380 is non-volatile memory, allowing MCU 360 to store data (e.g., voltage and temperature readings, and operating parameters) even when system 300 is powered off. Clock signal 355 and associated clock strobe bit 356 control the timing and synchronization of processor 370 and its subsystems (e.g., via system bus 378).

[0037] In various embodiments, the operation of an embedded system, including the diagnostic operating routines described herein, is affected by one or more operating modes of the system. For example, the MCU 360 may operate in different modes depending on the specific task it is performing, environmental conditions, and overall system requirements. These operating modes may include, but are not limited to, full operating mode, standby mode, boot mode, and built-in self-test (BIST) mode.

[0038] In full operating mode, the MCU 360 performs its primary functions and manages the vehicle's systems in real time. This mode typically involves the highest levels of power consumption and processing activity, as the MCU 360 is fully engaged in controlling and monitoring the operation of its embedded system. In this mode, the MCU 360 can perform continuous diagnostics to ensure that it is operating within expected parameters given its task profile.

[0039] In standby mode, the MCU 360 reduces its power consumption and processing activity, maintaining only essential functions while awaiting further instructions or events. Standby mode is typically used when the vehicle is idle or during periods of low activity. During this mode, diagnostic tests can be scheduled less frequently or triggered by specific events to conserve energy, while still monitoring critical parameters.

[0040] Boot mode is the initial operating mode when the MCU 360 is starting up. In this mode, the MCU 360 performs internal checks and initializes its subsystems before transitioning to full operating mode. The diagnostic routines during boot mode focus on ensuring that the MCU 360 is ready to operate and that all systems are functioning correctly before the vehicle begins operation.

[0041] BIST mode is a diagnostic mode in which the MCU performs a self-evaluation to verify the integrity of its components. This mode involves running one or more predefined test sequences that stress the MCU's circuitry to detect any potential faults. The results from BIST mode are crucial for identifying problems that may not be apparent during normal operation. See the following reference... Figure 5 The described method compares results from BIST patterns with historical BIST data to assess the health of the MCU.

[0042] Typically, a specific operating mode determines the context in which the PMIC 310 measures power consumption and temperature, and how diagnostic results are interpreted. For example, the expected power consumption and thermal distribution during full operating mode will differ significantly from those in standby or boot mode. Therefore, in various embodiments, the described diagnostic routines are adapted to account for these differences, thereby ensuring that the system accurately detects potential problems under varying conditions. Understanding and considering the MCU's operating modes allows the system to provide more reliable and context-sensitive diagnostics, ultimately enhancing the security and reliability of embedded systems.

[0043] Figure 4 This is a flowchart of an operating routine 400 according to some embodiments. Routine 400 may, for example, be provided by a unit coupled to an embedded processing unit (e.g., Figure 2 MCU 260 or Figure 3 The PMIC of the MCU 360 (e.g., respectively) Figure 2 and 3 Embedded systems (e.g., PMIC210, 310) Figure 2 Embedded systems 200 or Figure 3 The system (300) is used to execute this.

[0044] Operation routine 400 begins at step 405, where a diagnostic test is initiated. In various embodiments and scenarios, the diagnostic test can be initiated by the PMIC or the MCU, depending on the system configuration and the specific monitoring strategy used. For example, the test initiation can be scheduled, event-driven, or based on predefined conditions related to the operating environment (e.g., based on data from an internal PMIC temperature sensor) or system task profile data. The routine proceeds to step 410.

[0045] At step 410, the MCU continues executing the benchmark application. In some embodiments, the benchmark application is designed to simulate typical and / or worst-case operating conditions of the MCU, thereby providing a controlled environment in which key performance indicators (such as power consumption and temperature) are measured. The routine proceeds to step 415.

[0046] At step 415, the PMIC measures the MCU's power consumption and temperature during the execution of the benchmark application. The PMIC uses internal monitoring capabilities (e.g., those mentioned above) Figure 2 The PMIC 210 (with its internal monitoring capabilities as described) is used to collect this data. After the measurement has been performed, the routine proceeds to step 420.

[0047] At step 420, the PMIC or MCU compares the measured value with the expected data value. As a non-limiting example, the expected data value can be derived based on task profile information and / or historical data (e.g., performance log data) associated with the MCU and / or its current operating mode. In some embodiments, deriving the expected data value may include calculating one or more differences between the task profile information and the actual measured value. In some embodiments, the MCU stores information indicating the measured current power consumption and current temperature measurements in non-volatile memory for future use (e.g., as historical data for the MCU when performing future diagnostic tests).

[0048] If the result is determined to be within the expected range at step 420, routine 400 proceeds to step 425, where the test is considered passed. Optionally, the result can be recorded at this point for future reference, thus providing historical data for use in subsequent tests.

[0049] However, if an anomaly is detected during the comparison at step 420—indicating a potential future failure or deviation from normal operation—the routine proceeds to step 430, where a warning is generated to notify the user of the potential problem. This warning can instruct the user to take the vehicle to an OEM dealer for further inspection or maintenance, thereby helping to prevent unexpected failures and ensuring the continued reliability of the system. As mentioned elsewhere herein, in some embodiments, the warning may be provided to one or more entities associated with the MCU, for example, via one or more communication interfaces.

[0050] Operating Routine 400 provides a series of operations for monitoring the health of the system using the PMIC and MCU, thereby allowing for proactive maintenance and reducing the likelihood of unexpected failures. By comparing real-time data with historical or expected values, the system can detect early signs of aging or drift, enabling timely intervention.

[0051] Figure 5 This is a flowchart of an operating routine 500 according to some embodiments. Routine 500 may, for example, be provided by a unit coupled to an embedded processing unit (e.g., Figure 2 MCU 260 or Figure 3 The PMIC of the MCU 360 (e.g., respectively) Figure 2 and 3 Embedded systems (e.g., PMIC210, 310) Figure 2 Embedded systems 200 or Figure 3 The system (300) is used to execute this.

[0052] Operation routine 500 begins at step 505, in which the Built-in Self-Test (BIST) is triggered. In various embodiments, the BIST may be triggered by the MCU as part of its diagnostic routine (e.g., upon first power-on or in another defined scenario). In some embodiments and scenarios, the BIST may be executed, for example, during embedded system startup or shutdown. The BIST is designed to evaluate the integrity and functionality of the MCU by running a series of internal tests that check the correct operation of the MCU's components. The routine then proceeds to step 510.

[0053] At step 510, the PMIC measures the MCU's power consumption and temperature during BIST execution. These measurements enable the assessment of whether the MCU is operating within the expected parameters during BIST. The PMIC uses its internal monitoring capabilities (e.g., those mentioned above) Figure 2 The PMIC 210 (with its internal monitoring capabilities as described) is used to collect this data. After the measurement has been performed, the routine proceeds to step 520.

[0054] At step 520, the PMIC or MCU compares the measured value with expected or historical BIST data. Expected data can be derived from the initial BIST results or from historical performance logs stored within the system. This comparison helps identify any deviations from normal operation that may indicate potential problems within the MCU. The routine evaluates whether the measured result is within the expected range.

[0055] If the result is determined to be within the expected range at step 520, routine 500 proceeds to step 525, where it is considered that BIST has been passed. Optionally, the test results may be recorded for future reference, thereby facilitating the collection of historical data that will be used in subsequent diagnoses.

[0056] However, if an anomaly is detected during the comparison at step 520—indicating a potential future fault or deviation from normal operation—the routine proceeds to step 530, where a warning is generated to notify the user of the potential problem. This warning may instruct the user to take the vehicle to an OEM dealer for further inspection or maintenance. As with other warnings described in this specification, this warning may also be transmitted via one or more communication interfaces to the relevant entity associated with the MCU.

[0057] Methods and systems for monitoring and diagnosing the health status of processing units within an embedded system using a power management integrated circuit (PMIC) are described. The PMIC measures the current power consumption and temperature of the processing unit and compares these measurements to expected ranges derived from task profiles, operating modes, and / or historical data. If a measurement is determined to be outside the expected range, a warning is generated to prompt corrective action.

[0058] The aspects of this disclosure are defined in the appended claims. In a first aspect, a system is provided, the system comprising: a processing unit including one or more processors and at least one temperature sensor; and a power management integrated circuit (PMIC) coupled to the processing unit, the PMIC being configured to: measure a current power consumption of the processing unit; and receive a current temperature measurement from the at least one temperature sensor of the processing unit; wherein one of the processing unit or the PMIC is configured to: perform a first comparison of the measured current power consumption with an expected power consumption range of the processing unit; and perform a second comparison of the current temperature measurement with an expected temperature range of the processing unit; and wherein the processing unit is configured to generate a warning in response to: determining, based on the first comparison, that the measured current power consumption is outside the expected power consumption range; or determining, based on the second comparison, that the current temperature measurement is outside the expected temperature range of the processing unit.

[0059] In some embodiments, at least one of the first comparison or the second comparison is performed as at least a portion of a diagnostic test initiated in response to one or more defined conditions associated with one or more of the operating modes or task profiles of the processing unit.

[0060] In some embodiments, diagnostic testing includes the built-in self-test (BIST) of the processing unit.

[0061] In some embodiments, the PMIC includes an internal PMIC temperature sensor, and diagnostic tests are initiated by the PMIC based at least in part on data from the internal PMIC temperature sensor.

[0062] In some embodiments, the processing unit is further configured to determine at least one of a expected power consumption range or an expected temperature range based at least in part on one or more of a group including the operating mode of the processing unit, task profile data associated with the processing unit, or historical data associated with the processing unit.

[0063] In some embodiments, at least one of the expected power consumption range or the expected temperature range is based at least in part on the predicted failure of the processing unit.

[0064] In some embodiments, the processing unit is configured to store information indicating the measured current power consumption and current temperature measurements in a non-volatile memory for future use as historical data associated with the processing unit.

[0065] In some embodiments, generating a warning includes the user of the warning processing unit performing system scheduling and maintenance operations that are incorporated into the processing unit.

[0066] In some embodiments, generating a warning includes transmitting information initiating the warning to an entity associated with the processing unit, the entity being located remotely from the processing unit.

[0067] In a second aspect, a method is provided, the method comprising: measuring the current power consumption of a processing unit by a power management integrated circuit (PMIC) coupled to the processing unit; receiving the current temperature of the processing unit by the PMIC; comparing the measured current power consumption with an expected power consumption range of the processing unit by either the processing unit or the PMIC; comparing the current temperature of the processing unit with an expected temperature range of the processing unit by either the processing unit or the PMIC; and generating a warning by the processing unit in response to the measured current power consumption being outside the expected power consumption range or the current temperature measurement being outside the expected temperature range.

[0068] In some embodiments, the measurement is performed in response to one or more defined conditions associated with one or more of the operating modes or task profiles of the processing unit.

[0069] In some embodiments, the measurement includes the built-in self-test (BIST) of the starting processing unit.

[0070] In some embodiments, receiving the current temperature of the processing unit includes receiving information indicating a first temperature from a first temperature sensor of the PMIC and information indicating a second temperature from a second temperature sensor of the processing unit.

[0071] In some embodiments, the method further includes determining at least one of a expected power consumption range or an expected temperature range based at least in part on one or more of a group including the operating mode of the processing unit, task profile data associated with the processing unit, or historical data associated with the processing unit.

[0072] In some embodiments, determining at least one of the expected power consumption range or the expected temperature range includes determining the at least one expected range based at least in part on predicted failures of the processing unit.

[0073] In some embodiments, the method further includes storing information indicating the measured current power consumption and current temperature in a non-volatile memory for future use as historical data associated with the processing unit.

[0074] In some embodiments, generating a warning includes the user of the warning processing unit performing system scheduling and maintenance operations that are incorporated into the processing unit.

[0075] In some embodiments, generating a warning includes transmitting an initial warning to an entity associated with the processing unit, the entity being located remotely from the processing unit.

[0076] In a third aspect, a non-transitory computer-readable medium is provided for storing an executable instruction set that, when executed by one or more processors, manipulates the one or more processors to: receive information from a power management integrated circuit (PMIC) coupled to the one or more processors indicating the current power consumption of the one or more processors; receive information indicating the current temperature of the one or more processors; compare the current power consumption with an expected power consumption range of a processing unit; compare the current temperature with an expected temperature range of a processing unit; and generate a warning in response to the current power consumption of the one or more processors being outside the expected power consumption range or the current temperature being outside the expected temperature range.

[0077] In some embodiments, the executable instruction set further manipulates the one or more processors to determine at least one of an expected power consumption range or an expected temperature range based at least in part on a predicted fault of at least one of the one or more processors, the predicted fault being based on one or more of a group including the operating mode of the at least one processor, task profile data associated with the at least one processor, or historical data associated with the at least one processor.

[0078] In some embodiments, certain aspects of the above-described technology can be implemented by executing software through one or more processors of a processing system. The software includes one or more sets of executable instructions stored or otherwise tangibly embodied on a non-transitory computer-readable storage medium. The software may include instructions and certain data that, when executed by the one or more processors, manipulate the one or more processors to perform one or more aspects of the technology described above. The non-transitory computer-readable storage medium may include, for example, disk or optical disk storage devices, solid-state storage devices (e.g., flash memory), caches, random access memory (RAM), or one or more other non-volatile memory devices. The executable instructions stored on the non-transitory computer-readable storage medium may be source code, assembly language code, object code, or other instruction formats that can be interpreted or otherwise executed by one or more processors.

[0079] Computer-readable storage media can include any storage medium or combination of storage media that can be accessed by a computer system during use to provide instructions and / or data to the computer system. Such storage media can include, but are not limited to, optical media (e.g., compact disc (CD), digital versatile disc (DVD), Blu-ray disc), magnetic media (e.g., floppy disk, magnetic tape, or magnetic hard disk), volatile memory (e.g., random access memory (RAM) or cache), non-volatile memory (e.g., read-only memory (ROM) or flash memory), or microelectromechanical systems (MEMS) based storage media. Computer-readable storage media can be embedded in a computing system (e.g., system RAM or ROM), fixedly attached to a computing system (e.g., magnetic hard disk), removably attached to a computing system (e.g., optical disc or USB-based flash memory), or coupled to a computer system via a wired or wireless network (e.g., network accessible storage device (NAS)).

[0080] It should be noted that not all activities or elements described in the general description above are necessary. A particular activity or part of the apparatus may be unnecessary and may perform one or more additional activities besides those described, or may include one or more additional elements besides those described. Furthermore, the order in which the activities are listed is not necessarily the order in which they are performed. These concepts have been described with reference to specific embodiments. However, those skilled in the art will understand that various modifications and changes can be made without departing from the scope of this disclosure as set forth in the appended claims. Therefore, the specification and drawings should be viewed in an illustrative rather than restrictive sense, and all such modifications are contemplated to be included within the scope of this disclosure.

[0081] Benefits, other advantages, and solutions to the problem have been described above with respect to specific embodiments. However, the benefits, advantages, solutions to the problem, and any features that may cause any benefit, advantage, or solution to appear or become more apparent should not be construed as essential, necessary, or fundamental features of any or all claims. Furthermore, the specific embodiments disclosed above are merely illustrative, as the disclosed subject matter can be modified and practiced in different but equivalent ways that will be apparent to those skilled in the art who have benefited from the teachings herein. No limitation is intended to be imposed on the details of the constructions or designs shown herein, other than those set forth in the appended claims. It is therefore apparent that the specific embodiments disclosed above can be altered or modified, and all such changes are considered to be within the scope of the disclosed subject matter. Therefore, the protection sought herein is as set forth in the appended claims.

Claims

1. A system, characterized by include: A processing unit, comprising one or more processors and at least one temperature sensor; as well as A power management integrated circuit (PMIC) coupled to the processing unit, the PMIC being configured to: Measure the current power consumption of the processing unit; and Receive the current temperature measurement value from the at least one temperature sensor of the processing unit; One of the processing units or the PMIC is configured to: Perform a first comparison between the measured current power consumption and the expected power consumption range of the processing unit; and Perform a second comparison between the current temperature measurement value and the expected temperature range of the processing unit; and The processing unit is configured to generate a warning in response to the following: Based on the first comparison, it is determined that the measured current power consumption is outside the expected power consumption range; or Based on the second comparison, it is determined that the current temperature measurement value is outside the expected temperature range of the processing unit.

2. The system according to claim 1, characterized in that, At least one of the first comparison or the second comparison is performed as at least a portion of a diagnostic test initiated in response to one or more defined conditions associated with one or more of the operating modes of the processing unit or the task profiles of the processing unit.

3. The system according to claim 2, characterized in that, The diagnostic tests include the built-in self-test (BIST) of the processing unit.

4. The system of any one of claims 2 or 3, wherein, The PMIC includes an internal PMIC temperature sensor, and the diagnostic test is initiated by the PMIC based at least in part on data from the internal PMIC temperature sensor.

5. The system of any preceding claim, wherein, The processing unit is further configured to determine at least one of the expected power consumption range or the expected temperature range based at least in part on one or more of a group including the operating mode of the processing unit, task profile data associated with the processing unit, or historical data associated with the processing unit.

6. The system of any preceding claim, wherein, At least one of the expected power consumption range or the expected temperature range is based, in part, on the predicted failure of the processing unit.

7. The system of any preceding claim, wherein, The processing unit is configured to store information indicating the measured current power consumption and the current temperature measurement in a non-volatile memory for future use as historical data associated with the processing unit.

8. The system of any preceding claim, wherein, The warning is generated for users of the processing unit who are involved in system scheduling and maintenance operations.

9. The system of any preceding claim, wherein, Generating the warning includes initiating the transmission of information indicating the warning to an entity associated with the processing unit, the entity being located away from the processing unit.

10. A method characterized by, include: The current power consumption of the processing unit is measured by a power management integrated circuit (PMIC) coupled to the processing unit; The PMIC receives the current temperature of the processing unit; The current power consumption measured by one of the processing units or the PMIC is compared with the expected power consumption range of the processing unit. The current temperature of the processing unit is compared with the expected temperature range of the processing unit by one of the processing units or the PMIC; as well as The processing unit generates a warning in response to the measured current power consumption being outside the expected power consumption range or the current temperature measurement being outside the expected temperature range.

Images