Testing device for batch testing of power devices under high temperature condition

Abstract

The invention discloses a testing device for batch testing of power devices under a high-temperature condition, which comprises a heating platform module, a testing station module, a probe module and a control system, and is characterized in that the heating platform module is used for providing a stable high-temperature testing environment for a to-be-tested device and comprises a constant-temperature heating table, a heating element, a temperature sensor and a temperature controller; the surface of the constant-temperature heating table is made of a heat-conducting ceramic chip; the test station module is used for bearing and positioning a plurality of devices to be tested and is composed of a plurality of independent test units arranged side by side, and each independent test unit comprises a to-be-tested device installation part, a heat preservation and pressurization part and a test signal leading-out part. According to the testing device for testing the power devices in batches under the high-temperature condition, the defects that in the prior art, high-temperature testing of the power devices is poor in batch performance, long in testing period, large in labor intensity, low in safety and insufficient in measuring precision are overcome.

Description

Technical Field

[0001] This invention belongs to the field of power device testing technology, specifically relating to a testing device for batch testing of power devices under high temperature conditions. Background Technology

[0002] Power devices, as core components for power conversion and control, are widely used in key areas such as new energy vehicles, industrial motor drives, renewable energy power generation, rail transit, and smart grids. Their reliability directly determines the safe and stable operation of the entire system. Power devices generate a large amount of heat during operation, leading to a significant increase in junction temperature. High temperature is a key stress factor that causes device performance degradation, parameter drift, and even failure. Therefore, accurate testing and evaluation of the electrical performance of power devices under high junction temperature conditions (such as on-resistance Rds(on), threshold voltage Vth, switching characteristics, and leakage current) is crucial for product selection, reliability prediction, and quality control.

[0003] Currently, the industry primarily employs a single-device testing mode for high-temperature testing of power devices: a single device under test (DUT) is placed in a high-temperature environmental chamber, and test signals are led out via high-temperature resistant leads to connect to external testing equipment to complete the test. This method has significant drawbacks: it can only test one device at a time, has a long testing cycle, and cannot meet the production capacity requirements for high-temperature testing of devices in large-scale production; it also requires frequent manual handling of devices and connection of circuits, resulting in high labor intensity, and the high-temperature environment poses safety risks to operators.

[0004] Some manufacturers have attempted to use multiplexers to switch channels and perform sequential testing of multiple devices. However, general-purpose multiplexers are not designed for high-temperature environments. If they are placed outside the high-temperature chamber, it will result in too many test leads, and long leads will introduce additional parasitic parameters, which will seriously affect the measurement accuracy, especially in high-current and high-speed switching tests. If they are placed inside the high-temperature chamber, they will face the problem of poor high-temperature adaptability and easy damage of multiplexers, which will also fail to guarantee the reliability and accuracy of the test. Summary of the Invention

[0005] The main objective of this invention is to provide a testing device for batch testing of power devices under high-temperature conditions. This device overcomes the shortcomings of existing technologies, such as poor batch testing capability, long testing cycle, high labor intensity, low safety, and insufficient measurement accuracy in high-temperature testing of power devices. It can provide a stable and controllable high-temperature testing environment and realize automated batch testing of multiple power devices in the same batch, thereby improving testing efficiency, reducing labor costs, ensuring operational safety, and ensuring the consistency of testing conditions and the accuracy of test results for all devices under test.

[0006] To achieve the above objectives, the present invention provides a testing apparatus for batch testing of power devices under high-temperature conditions, comprising a heating platform module, a testing station module, a probe module, and a control system, wherein: The heating platform module is used to provide a stable high-temperature testing environment for the device under test, including a constant temperature heating stage, heating element, temperature sensor and temperature controller. The surface of the constant temperature heating stage is made of thermally conductive ceramic sheet. The test station module is used to carry and position multiple devices under test (DUTs). It consists of multiple independent test units arranged side by side. Each independent test unit includes a DUT mounting section, a heat insulation and pressurization section, and a test signal output section, wherein: The device under test (DUT) mounting part is vertically arranged on the constant temperature heating stage and is equipped with a test socket for supporting the DUT. After the DUT is inserted into the test socket, the metal heat dissipation surface of the DUT is parallel to and in close contact with the surface of the thermally conductive ceramic plate of the heating platform module. The heat insulation and pressurization part is pressed against the end of the device under test away from the test base and is connected to the constant temperature heating stage; The test signal lead-out part is installed above the test socket. The test signal lead-out part is directly soldered to the device under test mounting part, thereby connecting to the corresponding node of the test socket and being used to access the pin signals of the device under test. The test signal lead-out part is provided with gold-plated copper pads as test points for probe testing. The probe module is used to achieve accurate acquisition and transmission of test signals. It includes a multi-axis robotic arm and a probe adapter plate. The multi-axis robotic arm is used for positioning in the X, Y, and Z axis directions. The probe adapter plate is fixedly installed on the end effector of the multi-axis robotic arm. The lower surface of the probe adapter plate is equipped with probes and the upper surface is provided with corresponding signal interfaces. The arrangement of the probes matches the array layout of the test points. The control system is used to coordinate the actions of each module to complete automated testing.

[0007] As a further preferred embodiment of the above technical solution, the heating element and the temperature sensor are integrated inside the constant temperature heating platform, and the temperature controller forms a closed-loop control with the temperature sensor and the heating element. The temperature adjustment range of the constant temperature heating platform is from room temperature to a preset temperature.

[0008] As a further preferred technical solution to the above technical solution, the control system is a PLC controller. The PLC controller is used to control the positioning action of the multi-axis robotic arm and establish a communication connection with an external testing machine to realize the interaction between test trigger signals and test completion signals.

[0009] As a further preferred embodiment of the above technical solution, the multi-axis robotic arm includes a first X-axis driver, a second X-axis driver, a vertical mounting plate, a Y-axis driver, and a Z-axis driver. The vertical mounting plate is mounted between the driving ends of the first X-axis driver and the second X-axis driver. The Y-axis driver is mounted on the vertical mounting plate, and the Z-axis driver is mounted on the driving end of the Y-axis driver. The probe adapter plate is mounted on the driving end of the Z-axis driver.

[0010] As a further preferred technical solution to the above technical solution, the working process of the testing device includes the following steps: Step S1: Test preparation. Insert multiple devices under test into the test sockets of each independent test unit in sequence. Then press down the pressure block of the heat preservation and pressurization part to ensure that the device under test is in close contact with the thermally conductive ceramic sheet. Step S2: Heating and heat preservation. Start the heating platform module, set the target test temperature through the temperature controller, and the heating element starts heating. The temperature sensor monitors the heating platform temperature in real time and feeds it back to the temperature controller to form a closed-loop control, so that the constant temperature heating platform temperature is stable at the preset value. Keep the temperature for a period of time to ensure that the junction temperature of all devices under test is uniform and stable to reach the target test temperature. Step S3: Probe positioning and contact. The PLC controller drives the multi-axis robotic arm to move so that the probe on the probe adapter board is precisely aligned with the test point array of the first independent test unit. Then, the Z-axis driver is controlled to move down so that the probe forms a stable electrical contact with the gold-plated copper pad test point of the test signal lead-out part. Step S4: Electrical performance test. After the probe contacts are stable, the PLC controller sends a test trigger signal to the external test machine. The external test machine performs electrical performance parameter tests on the device under test of the independent test unit according to the preset test program. Step S5: Batch cyclic testing. After the independent test unit is completed, the external tester sends a test completion signal to the PLC controller. After receiving the signal, the PLC controller controls the multi-axis robotic arm to lift the probe and then move to the next independent test unit. The actions of steps S3-S4 are repeated until all the devices under test in all independent test units have been tested. Step S6: Data processing and material change. During the test, the host computer software collects, processes and analyzes the test data of each device under test in real time. After all devices have been tested, the heating platform module stops heating and cools down. After the temperature drops to a safe range, the tested devices are removed and a new batch of devices under test is installed to enter the next batch of testing process.

[0011] The beneficial effects of this invention are as follows: 1. Enable batch testing and significantly improve testing efficiency: Through the design of multiple independent test units arranged side by side, multiple devices under test can be carried at the same time. Combined with the automated switching of test stations by robotic arms, the inefficiency of the traditional single device testing mode is avoided, the capacity requirements of high temperature testing in large-scale production are met, and the testing cycle is significantly shortened. 2. High consistency of test conditions and accurate and reliable results: All devices under test are heated through the same heating platform and direct heat conduction is used to ensure uniform junction temperature of each device; the test signal is transmitted through a short-distance probe contact + shielded coaxial cable design, which effectively reduces parasitic parameter interference and significantly improves measurement accuracy compared with traditional long lead test methods. 3. High degree of automation, reducing labor intensity and safety risks: The entire testing process is coordinated and controlled by a PLC controller. Operators only need to load and unload components before and after testing. There is no need for frequent manual intervention in the testing process, which reduces labor intensity and avoids operators from being in direct contact with high-temperature environments, thus improving operational safety. 4. Reasonable structural design and strong adaptability: The test station module adopts a modular design, which can flexibly adjust the number of independent test units according to the specifications of the device under test and the test requirements; the heating platform has a wide temperature adjustment range, which can meet the high temperature test requirements of different power devices and has a wide range of applications. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0013] Figure 2 This is a schematic diagram of the structure of the present invention.

[0014] Figure 3 This is a structural schematic diagram of the heating platform module and the testing station module of the present invention.

[0015] Figure 4 This is a schematic diagram of the installation of the device under test according to the present invention.

[0016] Figure 5 This is a schematic diagram of the probe adapter plate of the present invention.

[0017] Figure 6 This is a schematic diagram of the PCB structure of the device under test mounting section of the present invention.

[0018] Figure 7 This is a schematic diagram of the PCB structure of the test signal lead-out section of the present invention.

[0019] Figure 8 This is a schematic diagram of the PCB structure of the probe adapter board of the present invention.

[0020] The reference numerals in the attached figures include: 11, constant temperature heating stage; 21, device under test mounting section; 211, test base; 22, heat preservation and pressurization section; 23, test signal lead-out section; 231, test point; 31, multi-axis robotic arm; 311, first X-axis driver; 312, second X-axis driver; 313, vertical mounting plate; 314, Y-axis driver; 315, Z-axis driver; 32, probe adapter plate; 321, probe; 40, device under test. Detailed Implementation

[0021] The following description is intended to disclose the present invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the invention.

[0022] In the preferred embodiments of the present invention, those skilled in the art should note that the devices under test and the like involved in the present invention can be considered as prior art.

[0023] Preferred embodiment.

[0024] like Figure 1-8 As shown, this invention discloses a testing device for batch testing of power devices under high-temperature conditions, including a heating platform module, a testing station module, a probe module, and a control system, wherein: The heating platform module is used to provide a stable high-temperature testing environment for the device under test, including a constant temperature heating stage 11, heating elements, temperature sensors and temperature controllers. The surface of the constant temperature heating stage 11 is made of thermally conductive ceramic sheets. The test station module is used to carry and position multiple devices under test (DUTs). It consists of multiple independent test units arranged side by side. Each independent test unit includes a DUT mounting section 21, a heat preservation and pressurization section 22, and a test signal output section 23, wherein: The device under test (DUT) mounting section 21 is vertically disposed on the constant temperature heating stage 11 and is equipped with a test socket 211 for supporting the DUT 40. After the DUT 40 is inserted into the test socket 211, the metal heat dissipation surface of the DUT 40 is parallel and in close contact with the surface of the thermally conductive ceramic plate of the heating platform module. (The DUT mounting section is a PCB vertically placed on the constant temperature heating stage. A test socket for supporting the power device under test is mounted on the PCB. When the DUT is inserted into the test socket, its metal heat dissipation surface remains parallel and in close contact with the upper ceramic surface of the heating stage. This arrangement ensures that the heat from the heating stage can be efficiently and uniformly transferred to the die of the DUT through direct heat conduction, so that its junction temperature can quickly reach and stabilize at the target test temperature.) The heat preservation and pressurization part 22 presses against the end of the device under test 40 away from the test base 211 and is connected to the constant temperature heating stage 11 (used to press the device under test inserted into the test base tightly to ensure close contact between the device under test and the surface of the thermally conductive ceramic sheet). The test signal lead-out part 23 is mounted above the test socket 211. The test signal lead-out part 23 (through a specific PCB structure) is directly soldered to the device under test mounting part 21, thereby connecting to the corresponding node of the test socket 211 and used to access the pin signals of the device under test 40. The test signal lead-out part 23 is provided with gold-plated copper pads as test points 231 for probe testing (the test signal lead-out part is mounted on the PCB above the test socket, and a 5mm gold-plated copper pad is mounted on the PCB). The probe module is used to achieve accurate acquisition and transmission of test signals. It includes a multi-axis robotic arm 31 and a probe adapter plate 32. The multi-axis robotic arm 31 is used for positioning in the X, Y, and Z axis directions, and the probe adapter plate 32 is fixedly installed on the end effector of the multi-axis robotic arm 31. The probe adapter plate 32 has probes 321 installed on its lower surface and corresponding signal interfaces (BNC interfaces, used for connecting the device to the testing machine during Kelvin four-wire testing) on ​​its upper surface. The arrangement of the probes 321 matches the array layout of the test points 231. The control system is used to coordinate the actions of each module to complete automated testing.

[0025] Specifically, the heating element and the temperature sensor are integrated inside the constant temperature heating platform 11. The temperature controller, the temperature sensor, and the heating element form a closed-loop control. The temperature adjustment range of the constant temperature heating platform 11 is from room temperature to a preset temperature (200°C).

[0026] More specifically, the control system is a PLC controller, which is used to control the positioning action of the multi-axis robotic arm and establish a communication connection with the external testing machine to realize the interaction of test trigger signals and test completion signals (its core functions include: controlling the movement and positioning of the multi-axis robotic arm in the X, Y, and Z directions to ensure accurate and reliable contact between the probe and the test point; establishing a communication connection with the external testing machine to realize the interaction of test trigger signals and test completion signals, and coordinating the orderly progress of the test process).

[0027] Furthermore, the multi-axis robotic arm 31 includes a first X-axis driver 311, a second X-axis driver 312, a vertical mounting plate 313, a Y-axis driver 314, and a Z-axis driver 315. The vertical mounting plate 313 is mounted between the driving end of the first X-axis driver 311 and the driving end of the second X-axis driver 312. The Y-axis driver 314 is mounted on the vertical mounting plate 313, and the Z-axis driver 315 is mounted on the driving end of the Y-axis driver 314. The probe adapter plate 32 is mounted on the driving end of the Z-axis driver 315.

[0028] Furthermore, the working process of the testing device includes the following steps: Step S1: Test preparation. Insert multiple devices under test 40 into the test sockets 211 of each independent test unit in sequence. Then press down the pressure block of the heat preservation and pressurization part 22 to ensure that the device under test 40 is in close contact with the thermally conductive ceramic sheet. Step S2: Heating and heat preservation. Start the heating platform module, set the target test temperature through the temperature controller, and the heating element starts heating. The temperature sensor monitors the temperature of the heating platform in real time and feeds back to the temperature controller to form a closed-loop control, so that the temperature of the constant temperature heating platform 11 is stable at the preset value. Keep it warm for a period of time to ensure that the junction temperature of all devices under test 40 is uniform and stable to reach the target test temperature. Step S3: Probe positioning and contact. The PLC controller drives the multi-axis robotic arm 31 to move, so that the probe 321 on the probe adapter plate 32 is precisely aligned with the test point 231 array of the first independent test unit. Then, the Z-axis driver 315 is controlled to move down, so that the probe 321 forms a stable electrical contact with the gold-plated copper pad test point 231 of the test signal lead-out part. Step S4: Electrical performance test. After probe 321 makes stable contact, the PLC controller sends a test trigger signal to the external test machine. The external test machine performs electrical performance parameter tests on the device under test 40 of the independent test unit according to the preset test program. Step S5: Batch cyclic testing. After the independent test unit is completed, the external tester sends a test completion signal to the PLC controller. After receiving the signal, the PLC controller controls the multi-axis robotic arm 31 to lift the probe 321 and then move to the next independent test unit. The actions of steps S3-S4 are repeated until all the devices under test 40 in all independent test units have completed the test. Step S6: Data processing and material change. During the test, the host computer software collects, processes and analyzes the test data of each device under test in real time. After all devices have been tested, the heating platform module stops heating and cools down (through a fan). After the temperature drops to a safe range, the tested devices are removed and a new batch of devices under test is installed to enter the next batch of testing process.

[0029] It is worth mentioning that the technical features such as the device under test involved in this patent application should be regarded as prior art. The specific structure, working principle and possible control method and spatial arrangement of these technical features can be conventionally selected in the field and should not be regarded as the inventive point of this patent. This patent will not be further elaborated in detail.

[0030] For those skilled in the art, modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this invention should be included within the protection scope of this invention.

Claims

1. A testing apparatus for batch testing power devices under high temperature conditions, characterized in that, It includes a heating platform module, a testing station module, a probe module, and a control system, among which: The heating platform module is used to provide a stable high-temperature testing environment for the device under test, including a constant temperature heating stage, heating element, temperature sensor and temperature controller. The surface of the constant temperature heating stage is made of thermally conductive ceramic sheet. The test station module is used to carry and position multiple devices under test (DUTs). It consists of multiple independent test units arranged side by side. Each independent test unit includes a DUT mounting section, a heat insulation and pressurization section, and a test signal output section, wherein: The device under test (DUT) mounting part is vertically arranged on the constant temperature heating stage and is equipped with a test socket for supporting the DUT. After the DUT is inserted into the test socket, the metal heat dissipation surface of the DUT is parallel to and in close contact with the surface of the thermally conductive ceramic plate of the heating platform module. The heat insulation and pressurization part is pressed against the end of the device under test away from the test base and is connected to the constant temperature heating stage; The test signal lead-out part is installed above the test socket. The test signal lead-out part is directly soldered to the device under test mounting part, thereby connecting to the corresponding node of the test socket and being used to access the pin signals of the device under test. The test signal lead-out part is provided with gold-plated copper pads as test points for probe testing. The probe module is used to achieve accurate acquisition and transmission of test signals. It includes a multi-axis robotic arm and a probe adapter plate. The multi-axis robotic arm is used for positioning in the X, Y, and Z axis directions. The probe adapter plate is fixedly installed on the end effector of the multi-axis robotic arm. The lower surface of the probe adapter plate is equipped with probes and the upper surface is provided with corresponding signal interfaces. The arrangement of the probes matches the array layout of the test points. The control system is used to coordinate the actions of each module to complete automated testing.

2. The testing apparatus for batch testing power devices under high temperature conditions according to claim 1, characterized in that, The heating element and the temperature sensor are integrated inside the constant temperature heating platform. The temperature controller, the temperature sensor, and the heating element form a closed-loop control. The temperature adjustment range of the constant temperature heating platform is from room temperature to a preset temperature.

3. The testing apparatus for batch testing power devices under high temperature conditions according to claim 2, characterized in that, The control system is a PLC controller, which is used to control the positioning action of the multi-axis robotic arm and establish a communication connection with an external testing machine to realize the interaction between test trigger signals and test completion signals.

4. The testing apparatus for batch testing power devices under high temperature conditions according to claim 3, characterized in that, The multi-axis robotic arm includes a first X-axis driver, a second X-axis driver, a vertical mounting plate, a Y-axis driver, and a Z-axis driver. The vertical mounting plate is mounted between the driving ends of the first X-axis driver and the second X-axis driver. The Y-axis driver is mounted on the vertical mounting plate, and the Z-axis driver is mounted on the driving end of the Y-axis driver. The probe adapter plate is mounted on the driving end of the Z-axis driver.

5. The testing apparatus for batch testing power devices under high temperature conditions according to claim 4, characterized in that, The working process of the testing device includes the following steps: Step S1: Test preparation. Insert multiple devices under test into the test sockets of each independent test unit in sequence. Then press down the pressure block of the heat preservation and pressurization part to ensure that the device under test is in close contact with the thermally conductive ceramic sheet. Step S2: Heating and heat preservation. Start the heating platform module, set the target test temperature through the temperature controller, and the heating element starts heating. The temperature sensor monitors the heating platform temperature in real time and feeds it back to the temperature controller to form a closed-loop control, so that the constant temperature heating platform temperature is stable at the preset value. Keep the temperature for a period of time to ensure that the junction temperature of all devices under test is uniform and stable to reach the target test temperature. Step S3: Probe positioning and contact. The PLC controller drives the multi-axis robotic arm to move so that the probe on the probe adapter board is precisely aligned with the test point array of the first independent test unit. Then, the Z-axis driver is controlled to move down so that the probe forms a stable electrical contact with the gold-plated copper pad test point of the test signal lead-out part. Step S4: Electrical performance test. After the probe contacts are stable, the PLC controller sends a test trigger signal to the external test machine. The external test machine performs electrical performance parameter tests on the device under test of the independent test unit according to the preset test program. Step S5: Batch cyclic testing. After the independent test unit is completed, the external tester sends a test completion signal to the PLC controller. After receiving the signal, the PLC controller controls the multi-axis robotic arm to lift the probe and then move to the next independent test unit. The actions of steps S3-S4 are repeated until all the devices under test in all independent test units have been tested. Step S6: Data processing and material change. During the test, the host computer software collects, processes and analyzes the test data of each device under test in real time. After all devices have been tested, the heating platform module stops heating and cools down. After the temperature drops to a safe range, the tested devices are removed and a new batch of devices under test is installed to enter the next batch of testing process.

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