Atomic clock temperature control and signal detection method, device and system

Abstract

The invention discloses an atomic clock temperature control and signal detection method, device and system, and the method comprises the steps: constructing a combined temperature control structure of an annular micro-channel heating array attached to the inner wall of a coating buffer gas atomic gas chamber and a distributed temperature sensing probe, and carrying out the three-dimensional space partition temperature control of the atomic gas chamber through the combined temperature control structure, meanwhile, the response time of a temperature control algorithm is optimized; a signal processing module is built at the rear end of a photoelectric detector of an atomic clock, and the signal processing module comprises a phase-locked amplification circuit with a self-adaptive threshold value, a low-noise pre-amplifier with light intensity pre-amplification and a filter circuit; a transmission light signal output by the photoelectric detector is processed through the signal processing module, and the cut-off frequency and the bandwidth of the filter circuit are matched and optimized according to the characteristics of the transmission light signal. The atomic energy level is kept consistent through a stable temperature environment, and the precision of atomic clock frequency detection is improved through high-quality signal processing.

Description

Technical Field

[0001] This invention relates to the field of precision spectral detection technology, and in particular to a method, apparatus and system for atomic clock temperature control and signal detection. Background Technology

[0002] This section is intended to provide background or context for the embodiments of this application set forth in the claims. The description herein is not an admission that it is prior art simply because it is included in this section.

[0003] Atomic gas chambers are typically constructed using glass fusion to create a sealed, light-transmitting cavity, filled with a combination of inert gases and alkali metal atoms to manipulate and detect microscopic atoms. Atomic clocks use atomic gas chambers for frequency measurement. However, the output frequency of atomic clocks is easily affected by changes in ambient temperature, primarily because temperature variations cause shifts in atomic energy levels, thus affecting the clock's frequency output. To improve the frequency output stability of atomic clocks in the face of temperature changes, one can focus on the intrinsic properties of the atomic gas chamber, mainly by developing atomic gas chambers with low temperature drift coefficients. Currently, most methods for developing atomic gas chambers with low temperature drift coefficients focus on obtaining the temperature frequency shift coefficient through theoretical calculations and experiments, and optimizing the buffer gas ratio. The principle is to fill the atomic gas chamber with a certain proportion of buffer gas combination to counteract the temperature frequency shift, constructing a gas chamber with low temperature sensitivity characteristics at specific temperatures. This approach has shortcomings: firstly, under given ratios and pressures, the atomic gas chamber only possesses a low temperature drift coefficient within a very small temperature range, lacking operational flexibility; secondly, it is difficult to simultaneously achieve low temperature sensitivity and a high signal-to-noise ratio. A gas chamber with a low temperature sensitivity coefficient over a wide temperature range is needed, along with a high signal-to-noise ratio, to support the operation of a high-precision atomic clock. Summary of the Invention

[0004] One objective of this application is to provide a method for temperature control and signal detection of an atomic clock, thereby maintaining consistent atomic energy levels through a stable temperature environment. Another objective of this application is to provide a device for temperature control and signal detection of an atomic clock. A further objective of this application is to provide a system for temperature control and signal detection of an atomic clock.

[0005] To achieve the above objectives, this application discloses a method for atomic clock temperature control and signal detection, the method comprising: A combined temperature control structure is constructed, consisting of an annular microchannel heating array and a distributed temperature sensing probe attached to the inner wall of the atomic gas chamber of the coated buffer gas. The combined temperature control structure is used to perform three-dimensional spatial partitioning temperature control of the atomic gas chamber, while optimizing the response time of the temperature control algorithm. A signal processing module is built at the back end of the photodetector of the atomic clock. The signal processing module includes an adaptive threshold lock-in amplifier circuit, a low-noise preamplifier with light intensity preamplification, and a filtering circuit. The signal processing module processes the transmitted light signal output by the photodetector, and the cutoff frequency and bandwidth of the filter circuit are matched and optimized according to the characteristics of the transmitted light signal.

[0006] Optionally, the combined temperature control structure, which integrates an annular microchannel heating array fitted to the inner wall of the coated buffer gas atomic chamber with a distributed temperature sensing probe, includes: Based on the inner wall contour dimensions of the coated buffer gas atomic chamber, the channel diameter, arrangement density, and number of annular layers of the annular microchannel heating array are designed. Based on the three-dimensional spatial zoning requirements of the atomic gas chamber, the number of detection points of the distributed temperature sensing probes and the installation position of each point on the inner wall of the gas chamber are determined. The designed annular microchannel heating array is attached and fixed to the inner wall of the atomic gas chamber, and distributed temperature sensing probes are installed at preset detection points to form a combined temperature control structure.

[0007] Optionally, the step of designing the channel diameter, arrangement density, and number of annular layers of the annular microchannel heating array based on the inner wall contour dimensions of the coated buffer gas atomic chamber includes: Measure the inner wall diameter, length, and wall thickness of the coated buffer gas atomic chamber to determine the suitable installation space range for the annular microchannel heating array; Based on the aforementioned installation space range, the channel diameter of the annular microchannel, the spacing between adjacent annular channels, and the number of annular layers are set.

[0008] Optionally, the three-dimensional spatial partitioning temperature control of the atomic gas chamber through the combined temperature control structure includes: The temperature data of the air chamber at each detection point is collected in real time by distributed temperature sensing probes, and the collected temperature data is transmitted to the temperature control algorithm module. The temperature control algorithm module calculates the temperature deviation value of each zone based on the target temperature of each temperature control zone and the real-time collected temperature data; Based on the temperature deviation value, a heating power adjustment signal is output to the microchannel of the corresponding partition in the annular microchannel heating array to control the heating power of the microchannel in that partition and achieve independent temperature regulation of each partition.

[0009] Optionally, the step of outputting a heating power adjustment signal to the microchannels of the corresponding partition in the annular microchannel heating array includes: When the temperature deviation is positive, the heating power of the corresponding microchannel is increased according to the preset power adjustment coefficient based on the magnitude of the deviation. When the temperature deviation is negative, the heating power of the corresponding microchannel is decreased according to the preset power adjustment coefficient based on the magnitude of the deviation. After adjusting the heating power, the temperature data of the corresponding zone is collected again by distributed temperature sensing probes to verify whether the temperature has reached the target temperature.

[0010] Optionally, the step of building a signal processing module at the back end of the photodetector of the atomic clock includes: The input terminal of the low-noise preamplifier with light intensity preamplification is connected to the signal output terminal of the photodetector via a shielded cable. Connect the signal output of the low-noise preamplifier to the signal input of the adaptive threshold lock-in amplifier circuit, and simultaneously connect the reference frequency signal of the atomic clock to the reference signal input of the lock-in amplifier circuit. Connect the signal output terminal of the lock-in amplifier circuit to the signal input terminal of the filter circuit to complete the construction of the signal processing module.

[0011] Optionally, connecting the signal output terminal of the low-noise preamplifier to the signal input terminal of the adaptive threshold lock-in amplifier circuit includes: Select a shielded cable with a preset impedance matching value and gold-plat both ends of the cable to reduce impedance loss during signal transmission. Connect one end of the shielded cable to the signal output interface of the photodetector via an adapter, and connect the other end to the signal input interface of the low-noise preamplifier via an adapter of the same specification. The outer shielding layer of the shielded cable is grounded, and the grounding resistance is controlled within a preset threshold to reduce the impact of external electromagnetic interference on signal transmission.

[0012] Optionally, the cutoff frequency and bandwidth of the filter circuit are optimized for matching based on the characteristics of the transmitted light signal, including: Collect the transmitted light signal output by the photodetector, analyze the frequency range and noise distribution characteristics of the signal, and determine the effective frequency range of the signal; Based on the effective frequency range, the high-pass cutoff frequency and low-pass cutoff frequency of the filter circuit are set so that the bandwidth of the filter circuit covers the effective frequency range of the signal, so as to retain the effective signal and filter out noise outside the range. The filter circuit with the cutoff frequency and bandwidth set is connected to the signal processing module, and the noise suppression effect of the filtered signal is tested.

[0013] Another aspect of this application discloses an atomic clock temperature control and signal detection device, the device comprising: Optimize the temperature control module: Construct a combined temperature control structure of a ring-shaped microchannel heating array and a distributed temperature sensing probe that fits the inner wall of the atomic gas chamber of the coated buffer gas. The combined temperature control structure performs three-dimensional spatial partitioning temperature control of the atomic gas chamber, while optimizing the response time of the temperature control algorithm. Signal processing module: A signal processing module is built at the back end of the photodetector of the atomic clock. The signal processing module includes an adaptive threshold lock-in amplifier circuit, a low-noise preamplifier with light intensity pre-amplification, and a filtering circuit. Matching optimization module: The signal processing module processes the transmitted light signal output by the photodetector, and the cutoff frequency and bandwidth of the filter circuit are matched and optimized according to the characteristics of the transmitted light signal.

[0014] In another aspect, this application proposes an atomic clock temperature control and signal detection system, the system comprising the atomic clock temperature control and signal detection device as described above.

[0015] The beneficial effects of this application are as follows: This application discloses an atomic clock temperature control and signal detection method. By constructing a combined temperature control structure of a ring-shaped microchannel heating array attached to the inner wall of the atomic gas chamber with a film-coated buffer gas and a distributed temperature sensing probe, three-dimensional spatial partitioned temperature control of the atomic gas chamber is achieved. A signal processing module including an adaptive threshold lock-in amplifier circuit, a low-noise preamplifier, and a filtering circuit is built at the back end of the photodetector. The low-noise preamplifier enhances the amplitude of the weak transmitted light signal, and the adaptive threshold lock-in amplifier circuit extracts the target signal of atomic transition. Combined with a filtering circuit optimized to match the characteristics of the transmitted light signal, noise interference is effectively filtered out, and the signal-to-noise ratio and quality of the signal are improved. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings: Figure 1 This is a flowchart illustrating a specific embodiment of the atomic clock temperature control and signal detection method according to an embodiment of this application; Figure 2 The flowcharts of specific embodiments S110-S130 of the atomic clock temperature control and signal detection method according to the present application are shown. Figure 3 The flowcharts of specific embodiments S111-S112 of the atomic clock temperature control and signal detection method of this application are shown. Figure 4 The flowcharts of specific embodiments S140-S160 of the atomic clock temperature control and signal detection method according to the present application are shown. Figure 5The flowcharts of specific embodiments S161-S162 of the atomic clock temperature control and signal detection method of this application are shown. Figure 6 The flowcharts of specific embodiments S210-S230 of the atomic clock temperature control and signal detection method according to the present application are shown. Figure 7 The flowcharts of specific embodiments S221-S223 of the atomic clock temperature control and signal detection method of this application are shown. Figure 8 The flowcharts of specific embodiments S310-S330 of the atomic clock temperature control and signal detection method according to the present application are shown. Figure 9 The diagram illustrates a specific example of a specific embodiment of the atomic clock temperature control and signal detection method according to this application. Figure 10 A schematic diagram showing the temperature sensitivity coefficients of atomic chambers with different buffer gas pressures in the atomic clock temperature control and signal detection methods of this application is illustrated. Figure 11 This diagram illustrates the structure of the atomic clock temperature control and signal detection device according to an embodiment of this application. Figure 12 A schematic diagram of the structure of a computer programmable logic device used to implement embodiments of the present invention is shown. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. In the description of the embodiments of this application, unless otherwise stated, " / " indicates "or," for example, A / B can mean A or B; "and / or" in the text is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more than two.

[0018] It should be understood that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "include" and "have," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or programmable logic device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or programmable logic devices.

[0019] References to embodiments in this application mean that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0020] In order to solve at least one of the problems existing in the prior art, according to one aspect of this application, such as Figure 1 As shown in the figure, this embodiment discloses a method for atomic clock temperature control and signal detection, the method comprising: S100: Construct a combined temperature control structure of an annular microchannel heating array and a distributed temperature sensing probe that fits the inner wall of the atomic gas chamber of the film-coated buffer gas chamber. The combined temperature control structure is used to perform three-dimensional spatial partitioning temperature control of the atomic gas chamber, while optimizing the response time of the temperature control algorithm.

[0021] Specifically, the atomic clock temperature control and signal detection methods mainly revolve around the temperature control and transmitted light signal processing of the coated buffer gas atomic chamber. The aim is to improve the frequency stability and signal detection accuracy of the atomic clock by optimizing the temperature control structure and signal processing flow. It should be noted that the coated buffer gas atomic chamber is a component of the atomic clock. It is filled with alkali metals and a specific background gas, and its inner wall is coated with an anti-relaxation coating. This structure is designed to reduce the loss of optical polarization after collisions between atoms and the inner wall of the gas chamber, while simultaneously limiting the thermal motion rate of atoms through the buffer gas, thereby providing a stable environment for atomic-laser interaction. In practical applications, a combined temperature control structure needs to be constructed, consisting of a ring-shaped microchannel heating array fitted to the inner wall of the atomic chamber and distributed temperature sensing probes. The ring-shaped microchannel heating array is based on the contour features of the inner wall of the atomic chamber, allowing it to fit tightly to the inner wall for uniform heating. The distributed temperature sensing probes are used to acquire temperature information of different areas of the chamber in real time. The combined temperature control structure can overcome the limitations of traditional monolithic temperature control and achieve zoned temperature control of the three-dimensional space of the chamber.

[0022] S200: A signal processing module is built at the back end of the photodetector of the atomic clock. The signal processing module includes an adaptive threshold lock-in amplifier circuit, a low-noise preamplifier with light intensity pre-amplification, and a filtering circuit.

[0023] Specifically, the photodetector converts the laser signal passing through the atomic gas cell into an electrical signal, i.e., a transmitted light signal. However, this electrical signal is often subject to noise interference and has a weak amplitude, making it difficult to use directly for frequency calculation of the atomic clock. Therefore, it is necessary to build a signal processing module that includes an adaptive threshold lock-in amplifier circuit, a low-noise preamplifier with light intensity preamplification, and a filtering circuit.

[0024] S300: The signal processing module processes the transmitted light signal output by the photodetector, and the cutoff frequency and bandwidth of the filter circuit are matched and optimized according to the characteristics of the transmitted light signal.

[0025] The cutoff frequency and bandwidth of the filter circuit need to be matched and optimized according to the characteristics of the transmitted light signal. This is because the frequency range and noise distribution of the transmitted light signal will differ under different operating conditions. Only by adapting the parameters of the filter circuit to the signal characteristics can noise be filtered out more effectively and the effective signal be retained. This application is not limited to this. In practical applications, the details of temperature control and signal processing can also be adjusted according to the specific type of atomic clock.

[0026] In alternative implementations, such as Figure 2 As shown, the combined temperature control structure, which integrates a ring-shaped microchannel heating array that conforms to the inner wall of the coated buffer gas atomic chamber with a distributed temperature sensing probe, includes: S110: Based on the inner wall contour dimensions of the coating buffer gas atomic chamber, design the channel diameter, arrangement density, and number of annular layers of the annular microchannel heating array.

[0027] Specifically, the inner wall contour dimensions are obtained by collecting data on the inner wall morphology of the air chamber using specialized dimensional measuring equipment, including characteristic parameters such as the degree of curvature and overall length. The design of the channel diameter, arrangement density, and number of annular layers in the ring-shaped microchannel heating array is intended to ensure that the heating array adapts to the inner wall of the air chamber and prevents localized overheating or underheating during the heating process. For example, if there is a significant curvature change in the inner wall of the air chamber, the number of annular layers and the channel arrangement density need to be adjusted so that each annular channel can fit the corresponding position of the inner wall, thus providing a structural basis for subsequent zoned heating.

[0028] S120: Based on the three-dimensional spatial zoning requirements of the atomic gas chamber, determine the number of detection points of the distributed temperature sensing probes and the installation position of each point on the inner wall of the gas chamber.

[0029] Specifically, the determination of the number and installation location of detection points is based on the three-dimensional spatial zoning requirements of the atomic gas chamber. This zoning is based on the volume and temperature distribution characteristics of the atomic gas chamber. Typically, the temperature in different areas of the chamber varies due to the influence of the external environment and internal atomic movement. If a detection point is placed at only a single location, it cannot comprehensively reflect the temperature distribution within the chamber. Therefore, based on the three-dimensional spatial characteristics of the chamber, multiple temperature control zones need to be defined, and corresponding detection points need to be configured for each zone, enabling real-time monitoring of the temperature in each zone.

[0030] S130: The designed annular microchannel heating array is attached and fixed to the inner wall of the atomic gas chamber, and distributed temperature sensing probes are installed at preset detection points to form a combined temperature control structure.

[0031] Specifically, during installation, the annular microchannel heating array must be tightly fitted to the inner wall of the gas chamber. This fit is achieved by using a flexible installation material to eliminate gaps between the heating array and the inner wall, preventing heat loss due to these gaps. Simultaneously, when installing the distributed temperature sensing probes at the preset detection points, stable contact between the probes and the inner wall of the gas chamber must be ensured. Stable contact allows the probes to collect temperature data at the corresponding points, avoiding temperature measurement errors caused by poor contact. The resulting combined temperature control structure enables simultaneous temperature monitoring and zoned heating functions, providing hardware support for subsequent temperature control.

[0032] In alternative implementations, such as Figure 3 As shown, the design of the channel diameter, arrangement density, and number of annular layers of the annular microchannel heating array based on the inner wall contour dimensions of the coated buffer gas atomic chamber includes: S111: Measure the inner wall diameter, length, and wall thickness of the coating buffer gas atomic chamber to determine the suitable installation space range for the annular microchannel heating array.

[0033] Specifically, determining the suitable installation space range requires using the inner wall diameter, length, and wall thickness of the coated buffer gas atomic chamber as basic parameters. These parameters are obtained by acquiring the physical dimensions of the chamber using high-precision measuring equipment. The inner wall diameter reflects the size of the chamber's cross-section, the inner wall length reflects the axial dimension, and the wall thickness reflects the thickness of the chamber wall. These three factors together determine the spatial boundaries for the heating array to be installed. For example, if the inner wall diameter of the chamber is small, the diameter of the annular channel of the heating array needs to be reduced accordingly to avoid exceeding the inner wall's range and preventing installation. If the inner wall length of the chamber is long, it is necessary to consider increasing the number of annular layers to ensure axial heating coverage. Determining the suitable installation space range using these parameters serves to define a reasonable range for the subsequent design of the heating array's specific parameters, preventing the designed heating array from being incompatible with the chamber.

[0034] S112: Based on the aforementioned adaptation installation space range, set the channel diameter of the annular microchannel, the spacing between adjacent annular channels, and the number of annular layers.

[0035] Specifically, the setup process is based on the suitable installation space range determined in the first step. The principle of the setup is to adjust the channel diameter, spacing, and number of layers within the space to ensure that the heating array can cover the key areas of the gas chamber wall and achieve uniform heat transfer during heating. For example, if the axial length of the suitable installation space range is long, the number of annular layers can be appropriately increased while controlling the spacing between adjacent annular channels to avoid uneven axial temperature distribution due to excessive spacing; if the cross-section of the suitable installation space range is small, the channel diameter can be reduced to allow the annular channels to fit snugly against the inner wall. It should be noted that the channel diameter, spacing, and number of layers are not fixed and this application is not limited to them. In actual design, these parameters can be flexibly adjusted according to the specific temperature control requirements of the gas chamber.

[0036] In alternative implementations, such as Figure 4 As shown, the three-dimensional spatial partitioning temperature control of the atomic gas chamber through the combined temperature control structure includes: S140: Collects air chamber temperature data at each detection point in real time through distributed temperature sensing probes, and transmits the collected temperature data to the temperature control algorithm module.

[0037] Specifically, the temperature data acquisition is primarily handled by distributed temperature sensing probes. The acquisition principle involves using temperature-sensitive elements within the probes to convert temperature changes in the air chamber walls into electrical signals, thereby obtaining temperature data at each detection point. The acquisition process is real-time, ensuring timely capture of dynamic temperature changes within the air chamber and preventing information lag caused by excessively long acquisition intervals. The acquired temperature data is then transmitted to the temperature control algorithm module via data transmission lines. This transmission converts the temperature data into digital signals that the algorithm module can recognize, either electrical or optical, providing the necessary data for calculations.

[0038] S150: The temperature control algorithm module calculates the temperature deviation value of each temperature control zone based on the target temperature of each zone and the real-time collected temperature data.

[0039] Specifically, the temperature deviation value is calculated primarily by the temperature control algorithm module, based on the target temperature of each temperature control zone and the real-time collected temperature data. The target temperature is determined according to the operational requirements of the atomic clock. Different types of atomic clocks have different optimal operating temperatures for their internal atoms, and the target temperature must be set to a value that allows the atoms to maintain a stable energy level state. The calculation principle is to subtract the corresponding target temperature from the real-time temperature data of each zone; the difference is the temperature deviation value. If the difference is positive, it indicates that the real-time temperature is lower than the target temperature; if the difference is negative, it indicates that the real-time temperature is higher than the target temperature. The purpose of the temperature deviation value is to reflect the degree of deviation between the temperature of each zone and the target temperature, providing a judgment standard for subsequent heating power adjustment.

[0040] S160: Based on the temperature deviation value, output a heating power adjustment signal to the microchannel of the corresponding partition in the annular microchannel heating array to control the heating power of the microchannel in that partition to achieve independent temperature control of each partition.

[0041] Specifically, the adjustment is based on the temperature deviation value calculated in the second step, and the main body of the adjustment is the microchannels of the corresponding partition in the annular microchannel heating array. The principle of adjustment is to output a heating power adjustment signal to the corresponding microchannel according to the sign and magnitude of the temperature deviation value. The function of the signal is to control the power output of the heating element inside the microchannel. When it is necessary to increase the temperature, the heating power is increased; when it is necessary to decrease the temperature, the heating power is decreased. Each partition's microchannel independently receives and executes the adjustment signal, realizing independent temperature control of each partition. This independent control avoids temperature interference between different partitions, enabling each partition to quickly reach and maintain the target temperature, thereby providing a stable environment for the atoms in the atomic chamber, reducing atomic energy level shifts caused by temperature fluctuations, and improving the frequency stability of the atomic clock.

[0042] In alternative implementations, such as Figure 5 As shown, the step of outputting a heating power adjustment signal to the microchannels of the corresponding partition in the annular microchannel heating array includes: S161: When the temperature deviation is positive, the heating power of the corresponding microchannel is increased according to the preset power adjustment coefficient based on the magnitude of the deviation. When the temperature deviation is negative, the heating power of the corresponding microchannel is decreased according to the preset power adjustment coefficient based on the magnitude of the deviation.

[0043] Specifically, the temperature deviation value is calculated by the temperature control algorithm module. The calculation method involves subtracting the target temperature data from the real-time temperature data of each zone. Its function is to determine the direction and degree of deviation between the real-time temperature and the target temperature. When the temperature deviation value is positive, it indicates that the real-time temperature is lower than the target temperature, and the heating power needs to be increased to raise the temperature. When the temperature deviation value is negative, it indicates that the real-time temperature is higher than the target temperature, and the heating power needs to be reduced to lower the temperature. Adjusting the heating power must follow a preset power adjustment coefficient. This preset power adjustment coefficient is determined based on a large amount of experimental data. Its function is to match the adjustment range of the heating power with the temperature deviation value, avoiding temperature overshoot due to excessive adjustment or slow temperature adjustment due to insufficient adjustment. For example, if the temperature deviation value is small, a smaller power adjustment amount is output according to the power adjustment coefficient; if the temperature deviation value is large, a larger power adjustment amount is output to achieve fast and stable temperature adjustment.

[0044] S162: After adjusting the heating power, the temperature data of the corresponding zone is collected again by the distributed temperature sensor probe to verify whether the temperature has reached the target temperature.

[0045] Specifically, the verification involves a distributed temperature sensing probe. The verification principle is that after adjusting the heating power, the probe re-collects temperature data for the corresponding zone, using the same method as the initial collection: converting temperature into an electrical signal through a temperature-sensitive element. The newly collected temperature data is then transmitted to the temperature control algorithm module, which compares the new temperature data with the target temperature to determine if the target temperature has been reached. The purpose of verification is to confirm the accuracy of temperature regulation and avoid situations where the temperature fails to meet the target due to errors in the power adjustment signal or external environmental interference. If the temperature has reached the target temperature, the power adjustment for the current zone is stopped; if the temperature has not reached the target temperature, the first step of the power adjustment process is repeated until the temperature meets the target requirements. This application is not limited to this; in practical applications, the interval for temperature verification can be adjusted according to the working scenario of the atomic clock to adapt to different temperature control needs.

[0046] In alternative implementations, such as Figure 6 As shown, the signal processing module built at the back end of the photodetector of the atomic clock includes: S210: Connect the input of the low-noise preamplifier with light intensity preamplification to the signal output of the photodetector via a shielded cable.

[0047] Specifically, the photodetector converts the laser signal passing through the atomic gas cell into an electrical signal, which is the transmitted light signal. However, because the laser signal is affected by atomic absorption and scattering when passing through the gas cell, the amplitude of the converted transmitted light signal is usually weak and susceptible to external electromagnetic interference. Therefore, it needs to be amplified by a low-noise preamplifier with pre-amplification. Shielded cables are used for connection. The purpose of the shielded cables is to reduce the impact of external electromagnetic interference on signal transmission. The connection principle is to directly connect the input terminal of the low-noise preamplifier to the signal output terminal of the photodetector through the shielded cable, allowing the transmitted light signal to be transmitted completely to the amplifier and avoiding signal loss or interference superposition during transmission.

[0048] S220: Connect the signal output of the low-noise preamplifier to the signal input of the adaptive threshold lock-in amplifier circuit, and simultaneously connect the reference frequency signal of the atomic clock to the reference signal input of the lock-in amplifier circuit.

[0049] Specifically, after the low-noise preamplifier amplifies the transmitted light signal, it needs to be transmitted to a lock-in amplifier circuit with an adaptive threshold for further processing. The connection principle is to interface the amplifier's output with the lock-in amplifier's signal input via a signal line, allowing the amplified signal to enter the lock-in amplifier circuit. Simultaneously, the atomic clock's reference frequency signal needs to be connected to the lock-in amplifier circuit's reference signal input. This reference frequency signal is generated by the reference frequency source inside the atomic clock, and its frequency matches the atomic clock's operating frequency. The purpose of connecting the reference frequency signal is to provide a comparison reference for the lock-in amplifier circuit, enabling it to extract the target signal related to the reference frequency from the amplified transmitted light signal and filter out noise signals unrelated to the reference frequency. The adaptive threshold automatically adjusts the threshold based on the signal strength, thus enabling the extraction of the target signal under different signal intensities.

[0050] S230: Connect the signal output terminal of the lock-in amplifier circuit to the signal input terminal of the filter circuit to complete the construction of the signal processing module.

[0051] Specifically, after the lock-in amplifier circuit extracts the target signal, a small amount of high-frequency or low-frequency noise may still exist in the signal. Therefore, further filtering is required by the filter circuit. The connection principle is to connect the signal output terminal of the lock-in amplifier circuit to the signal input terminal of the filter circuit, allowing the signal processed by the lock-in amplifier to enter the filter circuit. After the signal processing module is built, a signal processing link is formed: photodetector - low-noise preamplifier - lock-in amplifier circuit - filter circuit. The function of this link is to gradually amplify and purify the transmitted light signal, and finally output a high-quality signal to provide a basis for the frequency calculation of the atomic clock.

[0052] In alternative implementations, such as Figure 7 As shown, connecting the signal output terminal of the low-noise preamplifier to the signal input terminal of the adaptive threshold lock-in amplifier circuit includes: S221: Select a shielded cable with a preset impedance matching value and gold-plat both ends of the cable to reduce impedance loss during signal transmission.

[0053] Specifically, the selection of shielded cables must be based on a preset impedance matching value. This impedance matching value is determined by the output impedance of the low-noise preamplifier and the input impedance of the lock-in amplifier circuit. The purpose of impedance matching is to prevent signal reflection and loss during transmission due to impedance mismatch, ensuring efficient signal transmission. Gold plating is applied to both ends of the cable. The principle of gold plating is to utilize gold's excellent conductivity and corrosion resistance to reduce contact resistance at both ends of the cable, thereby reducing impedance loss during signal transmission and preventing poor contact due to oxidation at the cable ends.

[0054] S222: Connect one end of the shielded cable to the signal output interface of the photodetector via an adapter, and connect the other end to the signal input interface of the low-noise preamplifier via an adapter of the same specification.

[0055] Specifically, the adapter must be compatible with the signal output interface of the photodetector and the signal input interface of the low-noise preamplifier. The adapter's function is to securely connect the cable and the interface, preventing signal transmission interruption or interference caused by loose connections. During connection, one end of the shielded cable is connected to the signal output interface of the photodetector via the adapter, and the other end is connected to the signal input interface of the low-noise preamplifier via an adapter of the same specification. The connection works by using the internal metal contacts of the adapter to electrically connect the cable and the interface, allowing the transmitted light signal to be stably transmitted from the photodetector to the low-noise preamplifier.

[0056] S223: Grounding is performed on the outer shielding layer of the shielded cable to control the grounding resistance within a preset threshold, thereby reducing the impact of external electromagnetic interference on signal transmission.

[0057] Specifically, grounding involves guiding external electromagnetic interference signals induced on the shielding layer to the ground via a grounding wire, preventing interference signals from entering the cable and affecting the transmitted light signal. During grounding, the grounding resistance must be controlled within a preset threshold. This preset threshold is determined based on electromagnetic compatibility design standards. Keeping the grounding resistance within this threshold ensures that interference signals are effectively conducted to the ground, reducing the impact of external electromagnetic interference on signal transmission. Through these three steps, a stable connection between the low-noise preamplifier and the lock-in amplifier circuit can be achieved, ensuring proper processing of subsequent signals.

[0058] In alternative implementations, such as Figure 8 As shown, the cutoff frequency and bandwidth of the filter circuit are optimized by matching based on the characteristics of the transmitted light signal, including: S310: Collects the transmitted light signal output by the photodetector, analyzes the frequency range and noise distribution characteristics of the signal, and determines the effective frequency range of the signal.

[0059] Specifically, the primary device for acquiring transmitted light signals is a photodetector. The principle behind this acquisition is that the photodetector converts the laser signal passing through the atomic gas cell into an electrical signal; the acquired signal is the transmitted light signal. Signal characteristic analysis includes the signal's frequency range and noise distribution characteristics. The principle of this analysis is to perform spectral analysis on the acquired transmitted light signal using signal analysis equipment to obtain the signal's amplitude distribution at different frequencies, thereby determining the effective frequency range of the signal. The effective frequency range refers to the frequency range containing the signal's main energy; frequency components outside this range are mostly noise signals. For example, if the analysis finds that the signal's main energy is concentrated in a specific frequency band, this frequency band is the effective frequency range, and the high-frequency or low-frequency components outside this range are noise that needs to be filtered out.

[0060] S320: Based on the effective frequency range, set the high-pass cutoff frequency and low-pass cutoff frequency of the filter circuit so that the bandwidth of the filter circuit covers the effective frequency range of the signal, so as to retain the effective signal and filter out noise outside the range.

[0061] Specifically, the setting is based on the effective frequency range of the signal determined in the first step. The high-pass cutoff frequency of the filter circuit is set as the lower limit of the effective frequency range, and the low-pass cutoff frequency is set as the upper limit of the effective frequency range. In this way, the bandwidth of the filter circuit exactly covers the effective frequency range of the signal. The high-pass cutoff frequency is used to filter out low-frequency noise below the lower limit of the effective range, and the low-pass cutoff frequency is used to filter out high-frequency noise above the upper limit of the effective range. Through this setting, noise signals can be filtered out to the maximum extent while retaining the effective signal.

[0062] S330: Connect the filter circuit with the cutoff frequency and bandwidth set to the signal processing module to test the noise suppression effect of the filtered signal.

[0063] Specifically, the detection principle involves connecting a pre-configured filter circuit to the signal processing module, acquiring the filtered signal using a signal detection device, analyzing the spectrum of the filtered signal, and comparing the changes in noise amplitude before and after filtering to determine if the noise suppression effect meets the requirements. For example, if the noise amplitude outside the effective frequency range of the filtered signal is significantly reduced, it indicates a good noise suppression effect; if the noise amplitude reduction is not significant, it is necessary to return to the first step, acquire and analyze the signal characteristics again, and adjust the cutoff frequency and bandwidth of the filter circuit until the noise suppression effect reaches the expected level.

[0064] In a specific example, such as Figure 9As shown, 1 is a VCSEL laser, 2 is a polarizer, 3 is a quarter-wave plate, 4 is a coated buffer gas atom chamber, 5 is a temperature control structure, 6 is a magnetic shield and magnetic field coil, and 7 is a photodetector. The laser emitted by the VCSEL laser passes through a polarizer to filter its polarization state, a quarter-wave plate to convert it into circularly polarized light, and then enters the coated buffer gas atom chamber, where it resonates with the atoms inside. During this process, the temperature control structure maintains a stable temperature in the chamber, and the magnetic shield and magnetic field coil ensure a stable magnetic field environment for the atoms. Finally, the laser light passing through the chamber is received by the photodetector and converted into an electrical signal, completing the signal acquisition of the interaction between the atoms and the laser.

[0065] It should be noted that the buffer gas atomic chamber is filled with alkali metals and a specific background gas, and its inner wall is coated with an anti-relaxation coating. This structural design aims to reduce the loss of optical polarization after collisions between atoms and the inner wall, while simultaneously limiting the thermal motion rate of atoms through the buffer gas, thereby providing a stable environment for the atomic clock to interact with the laser. The pressure of the buffer gas is one of the key parameters affecting the temperature sensitivity of the chamber, such as... Figure 10 As shown, the temperature sensitivity curves under different buffer gas filling pressures were measured experimentally. Near the working temperature point of the atomic gas chamber, the temperature control temperature of the atomic gas chamber was changed. After the temperature stabilized, the output frequency of the atomic clock was collected. Each temperature control point was held for 500s, of which 300s was the waiting time for the temperature control to stabilize. The data acquisition time was 200s, the data sampling rate was 1Hz, and the average value of 200 frequency data was calculated after the frequency data was collected. Figure 10 The temperature sensitivity curves for different buffer gas pressures are shown. Under the same gas ratio of nitrogen:argon = 1:1.7, the atomic gas chambers at pressures of 10 Torr, 29 Torr, and 58 Torr are compared. Within a temperature range of ±1°C near the operating temperature, the atomic gas chamber at 10 Torr has the lowest temperature sensitivity, at 0.03 mHz / °C. The coated-buffered gas atomic gas chamber used in this application can further control the buffer gas pressure below 5 Torr while ensuring relaxation performance, thus suppressing the temperature sensitivity coefficient to 0.01 mHz / °C.

[0066] Another aspect of this application discloses an atomic clock temperature control and signal detection device, such as... Figure 11 As shown, the device includes: Optimized temperature control module 11: Construct a combined temperature control structure of an annular microchannel heating array and a distributed temperature sensing probe that fits the inner wall of the coated buffer gas atomic gas chamber. The combined temperature control structure performs three-dimensional spatial partitioning temperature control of the atomic gas chamber, while optimizing the response time of the temperature control algorithm.

[0067] Signal processing module 12: A signal processing module is built at the back end of the photodetector of the atomic clock. The signal processing module includes an adaptive threshold lock-in amplifier circuit, a low-noise preamplifier with light intensity preamplification, and a filtering circuit.

[0068] Matching optimization module 13: The signal processing module processes the transmitted light signal output by the photodetector, and the cutoff frequency and bandwidth of the filter circuit are matched and optimized according to the characteristics of the transmitted light signal.

[0069] Since the principle by which this device solves the problem is similar to the methods described above, the implementation of this device can be found in the implementation of the methods, and will not be repeated here.

[0070] In another aspect, this application discloses an atomic clock temperature control and signal detection system, the system including the atomic clock temperature control and signal detection device as described above.

[0071] Since the principle by which this system solves the problem is similar to the methods and apparatus described above, the implementation of this system can be found in the implementation of the methods and apparatus, and will not be repeated here.

[0072] This application also provides a computer programmable logic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the above-described method.

[0073] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described method.

[0074] Those skilled in the art will understand that the embodiments of this application can provide methods, systems, or computer programs that produce the systems, apparatuses, modules, or units described in the above embodiments. Specifically, they can be implemented by computer chips or entities, or by products with certain functions. A typical implementation of a programmable logic device is a computer programmable logic device. Specifically, a computer programmable logic device can be, for example, a personal computer, laptop computer, cellular phone, camera phone, smartphone, personal digital assistant, media player, navigation programmable logic device, email programmable logic device, game console, tablet computer, wearable programmable logic device, or any combination of these programmable logic devices.

[0075] In a typical example, a computer programmable logic device specifically includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, it implements the method executed by the client as described above, or the method executed by the server as described above.

[0076] The following is for reference. Figure 12 It shows a schematic diagram of the structure of a computer programmable logic device 600 suitable for implementing embodiments of the present application.

[0077] like Figure 12 As shown, the computer programmable logic device 600 includes a central processing unit (CPU) 601, which can perform various appropriate tasks and processes according to a program stored in a read-only memory (ROM) 602 or a program loaded from a storage section 608 into a random access memory (RAM) 603. The RAM 603 also stores various programs and data required for the operation of the computer programmable logic device 600. The CPU 601, ROM 602, and RAM 603 are interconnected via a bus 604. An input / output (I / O) interface 605 is also connected to the bus 604.

[0078] The following components are connected to I / O interface 605: an input section 606 including a keyboard, mouse, etc.; an output section 607 including a cathode ray tube (CRT), liquid crystal feedback (LCD), etc., and speakers, etc.; a storage section 608 including a hard disk, etc.; and a communication section 609 including a network interface card such as a LAN card, modem, etc. The communication section 609 performs communication processing via a network such as the Internet. A drive 610 is also connected to I / O interface 605 as needed. A removable medium 611, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., is installed on drive 610 as needed so that computer programs read from it can be installed in storage section 608 as needed.

[0079] In particular, according to embodiments of this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of this application include a computer program product comprising a computer program tangibly embodied on a machine-readable medium, the computer program including program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via communication section 609, and / or installed from removable medium 611.

[0080] Computer-readable media include both permanent and non-permanent, removable and non-removable media that can store information by any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage, programmable logic devices, or any other non-transferable media that can be used to store information accessible by a computer programmable logic device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.

[0081] For ease of description, the above devices are described separately by function as various units. Of course, in implementing this application, the functions of each unit can be implemented in one or more software and / or hardware.

[0082] This application is described with reference to flowchart illustrations and / or block diagrams of methods, programmable logic devices (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing programmable logic device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing programmable logic device, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0083] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing programmable logic device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0084] These computer program instructions can also be loaded onto a computer or other programmable data processing logic device, causing a series of operational steps to be executed on the computer or other programmable logic device to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable logic device for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0085] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or programmable logic device that includes a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or programmable logic device. Without further limitations, an element defined by the statement "including one..." does not exclude the presence of other identical elements in the process, method, article, or programmable logic device that includes said element.

[0086] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0087] This application can be described in the general context of computer-executable instructions, such as program modules, that are executed by a computer. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform a specific task or implement a specific abstract data type. This application can also be practiced in distributed computing environments where tasks are performed by remotely processed programmable logic devices connected via a communication network. In a distributed computing environment, program modules can reside in local and remote computer storage media, including storage for programmable logic devices.

[0088] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0089] The above description is merely an embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this application should be included within the scope of the claims of this application.

Claims

1. A method for temperature control and signal detection of an atomic clock, characterized in that, The method includes: A combined temperature control structure is constructed, consisting of an annular microchannel heating array and a distributed temperature sensing probe attached to the inner wall of the atomic gas chamber of the coated buffer gas. The combined temperature control structure is used to perform three-dimensional spatial partitioning temperature control of the atomic gas chamber, while optimizing the response time of the temperature control algorithm. A signal processing module is built at the back end of the photodetector of the atomic clock. The signal processing module includes an adaptive threshold lock-in amplifier circuit, a low-noise preamplifier with light intensity preamplification, and a filtering circuit. The signal processing module processes the transmitted light signal output by the photodetector, and the cutoff frequency and bandwidth of the filter circuit are matched and optimized according to the characteristics of the transmitted light signal.

2. The atomic clock temperature control and signal detection method according to claim 1, characterized in that, The combined temperature control structure, which integrates a ring-shaped microchannel heating array and a distributed temperature sensing probe to form a cavity wall of a buffer gas atomic chamber fitted with a film-coated gas, includes: Based on the inner wall contour dimensions of the coated buffer gas atomic chamber, the channel diameter, arrangement density, and number of annular layers of the annular microchannel heating array are designed. Based on the three-dimensional spatial zoning requirements of the atomic gas chamber, the number of detection points of the distributed temperature sensing probes and the installation position of each point on the inner wall of the gas chamber are determined. The designed annular microchannel heating array is attached and fixed to the inner wall of the atomic gas chamber, and distributed temperature sensing probes are installed at preset detection points to form a combined temperature control structure.

3. The atomic clock temperature control and signal detection method according to claim 2, characterized in that, The design of the channel diameter, arrangement density, and number of annular layers of the annular microchannel heating array based on the inner wall contour dimensions of the coated buffer gas atomic chamber includes: Measure the inner wall diameter, length, and wall thickness of the coated buffer gas atomic chamber to determine the suitable installation space range for the annular microchannel heating array; Based on the aforementioned installation space range, the channel diameter of the annular microchannel, the spacing between adjacent annular channels, and the number of annular layers are set.

4. The atomic clock temperature control and signal detection method according to claim 1, characterized in that, The three-dimensional spatial partitioning temperature control of the atomic gas chamber through the combined temperature control structure includes: The temperature data of the air chamber at each detection point is collected in real time by distributed temperature sensing probes, and the collected temperature data is transmitted to the temperature control algorithm module. The temperature control algorithm module calculates the temperature deviation value of each zone based on the target temperature of each temperature control zone and the real-time collected temperature data; Based on the temperature deviation value, a heating power adjustment signal is output to the microchannel of the corresponding partition in the annular microchannel heating array to control the heating power of the microchannel in that partition and achieve independent temperature regulation of each partition.

5. The atomic clock temperature control and signal detection method according to claim 4, characterized in that, The step of outputting a heating power adjustment signal to the microchannels of the corresponding partition in the annular microchannel heating array includes: When the temperature deviation is positive, the heating power of the corresponding microchannel is increased according to the preset power adjustment coefficient based on the magnitude of the deviation. When the temperature deviation is negative, the heating power of the corresponding microchannel is decreased according to the preset power adjustment coefficient based on the magnitude of the deviation. After adjusting the heating power, the temperature data of the corresponding zone is collected again by distributed temperature sensing probes to verify whether the temperature has reached the target temperature.

6. The atomic clock temperature control and signal detection method according to claim 1, characterized in that, The construction of a signal processing module at the back end of the photodetector of the atomic clock includes: The input terminal of the low-noise preamplifier with light intensity preamplification is connected to the signal output terminal of the photodetector via a shielded cable. Connect the signal output of the low-noise preamplifier to the signal input of the adaptive threshold lock-in amplifier circuit, and simultaneously connect the reference frequency signal of the atomic clock to the reference signal input of the lock-in amplifier circuit. Connect the signal output terminal of the lock-in amplifier circuit to the signal input terminal of the filter circuit to complete the construction of the signal processing module.

7. The atomic clock temperature control and signal detection method according to claim 6, characterized in that, Connecting the signal output terminal of the low-noise preamplifier to the signal input terminal of the adaptive threshold lock-in amplifier circuit includes: Select a shielded cable with a preset impedance matching value and gold-plat both ends of the cable to reduce impedance loss during signal transmission. Connect one end of the shielded cable to the signal output interface of the photodetector via an adapter, and connect the other end to the signal input interface of the low-noise preamplifier via an adapter of the same specification. The outer shielding layer of the shielded cable is grounded, and the grounding resistance is controlled within a preset threshold to reduce the impact of external electromagnetic interference on signal transmission.

8. The atomic clock temperature control and signal detection method according to claim 1, characterized in that, The cutoff frequency and bandwidth of the filter circuit are optimized based on the characteristics of the transmitted light signal, including: Collect the transmitted light signal output by the photodetector, analyze the frequency range and noise distribution characteristics of the signal, and determine the effective frequency range of the signal; Based on the effective frequency range, the high-pass cutoff frequency and low-pass cutoff frequency of the filter circuit are set so that the bandwidth of the filter circuit covers the effective frequency range of the signal, so as to retain the effective signal and filter out noise outside the range. The filter circuit with the cutoff frequency and bandwidth set is connected to the signal processing module, and the noise suppression effect of the filtered signal is tested.

9. An atomic clock temperature control and signal detection device, characterized in that, The device includes: Optimize the temperature control module: Construct a combined temperature control structure of a ring-shaped microchannel heating array and a distributed temperature sensing probe that fits the inner wall of the atomic gas chamber of the coated buffer gas. The combined temperature control structure performs three-dimensional spatial partitioning temperature control of the atomic gas chamber, while optimizing the response time of the temperature control algorithm. Signal processing module: A signal processing module is built at the back end of the photodetector of the atomic clock. The signal processing module includes an adaptive threshold lock-in amplifier circuit, a low-noise preamplifier with light intensity preamplification, and a filtering circuit. Matching optimization module: The signal processing module processes the transmitted light signal output by the photodetector, and the cutoff frequency and bandwidth of the filter circuit are matched and optimized according to the characteristics of the transmitted light signal.

10. An atomic clock temperature control and signal detection system, characterized in that, The system includes the atomic clock temperature control and signal detection device as described in claim 9.

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