Electrode cap end face grinding sticky chip control method and system
By constructing a nonlinear coupling model of rotation speed and pressure and a method for quantifying the risk of chip adhesion, the instability problem of chip adhesion defects during electrode cap grinding was solved, achieving precise control and high quality and efficiency in the electrode cap grinding process.
Patent Information
- Application Number
- CN202610328374.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-18
- Publication Date
- 2026-04-17
- Estimated Expiration
- 2046-03-18
AI Technical Summary
The existing electrode cap grinding process has a probabilistic and fluctuating nature in terms of chip adhesion defects, resulting in unstable grinding quality. Furthermore, the lack of scientific assessment and control of chip adhesion risk makes it difficult to determine a continuous and stable processing window.
By constructing a nonlinear coupling model of rotation speed and pressure, and combining it with a multi-factor coupling optimization method, a chip adhesion risk quantification model is established. The Mahalanobis distance and comprehensive stability index are introduced to determine the stable processing window and select the parameters with the best efficiency.
It enables precise control of the electrode cap grinding process, reduces chip adhesion defects, improves grinding quality and stability, and ensures the continuity and stability of the production process.