Display module and preparation method thereof, display module mother board and display device

Abstract

The invention provides a display module and a preparation method thereof, a display module mother board and a display device.The preparation method of the display module comprises the steps that a substrate and a plurality of display units are provided, and the display units are arranged on the substrate to form display unit blocks; binding the circuit function parts to the display unit blocks to form a display module mother board; the display module mother board is cut, a plurality of display modules are obtained, and each display module comprises at least one display unit and a part of circuit function parts electrically connected with the display unit. The micro display units are combined into the block structure conforming to the machining size of current binding equipment, and precise cutting is performed after binding, so that the problem that the size of the micro display units is not matched with the machining size of standard binding equipment is solved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and its manufacturing method, a display module motherboard, and a display device. Background Technology

[0002] With the advancement of display technology, display units are continuously becoming miniaturized. However, the size of micro display units is far smaller than the lower limit of the current mainstream bonding equipment's processing capabilities, and developing dedicated equipment for them faces problems such as high cost and long development cycle. Summary of the Invention

[0003] In view of this, the purpose of this application is to propose a display module and its manufacturing method, a display module motherboard and a display device, so as to solve the problem of mismatch between the size of the micro display unit and the processing size of the standard bonding equipment.

[0004] In view of the above objectives, firstly, this application provides a method for manufacturing a display module, comprising: A substrate and multiple display units are provided, and the multiple display units are arranged on the substrate to form a display unit block; The circuit functional components are bound to the display unit block to form a display module motherboard; The motherboard of the display module is cut to obtain multiple display modules. Each display module includes at least one display unit and some of the circuit functional components electrically connected to the display unit.

[0005] Optionally, the display unit is a microdisplay with a diagonal size of less than 1 inch.

[0006] Optionally, in the display unit block, multiple display units are bound to the same circuit functional component.

[0007] Optionally, a gap is provided between adjacent display units, the width of which is greater than or equal to 150 μm and less than or equal to 200 μm.

[0008] Optionally, the width of the display unit block is greater than or equal to 35mm, and the length is greater than or equal to 60mm.

[0009] Optionally, the method includes: The substrate is removed before cutting the display module motherboard; Laser cutting technology is used to cut the motherboard of the display module after the substrate has been removed.

[0010] Secondly, this application also provides a display module motherboard, comprising: substrate; The display unit block includes multiple display units, which are arranged on the substrate. At least one circuit functional component is attached to the display unit block and electrically connected to the plurality of display units.

[0011] Optionally, the circuit functional component is a flexible printed circuit board; And / or, the circuit functional components include a plurality of bonding pins that correspond one-to-one with the display unit.

[0012] Thirdly, this application also provides a display module prepared by the preparation method described in any one of the first aspects.

[0013] Fourthly, this application also provides a display device, including the display module of the third aspect.

[0014] The display module provided in this application forms a display unit block by arranging multiple display units; a display module motherboard is formed by binding circuit functional components to the display unit block; the display module motherboard is cut to obtain multiple display modules, each display module including at least one display unit and some circuit functional components electrically connected to the display unit; thus, multiple micro display units are integrated in the early stage of manufacturing to form a large intermediate body that is dimensionally compatible with standard bonding equipment, namely the display module motherboard; after batch bonding is completed, it is then separated into independent final modules by precise cutting, which solves the problem of mismatch between the size of micro display units and the processing size of standard bonding equipment. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a display unit in related technologies; Figure 2 A schematic flowchart illustrating a method for fabricating a display module according to an embodiment of this application; Figure 3 A schematic diagram of a display unit block during the fabrication process of a display module provided in an embodiment of this application; Figure 4 A schematic diagram illustrating key steps of a method for fabricating a display module according to an embodiment of this application; Figure 5 This is a schematic diagram of the structure of a display module provided in another embodiment of this application; Figure 6 This is a schematic diagram of the structure of a display module motherboard provided in another embodiment of this application.

[0017] Marker explanation: 100. Display module; 200. Display module motherboard; 10. Display unit block; 110. Substrate; 11. Display unit; 101. Display area; 102. Bonding area; 12. Circuit functional component; 130. Gap; 13. Cutting path. Detailed Implementation

[0018] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0019] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0021] With the rapid development of near-eye display technologies such as augmented reality (AR) and virtual reality (VR), the requirements for miniaturization and lightweighting of display modules are increasing. Microdisplays typically refer to display units with a diagonal size of less than 1 inch. Due to their small size and high resolution, they have become the core component of such near-eye display devices.

[0022] In the manufacturing process of micro-display modules, flexible printed circuit boards (FPCs) and other circuit functional components need to be bonded to the display body to connect drive signals and power. Currently, the bonding equipment widely used in the industry is mainly designed for traditional-sized display panels, such as hot press bonding machines suitable for 3-inch to 8-inch panels. Their equipment platforms, alignment systems, and process parameters are all optimized for these sizes. Typically, conventional bonding equipment requires the processed object to be at least 60mm in length and 35mm in width, and the spacing between positioning marks is generally at least 12mm.

[0023] However, novel microdisplays, such as glass-based augmented reality displays, have individual unit sizes smaller than the processing limits of the aforementioned equipment. For example, a typical augmented reality microdisplay measures only 4.51mm × 6.55mm. Correspondingly, the spacing of the positioning marks on the display is also small; for example, the FPC mark spacing is approximately 3.32mm, and the alignment mark spacing is approximately 3.04mm, far below the minimum spacing of at least 12mm typically required by conventional bonding equipment. This mismatch between micro-sized dimensions and macro-manufacturing equipment means that existing efficient and mature standard bonding equipment cannot be directly used for bonding flexible printed circuit boards to such microdisplays. Developing entirely new dedicated micro-bonding equipment for such microdisplays faces challenges such as long R&D cycles, high manufacturing costs, and complex process stability verification. Therefore, achieving high-precision, high-yield bonding of tiny display units with dimensions far smaller than the processing limits of existing standard bonding equipment without modifying or replacing it has become a core technological bottleneck restricting the mass production and cost control of glass-based microdisplay modules (especially AR modules).

[0024] In view of this, embodiments of this application provide a display module and its manufacturing method, a display module motherboard and a display device, which aim to combine multiple micro display units into a block structure that conforms to the processing size of standard equipment through a process sequence of "integration first, separation later", and then divide them into independent modules after binding, thereby achieving efficient and reliable manufacturing of micro display units.

[0025] like Figures 2 to 4 As shown, an embodiment of the first aspect of this application provides a method for manufacturing a display module. The method for manufacturing the display module specifically includes the following steps: Step S110: Provide a substrate 110 and a plurality of display units 11, and arrange the plurality of display units 11 on the substrate 110 to form a display unit block 10.

[0026] Step S120: Bind the circuit functional component 12 to the display unit block 10 to form the display module motherboard 200.

[0027] Step S130: Cut the display module motherboard 200 to obtain multiple display modules 100. Each display module 100 includes at least one display unit 11 and some circuit functional components 12 electrically connected to the display unit 11.

[0028] Specifically, in step S110, a substrate 110 and a plurality of independent display units 11 are provided. The display units 11 may be micro-LED display units, organic light-emitting diode (OLED) display units, or other microdisplay bodies based on a glass substrate. The size of a single display unit 11 is relatively small, for example, a dimension X1 = 4.51 mm along a first direction (as shown by the X direction in the figure), a dimension Y1 = 6.55 mm along a second direction (as shown by the Y direction in the figure), and a diagonal dimension typically between 0.1 inches and 0.7 inches.

[0029] Multiple display units 11 are arranged on the substrate 110 according to a preset row and column spacing to form a matrix arrangement structure. During arrangement, the relative positional accuracy between each display unit 11 can be achieved through an alignment platform. The fixing method can be ultraviolet curable adhesive, heat release adhesive, or mechanical clamps, etc.

[0030] By arranging and fixing multiple display units 11 in an array to form an integrated display unit block 10, it is ensured that there is no relative displacement between the display units 11 in subsequent processes, thus maintaining the overall dimensional accuracy and alignment reference of the display unit block 10. The overall outer contour dimensions of the display unit block 10 are designed to be the minimum processable size suitable for current mainstream bonding equipment. Through array design, the micro-pitch positioning marks that were originally unrecognizable by the equipment are integrated into a mark layout that conforms to the recognition standards of the equipment alignment system.

[0031] In one specific embodiment, the size of the display unit block 10 is configured as follows: width X2 ≥ 35mm, length Y2 ≥ 60mm, preferably X2 = 35mm, Y2 = 60mm. This size design enables the display unit block 10 to be compatible with the processing window of conventional binding equipment.

[0032] In this way, the overall size of the display unit block 10 and the spacing of the positioning marks that can be set on it are both expanded to meet the requirements of the standard binding device, thereby solving the alignment and binding problems caused by the small size of the unit block and the insufficient spacing of the positioning marks.

[0033] In step S120, at least one circuit functional component 12 is bound to the display unit block 10 formed in step S110.

[0034] The circuit functional component 12 is preferably a flexible printed circuit board, which may house a driver integrated circuit or have interface pads for external connections. The bonding process can employ standard thermoforming equipment suitable for standard-sized panels, such as roll-to-roll or sheet-to-sheet bonding machines for 3 to 8-inch panels.

[0035] Since the object being bound at this time is a large display unit block 10, the mature technology of the existing binding equipment can be directly utilized to achieve high-precision alignment, uniform hot pressing and stable connection.

[0036] In one specific embodiment, the circuit functional component 12 can be a strip-shaped flexible printed circuit board, which is bound to the corresponding display unit 11 in the display unit block 10 by column or row. The display module motherboard 200 formed after binding is a composite structure containing multiple display units 11 and their shared circuit functional components 12.

[0037] Thus, by using existing bonding equipment to complete the electrical connection of the microdisplay unit, not only is the bonding accuracy and reliability improved, but the cost and time investment caused by equipment modification or the introduction of new processes are also reduced.

[0038] In step S130, the substrate 110 can be removed first, and the composite structure after removing the substrate can be cut to obtain multiple display modules 100.

[0039] Specifically, after the bonding of the circuit functional components 12 is completed, the first step is to remove the substrate 110. Since the display units 11 are bonded to the substrate 110 through temporary fixing methods (such as UV-curable adhesive or heat-release tape), the substrate 110 can be removed from the display module motherboard 200 as a whole by means of light heating or mechanical peeling, resulting in a flexible composite structure composed of the circuit functional components 12 and multiple display units 11. In the composite structure, the relative positional relationship between each display unit 11 can be maintained through the circuit functional components 12.

[0040] Subsequently, the composite structure is cut. The cutting path 13 follows the gap 130 between adjacent display units 11 in the display unit block 10, i.e., the preset cutting channel, and uses laser cutting technology to cut through the circuit functional components 12, thereby dividing the composite structure into multiple independent display modules 100. The cutting process preferably uses ultraviolet (UV) laser, such as a UV laser with a wavelength of 355nm, which has the advantages of non-contact, high precision, and small heat-affected zone.

[0041] After cutting, each independent display module 100 includes at least one display unit 11 and a portion of the circuitry 12 electrically connected to the display unit 11. This portion of the circuitry 12 can form the electrical connection pins of the display module to the outside. By removing the substrate first and then cutting, efficient bonding of the micro-display units is achieved, while ensuring the dimensional accuracy and structural integrity of the final module.

[0042] In other embodiments, each individual display module 100 may also include a plurality of display units 11.

[0043] Therefore, the method for manufacturing the display module 100 provided in this application embodiment combines multiple micro display units into a block structure that conforms to the processing size of current bonding equipment, and performs precision cutting after integrated bonding, thereby achieving efficient and reliable bonding of display units with extremely small component sizes.

[0044] The problem of bonding multiple micro-display units 11 is transformed into bonding a standard-sized panel that meets the processing capabilities of current equipment. This fundamentally solves the contradiction that standard equipment cannot be used due to the small size of individual units, enabling the micro-display units 11 to be integrated into the existing display panel mass production system, reducing equipment investment costs and process development risks. It is particularly suitable for the fabrication of micro-display modules for glass-based augmented reality.

[0045] Optionally, the substrate 110 is a glass substrate due to its excellent rigidity, flatness, and thermal stability. It is understood that in other embodiments, other rigid or flexible substrates that can provide sufficient support accuracy may also be used.

[0046] The display unit 11 includes a display area 101 and a bonding area 102, with the bonding area 102 located on one side of the display area 101. The bonding area 102 is a dense wiring area, which may specifically include metal wiring sections.

[0047] In some embodiments, the display unit 11 is a microdisplay with a diagonal size of less than 1 inch.

[0048] Specifically, the display unit 11 is a microdisplay with a diagonal size of less than 1 inch (approximately 25.4 mm). For example, the diagonal size of the display unit 11 can be between 0.1 inches and 0.7 inches, such as 0.1 inches, 0.2 inches, 0.3 inches, 0.5 inches, 0.7 inches, etc.

[0049] For example, the diagonal size of the display unit 11 can be 0.3 inches to 0.5 inches. The resolution of the display unit 11 can be 1920×1080 or higher, with a pixel density greater than 3000 PPI. The display unit 11 can be used for monochrome or full-color displays and supports low-power driving modes.

[0050] In some embodiments, multiple display units 11 are bound to the same circuit function 12 within a display unit block. For example, multiple display units 11 in the same column or row share a single flexible printed circuit board.

[0051] Specifically, such as Figure 3 and Figure 4 As shown, the display unit block 10 includes at least two rows of display units 11 arranged at intervals. In the bonding step S120, an independent circuit functional component 12 is bonded to each row of display units 11, such as a strip-shaped flexible printed circuit board. That is, multiple display units 11 in the same row share a single circuit functional component 12. This layout simplifies the bonding process, improves material utilization, and optimizes wiring.

[0052] The layout of using a shared flexible printed circuit board (PCB) per column optimizes the trace design and material utilization of the PCB while meeting the overall size requirements of the display unit block 10. Compared to bonding an independent PCB to each unit, this method reduces the number of bonding operations and improves the efficiency of the bonding process. Compared to using a single PCB covering the entire display unit block 10, this method reduces the complexity and manufacturing difficulty of the PCB and provides a simpler pin layout for each module after cutting.

[0053] In other embodiments, the circuit functional component 12 may be a segmented flexible printed circuit board, wherein each segment corresponds to a column or row of a display unit 11 and is connected by bridging lines. The specific bonding method of the circuit functional component 12 may be anisotropic conductive film (ACF) bonding or metal thermoforming. Passive components or sensors may also be integrated on the circuit functional component 12.

[0054] In some embodiments, a gap 130 is provided between adjacent display units 11, and the width of the gap 130 is configured to be greater than or equal to 150 μm and less than or equal to 200 μm. For example, the width of the gap 130 is 150 μm, 170 μm, 190 μm, 200 μm, etc.

[0055] The gap 130 reserved between adjacent display units 11 is also referred to as the "cutting path". It should be noted that the gap 130 itself is not the direct target of laser cutting, but rather provides a safe space for subsequent cutting processes. After removing the substrate 110, laser cutting proceeds along the cutting path 13 passing through the center line of the gap 130, thereby cutting the circuit functional components 12. By setting the gap 130, laser damage to the effective area of ​​the display unit 11 can be effectively avoided, while also providing tolerance for cutting alignment.

[0056] In some embodiments, in order to enable the formed display unit block 10 to be reliably processed by a standard bonding device, the size of the display unit block 10 is configured such that, along a first direction (e.g., Figure 3 The dimension in the X direction is greater than or equal to 35 mm, and along the second direction (e.g.) Figure 3 The dimension of the first direction (in the Y direction) is greater than or equal to 60 mm; wherein the first direction intersects the second direction.

[0057] Optionally, the first direction is perpendicular to the second direction.

[0058] In a specific example, the dimensions of display unit block 10 are: width x2 = 35mm and Y2 = 60mm along the second direction. That is, the dimensions of display unit block 10 are 60mm × 35mm. This size configuration directly corresponds to and meets the minimum size requirements of mainstream standard binding equipment for the processed object.

[0059] The size of the display unit block 10 can be dynamically adjusted according to the device specifications, for example, it can be set to 65mm in length and 40mm in width, or 70mm in length and 45mm in width. The spacing of the display units 11 in the display unit block 10 can be uniform or non-uniform, and the spacing range can be between 0.15mm and 0.2mm.

[0060] In some embodiments, cutting the display module motherboard 200 includes: Laser cutting technology is used for cutting.

[0061] The display module motherboard 200 is cut using a laser cutting process. Laser cutting has advantages such as being non-contact, highly precise, and allowing for controllable heat-affected zones.

[0062] Laser cutting is particularly suitable for precision cutting of composite structures containing brittle materials (such as glass-based display units 11) and precision metal circuitry. This results in clean, vertical cut surfaces, minimizing damage to the edge areas of the display unit 11 and the functionality of the flexible printed circuit board leads, thus ensuring the performance and reliability of the final display module 100.

[0063] In other embodiments, laser cutting may employ infrared laser, green laser, or ultrashort pulse laser. The laser power is adjustable from 0.5 W to 20 W, and the scanning speed is from 50 mm / s to 500 mm / s. The cutting path 13 may be a straight line, a curve, or a combination of these paths, and may be equipped with a vision system for real-time path correction.

[0064] In some embodiments, before the display module motherboard 200 is cut, the method for preparing the display module further includes removing the substrate 110.

[0065] Specifically, since the display unit 11 is attached to the substrate 110 by a temporary fixing method, the substrate 110 can be removed from each independent display module 100 by means of light heating or mechanical peeling, thereby obtaining the final display module product.

[0066] An embodiment of the second aspect of this application provides a display module motherboard 200, which can be prepared by the preparation method of any of the embodiments of the first aspect described above.

[0067] The display module motherboard 200 includes a substrate 110, a display unit block 10, and at least one circuit functional component 12. The display unit block 10 includes a plurality of display units 11 arranged on the substrate 110. The circuit functional component 12 is bonded to the display unit block 10 and electrically connected to the plurality of display units 11.

[0068] In some embodiments, the circuit functional component 12 is a flexible printed circuit board.

[0069] See Figure 4 A display unit block 10 is formed by arranging and fixing multiple display units 11. A circuit functional component 12 is bound to the display unit block 10 and electrically connected to multiple or all of the display units 11.

[0070] Among them, the circuit functional component 12 is an integrated flexible printed circuit board. "Integrated" means that before the cutting process, the flexible printed circuit board is a physically continuous and complete monolithic structure, and its circuit pattern covers and connects multiple display units 11.

[0071] The circuit functional component 12 can be a multilayer flexible printed circuit board, which includes a shielding layer or a heat dissipation layer. The display unit block 10 can be bonded to the circuit functional component 12 through a transparent adhesive layer or optical adhesive.

[0072] Specifically, the display unit block 10 is formed by arranging and fixing multiple independent display units 11 according to a preset row and column spacing. This corresponds to step S110, in which multiple display units 11 are precisely arranged in a plane according to a preset row and column spacing and fixed by means of adhesives, temporary bonding adhesives or mechanical clamps, thereby forming an integrated display unit block 10. This ensures that no relative displacement occurs between the display units 11 during subsequent handling and binding processes, maintaining the overall dimensional accuracy of the array.

[0073] The overall outer contour dimensions of the display unit block 10 are specially designed to fit the process window of the subsequent bonding equipment. For example, the overall outer contour dimensions of the final display unit block 10 are adapted to the minimum machinable size of the standard bonding equipment selected subsequently.

[0074] In one specific example, substrate 110 provides mechanical support and alignment reference for display unit block 10. Substrate 110 is preferably a material with excellent rigidity, flatness, and thermal stability, such as soda-lime glass, quartz glass, sapphire, or a high molecular weight polymer film. In a preferred embodiment, substrate 110 is borosilicate glass, whose coefficient of thermal expansion matches that of the subsequent glass-based display unit 11 to reduce process thermal stress.

[0075] Display unit 11 is a standalone microdisplay device with completed front-end fabrication, comprising a display area 101 and a bonding area 102 located on one side. The bonding area 102 contains micron-sized pads or electrodes made of a metallic material (such as copper, aluminum, or ITO). The types of display units 11 include, but are not limited to: active-matrix units based on micro-LED chips, display units based on organic light-emitting diodes, or microdisplays employing liquid crystal modulation technology. Their common characteristic is their small overall size; for example, their planar dimensions can be 4.51 mm × 6.55 mm, and their diagonal dimensions range from 0.1 inches to 0.7 inches.

[0076] The process of forming the display unit block 10 is as follows: First, multiple display units 11 are precisely arranged on the surface of the substrate 110 with their bonding areas 102 facing upwards using a high-precision alignment platform (such as a vision alignment system), according to a preset matrix pattern (such as M rows × N columns). After the arrangement is completed, each display unit 11 is temporarily fixed to the substrate 110 using a fixing material. The fixing material can be an ultraviolet (UV) curable adhesive, which is fluid before curing, making it easy to fill gaps, and cures rapidly after being irradiated with UV light of a specific wavelength; or it can be a heat-release tape, which loses its adhesiveness at a specific temperature in subsequent processes. The fixing process must ensure the positional accuracy (e.g., within ±5μm) and height consistency of each display unit 11 in the plane to prevent displacement during subsequent handling or bonding. The final display unit block 10 is an integral rigid structure, and its outer contour dimensions are designed to adapt to the minimum processable size requirements of the standard bonding equipment selected subsequently. In a specific example, by arranging dozens or even hundreds of micro-display units 11 in a 5-row × 12-column configuration, the final size of the display unit block 10 reaches 60mm × 35mm, meeting the size requirements of conventional hot-press bonding machines for processed objects of "length ≥ 60mm, width ≥ 35mm". Simultaneously, globally aligned markers conforming to standard equipment identification specifications can be specially placed around the perimeter of the display unit block 10. Their size and spacing (e.g., ≥ 12mm) are compatible with the equipment, thus solving the problem of alignment marks on individual micro-display units being too small or too dense to be recognized by the equipment.

[0077] The circuit functional component 12 is preferably a flexible printed circuit board with a substrate of polyimide (PI) or polyester (PET), on which a precise copper wire pattern is formed by etching or addition methods, and may house driver integrated circuits (ICs), passive components (resistors, capacitors), or connector interfaces. The bonding process preferably employs thermosetting bonding technology, which is mature in mass production.

[0078] The specific bonding process for the circuit functional component 12 is as follows: the pre-fabricated circuit functional component 12 is visually aligned with the global alignment marks on the display unit block 10 through alignment holes or marks on it. The alignment accuracy is typically required to be less than ±15μm. After alignment, a standard hot-press bonding device (such as an ACF hot press suitable for 8-inch panels) is used for pressing. This device has a size-adapted heating head and a flat pressure-bearing platform, which can apply heat and pressure to the entire display unit block 10. The process parameters can be set as follows: temperature 180℃~220℃, pressure 0.5MPa~2.0MPa, time 5~15 seconds. Under the combined action of heat and pressure, the circuit functional component 12 and the electrodes on the bonding area 102 of each display unit 11 achieve mechanical connection and electrical conduction through anisotropic conductive film (ACF) or non-conductive resin (NCF). The conductive particles within the ACF are flattened under pressure, forming a vertical conductive path between the display unit electrodes and the FPC pads, while the cured resin matrix provides reliable bonding strength.

[0079] After removing the substrate 110, the composite structure consisting of the circuit functional components 12 and multiple display units 11 is cut. The cutting is performed along the gap 130 between the display units 11, and a laser cutting process is used to cut through the circuit functional components 12, dividing the composite structure into multiple independent display modules 100, ensuring that the FPC pins at the edge of each module are functionally intact.

[0080] Specifically, the cutting process can use ultraviolet (UV) laser with a wavelength of 355nm. This wavelength has a high absorption rate for both glass and polyimide materials, enabling cold processing, effectively reducing thermal damage such as melting and carbonization, and producing vertical and smooth cut edges with chipping size controlled below 20μm.

[0081] In some embodiments, the circuit functional component 12 includes a plurality of bonding pins, each bonding pin corresponding to a display unit 11 in the display unit block 10. In the display unit block 10, the bonding area 102 of each display unit 11 is electrically connected to the corresponding bonding pin on the circuit functional component 12. During the cutting process, after cutting along the gap 130 between adjacent display units 11, each independent display module 100 still retains bonding pins on a portion of the circuit functional component 12 that correspond one-to-one with the display units 11 in that display module 100, for connecting the display module 100 to external circuits.

[0082] An embodiment of the third aspect of this application provides a display module 100, which can be manufactured by the method for manufacturing a display module in any of the embodiments of the first aspect described above.

[0083] Specifically, using the first aspect of the preparation method, after the bonding of the circuit functional components 12 is completed, the substrate 110 is removed first, and then the composite structure composed of the circuit functional components 12 and multiple display units 11 is cut along the gap 130 between the display units 11 to obtain multiple independent display modules 100.

[0084] Each independent display module 100 includes at least one display unit 11 and some circuitry functional components electrically connected to the display unit 11. The display unit 11 is a microdisplay with a diagonal size of less than 1 inch, and the circuitry functional components are cut segments of a monolithic, continuous flexible printed circuit board, each with bonding pins corresponding to one display unit 11. The final display module 100 can be directly used for subsequent optomechanical assembly.

[0085] In other embodiments, the display module 100 may also include an optical film, a polarizer, or a touch sensor. The leads of the circuit functional component 12 may be gold fingers, solder pads, or connector interfaces. The thickness of the display module 100 is suitable for ultra-thin display devices.

[0086] Since the display module 100 provided in the third aspect of this application includes the display module prepared by the method of any of the first aspects of the above-described display module, the display module 100 provided in the third aspect of this application includes the display module prepared by the method of any of the first aspects of this application.

[0087] Therefore, the display module 100 provided in the third aspect embodiment of this application has the beneficial effects of the preparation method of the display module in any of the first aspects embodiment, or the beneficial effects of the display module motherboard 200 in any of the second aspects embodiment, which will not be repeated here.

[0088] An embodiment of the fourth aspect of this application also provides a display device, including the display module of any of the embodiments of the third aspect described above.

[0089] The display devices in the embodiments of this application include, but are not limited to, virtual reality display devices, augmented reality display devices, mixed reality devices, head-mounted displays, or any other electronic products that include micro-display modules.

[0090] The display module, its manufacturing method, the display module motherboard, and the display device provided in this application have the following beneficial effects: First, by combining micron-sized display units 11 into a block structure to form a standard-sized display unit block 10, this intermediate can be directly compatible with current mainstream 3- to 8-inch panel bonding equipment. This avoids the problems of long R&D cycles and complex process stability verification caused by developing dedicated bonding equipment for micro display units, effectively utilizing existing mature equipment and process systems, thereby reducing the cost of large-scale production of micro display modules and the risks of process development.

[0091] Secondly, the use of mature hot-press bonding technology is beneficial to improving the mechanical strength and electrical stability of the interface connection.

[0092] Third, the use of ultraviolet laser cutting technology results in a narrow kerf and a small heat-affected zone, which can avoid problems such as glass breakage, flexible printed circuit board peeling, or circuit damage caused by traditional mechanical cutting.

[0093] Fourth, by array bonding and batch cutting, multiple display modules can be manufactured in parallel, which is suitable for large-scale manufacturing.

[0094] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for manufacturing a display module, characterized in that, include: A substrate and multiple display units are provided, and the multiple display units are arranged on the substrate to form a display unit block; The circuit functional components are bound to the display unit block to form a display module motherboard; The motherboard of the display module is cut to obtain multiple display modules. Each display module includes at least one display unit and some of the circuit functional components electrically connected to the display unit.

2. The method for preparing a display module according to claim 1, characterized in that, The display unit is a microdisplay with a diagonal size of less than 1 inch.

3. The method for preparing a display module according to claim 1, characterized in that, In the display unit block, multiple display units in at least one row or column are bound to the same circuit function.

4. The method for preparing a display module according to claim 1, characterized in that, A gap is provided between adjacent display units, the width of which is greater than or equal to 150 μm and less than or equal to 200 μm.

5. The method for manufacturing a display module according to claim 1, characterized in that, The width of the display unit block is greater than or equal to 35mm, and the length is greater than or equal to 60mm.

6. The method for preparing a display module according to claim 1, characterized in that, The method includes: The substrate is removed before cutting the display module motherboard; Laser cutting technology is used to cut the motherboard of the display module after the substrate has been removed.

7. A display module motherboard, characterized in that, include: substrate; The display unit block includes multiple display units, which are arranged on the substrate. At least one circuit functional component is attached to the display unit block and electrically connected to the plurality of display units.

8. The display module motherboard according to claim 7, characterized in that, The circuit functional component is a flexible printed circuit board; And / or, the circuit functional components include a plurality of bonding pins that correspond one-to-one with the display unit.

9. A display module, characterized in that, It is prepared by any one of claims 1 to 6.

10. A display device, characterized in that, Includes the display module as described in claim 9.

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