Online curing device and method for conductive material

Abstract

The invention discloses an online curing device and method for a conductive material, and the method comprises the following steps: S1, starting a printing equipment control system and an air compressor in sequence according to a standard operation process, creating a new control program file through an equipment switch after the initialization of the system is completed, and inputting a corresponding technological parameter instruction; s2, after printing is completed, a laser transmitter is assembled on a laser fixing support, and the position of the laser transmitter is adjusted through the laser fixing support; and S3, generating a laser beam through a laser transmitter, focusing the laser beam through an optical system, and irradiating the laser beam on the conductive silver paste of the fixed bracket, so that the material is instantly heated to be above a melting point, the material is sintered, and the conductive material on the cushion block is cured. The device has the beneficial effects that by arranging the laser transmitter, the conductive material can be rapidly heated and cured, the curing efficiency is effectively improved, material deformation is reduced, in-situ direct solidification of the conductive material is achieved, and integrated manufacturing of a supporting circuit structure is achieved.

Description

Technical Field

[0001] This invention relates to the technical field of conductive material curing, and specifically to an online curing device and method for conductive materials. Background Technology

[0002] With the rapid development of modern electronic technology, electronic products are evolving towards miniaturization, lightweighting, and functionality, which places more stringent demands on the performance and manufacturing processes of electronic components. Among numerous conductive materials, micro- and nano-scale conductive silver particles are widely used due to their excellent electrical conductivity, thermal conductivity, chemical stability, and processability. With breakthroughs in integrated circuit manufacturing technology, the simultaneous manufacturing of conductive materials during the structural manufacturing process has become a crucial factor determining the direct manufacturing quality of electronic circuit systems. How to achieve rapid and stable solidification of conductive materials is a key problem that urgently needs to be solved.

[0003] Therefore, we designed an online curing device and method for conductive materials, which can achieve rapid and stable solidification of conductive materials. Summary of the Invention

[0004] Objective of the invention: To provide an online curing device and method for conductive materials to solve the above-mentioned problems existing in the prior art.

[0005] Technical solution: An online curing device for conductive materials, comprising a curing assembly including a base, a bracket disposed on the side of the base, a connecting frame slidably disposed on the bracket, a dispensing pen disposed on the front side of the connecting frame, and a laser emitter disposed in the middle of the front side of the connecting frame; and, The adjustment assembly includes an x-axis adjustment component disposed within the bracket and slidably connected to the connecting frame, a y-axis adjustment component disposed at the top of the base, and a z-axis adjustment component disposed within the connecting frame and slidably connected to the x-axis adjustment component.

[0006] Optimally, the x-axis adjusting component includes an x-axis motor mounted on a bracket, an x-axis transmission belt mounted at the output end of the x-axis motor, and an x-axis slide rail mounted on the bracket and parallel to the side of the belt transmission unit; wherein the connecting frame is fixedly connected to the belt of the x-axis transmission belt and slidably connected to the x-axis slide rail.

[0007] Optimally, the y-axis adjusting component includes a sliding seat disposed at the top of the base, a y-axis transmission belt disposed at the bottom of the sliding seat, a y-axis motor disposed on the base and connected to the y-axis transmission belt, a y-axis slide rail disposed at the bottom of the base and disposed on the side of the transmission belt, a base plate fixedly connected to the belt of the y-axis transmission belt and slidably connected to the slide rail of the y-axis slide rail, and a pad fixedly disposed on the base plate.

[0008] Optimally, the z-axis adjusting component includes a z-axis motor mounted on a connecting frame, a z-axis transmission belt mounted on the connecting frame and mounted at the output end of the z-axis motor, z-axis slide rails mounted on both sides of the z-axis transmission belt, and a connecting plate fixedly connected to the belt of the z-axis transmission belt and slidably connected to the z-axis slide rails. Ideally, a fixed support is provided on the front side of the connecting plate, and a glue pen is movably mounted on the fixed support.

[0009] Ideally, a handheld controller and a device switch are respectively provided on both sides of the bracket.

[0010] Ideally, the laser emitter is mounted on the connecting frame via a laser fixing bracket.

[0011] An online curing method for conductive materials, characterized by the following steps: S1. Start the printing equipment control system and air compressor in sequence according to the standard operating procedure. After the system initialization is completed, create a new control program file through the equipment switch and input the corresponding process parameter instructions. S2. After printing is complete, assemble the laser emitter onto the laser mounting bracket and adjust the position of the laser emitter using the laser mounting bracket. S3. A laser beam is generated by a laser emitter, and after being focused by an optical system, it is irradiated onto the conductive silver paste on the fixed bracket, instantly heating the material above its melting point to achieve sintering and solidify the conductive material on the pad.

[0012] The beneficial effects of this invention are: by setting a laser emitter, conductive materials can be heated and cured quickly, effectively improving curing efficiency, reducing porosity, increasing sintering speed, reducing material deformation, and improving the performance and reliability of electronic devices. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a structural schematic diagram of the present invention from another angle; Figure 3 This is a schematic diagram of the rear structure of the present invention; Figure 4 This is a detailed structural diagram of the x-axis adjustment component in this invention; Figure 5 This is a detailed structural diagram of the y-axis adjustment component in this invention; Figure 6 This is a detailed structural diagram of the z-axis adjustment component in this invention; Figure 7 This is a schematic diagram of the laser fixing support in this invention; Figure 8 This is a schematic diagram of the printhead printing process of the present invention; Figure 9 This is a printed physical image of the present invention; Figure 10 A printed image of the experimental prototype; Figure 11 V in this invention 打印 The image shows the CT scan results of a part with a speed of 2 mm / s. Figure 12 V in this invention 打印 The image shows the CT scan results of a part with a speed of 3 mm / s. Figure 13 This is a three-dimensional histogram of the resistance of the present invention.

[0014] The attached figures are labeled as follows: 1. Curing component; 2. Adjustment component; 3. Handheld controller; 4. Equipment switch; 11. Base; 12. Bracket; 13. Connecting frame; 14. Dispensing pen; 15. Laser emitter; 16. Fixed bracket; 17. Laser fixing support; 21. X-axis adjusting component; 22. Y-axis adjusting component; 23. Z-axis adjusting component; 211. X-axis motor; 222. X-axis conveyor belt; 213. X-axis slide rail; 221. Sliding seat; 222. Y-axis conveyor belt; 223. Y-axis motor; 224. Y-axis slide rail; 225. Base plate; 226. Pad; 231. Z-axis motor; 232. Z-axis conveyor belt; 233. Z-axis slide rail; 334. Connecting plate. Detailed Implementation

[0015] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Specific Implementation Example 1: As attached Figure 1-7 As shown, in this embodiment, an online curing device for conductive materials includes a curing component 1, which includes a base 11, a bracket 12 disposed on the side of the base 11, a connecting frame 13 slidably disposed on the bracket 12, a dispensing pen 14 disposed on the front side of the connecting frame 13, and a laser emitter 15 disposed in the middle of the front side of the connecting frame 13. A bracket 12 is fixedly mounted on the right side of the base 11. A connecting frame 13 is slidably mounted on the top of the bracket 12. A dispensing pen 14 is mounted on the front side of the connecting frame 13 via a fixing bracket 16. A laser fixing support 17 is mounted in the middle of the connecting frame 13, and a laser emitter 15 is mounted on the laser fixing support 17. A control button is located on the front side of the base 11 for controlling the device.

[0017] Adjustment component 2 includes an x-axis adjustment component 21 disposed within the bracket 12 and slidably connected to the connecting frame 13, a y-axis adjustment component 22 disposed at the top of the base 11, and a z-axis adjustment component 23 disposed within the connecting frame 13 and slidably connected to the x-axis adjustment component 21.

[0018] The x-axis adjustment component 21 is located at the top center of the base 11, the y-axis adjustment component 22 is located on the inner side of the top of the bracket 12, driving the connecting frame 13 to move on the bracket 12, and the z-axis adjustment component 23 is located inside the connecting frame 13.

[0019] The x-axis adjusting component 21 includes an x-axis motor 211 mounted on the bracket 12, an x-axis transmission belt 212 mounted on the output end of the x-axis motor 211, and an x-axis slide rail 213 mounted on the bracket 12 and parallel to the side of the belt transmission unit 212; wherein, the connecting frame 13 is fixedly connected to the belt of the x-axis transmission belt 212 and slidably connected to the x-axis slide rail 213.

[0020] When the x-axis motor 211 starts, it drives the x-axis transmission belt 212 to rotate. Since the connecting frame 13 is fixedly connected to the belt of the x-axis transmission belt 212, the connecting frame 13 will slide on the x-axis slide rail 213 as the x-axis transmission belt 212 rotates, realizing the movement adjustment in the x-axis direction. The x-axis transmission belt 212 includes two pulleys rotatably mounted on the bracket 12, and a belt connected between the two pulleys. One of the two pulleys is connected to the x-axis motor 211, the belt is fixedly connected to the connecting frame 13, and the connecting frame 13 is slidably connected to the x-axis slide rail 213 by a slider.

[0021] The y-axis adjusting component 22 includes a sliding seat 221 disposed at the top of the base 11, a y-axis transmission belt 222 disposed at the bottom of the sliding seat 221, a y-axis motor 223 disposed on the base 11 and connected to the y-axis transmission belt 222, a y-axis slide rail 224 disposed at the bottom of the base 11 and disposed on the side of the transmission belt 222, a base plate 225 fixedly connected to the belt of the y-axis transmission belt 222 and slidably connected to the slide rail of the y-axis slide rail 224, and a pad 226 fixedly disposed on the base plate 225.

[0022] When the Y-axis motor 223 starts, it drives the Y-axis transmission belt 222 to rotate. Since the base plate 225 is fixedly connected to the belt of the Y-axis transmission belt 222, and the base plate 225 is slidably connected to the Y-axis slide rail 224 through a slider, the base plate 225 will slide on the Y-axis slide rail 224 as the Y-axis transmission belt 222 rotates, thereby driving the pad block 226 to move back and forth. The Y-axis transmission belt 222 also includes two pulleys rotatably mounted on the base 11, and a belt connected between the two pulleys. One of the pulleys is connected to the Y-axis motor 223, and the belt is fixedly connected to the base plate 225.

[0023] The z-axis adjusting component 23 includes a z-axis motor 231 mounted on the connecting frame 13, a z-axis transmission belt 232 mounted on the connecting frame 13 and mounted at the output end of the z-axis motor 231, z-axis slide rails 233 mounted on both sides of the z-axis transmission belt 232, and a connecting plate 234 fixedly connected to the belt of the z-axis transmission belt 232 and slidably connected to the z-axis slide rails 233.

[0024] When the Z-axis motor 231 starts, it drives the Z-axis transmission belt 232 to rotate. Since the connecting plate 234 is fixedly connected to the belt of the Z-axis transmission belt 232, and the connecting plate 234 is slidably connected to the Z-axis slide rail 233 through a slider, the connecting plate 234 will slide on the Z-axis slide rail 233 as the Z-axis transmission belt 232 rotates, realizing the movement adjustment in the Z-axis direction. The Z-axis transmission belt 232 also includes two pulleys rotatably mounted on the connecting frame 13, and a belt connected between the two pulleys. One of the pulleys is connected to the Z-axis motor 231, and the belt is fixedly connected to the connecting plate 234. A fixed support 16 is provided on the front side of the connecting plate 234, and a glue pen 14 is movably mounted on the fixed support 16.

[0025] The fixed support 16 is connected to the connecting frame 13. The fixed support 16 is equipped with a fine-tuning component, which can drive the dispensing pen 14 to slide along the z-axis.

[0026] A handheld controller 3 and a device switch 4 are respectively installed on both sides of the bracket 12.

[0027] The laser emitter 15 is mounted on the connecting frame 13 via a laser fixing bracket 17.

[0028] The laser mounting bracket 17 includes an XY axis fine-tuning platform connected to the base by a T-shaped bracket for adjusting the position of the laser emitter 15.

[0029] An online curing method for conductive materials, characterized by the following steps: S1. Start the conductive paste or ink printing equipment control system and air compressor in sequence according to the standard operating procedure. After the system initialization is completed, create a new control program file through equipment switch 4 and input the corresponding process parameter instructions. S2. After printing is completed, assemble the laser emitter 15 onto the laser fixing bracket 17, and adjust the position of the laser emitter 15 through the laser fixing bracket 17. S3. A laser beam is generated by the laser emitter 15, and after being focused by the optical system, it is irradiated onto the conductive silver paste on the fixed bracket 16, so that the material is instantly heated to above the melting point, thereby achieving sintering of the material and solidifying the conductive material on the pad 226.

[0030] Working principle explanation: In use, the operator first starts the equipment via the handheld controller 3, and the equipment switch 4 simultaneously completes the initialization self-test program. After the conductive paste or ink printing equipment enters the standby state, the preset process parameters are input into the control interface, including key indicators such as dispensing trajectory coordinates, laser power density, and sintering temperature curve. Through the three-dimensional motion module composed of the x-axis adjustment component 21, y-axis adjustment component 22, and z-axis adjustment component 23, the connecting frame 13 carries the dispensing pen 14 to complete the precise coating of conductive silver paste along the planned path. During this process, the z-axis motor 231, in conjunction with the fine-tuning component, achieves constant distance control between the pen tip and the substrate. After the coating process is completed, the laser emitter 15 is precisely aligned with the coating area through the XY-axis fine-tuning platform. The emitted high-energy pulsed laser is focused into a spot with a diameter of 0.1-0.5 mm by the focusing lens group. Under the instantaneous action of 50-200 ms, the temperature of the silver paste layer exceeds 961.8℃ (the melting point of silver), completing the phase transition curing from amorphous to crystalline state. During the curing process, the Y-axis conveyor belt 222 drives the pad 226 to reciprocate at a uniform speed, ensuring uniform distribution of laser energy. Simultaneously, the air compressor continuously supplies clean, dry compressed air, creating a localized inert gas protective environment to prevent material oxidation. The entire process is controlled by a PLC system to achieve sequential linkage of dispensing, sintering, and cooling, with a single-point curing cycle controlled within 3 seconds, representing a 400% improvement in efficiency compared to traditional hot air curing. Specific Implementation Example 2: Combination Figure 9 , 10 In this embodiment, based on the substrate size, a 15mm long straight line is printed on the substrate every 5mm. Figure 9 The experimental subject of this experiment is a set of straight lines printed on a 50×20mm substrate at printing speeds of 1-5mm / s. Figure 10 The result was obtained under the conditions of sintering with reference parameters (sintering power: 2W, sintering height: 125mm, sintering speed: 1mm / s, number of sintering times: 1).

[0032] Combination Figure 11 , 12 In this embodiment, CT scanning is mainly used to characterize the microstructure of sintered conductive silver paste samples. The analysis process can be divided into three steps: scanning, reconstruction, and analysis. The scanning step acquires two-dimensional projection data of the sample. The reconstruction step transforms the two-dimensional projection data into three-dimensional volume data. The computer uses mathematical inversion to calculate the linear attenuation coefficient distribution at various points within the sample, outputting data that can be sliced ​​to display the internal structure of any cross-section. The final analysis quantitatively characterizes the microstructure features of the sintered sample, including pore analysis, defect detection, and three-dimensional visualization. The CT scan results show that when the sintering height (h) is a single variable, Figure 11 V打印 Those with a velocity of 2 mm / s have fewer internal pores, with a pore distribution analysis result of 42.67%; while Figure 1 V 打印 The one with a speed of 3 mm / s has a large number of internal pores, with a porosity of 49.89%. Specific Implementation Example 3: Combination Figure 13 In this embodiment, during resistance testing, the substrate is fixed using small vises to eliminate measurement errors caused by environmental vibrations, ensuring no sample displacement during the test and guaranteeing the accuracy of the results. Next, the red and black probes are held against both ends of the test line segment to ensure the segment length is essentially consistent, maintaining a single variable. Simultaneously, multiple measurements are taken for each straight line segment, and the average value is calculated to reduce testing error. When sintering power is used as a changing factor, V... 打印 : 3mm / s, P: 1.0W, maximum resistance is 0.9Ω. The optimal sintering parameters were ultimately determined to be: P: 2.0W, H: 115mm, V. 烧结 3mm / s, n: 1 time. It was found that the sintering parameters affect porosity as follows: increasing power and decreasing sintering height decreases porosity, while increasing sintering speed and increasing the number of sintering times increases porosity.

[0034] The preferred embodiments have been shown and described, but should not be construed as limiting the invention itself. Various changes in form and detail may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. An online curing device for conductive materials, characterized in that: include, The curing assembly (1) includes a base (11), a bracket (12) disposed on the side of the base (11), a connecting frame (13) slidably disposed on the bracket (12), a dispensing pen (14) disposed on the front side of the connecting frame (13), and a laser emitter (15) disposed in the middle of the front side of the connecting frame (13); and, The adjustment assembly (2) includes an x-axis adjustment member (21) disposed in the bracket (12) and slidably connected to the connecting frame (13), a y-axis adjustment member (22) disposed at the top of the base (11), and a z-axis adjustment member (23) disposed in the connecting frame (13) and slidably connected to the x-axis adjustment member (21).

2. The online curing device for conductive materials according to claim 1, characterized in that: The x-axis adjustment component (21) includes an x-axis motor (211) mounted on the bracket (12), an x-axis transmission belt (212) mounted on the output end of the x-axis motor (211), and an x-axis slide rail (213) mounted on the bracket (12) and parallel to the side of the belt transmission unit (212). The connecting frame (13) is fixedly connected to the belt of the x-axis transmission belt (212) and slidably connected to the x-axis slide rail (213).

3. The online curing device for conductive materials according to claim 2, characterized in that: The y-axis adjusting component (22) includes a sliding seat (221) at the top of the base (11), a y-axis transmission belt (222) at the bottom of the sliding seat (221), a y-axis motor (223) on the base (11) and connected to the y-axis transmission belt (222), a y-axis slide rail (224) at the bottom of the base (11) and on the side of the transmission belt (222), a base plate (225) fixedly connected to the belt of the y-axis transmission belt (222) and slidably connected to the slide rail of the y-axis slide rail (224), and a pad (226) fixedly installed on the base plate (225).

4. The online curing device for conductive materials according to claim 3, characterized in that: The z-axis adjusting component (23) includes a z-axis motor (231) mounted on a connecting frame (13), a z-axis transmission belt (232) mounted on the connecting frame (13) and mounted at the output end of the z-axis motor (231), z-axis slide rails (233) mounted on both sides of the z-axis transmission belt (232), and a connecting plate (234) fixedly connected to the belt of the z-axis transmission belt (232) and slidably connected to the z-axis slide rails (233).

5. The online curing apparatus for conductive materials according to claim 4, characterized in that: A fixed support (16) is provided on the front side of the connecting plate (234), and a glue pen (14) is movably mounted on the fixed support (16).

6. The online curing apparatus for conductive materials according to claim 5, characterized in that: A handheld controller (3) and a device switch (4) are respectively provided on both sides of the bracket (12).

7. The online curing apparatus for conductive materials according to claim 6, characterized in that: The laser emitter (15) is mounted on the connecting frame (13) via a laser fixing bracket (17).

8. An online curing method for conductive materials, characterized in that: Includes the following steps: S1. Start the printing equipment control system and air compressor in sequence according to the standard operating procedure. After the system initialization is completed, create a new control program file through the equipment switch (4) and input the corresponding process parameter instructions. S2. After printing, assemble the laser emitter (15) onto the laser fixing bracket (17) and adjust the position of the laser emitter (15) through the laser fixing bracket (17). S3. A laser beam is generated by the laser emitter (15), and after being focused by the optical system, it is irradiated onto the conductive silver paste of the fixed bracket (16), so that the material is instantly heated to above the melting point, thereby achieving sintering and solidification of the material.

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