Leading-out assembly and solid-state battery

Abstract

The invention provides a lead-out assembly which comprises a mounting substrate, a terminal structure and a current collecting layer arranged on the mounting substrate, and the current collecting layer is used for being in contact with a battery cell; the terminal structure comprises at least one external terminal, the external terminal comprises a first section and a second section which are connected with each other, the first section is arranged on the mounting substrate and is electrically connected with the current collecting layer, and the second section extends out of the mounting substrate; in the thickness direction of the current collecting layer, the first section is bent towards the side where the installation substrate is located relative to the current collecting layer. According to the leading-out assembly, the risk of warping, protruding, cracking and other problems of the external terminal in the hot pressing process can be reduced, the risk of short circuit caused by the fact that the external terminal makes contact with a current collector or other external terminals in the hot pressing process is reduced, and the production yield and the use safety of the battery are improved. The invention also provides a solid-state battery.

Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to an output component and a solid-state battery. Background Technology

[0002] In the research and application of solid-state batteries, bipolar stacking structures are widely considered an important means to improve battery energy density and performance. A bipolar stacked cell generally includes multiple composite electrodes, each of which includes a current collector and positive and negative active material layers respectively disposed on opposite sides of the current collector. Multiple composite electrodes are stacked sequentially, with adjacent composite electrodes separated by solid electrolyte layers. The multiple composite electrodes and each solid electrolyte layer are bonded together by a hot-pressing process to form a cell. Summary of the Invention

[0003] To ensure sufficient contact between the solid electrolyte layers and the adjacent positive and negative active material layers, the composite electrode and solid electrolyte layers are typically hot-pressed under pressure exceeding 300 MPa during cell manufacturing. Under such high pressure, the tabs at their interface with the cell are subjected to significant shear forces, making them prone to warping, bulging, and cracking. This affects the reliability of the tabs. Furthermore, warping and bulging can easily cause the positive and negative tabs or the tabs to come into contact with the current collector, leading to short circuits. This reduces the final yield of the solid-state battery assembly and increases the safety risks associated with its use.

[0004] The purpose of this application is to provide a lead-out component that can reduce the risk of warping, bulging, cracking, etc. of external terminals during hot pressing, reduce the risk of short circuits caused by contact between external terminals and current collectors or other external terminals during hot pressing, and improve the production yield and safety of the battery.

[0005] This application provides a lead-out component, including a mounting substrate, a terminal structure, and a current collector layer disposed on the mounting substrate. The current collector layer is used to contact a battery cell. The terminal structure includes at least one external terminal, and the external terminal includes a first segment and a second segment connected to each other. The first segment is disposed on the mounting substrate and electrically connected to the current collector layer, and the second segment extends beyond the mounting substrate. Along the thickness direction of the current collector layer, the first segment is bent relative to the current collector layer towards the side where the mounting substrate is located.

[0006] In one possible implementation, the first segment includes a bend, and the second segment and the current collector are connected via the bend; along the thickness direction, the bend is bent relative to the current collector toward the side where the mounting substrate is located.

[0007] In one possible implementation, the bending angle of the bent portion relative to the flow collector is α, where 0° < α ≤ 90°.

[0008] In one possible implementation, the first segment further includes a first extension, and the second segment and the bent portion are connected via the first extension.

[0009] In one possible implementation, both the first extension and the second section are flat plate structures parallel to the mounting substrate.

[0010] In one possible implementation, the first segment further includes a second extension, through which the bend and the current collection layer are connected.

[0011] In one possible implementation, the mounting substrate has a mounting surface, the current collector is disposed on the mounting surface, and an insulating structure is provided between the first section and the plane containing the mounting surface; The bending depth of the first section relative to the current collector layer on the side facing the mounting substrate is h, where h ≥ e*g*U T +t1; where e is the insulation design redundancy coefficient of the insulation structure, 1≤e≤3; g is the insulation coefficient of the insulation structure; U T t1 is the nominal voltage of the entire battery cell; t1 is the thickness of the external terminal.

[0012] In one possible implementation, at least a portion of the first segment is embedded and fixed within the mounting substrate.

[0013] In one possible implementation, the mounting substrate has a mounting groove, at least a portion of the first section is fixedly disposed within the mounting groove, and the second section and the current collector are both located outside the mounting groove and respectively located on opposite sides of the first section.

[0014] In one possible implementation, an insulating fastener is provided within the mounting groove and is fixed to the mounting substrate; at least a portion of the first section is fixed to the insulating fastener.

[0015] In one possible implementation, the insulating fastener contains a first insulating adhesive, and at least a portion of the first section is embedded between the insulating fastener and the first insulating adhesive, wherein the first section is bonded and fixed to the insulating fastener by the first insulating adhesive.

[0016] In one possible implementation, the mounting substrate has a second insulating layer that covers the first insulating adhesive and the insulating fastener.

[0017] In one possible implementation, the first segment includes a first extension, a bent portion, and a second extension connected in sequence, wherein the bent portion bends relative to the current collector layer toward the mounting substrate along the thickness direction; the second segment and the bent portion are connected via the first extension, and the bent portion and the current collector layer are connected via the second extension; the first extension and at least a portion of the bent portion are fixedly disposed within the mounting groove.

[0018] In one possible implementation, the mounting substrate has a mounting surface, the current collector layer and the second extension are both disposed on the mounting surface, an insulating structure is provided between the first section and the plane of the mounting surface, the insulating structure includes a first insulating adhesive and a first insulating layer; the first insulating adhesive is disposed in the mounting groove, and the first insulating adhesive is located between the first extension and the plane of the mounting surface, the surface of the first insulating adhesive away from the mounting substrate is flush with the mounting surface; the first insulating layer is disposed between the current collector layer and the mounting surface and between the second extension and the plane of the mounting surface.

[0019] In one possible implementation, the bending depth of the first segment relative to the current collector layer on the side facing the mounting substrate is h, where h ≥ e1*g1*U T + e2*g2*U T +t1; where e1 is the insulation design redundancy coefficient of the first insulating layer, 1≤e1≤3; g1 is the insulation coefficient of the first insulating layer; e2 is the insulation design redundancy coefficient of the first insulating adhesive, 1≤e2≤3; g2 is the insulation coefficient of the first insulating adhesive; U T t1 is the nominal voltage of the entire battery cell; t1 is the thickness of the external terminal.

[0020] In one possible implementation, the minimum distance between the bent portion and the inner wall of the mounting groove is b. min b min ≥e1*g1*U T + e2*g2*U T Where, e1 is the insulation design redundancy coefficient of the first insulating layer, 1≤e1≤3; g1 is the insulation coefficient of the first insulating layer; e2 is the insulation design redundancy coefficient of the first insulating adhesive, 1≤e2≤3; g2 is the insulation coefficient of the first insulating adhesive; U T This is the nominal voltage of the entire battery cell.

[0021] In one feasible approach, the external terminal and the current collector are an integral structure.

[0022] In one possible implementation, the terminal structure includes a plurality of external terminals, which are spaced apart along the width direction of the current collector.

[0023] This application also provides a solid-state battery, including a cell and a lead-out assembly as described above, wherein the current collector is in contact with the cell.

[0024] In one possible implementation, there are two lead-out components, with the battery cell located between the current collectors of the two lead-out components; the current collector in one lead-out component is in contact with one side of the battery cell, and the current collector in the other lead-out component is in contact with the other side of the battery cell.

[0025] In one possible embodiment, the solid-state battery further includes a sealing side plate located between the mounting substrates of the two lead-out components and surrounding the periphery of the cell. The sealing side plate is fixedly connected to the mounting substrates of the two lead-out components. A second section of the external terminal extends beyond the solid-state battery after bypassing the sealing side plate. A second insulating adhesive is filled between the sealing side plate and the cell.

[0026] In one possible implementation, the solid-state battery further includes an insulating film that wraps around the outside of the mounting substrate and the sealing side plate; a second section of the external terminal extends beyond the insulating film.

[0027] In one possible implementation, the battery cell includes a plurality of battery cell units stacked sequentially along the thickness direction of the current collector, each battery cell unit including a positive electrode active material layer, a solid electrolyte layer and a negative electrode active material layer stacked sequentially along the thickness direction; The current collector layer in one of the lead-out components is in contact with the positive active material layer in one of the outermost cell units, and the current collector layer in the other lead-out component is in contact with the negative active material layer in the other outermost cell unit.

[0028] In one feasible manner, a current collector is provided between each pair of adjacent cell units; in each pair of adjacent cell units, adjacent positive electrode active material layers and negative electrode active material layers are respectively disposed on opposite sides of the corresponding current collector, so that adjacent positive electrode active material layers, current collectors and negative electrode active material layers constitute a composite electrode.

[0029] The lead-out component provided in this application, by setting the first section of the external terminal as a bent structure, with the first section bent relative to the current collector towards the mounting substrate, can reduce the shear force on the first section during hot pressing, thereby reducing the risk of warping, bulging, cracking, and other problems of the external terminal during hot pressing. At the same time, since the first section is bent relative to the current collector towards the mounting substrate, the second section is located on the side of the current collector away from the cell. The bending depth of the first section can offset at least part of the deformation of the external terminal during hot pressing, thereby reducing the risk of short circuit caused by contact between the external terminal and the current collector or other external terminals, and improving the production yield and safety of the battery. Attached Figure Description

[0030] Figure 1 This is a cross-sectional schematic diagram of the solid-state battery in an embodiment of this application.

[0031] Figure 2 for Figure 1 A magnified diagram of a local location.

[0032] Figure 3 This is a schematic diagram of the assembly process of the battery cell and lead-out assembly in an embodiment of this application.

[0033] Figure 4 This is a three-dimensional structural diagram of the components introduced in the embodiments of this application.

[0034] Figures 5A to 5E This is a schematic diagram of the assembly process of the components introduced in the embodiments of this application.

[0035] Figure 6 This is a magnified schematic diagram of a partial location of the solid-state battery in another embodiment of this application.

[0036] Figure 7 This is a three-dimensional structural diagram of the extended component in another embodiment of this application.

[0037] Figure 8 This is a cross-sectional schematic diagram of the battery cell during hot pressing in the comparative example of this application.

[0038] In the figure: 1-Mounting substrate, 10-Mounting surface, 101-Step portion, 11-Mounting groove, 111-Inner sidewall, 12-Insulating fastener, 121-Slope, 13-Second insulating layer, 2-Terminal structure, 20-External terminal, 21-First section, 211-First extension, 212-Bending portion, 213-Second extension, 22-Second section, 3-Battery cell, 30-Battery cell unit, 300-Composite electrode sheet, 31-Positive electrode active material layer, 32-Solid electrolyte layer, 33-Negative electrode active material layer, 34-Current collector, 4-Current collector layer, 5-Insulating structure, 51-First insulating adhesive, 52-First insulating layer, 6-Sealed side plate, 7-Second insulating adhesive, 8-Insulating film, 9-Pressure plate. Detailed Implementation

[0039] The specific embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but are not intended to limit the scope of this application.

[0040] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0041] The directional terms such as "upper," "lower," "left," "right," "front," "back," "top," and "bottom" (if present) used in the specification and claims of this application are defined according to the position of the structures in the drawings and the relative positions of the structures, and are only for the purpose of clarity and convenience in expressing the technical solution. It should be understood that the use of directional terms should not limit the scope of protection claimed in this application.

[0042] like Figures 1 to 4 As shown, this application embodiment provides a lead-out component, including a mounting substrate 1, a terminal structure 2, and a current collector 4 disposed on the mounting substrate 1. The current collector 4 is used to contact a battery cell 3 to electrically connect the current collector 4 and the battery cell 3; the battery cell 3 is located on the side of the current collector 4 away from the mounting substrate 1. The terminal structure 2 includes at least one external terminal 20. Both the external terminal 20 and the current collector 4 are sheet-like structures. Each external terminal 20 includes a first segment 21 and a second segment 22 that are interconnected. The first segment 21 is disposed on the mounting substrate 1 and electrically connected to the current collector 4, and the second segment 22 extends beyond the mounting substrate 1. The first segment 21 is a bent structure; the current collector 4 has a thickness direction T and a width direction W that are perpendicular to each other. Along the thickness direction T of the current collector 4, the first segment 21 is bent relative to the current collector 4 towards the side where the mounting substrate 1 is located (that is, the first segment 21 is bent relative to the current collector 4 towards the side away from the battery cell 3).

[0043] like Figure 1 and Figure 2As shown, in one embodiment, along the thickness direction T, the second section 22 is located on the side of the current collector 4 closer to the mounting substrate 1 (that is, the second section 22 is located on the side of the current collector 4 away from the battery cell 3).

[0044] Specifically, such as Figure 8 As shown, the current external terminals 20 are generally flat structures (i.e., flat structures). When the battery cell 3 is hot-pressed using a hot-pressing device, the pressure plate 9 of the hot-pressing device applies pressure to the battery cell 3 from both sides. At this time, the external terminals 20 will deform towards the side closer to the battery cell 3. At the same time, because the external terminals 20 will be subjected to a large shear force at the interface between them and the battery cell 3, the external terminals 20 are prone to warping, bulging, cracking, and other problems, affecting the reliability of the external terminals 20 in subsequent use. Moreover, after the external terminals 20 warp, bulge, or undergo other deformation problems (in Figure 8 In the diagram, the dashed line represents the deformed external terminal 20. The external terminal 20 is prone to contact with the current collector 34 in the cell 3 or other external terminals 20, which can cause a short circuit, thereby reducing the production yield of the battery and increasing the safety risks of battery use.

[0045] In this embodiment, such as Figure 1 and Figure 2 As shown, by setting the first section 21 of the external terminal 20 as a bent structure, the first section 21 is bent relative to the side of the current collector 4 facing the mounting substrate 1, which can reduce the shear force on the first section 21 during hot pressing (during hot pressing, when the first section 21 is subjected to pressure towards the side closer to the cell 3, the bent part of the first section 21 will first deform towards the side closer to the cell 3, thereby relieving part of the pressure on the first section 21 and reducing the shear force on the first section 21), thereby reducing the risk of warping, bulging, cracking and other problems of the external terminal 20 during hot pressing. Meanwhile, since the first section 21 is bent towards the side of the mounting substrate 1 relative to the current collector 4, the second section 22 is located on the side of the current collector 4 away from the cell 3. The bending depth h of the first section 21 can offset at least part of the deformation of the external terminal 20 during the hot pressing process (i.e., offset the displacement of the external terminal 20 in the thickness direction T), thereby reducing the risk of short circuit caused by the external terminal 20 contacting the current collector 34 or other external terminals 20 (since the external terminal 20 is bent towards the side of the mounting substrate 1, the distance between the external terminal 20 and the current collector 34 or other external terminals 20 in the thickness direction T is increased. During the hot pressing process, even if the external terminal 20 deforms towards the side closer to the cell 3, the external terminal 20 is not likely to contact the current collector 34 or other external terminals 20), thus improving the production yield and safety of the battery.

[0046] like Figures 1 to 3As shown, in one embodiment, the battery cell 3 is a solid-state battery cell, which includes a plurality of battery cell units 30 stacked sequentially along the thickness direction T, forming a structure in which the plurality of battery cell units 30 are connected in series. Each battery cell unit 30 includes a positive electrode active material layer 31, a solid electrolyte layer 32 and a negative electrode active material layer 33 stacked sequentially along the thickness direction T.

[0047] like Figure 1 and Figure 2 As shown, in one embodiment, the first section 21 includes a bending portion 212, and the second section 22 and the current collector layer 4 are connected by the bending portion 212. Along the thickness direction T, the bending portion 212 bends relative to the current collector layer 4 toward the side where the mounting substrate 1 is located.

[0048] like Figure 6 As shown, in one embodiment, the bending angle of the bent portion 212 relative to the current collection layer 4 is a (the bending angle a is also the angle between the bent portion 212 and the mounting substrate 1), 0° < a ≤ 90°.

[0049] like Figure 1 and Figure 2 As shown, in one embodiment, the bent portion 212 is perpendicular to the flow collection layer 4, that is, a is 90°.

[0050] like Figure 6 As shown, in another embodiment, the bending portion 212 is inclined relative to the current collection layer 4, where 0° < a < 90°. By setting the bending portion 212 as an inclined structure, the deformation resistance of the external terminal 20 can be improved. During the hot pressing process and subsequent use, the external terminal 20 can withstand greater deformation and pressure, which is beneficial to improving the structural stability of the external terminal 20.

[0051] like Figure 1 and Figure 2 As shown, in one embodiment, the first section 21 further includes a first extension 211, and the second section 22 and the bent section 212 are connected by the first extension 211. The first extension 211 and the second section 22 are both flat structures (i.e., flat structures) parallel to the mounting substrate 1, and the first extension 211 and the second section 22 are on the same plane.

[0052] like Figure 1 and Figure 2 As shown, in one embodiment, the first section 21 further includes a second extension 213, and the bending portion 212 and the current collection layer 4 are connected through the second extension 213. The second section 22, the first extension 211, the bending portion 212 and the second extension 213 are connected sequentially, and the second section 22, the first extension 211, the bending portion 212 and the second extension 213 are an integral structure.

[0053] like Figure 1 and Figure 2 As shown, in one embodiment, the second extension 213 is a flat plate structure parallel to the current collector 4. The second extension 213 and the current collector 4 are on the same plane, that is, both the second extension 213 and the current collector 4 are parallel to the mounting substrate 1. The bending portion 212 is bent and connected between the first extension 211 and the second extension 213.

[0054] like Figure 1 and Figure 2 As shown, in one embodiment, the bent portion 212 is a flat structure. In other embodiments, the bent portion 212 may also be a non-flat structure, such as a curved structure (specifically, it may be an arc-shaped structure, etc.).

[0055] In one embodiment, the connection between the bent portion 212 and the first extension portion 211 is a smooth transition, and the connection between the bent portion 212 and the second extension portion 213 is a smooth transition.

[0056] In one implementation, the external terminal 20 and the current collector 4 are an integral structure. Specifically, the external terminal 20 can be formed by cutting and bending the edge of the current collector 4, thus eliminating the need for soldering the external terminal 20 and the current collector 4. This avoids problems caused by poor soldering or over-soldering during soldering, saves costs by eliminating the soldering step, and reduces the resistance between the external terminal 20 and the current collector 4. Of course, in other embodiments, the external terminal 20 and the current collector 4 can also be separate structures, which can be connected by soldering.

[0057] In one implementation, the current collector layer 4 is a current collector foil, which can be made of stainless steel, copper, aluminum, or composite foil (e.g., copper-aluminum composite foil, copper-stainless steel composite foil). The external terminal 20 can also be made of the above materials.

[0058] like Figures 1 to 4 As shown, in one embodiment, along the width direction W of the current collector layer 4, the width of the external terminal 20 is W1, where W1 ≥ k1*R*C / (n*t1*d1), and the unit of W1 is mm. Here, k1 is the overcurrent redundancy design coefficient of the external terminal 20, 1 < k1 ≤ 3; this coefficient ensures that the external terminal 20 does not overheat or melt under continuous high current flow, guaranteeing the operational safety of the external terminal 20. R is the maximum discharge rate of the cell 3 (i.e., the maximum discharge rate of the battery). C is the rated capacity of the cell 3 (i.e., the rated capacity of the battery), in Ah. n is the number of external terminals 20 in the terminal structure 2, where n is a positive integer greater than or equal to 1. t1 is the thickness of the external terminal 20, in mm. d1 is the maximum current allowed to pass through the external terminal 20 per unit cross-sectional area, in A / mm. 2 .

[0059] Specifically, this embodiment makes appropriate redundant design of the width W1 of the external terminal 20 (i.e., introduces a coefficient k1 in the above formula) to make appropriate redundant design of the overcurrent performance of the external terminal 20, so that the external terminal 20 can meet the requirements of high-rate charging and discharging, avoid overheating and melting of the external terminal 20 during operation, and ensure the safety of battery use.

[0060] like Figures 1 to 4 As shown, in one embodiment, the terminal structure 2 includes an external terminal 20, i.e., n is 1.

[0061] like Figure 7 As shown, in another embodiment, the terminal structure 2 includes a plurality of external terminals 20, i.e., n≥2 as described above; the plurality of external terminals 20 are spaced apart along the width direction W of the current collector 4, and all of the plurality of external terminals 20 are connected to the current collector 4. Specifically, the plurality of external terminals 20 are respectively connected to different positions of the current collector 4.

[0062] Specifically, by setting multiple external terminals 20, the multiple external terminals 20 can shunt the current, preventing current from concentrating on a single external terminal 20. This further avoids problems such as overheating and melting of the external terminal 20 during high-rate charging and discharging, ensuring the safety of battery use. At the same time, by setting multiple external terminals 20, the thickness of the external terminals 20 can be significantly reduced under the premise of the same overcurrent capacity, thereby reducing the thickness of the current collector layer 4 (the thickness of the current collector layer 4 is generally equal to that of the external terminals 20), thus reducing the weight of the battery and increasing the energy density of the battery.

[0063] In one embodiment, the terminal structure 2 includes at least three external terminals 20, i.e., n≥3; or, the terminal structure 2 includes at least five external terminals 20, i.e., n≥5.

[0064] like Figures 1 to 4 As shown, in one implementation, the thickness of the current collector 4 is t2, where t2 ≥ k2*R*C / (W2*d2), and the unit of t2 is mm. Here, k2 is the overcurrent redundancy design coefficient of the current collector 4, 1 < k2 ≤ 3; this coefficient ensures that the current collector 4 does not overheat or melt under continuous high current flow, guaranteeing the operational safety of the current collector 4. W2 is the width of the current collector 4, in mm. d2 is the maximum current allowed to pass through the current collector 4 per unit cross-sectional area, in A / mm. 2 .

[0065] Specifically, in this embodiment, the thickness t2 of the current collector layer 4 is appropriately redundantly designed (i.e., a coefficient k2 is introduced in the above formula), so as to make appropriate redundancy design for the overcurrent performance of the current collector layer 4, so that the current collector layer 4 can meet the requirements of high-rate charging and discharging, avoid overheating and other problems during the operation of the current collector layer 4, ensure the safety of battery use, and at the same time avoid the current collector layer 4 being too thick and affecting the energy density of the battery.

[0066] like Figures 1 to 4 As shown, in one embodiment, at least a portion of the first segment 21 is embedded and fixed within the mounting substrate 1, and the first segment 21 is insulated from the mounting substrate 1 (generally, the mounting substrate 1 is made of a conductive material, such as metal. Of course, the mounting substrate 1 can also be made of an insulating material). This arrangement can further reduce the risk of warping, bulging, wrinkling, cracking, and other problems occurring in the external terminal 20 during hot pressing; at the same time, since the first segment 21 is embedded and fixed within the mounting substrate 1, the mounting substrate 1 can protect the external terminal 20 and improve the tensile strength and sealing of the external terminal 20 during subsequent use (external moisture and other substances are less likely to enter the battery through the external terminal 20), and the external terminal 20 and the mounting substrate 1 form a whole, which is beneficial for the transportation and transfer of components during assembly.

[0067] like Figures 1 to 4 As shown, in one embodiment, the mounting substrate 1 is provided with a mounting groove 11, and at least a portion of the first section 21 is fixedly disposed in the mounting groove 11 (i.e., at least a portion of the first section 21 is embedded in the mounting groove 11), thereby embedding and fixing the first section 21 in the mounting substrate 1; the second section 22 and the current collector 4 are both located outside the mounting groove 11, and the second section 22 and the current collector 4 are respectively located on opposite sides of the first section 21.

[0068] Specifically, the mounting groove 11 is located on the side (i.e., the edge) of the mounting substrate 1, and the mounting groove 11 penetrates the side wall of the mounting substrate 1. The second section 22 extends out of the mounting groove 11 through the side opening of the mounting groove 11. In this embodiment, there is one mounting groove 11, which is used to mount one external terminal 20. Figure 7 As shown, when there are multiple external terminals 20, multiple mounting slots 11 need to be provided on the mounting base plate 1, and the multiple mounting slots 11 correspond one-to-one with the multiple external terminals 20.

[0069] like Figures 1 to 4As shown, in one embodiment, the first extension 211 and at least a partial bend 212 are fixedly disposed within the mounting groove 11, while the second extension 213 is located outside the mounting groove 11. Specifically, in this embodiment, one end of the bend 212 near the second extension 213 is located outside the mounting groove 11, and the other end of the bend 212 near the first extension 211 extends into the mounting groove 11, meaning that a portion of the bend 212 is fixedly disposed within the mounting groove 11.

[0070] like Figures 1 to 4 As shown, in one embodiment, an insulating fastener 12 is provided in the mounting groove 11, and the insulating fastener 12 is fixed to the mounting base 1. At least a portion of the first section 21 is located within the insulating fastener 12, and at least a portion of the first section 21 is fixed to the insulating fastener 12. A first insulating adhesive 51 is provided within the insulating fastener 12, and at least a portion of the first section 21 is embedded between the insulating fastener 12 and the first insulating adhesive 51. The first section 21 is bonded and fixed to the insulating fastener 12 by the first insulating adhesive 51, thereby embedding and fixing the first section 21 within the mounting base 1, and insulatingly separating the first section 21 from the mounting base 1. The first insulating adhesive 51 can be applied to the insulating fastener 12 by pouring insulating glue. During the pouring process, care should be taken to prevent the formation of air bubbles to ensure the sealing and insulation properties of the first insulating adhesive 51.

[0071] Specifically, in this embodiment, the first extension 211 and the partial bend 212 are located within the insulating fastener 12 and embedded between the insulating fastener 12 and the first insulating adhesive 51, with the first extension 211 and the bend 212 fitting against the inner wall of the insulating fastener 12; the second extension 213 is located outside the insulating fastener 12. The insulating fastener 12 is a drawer-shaped structure similar in shape to the mounting groove 11, and the second section 22 extends out of the insulating fastener 12 through a side opening. Figure 6 As shown, in another embodiment, when the bending portion 212 is an inclined structure, the insulating fastener 12 is provided with a ramp 121 that fits against the bending portion 212. The ramp 121 can support the bending portion 212, thereby improving the tightness of the fit between the external terminal 20 and the insulating fastener 12 and enhancing the pressure-bearing capacity of the external terminal 20.

[0072] like Figures 1 to 4 As shown, in one embodiment, the height of the insulating fastener 12 is equal to the depth of the mounting groove 11, so that the end face of the insulating fastener 12 (i.e., the end face of the insulating fastener 12 away from the mounting substrate 1 along the thickness direction T) is flush with the mounting surface 10 of the mounting substrate 1; at the same time, the surface of the first insulating adhesive 51 (i.e., the surface of the first insulating adhesive 51 away from the mounting substrate 1 along the thickness direction T) is flush with the mounting surface 10 of the mounting substrate 1.

[0073] In one embodiment, the insulating fastener 12 is bonded and fixed to the mounting substrate 1 by an adhesive (not shown), that is, the insulating fastener 12 is bonded and fixed to the inner wall of the mounting groove 11 by an adhesive. The insulating fastener 12 can be made of high-temperature and high-voltage resistant materials, such as PTFE (polytetrafluoroethylene), PVC (polyvinyl chloride), PP (polypropylene), PET (polyethylene terephthalate), etc. The mounting substrate 1 can be made of high-hardness materials such as stainless steel or aluminum alloy. The first insulating adhesive 51 and the adhesive can be made of high-temperature and high-voltage resistant materials, such as PTFE adhesive, PVC adhesive, PP adhesive, etc.

[0074] In one embodiment, both the inner and outer surfaces of the insulating fastener 12 are rough, thereby increasing the contact area and bonding performance between the adhesive and the outer surface of the insulating fastener 12, as well as between the first insulating adhesive 51 and the inner surface of the insulating fastener 12.

[0075] like Figures 1 to 5E As shown, in one embodiment, the mounting substrate 1 has a mounting surface 10, which is located on the side of the mounting substrate 1 facing the battery cell 3. The mounting groove 11 is formed by recessing the mounting surface 10 in a direction away from the battery cell 3. The current collector 4 and the second extension 213 are both provided on the mounting surface 10.

[0076] An insulating structure 5 is provided between the first section 21 and the plane containing the mounting surface 10. The bending depth of the first section 21 relative to the side of the current collector 4 facing the mounting substrate 1 (that is, the bending depth of the bent portion 212 relative to the side of the current collector 4 facing the mounting substrate 1) is h, where h ≥ e*g*U T +t1, h is in mm. Where e is the insulation design redundancy coefficient of the insulation structure 5, 1≤e≤3; this coefficient ensures the insulation performance between the first section 21 and the mounting substrate 1. g is the insulation coefficient of the insulation structure 5, that is, the thickness required for the insulation structure 5 to achieve the preset insulation effect under unit voltage, and g is in mm / V. T t1 is the nominal voltage of the entire cell 3, in V. t1 is the thickness of the external terminal 20, in mm.

[0077] Among them, U T =U*s; U is the nominal voltage of a single cell unit 30, in V; s is the number of cell units 30 in cell 3.

[0078] like Figures 1 to 5EAs shown, in one embodiment, the insulating structure 5 includes a first insulating adhesive 51 and a first insulating layer 52. The first insulating adhesive 51 is disposed in the mounting groove 11 and is located between the first extension 211 and the plane where the mounting surface 10 is located. The surface of the first insulating adhesive 51 away from the mounting substrate 1 is flush with the mounting surface 10. The first insulating layer 52 is disposed between the current collector 4 and the mounting surface 10 and between the second extension 213 and the plane where the mounting surface 10 is located (i.e., a part of the first insulating layer 52 is sandwiched between the current collector 4 and the mounting surface 10, and another part is sandwiched between the second extension 213 and the plane where the mounting surface 10 is located). The side of the first insulating layer 52 is flush with the inner wall of the insulating fastener 12 (specifically, the inner wall of the insulating fastener 12 near the current collector 4).

[0079] At this point, h ≥ e1*g1*U T + e2*g2*U T +t1. Where e1 is the insulation design redundancy coefficient of the first insulating layer 52, 1≤e1≤3; this coefficient ensures the insulation performance between the current collector 4 and the mounting substrate 1, and between the second extension 213 and the mounting substrate 1. g1 is the insulation coefficient of the first insulating layer 52, that is, the thickness required for the first insulating layer 52 to achieve the preset insulation effect under unit voltage; the unit of g1 is mm / V. e2 is the insulation design redundancy coefficient of the first insulating adhesive 51, 1≤e2≤3; this coefficient ensures the insulation performance between the first extension 211 and the mounting substrate 1. g2 is the insulation coefficient of the first insulating adhesive 51, that is, the thickness required for the first insulating adhesive 51 to achieve the preset insulation effect under unit voltage; the unit of g2 is mm / V. U T t1 is the nominal voltage of the entire cell 3, in V. t1 is the thickness of the external terminal 20, in mm.

[0080] In one embodiment, the first insulating layer 52 can be made of a high-temperature and high-voltage resistant material, such as PTFE, PVC, PP, PET, etc. Both sides of the first insulating layer 52 are provided with adhesive (not shown), and both sides of the first insulating layer 52 are respectively bonded and fixed to the current collector layer 4 and the mounting substrate 1. The adhesive can be made of a high-temperature and high-voltage resistant material, such as PTFE adhesive, PVC adhesive, PP adhesive, etc.

[0081] like Figure 1 , Figure 2 and Figure 5A As shown, in one embodiment, the minimum distance between the bent portion 212 and the inner wall 111 of the mounting groove 11 (specifically, the inner wall of the mounting groove 11 near the flow collection layer 4) is b. min b min ≥e*g*U T That is, b min≥e1*g1*U T + e2*g2*U T This design ensures the insulation performance between the bent portion 212 and the mounting base plate 1. It should be noted that, as... Figure 2 As shown, when the bend 212 is perpendicular to the current collection layer 4, the distance between each position of the bend 212 and the inner wall 111 of the mounting groove 11 is equal. min The distance between any position of the bent portion 212 and the inner wall 111 of the mounting groove 11; such as Figure 6 As shown, when the bent portion 212 is an inclined structure, b min The distance between the end of the bent portion 212 near the second extension 213 and the inner sidewall 111 of the mounting groove 11.

[0082] like Figure 1 and Figure 2 As shown, in one embodiment, a step portion 101 is formed on the mounting substrate 1. The step portion 101 is located between the mounting groove 11 and the current collection layer 4. The bent portion 212 and the second extension portion 213 both rest on the step portion 101.

[0083] like Figures 1 to 5E As shown, in one embodiment, a second insulating layer 13 is provided on the mounting substrate 1 (specifically, the second insulating layer 13 is disposed on the mounting surface 10, and the second insulating layer 13 and the first insulating layer 52 are respectively located on opposite sides of the bent portion 212, so that part of the bent portion 212 is sandwiched between the second insulating layer 13 and the first insulating layer 52). The second insulating layer 13 covers the first insulating adhesive 51 and the insulating fastener 12. The second insulating layer 13 can further improve the insulation performance between the mounting substrate 1 and the external terminal 20 and the current collector 4, avoiding short circuits during stacking. In this embodiment, the side of the second insulating layer 13 facing the mounting substrate 1 is provided with adhesive (not shown in the figure). The second insulating layer 13 is bonded and fixed to the mounting substrate 1, the first insulating adhesive 51 and the insulating fastener 12 by the adhesive. The material of the second insulating layer 13 can be a high-temperature resistant and high-voltage resistant material, such as PTFE, PVC, PP, PET, etc.

[0084] In one implementation, the thickness of the second insulating layer 13 is equal to the thickness of the first insulating layer 52.

[0085] like Figures 5A to 5E As shown, in one embodiment, the assembly steps of the lead-out component can be as follows: (1) such as Figure 5AAs shown, a mounting substrate 1 and an insulating fastener 12 are provided; wherein, a mounting groove 11 is provided at the edge of the mounting substrate 1, and the shape and size of the mounting groove 11 match the shape and size of the insulating fastener 12; the insulating fastener 12 has a drawer-shaped structure, and both the inner and outer surfaces of the insulating fastener 12 have a rough structure.

[0086] (2) such as Figure 5B As shown, adhesive is applied to the inner wall of the mounting groove 11 and / or the outer surface of the insulating fastener 12, and then the insulating fastener 12 is installed into the mounting groove 11 so that the insulating fastener 12 and the mounting substrate 1 are bonded and fixed together by adhesive.

[0087] (3) such as Figure 5C As shown, adhesive is provided on both sides of the first insulating layer 52, and then the first insulating layer 52 is placed on the mounting surface 10 of the mounting substrate 1, so that the first insulating layer 52 and the mounting substrate 1 are bonded and fixed by the adhesive. Moreover, the side of the first insulating layer 52 is flush with the inner wall of the insulating fastener 12 (specifically, the inner wall of the insulating fastener 12 near the current collector 4).

[0088] The current collector foil is cut to obtain the current collector layer 4 and the external terminal 20, which are integral with the current collector layer 4. The external terminal 20 is then bent to obtain the bent external terminal 20.

[0089] The current collector 4 is attached to the first insulating layer 52, and the current collector 4 and the first insulating layer 52 are fixed together by adhesive. At the same time, the first section 21 of the external terminal 20 extends into the insulating fastener 12 and is attached to the inner wall of the insulating fastener 12; the second section 22 of the external terminal 20 extends out of the insulating fastener 12.

[0090] (4) such as Figure 5D As shown, insulating adhesive is poured into the insulating fastener 12. After the insulating adhesive solidifies, the first insulating adhesive 51 is obtained. A portion of the first section 21 is embedded between the insulating fastener 12 and the first insulating adhesive 51. During the pouring process, the amount of insulating adhesive poured is controlled so that the surface of the first insulating adhesive 51 away from the mounting substrate 1 is flush with the mounting surface 10 of the mounting substrate 1. At the same time, care must be taken to prevent the formation of air bubbles during the pouring process to ensure the sealing and insulation properties of the first insulating adhesive 51.

[0091] (5) such as Figure 5EAs shown, an adhesive backing is provided on one side of the second insulating layer 13, and the second insulating layer 13 is disposed on the mounting substrate 1. The second insulating layer 13 covers the first insulating adhesive 51 and the insulating fastener 12. The second insulating layer 13 is bonded and fixed to the mounting substrate 1, the first insulating adhesive 51, and the insulating fastener 12 by the adhesive backing. The second insulating layer 13 and the first insulating layer 52 are close to each other, and a portion of the bent portion 212 (i.e., the upper end of the bent portion 212) is sandwiched between the second insulating layer 13 and the first insulating layer 52.

[0092] Through the above steps, the assembly of the components is completed, and the various parts of the components are connected into a whole, which facilitates subsequent transportation, transfer and assembly.

[0093] like Figures 1 to 3 As shown, this application embodiment also provides a solid-state battery, particularly an all-solid-state battery, including a cell 3 and the lead-out assembly as described above. The cell 3 is located on the side of the current collector 4 away from the mounting substrate 1, that is, the current collector 4 is located between the cell 3 and the mounting substrate 1, and the current collector 4 is in contact with the cell 3 so that the current collector 4 and the cell 3 are electrically connected.

[0094] like Figures 1 to 3 As shown, in one embodiment, there are two lead-out components, with the battery cell 3 located between the current collectors 4 of the two lead-out components. The current collector 4 in one lead-out component is in contact with one side of the battery cell 3, and the current collector 4 in the other lead-out component is in contact with the other side of the battery cell 3. The external terminal 20 in one lead-out component serves as the positive terminal of the battery, and the external terminal 20 in the other lead-out component serves as the negative terminal of the battery. The positive and negative terminals are used for electrical connection to an external device (not shown).

[0095] like Figures 1 to 3As shown, in one embodiment, the solid-state battery also includes a sealing side plate 6, which is located between the mounting base plates 1 of the two lead-out components. The sealing side plate 6 has an annular structure (it can be a single, integral annular structure or a ring structure composed of multiple small pieces). The sealing side plate 6 surrounds the periphery of the cell 3 and is fixedly connected to the mounting base plates 1 of the two lead-out components. A second insulating adhesive 7 is filled between the sealing side plate 6 and the cell 3 to improve the sealing and insulation performance of the cell 3 (ensuring insulation between the sealing side plate 6 and the cell 3). The second section 22 of the external terminal 20 extends out of the solid-state battery after passing through the mounting groove 11 around the sealing side plate 6. Since the external terminal 20 adopts a bent design and extends through the mounting groove 11 on the mounting base plate 1, the external terminal 20 can avoid the sealing side plate 6, so that there is no need to open a hole on the sealing side plate 6 for the external terminal 20 to pass through (if the external terminal 20 is a non-bent structure, the external terminal 20 needs to pass directly through the sealing side plate 6, and at this time, the sealing side plate 6 needs to open a hole for the external terminal 20 to pass through), thereby ensuring the sealing performance of the sealing side plate 6 and reducing the assembly difficulty.

[0096] Specifically, the sealing side plate 6 can be made of high-hardness materials such as stainless steel or aluminum alloy; the sealing side plate 6 and the mounting base plate 1 can be fixed by welding to form a sealed structure, isolating external air and moisture. The second insulating adhesive 7 can be filled between the sealing side plate 6 and the battery cell 3 by pouring insulating adhesive. The material of the second insulating adhesive 7 can be a high-temperature resistant and high-voltage resistant material, such as PTFE adhesive, PVC adhesive, PP adhesive, etc. The second insulating adhesive 7 is anhydrous adhesive, and the moisture content in the second insulating adhesive 7 is ≤100ppm to ensure the insulation performance of the second insulating adhesive 7.

[0097] like Figure 1 As shown, in one embodiment, the solid-state battery also includes an insulating film 8, which wraps around the two mounting substrates 1 and the sealing side plate 6; the second section 22 of the external terminal 20 extends beyond the insulating film 8. The insulating film 8 provides insulation protection between the external terminal 20 and the mounting substrate 1, preventing short circuits between the external terminal 20 and the mounting substrate 1. The insulating film 8 can be made of high-temperature and high-voltage resistant materials, such as PTFE, PVC, PP, PET, etc.

[0098] like Figures 1 to 3As shown, in one embodiment, the battery cell 3 is a solid-state battery cell, comprising a plurality of battery cell units 30 stacked sequentially along the thickness direction T, forming a structure connected in series. Each battery cell unit 30 includes a positive electrode active material layer 31, a solid electrolyte layer 32, and a negative electrode active material layer 33 stacked sequentially along the thickness direction T. The current collector 4 in one lead-out assembly is in contact with the positive electrode active material layer 31 of one of the outermost battery cell units 30, and the current collector 4 in another lead-out assembly is in contact with the negative electrode active material layer 33 of the other outermost battery cell unit 30.

[0099] like Figures 1 to 3 As shown, in one embodiment, a current collector 34 is provided between each pair of adjacent battery cells 30. In each pair of adjacent battery cells 30, adjacent positive electrode active material layers 31 and negative electrode active material layers 33 are respectively disposed on opposite sides of the corresponding current collector 34, so that adjacent positive electrode active material layers 31, current collector 34 and negative electrode active material layers 33 constitute a composite electrode 300. That is, in each pair of adjacent battery cells 30, the positive electrode active material layer 31 of one battery cell 30 and the negative electrode active material layer 33 of the other battery cell 30 share a current collector 34. In other words, the composite electrode 300 includes the current collector 34 and the positive electrode active material layer 31 and the negative electrode active material layer 33 respectively disposed on opposite sides of the current collector 34.

[0100] In one implementation, the current collector 34 is a current collector foil, and the specific material can be stainless steel, copper, aluminum, composite foil (such as copper-aluminum composite foil, copper-stainless steel composite foil), etc.

[0101] In one embodiment, the positive electrode active material layer 31 includes an active material, a conductive agent, a binder, and a solid electrolyte. The active material includes lithium-containing layered oxides, lithium phosphate compounds, such as ternary materials LiCo8Ni1Mn1O2 and LiFePO4; the conductive adhesive is a highly conductive material, such as conductive carbon black, carbon nanotubes, and carbon nanorods; the binder is a binding material, such as PVDF (polyvinylidene fluoride), SBR (styrene-butadiene rubber), and NBR (nitrile rubber); and the solid electrolyte is a material with high ionic conductivity, such as oxides and sulfides.

[0102] As one implementation method, the negative electrode active material layer 33 can be a graphite-based material, a silicon-based material, or the like.

[0103] like Figures 1 to 3 As shown, in one embodiment, the assembly steps of this solid-state battery can be: (1) After the lead-out assembly is completed, composite electrode 300 and solid electrolyte layer 32 are stacked on the current collector layer 4 in the lead-out assembly. The stacking order is: positive electrode active material layer 31, solid electrolyte layer 32, composite electrode 300, solid electrolyte layer 32, composite electrode 300, ..., solid electrolyte layer 32, composite electrode 300, solid electrolyte layer 32, negative electrode active material layer 33, to form cell 3. After stacking, another lead-out assembly is stacked on the cell 3 so that the current collector layer 4 in the other lead-out assembly is in contact with the cell 3. During the stacking process, a hot pressing treatment is required for each stacked layer to ensure that each solid electrolyte layer 32 is in full contact with the adjacent positive electrode active material layer 31 and negative electrode active material layer 33.

[0104] By directly stacking the composite electrode 300 and the solid electrolyte layer 32 in situ on the lead-out component, the parallelism of the composite electrode 300 and the solid electrolyte layer 32 during the stacking process can be guaranteed, reducing the occurrence of short circuits and reducing the generation of defective products during the transfer process, thereby improving the production yield.

[0105] (2) Insulating adhesive is poured around the battery cell 3. After the insulating adhesive solidifies, it forms a second insulating adhesive 7. Then, a sealing side plate 6 is installed on the outside of the second insulating adhesive 7. The sealing side plate 6 is fixed to the mounting base plate 1 on the upper and lower sides by welding.

[0106] (3) Wrap an insulating film 8 around the outside of the sealing side plate 6 and the mounting substrate 1 to obtain a solid-state battery.

[0107] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A lead-out component, characterized in that, The device includes a mounting substrate (1), a terminal structure (2), and a current collector (4) disposed on the mounting substrate (1). The current collector (4) is used to contact the battery cell (3). The terminal structure (2) includes at least one external terminal (20). The external terminal (20) includes a first section (21) and a second section (22) connected to each other. The first section (21) is disposed on the mounting substrate (1) and electrically connected to the current collector (4). The second section (22) extends out of the mounting substrate (1). Along the thickness direction (T) of the current collector (4), the first section (21) is bent relative to the current collector (4) toward the side where the mounting substrate (1) is located.

2. The lead-out component as described in claim 1, characterized in that, The first section (21) includes a bend (212), and the second section (22) and the current collection layer (4) are connected by the bend (212); along the thickness direction (T), the bend (212) bends relative to the current collection layer (4) toward the side where the mounting substrate (1) is located.

3. The lead-out component as described in claim 2, characterized in that, The bending angle of the bent portion (212) relative to the flow collection layer (4) is a, where 0° < a ≤ 90°.

4. The lead-out component as described in claim 2, characterized in that, The first section (21) further includes a first extension (211), and the second section (22) and the bent portion (212) are connected by the first extension (211).

5. The lead-out component as described in claim 4, characterized in that, Both the first extension (211) and the second section (22) are flat structures parallel to the mounting base plate (1).

6. The lead-out component as described in claim 2, characterized in that, The first section (21) further includes a second extension (213), through which the bent portion (212) and the current collection layer (4) are connected.

7. The lead-out component as claimed in claim 1, characterized in that, The mounting substrate (1) has a mounting surface (10), the current collector (4) is disposed on the mounting surface (10), and an insulating structure (5) is provided between the first section (21) and the plane where the mounting surface (10) is located. The bending depth of the first section (21) relative to the current collector layer (4) towards the mounting substrate (1) is h, where h ≥ e*g*U T +t1; where e is the insulation design redundancy coefficient of the insulation structure (5), 1≤e≤3; g is the insulation coefficient of the insulation structure (5); U T t1 is the nominal voltage of the entire cell (3); t1 is the thickness of the external terminal (20).

8. The lead-out component as claimed in claim 1, characterized in that, At least a portion of the first section (21) is embedded and fixed within the mounting base plate (1).

9. The lead-out component as described in claim 8, characterized in that, The mounting base plate (1) is provided with a mounting groove (11), at least part of the first section (21) is fixedly disposed in the mounting groove (11), and the second section (22) and the current collection layer (4) are both located outside the mounting groove (11) and are respectively located on opposite sides of the first section (21).

10. The lead-out component as claimed in claim 9, characterized in that, An insulating fastener (12) is provided in the mounting groove (11), and the insulating fastener (12) is fixed to the mounting base plate (1); at least a portion of the first section (21) is fixed to the insulating fastener (12).

11. The lead-out component as claimed in claim 10, characterized in that, The insulating fastener (12) is provided with a first insulating adhesive (51), and at least part of the first section (21) is embedded between the insulating fastener (12) and the first insulating adhesive (51). The first section (21) is bonded and fixed to the insulating fastener (12) by the first insulating adhesive (51).

12. The lead-out component as claimed in claim 11, characterized in that, The mounting substrate (1) is provided with a second insulating layer (13), which covers the first insulating adhesive (51) and the insulating fastener (12).

13. The lead-out component as claimed in claim 9, characterized in that, The first section (21) includes a first extension (211), a bent portion (212), and a second extension (213) connected in sequence. Along the thickness direction (T), the bent portion (212) bends relative to the current collector layer (4) toward the side where the mounting substrate (1) is located. The second section (22) and the bent portion (212) are connected by the first extension (211), and the bent portion (212) and the current collector layer (4) are connected by the second extension (213). The first extension (211) and at least a portion of the bent portion (212) are fixedly disposed in the mounting groove (11).

14. The lead-out component as claimed in claim 13, characterized in that, The mounting substrate (1) has a mounting surface (10). The current collector (4) and the second extension (213) are both disposed on the mounting surface (10). An insulating structure (5) is provided between the first section (21) and the plane where the mounting surface (10) is located. The insulating structure (5) includes a first insulating adhesive (51) and a first insulating layer (52). The first insulating adhesive (51) is disposed in the mounting groove (11), and the first insulating adhesive (51) is located between the first extension (211) and the plane where the mounting surface (10) is located. The surface of the first insulating adhesive (51) away from the mounting substrate (1) is flush with the mounting surface (10). The first insulating layer (52) is disposed between the current collector (4) and the mounting surface (10) and between the second extension (213) and the plane where the mounting surface (10) is located.

15. The lead-out component as claimed in claim 14, characterized in that, The bending depth of the first section (21) relative to the current collector layer (4) towards the mounting substrate (1) is h, where h ≥ e1*g1*U T + e2*g2*U T +t1; Wherein, e1 is the insulation design redundancy coefficient of the first insulating layer (52), 1≤e1≤3; g1 is the insulation coefficient of the first insulating layer (52); e2 is the insulation design redundancy coefficient of the first insulating adhesive (51), 1≤e2≤3; g2 is the insulation coefficient of the first insulating adhesive (51); U T t1 is the nominal voltage of the entire cell (3); t1 is the thickness of the external terminal (20).

16. The lead-out component as claimed in claim 14, characterized in that, The minimum distance between the bent portion (212) and the inner wall (111) of the mounting groove (11) is b. min b min ≥e1*g1*U T + e2*g2*U T ; Wherein, e1 is the insulation design redundancy coefficient of the first insulating layer (52), 1≤e1≤3; g1 is the insulation coefficient of the first insulating layer (52); e2 is the insulation design redundancy coefficient of the first insulating adhesive (51), 1≤e2≤3; g2 is the insulation coefficient of the first insulating adhesive (51); U T The nominal voltage of the entire cell (3) is given.

17. The lead-out component as claimed in claim 1, characterized in that, The external terminal (20) and the current collector (4) are an integral structure.

18. The lead-out component as described in any one of claims 1-17, characterized in that, The terminal structure (2) includes a plurality of external terminals (20), which are spaced apart along the width direction (W) of the current collection layer (4).

19. A solid-state battery, characterized in that, Includes a battery cell (3) and a lead-out assembly as described in any one of claims 1-18, wherein the current collector layer (4) is in contact with the battery cell (3).

20. The solid-state battery as claimed in claim 19, characterized in that, The number of lead-out components is two, and the battery cell (3) is located between the current collectors (4) of the two lead-out components; the current collector (4) of one of the lead-out components is in contact with one side of the battery cell (3), and the current collector (4) of the other lead-out component is in contact with the other side of the battery cell (3).

21. The solid-state battery as claimed in claim 20, characterized in that, The solid-state battery also includes a sealing side plate (6), which is located between the mounting base plates (1) of the two lead-out components and surrounds the periphery of the cell (3). The sealing side plate (6) is fixedly connected to the mounting base plates (1) of the two lead-out components. The second section (22) of the external terminal (20) extends out of the solid-state battery after bypassing the sealing side plate (6). A second insulating adhesive (7) is filled between the sealing side plate (6) and the cell (3).

22. The solid-state battery as claimed in claim 21, characterized in that, The solid-state battery also includes an insulating film (8), which wraps around the outside of the mounting substrate (1) and the sealing side plate (6); the second section (22) of the external terminal (20) extends out of the insulating film (8).

23. The solid-state battery as described in claim 20, characterized in that, The cell (3) includes a plurality of cell units (30) stacked sequentially along the thickness direction (T) of the current collector (4), and each cell unit (30) includes a positive electrode active material layer (31), a solid electrolyte layer (32) and a negative electrode active material layer (33) stacked sequentially along the thickness direction (T). One of the lead-out components has a current collector layer (4) in contact with the positive electrode active material layer (31) of one of the outermost cell units (30), and the other lead-out component has a current collector layer (4) in contact with the negative electrode active material layer (33) of the other outermost cell unit (30).

24. The solid-state battery as described in claim 23, characterized in that, A current collector (34) is provided between each pair of adjacent battery cells (30); in each pair of adjacent battery cells (30), the adjacent positive electrode active material layer (31) and the negative electrode active material layer (33) are respectively disposed on opposite sides of the corresponding current collector (34), so that the adjacent positive electrode active material layer (31), the current collector (34) and the negative electrode active material layer (33) constitute a composite electrode (300).

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