Radio frequency processing circuit, radio frequency processing device and communication equipment

Abstract

The invention discloses a radio frequency processing circuit, a radio frequency processing device and communication equipment, relates to the field of radio frequency, and is used for reducing the size and cost of the radio frequency processing circuit. The radio frequency processing circuit comprises a first transmission line, a first end of the first transmission line is coupled to a first port of the radio frequency processing circuit, and a first adjusting circuit is coupled between a second end of the first transmission line and a second port of the radio frequency processing circuit. The length of the first transmission line is smaller than one fourth of the wavelength corresponding to a to-be-transmitted radio frequency signal of the radio frequency processing circuit. The first end of the second transmission line is coupled to the first port of the radio frequency processing circuit, and a second adjusting circuit is coupled between the second end of the second transmission line and the third port of the radio frequency processing circuit. And the length of the second transmission line is smaller than one fourth of the wavelength corresponding to a to-be-transmitted radio frequency signal of the radio frequency processing circuit. An isolation circuit is coupled between the second end of the first transmission line and the second end of the second transmission line.

Description

Technical Field

[0001] This application relates to the field of radio frequency, and more particularly to a radio frequency processing circuit, a radio frequency processing device, and a communication device. Background Technology

[0002] In communication networks, to improve the network coverage of terminal devices, related technologies involve adding active transmitting circuits to the terminal devices to increase their uplink power, thereby improving network coverage. However, adding active transmitting circuits increases power consumption and cost. Summary of the Invention

[0003] This application provides a radio frequency processing circuit, a radio frequency processing device, and a communication equipment to solve the problem of increased power consumption and cost caused by improving the network coverage of terminal devices.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] A first aspect provides a radio frequency (RF) processing circuit, comprising: a first transmission line, a first end of which is coupled to a first port of the RF processing circuit, and a second end of which is coupled to a second port of the RF processing circuit via a first adjustment circuit. The length of the first transmission line is less than one-quarter of the wavelength corresponding to the RF signal to be transmitted by the RF processing circuit. The first adjustment circuit is used to match the characteristic impedance of the first transmission line with the characteristic impedance of the second port, i.e., the first adjustment circuit transforms the characteristic impedance of the first transmission line to the characteristic impedance of the second port. A second transmission line, a first end of which is coupled to the first port of the RF processing circuit, and a second end of which is coupled to a third port of the RF processing circuit via a second adjustment circuit. The length of the second transmission line is less than one-quarter of the wavelength corresponding to the RF signal to be transmitted by the RF processing circuit. The second adjustment circuit is used to match the characteristic impedance of the second transmission line with the characteristic impedance of the third port, i.e., the second adjustment circuit transforms the characteristic impedance of the second transmission line to the characteristic impedance of the third port. An isolation circuit is coupled between the second ends of the first transmission line.

[0006] In the above technical solution, by shortening the lengths of the first and second transmission lines to less than one-quarter of the wavelength corresponding to the RF signal, the electrical length of the transmission lines is significantly shortened, greatly reducing the physical space occupied. This promotes the miniaturization and high integration of the RF processing circuit structure, while reducing the size and cost of the circuit. Functionally, this embodiment achieves functional separation and optimization. The first and second transmission lines are used to focus on the power splitting function, while a first and second adjustment circuit are introduced to independently handle the impedance matching of the two signals. This separation design not only makes the power splitting function more pure but also provides greater flexibility in the design of the RF processing circuit structure. This allows designers to flexibly adjust the transmission line length and optimize circuit component parameters according to the specific needs of different application scenarios, thereby achieving the best signal transmission effect. Furthermore, the addition of the isolation circuit effectively isolates signal interference between the first and second transmission lines, significantly reducing system noise and signal distortion, ensuring the high stability and purity of the RF signal during transmission, and comprehensively improving the overall performance of the RF processing circuit.

[0007] In one possible implementation of the first aspect, the first transmission line and the second transmission line are either microstrip lines or striplines.

[0008] In this possible implementation, microstrip lines and striplines, as planar transmission lines, possess compact structural characteristics, making them ideal for miniaturized RF circuit designs. Furthermore, using microstrip lines or striplines in RF circuits can reduce material costs and fabrication complexity in actual production.

[0009] In another possible implementation of the first aspect, the isolation circuit includes a resistor and at least one of the following: a capacitive device and an inductive device.

[0010] In this possible implementation, signal interference between the first and second transmission lines is effectively isolated by an isolation circuit. This not only significantly reduces system noise and signal distortion, ensuring high stability and purity of the RF signal during transmission, but also enhances the overall performance of the RF processing circuit. Furthermore, by utilizing the characteristics of capacitive and inductive devices, the frequency response and impedance matching of the circuit can be further optimized, guaranteeing the stability of the RF processing circuit's performance in various application scenarios.

[0011] In another possible implementation of the first aspect, the first adjustment circuit and the second adjustment circuit include one or more lumped devices. The lumped devices include at least one of the following: capacitive devices and inductive devices.

[0012] In this possible implementation, the flexible use of one or more lumped devices (including capacitive and inductive devices) provides powerful impedance matching and performance optimization capabilities for the RF processing circuit. The combined use of capacitive and inductive devices allows the adjustment circuit to precisely adjust the impedance value, optimize the signal transmission path, and thus significantly improve the transmission efficiency of the RF signal and the overall performance of the circuit. At the same time, the introduction of lumped devices also provides designers with more design options, facilitating targeted optimization according to the specific needs of different application scenarios and ensuring the stability of the RF processing circuit's performance under various environments.

[0013] In another possible implementation of the first aspect, the first adjustment circuit includes a first set of lumped devices and a second set of lumped devices. The first set of lumped devices is used to adjust the phase of the radio frequency signal input at the second terminal of the first transmission line. The second set of lumped devices is used to match the characteristic impedance of the second transmission line with the characteristic impedance of the third port.

[0014] In this possible implementation, the combination of multiple lumped devices allows for more precise and flexible impedance matching, ensuring the RF signal remains in optimal condition during transmission. Simultaneously, the independence of these multiple lumped devices provides designers with greater freedom in circuit optimization, allowing them to independently adjust the parameters of each group of devices according to the specific application requirements to achieve the best signal transmission performance. This highly flexible design capability strongly guarantees the efficient performance of the RF processing circuit in diverse applications. Furthermore, the first adjustment circuit, by introducing the first set of lumped devices, is specifically designed to precisely adjust the phase of the RF signal input at the second terminal of the first transmission line. This design significantly enhances the RF processing circuit's ability to control the signal phase, facilitating more complex signal processing and modulation functions. Meanwhile, the second set of lumped devices is configured to match the characteristic impedance of the second transmission line and the characteristic impedance of the third port. This design effectively reduces signal reflection and loss during transmission, improving signal transmission efficiency and stability.

[0015] In another possible implementation of the first aspect, the second adjustment circuit includes a third set of lumped devices and a fourth set of lumped devices. The third set of lumped devices is used to adjust the phase of the radio frequency signal input at the second terminal of the second transmission line; the fourth set of lumped devices is used to match the characteristic impedance of the second transmission line with the characteristic impedance of the third port.

[0016] In this possible implementation, the combination of multiple lumped devices allows for more precise and flexible impedance matching, ensuring the RF signal remains in optimal condition during transmission. Simultaneously, the independence of these multiple lumped devices provides designers with greater freedom in circuit optimization, allowing them to independently adjust the parameters of each group based on specific application requirements to achieve the best signal transmission performance. This highly flexible design capability strongly guarantees the efficient performance of the RF processing circuit in diverse applications. Furthermore, the second adjustment circuit introduces a third set of lumped devices specifically for precisely adjusting the phase of the RF signal input at the second terminal of the first transmission line. This design significantly enhances the RF processing circuit's control over the signal phase, facilitating more complex signal processing and modulation functions. Simultaneously, a fourth set of lumped devices is configured to match the characteristic impedance of the second transmission line and the characteristic impedance of the third port. This design effectively reduces signal reflection and loss during transmission, improving signal transmission efficiency and stability.

[0017] In another possible implementation of the first aspect, the first adjustment circuit is further configured to adjust the phase of the first radio frequency signal input at the second end of the first transmission line. The second adjustment circuit is further configured to adjust the phase of the second radio frequency signal input at the second end of the second transmission line.

[0018] This possible implementation simplifies the complexity of the RF processing circuitry while maintaining high performance. This simplified circuit structure not only reduces design, manufacturing, and maintenance costs but also improves circuit reliability and stability. Each adjustment circuit can perform precise impedance matching and possible phase adjustment for its corresponding transmission line, ensuring low loss and high fidelity of the RF signal during transmission. Furthermore, this design facilitates subsequent performance optimization and upgrades, as designers can focus on optimizing a few components without dealing with complex circuit interactions. In addition, the first adjustment circuit performs fine phase control on the first RF signal input at the second end of the first transmission line through its phase adjustment function. Similarly, the second adjustment circuit also performs phase adjustment on the second RF signal input at the second end of the second transmission line. This design not only simplifies the circuit structure but also achieves independent and precise control of the RF signal phase on both transmission lines, thereby improving the overall performance of the RF processing circuitry.

[0019] In another possible implementation of the first aspect, the ratio of the power of the radio frequency signal input to the first transmission line to the power of the radio frequency signal input to the second transmission line is k:1. Furthermore, the ratio of the characteristic impedance of the first transmission line to the characteristic impedance of the second transmission line is... The parallel characteristic impedance of the first and second transmission lines is equal to the characteristic impedance of the first port of the RF processing circuit.

[0020] In this possible implementation, the ratio of the RF signal power input to the first transmission line to the RF signal power input to the second transmission line is set to k:1. This asymmetric power allocation method allows for flexible adjustment of signal strength based on actual antenna radiation efficiency, coupling coefficient, and other parameters. Simultaneously, the ratio of the characteristic impedance of the first transmission line to the characteristic impedance of the second transmission line is set to... This impedance ratio selection is based on precise calculations of the power distribution ratio and parallel characteristic impedance, aiming to minimize signal reflection and loss, and ensure signal stability and efficiency during transmission. Furthermore, the parallel characteristic impedance of the first and second transmission lines is designed to be equal to the characteristic impedance of the first port of the RF processing circuit. This innovative design not only simplifies the circuit structure but also significantly improves the transmission efficiency of RF signals. Due to the perfect match between the parallel characteristic impedance and the characteristic impedance of the first port, the RF signal can seamlessly enter the RF processing circuit without the need for additional impedance conversion or matching networks, thereby reducing signal distortion and noise interference during transmission.

[0021] In a second aspect, this application provides a radio frequency processing apparatus, including a power amplifier and any of the radio frequency processing circuits in the first aspect, wherein the power amplifier is coupled to a first port of the radio frequency processing circuit.

[0022] Thirdly, this application provides a communication device, including a circuit board and a radio frequency processing device as described in the second aspect disposed on the circuit board.

[0023] The technical principles and beneficial effects of the second and third aspects can be referred to the relevant explanations in the first aspect above, and will not be repeated here. Attached Figure Description

[0024] Figure 1 A schematic diagram of a Smith chart provided for embodiments of this application. Figure 1 ;

[0025] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0026] Figure 3 This is a schematic diagram of the structure of a mobile communication module provided in an embodiment of this application;

[0027] Figure 4 A schematic diagram of a radio frequency circuit provided in this application embodiment. Figure 1 ;

[0028] Figure 5 A schematic diagram of a radio frequency circuit provided in this application embodiment. Figure 2 ;

[0029] Figure 6A schematic diagram of a radio frequency circuit provided in this application embodiment. Figure 3 ;

[0030] Figure 7 This is a schematic diagram of antenna pattern synthesis provided in an embodiment of this application;

[0031] Figure 8 A schematic diagram of a power divider structure provided in this application embodiment. Figure 1 ;

[0032] Figure 9 A schematic diagram of a power divider structure provided in this application embodiment. Figure 2 ;

[0033] Figure 10 A schematic diagram of a radio frequency processing circuit structure provided in this application embodiment. Figure 1 ;

[0034] Figure 11 A schematic diagram of a radio frequency processing circuit structure provided in this application embodiment. Figure 2 ;

[0035] Figure 12 A schematic diagram of a radio frequency processing circuit structure provided in this application embodiment. Figure 3 ;

[0036] Figure 13 A schematic diagram of a radio frequency processing circuit structure provided in this application embodiment. Figure 4 ;

[0037] Figure 14 A schematic diagram of a radio frequency processing circuit structure provided in this application embodiment. Figure 5 ;

[0038] Figure 15 A schematic diagram of a radio frequency processing circuit structure provided in this application embodiment. Figure 6 ;

[0039] Figure 16 A schematic diagram of a Smith chart provided for embodiments of this application. Figure 2 ;

[0040] Figure 17 A schematic diagram of an adjustment circuit provided in an embodiment of this application. Figure 1 ;

[0041] Figure 18 A schematic diagram of an adjustment circuit provided in an embodiment of this application. Figure 2 ;

[0042] Figure 19 A schematic diagram of a radio frequency processing circuit structure provided in this application embodiment. Figure 7 ;

[0043] Figure 20 A simulation result diagram of a radio frequency processing circuit provided for an embodiment of this application. Figure 1 ;

[0044] Figure 21 A simulation result diagram of a radio frequency processing circuit provided for an embodiment of this application. Figure 2 ;

[0045] Figure 22 A simulation result diagram of a radio frequency processing circuit provided for an embodiment of this application. Figure 3 ;

[0046] Figure 23 A simulation result diagram of a radio frequency processing circuit provided for an embodiment of this application. Figure 4 ;

[0047] Figure 24 This is a schematic diagram of a radio frequency processing device provided in an embodiment of this application. Detailed Implementation

[0048] Hereinafter, the terms "first" and "second" are used only to distinguish features of the same type and should not be construed as indicating relative importance, quantity, order, etc. Nor should they be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0049] The terms "exemplary" or "for example" used in the embodiments of this application are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0050] The terms "coupled" and "connected" used in the embodiments of this application should be interpreted broadly. For example, they can refer to a physical direct connection or an indirect connection achieved through electronic devices, such as a connection achieved through resistors, inductors, capacitors or other electronic devices.

[0051] First, some concepts involved in this application will be described.

[0052] Scattering parameters (S-parameters): The S-parameter S(b, a) represents the output signal (complex vector Z) at the output terminal b of the transmission line. b ) and input signal (complex vector Z) at input terminal a a The ratio Z between )b / Z a In this equation, 'a' and 'b' can be the same or different. When 'a' and 'b' are the same, the S-parameter S(b, a) represents the reflection coefficient, i.e., how much energy is reflected back to the source. A smaller reflection coefficient is better, indicating less energy is reflected back to the source. When 'a' and 'b' are different, the S-parameter S(b, a) represents the transmission coefficient, i.e., how much energy is transmitted to the destination. A larger transmission coefficient indicates higher signal transmission efficiency. For example, assuming the first port p1 is the signal input and the second port p2 and the third port p3 are the signal outputs, then S(p1, p1) (which can be abbreviated as S(1, 1) or S11) represents the reflection coefficient, and S(p2, p1) (which can be abbreviated as S(2, 1) or S21) and S(p3, p1) (which can be abbreviated as S(3, 1) or S31) represent the transmission coefficients.

[0053] Since the complex vector Z of the signal can be represented by an exponent Aeiθ that includes the amplitude A and the phase θ, the S-parameters can be expressed as: The S-parameters describe the phase difference (θ) between the signal at the output terminal b and the signal at the input terminal a of the transmission line. b -θ a ) and efficiency (A b / A a Efficiency (A) b / A a The phase difference θ is essentially the amplitude change of the signal at the output terminal b of the transmission line relative to the signal at the input terminal a. In this application, the phase difference (S(b, a)) represents the phase difference θ. b -θ a Let dB(S(b, a)) represent the efficiency (A). b / A a The value after conversion to the dB domain is 20log(A) b / A a ).

[0054] Smith chart: such as Figure 1 As shown, the Smith chart is a calculation diagram that plots normalized impedance equivalent circles on a reflection coefficient plane, primarily used for impedance matching of transmission lines. The Smith chart includes equal reflection coefficient circles, equal resistance circles, and equal reactance circles. The equal reflection coefficient circle is drawn according to the following formula 1.

[0055]

[0056] Where Γ is the reflection coefficient S11 in the S-parameters mentioned above, and z = Z L / Z0 represents the normalized impedance, Z L Z0 is the load impedance of the transmission line, and Z0 is the characteristic impedance of the transmission line, typically 50Ω. The reflection coefficient Γ is expressed in the form Γ = Γ0.u +Γ v x-coordinate Γ u Represents the real part, with the ordinate Γ. v This represents the imaginary part. On the same circle of equal reflectance, the magnitude of the reflectance Γ is equal to |Γ|.

[0057] If we also express the impedance z in complex form z = r + jx, where r is resistance and x is reactance, and combine this with formula 1 and Γ = Γ u +iΓ v Formulas 2 and 3 can be obtained from this.

[0058]

[0059] Formula 2 represents the circle of equal resistance. The center of the circle of equal resistance is (r / (r+1), 0), and the radius is 1r / +1. On the same circle of equal resistance, the resistance is equal and is r. All circles of equal resistance pass through the point (1, 0). The larger the resistance, the smaller the radius of the corresponding circle of equal resistance. The range of resistance r is 0 ≤ r

[0060] Formula 3 represents the equal reactance circle. The center of the equal reactance circle is (1, 1 / x), and the radius is 1 / x. On the same equal reactance circle, the reactance is equal and is always x. A positive x indicates inductive and a negative x indicates capacitive. Therefore, there are two sets of equal reactance circles, and all equal reactance circles pass through the coordinate point (1, 0).

[0061] When merging the circles of equal reflection coefficient, equal resistance, and equal reactance into a Smith chart, for the circles of equal reflection coefficient, usually only the circle with the largest |Γ| = 1 is retained; for the circles of equal resistance and equal reactance, only the circles intersecting with the circles of equal reflection coefficient with |Γ| = 1 are retained.

[0062] The ideal impedance matching refers to the load impedance Z of the transmission line. L When the impedance is equal to the characteristic impedance Z0 of the transmission line, the transmission line will not reflect signals, and all the energy of the transmitted signal will be absorbed by the load. According to Equation 1, the ideal impedance matching corresponds to the (0, 0) coordinate point on the Smith chart.

[0063] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0064] The technical solution provided in this application will be further described below with reference to the accompanying drawings and embodiments.

[0065] This application provides an electronic device with wireless communication capabilities. The electronic device can be mobile or fixed. It can be deployed on land (e.g., indoors or outdoors, handheld or vehicle-mounted), on water (e.g., on ships), or in the air (e.g., airplanes, balloons, and satellites). This electronic device can be referred to as user equipment (UE), access terminal, terminal unit, subscriber unit, terminal station, mobile station (MS), mobile station, terminal agent, or terminal device. For example, it can be a mobile phone, tablet computer, laptop computer, smart bracelet, smart screen, smartwatch, virtual reality (VR) device, augmented reality (AR) device, terminal in industrial control, terminal in self-driving, terminal in remote medical care, terminal in smart grid, terminal in transportation safety, terminal in smart city, terminal in smart home, etc. This application does not limit the specific type and structure of the electronic device. The following describes one possible structure of the electronic device.

[0066] Taking mobile phones as an example, Figure 2 A possible structure of an electronic device 100 is shown. The electronic device 100 may include a processor 210, an antenna 1, an antenna 2, a mobile communication module 220, and a wireless communication module 230.

[0067] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0068] Processor 210 may include one or more processing units, such as: a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), a system-on-chip (SoC), a central processing unit (CPU), an application processor (AP), a network processor (NP), a digital signal processor (DSP), a microcontroller unit (MCU), a programmable logic device (PLD), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, and a neural network processing unit (NPU), etc. Different processing units may be independent devices or integrated into one or more processors. For example, processor 210 may be an application processor (AP). Alternatively, processor 210 may be integrated into a system-on-chip (SoC). Or, processor 210 may be integrated into an integrated circuit (IC) chip. The processor 210 may include an analog front end (AFE) and a micro-controller unit (MCU) in an IC chip.

[0069] The wireless communication function of electronic device 100 can be realized through antenna 1, antenna 2, mobile communication module 220, wireless communication module 230, modem processor, etc.

[0070] Antenna 1 and antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 can be used to cover one or more communication frequency bands. Different antennas can also be multiplexed to improve antenna utilization. For example, antenna 1 can be multiplexed as a diversity antenna for a wireless local area network. In some other embodiments, the antennas can be used in conjunction with tuning switches.

[0071] Mobile communication module 220 can provide wireless communication solutions, including 2G / 3G / 4G / 5G, for use on electronic device 100. Wireless communication module 230 can provide wireless communication solutions, including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technologies, for use on electronic device 101. In some embodiments, antenna 1 of electronic device 100 is coupled to mobile communication module 220, and antenna 2 is coupled to wireless communication module 230, enabling electronic device 100 to communicate with networks and other devices via wireless communication technologies.

[0072] like Figure 3 As shown, the mobile communication module 220 may include a baseband chip 31, a radio frequency integrated circuit (RFIC) 32, and a radio frequency circuit 33.

[0073] The baseband chip 31 is used to convert data from the processor 210 into baseband signals, including modulation and demodulation, digital filtering, and equalization processing of the baseband signals. The RFIC 32 is used to convert the baseband signals from the baseband chip 31 into radio frequency signals, which are then transmitted through the radio frequency circuit 33 and at least one of the multiple antennas 34. Alternatively, it can receive radio frequency signals through at least one antenna and the radio frequency circuit 33, convert them into baseband signals, and send them to the baseband chip 31. The baseband chip 31 then converts the baseband signals back into data and sends them to the processor 210. It should be noted that the baseband chip 31 and RFIC 32 can also be integrated with the processor 210 in a SoC. In this embodiment, the process of transmitting the radio frequency signals from the RFIC 32 to at least one of the multiple antennas through the radio frequency circuit 33 is referred to as power feeding.

[0074] The radio frequency (RF) circuit 33 is a crucial component in wireless communication equipment, responsible for signal transmission and reception, located between the antenna and the intermediate frequency (or baseband) circuit. In this part, signals are transmitted in radio frequency form and processed through modulation, amplification, and filtering to achieve wireless signal transmission and reception. Figure 4As shown, the RF circuit 33 includes one signal transmitting circuit 331, two signal receiving circuits 332, and a duplexer M. The transmitting circuit 331 is coupled to one of the two signal receiving circuits 332 via the duplexer M, which isolates the transmitted and received RF signals, ensuring simultaneous normal operation of both transmission and reception. Each signal receiving circuit 332 is coupled to one antenna (antenna 341 and antenna 342). The transmitting circuit 331 includes an amplifier 330, which can be a power amplifier (PA). Antennas 341 and 342 serve as the interface between the RF front-end and space signals, responsible for radiating RF signals into or receiving RF signals from space.

[0075] During signal transmission, the baseband signal to be transmitted is first input into amplifier 330 for power amplification to meet the signal transmission requirements. The baseband signal is then converted into a radio frequency signal by modulator through signal transmission circuit 331, and then transmitted into space by antennas 341 and 342.

[0076] During signal reception, antennas 341 and 342 respectively receive radio frequency signals from space, and these signals are sent to their respective coupled signal receiving circuits 332.

[0077] The signal transmission performance (such as radiation distance and range) of electronic device 100 largely depends on the range of frequency bands it supports. The choice of frequency band directly affects the signal strength, data transmission speed, and coverage of electronic device 100. Especially in the 5G era, with the diversification of application scenarios, electronic device 100 needs to support more frequency bands to adapt to different network environments. For example, in operator networks, low-frequency bands (LB) (such as N28) are generally used as bands to ensure wide-area coverage. The N28 band is a specific FDD (Frequency Division Duplex) band in 5G NR (new radio) technology, also known as the "golden band" because it has excellent characteristics such as strong penetration and wide coverage. According to the 3GPP standard, the full frequency range of N28 is 703-748MHz (uplink) and 758-803MHz (downlink).

[0078] The N28 band belongs to the Sub-1GHz low-frequency band. Compared with other high-frequency bands (such as N77 and N78), its wavelength is longer, which allows it to penetrate buildings and other obstacles better, thus providing wider coverage and stronger signal penetration. The N28 band can achieve a higher signal coverage range, up to four times the coverage range, and can easily achieve indoor and outdoor signal coverage, making it particularly suitable for 5G network construction in rural and remote areas.

[0079] Based on the N28 edge coverage requirement of 20Mbps downlink / 1Mbps uplink, as shown in Table 1, four geographical regions are presented: "Dense Urban Area", "General Urban Area", "Suburban Towns", and "Rural Area", and three coverage types: "Uplink Coverage", "Downlink Coverage" and "Final Coverage". Each region and coverage type corresponds to a specific numerical value.

[0080] Table 1

[0081] Coverage calculation value / meter (m) Dense urban areas General urban areas Suburban towns rural areas Uplink coverage 1180 1878 3016 4203 Downlink Coverage 1328 2113 3393 4728 Final Coverage 1180 1878 3016 4203

[0082] Table 1 shows that for uplink coverage, the uplink coverage diameter is 1180m in densely populated urban areas, 1878m in general urban areas, 3016m in suburban towns, and 4203m in rural areas. For downlink coverage, the downlink coverage diameter is 1328m in densely populated urban areas, 2113m in general urban areas, 3393m in suburban towns, and 4728m in rural areas. For final coverage, the final coverage diameter is 1180m in densely populated urban areas (same as uplink coverage), 1878m in general urban areas (same as uplink coverage), 3016m in suburban towns (same as uplink coverage), and 4203m in rural areas (same as uplink coverage). From densely populated urban areas to rural areas, both uplink and downlink coverage values ​​show an increasing trend. This reflects that as the geographical area expands from urban to rural areas, the coverage range or quantity gradually increases. Furthermore, in all geographical regions, the downlink coverage value was higher than the uplink coverage value. This further indicates that uplink coverage limitations are common across various scenarios.

[0083] Limited uplink coverage not only affects user experience (such as applications requiring high uplink speeds, like video calls and file uploads), but can also lead to an overall decline in network performance. In weak signal areas (such as 0 / 1 / 2 bars, RSRP < -110dBm; "0 / 1 / 2 bars" signal strength and RSRP values ​​below -110dBm are typical indicators of weak signal areas in mobile communications), the N28 band accounts for a high proportion (possibly as high as 25%), and in these areas, poor network coverage and uplink bottlenecks lead to a higher failure rate for both calling and called parties at the UE (User Equipment).

[0084] To address the limited uplink coverage in low-frequency bands (such as N28) of carrier networks, the uplink transmit power of user equipment can be increased. If the goal is to increase uplink power, in areas such as... Figure 4 The radio frequency circuit 33 shown has an additional transmitting circuit, such as... Figure 5 As shown, although it can increase uplink power, it will also increase power consumption and heat, and at the same time, it will increase costs.

[0085] Therefore, in order to increase the total radiated power (TRP) of the antenna without significantly increasing power consumption, heat generation, and cost, Figure 4 The RF circuit 33 shown includes the power divider circuit and the phase shifter (PS) circuit. Figure 6 As shown, the RF circuit 33 includes a power divider circuit 333 and a phase shifter circuit 334. When the amplifier 330 is a PA, the amplifier 330 amplifies the RF signal from the RFIC and sends it to the power divider circuit 333. The power divider circuit 333 splits the input RF signal into two RF signals with the same phase. One signal is transmitted through antenna 341, and the other signal is phase-shifted by the phase shifter circuit 334 and then transmitted through antenna 342. The power divider circuit 333 is a passive circuit, and the two transmitting circuits split by the power divider circuit 333 are passive transmitting circuits and do not introduce additional power consumption. It should also be noted that this embodiment uses two antennas (antenna 341 and antenna 342) as an example, but it is not intended to be limited to this. The RF circuit 33 can also connect to more antennas.

[0086] In some examples, the antenna efficiency when amplifier 330 acts as a PA refers to the ratio of the power radiated by the antenna (i.e., the power that effectively converts the electromagnetic wave portion) to the power output by the PA to the antenna. The radiation efficiency of a single antenna is constant, so the power of the radio frequency signal radiated into space is also constant. By rationally distributing the power to the two antennas and adjusting the phase difference between the radio frequency signals emitted by the two antennas using phase-shifting circuit 334, spatial signal enhancement can be achieved. This results in a higher power of the combined radio frequency signal compared to the signal emitted by a single antenna. Thus, antenna efficiency can be improved without changing the PA output power.

[0087] like Figure 7 The diagram shows a simulation of the combined radio frequency (RF) signal from antennas 341 and 342. During simulation, antenna 341 can be disabled (by grounding) and antenna 342 can be operated alone to obtain its radiation pattern. Similarly, antenna 342 can be disabled (by grounding) and antenna 341 can be operated alone to obtain its radiation pattern. The RF signal transmitted through antenna 341 has a phase difference of θ compared to the RF signal transmitted through antenna 342. The combined radiation pattern and combined power of antennas 341 and 342 can then be obtained. Figure 6 If the two antennas shown in the RF circuit 33 have the same radiation pattern and the same gain, and the power divider circuit 333 and the phase shifter circuit 334 have no loss, the ideal gain of the antenna TRP power is 3dB.

[0088] In some examples, with Figure 8 Taking the power divider circuit shown as an example, this power divider circuit is coupled to the first port p1, the second port p2, and the third port p3. (Refer to...) Figure 8 As shown in (A), when a higher-power signal P1 is input from the first port p1, a lower-power signal P2 can be output from the second port p2 of the power divider circuit, and another lower-power signal P3 can be output from the third port p3 of the power divider circuit. Conversely, referring to... Figure 8 As shown in (B), when two signals with lower power, P2` and P3`, are input from the second port p2 and the third port p3 respectively, a signal with higher power, P1`, can also be output from the first port p1.

[0089] An important parameter of a power divider circuit is its loss. Figure 8 For example, assuming the power divider circuit is ideally lossless, the sum of the power of P2 and P3 should equal the power of P1, and the power of P1' should also equal the sum of the power of P2' and P3'. In reality, power divider circuits have some losses; the sum of the power of P2 and P3 will be less than the power of P1, and the power of P1' will also be less than the sum of the power of P2' and P3'. Another important parameter of a power divider circuit is isolation. Let's continue with... Figure 8 For example, suppose a signal is input from the second port p2. Ideally, this signal should be output from the first port p1, and output from the third port p3 as much as possible to avoid signal leakage. The isolation between the second and third ports is a parameter used to measure this signal leakage phenomenon. Higher isolation means less signal leakage, while lower isolation means more signal leakage.

[0090] Another important parameter of a power divider circuit is port matching (also known as return loss). Return loss is the ratio of incident power to reflected power; generally, the higher the port matching, the lower the return loss. An ideal power divider circuit requires all three ports (p1, p2, and p3) to be matched simultaneously, meaning that the return loss of all three ports is zero.

[0091] For example, with Figure 9 Taking a Wilkinson power divider circuit structure as an example, the isolation and port matching are explained as follows: This Wilkinson power divider is a classic power divider based on transmission line design. Figure 9As shown, the Wilkinson power divider is coupled to port 1 (p1), port 2 (p2), and port 3 (p3), a first transmission line between port 1 (p1) and port 2 (p2), a second transmission line between port 1 (p1) and port 3 (p3), and an isolation resistor R between port 2 (p2) and port 3 (p3), with an impedance denoted as 2Z0. The first and second transmission lines should be symmetrically designed, with equal characteristic impedances, both denoted as Z0. Their lengths are both required to be one-quarter of the wavelength of the signal to be transmitted, denoted as λ / 4. The isolation resistor R is required to be much smaller than the wavelength of the signal to be transmitted, and can be almost ignored. When the Wilkinson power divider is operating, port 1 (p1), port 2 (p2), and port 3 (p3) are coupled to three transmission lines with characteristic impedances also denoted as Z0, which satisfies the impedance matching conditions (i.e., port matching) required for signal transmission.

[0092] The signal input from the first port p1 passes through the first and second transmission lines of equal length (λ / 4) and simultaneously reaches both ends of the isolation resistor R. Two signals with theoretically equal amplitude and phase are then output from the second port p2 and the third port p3. It is easy to see that this Wilkinson power divider is also an equal-power power divider. Since the signal amplitude and phase are equal across the isolation resistor R, there should be no differential-mode signal on the isolation resistor R; therefore, theoretically, this Wilkinson power divider has no power loss. However, due to factors such as the materials used in its construction and the non-ideal nature of signal transmission, some power loss will still occur during actual operation.

[0093] Furthermore, due to the presence of the isolation resistor R, when the signal is reflected back from the second port p2, part of the signal reaches the third port p3 through the isolation resistor R. The other part of the signal reaches the third port p3 through two transmission lines of length λ / 4. The amplitudes of these two signals are almost equal, but the path difference (λ / 2, corresponding to two λ / 4 segments) results in a phase difference of π, meaning they are out of phase, causing them to cancel each other out. Thus, the signal input from the second port p2 will almost never be output from the third port p3. Therefore, the presence of the isolation resistor R effectively improves the isolation between the second and third ports.

[0094] Return to Figure 6 In such Figure 6 In the RF circuit 33 shown, the power divider circuit 333 is relatively large, which not only causes inconvenience for integration but also hinders the miniaturization of the RF circuit 33 structure. Therefore, the overall structural size of the RF circuit 33 is relatively large, which in turn leads to a corresponding increase in hardware cost.

[0095] To reduce the size and cost of radio frequency (RF) processing circuits, embodiments of this application provide an RF processing circuit, referring to... Figure 10 As shown, the radio frequency processing circuit 600 includes:

[0096] A first transmission line 610 has its first end coupled to the first port p1 of the radio frequency processing circuit 600, and its second end coupled to the second port p2 of the radio frequency processing circuit 600 via a first adjustment circuit 630. The first adjustment circuit 630 is used to perform impedance matching on the characteristic impedance of the first transmission line. The length of the first transmission line 610 is less than one-quarter of the wavelength corresponding to the radio frequency signal to be transmitted by the radio frequency processing circuit 600.

[0097] A second transmission line 620 has its first end coupled to the first port p1 of the RF processing circuit 600. A second adjustment circuit 640 is coupled between the second end of the second transmission line 620 and the third port p3 of the RF processing circuit 600. The second adjustment circuit 640 is used for impedance matching of the characteristic impedance of the second transmission line. The length of the second transmission line 620 is less than one-quarter of the wavelength corresponding to the RF signal to be transmitted by the RF processing circuit 600. An isolation circuit 650 is coupled between the second end of the first transmission line 610 and the second end of the second transmission line 620.

[0098] The first transmission line 610 and the second transmission line 620 are used to distribute the power of the radio frequency (RF) signal input to the first port p1 to achieve power division. The isolation circuit 650 is used to isolate the third and fourth RF signals. The third RF signal is the RF signal transmitted between the first port p1 and the second port p2. The fourth RF signal is the RF signal transmitted between the first port p1 and the third port p3. It also isolates the RF signal transmitted between the second port p2 and the third port p3. This reduces system noise, minimizes signal distortion, improves signal quality, ensures high stability and purity of the RF signal during transmission, and thus enhances the overall performance of the RF processing circuit.

[0099] In the embodiments of this application, in terms of structural miniaturization, compared to, Figure 9The Wilkinson power divider shown has a first and second transmission line that are one-quarter (90°) of the wavelength of the signal to be transmitted. For integrated circuits, a transmission line of one-quarter wavelength (λ / 4) of the RF signal to be transmitted requires too much chip area, which is not conducive to circuit integration. Furthermore, actual transmission lines have losses, and longer transmission lines result in greater losses. This embodiment designs the lengths of the first transmission line 610 and the second transmission line 620 to be less than one-quarter of the wavelength of the RF signal (e.g., 10°, i.e., λ / 36; or 20°, i.e., λ / 18, etc.), shortening the electrical length of the transmission lines. This not only effectively reduces the physical space occupied but also makes the overall RF processing circuit 600 structure more compact, achieving miniaturization and high integration of the RF processing circuit 600. It also reduces the size and cost of the circuit.

[0100] At the functional separation and optimization level, this embodiment implements power division through the first transmission line 610 and the second transmission line 620, and impedance matching through the first adjustment circuit 630 and the second adjustment circuit 640. This separates the power division and impedance matching functions in the RF processing circuit 600, allowing for independent optimization via adjustment circuits. Designers can flexibly adjust the transmission line length and optimize circuit component parameters according to the specific needs of different application scenarios to achieve optimal signal transmission performance. This highly flexible design capability provides a strong guarantee for the efficient performance of the RF processing circuit 600 in diverse applications.

[0101] At the same time, such as Figure 9 The Wilkinson power divider shown integrates power division and impedance matching functions on the same transmission line, which not only increases design complexity but also limits optimization space, making it difficult to achieve optimal overall performance. This embodiment, however, introduces a first adjustment circuit 630 and a second adjustment circuit 640, which perform independent impedance matching at the output ends of the two transmission lines respectively. This makes the power division function of the first transmission line 610 and the second transmission line 620 more focused, and also provides greater design freedom for the power division functions of the first transmission line 610 and the second transmission line 620, as well as the impedance matching of the first adjustment circuit 630 and the second adjustment circuit 640, thereby significantly improving the transmission efficiency of RF signals and the overall performance of the circuit.

[0102] In some examples, the first transmission line 610 and the second transmission line 620 are microstrip lines or striplines. Microstrip lines and striplines, as planar transmission lines, have a compact structural characteristic, making them ideal for miniaturization designs of the RF processing circuit 600. Furthermore, using microstrip lines or striplines in RF circuits can reduce material costs and manufacturing complexity in actual production.

[0103] In some examples, the power ratio of the RF signal input to the first transmission line 610 to the power ratio of the RF signal input to the second transmission line 620 is k:1, and the ratio of the characteristic impedance of the first transmission line 610 to the characteristic impedance of the second transmission line 620 is... The parallel characteristic impedance of the first transmission line 610 and the second transmission line 620 is equal to the characteristic impedance of the first port p1 of the RF processing circuit 600. Therefore, the characteristic impedance of the first transmission line 610 and the second transmission line 620 is determined by the power distribution ratio and the impedance after parallel connection. The characteristic impedance of the first port p1, the second port p2, and the third port p3 can be 50 ohms.

[0104] In this embodiment, the ratio of the RF signal power input to the first transmission line to the RF signal power input to the second transmission line is set to k:1. This asymmetric power allocation helps to flexibly adjust the signal strength according to actual antenna radiation efficiency, coupling coefficient, and other indicators. Simultaneously, the ratio of the characteristic impedance of the first transmission line to the characteristic impedance of the second transmission line is set to... The choice of this impedance ratio is based on precise calculations of the power distribution ratio and the parallel characteristic impedance, aiming to minimize signal reflection and loss, and ensure signal stability and efficiency during transmission. Furthermore, the parallel characteristic impedance of the first and second transmission lines is designed to be equal to the characteristic impedance of the first port p1 of the RF processing circuit. This innovative design not only simplifies the circuit structure but also significantly improves the transmission efficiency of the RF signal. Due to the perfect match between the parallel characteristic impedance and the characteristic impedance of the first port p1, the RF signal can seamlessly enter the RF processing circuit without the need for additional impedance conversion or matching networks, thereby reducing signal distortion and noise interference during transmission.

[0105] In some examples, the isolation circuit 650 includes a resistor and at least one of the following: a capacitive device and an inductive device.

[0106] For example, in Figure 9 The isolation circuit 650 in the Wilkinson power divider shown only includes resistors. This embodiment adds an inductor or capacitor in series with the resistors to provide impedance matching capability for the return signal at the power divider's ports. Figure 11 As shown, the isolation circuit 650 includes a resistor and a capacitor connected in series.

[0107] Specifically, taking capacitive devices as capacitors and inductive devices as inductors as examples, the capacitance or inductance value needs to be compared with... Figure 10 or Figure 11The electrical lengths of the first transmission line 610 and the second transmission line 620 shown correspond. In a specific implementation, the inductor or capacitor values ​​should ensure that when a signal is input from the second port p2, a portion of the signal reaches the third port p3 through the isolation circuit 650. The other portion of the signal reaches the third port p3 through two segments of the first transmission line 610 and the second transmission line 620, each with a length less than λ / 4. The amplitudes of these two signal portions are almost equal, and the phase difference caused by the path difference must be an integer multiple of π, i.e., opposite in phase, so that the two signal portions exactly cancel each other out. In this way, the signal input from the second port p2 will almost never be output from the third port p3. Therefore, the presence of the isolation circuit 650 effectively improves the isolation between the second port p2 and the third port p3.

[0108] In this embodiment, the isolation circuit 650 effectively isolates signal interference between the first transmission line 610 and the second transmission line 620. This not only significantly reduces system noise and signal distortion, ensuring high stability and purity of the radio frequency signal during transmission, but also enhances the overall performance of the radio frequency processing circuit 600. Furthermore, by utilizing the characteristics of capacitive and inductive devices, the frequency response and impedance matching of the circuit can be further optimized, ensuring the stability of the radio frequency processing circuit 600's performance in different application scenarios.

[0109] In some examples, the first adjustment circuit 630 and the second adjustment circuit 640 include one or more lumped devices. The lumped devices include at least one of the following: capacitive devices and inductive devices. By flexibly employing one or more lumped devices (including capacitive and inductive devices), the RF processing circuit 600 is provided with powerful impedance matching and performance optimization capabilities. The combined use of capacitive and inductive devices allows the adjustment circuit to precisely adjust the impedance value, optimize the signal transmission path, and thus significantly improve the transmission efficiency of the RF signal and the overall performance of the circuit. At the same time, the introduction of lumped devices also provides designers with more design options, facilitating targeted optimization according to the specific needs of different application scenarios, ensuring the stability of the RF processing circuit 600's performance under various environments.

[0110] For example, such as Figure 12 As shown, the first adjustment circuit 630 includes a first set of lumped devices 631 and a second set of lumped devices 632, which are connected in series. The first set of lumped devices 631 is used to adjust the phase of the radio frequency signal input to the second terminal of the first transmission line 610. The second set of lumped devices 632 is used to match the characteristic impedance of the first transmission line 610 and the characteristic impedance of the second port p2.

[0111] In this embodiment, on the one hand, by using multiple sets of lumped components, the circuit can achieve more precise and flexible impedance matching adjustment, ensuring that the RF signal remains in optimal condition during transmission. Simultaneously, the independence of the multiple sets of lumped components gives designers greater freedom in optimizing the circuit; they can independently adjust the parameters of each set of components according to the needs of specific application scenarios to achieve the best signal transmission effect. This highly flexible design capability provides a strong guarantee for the efficient performance of the RF processing circuit 600 in diverse applications.

[0112] On the other hand, the first adjustment circuit 630, by introducing a first set of lumped devices 631, is specifically designed to precisely adjust the phase of the RF signal input at the second terminal of the first transmission line 610. This design significantly enhances the RF processing circuit 600's control over the signal phase, facilitating the implementation of more complex signal processing and modulation functions. Simultaneously, the second set of lumped devices 632 is configured to match the characteristic impedance of the first transmission line 610 and the characteristic impedance of the second port p2. This design effectively reduces signal reflection and loss during transmission, improving signal transmission efficiency and stability.

[0113] In such Figure 12 In the RF processing circuit 600 shown, since the phases of the two paths (taking the first path as the path containing the first port p1 and the second port p2, and the second path as the path containing the first port p1 and the third port p3 as an example) are relative, if the first path leads the second path by more than 180°, it can also be considered that the second path lags the first path by less than 180°. Therefore, the relative phase difference between the two paths only needs to be 180°. If only one path is adjusted to achieve a 180° phase difference, the large-angle phase shift may introduce more phase distortion and signal attenuation, and the amount of phase change with frequency will increase, resulting in distortion and deformation of the transmitted RF signal. The 180° phase difference in this embodiment is only an example. Those skilled in the art can adjust the phase shift amount by one path according to the actual situation to meet the target phase difference between the two paths, such as a target phase difference of 10°, 20°, etc., which is not limited here.

[0114] To reduce the amount of phase change with frequency, a strategy of simultaneous phase shifting of two paths can be adopted. For example, such as... Figure 13As shown, a third set of lumped devices 641 and a fourth set of lumped devices 642 can be configured in the second adjustment circuit 640, and the third set of lumped devices 641 and the fourth set of lumped devices 642 are connected in series. The third set of lumped devices 641 is used to adjust the phase of the RF signal input at the second end of the second transmission line. The fourth set of lumped devices 642 is used to match the characteristic impedance of the second transmission line 620 and the characteristic impedance of the third port p3. If the goal is to achieve the target phase difference between the two paths, each path only needs to be shifted by half of the target phase difference. For example, if the goal is to adjust the phase difference between the two signals to 180°, then each signal can be shifted by 90° instead of shifting one of them by the entire 180°.

[0115] Specifically, such as Figure 14 As shown, the first group of lumped devices 631 may include a first inductor L1, a second inductor L2, and a first capacitor C1. The first end of the first inductor L1 is coupled to the second end of the first transmission line, and the second end of the first inductor L1 is coupled to the first end of the second inductor L2. The first end of the first capacitor C1 is coupled to the second end of the first inductor L1, and the second end of the first capacitor C1 is grounded. The second end of the second inductor L2 is coupled to the second group of lumped devices 632.

[0116] The second group of lumped components 632 may include a third inductor L3, a fourth inductor L4, and a second capacitor C2. The first terminal of the third inductor L3 is coupled to the second terminal of the second inductor L2 and the first terminal of the second capacitor C2, and the second terminal of the third inductor L3 is grounded. The second terminal of the second capacitor C2 is coupled to the first terminal of the fourth inductor L4 and the second port p2. The second terminal of the fourth inductor L4 is grounded.

[0117] The third group of lumped devices 641 may include a fifth inductor L5, a sixth inductor L6, and a third capacitor C3. The first terminal of the fifth inductor L5 is coupled to the second terminal of the second transmission line, and the second terminal of the fifth inductor L5 is coupled to the first terminal of the sixth inductor L6. The first terminal of the third capacitor C3 is coupled to the second terminal of the fifth inductor L5, and the second terminal of the third capacitor C3 is grounded. The second terminal of the sixth inductor L6 is coupled to the fourth group of lumped devices 642.

[0118] The fourth group of lumped components 642 may include a fourth capacitor C4, a fifth capacitor C5, and a seventh inductor L7. The first terminal of the fourth capacitor C4 is coupled to the second terminal of the sixth inductor L6 and the first terminal of the seventh inductor L7, and the second terminal of the fourth capacitor C4 is grounded. The second terminal of the seventh inductor L7 is coupled to the first terminal of the fifth capacitor C5 and the third port p3. The second terminal of the fifth capacitor C5 is grounded.

[0119] In this embodiment, the third set of lumped devices 641 is used to adjust the phase of the radio frequency signal input to the second terminal of the second transmission line 620. The second adjustment circuit 640 is further extended from the original design, possessing more diverse impedance matching and signal phase adjustment capabilities, thereby enabling efficient and stable radio frequency signal processing in a wider range of application scenarios. This not only enhances the overall performance of the circuit but also improves its adaptability and flexibility, allowing designers to perform more precise circuit optimization according to different radio frequency processing circuit requirements.

[0120] On the other hand, the introduction of a third set of lumped devices 641 specifically for adjusting the phase of the RF signal input at the second terminal of the second transmission line 620 significantly enhances the phase control capability of the RF processing circuit 600. This function is particularly important in complex RF processing circuits because it allows designers to precisely control the phase of the signal, thereby optimizing the signal path, reducing phase errors, and potentially enabling advanced signal processing functions such as phase balancing and phase modulation. The improved phase adjustment capability not only enhances the transmission quality of the RF signal but also strengthens the stability and reliability of the RF processing circuit 600 in complex electromagnetic environments. Therefore, the addition of the third set of lumped devices 641 brings greater flexibility and powerful performance to the RF processing circuit 600.

[0121] On the other hand, such as Figure 13 The RF processing circuit 600 shown enables flexible adjustment of the target phase difference between two signals. First, it reduces the difficulty of phase shifting, as small-angle phase shifts are generally easier to implement than large-angle phase shifts because phase shifters typically have better linearity and accuracy within a smaller phase shift range. Second, it reduces phase distortion; large-angle phase shifts can introduce more phase distortion and signal attenuation, while simultaneous small-angle phase shifts on both paths help maintain signal integrity and stability. Specifically, to optimize the phase adjustment strategy, reduce the amplitude of phase shift on a single path, and effectively suppress the influence of phase fluctuations with frequency, a simultaneous two-path phase shift method is adopted. Each path only needs to shift half of the target phase difference, thus significantly reducing the complexity of phase adjustment and phase distortion. Simultaneously, simultaneous phase adjustment on both paths also provides phase frequency compensation. Furthermore, simultaneous phase adjustment on both paths can handle small phase changes at different frequencies, ensuring the stability and accuracy of signal processing.

[0122] In such Figure 12 , Figure 13 and Figure 14 The RF processing circuit shown has a complex structure and uses a lot of lumped components, which makes circuit debugging inconvenient and introduces a large insertion loss, resulting in a decrease in antenna TRP revenue.

[0123] To simplify the circuit structure, facilitate circuit debugging, and reduce power consumption, the first adjustment circuit 630 can implement phase shift and impedance transformation using a set of lumped devices. Similarly, the second adjustment circuit 640 can also implement phase shift and impedance transformation using a set of lumped devices. In one example, such as Figure 15 As shown, the first adjustment circuit 630 includes a set of lumped devices. The first adjustment circuit 630 is used to match the characteristic impedance of the first transmission line 610 and the characteristic impedance of the second port p2, and also adjusts the phase of the first radio frequency signal input to the second end of the first transmission line 610. The second adjustment circuit 640 includes a set of lumped devices. The second adjustment circuit 640 is used to match the characteristic impedance of the second transmission line 620 and the characteristic impedance of the third port p3, and also adjusts the phase of the second radio frequency signal input to the second end of the second transmission line 620.

[0124] In this embodiment, the complexity of the RF processing circuit 600 is simplified while maintaining high performance. This simplified circuit structure not only reduces design, manufacturing, and maintenance costs but also improves circuit reliability and stability. Each lumped device group can perform precise impedance matching and possible phase adjustment for its corresponding transmission line, thereby ensuring low loss and high fidelity of the RF signal during transmission. Furthermore, this design facilitates subsequent performance optimization and upgrades, as designers can focus on optimizing a few components without dealing with complex circuit interactions.

[0125] On the other hand, the first adjustment circuit 630 also performs fine phase control on the first radio frequency signal input to the second terminal of the first transmission line 610 through its phase adjustment function. Similarly, the second adjustment circuit 640 also performs phase adjustment on the second radio frequency signal input to the second terminal of the second transmission line 620. This design not only simplifies the circuit structure but also achieves independent and precise phase control of the radio frequency signals on the two transmission lines, thereby improving the overall performance of the radio frequency processing circuit 600, such as increasing the antenna TRP gain.

[0126] For example, as Figure 15 In the RF processing circuit 600 shown, the frequency of the RF signal to be transmitted is 725.5MHz. The first transmission line 610 and the second transmission line 620 are microstrip lines with an electrical length of 3mm (i.e., 10°, λ / 36). The characteristic impedance of the first transmission line 610 and the second transmission line 620 can be 100 ohms, and the characteristic impedance of the first port p1, the second port p2, and the third port p3 can be 50 ohms, for example. The type of lumped devices (capacitive or inductive) and the reactance value in the first adjustment circuit 630 and the second adjustment circuit 640 can be determined using a Smith chart.

[0127] In the Smith chart, rotating downwards along the admittance circle results in a capacitor in parallel, while rotating upwards along the admittance circle results in an inductor in parallel. Rotating downwards along the resistance circle results in a capacitor in series, while rotating upwards along the resistance circle results in an inductor in series.

[0128] Taking the determination of the type of concentrated components (capacitive or inductive) and reactance value in the first adjustment circuit 630 as an example, such as... Figure 16 As shown, point A corresponds to a characteristic impedance of 100 ohms (normalized value of 2 in the Smith chart), and point B corresponds to a characteristic impedance of 50 ohms (normalized value of 1 in the Smith chart). We can start from point A and proceed along the impedance circle (or admittance circle, admittance circle)... Figure 16 (As shown in the middle), rotate up or down until you reach point B.

[0129] like Figure 16 As shown, first, rotating downwards from point A along the admittance circle to point C, it can be determined that a capacitor needs to be connected in parallel in the first adjustment circuit 630. Then, rotating from point C along the resistance circle to point D, it can be determined that an inductor needs to be connected in series in the first adjustment circuit 630. Finally, rotating from point D along the admittance circle to point B, it can be determined that a capacitor needs to be connected in parallel in the first adjustment circuit 630. The circuit structure of the first adjustment circuit 630 can be obtained as follows: Figure 17 As shown.

[0130] like Figure 17 As shown, the first adjustment circuit 630 includes a sixth capacitor C6, a seventh capacitor C7, and an eighth inductor L8. The first terminal of the sixth capacitor C6 is coupled to the second terminal of the first transmission line, and the second terminal of the sixth capacitor C6 is grounded. The first terminal of the eighth inductor L8 is coupled to the second terminal of the first transmission line, and the second terminal of the eighth inductor L8 is coupled to the second port p2. The first terminal of the seventh capacitor C7 is coupled to the second port p2, and the second terminal of the seventh capacitor C7 is grounded.

[0131] At the same time, different phase shifts can also be achieved using the Smith chart. Different device values ​​can be selected to ensure that the final impedance matching remains constant, while the matching wire travels different distances, thereby achieving different phase shifts.

[0132] Similarly, the circuit structure of the second adjustment circuit 640 can be determined. For example, as shown... Figure 18 As shown, the second adjustment circuit 640 may include a ninth inductor L9, a tenth inductor L10, and an eighth capacitor C8. The first terminal of the ninth inductor L9 is coupled to the second terminal of the first transmission line, and the second terminal of the ninth inductor L9 is grounded. The first terminal of the eighth capacitor C8 is coupled to the second terminal of the first transmission line, and the second terminal of the eighth capacitor C8 is coupled to the third port p3. The first terminal of the tenth inductor L10 is coupled to the third port p3, and the second terminal of the tenth inductor L10 is grounded.

[0133] Combination Figure 15 , Figure 17 and Figure 18 It can be obtained Figure 19 ,by Figure 19 Taking the radio frequency processing circuit 600 shown as an example, combined with Figure 20 , Figure 21 , Figure 22 and Figure 23 The simulation results are shown in the diagram. Figure 19 The RF processing circuit 600 shown can achieve a passband reflection coefficient of less than -20dB, an isolation of less than -25dB, an insertion loss of less than 0.1dB, and a 90° phase shift for the N28 TX.

[0134] Specifically, such as Figure 20 As shown, Figure 20 The horizontal axis represents the frequency (703MHz-748MHz) of the RF signal transmitted in the RF processing circuit 600, and the vertical axis represents the transmission efficiency. According to... Figure 20 It can be seen that when transmitting a 725MHz radio frequency signal in the radio frequency processing circuit 600, the dB(S(2,2)) is -37.067dB, that is, the reflection coefficient is -20dB.

[0135] like Figure 21 As shown, Figure 21 The horizontal axis represents the frequency (703MHz-748MHz) of the RF signal transmitted in the RF processing circuit 600, and the vertical axis represents the transmission efficiency. According to... Figure 21 It can be seen that when transmitting a 725MHz radio frequency signal in the radio frequency processing circuit 600, dB(S(3,2)) or dB(S(2,3)) is -28.366dB, that is, the isolation is -28.366dB, which is less than -25dB.

[0136] like Figure 22 As shown, Figure 22 The horizontal axis represents the frequency (703MHz-748MHz) of the RF signal transmitted in the RF processing circuit 600, and the vertical axis represents the transmission efficiency. According to... Figure 22 It can be seen that when transmitting a 725MHz RF signal in the RF processing circuit 600, dB(S(2,1)) is -3.03dB, that is, the insertion loss is less than 0.1dB.

[0137] like Figure 23 As shown, Figure 23 The horizontal axis represents the frequency (703MHz-748MHz) of the RF signal transmitted in the RF processing circuit 600, and the vertical axis represents the difference between (S(3,1)) and (S(2,1)). According to... Figure 23It can be seen that when transmitting a 725MHz radio frequency signal in the radio frequency processing circuit 600, the difference between (S(3,1)) and (S(2,1)) is 92.493, which means that a 90° phase shift is achieved.

[0138] Even considering device losses Figure 19 The simulation results for the insertion loss of the RF processing circuit 600 shown are around 0.3dB, while... Figure 6 The circuit structure shown has a voltage drop of approximately 0.5 dB.

[0139] This disclosure also provides a radio frequency processing device 700, such as... Figure 24 As shown, the radio frequency processing device 700 includes a power amplifier 710 and a radio frequency processing circuit 600, with the power amplifier 710 coupled to the first port p1 of the radio frequency processing circuit 600. The radio frequency processing device 700 can be used as... Figure 3 , Figure 4 and Figure 6 The radio frequency circuit 33 in the corresponding embodiment can be referred to the corresponding embodiment described above, and will not be repeated here. The radio frequency processing device 700 can also be used as a transmitter, receiver, or transceiver (a transceiver includes a transmitter and a receiver), etc.

[0140] This disclosure also provides a communication device, which includes a circuit board and a radio frequency processing unit. The communication device can be, for example... Figure 2 The electronic device 100 shown is described in detail above, and will not be repeated here.

[0141] It should be understood that in the various embodiments of this application, the order of the above-mentioned processes does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0142] Those skilled in the art will recognize that the modules and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0143] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and modules described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0144] In the embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another device, or some features may be ignored or not executed. Furthermore, the coupling, connection, or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling, connection, or communication connection between devices or modules may be electrical, mechanical, or other forms.

[0145] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located on one device or distributed across multiple devices. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0146] In addition, the functional modules in the various embodiments of this application can be integrated into one device, or each module can exist physically separately, or two or more modules can be integrated into one device.

[0147] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented using software programs, implementation can be, in whole or in part, in the form of a computer program product. This computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device containing one or more servers, data centers, etc., that can be integrated with the medium. The available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., DVDs), or semiconductor media (e.g., solid-state disks, SSDs), etc.

[0148] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A radio frequency processing circuit, characterized in that, include: A first transmission line, wherein a first end of the first transmission line is coupled to a first port of the radio frequency processing circuit, and a first adjustment circuit is coupled between a second end of the first transmission line and a second port of the radio frequency processing circuit; the length of the first transmission line is less than one-quarter of the wavelength corresponding to the radio frequency signal to be transmitted by the radio frequency processing circuit. The first adjustment circuit is used to match the characteristic impedance of the first transmission line and the characteristic impedance of the second port; A second transmission line has a first end coupled to a first port of the radio frequency processing circuit, and a second adjustment circuit coupled between the second end of the second transmission line and a third port of the radio frequency processing circuit; the length of the second transmission line is less than one-quarter of the wavelength corresponding to the radio frequency signal to be transmitted by the radio frequency processing circuit. The second adjustment circuit is used to match the characteristic impedance of the second transmission line and the characteristic impedance of the third port; An isolation circuit is coupled between the second end of the first transmission line and the second end of the second transmission line.

2. The radio frequency processing circuit according to claim 1, characterized in that, The first transmission line and the second transmission line are either microstrip lines or striplines.

3. The radio frequency processing circuit according to claim 1, characterized in that, The isolation circuit includes a resistor and at least one of the following: a capacitive device and an inductive device.

4. The radio frequency processing circuit according to claim 1, characterized in that, The first adjustment circuit and the second adjustment circuit include one or more lumped devices; the lumped devices include at least one of the following: capacitive devices and inductive devices.

5. The radio frequency processing circuit according to claim 1, characterized in that, The first adjustment circuit includes a first group of lumped devices and a second group of lumped devices; The first set of lumped devices is used to adjust the phase of the radio frequency signal input at the second end of the first transmission line; The second set of lumped devices is used to match the characteristic impedance of the first transmission line and the characteristic impedance of the second port.

6. The radio frequency processing circuit according to claim 1 or 5, characterized in that, The second adjustment circuit includes a third group of lumped devices and a fourth group of lumped devices; The third set of lumped devices is used to adjust the phase of the radio frequency signal input at the second end of the second transmission line; The fourth set of lumped devices is used to match the characteristic impedance of the second transmission line and the characteristic impedance of the third port.

7. The radio frequency processing circuit according to any one of claims 1-4, characterized in that, The first adjustment circuit is also used to adjust the phase of the first radio frequency signal input at the second end of the first transmission line; The second adjustment circuit is also used to adjust the phase of the second radio frequency signal input at the second end of the second transmission line.

8. The radio frequency processing circuit according to any one of claims 1-5, characterized in that, The ratio of the power of the RF signal input to the first transmission line to the power of the RF signal input to the second transmission line is k:1; and the ratio of the characteristic impedance of the first transmission line to the characteristic impedance of the second transmission line is 1:

1. The parallel characteristic impedance of the first transmission line and the second transmission line is equal to the characteristic impedance of the first port of the radio frequency processing circuit.

9. A radio frequency processing device, characterized in that, It includes a power amplifier and a radio frequency processing circuit as described in any one of claims 1-8, wherein the power amplifier is coupled to a first port of the radio frequency processing circuit.

10. A communication device, characterized in that, It includes a circuit board and a radio frequency processing device as described in claim 9 disposed on the circuit board.

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