PCB (printed circuit board) capable of preventing board clamping and processing method thereof

Abstract

The invention discloses an anti-jamming PCB (printed circuit board) and a processing method thereof, the PCB is provided, a first chamfer is arranged at the end angle of the upper side of the PCB in the advancing direction, one-way board feeding is realized by utilizing the first chamfer, and the condition of jamming is prevented. The thickness of the PCB is not smaller than 4 mm, and in the application scene, compared with a traditional forming machine milling cutting mode, the machining process is more convenient, and meanwhile cooperation of the PCB and the rolling wheels is better facilitated.

Description

Technical Field

[0001] This invention relates to the field of PCB board processing, specifically to an anti-jamming PCB board and its processing method. Background Technology

[0002] In PCB manufacturing, for PCBs thicker than 4mm, a CNC milling machine is used after lamination to remove the edge material around the edges for subsequent operations. However, the most common step in current PCB molding is using a straight shank milling cutter on the milling machine to cut the shape vertically. While this method is economical and fast, the milling direction is perpendicular to the material's direction, resulting in 90° edges and corners on the PCB after lamination, which are prone to sharp burrs. This causes the PCB edges to scratch the rollers or lamination rollers on the horizontal conveyor line, reducing their lifespan and allowing contaminants from the damaged rollers to fall and contaminate the PCB. Furthermore, 90° edges can easily get stuck on the rollers during horizontal conveyor transport, causing jams and ultimately scrapping the PCB, severely impacting conveyor efficiency. Summary of the Invention

[0003] To overcome the shortcomings of existing technologies, this invention provides a PCB board for preventing jamming and its processing method.

[0004] The technical solution of this invention is as follows:

[0005] A PCB board for preventing jamming includes a PCB material, which contacts and is driven forward by a roller. The upper corner of the end of the PCB material is provided with a first chamfer, which is an inclined plane, and the angle between the plane and the upper surface of the PCB board is 25° to 35°.

[0006] Preferably, the thickness of the PCB board is not less than 4mm.

[0007] Preferably, the lower end corner of the PCB board is provided with a second chamfer, which is an inclined plane or a convex arc surface.

[0008] Preferably, there is a gap between the first chamfer and the second chamfer, so that the PCB board has excess thickness at this end.

[0009] Preferably, the relationship between the excess thickness a and the thickness b of the PCB board is: a = 1 / 4b, and a ≤ 3mm.

[0010] A method for processing a PCB board as described in any one of claims 1-6.

[0011] (1) First, pre-process the PCB board;

[0012] (2) Inspect the PCB board;

[0013] (3) Perform chamfering;

[0014] (4) Quality inspection and further cleaning.

[0015] Preferably, the pretreatment of the PCB board in step 1 includes: using a spray line to spray and clean the PCB board to remove debris from the surface of the PCB board; then using a baking line to dry the PCB board; and finally using a dust removal line to remove static electricity from the surface of the PCB board to prevent debris from adhering to the PCB board.

[0016] Preferably, the preprocessing of the PCB board in step 1 further includes: using a vision inspection device to detect the parameters of the angle of the first chamfer and the second chamfer, the width of the texture groove and the depth of the texture groove, and automatically rejecting unqualified products when the detected parameters exceed the preset range.

[0017] Preferably, the quality inspection and re-cleaning in step 4 includes: using a flexible brush to deburr the first chamfer and the second chamfer area of ​​the PCB board, so that the surface roughness Ra of the first chamfer and the second chamfer area is ≤3.2μm.

[0018] Preferably, the chamfering process in step 3 includes: using a five-axis CNC cutting device to process a first chamfer and a second chamfer on the upper end and lower end of the PCB board, respectively.

[0019] According to the above-described solution, the beneficial effects of this invention are as follows: This invention provides a PCB board with a first chamfer at the upper corner in the forward direction. This first chamfer enables unidirectional board feeding, preventing board jamming. The PCB board thickness targeted by this invention is not less than 4mm. In this application scenario, compared to the traditional forming machine cutting method, this invention offers a more convenient processing technology and is more conducive to the cooperation between the PCB board and the rollers. Attached Figure Description

[0020] Figure 1 A schematic diagram of the PCB board structure after processing using existing technology;

[0021] Figure 2 This is a flowchart of the present invention;

[0022] Figure 3 This is a schematic diagram of the PCB board structure;

[0023] Figure 4 This is a structural diagram of the PCB board and rollers;

[0024] Figure 5 This is a schematic diagram of the cross-sectional structure of the PCB board.

[0025] In the diagram, 10 is the PCB board material; 20 is the first chamfer; 21 is the stepped corner; 22 is the protective layer; 30 is the second chamfer; 31 is the texture groove; and 40 is the roller. Detailed Implementation

[0026] The present invention will now be further described with reference to the accompanying drawings and embodiments:

[0027] In the existing PCB board 10 processing technology, the PCB board 10 after being processed by cutting and lamination, such as Figure 1 As shown, the PCB board 10 has four right-angled sides, each with a 90° angle. When the PCB board 10 is transported by a horizontal conveyor line, the sharp edges of the right-angled corners can easily scratch the surfaces of the rollers 40 or the pressing rollers during contact with the conveyor line, affecting subsequent processing. Therefore, the following specific embodiments improve the processing method of the PCB board 10, aiming to solve the technical problem of the PCB board 10 scratching the rollers 40 or the pressing rollers during horizontal conveyor line transport.

[0028] like Figures 3 to 5 As shown, to reduce damage to the roller 40 during the translation of the PCB board, this invention provides a PCB board material 10. The upper corner of the PCB board material 10 in the forward direction is provided with a first chamfer 21. The first chamfer 21 enables unidirectional board feeding and prevents board jamming. The PCB board material 10 used in this invention has a thickness of not less than 4mm. In this application scenario, compared with the traditional forming machine cutting method, this invention has a more convenient processing technology and is more conducive to the cooperation between the PCB board material 10 and the roller 40.

[0029] Preferably, a second chamfer 30 is provided at the lower corner of the PCB board 10 in the forward direction. The board thickness corresponding to the first chamfer 21 is greater than the board thickness corresponding to the second chamfer 30, and there is a gap between the first chamfer 21 and the second chamfer 30, so that the board has a thickness 'a' in the forward direction. In this invention, the board thickness 'a' = 1 / 4b and ≤ 3mm, where b is the board thickness of the PCB board 10. This board thickness can accommodate the gap between the upper and lower rollers 40 during the board's movement, and at the same time, it can make the board clamped by the two rollers 40, which is beneficial for the board to move horizontally under the action of the rollers 40.

[0030] In the preferred embodiment of the present invention, the first chamfer 21 is an inclined plane, and the angle between this plane and the upper plane of the plate is an acute angle (30° to 35°, preferably 32°); the second chamfer 30 is an arc surface, and this arc surface is convex. The acute angle of the first chamfer 21 allows the upper roller 40 to enter smoothly and prevents jamming; the arc-shaped second chamfer 30 can cooperate with the lower roller 40, avoiding damage to the roller 40 by the sharp corner.

[0031] In one specific embodiment of the present invention, the surface of the first chamfer 21 is provided with a plurality of concave and parallel stepped corners 21, the extending direction of which is parallel to the axial direction of the roller 40 and perpendicular to the forward direction of the PCB board 10. The surface of the second chamfer 30 is provided with a plurality of concave and parallel textured grooves 31, the extending direction of which is parallel to the axial direction of the roller 40 and perpendicular to the forward direction of the PCB board 10. Preferably, the apex angle of the stepped corner 21 is an acute angle, and the textured groove 31 is an arc-shaped groove.

[0032] In addition, the present invention also provides a processing method for the board material: (1) pre-processing the PCB board, that is, cleaning the surface of the PCB board; (2) inspecting the PCB board to determine the various parameters of the PCB board, and clarifying the forward direction and chamfer processing area; (3) performing chamfer processing; (4) quality inspection and further cleaning.

[0033] Example 1

[0034] like Figure 2 As shown, this embodiment is used to process PCB board 10 with a thickness of 4mm to 6mm, preferably PCB board 10 with a thickness of 5mm. The specific processing steps are as follows:

[0035] Step 1: Preprocessing.

[0036] A PCB board 10 with dimensions of 500mm × 400mm × 5mm is provided and fed into a cleaning equipment. The cleaning equipment includes a spray line, a baking line, and a dust removal line. First, the spray line activates a high-pressure deionized water spray system, with the water pressure adjusted to 0.3MPa. The distance between the spray nozzle and the surface of the PCB board 10 is controlled at 150mm. Both sides of the PCB board 10 are sprayed and cleaned for 3 minutes to remove drilling debris, resin powder, and oil stains. After spraying, the PCB board 10 is fed into the baking line. The temperature inside the baking chamber is set to 70℃, and the conveyor speed is 0.5m / min. The PCB board 10 is kept in the baking line for 8 minutes to achieve thorough drying. After drying, the PCB board 10 enters the dust removal line. The distance between the outlet of the ion air gun in the dust removal line and the surface of the PCB board 10 is 100mm, and the air velocity is 8m / s. The surface of the PCB board 10 is ionized and blown for 2 minutes to remove surface static electricity and prevent debris from re-adhering. The combined process of spraying, baking, and dust removal ensures the cleanliness of the PCB board surface, providing a guarantee for the accuracy of subsequent processing.

[0037] Step 2: Region division.

[0038] The cleaned PCB board 10 is fixed on the worktable of the testing equipment, which is a laser thickness gauge. The laser thickness gauge measures the thickness of the PCB board 10 at its four corners and center, with a measurement accuracy of 0.001 mm, to re-verify the thickness of the PCB board 10. If the test results are satisfactory, the control system of the laser thickness gauge divides the PCB board 10 into a top region and a bottom region in the thickness direction. The top region has a thickness of 1.0 mm, and the bottom region has a thickness of 4.0 mm. The boundary between the two regions is precisely located using the coordinate system of the laser thickness gauge. The thickness measurement of the PCB board 10 employs a multi-point detection method, which not only verifies the thickness of the PCB board 10 but also improves the accuracy of the region division.

[0039] Step 3: Chamfering.

[0040] like Figures 3 to 5As shown, the first chamfer 20 of the top area is processed first. Based on the thickness of the PCB board 10, the angle of the first chamfer 20 is set to 30°–35°, preferably 32°. A five-axis CNC cutting machine uses a 10mm diameter carbide end mill, with a milling cutter speed set to 3000 r / min and a feed rate of 500 mm / min. The chamfer is applied to the four edges of the top area of ​​the PCB board 10. During processing, an emulsion is used for cooling and lubrication to prevent wear on the milling cutter and burning of the edges of the PCB board 10. Specifically, the first chamfer 20 is an inclined plane to avoid a right-angle collision between the PCB board 10 and the roller 40, while also facilitating the cutting of the roller 40. The angle of the first chamfer 20 is the acute angle between the inclined edge of the first chamfer 20 and the horizontal plane, which is 30°–35°. Combined with the thickness of the PCB board 10, this allows for a smoother transition for the roller.

[0041] like Figures 3 to 5 As shown, after the first chamfer 20 is machined, keeping the milling cutter parameters unchanged, at least three equally spaced stepped corners 21 are machined on the surface of the first chamfer 20. Keeping the milling cutter parameters unchanged reduces the difficulty of equipment operation. The height of each stepped corner 21 is 0.3mm, and the angle of the stepped corner 21 is 30° to 35°, preferably 30°. After the stepped corners 21 are machined, a diamond grinding head with a diameter of 5mm is replaced. The grinding head speed is 2000r / min, and the feed rate is 300mm / min. The surface of the stepped corners 21 is ground to form an arc-shaped protective layer 22 with a radius of 0.1mm, reducing damage to the rollers caused by the stepped corners. The stepped corner 21 optimizes the guidance of the top area of ​​the PCB board, reduces the contact area and interference risk between the PCB board 10 and the roller 40, and helps improve the anti-jamming effect. Combined with the arc-shaped protective layer 22, it eliminates burrs and sharp edges generated during the processing of the stepped corner 21, preventing scratches on the roller 40 and the PCB board's own circuitry during transfer or assembly. The number of stepped corners 21 is no less than three, and in this embodiment, four are preferred. The four stepped corners 21 are arranged at equal intervals along the inclined surface of the first chamfer 20, with adjacent stepped corners 21 having equal spacing and parallel to the inclined surface of the first chamfer 20, thus forming a progressively decreasing stepped structure on the inclined surface of the first chamfer 20.

[0042] like Figures 3 to 5As shown, after machining the first chamfer 20 and the stepped angle 21, the second chamfer 30 is machined at one end of the bottom region. Specifically, a ball end mill with a diameter of 15mm is used, with a milling cutter speed of 2500r / min and a feed rate of 400mm / min to perform arc chamfering on the four edges of the bottom region of the PCB board 10. Depending on the thickness of the bottom region of the PCB board 10, emulsion cooling and lubrication are also used during the machining process. The cooperation between the second chamfer 30 and the first chamfer 20 further reduces the risk of interference between the PCB board 10 and the roller 40. The vertical cross-section of the second chamfer 30 is arc-shaped, and the radius of curvature of the arc surface of the second chamfer 30 is adapted to the thickness of the bottom region of the PCB board 10. When the thickness of the bottom region of the PCB board 10 is 4mm, the curvature range is 0.5mm to 2.0mm.

[0043] like Figures 3 to 5 As shown, further, after the second chamfer 30 is processed, keeping the ball end mill parameters unchanged, a textured groove 31 is milled on the surface of the second chamfer 30. The extension direction of the textured groove 31 is parallel to the roller axis, which can match the rotation direction of the roller. The groove depth is 0.05mm to 0.2mm, preferably 0.1mm, and the spacing between adjacent textured grooves 31 is 0.3mm to 1.2mm, preferably 0.8mm. By using the textured groove 31 in conjunction with the second chamfer 30, the guiding performance of the bottom area of ​​the PCB board entering and exiting the roller 40 can be further optimized to improve the smoothness of the flow. The textured groove 31 with a groove depth of 0.05mm to 0.2mm can accommodate the small debris and dust left over from the roller 40, avoiding the accumulation of impurities that could cause the board to jam or scratch the PCB board 10. The texture groove 31 is a groove structure formed by milling along the 30 arc surface of the second chamfer 30. The vertical cross-section shape is U-shaped. The texture groove 31 is distributed on the arc surface of the second chamfer 30 and extends along the tangent direction of the arc surface. This not only makes it fit the surface curvature of the second chamfer 30 better, but also helps to reduce the requirements for machining accuracy.

[0044] The preferred plurality of textured grooves 31 are evenly distributed at equal intervals along the circumferential direction of the second chamfer 30, with the spacing between adjacent textured grooves 31 ranging from 0.3mm to 1.2mm, satisfying the arc-shaped distribution requirements of the textured grooves 31 and the surface of the second chamfer 30. All textured grooves 31 have identical groove depth, width, and cross-sectional shape, which helps reduce machining difficulty. After milling the textured grooves 31 with a milling cutter, the connecting surfaces between each textured groove 31 are ground, thereby forming a complete and smooth arc surface separating each textured groove 31. This ensures that the chamfered surfaces between textured grooves 31 remain smooth, without intersections or overlaps, ensuring that each textured groove 31 can independently perform its function of accommodating debris and optimizing guidance.

[0045] After the PCB undergoes the above processing, as follows: Figures 3 to 5As shown, the thickness of one end of the cut PCB board 10 is 0.18 mm to 0.32 mm of the thickness of the PCB board 10 before cutting. Among them, the thickness of one end of the cut PCB board 10 is at the junction where the first chamfer 20 and the second chamfer 30 are connected, and a tapered thin wedge-shaped guiding structure can be formed. As Figure 4 shown, the thickness of one end of the cut PCB board 10 is less than 0.35 mm. Through the above settings, a thin wedge-shaped guiding structure is formed at the cut end of the PCB board 10. When the PCB board 10 enters the area of the roller 40 during transportation, the thin wedge-shaped structure changes the contact form between the end of the PCB board 10 and the roller 40 from "right-angle顶撞" to "inclined-plane sliding-in", effectively reducing the contact normal pressure, reducing the transportation resistance and the concentration of friction force, and preventing the board from retreating during transportation with the roller 40. At the same time, this structure avoids mechanical interference between the end and the support point of the roller 40, thereby reducing the problem of board jamming caused by the excessive edge thickness of the PCB board 10.

[0046] Preferably, in the present invention, the remaining thickness a of the cut board is 1 / 4b and ≤ 3 mm, and the remaining thickness a in the present invention is close to the lower side of the board, that is, the board thickness corresponding to the first chamfer 20 is greater than the board thickness corresponding to the second chamfer 30, so as to adapt to the up and down displacement of the upper and lower rollers of the board. During the translation of the board, when the board on the lower side contacts the lower roller, the height at which the lower roller abuts against the board is small, and the height at which the board on the upper side abuts against the upper roller is large. Therefore, the milling height corresponding to the first chamfer 20 is greater than the milling height of the second chamfer 30.

[0047] In the present invention, both the first chamfer 21 and the second chamfer 30 are located in the board feeding direction, and the first chamfer 21 and the second chamfer 30 are not provided on the board discharging side. In this way, not only can the processing steps be reduced, but also the upper roller and the lower roller will not be affected.

[0048] Step 4: Quality inspection.

[0049] Send the processed PCB board 10 into the vision inspection equipment. The vision inspection equipment is equipped with a 2 million-pixel high-definition industrial camera, and the shooting accuracy is 0.005 mm.配合视觉检测设备搭载的图像分析系统对第一倒角20角度(预设范围30°~35°)、第二倒角30曲率(预设范围0.5mm~2.0mm)、纹理槽31槽宽(预设范围0.1mm~0.3mm)及槽深(预设范围0.05mm~0.2mm)等参数进行检测。判断加工完成后的PCB板材1应翻译为:Cooperate with the image analysis system carried by the vision inspection equipment to detect parameters such as the angle of the first chamfer 20 (preset range 30° - 35°), the curvature of the second chamfer 30 (preset range 0.5 mm - 2.0 mm), the groove width of the texture groove 31 (preset range 0.1 mm - 0.3 mm), and the groove depth (preset range 0.05 mm - 0.2 mm). Determine whether the processed PCB board 10 is qualified. The use of the vision inspection link realizes the precise control of key parameters and prevents unqualified PCB boards 10 from flowing into subsequent processes.

[0050] Finally, the processed PCB board 10 is fed into a flexible brush polishing device for fine cleaning. A nylon flexible brush with a bristle diameter of 0.05 mm is preferably used. The brushing speed is set to 400 r / min, and the conveying speed of the PCB board 10 is 0.3 m / min. Double-sided brush polishing is performed to deburr the first chamfer 20 and the second chamfer 30 areas. After processing, the surface roughness Ra of the first chamfer 20 and the second chamfer 30 areas is less than 3.2 μm, preferably 2.8 μm, as measured by a surface roughness meter. This fine cleaning using flexible brush polishing further improves the surface quality of the product.

[0051] This invention utilizes a combination of cleaning equipment, testing equipment, and a five-axis CNC cutting device to clean the surface of the PCB board 10 after pressing, measure the thickness of the PCB board 10, and process a first chamfer 20 and a second chamfer 30 according to the thickness of the PCB board 10. The first chamfer 20 and the second chamfer 30 can reduce the sharpness of the edges of the PCB board 10 and reduce the friction between the PCB board 10 and the roller 40, allowing the PCB board 10 to pass smoothly through the roller 40. This effectively solves the technical problems of board jamming and scratching the surface of the roller 40, and greatly improves the conveying efficiency of the PCB board 10.

[0052] Example 2

[0053] This embodiment is used to process PCB board material 10 with a thickness of 6-10mm, preferably 8mm PCB board material 10. The specific steps are as follows:

[0054] Step 1: Provide an aluminum-based PCB board 10 with dimensions of 600mm×500mm×8mm, and feed it into the cleaning line, spray line, baking line and dust removal line in sequence, and clean the PCB board 10 according to the steps in Example 1.

[0055] Step 2: Use a laser thickness gauge to inspect the four corners, center and edge midpoints of the cleaned PCB board 10. Use the control system of the laser thickness gauge to divide the top and bottom areas of the PCB board 10. The thickness of the top area is 2mm and the thickness of the bottom area is 6mm.

[0056] Step 3: The top area of ​​the PCB board 10 is processed. Specifically, since the thickness of the PCB board 10 has changed compared to Example 1 and is greater than that of the PCB board 10 in Example 1, the milling cutter needs to be replaced. A 12mm diameter carbide milling cutter is preferably used, with a rotation speed of 3500 r / min and a feed rate of 600 mm / min. A first chamfer 20 is machined at one end of the top area of ​​the PCB board 10. The angle of the first chamfer 20 is 38°. It should be noted that the angle of the first chamfer 20 can be machined to any angle within the range of 35° to 40° as needed. During the processing, emulsion is used for cooling and lubrication. Subsequently, at least three stepped corners 21 are machined on the surface of the first chamfer 20. The edges of the stepped corners 21 are ground with a diamond grinding head to form an arc-shaped protective layer 22, and the angle of the stepped corners 21 is the same as that of the stepped corners 21 in Example 1. Then, the second chamfer 30 is processed. The processing of the second chamfer 30 is consistent with that in Example 1, so the processing steps are not described in detail.

[0057] Step 4: The visual inspection equipment checks various parameters. The first chamfer 20 has a preset angle range of 35° to 40°, the second chamfer 30 has a curvature of 0.8mm to 3.0mm, and the texture groove 31 has a groove depth of 0.05mm to 0.2mm. The processed PCB is then checked for quality. For qualified PCBs, a flexible brush polishing process using 0.06mm nylon bristles at a speed of 450r / min and a conveyor speed of 0.25m / min is performed. The resulting surface roughness Ra is 3.0μm, which meets the requirements.

[0058] It should be noted that, to improve accuracy, a comparative test was conducted. Existing technology was used to process a 5mm PCB board 10, performing only a single 45° chamfering treatment, without pre-treatment cleaning, step corner 21 processing, texture groove 31 processing, or fine cleaning. This PCB board 10 and the PCB board 10 processed in Example 1 were simultaneously subjected to 100 simulated transport process tests. The test results showed that the PCB board 10 processed by the existing technology experienced 18 jamming incidents, a jamming rate of 18%, and 12 PCB boards 10 had burrs or damage on their edges; the PCB board 10 processed in Example 1 did not experience any jamming incidents, a jamming rate of 0%, and only one PCB board 10 had minor dust on its surface (which could be removed with simple wiping), with a product qualification rate of 99%. Through the above settings, it can be demonstrated that the processing method of the present invention can significantly reduce the jamming rate of the PCB board 10, and improve the product qualification rate and production efficiency.

[0059] It should be noted that the specific model of the five-axis CNC cutting equipment can be selected according to the processing requirements. The specifications of the milling cutter and grinding head can be adjusted according to the material and processing accuracy of the PCB board 10. The parameters of the cleaning, baking, and testing equipment can also be optimized according to the actual production situation. The first chamfer 21 and the second chamfer 30 are processed only on one end of the PCB board 10, and the other end of the PCB board 10 is not processed.

[0060] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0061] The present invention has been described above with reference to the accompanying drawings. Obviously, the implementation of the present invention is not limited to the above-described manner. Any improvements made using the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other situations without modification, are all within the protection scope of the present invention.

Claims

1. A PCB board for preventing jamming, comprising a PCB material, wherein the PCB material contacts and is driven forward by a roller, characterized in that, The upper corner of the PCB board is provided with a first chamfer, the first chamfer is an inclined plane, and the angle between the plane and the upper surface of the PCB board is 25° to 35°.

2. The PCB board for the anti-jamming plate according to claim 1, characterized in that, The thickness of the PCB board is not less than 4mm.

3. The PCB board for the anti-jamming plate according to claim 1, characterized in that, The lower end corner of the PCB board is provided with a second chamfer, which is an inclined plane or a convex arc surface.

4. The PCB board for the anti-jamming plate according to claim 3, characterized in that, There is a gap between the first chamfer and the second chamfer, so that the PCB board has excess thickness at this end.

5. The PCB board for the anti-jamming plate according to claim 4, characterized in that, The relationship between the excess thickness 'a' and the thickness 'b' of the PCB material is: a = 1 / 4b, and a ≤ 3mm.

6. A method for processing a PCB board material as described in any one of claims 1-6, characterized in that, (1) First, pre-process the PCB board; (2) Inspect the PCB board; (3) Perform chamfering; (4) Quality inspection and further cleaning.

7. The processing method according to claim 7, characterized in that, The PCB pretreatment in step 1 includes: using a spray line to clean the PCB to remove debris from the PCB surface; then using a baking line to dry the PCB; and finally using a dust removal line to remove static electricity from the PCB surface to prevent debris from adhering to the PCB.

8. The processing method according to claim 7, characterized in that, The preprocessing of the PCB board in step 1 also includes: using a vision inspection device to detect the parameters of the first chamfer, the second chamfer, the width of the texture groove, and the depth of the texture groove. When the detected parameters exceed the preset range, unqualified products are automatically rejected.

9. The processing method according to claim 7, characterized in that, The quality inspection and re-cleaning in step 4 includes: using a flexible brush to deburr the first and second chamfer areas of the PCB board, so that the surface roughness Ra of the first and second chamfer areas is ≤3.2μm.

10. The processing method according to claim 7, characterized in that, Step 3, the chamfering process, includes: using a five-axis CNC cutting machine to process the first chamfer and the second chamfer on the upper and lower ends of the PCB board, respectively.

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