Heat dissipation cover, packaging chip, circuit board assembly and electronic equipment

Abstract

The embodiment of the invention discloses a heat dissipation cover, a packaged chip, a circuit board assembly and electronic equipment, relates to the technical field of chip heat dissipation, not only can provide good physical protection for the chip, but also has good heat dissipation effects in packaging, assembling, function testing and subsequent use. The heat dissipation cover is used for being arranged outside the chip in a covering mode. The heat dissipation cover comprises a cover body and a heat dissipation structure, and the cover body is provided with a first wall surface of a part of the liquid cooling medium cavity. And the cover body is used for detachably connecting the cold plate upper cover so as to form a liquid cooling medium cavity. The heat dissipation structure is arranged on the first wall surface. According to the heat dissipation cover provided by the embodiment of the invention, good physical protection can be provided for the chip, and after the heat dissipation structure is additionally arranged, the heat dissipation area is increased, so that the packaged chip has good heat dissipation effects in packaging, assembling, function testing and subsequent use.

Description

Technical Field

[0001] This application relates to the field of chip heat dissipation technology, and in particular to a heat sink, packaged chip, circuit board assembly and electronic device. Background Technology

[0002] As chip power consumption continues to rise, the risk of heat dissipation increases, making chip heat dissipation one of the major bottlenecks restricting chip development. Liquid cooling is one of the known efficient heat dissipation solutions, achieving efficient liquid cooling by shortening the thermal path and bringing the cooling medium closer to the chip's hot spots.

[0003] Single-phase liquid coolers are widely used in lidless or lidded chip packages. The outer side of the lid or the top surface of the chip is connected to the bottom of the single-phase liquid cooler via an interfacial thermally conductive material. While lidless packages eliminate the thermal resistance of the lid and the thermal interface material TIM2 between the lid and the single-phase liquid cooler, resulting in near-junction cooling (which reduces the series connection and physical distance between the heat dissipation path and the heat source for more direct and efficient heat dissipation), they offer less physical protection for the chip. Lidded chip packages, on the other hand, provide stronger physical protection with their heatsinks. However, the longer thermal resistance path and greater number of thermal interfaces contribute to poorer heat dissipation. Summary of the Invention

[0004] This application provides a heat sink, a packaged chip, a circuit board assembly, and an electronic device, which not only provides good physical protection for the chip, but also has good heat dissipation effect in packaging, assembly, functional testing, and subsequent practical applications.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] In a first aspect, embodiments of this application provide a heat sink cover for covering a chip. The heat sink cover includes a cover body and a heat dissipation structure. The cover body has a first wall surface, which forms at least a portion of a liquid cooling medium cavity. Furthermore, the cover body can be detachably connected to a cold plate cover to form a liquid cooling medium cavity. The aforementioned heat dissipation structure is disposed on the first wall surface.

[0007] Compared to existing technologies, the heat sink in this embodiment of the application can be decoupled from the cold plate cover during chip packaging, assembly, or functional testing. The chip relies solely on the heat sink (or in conjunction with the cold plate) for heat dissipation. The heat sink with its heat dissipation structure has a large heat dissipation area and excellent heat dissipation effect. Therefore, the heat sink in this embodiment not only provides good physical protection for the chip but also increases the heat dissipation area, resulting in excellent heat dissipation performance for the packaged chip during packaging, assembly, functional testing, and subsequent practical applications.

[0008] Based on the aforementioned heat dissipation cover, in some embodiments of this application, the heat dissipation structure includes any one or more of the following: multiple spaced heat dissipation columns, multiple spaced heat dissipation fins, a metal wire mesh plate, a metal foam board, and a sintered capillary core plate. These heat dissipation structures are relatively simple in structure and have a large contact surface with the liquid cooling medium, resulting in good heat dissipation performance.

[0009] It is understandable that the heat sink cover needs to be sealed to the cold plate cover to ensure the reliability of the liquid cooling medium cavity's seal. Specifically, the heat sink cover can be sealed to the cold plate cover using a sealing structure, such as a sealing ring or sealant.

[0010] Furthermore, to improve the sealing reliability between the heat sink cover and the cold plate cover, in some embodiments of this application, a sealing boss is provided on the first wall surface, surrounding the outer periphery of the heat dissipation structure. The sealing boss is used to mate with the cold plate cover. Therefore, the heat sink cover is sealed to the cold plate cover via the sealing boss and sealing ring (or sealant), resulting in high sealing reliability.

[0011] In addition to the structure described above, the heat dissipation cover of this application may also include other structures. In some embodiments, the heat dissipation cover further includes a protective enclosure disposed on the first wall surface and surrounding the outer periphery of the heat dissipation structure. Furthermore, the height of the protective enclosure is greater than or equal to the height of the heat dissipation structure. Therefore, the protective enclosure can protect the heat dissipation structure radially and partially axially to prevent mechanical contact or damage to the heat dissipation structure during manufacturing, assembly, and transportation. It can also be used in conjunction with the cold plate cover as a sealing enclosure to improve the sealing reliability between the heat dissipation cover and the cold plate cover.

[0012] Furthermore, in some embodiments of this application, the heat sink cover also includes a support platform disposed on the first wall surface of the cover body. The support platform facilitates thermal bonding between the heat sink cover and the cold plate cover, as well as rapid contact performance testing. Additionally, by designing the height of the support platform, it can limit the assembly with the cold plate cover and control the distance between the cold plate cover and the heat dissipation structure.

[0013] In addition, the heat dissipation cover also includes one or more partitions disposed on the aforementioned first wall surface. If there is one partition, it can divide the liquid cooling medium cavity into two sub-liquid cooling cavities. If there are multiple partitions, they can divide the liquid cooling medium cavity into more than two sub-liquid cooling cavities. Thus, different liquid cooling schemes can be implemented, achieving functions such as sequential flow guidance, zoned flow guidance, and zoned jet flow.

[0014] Secondly, embodiments of this application also include a packaged chip, comprising a chip and a heat sink as described in the above embodiments, the heat sink being disposed over the chip. Since the heat sink in the packaged chip of this application has the same structure as the heat sink described in the above embodiments, and both can solve the same technical problem and achieve the same technical effect, further details are omitted here.

[0015] Thirdly, embodiments of this application also include a circuit board assembly, comprising the circuit board assembly, the packaged chip described in the above embodiments, and a cold plate cover. The packaged chip is disposed on the circuit board. The cold plate cover is detachably connected to the heat dissipation cover of the packaged chip. The cold plate cover has a second wall surface forming at least a portion of a liquid cooling medium cavity, the second wall surface and the first wall surface of the heat dissipation cover forming the liquid cooling medium cavity. Since the packaged chip in the circuit board assembly of this application embodiment has the same structure as the packaged chip described in the above embodiments, both can solve the same technical problems and achieve the same technical effects, further details are omitted here.

[0016] Therefore, in some embodiments, the circuit board assembly further includes a seal that can seal the heat sink and the cold plate cover axially or radially. When the cold plate cover and heat sink are assembled, the axial seal applies pressure to the solder joint between the bare die and the substrate, making it suitable for applications requiring high strength in the solder joint between the bare die and the substrate. The radial seal, however, does not apply pressure to the solder joint between the bare die and the substrate, and is unrestricted in its application to various solder joint configurations.

[0017] Furthermore, in some embodiments of this application, the aforementioned cold plate cover is also provided with a first connecting hole. A second connecting hole is provided on the circuit board at the position corresponding to the first connecting hole. The circuit board assembly also includes fasteners, which are installed in the first and second connecting holes. Thus, the fasteners can connect the cold plate cover to the circuit board, improving the overall connection strength of the circuit board assembly. Specifically, the fasteners can be bolts or screws.

[0018] To achieve liquid diversion, in some embodiments of this application, the heat dissipation cover further includes one or more partitions disposed on the first wall surface of the cover. The one or more partitions can divide the liquid cooling medium cavity into two or more (hereinafter referred to as "multiple") sub-liquid cooling cavities. Furthermore, the cold plate cover is provided with liquid cooling inlet channels and liquid cooling outlet channels. Both liquid cooling inlet channels and liquid cooling outlet channels are two or more (hereinafter referred to as "multiple"). The number of liquid cooling inlet channels, the number of liquid cooling outlet channels, and the number of sub-liquid cooling cavities can be the same or different; this application does not impose any restrictions on this. The outlets of the multiple liquid cooling inlet channels are respectively connected to the multiple sub-liquid cooling cavities. The inlets of the multiple liquid cooling outlet channels are also respectively connected to the multiple sub-liquid cooling cavities. Therefore, the structure of the heat dissipation cover and the cold plate cover allows for liquid cooling of multiple areas of the chip through multiple sub-liquid cooling cavities, enabling sequential diversion, zoned diversion, and zoned jetting functions.

[0019] Fourthly, embodiments of this application also include an electronic device, comprising a housing and the circuit board assembly described in the above embodiments. The circuit board assembly is located within the housing. Since the circuit board assembly in the electronic device of this application has the same structure as the circuit board assembly described in the above embodiments, and both can solve the same technical problems and achieve the same technical effects, further details are omitted here. Attached Figure Description

[0020] To illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0021] Figure 1 This is a three-dimensional structural diagram of an electronic device as a server in an embodiment of this application;

[0022] Figure 2 This is a three-dimensional structural diagram of the circuit board assembly according to an embodiment of this application;

[0023] Figure 3a This is a cross-sectional schematic diagram of the circuit board assembly in the first related technology;

[0024] Figure 3b This is a cross-sectional schematic diagram of the circuit board assembly in the second related technology;

[0025] Figure 4 This is a cross-sectional schematic diagram of the packaged chip according to an embodiment of this application;

[0026] Figure 5 This is a schematic diagram of the exploded cross-section of the packaged chip according to an embodiment of this application;

[0027] Figure 6 This is a cross-sectional schematic diagram of the packaged chip and the cold plate cover assembled according to an embodiment of this application;

[0028] Figure 7 This is a cross-sectional schematic diagram of the circuit board assembly in the third related technology;

[0029] Figure 8 (a), (b), (c), and (d) are schematic diagrams of different distribution patterns of heat dissipation columns on the heat dissipation cover in embodiments of this application.

[0030] Figure 9 (a), (b), (c), and (d) are schematic diagrams of different distribution patterns of heat dissipation fins on the heat dissipation cover in embodiments of this application, respectively.

[0031] Figure 10 This is a cross-sectional schematic diagram of a heat dissipation cover with a metal wire mesh plate according to an embodiment of this application;

[0032] Figure 11a This is a top view of a heat sink cover having a heat dissipation structure including heat dissipation pillars and heat dissipation fins, according to an embodiment of this application.

[0033] Figure 11b This is a top view of a heat dissipation cover having a heat dissipation structure including heat dissipation pillars and a metal wire mesh plate, according to an embodiment of this application.

[0034] Figure 11c This is a cross-sectional schematic diagram of a heat dissipation cover having a heat dissipation structure including heat dissipation pillars and a metal wire mesh plate, according to an embodiment of this application.

[0035] Figure 12a This is a top view of a heat dissipation cover with a protective enclosure, according to an embodiment of this application.

[0036] Figure 12b This is a cross-sectional schematic diagram of a heat dissipation cover with a protective enclosure according to an embodiment of this application.

[0037] Figure 13 This is a cross-sectional schematic diagram of a packaged chip with sealant and an axially sealed connection between the cold plate cover and the heat sink cover, according to an embodiment of this application.

[0038] Figure 14 This is a cross-sectional schematic diagram of a packaged chip with a sealing boss according to an embodiment of this application;

[0039] Figure 15a This is a schematic cross-sectional view of a circuit board assembly with fasteners according to an embodiment of this application;

[0040] Figure 15b This is a cross-sectional schematic diagram of a circuit board assembly with fasteners and sealing bosses according to an embodiment of this application;

[0041] Figure 16a This is a cross-sectional schematic diagram of a circuit board assembly having fasteners and radially sealed by a sealing ring according to an embodiment of this application;

[0042] Figure 16b This is a cross-sectional schematic diagram of a circuit board assembly having fasteners and sealing bosses, and radially sealed by a sealing ring, according to an embodiment of this application.

[0043] Figure 17 (a) and (b) are schematic diagrams from different perspectives of the heat dissipation cover with a support platform according to an embodiment of this application;

[0044] Figure 18 (a), (b), (c), and (d) are schematic diagrams of the structure of a heat dissipation cover or circuit board assembly with multiple sub-liquid cooling cavities according to embodiments of this application.

[0045] Icon labels:

[0046] 1000 - Electronic device; 100 - Housing; 200 - Circuit board assembly; 10 - Circuit board; 101 - Second connection hole; 20 - Electronic component; 201 - Chip; 202 - Network interface card; 1S - Packaged chip; 11 - Substrate; 12 - Bare chip; 13 - Heat sink; 131 - Cover; 1310 - First wall surface; 132 - Heat dissipation structure; 1321 - Heat dissipation column; 1322 - Heat dissipation fin; 1323 - Metal wire mesh plate; 1 33-Protective enclosure; 134-Sealing boss; 135-Support platform; 136-Baffle; 137-Liquid cooling inlet channel; 138-Liquid cooling outlet channel; 14-Adhesive; 30-Cold plate cover; 301-Second wall surface; 302-First connecting hole; 40-Seal; 401-Sealing ring; 402-Sealant; 50-Fastener; LC-Liquid cooling medium cavity; LC1-Sub-liquid cooling cavity; 01-Single-phase liquid cooling plate; 02-Liquid cooling heat dissipation cover. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0048] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0049] Furthermore, in this application, directional terms such as "upper," "lower," "left," "right," "horizontal," and "vertical" are defined relative to the indicated placement of the components in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the placement of the components in the accompanying drawings.

[0050] In this application, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can refer to a mechanical or physical connection. It can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. It can also be understood as the physical contact and electrical conduction of components, or as the form of connection between different components in a circuit structure through physical lines capable of transmitting electrical signals, such as PCB copper foil or wires.

[0051] This application provides an electronic device that may include mobile phones, tablet computers, laptop computers, personal digital assistants (PDAs), cameras, personal computers, laptops, in-vehicle devices, wearable devices, augmented reality (AR) glasses, AR headsets, virtual reality (VR) glasses, VR headsets, servers, routers, switches, and other devices with high heat dissipation requirements. The embodiments of this application do not impose special limitations on the specific form of the aforementioned electronic device. For ease of explanation, the following description uses this electronic device as an example. Figure 1 The example shown is an illustration using the server shown.

[0052] Please refer to Figure 1 , Figure 1 This is a perspective view of a server provided in some embodiments of this application. As can be seen from the above, in this embodiment, the electronic device 1000 is a server. (Refer to...) Figure 1 and Figure 2 Electronic device 1000 may include, for example Figure 1 The diagram shows a housing 100 and a circuit board assembly 200 disposed within the housing 100. The circuit board assembly 200 includes a circuit board 10 and various electronic devices 20 disposed on the circuit board 10. These electronic devices 20 may include various chips 201 such as processors, memory, and storage devices, hard disk drive controllers, expansion slots, and network interface cards 202. The chips can be packaged in die form or with a heatsink; this application does not impose any limitation on this. When the server is operating, the chip 1 generates a significant amount of heat. Therefore, the heat dissipation performance of the chip 201 is one of the important factors in ensuring the normal operation of the server.

[0053] If a single-phase liquid cooling plate is used as a heat sink, its bottom can be connected to the chip via an interfacial thermally conductive material. This allows heat generated by the chip to be transferred to the single-phase liquid cooling plate for dissipation. For lidded packaged chips, such as... Figure 3a As shown, thermal interface material TIM1 needs to be placed between the heat sink 13 and the chip 201, and thermal interface material TIM2 needs to be placed between the heat sink 13 and the single-phase liquid cooling plate 01. Therefore, the thermal resistance path of the chip 201 is relatively long, the number of thermal interfaces is large, and the heat dissipation effect is poor. And for... Figure 3b The liquidless packaged chip 201 shown does not provide adequate physical protection for chip 201.

[0054] Therefore, in order to solve the above problems simultaneously, this application provides an improved heat sink 13 and a cold plate cover that cooperates with the heat sink 13. The heat sink 13 can be used in various packaged chips. (Refer to...) Figure 4 and Figure 5 The packaged chip 1S includes a substrate 11, a bare chip 12, and a heat sink 13. The substrate 11 is electrically connected to the circuit board 10, the bare chip 12 is electrically connected to the side of the substrate 11 away from the circuit board 10, and the heat sink 13 covers the bare chip 12 and is connected to the substrate 11. For example, the heat sink 13 is connected to the substrate 11 by an adhesive 14. Specifically, the adhesive can be epoxy resin (also known as "AD glue"). A thermal interface material TIM1 is also laminated between the inner wall of the heat sink 13 and the outer wall of the bare chip 12.

[0055] Furthermore, the heat dissipation cover 13 can be detachably connected to the aforementioned cold plate cover 30. The heat dissipation cover 13 includes a cover body 131, and the outer wall of the cover body 131 is provided with a first wall surface 1310. For example... Figure 6 As shown, the cold plate cover 30 is provided with a second wall surface 301, which can form a liquid cooling medium cavity LC with the first wall surface 1310. Therefore, the first wall surface 1310 serves as the wall surface of at least a portion of the liquid cooling medium cavity LC, and the second wall surface 301 also serves as the wall surface of at least a portion of the liquid cooling medium cavity LC. The inlet and outlet of the liquid cooling medium cavity LC can be connected to a coolant distribution unit (CDU). Figure 6 The hollow and solid arrows indicate the flow direction of the liquid cooling medium. Thus, the coolant distribution device can distribute the coolant to the liquid cooling medium cavity LC for heat dissipation. Furthermore, the first wall surface 1310 of the heat sink 13 is provided with a heat dissipation structure 132, which can increase the heat dissipation area of ​​the heat sink 13.

[0056] Compared to Figure 7The integrated liquid-cooled heat sink 02 shown in this embodiment allows the packaged chip 1S to be packaged, assembled, or functionally tested without the cold plate cover 30 initially installed on the heat sink 13. The chip relies solely on the heat sink 13 (or in conjunction with a cold head) for heat dissipation. The heat dissipation structure 132 with the heat sink 13 has a large heat dissipation area and excellent heat dissipation effect. Furthermore, the combination of the packaged chip with the heat sink 13 and the cold plate cover 30 in this embodiment not only possesses the advantages of a short thermal resistance path in the combination of a water-cooled plate and a lidded packaged chip, but also the high physical protection of the bare chip in the combination of a water-cooled plate and a lidded packaged chip. Therefore, the heat sink 13 in this embodiment not only provides good physical protection for the chip, but also exhibits excellent heat dissipation performance in packaging, assembly, functional testing, and subsequent practical applications. Furthermore, it is compatible with various high-reliability TIM1 options and solves the challenge of multi-die packaging height difference, making it suitable for multi-chip modules (MCMs). It is also compatible with various cold plate heat exchange structure designs and achieves good heat dissipation performance, thus solving the heat dissipation problem of chips evolving towards high power consumption and miniaturization (i.e., chiplets).

[0057] It should be noted that the heat dissipation structure 132 described above can have various structural forms. For example, as Figure 8 As shown in (a), (b), (c), and (d), the heat dissipation structure 132 includes multiple heat dissipation columns 1321, which are spaced apart on the first wall surface 1310. The multiple heat dissipation columns 1321 have a large contact surface with the liquid cooling medium, resulting in good heat dissipation. The cross-section of the heat dissipation column 1321 (parallel to the XY plane) can be circular or square; this application does not limit this. Furthermore, the distribution of the multiple heat dissipation columns 1321 can be varied, and the shapes and sizes of the multiple heat dissipation columns 1321 can be the same or different; this application does not limit this either. Figure 8 The multiple heat dissipation columns 1321 shown in (b) and (c) are identical in shape and size, but their distribution schemes are different. Figure 8 The multiple heat dissipation columns 1321 shown in (d) have the same shape, but the size, distribution and spacing of the multiple heat dissipation columns 1321 are different.

[0058] For example, such as Figure 9 As shown in (a), (b), (c), and (d), the heat dissipation structure 132 includes multiple heat dissipation fins 1322, which are spaced apart on the first wall surface 1310. The multiple heat dissipation fins 1322 have a larger surface area and a larger contact area with the liquid cooling medium, resulting in faster heat dissipation efficiency. The thickness and length of the multiple heat dissipation fins 1322 can be the same or different; this application does not impose any limitations on this. Figure 9The multiple heat dissipation fins 1322 shown in (b) have the same length, thickness and spacing. Figure 9 The multiple heat dissipation fins 1322 shown in (c) have the same length, but different widths and spacings. Figure 9 The multiple heat dissipation fins 1322 shown in (d) have the same thickness and spacing, but different lengths.

[0059] For example, such as Figure 10 As shown, the heat dissipation structure 132 includes a metal mesh plate 1323, which can be connected to the first wall surface 1310 by means such as welding. The metal mesh plate 1323 can also increase the contact surface with the liquid cooling medium, thereby improving the heat dissipation effect.

[0060] For example, the heat dissipation structure 132 may also include a metal foam board, which can be connected to the first wall surface 1310 by means of welding. Alternatively, the heat dissipation structure 132 may also include a sintered capillary core plate, which can also be connected to the first wall surface 1310 by means of welding. Similarly, both the metal foam board and the sintered capillary core plate can increase the contact area with the liquid cooling medium, thereby improving the heat dissipation efficiency.

[0061] It should be noted that the above example is an implementation of the heat dissipation structure 132 including only one heat dissipation component. The heat dissipation structure 132 in the embodiments of this application may also include any of the following: multiple spaced heat dissipation columns 1321, multiple spaced heat dissipation fins 1322, metal wire mesh plate 1323, metal foam board, and sintered capillary core plate.

[0062] Example, Figure 11a The heat dissipation structure 132 shown includes a plurality of spaced heat dissipation columns 1321 and a plurality of spaced heat dissipation fins 1322. Figure 11b and Figure 11c The heat dissipation structure 132 shown includes a metal wire mesh plate 1323 and a plurality of spaced heat dissipation columns 1321.

[0063] Furthermore, in order to protect the heat dissipation structure 132, in some embodiments of this application, the heat dissipation cover 13 further includes, for example, Figure 12a and Figure 12bThe protective enclosure 133 shown is disposed on the first wall surface 1310 of the cover 131 and surrounds the outer periphery of the heat dissipation structure 132. Furthermore, the height H1 of the protective enclosure 133 can be greater than or equal to the height H2 of the heat dissipation structure 132. Therefore, the protective enclosure 133 can protect the heat dissipation structure 132 radially and partially axially to prevent mechanical contact or damage to the heat dissipation structure 132 during manufacturing, assembly, and transportation. It can also be used in conjunction with the cold plate cover as a sealing enclosure to improve the sealing reliability between the heat dissipation cover 13 and the cold plate cover 30.

[0064] Figure 12a The cross-section (parallel to the XY plane) of the protective enclosure 133 shown is square. It should be noted that the cross-section of the protective enclosure 133 can also be circular or elliptical, and this application does not impose any restrictions on this.

[0065] The above describes the heat dissipation structure 132 in the heat sink 13 and its protective structure. The heat sink 13 and the cold plate cover 30 can be connected via, for example... Figure 6 The sealing element 40 shown provides a sealing connection. The sealing element 40 can be implemented in various ways, such as as a sealing ring or sealant.

[0066] In some embodiments, such as Figure 6 As shown, the sealing ring 401 can be sealed to the cold plate cover 30 along the axial direction of the heat sink 13 (e.g., parallel to the X-axis or Y-axis). When the cold plate cover 30 and the heat sink 13 are assembled, pressure is applied to the welded structure between the bare chip 12 and the substrate 11. Therefore, this sealing connection method is suitable for applications where the welded structure between the bare chip 12 and the substrate 11 requires high strength. The sealing ring 401 can also be replaced with sealant, and this application does not limit this.

[0067] In other embodiments, such as Figure 13 As shown, the sealant 402 can also be sealed to the cold plate cover 30 along the radial direction of the heat sink 13 (e.g., parallel to the Z-axis direction). When the cold plate cover 30 and the heat sink 13 are assembled, no pressure is applied to the welding structure between the bare chip 12 and the substrate 11. Therefore, this sealing connection method is not limited to the welding structure between the bare chip 12 and the substrate 11 and is applicable in various welding structure scenarios. The sealant 402 can also be replaced with a sealing ring, and this application does not limit this.

[0068] Furthermore, in order to improve the sealing effect, in some embodiments of this application, such as Figure 14As shown, a sealing boss 134 is provided on the first wall surface 1310 of the heat dissipation cover 13, and the sealing boss 134 surrounds the outer periphery of the heat dissipation structure 132. The sealing boss 134 can cooperate with the cold plate cover 30. Therefore, the heat dissipation cover 13 and the cold plate cover 30 are sealed together by the sealing boss 134 and the sealing element 40, and the two-layer sealing structure can improve the sealing reliability of the heat dissipation cover 13 and the cold plate cover 30.

[0069] It should be noted that the aforementioned cold plate cover 30 also needs to be fixedly connected to the circuit board 10 to improve the overall structural strength of the circuit board assembly 200. In some embodiments of this application, such as... Figure 15a , 15b As shown in Figures 16a and 16b, the aforementioned cold plate cover 30 also has a first connecting hole 302. A second connecting hole 101 is provided on the circuit board 10 at the position corresponding to the first connecting hole 302. Furthermore, the circuit board assembly 200 also includes a fastener 50, which is installed in the first connecting hole 302 and the second connecting hole 101. Thus, the fastener 50 can connect the cold plate cover 30 to the circuit board 10. Specifically, the fastener 50 can be a bolt or a screw.

[0070] Furthermore, for convenient thermally conductive pressing and rapid contact performance testing, in some embodiments of this application, such as Figure 17 As shown in (a) and (b), the heat dissipation cover 13 also includes a support platform 135, which is disposed on the first wall surface 1310 of the cover body 131. The support platform 135 facilitates thermal bonding between the heat dissipation cover 13 and the cold plate cover 30, as well as rapid contact performance testing. It can also be designed with a height to limit the assembly of the heat dissipation cover 13 and the cold plate cover 30, and control the distance between the cold plate cover 30 and the heat dissipation structure 132.

[0071] Considering that different areas on some chips generate different amounts of heat, in some other examples of this application, such as Figure 18 As shown in (a), (b), (c), and (d), the aforementioned heat sink 13 also includes a partition 136, which can be disposed on the first wall surface 1310. Furthermore, the partition 136 can be located within the heat dissipation structure 132 (i.e., within the distribution area of ​​the multiple heat dissipation fins 1322). When the cold plate cover 30 is connected to the heat sink 13, the partition 136 can divide the liquid cooling medium cavity LC enclosed by the cold plate cover 30 and the heat sink 13 into two or more sub-liquid cooling cavities LC1. The number of partitions 136 on the heat sink 13 can be one or more, depending on actual needs. Therefore, if the heat sink 13 has one partition 136, the liquid cooling medium cavity LC can be divided into two sub-liquid cooling cavities LC1 by the partition 136. If the heat sink 13 has two or more partitions 136, the liquid cooling medium cavity LC can be divided into two or more sub-liquid cooling cavities LC1 by the partition 136.

[0072] Furthermore, correspondingly, the cold plate cover 30 is provided with a liquid cooling inlet channel 137 and a liquid cooling outlet channel 138. The outlet of the liquid cooling inlet channel 137 and the inlet of the liquid cooling outlet channel 138 are connected to the sub-liquid cooling cavity LC1. The number of liquid cooling inlet channels 137 can be two or more, and the number of liquid cooling outlet channels 138 can also be two or more. Moreover, the number of liquid cooling inlet channels 137 and the number of liquid cooling outlet channels 138 can be the same, and the same as the number of sub-liquid cooling cavities LC1 separated by the partition 136; the number of liquid cooling inlet channels 137 and the number of liquid cooling outlet channels 138 can also be different. Thus, different liquid cooling schemes can be implemented, achieving sequential flow guidance, zoned flow guidance, and zoned jet flow, etc.

[0073] For example, Figure 18 As shown in (b), (c), and (d), there is one partition 136, and two liquid-cooled inlet channels 137 and two liquid-cooled outlet channels 138. The partition 136 divides the liquid-cooled medium cavity LC into two sub-liquid-cooled cavities LC1. The outlets of the two liquid-cooled inlet channels 137 are connected to the two sub-liquid-cooled cavities LC1, respectively. The two liquid-cooled outlet channels 138 are also connected to the two sub-liquid-cooled cavities LC1, respectively. Furthermore, Figure 18 In (b), (c), and (d), the hollow and solid arrows also indicate the flow direction of the liquid cooling medium. Figure 18 Figure (b) shows a liquid cooling scheme with fixed-sequence flow. Figure 18 Figure (c) shows a liquid cooling scheme with zoned flow. Figure 18 The liquid cooling scheme for the partitioned jet is shown in (d).

[0074] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation cap for capping an external chip, characterized by, include: A cover body, the outer wall of which is provided with a first wall surface forming at least a portion of a liquid cooling medium cavity, and is used for detachable connection with a cover on a cold plate to form a liquid cooling medium cavity; A heat dissipation structure is disposed on the first wall surface.

2. The heat dissipation cover according to claim 1, characterized in that, The heat dissipation structure includes any one or more of the following: multiple spaced heat dissipation columns, multiple spaced heat dissipation fins, metal wire mesh, metal foam board, and sintered capillary core board.

3. The heat dissipation cover according to claim 1 or 2, characterized in that, The first wall surface is provided with a sealing boss, which surrounds the outer periphery of the heat dissipation structure and is used to cooperate with the cover of the cold plate.

4. The heat dissipation cover according to any one of claims 1-3, characterized in that, The heat sink also includes: A protective enclosure is provided on the first wall surface and surrounds the outer perimeter of the heat dissipation structure; the height of the protective enclosure is greater than or equal to the height of the heat dissipation structure.

5. The heat dissipation cover according to any one of claims 1-4, characterized in that, The heat sink also includes: A support platform is disposed on the first wall surface of the cover.

6. The heat dissipation cover according to any one of claims 1-5, characterized in that, The heat sink also includes: At least one partition is disposed on the first wall surface and is used to divide the liquid cooling medium cavity into at least two sub-liquid cooling cavities.

7. A packaged chip, characterized in that, include: chip; The heat dissipation cover according to any one of claims 1-6, wherein the heat dissipation cover is disposed on the outside of the chip.

8. A circuit board assembly, characterized in that, include: Circuit board; The packaged chip according to claim 7 is disposed on the circuit board; The cold plate cover is detachably connected to the heat dissipation cover of the packaged chip; the cold plate cover is provided with a second wall surface forming at least part of the liquid cooling medium cavity, the second wall surface and the first wall surface of the heat dissipation cover forming the liquid cooling medium cavity.

9. The circuit board assembly according to claim 8, characterized in that, The circuit board assembly also includes: A sealing element that seals the heat dissipation cover to the cold plate cover in an axial or radial manner.

10. The circuit board assembly according to claim 8 or 9, characterized in that, The cold plate cover is further provided with a first connection hole, and the circuit board is provided with a second connection hole at the position corresponding to the first connection hole; the circuit board assembly further includes: Fasteners are installed in the first connection hole and the second connection hole to connect the cold plate cover to the circuit board.

11. The circuit board assembly according to any one of claims 8-10, characterized in that, The heat sink also includes: At least one partition is disposed on the first wall surface and divides the liquid cooling medium cavity into at least two sub-liquid cooling cavities; The cold plate cover is provided with at least two liquid cooling inlet channels and at least two liquid cooling outlet channels. The outlets of the at least two liquid cooling inlet channels and the inlets of the at least two liquid cooling outlet channels are respectively connected to the at least two sub-liquid cooling cavities.

12. An electronic device, characterized in that, include: shell; The circuit board assembly according to any one of claims 8-11, wherein the circuit board assembly is located within the housing.

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