Automatic tail wire threading method and system and bonding equipment

Abstract

The invention relates to the technical field of lead bonding, in particular to an automatic tail wire threading method and system and bonding equipment. When the reserved length of the tail line is smaller than a first length, generating a first signal; the chopper is driven to move to a first area according to the first signal, an automatic threading device is arranged in the first area, and the automatic threading device applies traction force to the tail line to pull out the tail line from the chopper; when the tail line is pulled to a second tail line length, a second signal is generated, and line pulling is stopped; and driving the chopper to move to a second area according to the second signal, and performing second welding spot bonding in the second area and reserving a tail line again. The traction mechanism is controlled to apply traction force to the lead in the chopper so as to pull out the lead, the second welding spot bonding and the tail wire reserving operation are executed, the execution process does not need manual guarding, the length of the reserved tail wire is accurate and controllable, and the bonding processing efficiency and accuracy are improved.

Description

Technical Field

[0001] This invention relates to the field of wire bonding technology, and in particular to an automatic tail wire threading method, system and bonding equipment. Background Technology

[0002] Wire bonding is the mainstream technology for chip electrical interconnection. It uses a wedge to drive metal wires to connect the first solder joint on the chip pad and the corresponding pin of the lead frame as the second solder joint for bonding, thereby realizing the transmission of electrical signals.

[0003] In complex production processes, due to the inherent flexibility of the chip pads or external substrate materials, or material contamination, abnormalities such as short tail wires or inability to maintain the correct tail wire length can occur during wire bonding. These issues prevent proper soldering, causing the machine to alarm and shut down. Manual threading and tail wire maintenance are then required for the machine to resume production. However, due to cost considerations, one operator typically needs to monitor several machines. When a machine alarms and shuts down, the operator may not be able to immediately detect and address the problem, resulting in downtime. Furthermore, manual threading takes considerable time. All these factors combined lead to excessive downtime, reducing machine efficiency. Additionally, manual tail wire maintenance can result in inconsistent tail wire lengths due to human error, affecting the quality of the solder ball and potentially causing quality issues at the first solder joint. Summary of the Invention

[0004] In a first aspect, embodiments of this application provide an automatic threading method for the tail wire in wire bonding, to address the shortcomings of existing wire bonding processes that require manual intervention when the tail wire length is insufficient.

[0005] The method includes: When the reserved length of the tail wire is less than the first length, a first signal is generated; According to the first signal, the chopping knife is driven to move to the first area, and an automatic threading device is set in the first area. The automatic threading device applies a traction force to the tail line and pulls the tail line out of the chopping knife. When the tail wire is pulled to the second tail wire length, a second signal is generated to stop pulling the wire; According to the second signal, the cutting tool is driven to move to the second region, and the second solder joint bonding is performed in the second region to reserve the tail wire again.

[0006] Because of the above method, when the tail wire length is insufficient due to solder joint detachment or other reasons during the bonding process, an operation to re-reserve the tail wire is initiated. By controlling the traction mechanism to apply traction force to the lead wire in the wedge, the lead wire is pulled out, and the second solder joint bonding and tail wire reservation operation are performed, so that the tail wire reaches the length that can be used for the next bonding process. The process does not require manual supervision, and the reserved tail wire length is precisely controllable, which improves the efficiency and accuracy of the bonding process.

[0007] In one possible implementation, generating the first signal when the reserved length of the tail wire is less than the first length includes: Monitor the reserved length of the tail wire during the bonding process of the cleaving blade in the third region; When the reserved length of the tail wire is less than the first length, a first signal is generated.

[0008] In one possible implementation, monitoring the reserved length of the tail wire during the bonding process of the cleaver in the third region includes: Connect the signal detection terminal, the lead wire, and the third area contact terminal to form an electrical detection circuit; The on / off state of the electrical detection circuit is used to monitor whether the reserved length of the tail wire has reached the first length.

[0009] In one possible implementation, the automatic threading device is located in the first area and includes one or more threading cavities that cooperate with the splitting blade. The threading cavity is connected to a negative pressure pipeline, which pulls out the tail thread through negative pressure when the splitting blade moves and aligns with the threading cavity.

[0010] In one possible implementation, generating a second detection signal and stopping the wire pulling when the tail wire is pulled to the second tail wire length includes: A threading contact end is provided inside the threading cavity; Connect the wire-threading contact end to the electrical detection circuit; When the tail wire is pulled to the second tail wire length, the end of the tail wire contacts the wire threading contact end, and the electrical detection circuit is turned on; When the signal detection terminal detects that the electrical detection circuit is connected, it generates the second detection signal and stops pulling the wire.

[0011] In one possible implementation, the second region is a portion of the third region that is close to the first region.

[0012] In one possible implementation, after the second solder joint bonding is performed in the second region and a tail wire is reserved again, if the reserved length of the tail wire is less than the first length, a first signal is generated, and the tail wire reservation process is repeated a preset number of times. If the tail wire is still not successfully reserved, an alarm signal is output.

[0013] Secondly, embodiments of this application also provide an automatic threading system 10, wherein the automatic threading device is used to execute the automatic threading method for the tail thread in the above embodiments, and the automatic threading system includes: Tail wire detection module 101 generates a first signal when the reserved length of the tail wire is less than the first length; The automatic threading module 102 applies traction force to the tail wire by the automatic threading device to pull the tail wire out of the splitter; when the tail wire is pulled to the second tail wire length, a second signal is generated to stop pulling the wire; The bonding control module 103 drives the cutting tool to move to the first area to perform automatic threading according to the first signal, and drives the cutting tool to move to the second area according to the second signal to perform second solder joint bonding and reserve tail wire again in the second area.

[0014] In this embodiment, the automatic threading module 102 includes a lead wire traction unit 1021 and a tail wire detection unit 1022. The lead wire traction unit 1021 is a negative pressure traction device, and the tail wire detection unit 1022 is connected to the tail wire detection module 101 to form two lead wire detection circuits.

[0015] Thirdly, embodiments of this application also provide a bonding apparatus, the bonding apparatus including the automatic threading device described in the second aspect above. Attached Figure Description

[0016] Figure 1 This is a flowchart illustrating the first embodiment of the present invention; Figure 2 This is a schematic diagram of the specific process of step S1 in the second embodiment; Figure 3 This is a schematic diagram of the specific process of step S11 in the third embodiment; Figure 4 This is a schematic diagram of the electrical detection circuit under normal conditions; Figure 5 This is a schematic diagram of the electrical detection circuit when the tail wire length is insufficient. Figure 6 This is a schematic diagram of the automatic threading device according to the fourth embodiment; Figure 7 This is a schematic diagram of the electrical circuit connection of the automatic threading device in the fourth embodiment; Figure 8 This is a schematic diagram of the specific process of step S3 in the fifth embodiment; Figure 9 This is a schematic diagram of the structure when the cleaver moves to the automatic threading device in the fifth embodiment; Figure 10 This is a schematic diagram of the automatic threading device structure after the automatic threading of the tail wire is completed in the fifth embodiment; Figure 11 This is a schematic diagram of the module structure of the sixth embodiment. Detailed Implementation

[0017] The following detailed description, in conjunction with specific embodiments and accompanying drawings, clarifies that the described embodiments are only a portion, not all, of the embodiments. All other embodiments obtained by those skilled in the art based on the following embodiments without inventive effort are also within the scope of protection of this invention.

[0018] It should be understood that if the controllers or control circuits involved in the embodiments are conventional control technologies or units for those skilled in the art, such as the control circuits of the controllers, they can be implemented by those skilled in the art using existing technologies.

[0019] The disclosure of the embodiments provides many different implementations or examples for different ways of implementing the invention. To simplify the disclosure of the invention, specific examples of components and arrangements are described in the embodiments. Of course, these are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples in the embodiments; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0020] This is to facilitate understanding of the problems to be solved and the background and principles of the technical solutions implemented in the embodiments of this application.

[0021] In the wire bonding process, the wire is bonded to the first solder joint on the chip pad by a wedge, and then a second solder joint is bonded at the pin on the wire frame to achieve the wire connection. When the bonding equipment is working, the metal wire is first inserted into the inner diameter hole of the wedge and extends out from the inner chamfered opening of the wedge head. A certain length of wire needs to extend out; this extended section is commonly referred to as the tail wire in the industry. After the appropriate tail wire length is determined, the bonding equipment uses an ignition device to discharge electricity to the head of the tail wire. Under high temperature, the head of the metal tail wire melts into a metal ball. Then, under the movement of the bonding drive mechanism, the wedge drives the metal ball down to contact the chip pad surface, where it is ultrasonically bonded. Under the influence of parameters such as pressure, temperature, and time, metal balls are soldered onto the chip surface to form the first solder joint, achieving the first solder joint bonding. Then, the wedge pulls the metal lead along an arc motion, forming an arc shape. The wedge then descends to the external substrate pin, wedge-pressing the metal lead to form the second solder joint. The wedge then rises a certain height to leave a tail wire length at the wedge head, preparing for the arcing of the next wire. Then, the wire clamp closes to hold the lead, and the wedge continues to rise, breaking the metal lead at the weak point of the second solder joint, completing the current soldering. The bonding cycle continues until all chip pads and lead frame pins are bonded together.

[0022] When the lead wire is too short due to various factors, and the bonding equipment detects that the lead wire is insufficient for the next bonding operation, the machine will alarm and stop. Manual intervention is required to re-stretch the lead wire to a length sufficient for the next bonding operation. For example, during the first solder joint bonding, if the lead wire detaches from the metal ball, a portion of the lead wire has already been used to melt into the metal ball. Therefore, the bottom of the lead wire is not at the ignition position, and bonding cannot continue directly. Manual adjustment of the lead wire length is necessary. For example, during the second solder joint bonding process, under normal conditions, the second solder joint is firmly soldered to the lead. At this time, the wedge is raised because the second solder joint fixes the bottom of the lead wire, and the lead wire is held still. The wedge moves upward, leaving a sufficiently long tail wire. Then, the wire clamp clamps the lead wire and rises synchronously with the wedge, pulling the lead wire off at the second solder joint. This ensures that a sufficiently long tail wire is maintained at the wedge for the next first solder joint bonding process. However, if the second solder joint is not firmly soldered, the bottom of the lead wire is not held by the second solder joint. When the wedge is raised, because the bottom of the lead wire is a free end and the lead wire passes through the center hole of the wedge, the lead wire is affected by the friction of the inner hole of the wedge and moves upward with the wedge. In this case, the tail wire is not pulled out of the wedge. When the wire clamp is closed to prepare for ball bonding, it is found that there is no tail wire at the tip of the wedge or the tail wire is too short. The equipment reports an error and the tail wire length needs to be manually adjusted. Since manual adjustment of the tail wire is inefficient and the accuracy cannot be guaranteed, the embodiments of this application provide an automatic tail wire threading method for lead wire bonding that achieves automatic threading when the tail wire length is insufficient.

[0023] As can be seen from the above, reserving a tail wire after the second solder joint bonding is an existing process in the bonding process. It is a preparatory process for transitioning to the first solder joint bonding after the second solder joint bonding is completed. The overall inventive concept of the embodiments of this application is to utilize this tail wire reservation process, combined with automatic threading, to form a method for reserving a tail wire again and leaving the tail wire to a preset length when the tail wire length is insufficient.

[0024] like Figure 1 As shown, the first embodiment of this application provides an automatic threading method for the tail wire of wire bonding, the method comprising: S1. When the reserved length of the tail wire is less than the first length, a first signal is generated; S2. Based on the first signal, drive the chopping knife to move to the first area, set an automatic threading device in the first area, and use the automatic threading device to apply a traction force to the tail line and pull the tail line out of the chopping knife; S3. When the tail wire is pulled to the second tail wire length, a second signal is generated to stop pulling the wire; S4. Based on the second signal, drive the cutting tool to move to the second region, and perform the second solder joint bonding in the second region to reserve the tail wire again.

[0025] In step S1, when the reserved length of the tail wire is less than the first length, a first signal is generated. This first signal can be directly issued by the bonding equipment's own detection program as the start signal of the automatic threading program, or it can be manually triggered to generate the first signal when a fault signal is received from the equipment and identified by a human as being due to insufficient tail wire length.

[0026] Preferably, such as Figure 2 As shown, in the second embodiment, generating the first signal in step S1 when the reserved length of the tail wire is less than the first length includes: S11. Monitor the reserved length of the tail wire during the bonding process of the cleaver in the third region; S12. When the reserved length of the tail wire is less than the first length, a first signal is generated.

[0027] The phrase "the cutter detects the reserved length of the tail wire during the bonding process in the third region" refers to the fact that during the wire bonding process on the lead frame, the third region is the bonding working area, i.e., within the lead frame. Whether the cutter monitors the tail wire length and performs automatic threading in other regions depends on the situation.

[0028] In order to detect the reserved length of the tail wire during the bonding process in the third region of the cleaver, combined with Figures 3-5 As shown, in the third embodiment, the monitoring of the reserved length of the tail wire during the bonding process of the cleaver in the third region includes: S111. Connect the signal detection terminal, the lead wire, and the third area contact terminal to form an electrical detection circuit; S112. Monitor whether the reserved length of the tail wire has reached the first length by the on / off state of the electrical detection circuit.

[0029] like Figure 4 As shown, the signal detection terminal 1 is a current detection terminal. After connecting the signal detection terminal 1, lead wire 2, and third area contact terminal 3 through the signal line 4 to form an electrical detection circuit, under normal conditions, the cutting tool 5 moves the lead wire to the first solder point a for first solder point bonding, then forms a wire arc b and moves to the second solder point c for second solder point bonding. After the second solder point bonding, as the cutting tool 5 rises, the bottom of the tail wire 2a contacts the second solder point c, and the electrical detection circuit is in the on state. Combined with the closing of the wire clamp 6, the cutting tool 5 and the wire clamp 6 rise together, which can pull the bottom of the tail wire 2a away from the second solder point c, while retaining a sufficient length of tail wire for the next bonding process. Figure 5 As shown, after the second solder joint bonding is performed, when the cleaver 5 rises and the tail wire 2a separates from the second solder joint c, the tail wire 2a separates from the contact end 3 of the third region, the electrical detection circuit is disconnected, and when the signal detection end 1 detects that the electrical detection circuit is disconnected, it generates the first signal.

[0030] The third region contact end 3 is a connecting part on the bonding platform, also known as the top plate. It is a platform on the bonding equipment used to support the lead frame. The bonding platform itself is a metal platform that directly contacts and supports the lead frame. When the lead wire contacts the lead frame, a circuit is formed with the third region contact end 3.

[0031] The electrical detection circuit is used in some existing bonding equipment to detect the second solder joint's poor solder joint and lead wire detachment after the second solder joint is bonded. In some bonding equipment that does not have this electrical detection circuit, it is necessary to establish this electrical detection circuit separately in order to implement the automatic wire threading method of the various embodiments of this application.

[0032] Through the above steps S1, it is possible to monitor the situation where the tail wire is too short due to solder joint detachment during the bonding of the first and second solder joints. When the tail wire is too short during the bonding of the first solder joint, the distance between the end of the tail wire and the ignition component is too large, causing ignition failure. The system generates an ignition failure signal, which can be used as the first signal. When the tail wire is bonded, the electrical detection circuit is disconnected after the end of the tail wire detaches from the second solder joint. The electrical detection circuit sends an open circuit signal as the first signal.

[0033] Furthermore, in addition to using the circuit break signal of the electrical detection circuit as the first signal, a length threshold can be combined as the trigger condition for the first signal. During the wire tailing process, the bonding equipment will perform real-time circuit detection through its original welding detection system. When the cutter has not yet reached the tail wire height, the welding detection system signal is broken, the wire clamp will close, and the current welding head height will be recorded. Subtracting the welding head height at the time of bonding the second weld point from the current welding head height will give the current tail wire length. This indicates that the tail wire length left at this time is insufficient. A threshold parameter can be set. When the machine detects that the tail wire length is less than 85% of the normal tail wire length, the machine will start automatic wire threading. After obtaining the first signal, the first embodiment continues to execute step S2, which drives the chopping knife to move to the first area according to the first signal, and sets an automatic threading device in the first area. The automatic threading device applies a traction force to the tail line and pulls the tail line out of the chopping knife.

[0034] Step S2 is mainly used to pull the tail wire to at least a first length, which is the tail wire length required for bonding processing. Since the wedge carries the lead wire to perform the bonding process in the third region when the first signal is generated, in order to pull the tail wire, the wedge must first be moved out of the third region, i.e., the bonding region, which is the area of ​​the lead frame on the bonding platform, and moved to the first region, i.e., the region for automatic wire threading. When the wedge moves to the first region, there are two possibilities for the tail wire: first, the tail wire is exposed at the bottom of the wedge but is not long enough; second, the tail wire is retracted inside the wedge and is not exposed at the bottom of the wedge. For example, when the tail wire detaches from the lead frame during the process of leaving the second solder joint bonded, the tail wire usually falls into the first category, i.e., the tail wire is exposed at the bottom of the wedge, but the length is insufficient. When the first solder joint bonded and debonded, since the next process is to use the wedge to pull the metal lead wire to follow the arc movement and form an arc shape, in order to form the arc well, it is necessary to apply reverse tension to the lead wire. Usually, reverse air pressure is used to pull the lead wire to keep it taut. Once the bottom of the tail wire detaches from the first solder joint, it is easy to retract back into the inner hole of the wedge under the action of tension. At this time, there is no tail wire below the wedge.

[0035] Based on the two states of the tail wire described above, in order to effectively apply traction to the tail wire and pull it out to a length greater than or equal to the first length, the fourth embodiment provides an automatic threading device.

[0036] like Figure 6 and Figure 7 As shown, in the fourth embodiment, the automatic threading device 7 is located in the first region, i.e., the automatic threading execution region, and the automatic threading device includes: Mounting bracket 71 is located in the first area; within the movement range of the cleaver; The threading socket 72 is mounted on the bracket and has a threading cavity for accommodating the splitter. The traction mechanism 73 is connected to the threading cavity and applies a traction force to the lead wire in the splitter inside the threading cavity to pull out the lead wire; The tail wire contact end 74 is located inside the wire-passing cavity. When the tail wire 2a is pulled out to a sufficient length, it contacts the end of the tail wire 2a and generates a second signal.

[0037] In this embodiment, the traction mechanism 73 is a negative pressure traction mechanism, which is an air hole provided on the wire threading seat for connecting a negative pressure pipeline, and the tail wire contact end 74 is a conductor component provided at the bottom of the wire threading seat.

[0038] During operation, the tail wire is pulled out from under the chopper by negative pressure. The tail wire can be pulled out downward regardless of whether there is a tail wire under the chopper, thus achieving the purpose of automatic threading. At the same time, in order to control the pulled-out tail wire 2a to a reasonable length, it is also necessary to implement closed-loop control of the lead wire traction control, that is, to stop the traction control when the lead wire reaches a certain length.

[0039] Therefore, after executing step S2 in the first embodiment, step S3 is entered. When the tail wire is pulled to the second tail wire length, a second signal is generated to stop pulling the wire.

[0040] Step S3 is used to generate a second signal when the tail line is pulled to the second tail line length. This second signal is used to control the traction control of the tail line in step S2.

[0041] Combining the negative pressure traction working mode in one of the above embodiments, and the electrical detection circuit in the preceding process, such as Figure 8 As shown, in the fifth embodiment, generating a second detection signal and stopping the pulling of the wire when the tail wire is pulled to the second tail wire length includes: S31. A threading contact end is provided inside the threading cavity; S32. Connect the wire-threading contact end to the electrical detection circuit; S33. When the tail wire is pulled to the second tail wire length, the end of the tail wire contacts the wire threading contact end, and the electrical detection circuit is turned on; S34. When the signal detection terminal detects that the electrical detection circuit is connected, it generates the second detection signal and stops pulling the wire.

[0042] Because the tail wire detaches from the third area contact end in the original electrical detection circuit during the wire pulling process, the original electrical detection circuit is in a broken circuit state. This embodiment aims to connect the wire pulling contact end to the original electrical detection circuit, such as... Figure 9 As described above, when the chopping knife carrying an insufficient length of tail wire is connected to the threading seat 72, the bottom of the tail wire does not contact the tail wire contact end 74. When the tail wire is subjected to negative pressure traction to reach a certain length, i.e., the second tail wire length, such as... Figure 10 As shown, when the bottom end of the tail wire contacts 74 to the wire-threading contact end, the electrical detection circuit is turned on. At this time, the signal detection end in the electrical detection circuit detects that the electrical detection circuit is turned on and generates the second detection signal, thus stopping the wire pulling.

[0043] When the pulling of the wire is stopped, the equipment control clamp closes, which immediately clamps the lead wire. At this time, the negative pressure traction force no longer causes the tail wire to continue to be pulled.

[0044] Since negative pressure traction draws the lead wire from the inner hole of the wedge, and the flexibility of the lead wire material and the friction between the inner hole wall and the lead wire are variables during the negative pressure traction process, precise length measurement is not possible to a certain extent. Therefore, when the second tail wire length is set to the first tail wire length, the length of the pulled-out tail wire is difficult to control precisely at the first tail wire length, i.e., the standard tail wire length. At this time, the lead wire in the threading cavity may be in a bent state, so the actual length of the second tail wire may be greater than the first tail wire length. Therefore, after step S3 in the first embodiment is executed, step S4 is required to perform a second cutting process on the pulled-out tail wire. That is, according to the second signal, S4 drives the wedge to move to the second region, and performs the second solder point bonding in the second region to reserve the tail wire again. The key to this step is that after the second solder point bonding process in the existing bonding process is completed, there is a process of reserving the tail wire again based on the fixation of the tail wire end by the second solder point, combined with the coordinated work of the wedge and the wire clamp.

[0045] Specifically, in one embodiment, the second region is a portion of the third region. Since the third region is the bonding region, i.e., the area where the lead frame is located, the lead frame typically has an integral border around the pins, in addition to the internal array of chip pads and corresponding pins. This border is also made of metal, and the bonding platform on which the lead frame is placed is also made of metal. It inherently possesses an electrical detection circuit, or in other words, it has convenient conditions for constructing an electrical detection circuit. This bonding platform is often referred to as the top plate of the bonding device. Connected to the bonding platform by wires, it can effectively determine the contact status between the lead and the lead frame when forming a circuit with the electrical detection terminal and the lead. Therefore, in this embodiment, a portion of the third region is used as the second region.

[0046] In one implementation, the second region is a portion of the third region that is close to the first region. The first region is used for automatic threading, and using a portion of the third region that is close to the first region as the second region allows for control of the close-range movement of the cutting blade to quickly switch between bonding, threading, and cutting processes.

[0047] After re-reserving the tail wire in step S4, as long as the end of the tail wire does not detach from the second solder joint again, the length of the re-reserved tail wire can be guaranteed to remain at the length of the first tail wire. In this embodiment, step S4 is also referred to as tangent, and the second region can also be referred to as the tangent region, indicating that the tail wire after automatic pulling out is cut off as a whole by the second solder joint bonding, and the tail wire is re-reserved based on the execution logic of the second solder joint bonding.

[0048] Through the four steps of the first embodiment, the system can monitor when the tail wire length is insufficient, trigger an automatic threading operation for the tail wire, combine this with redundant control of the length of the automatic threading, and finally perform a second solder joint bonding to adjust to the standard tail wire length. Thus, if the tail wire length is insufficient due to solder joint detachment or other reasons during the bonding process, an operation to re-reserve the tail wire is triggered. By controlling the traction mechanism to apply traction force to the lead wire in the wedge, the lead wire is pulled out, and the second solder joint bonding and tail wire reservation operation are performed, so that the tail wire reaches the length that can be used for the next bonding process. The execution process does not require manual supervision, and the reserved tail wire length is precisely controllable, improving the efficiency and accuracy of the bonding process.

[0049] It is important to note that the tangent operation in step S4 cannot usually be performed directly after step S2. That is, if the tail wire length is insufficient, the tangent operation generally cannot be performed directly. This is because performing the second solder joint bonding itself requires a sufficient tail wire length. In the two scenarios mentioned above where the tail wire length is insufficient, one is that the tail wire retracts into the inner hole of the wedge, and the other is that the tail wire length is too short. When the tail wire retracts into the inner hole of the wedge, it means there is no tail wire. In this case, the tail wire cannot be fixed by the second solder joint during the second solder joint bonding process. The tail wire is reserved by the cutting tool. If the tail wire is too short, it may not be long enough to complete the pressing of the second solder joint. Alternatively, although the second solder joint can be bonded, if the tail wire is too short, it will be bent and pressed into the second solder joint, which will cause certain stress on the solder joint and affect the stability of the second solder joint, resulting in secondary desoldering. Therefore, in the first embodiment, after performing step S2, it is necessary to go through step S3 to pull the tail wire to at least greater than or equal to the length of the first tail wire, that is, after reaching the length of the second tail wire, and then proceed to step S4 to perform the second solder joint bonding and reserve the tail wire again.

[0050] In the first embodiment, after the second solder joint bonding is performed in the second region and the tail wire is reserved again, if the reserved length of the tail wire is less than the first length, a first signal is generated, and the tail wire reservation process is repeated a preset number of times. If the tail wire is still not successfully reserved, an alarm signal is output.

[0051] If reserving the tail wire again still fails to reach the length of the first tail wire, the process will be repeated a set number of times. If the process continues and the tail wire still cannot be successfully reserved to the length of the first tail wire, it indicates that there are other problems with the equipment and intervention is needed to check the specific cause of the fault.

[0052] In addition, if the electrical detection circuit still does not detect a circuit continuity signal within the set time, the machine will automatically increase the vacuum negative pressure and continue to detect the circuit continuity signal. This cycle continues until the vacuum negative pressure reaches its maximum and still no circuit continuity signal is detected. At this point, the machine will issue an alarm.

[0053] like Figure 11As shown, the sixth embodiment provides an automatic threading system 10. The automatic threading device is used to execute the automatic threading method for the tail thread in the above embodiments. The automatic threading system includes: Tail wire detection module 101 generates a first signal when the reserved length of the tail wire is less than the first length; The automatic threading module 102 applies traction force to the tail wire by the automatic threading device to pull the tail wire out of the splitter; when the tail wire is pulled to the second tail wire length, a second signal is generated to stop pulling the wire; The bonding control module 103 drives the cutting tool to move to the first area to perform automatic threading according to the first signal, and drives the cutting tool to move to the second area according to the second signal to perform second solder joint bonding and reserve tail wire again in the second area.

[0054] In this embodiment, the automatic threading module 102 includes a lead wire traction unit 1021 and a tail wire detection unit 1022. The lead wire traction unit 1021 is a negative pressure traction device, and the tail wire detection unit 1022 is connected to the tail wire detection module 101 to form two lead wire detection circuits.

[0055] Thirdly, embodiments of this application also provide a bonding apparatus, the bonding apparatus including the automatic threading device described in the second aspect above.

[0056] The above description is merely a preferred embodiment of the present application and does not limit the scope of disclosure of the embodiments of the present application. Any equivalent structural or procedural transformations made using the description and drawings of the embodiments of the present application, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection supported by the embodiments of the present application.

Claims

1. A method of automatically threading a bond wire, characterized by, include: When the reserved length of the tail wire is less than the first length, a first signal is generated; According to the first signal, the chopping knife is driven to move to the first area, and an automatic threading device is set in the first area. The automatic threading device applies a traction force to the tail line and pulls the tail line out of the chopping knife. When the tail wire is pulled to the second tail wire length, a second signal is generated to stop pulling the wire; According to the second signal, the cutting tool is driven to move to the second region, and the second solder joint bonding is performed in the second region to reserve the tail wire again.

2. The wedge tail wire threading method of claim 1, wherein, When the reserved length of the tail wire is less than the first length, generating the first signal includes: Monitor the reserved length of the tail wire during the bonding process of the cleaving blade in the third region; When the reserved length of the tail wire is less than the first length, a first signal is generated.

3. The automatic threading method for the tail wire of the splitting cutter as described in claim 2, characterized in that, The reserved length for monitoring the tail wire during the bonding process of the cleaver in the third region includes: Connect the signal detection terminal, lead wire, and third area contact terminal to form an electrical detection circuit; The on / off state of the electrical detection circuit is used to monitor whether the reserved length of the tail wire has reached the first length.

4. The automatic threading method for the tail wire of a splitting cutter as described in any one of claims 1-3, characterized in that, The automatic threading device is located in the first area and includes one or more threading cavities that cooperate with the splitting blade. The threading cavity is connected to a negative pressure pipeline. When the splitting blade moves and aligns with the threading cavity, the negative pressure pipeline pulls out the tail thread through negative pressure.

5. The automatic threading method for the tail wire of a splitting cutter as described in claim 4, characterized in that, The step of generating a second detection signal and stopping the wire pulling when the tail wire is pulled to the second tail wire length includes: A threading contact end is provided inside the threading cavity; Connect the wire-threading contact end to the electrical detection circuit; When the tail wire is pulled to the second tail wire length, the end of the tail wire contacts the wire threading contact end, and the electrical detection circuit is turned on; When the signal detection terminal detects that the electrical detection circuit is connected, it generates the second detection signal and stops pulling the wire.

6. The automatic threading method for the tail wire of a splitting cutter as described in claim 2 or 3, characterized in that, The second region is a portion of the third region that is close to the first region.

7. The automatic threading method for the tail wire of a splitting cutter as described in claim 1, characterized in that, After the second solder joint bonding is performed in the second region and the tail wire is reserved again, if the reserved length of the tail wire is less than the first length, a first signal is generated, and the tail wire reservation process is repeated a preset number of times. If the tail wire is still not reserved successfully, an alarm signal is output.

8. An automatic threading system for the tail wire of a splitter used to perform the method of any one of claims 1-7, characterized in that, include: The tail wire detection module generates a first signal when the reserved length of the tail wire is less than the first length; The automatic threading module applies traction force to the tail wire by the automatic threading device and pulls the tail wire out of the splitter; when the tail wire is pulled to the second tail wire length, a second signal is generated to stop pulling the wire; The bonding control module drives the cutting tool to move to the first area to perform automatic wire threading according to the first signal, and drives the cutting tool to move to the second area according to the second signal to perform second solder joint bonding and reserve tail wire again in the second area.

9. The automatic threading system for the tail wire of the splitter as described in claim 8, characterized in that, The automatic threading module includes a lead wire pulling unit and a tail wire detection unit. The lead wire pulling unit is a negative pressure pulling device, and the tail wire detection unit is connected to the tail wire detection module to form two electrical detection circuits.

10. A bonding apparatus, characterized in that, Includes any one of the automatic threading systems of claims 8-9.

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