Glass article manufacturing method and glass article

Abstract

The invention provides a method for manufacturing a glass article and a glass article, wherein the energy of flue gas (evaporant) generated during processing by laser irradiation is reduced, so that adhesion to a glass surface is suppressed, debris can be easily removed, and the strength of a supporting glass substrate can be prevented from being reduced. In a method for manufacturing a glass article, laser processing is performed using a pulsed laser (1) under the condition that the output of the laser used in the laser processing is 1 W or less, and the laser processing is performed by irradiating a predetermined laser processing line (L) a plurality of times. In addition, the pulse laser light (1) is femtosecond laser light.

Description

Technical Field

[0001] This invention relates to a method for manufacturing glass articles and to glass articles themselves. Background Technology

[0002] Previously, semiconductors used in electronic devices have required higher performance to handle increasing amounts of information. To achieve this, three-dimensional semiconductor mounting technology has emerged, which involves stacking semiconductor chips on top of each other and connecting them with wiring to create semiconductor packages. Panel-level packages (PLPs) are a known example of semiconductor packages. In PLPs, rectangular support substrates are used to increase the number of semiconductor packages on each support substrate while reducing manufacturing costs.

[0003] In the manufacturing process of semiconductor packages, due to the heat treatment at approximately 200°C, there is a risk of deformation of the sealing material and warping of the substrate due to the difference in thermal expansion coefficients. When warping occurs on the substrate, it is difficult to perform high-density wiring on one side of the substrate, and it is also difficult to accurately form solder bumps.

[0004] In this case, in order to suppress warping caused by the coefficient of thermal expansion of the support substrate and the processing substrate, glass is used as the material of the support substrate (for example, see Patent Document 1).

[0005] Glass substrates are easy to smooth and possess rigidity. Furthermore, by altering their composition, their coefficient of thermal expansion can be easily matched to that of the surrounding substrate. Therefore, when used as a support substrate, a glass substrate can be stably and accurately supported. Additionally, glass substrates readily transmit ultraviolet and infrared light. Therefore, when used as a support substrate, the processed substrate can be easily fixed by providing an adhesive layer such as a UV-curable adhesive. Further, by providing a release layer that absorbs infrared radiation, the processed substrate can be easily separated. Alternatively, by using an adhesive layer such as a UV-curable tape, the processed substrate can be easily fixed and separated.

[0006] In cases where a glass substrate is used as a support substrate, identification marks are sometimes formed on the glass substrate to manage and identify various information about the glass substrate (size, coefficient of thermal expansion, batch, overall thickness deviation, manufacturer's name, seller's name).

[0007] As a method for forming identification marks, for example, there is a known method of irradiating a glass substrate with a laser and using the thermal shock after irradiation to cause cracks (mainly cracks in the thickness direction) to extend on the supporting glass substrate to form an information identification part with identification marks.

[0008] However, in conventional laser-based forming processes, glass components (mainly Si, B, Al, Li, Na, and K) are generated as fumes (evaporators) and solidify on the surface around the heated section (information recognition section), accumulating as debris (foreign matter). In particular, in laser-based forming processes, the fumes adhere to the glass surface at a high energy level, making debris removal difficult. This sometimes makes reading the identification marks difficult. Furthermore, in the semiconductor package manufacturing process, accidental debris detachment can sometimes cause contamination within the process. Additionally, in cases where thermal shock is used to propagate cracks in the supporting glass substrate to form the information recognition section with identification marks, there is a risk of reduced strength of the supporting glass substrate due to accidental crack propagation.

[0009] Existing technical documents

[0010] Patent documents

[0011] Patent Document 1: Japanese Patent Application Publication No. 2019-47106 Summary of the Invention

[0012] The problem that the invention aims to solve

[0013] The present invention was made in view of the present problem, the problem of which is to provide a method for manufacturing glass articles and glass articles that, by reducing the energy of the fumes generated during processing using laser irradiation, can suppress adhesion to the glass surface and facilitate the removal of debris, while also suppressing the reduction in the strength of the supporting glass substrate due to cracks that develop during laser irradiation-based processing.

[0014] Solution for solving the problem

[0015] The problem to be solved by the present invention is as described above, and the solution to solve the problem will be described below.

[0016] In the glass article manufacturing method of embodiment 1 of the present invention, a glass article manufacturing method is to use a pulsed laser for laser processing, wherein the laser used in the laser processing is subjected to the following conditions: the output is less than 1W, and the laser processing is performed by irradiating a predetermined laser processing line multiple times.

[0017] According to this structure, processing is carried out by multiple irradiations at a power close to the lower limit of glass processing, thereby reducing the energy of the fumes generated during processing while processing the glass surface, thus suppressing adhesion to the glass surface and making it easy to remove debris.

[0018] Furthermore, in the glass article manufacturing method of Scheme 2, based on Scheme 1, it is preferable that the pulsed laser is a femtosecond laser.

[0019] Based on this structure, the pulse irradiation time can be shortened, thereby reducing the thermal effects on the glass (such as breakage caused by thermal shock).

[0020] Furthermore, in the glass article manufacturing method of Scheme 3, based on Scheme 1 or 2, it is preferable that the product of the output, the reciprocal of the frequency of the pulsed laser, and the number of irradiations by the pulsed laser onto the predetermined laser processing line is 0.02 or more, and the unit of the frequency of the pulsed laser is kHz.

[0021] Based on this structure, the energy irradiated onto a certain part is controlled within a certain range, thereby reducing the energy of the fumes generated during processing while processing the glass surface, thus inhibiting adhesion to the glass surface and making it easy to remove debris.

[0022] Furthermore, in the glass article manufacturing method of Scheme 4, based on Schemes 1 to 3, it is preferable that the number of times the pulsed laser irradiates the predetermined laser processing line is 2 to 10.

[0023] Based on this structure, laser processing can be performed without setting the number of irradiations to the predetermined laser processing line to be as many as necessary.

[0024] Furthermore, in the glass article manufacturing method of Scheme 5, based on Schemes 1 to 4, it is preferable to repeatedly scan from the starting point to the ending point of the laser processing predetermined line and perform multiple irradiations.

[0025] Based on this structure, efficient processing can be achieved on a predetermined laser processing line.

[0026] Furthermore, in the method for manufacturing glass articles according to Scheme 6, based on Schemes 1 to 5, it is preferable that the glass article contains more than 5% by mass of the combined amount of B2O3 and R2O, where R represents lithium, sodium, and potassium.

[0027] B2O3 and R2O in glass are components that are easily evaporated by laser processing (heating). Therefore, in glass containing a total amount of 5% or more of B2O3 and R2O, the aforementioned problems are easily made apparent, and the effects of schemes 1 to 5 can be enjoyed.

[0028] Furthermore, in the glass article manufacturing method of Scheme 7, based on Schemes 1 to 6, it is preferable that the laser processing is a point-forming process, wherein the point is a recess formed from the surface of the glass article inward.

[0029] Based on this structure, a highly visible identification information section can be obtained.

[0030] Furthermore, in the method for manufacturing glass articles according to embodiment 8, based on embodiments 1 to 7, it is preferable that, in cross-section, the point extends from the surface toward the interior and has a top and a curved portion, and has multiple inflection points between the surface and the top.

[0031] According to this structure, the shape of the point becomes curved when viewed in cross-section, which improves its resistance to thermal shock and external forces and makes it easier to suppress the extension of cracks from the point surface to the supporting glass substrate.

[0032] Furthermore, in the method for manufacturing a glass article according to embodiment 9, based on embodiments 1 to 8, it is preferable that, in cross-section, the angle formed between the surface of the glass article and the periphery of the point is 130° or more.

[0033] According to this structure, the angle formed between the surface of the glass article and the periphery of the point becomes gentler, which improves the resistance to thermal shock and external forces and makes it easier to suppress the extension of cracks from the point surface to the supporting glass substrate.

[0034] Furthermore, in the method for manufacturing a glass article according to embodiment 10, based on embodiments 1 to 9, it is preferable that, in cross-section, the aspect ratio of the depth of the point to its width is 0.20 or more and 0.45 or less.

[0035] Based on this structure, the resistance to thermal shock and external forces is improved, and the propagation of cracks from the point surface to the supporting glass substrate is easily suppressed.

[0036] Furthermore, in the method for manufacturing glass articles according to Scheme 11, based on Schemes 1 to 10, it is preferable that the point has a laser processing mark on the inner surface, and the laser processing mark is formed in a step shape.

[0037] Based on this structure, the resistance to thermal shock and external forces is improved, and the propagation of cracks from the point surface to the supporting glass substrate is easily suppressed.

[0038] Furthermore, in the method for manufacturing glass articles according to Scheme 12, based on Schemes 1 to 11, it is preferable that the arithmetic mean roughness of the inner surface of the point is 0.6 or less.

[0039] Based on this structure, it is easy to avoid cracks extending from the inner surface of the point towards the supporting glass substrate, starting from the unevenness of the inner surface of the point.

[0040] Furthermore, in the method for manufacturing glass articles according to embodiment 13, based on embodiments 1 to 12, it is preferable that no evaporation of the glass article is attached around the point.

[0041] This structure improves the visibility of points.

[0042] Furthermore, in the glass article manufacturing method of Scheme 14, based on Schemes 1 to 13, it is preferable that the method for setting the laser conditions is as follows: after N laser irradiations, it is determined whether there is any evaporated material of the glass article adhering to the surface of the glass article; if there is no evaporated material adhering, irradiation is performed for the N+1th time and the state of laser processing is determined. Here, N is a positive integer.

[0043] According to this structure, after reliably confirming that no vapors are attached to the surface of the glass article, subsequent laser irradiation can be performed, thus suppressing the adhesion of vapors to the glass surface.

[0044] In addition, in the glass article of embodiment 15, the glass article is a type of glass article that forms a point. Preferably, in cross-section, the point is a concave shape formed from the surface of the glass article toward the interior, and has a top and a curved portion extending from the surface toward the interior, and has a plurality of inflection points between the surface and the top.

[0045] Based on this structure, a highly visible identification information section can be obtained, and in cross-section, the shape of the dot becomes curved, which improves the resistance to thermal shock and external forces and easily suppresses the propagation of cracks from the dot surface to the supporting glass substrate.

[0046] Furthermore, in the glass article of embodiment 16, based on embodiment 15, it is preferable that, in cross-section, the angle formed by the surface of the glass article and the periphery of the point is 130° or more.

[0047] According to this structure, the angle formed between the surface of the glass article and the periphery of the point becomes gentler, which improves the resistance to thermal shock and external forces and makes it easier to suppress the extension of cracks from the point surface to the supporting glass substrate.

[0048] Furthermore, in the glass article of embodiment 17, based on embodiment 15 or 16, it is preferable that the aspect ratio of the depth of the point in cross-section to the width is 0.1 or more and 2 or less.

[0049] This structure improves the visibility of the points forming the identification information section and makes it easier to avoid the pitting of points where glass powder or other substances may enter.

[0050] Furthermore, in the glass article of embodiment 18, based on embodiments 15 to 17, it is preferable that the point has a laser processing mark on the inner surface, and the laser processing mark is formed in a stepped shape.

[0051] This structure is obtained by processing with multiple laser irradiations at power close to the lower limit of glass processing, which results in easy suppression of crack propagation from the point surface to the supporting glass substrate.

[0052] Furthermore, in the glass article of embodiment 19, based on embodiments 15 to 18, it is preferable that the arithmetic mean roughness of the inner surface of the point is 0.6 or less.

[0053] This structure makes it easy to prevent cracks from extending from the point surface to the supporting glass substrate, starting from the unevenness of the surface roughness.

[0054] Furthermore, in the glass article of embodiment 20, based on embodiments 15 to 19, it is preferable that no evaporation of the glass article is attached around the point.

[0055] This structure helps avoid reducing the visibility of points.

[0056] Invention Effects

[0057] As a result of the present invention, the following effects are achieved.

[0058] According to the glass article manufacturing method of the present invention, the energy of the fumes generated during laser irradiation processing is reduced, thereby suppressing adhesion to the glass surface, facilitating easy removal of debris, and suppressing the reduction in strength of the supporting glass substrate. Furthermore, according to the present invention, the glass article can suppress adhesion to the glass surface, facilitate easy removal of debris, and suppress the reduction in strength of the supporting glass substrate due to cracks developing during laser irradiation processing. Attached Figure Description

[0059] Figure 1 (a) to (c) are front cross-sectional views showing the glass substrate processing steps performed by a pulsed laser according to an embodiment of the present invention.

[0060] Figure 2 This is a schematic diagram illustrating a femtosecond laser pulse according to an embodiment of the present invention.

[0061] Figure 3 This is a perspective view showing identification information in the glass substrate processing according to one embodiment of the present invention.

[0062] Figure 4 This is a graph showing the relationship between output and frequency according to one embodiment of the present invention.

[0063] Figure 5 (a) is a perspective view showing a glass substrate with annular grooves formed by discontinuously imparting points to an embodiment of the present invention. Figure 5 (b) is a cross-sectional view showing the glass substrate.

[0064] Figure 6This is an enlarged cross-sectional view of a glass substrate with dots provided according to an embodiment of the present invention, and an enlarged cross-sectional view of the dots. Detailed Implementation

[0065] Next, embodiments of the invention will be described. In the accompanying drawings referenced in the embodiments, etc., components having substantially the same function are referred to by the same reference numerals. Furthermore, the drawings referenced in the embodiments, etc., are schematic illustrations.

[0066] Figure 1 This is a cross-sectional schematic diagram illustrating the process of laser processing using a pulsed laser 1 in the manufacturing method of a glass article according to this embodiment. Figure 1 As shown, in this embodiment, the manufactured glass article is a glass substrate G. Furthermore, Figure 2 This is a perspective view of a glass substrate G that has been laser-processed to imprint identification marks (text).

[0067] exist Figure 1 In the manufacturing method of the glass substrate G shown, the glass substrate G is a substrate suitable as a support substrate for a semiconductor package, and is a plate-shaped member with flatness and smoothness. It should be noted that in this embodiment, the glass article is made of the glass substrate G, but it is not limited to this; for example, it may also be a thin glass sheet such as a glass ribbon.

[0068] The glass used for the glass substrate G preferably contains, by mass percent, 50-75% SiO2, 0-10% Al2O3, 0-20% B2O3, 0-5% Li2O, 0-25% Na2O + K2O, and 0-10% MgO + CaO + SrO + BaO. With this glass composition, it is easy to specify the coefficient of thermal expansion within the target range and improve the resistance to devitrification, thus making it easier to manufacture a glass substrate G with a small overall thickness deviation.

[0069] Furthermore, the glass substrate G preferably contains 5% or more of the combined amount of B2O3 and R2O (R represents lithium, sodium, and potassium) by mass%. B2O3 and R2O in glass are components that easily evaporate during laser processing (heating). Therefore, in glass containing 5% or more of the combined amount of B2O3 and R2O, fumes are easily generated during laser processing (heating), thus allowing the benefits of the present invention to be achieved.

[0070] The glass substrate G of the present invention is preferably manufactured by preparing a glass batch by blending and mixing glass raw materials, and then feeding the glass batch into a glass melting furnace, and feeding the resulting molten glass into a plate shape by clarifying and stirring.

[0071] The glass substrate G of the present invention is preferably formed by a down-drawing method, particularly an overflow down-drawing method. The overflow down-drawing method involves allowing molten glass to overflow from both sides of a heat-resistant trough-shaped structure, and simultaneously extending it downwards to form a plate shape while the overflowing molten glass converges at the lower top of the trough-shaped structure. In the overflow down-drawing method, the surface of the glass substrate G should not contact the trough-shaped refractory material and should be formed as a free surface. Therefore, the overall plate thickness deviation can be reduced to less than 2.0 μm, particularly less than 1.0 μm, using minimal grinding. As a result, the manufacturing cost of the glass substrate G can be reduced.

[0072] The glass substrate G thus formed is then subjected to laser processing on its surface. Laser processing is a process that uses laser irradiation to apply heat to the surface of the glass substrate G, melting the surface and creating points T. For example... Figure 2 As shown, the laser used in the laser processing of this embodiment is an oscillating pulsed laser 1. The pulsed laser 1 is a laser composed of pulses P with a predetermined duration of light output, and the pulses P are repeated at a predetermined frequency.

[0073] like Figure 3 As shown, the glass substrate G is preferably fixed, and the identification information C is engraved by moving the pulsed laser 1 along the predetermined laser processing line L and irradiating it intermittently.

[0074] Pulsed laser 1 is preferably as follows: Figure 1 As shown, by irradiating the same area multiple times, a deeper processing can be achieved. For example, as... Figure 1 (a) ~ Figure 1 In the case of (c), when the same area is irradiated, the surface can be cut with the first irradiation, the deeper part can be cut with the second irradiation, and the surface can be finished with the third irradiation.

[0075] It should be noted that the pulsed laser 1 is preferably used to repeatedly scan from the starting point to the ending point of the laser processing predetermined line L to perform multiple irradiations. That is, it is preferable not to perform multiple irradiations intermittently on the same area, but to perform processing again from the starting point of the laser processing predetermined line L after the irradiation from the starting point to the ending point of the laser processing predetermined line L has ended. As a result, the glass substrate G is less likely to retain heat, and the energy of the generated flue gas F can be reduced.

[0076] In this embodiment, a femtosecond laser is preferably used. The femtosecond laser is one with a pulse width Pd of 500 femtoseconds or less, which reduces the generation of thermally affected cracks (fractures caused by thermal shock) and debris D (material that has melted or evaporated due to the laser and adheres to the surface). In other words, by shortening the pulse irradiation time, the thermal impact on the glass substrate G can be suppressed to a lower level.

[0077] Next, using Table 1 and Figure 3 The laser irradiation process for the laser processing predetermined line L in this embodiment and the laser irradiation process in the comparative example will be explained.

[0078] In the laser irradiation process, a pulsed laser 1 is used to impart identification information C by continuously applying points T to the surface of the glass object. For example... Figure 3 As shown, the identification information C is formed by engraving markings, including text, numbers, and / or barcodes, onto the glass surface.

[0079] Furthermore, the output of pulsed laser 1 is below 1W. By suppressing the output in this way, the energy of the fumes F generated during processing is reduced. When the output of pulsed laser 1 exceeds 1W, the energy imparted to the glass substrate G by a single irradiation becomes greater, and the depth of the point T becomes deeper. However, a large amount of high-energy debris D adheres to the surface of the glass substrate G at once. Therefore, the debris D is firmly bonded to the surface of the glass substrate G and is difficult to peel off. To peel off the debris D, removal by cutting, cleaning by ultrasonic waves, and drying are required, increasing the cost of removal.

[0080] By setting the output of the pulsed laser 1 to 1W or less, the adhesion of debris to the surface of the glass substrate G can be suppressed. Furthermore, debris D can be easily removed.

[0081] Furthermore, the number of times the pulsed laser 1 irradiates the predetermined laser processing line L is preferably 4 to 6. With this configuration, efficient processing can be achieved on the predetermined laser processing line L, and the generation of blurring can be suppressed.

[0082] Furthermore, the product of the reciprocal of the frequency of pulsed laser 1, its output, and the number of irradiations is preferably 0.02 or higher. When the number of irradiations increases, the frequency decreases, and the output increases, the product increases. However, the output is preferably 1W or less; therefore, by decreasing the frequency or increasing the number of irradiations, the product can be increased, thus satisfying the specified conditions.

[0083] The output is from Figure 4 The average output is shown enclosed by the diagonal line. The average output is calculated by... Figure 4 The energy of the pulses in the peak output, as shown by the grayed-out portion, is calculated by time averaging the product of the pulse energy and the repetition frequency. When the output is the same but the frequency increases, the energy of the pulses in the peak output weakens. Therefore, the energy of the pulses in the peak output at low frequencies is higher, thus reducing the average output required for processing.

[0084] Furthermore, regarding the relationship between laser output and scanning speed along the predetermined laser processing line L, as the scanning speed increases, the irradiation time for a given area decreases. Consequently, the energy applied to the surface of the glass substrate G decreases, and the interval between each pass increases.

[0085] Therefore, as the frequency increases, the energy of each irradiation pulse decreases, and the number of times a region is irradiated increases. Conversely, as the scanning speed increases, the energy of each irradiation pulse remains constant, but the number of times a region is irradiated decreases.

[0086] The product of the reciprocal of the frequency of the pulsed laser 1, its output, and the number of irradiations is preferably 0.02 or higher, thereby controlling the generation of debris D within an acceptable range. By suppressing the generation of debris D, product quality defects can be prevented. The presence of debris D can cause equipment contamination in subsequent semiconductor package manufacturing processes, posing a risk of defects. Furthermore, since debris D adheres to the vicinity of the identification information C, it can sometimes cause poor reading of the identification information C.

[0087] Thus, by setting the product of the reciprocal of the frequency, the output, and the number of irradiations to 0.02 or higher, it is possible to reliably process the predetermined laser processing line L while suppressing the generation of debris D.

[0088] In addition, such as Figure 5 as well as Figure 6 As shown, point T on the glass substrate G is formed into a recessed shape from the surface of the glass substrate G inward. In cross-section, point T extends from the surface of the glass substrate G inward and has a top t1 and a curved portion t2, and has multiple inflection points between the surface of the glass substrate G and the top t1.

[0089] like Figure 6 As shown, the bending angle at the inflection point where the surface of the glass substrate G is connected to the first curved surface is θ1, the bending angle at the inflection point where the first curved surface is connected to the second curved surface is θ2, the bending angle at the inflection point where the second curved surface is connected to the third curved surface is θ3, the bending angle at the inflection point where the third curved surface is connected to the top t1 is θ4, the bending angle at the inflection point where the fourth curved surface is connected to the fifth curved surface is θ5, the bending angle at the inflection point where the fifth curved surface is connected to the sixth curved surface is θ6, and the bending angle at the inflection point where the sixth curved surface is connected to the glass surface is θ7.

[0090] The bending angles θ1 and θ7 formed at the inflection point where the surface of the glass substrate G is connected to the first curved surface that is the periphery of point T are preferably 130° or more.

[0091] Furthermore, the aspect ratio of the annular groove Tb at point T and the arithmetic mean roughness Ra, which is a parameter of surface roughness, are preferably 0.6 or less. Here, the arithmetic mean roughness Ra is a value obtained by adding the area from the average surface to the convex portion and the area to the concave portion, and then averaging the area of ​​the convex and concave portions after dividing by the reference length. With this configuration, the inner surface of the annular groove Tb at point T is smoothly formed, thereby suppressing the generation of cracks and debris D.

[0092] Furthermore, the aspect ratio 1 of the depth 1 of the annular groove Tb at point T relative to its width 1 is preferably 0.20 or more and 0.45 or less, more preferably 0.20 or more and 0.30 or less. Here, the aspect ratio refers to the ratio of the depth of the top t1 of the annular groove Tb at point T in cross-section to its width.

[0093] Furthermore, the aspect ratio 2 of depth 2 relative to width 2 is preferably 0.20 or more and 0.45 or less, more preferably 0.30 or more and 0.45 or less. When both aspect ratio 1 and aspect ratio 2 become larger than 0.45, the depth to the top t1 becomes relatively large, and the bend t2 becomes steep. Therefore, the generation of cracks (fractures caused by thermal shock) and debris D (materials formed by the adhesion of substances melted or evaporated by laser to the surface) is common.

[0094] The aspect ratio 1 of depth 1 relative to width 1 is preferably 0.20 or more and 0.45 or less, and the aspect ratio 2 of depth 2 relative to width 2 is 0.20 or more and 0.45 or less. Therefore, the depth of the top t1 becomes shallow relative to the width of the annular groove Tb at point T. As a result, an annular groove Tb at point T with a gently curved portion t2 is formed, thus suppressing the generation of cracks (fractures caused by thermal shock).

[0095] In addition, such as Figure 6 As shown in the enlarged view, point T preferably has a laser processing mark Ta on its inner surface. The laser processing mark Ta is formed in a stepped shape. This stepped shape is achieved through multiple irradiations by a pulsed laser. By dividing the pulsed laser irradiation into multiple sessions, the glass substrate G is less likely to retain heat, thus reducing the energy of the generated fumes F. This prevents the fumes F, which are part of the evaporation zone of the glass article, from adhering to the periphery of point T.

[0096] [Example]

[0097] Table 1 shows Examples 1-4 and Comparative Examples 1 and 2 under laser irradiation conditions. In Table 1, "OK" indicates a good result and "NG" indicates a bad result.

[0098] The glass articles used in the embodiments and comparative examples are in the form of substrates and are made of borosilicate glass containing, by weight percent, 65% SiO2, 5% Al2O3, 15% B2O3, 2% Li2O, 5% Na2O, 3% K2O, 3% MgO, and 2% CaO.

[0099] The presence or absence of debris and the degree of blurring, which were evaluated, were confirmed by visual observation at an illumination of 10000 Lx at a position 20 cm away from the surface of the glass substrate G (the processed surface by pulsed laser 1). Furthermore, the ease of removing debris D was assessed for the glass substrate G. It should be noted that blurring refers to an indicator related to the difficulty of reading (visibility) caused by insufficient formation of the identification information C formed by laser processing (heating).

[0100] Table 1

[0101]

[0102] In Examples 1 to 4, pulsed laser 1 is a femtosecond laser with a pulse width Pd of 400 femtoseconds.

[0103] In Examples 1 to 4, the frequency of the pulsed laser 1 is 50 kHz. Furthermore, the output of the pulsed laser 1 is 0.8 W to 1 W. By suppressing the output in this way, the energy of the fumes F generated during processing is reduced, thereby suppressing the adhesion of debris to the surface of the glass substrate G. Additionally, debris D can be easily removed.

[0104] Furthermore, in Examples 1 to 4, the pulsed laser 1 irradiates the predetermined laser processing line L 4 to 6 times. With this configuration, efficient processing can be achieved on the predetermined laser processing line L, and the generation of blurring can be suppressed.

[0105] In Comparative Example 1, the frequency of pulsed laser 1 is 100 kHz. Furthermore, the output of pulsed laser 1 is 1.3 W. Therefore, in Comparative Example 1, the output is higher and the frequency is higher, resulting in greater energy imparted to the glass substrate G through a single irradiation and a deeper point T.

[0106] In addition, in Comparative Example 1, the number of times the pulsed laser 1 irradiates the predetermined laser processing line L is once.

[0107] In Comparative Example 2, the frequency of pulsed laser 1 is 100 kHz. Furthermore, the output of pulsed laser 1 is 1.1 W.

[0108] In addition, in Comparative Example 2, the number of times the pulsed laser 1 irradiates the predetermined laser processing line L is once.

[0109] In Examples 1 to 4, the product of the reciprocal of the frequency, the output, and the number of irradiations is 0.068 to 0.108.

[0110] In Examples 1 to 4, the generation of ambiguity was controlled within an acceptable range.

[0111] In addition, in Examples 1 to 4, the generation of debris D was controlled within the allowable range.

[0112] As described above, the glass article manufacturing method according to this embodiment is a method for manufacturing glass articles using a pulsed laser 1 for laser processing. The laser used in the laser processing is characterized by an output of 1W or less, and the laser processing is performed by repeatedly irradiating a predetermined laser processing line L. With this structure, the energy of the fumes F generated during processing is reduced, thereby suppressing adhesion to the glass surface and making it easy to remove debris D.

[0113] [Examples related to the shape of point T]

[0114] Table 2 shows the angle at the inflection point of the cross-section of the annular groove Tb at point T, which is imparted by laser processing, and the presence or absence of a bend in Examples 5, 6, and Comparative Example 3.

[0115] The glass articles used in the embodiments and comparative examples are in the form of substrates and are made of borosilicate glass containing, by weight percent, 65% SiO2, 5% Al2O3, 15% B2O3, 2% Li2O, 5% Na2O, 3% K2O, 3% MgO, and 2% CaO.

[0116] Table 2

[0117]

[0118] In Examples 5 and 6, the pulsed laser 1 is a femtosecond laser with an output of 0.9W and a pulse width Pd of 400 femtoseconds.

[0119] Point T is set on the glass substrate G, such as Figure 5 as well as Figure 6 As shown, it is formed into a recessed shape from the surface of the glass substrate G inward. Point T, in cross-section, extends from the surface of the glass substrate G inward and has a top t1 and a curved portion t2, and has multiple inflection points between the surface of the glass substrate G and the top t1.

[0120] like Figure 6As shown, the bending angle at the inflection point where the surface of the glass substrate G is connected to the first curved surface is θ1, the bending angle at the inflection point where the first curved surface is connected to the second curved surface is θ2, the bending angle at the inflection point where the second curved surface is connected to the third curved surface is θ3, the bending angle at the inflection point where the third curved surface is connected to the top t1 is θ4, the bending angle at the inflection point where the fourth curved surface is connected to the fifth curved surface is θ5, the bending angle at the inflection point where the fifth curved surface is connected to the sixth curved surface is θ6, and the bending angle at the inflection point where the sixth curved surface is connected to the glass surface is θ7.

[0121] In Examples 5 and 6, as shown in Table 2, the bending angles θ1 and θ7 formed at the inflection point where the surface of the glass substrate G connects to the first curved surface at the peripheral end of point T are 130° or more. On the other hand, in Comparative Example 3, the bending angles θ1 and θ7 formed at the inflection point where the surface of the glass substrate G connects to the first curved surface at the peripheral end of point T are 124° or 119°. When θ1 and θ7 are smaller than 130°, the amount of deformation increases at the portion where the periphery of point T is continuous with the glass surface, leading to more frequent occurrences of cracks (fractures caused by thermal shock) and debris D (materials formed by the melting and evaporation of laser light adhering to the surface). Therefore, it is preferable that the angles θ1 and θ7 are 130° or more.

[0122] [Examples relating to the surface roughness and aspect ratio of the annular groove Tb at point T]

[0123] Furthermore, regarding the aspect ratio of the annular groove Tb of point T imparted by laser processing in this embodiment and the arithmetic mean roughness Ra as a parameter of surface roughness, Examples 7 to 11 and Comparative Examples 4 to 6 are shown in Table 3.

[0124] Table 3

[0125]

[0126] Here, the aspect ratio refers to the ratio of the depth to the width of the top t1 of the annular groove Tb at point T in cross-section. Additionally, the arithmetic mean roughness Ra is obtained by adding the area from the average surface to the convex portion and the area to the concave portion, then dividing by the reference length and averaging the areas of the convex and concave surfaces. It should be noted that the arithmetic mean roughness Ra in... Figure 5 In the case of the annular groove shown in (a), the measurement was performed on the portion indicated by circle M.

[0127] Depth 1 Figure 5As shown in (b), the depth of the minimum portion of the top t1 depth D1 is given, and the width 1 is the length W1 in the width direction of the annular groove Tb at point T of depth D1. Additionally, depth 2 is the depth D2 of the maximum portion of the top t1 depth, and width 2 is the length W2 in the width direction of the annular groove Tb at point T of depth D2. It should be noted that in embodiments 3 and 4, depth 2 was not measured, therefore the aspect ratio 2 was not calculated.

[0128] In Examples 7 to 11, the aspect ratio 1 of depth 1 relative to width 1 is 0.20 or more and 0.45 or less. More preferably, it is 0.20 or more and 0.30 or less. Furthermore, in Examples 7 to 11, the aspect ratio 2 of depth 2 relative to width 2 is 0.20 or more and 0.45 or less. More preferably, it is 0.30 or more and 0.45 or less.

[0129] In Comparative Examples 4 to 6, the aspect ratio of depth 1 to width 1 is greater than 0.45. Furthermore, in Comparative Examples 4 to 6, the aspect ratio of depth 2 to width 2 is greater than 0.55. Therefore, the depth up to the top t1 becomes relatively large, and the bend t2 becomes steep. Consequently, the generation of cracks (fractures caused by thermal shock) and debris D (material formed by the molten and evaporated material due to laser adhering to the surface) is common.

[0130] In addition, in Examples 7 to 11, the arithmetic mean roughness Ra was 0.6 or less.

[0131] Furthermore, in Comparative Examples 4 to 6, the arithmetic mean roughness Ra was greater than 0.6. Due to this configuration, unevenness was generated on the inner surface of point T, and cracks (fractures caused by thermal shock) and debris D (materials that have been melted or evaporated by the laser and adhered to the surface) were frequently observed.

[0132] Industrial applicability

[0133] This invention can be applied to a method for manufacturing glass articles and to glass articles themselves.

[0134] Explanation of reference numerals in the attached figures

[0135] 1. Pulsed laser

[0136] C Identification Information

[0137] D debris

[0138] F Smoke

[0139] G glass substrate

[0140] L Laser processing pre-line

[0141] T point

[0142] t1 top

[0143] t2 Bending section

[0144] Laser processing marks

[0145] Tb annular groove.

Claims

1. A method for manufacturing glass articles, using pulsed laser for laser processing. in, The conditions for the laser used in the laser processing are as follows: The output is below 1W, and laser processing is performed by repeatedly irradiating the predetermined laser processing line.

2. The method for manufacturing glass articles according to claim 1, wherein, The pulsed laser is a femtosecond laser.

3. The method for manufacturing a glass article according to claim 1 or 2, wherein, The product of the output, the reciprocal of the frequency of the pulsed laser, and the number of irradiations of the predetermined laser processing line by the pulsed laser is 0.02 or more. The frequency of the pulsed laser is measured in kHz.

4. The method for manufacturing a glass article according to claim 1 or 2, wherein, The pulsed laser irradiates the predetermined laser processing line 2 to 10 times.

5. The method for manufacturing a glass article according to claim 1 or 2, wherein, The laser is repeatedly scanned from the starting point to the ending point of the predetermined laser processing line and irradiated multiple times.

6. The method for manufacturing a glass article according to claim 1 or 2, wherein, The glass article contains more than 5% by mass of the combined amount of B2O3 and R2O. R represents lithium, sodium, and potassium.

7. The method for manufacturing a glass article according to claim 1 or 2, wherein, The laser processing is a point-forming process, where the point is a recess formed from the surface of the glass article inwards.

8. The method for manufacturing a glass article according to claim 1 or 2, wherein, In cross-section, the point extends from the surface toward the interior, having a top and a bend, and has multiple inflection points between the surface and the top.

9. The method for manufacturing a glass article according to claim 1 or 2, wherein, In cross-section, the angle formed by the surface of the glass article and the periphery of the point is 130° or more.

10. The method for manufacturing a glass article according to claim 1 or 2, wherein, The aspect ratio of the depth to the width of the point in the cross-section is greater than 0.20 and less than 0.

45.

11. The method for manufacturing a glass article according to claim 1 or 2, wherein, The point has laser processing marks on its inner surface, and the laser processing marks are formed in a stepped shape.

12. The method for manufacturing a glass article according to claim 1 or 2, wherein, The arithmetic mean roughness of the inner surface of the point is below 0.

6.

13. The method for manufacturing a glass article according to claim 1 or 2, wherein, No vapors from the glass article adhered to the vicinity of the point.

14. The method for manufacturing a glass article according to claim 1 or 2, wherein, The method for setting the conditions for the laser is as follows: After N laser irradiations, it is determined whether there is any evaporated material adhering to the surface of the glass item. If there is no evaporated material adhering, the irradiation is performed for the N+1th time and the state of laser processing is judged.

15. A glass object that forms dots, The glass article is characterized in that... In cross-section, the point is a concave shape formed from the surface of the glass article toward the interior, and has a top and a curved portion extending from the surface toward the interior, and has multiple inflection points between the surface and the top.

16. The glass article according to claim 15, wherein, In cross-section, the angle formed by the surface of the glass article and the periphery of the point is 130° or more.

17. The glass article according to claim 15 or 16, wherein, The aspect ratio of the depth to the width of the point in the cross-section is greater than 0.1 and less than 2.

18. The glass article according to claim 15 or 16, wherein, The point has laser processing marks on its inner surface, and the laser processing marks are formed in a stepped shape.

19. The glass article according to claim 15 or 16, wherein, The arithmetic mean roughness of the inner surface of the point is below 0.

6.

20. The glass article according to claim 15 or 16, wherein, No vapors from the glass article adhered to the vicinity of the point.

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