Illuminating device for photocuring forming equipment

Abstract

The present application addresses the problem of, in a photocuring molding apparatus (10) comprising a photocuring molding device (31) such as a lithography device (21) or a 3D printing device, a room (40) in which the photocuring molding device (31) is provided, and an illumination device (50) for illuminating the inside of the room (40), making the working environment color of the illumination device (50) better than the working environment color of a yellow (yellow) fluorescent lamp. And compared with the condition of using a fluorescent lamp, the service life is long and the power consumption is small. The lighting device (50) in the photocuring molding apparatus (10) is set to be LED lighting (51) not including a wavelength of 550 nm or less.

Description

Technical Field

[0001] This invention relates to photopolymerization molding equipment, such as photolithography equipment and 3D printing equipment, for photopolymerization molding of photosensitive materials. Background Technology

[0002] In the manufacture of printed wiring boards based on photolithography apparatus, which is a photopolymerization molding equipment, it is necessary to avoid ultraviolet light from acting on photosensitive materials, except when exposed to ultraviolet light. Therefore, such manufacturing is carried out in a room illuminated by a fluorescent lamp that blocks light with wavelengths below 500 nm, which is in the ultraviolet region. However, the room illuminated by such an illumination device becomes a yellow atmosphere, and the brightness is low and dim, which is undesirable as a working environment for the operator (see paragraphs

[0003] ,

[0004] of Patent Document 1).

[0003] Therefore, in Patent Document 1, in order to create a bright atmosphere of white light in the room used in the manufacturing process, the following solution is proposed: the lighting device is configured to include a fluorescent lamp provided with an ultraviolet absorbing film and an ultraviolet cut-off filter that allows light irradiated from the fluorescent lamp to pass through, and the ultraviolet cut-off filter is configured to gradually reduce the transmittance before and after the wavelength of 450 nm and cut off the wavelength below 450 nm (see the claims of Patent Document 1, paragraphs

[0005] ,

[0012] ).

[0004] Furthermore, Patent Document 2 proposes the following solution: a photolithography apparatus that uses a photosensitive material sensitive to ultraviolet light to perform a photolithography process is placed in a cleanroom, the photolithography apparatus being housed inside a housing having an observation window for observing the photolithography apparatus; the observation window is configured to block light of wavelengths that sensitize the photosensitive material (refer to claim 1 of Patent Document 2 regarding the above); the internal lighting device for illuminating the interior of the housing is configured as yellow light illumination based on yellow light (refer to claims 1 and 5 of Patent Document 2); and the lighting device in the cleanroom housing containing the housing is configured to have a white light illumination based on yellow light. The system includes white illumination and a second illumination based on yellow light, which is based on light that blocks the wavelength that would expose the photosensitive material. Furthermore, when the housing is opened, the system is configured to switch between the white illumination and the second illumination in order to extinguish the white illumination and prevent the photosensitive material from being exposed to light (see claims 1, 5, 6, and 8 of Patent Document 2, paragraph

[0016] ). The system integrates both the white illumination and the second illumination (yellow light illumination), and can utilize light sources such as LEDs and LCD lamps (see claims 7 of Patent Document 2, paragraphs

[0034] and

[0036] ).

[0005] In addition, in recent years, materials that are photosensitive in the visible light region without using ultraviolet light have been developed as resist materials. However, the inventors have recently realized that if the lighting device described in Patent Document 1 and Patent Document 2 is used, the following problem exists: the material that is not photosensitive in visible light below 500 nm will be photosensitive in visible light with wavelengths including 500-550 nm.

[0006] [Existing Technical Documents]

[0007] [Patent Literature]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 4-315158

[0009] [Patent Document 2] Japanese Patent Application Publication No. 2008-198888 Summary of the Invention

[0010] [The problem the invention aims to solve]

[0011] In the proposal of the aforementioned Patent Document 1, the fluorescent lamp used as a lighting device is not considered preferred in terms of its shorter lifespan and higher power consumption compared to LED lighting, which has been widely used in recent years.

[0012] Furthermore, in the proposal of the aforementioned Patent Document 2, an illumination device using a light source such as an LED is disclosed that integrates the white illumination and the second illumination [yellow (yellow) light illumination] into one unit. However, in terms of the two illumination devices—an illumination device for illuminating the area within the cleanroom where the photolithography apparatus is installed (i.e., the cleanroom where the housing is also installed) and an internal illumination device for illuminating the interior of the housing, the internal illumination device for illuminating the interior of the housing being a yellow (yellow) light illumination with poor ambient color, and the white illumination based on the white light in the illumination device for illuminating the area causing the photosensitive material to be photosensitive—it cannot be considered preferred.

[0013] The objective of this invention is to solve the problems of short lifespan and high power consumption when using yellow fluorescent lamps for lighting the room in a photopolymerization molding apparatus including a photolithography apparatus, a 3D printing apparatus, a room equipped with the photopolymerization molding apparatus, and a lighting device for illuminating the room. Furthermore, it also addresses the problem that photosensitive materials become photosensitive under visible light with wavelengths of 500-550 nm.

[0014] [Methods used to solve problems]

[0015] To achieve the above objectives, the photocuring molding apparatus of the present invention is characterized in that the lighting device is configured as LED lighting that does not include wavelengths below 550nm.

[0016] [Invention Effects]

[0017] According to the present invention, in the photopolymerization molding equipment of photolithography equipment or 3D printing equipment, the lighting device is LED lighting without wavelengths below 550nm, thus achieving a longer lifespan and lower power consumption compared to the use of fluorescent lamps.

[0018] Furthermore, as described in Patent Document 1, if the wavelength of the illumination device is set to 500 nm or less, the effective photosensitive period of materials (photosensitive liquid resin, photoresist, etc.) that are sensitive to ultraviolet light (refer to paragraph

[0014] for the use of the term "ultraviolet light, etc."), may sometimes be reduced. However, as in this invention, when the wavelength of the illumination device is set to 550 nm or less, the effective photosensitive period under illumination can be significantly extended. Attached Figure Description

[0019] Figure 1 This is a schematic diagram illustrating the photolithography apparatus 20 (photopolymerization molding apparatus 10) of Embodiment 1 of the present invention.

[0020] Figure 2 Examples 1 and 2 of the LED illumination 51 used in the photolithography apparatus 20 of Embodiment 1 of the present invention illustrate the relationship between wavelength and relative spectral radiant intensity [radiant intensity (%) of each wavelength when the maximum spectral radiant intensity is set to 100%] (in the following... Figure 3 The same diagram (as in the middle). Additionally... Figure 2 The comparative examples in the text represent existing examples when using yellow (yellow) light lighting devices.

[0021] Figure 3 Examples 3 and 4 refer to the LED lighting 51 used in the photolithography apparatus 20 of Embodiment 1 of the present invention, and illustrate the relationship with... Figure 2 A diagram showing the same relationships.

[0022] Figure 4 This is a schematic diagram illustrating the 3D printing equipment 30 (photopolymerization molding equipment 10) according to Embodiment 2 of the present invention. Detailed Implementation

[0023] Hereinafter, the photocurable molding apparatus 10 of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following description.

[0024] Additionally, in the following Figures 1 to 4 In Chinese, sometimes the same number is used to label the same parts and the description is omitted.

[0025] In addition, in the accompanying drawings, for ease of explanation, the structure of each part is sometimes appropriately simplified, and the dimensional ratios of each part are different from the actual ones, and are sometimes shown schematically.

[0026] In this specification, the "-" sign indicating a numerical range includes both the lower and upper limits.

[0027] The use of "about" before a numerical value in this specification means within 10% of that value, preferably within 5%, and more preferably within 2%.

[0028] The phrase "excluding wavelengths below 000 nm" or "excluding wavelengths above 000 nm" in this specification means that, in a coordinate graph showing the relationship between wavelength [nm] and relative spectral radiance [%), the "relative spectral radiance at wavelengths below or above 000 nm" is 5% or less, preferably 3% or less, and more preferably 2% or less.

[0029] <Regarding the photopolymerization molding equipment 10 of the present invention>

[0030] The photopolymerization molding apparatus 10 of the present invention includes a photolithography apparatus 20 and a photolithography device 21 as a subordinate concept thereunder, as well as a 3D printing apparatus 30 and a 3D printing device 31 as a subordinate concept thereunder.

[0031] The photopolymerization molding apparatus 10 of the present invention is characterized in that, as its main components, it includes a photolithography apparatus 21 or the 3D printing apparatus 31 (hereinafter, these apparatuses are sometimes collectively referred to as "photopolymerization molding apparatus"), a room 40 (or cleanroom 41) in which the photopolymerization molding apparatus 21 or 31 is installed, and an illumination device 50 for illuminating the room 40, wherein the illumination device 50 is an LED illumination 51 that does not contain wavelengths below 550 nm.

[0032] <Materials that are photosensitive using ultraviolet light, etc.>

[0033] The photosensitive material used in this invention, such as ultraviolet light, is not limited to any material that is photosensitive using ultraviolet light; various known materials can be used. For example, examples include the photoresist (not shown) used in the photolithography equipment 20 and the photosensitive liquid resin 60 used in the 3D printing equipment 30.

[0034] Examples of photoresists include resist inks, solder resist inks, electroplating resist inks, and marking inks. Additionally, photoresists can also be dry films.

[0035] The photoresist used in the photolithography equipment 20 and the photosensitive liquid resin 60 used in the 3D printing equipment 3 are formed into shapes corresponding to the pattern through pattern exposure based on ultraviolet light and subsequent development processes.

[0036] There may be positive resist that disappears due to development in the exposed areas of the pattern, and negative resist that remains in the exposed areas, but neither is limited in this invention.

[0037] <Regarding ultraviolet light used in the exposure of photosensitive materials>

[0038] Examples of ultraviolet light used for exposing photosensitive materials include gamma rays with a wavelength of 436 nm, i-rays with a wavelength of 365 nm, and various excimer lasers with wavelengths below 250 nm (KrF: 248 nm, ArF: 193 nm).

[0039] In addition, in recent years, photoresist materials that are sensitive to visible light without using ultraviolet light have been developed. When using such photosensitive materials, it is possible to expose to visible light with wavelengths ranging from 500 to 550 nm. Photoresists sensitive to visible light have characteristics such as increased light reflectivity.

[0040] In this specification, "ultraviolet light and / or visible light containing wavelengths of 500-550 nm" is sometimes referred to as "ultraviolet light, etc."

[0041] [Implementation Method 1]

[0042] Figure 1 The photolithography apparatus 20 of Embodiment 1 of the present invention is shown schematically.

[0043] As described above, the lithography equipment 20 includes the lithography device 21, a room 40 (or cleanroom 41) where the lithography device 21 is installed, and an illumination device 50 for illuminating the room 40. The illumination device 50 is an LED illumination 51 that does not contain wavelengths below 550nm.

[0044] The photolithography apparatus 21 includes an exposure device 22 that uses ultraviolet light or the like, and a developing device 23. After the photoresist (not shown) used as a photosensitive material that uses ultraviolet light or the like is exposed to the exposure device 22 in a predetermined pattern, it is developed by the developing device 23 to form a shape corresponding to the predetermined pattern.

[0045] The inventors have conducted various studies on the LED lighting 51 used as a lighting device 50.

[0046] While white LED lighting provides good ambient color for the work environment, photosensitivity deteriorates within a short period (30 minutes to several hours) from the time the photosensitive material is dried to the time it is exposed (Standing after drying).

[0047] When using LED lighting with wavelengths cut off below 500nm (yellow light), the ambient color is poor compared to white LED lighting. Furthermore, the time from drying the photosensitive material to exposure (standing after drying) (the retention time of photosensitivity) is less than 4 hours.

[0048] Therefore, the inventors investigated using LED lighting 51 that does not contain LED lighting with wavelengths below 550 nm and has one or more peaks in the wavelength range of 550-700 nm as the lighting device 50.

[0049] As a result, for LED lighting 51 that does not include wavelengths below 550nm (e.g., orange LED lighting, orange-red LED lighting, deep red LED lighting), the time from drying of the photosensitive material using ultraviolet light to exposure (standing after drying) (the time for photosensitivity to be maintained) is more than 12 hours, which is sufficient for operation.

[0050] In addition, LED lighting with one or more peak wavelengths in the wavelength range of 550-700nm was studied 51.

[0051] As a result, even when using LED lighting 51 with multiple peaks in the wavelength range of 550-700nm as the lighting device 50, the time from drying to exposure (standing after drying) of the photoresist (the photosensitivity retention time) can be set to 12 hours or more. Furthermore, by appropriately combining LED lighting 51 with different peaks, the ambient color of the work environment can be improved compared to LED lighting consisting of a single peak.

[0052] The peak wavelength range of the LED lighting 51 as a combination is not limited, but the following wavelength ranges can be cited as examples.

[0053] 575-605nm

[0054] 610-640nm

[0055] 640-670nm

[0056] 580-600nm

[0057] 585-605nm

[0058] 615-635nm

[0059] 645-665nm

[0060] Such a peak wavelength range can be configured as a single LED lighting 51 or composed of multiple LED lighting 51.

[0061] [Examples 1 & 2 of LED lighting 51, and comparative examples]

[0062] Figure 2 This is a graph showing the wavelength (mm) versus relative spectral radiance (%) coordinates for LED illumination 51 used in the photolithography apparatus 30, which is a photopolymerization molding apparatus according to Embodiment 1 of the present invention.

[0063] Examples 1 and 2 above do not include wavelengths below 550nm, and in the coordinate graph above, the peak wavelength is approximately 625nm (Deep Red light: Example 1) or approximately 655nm (Orange Red light: Example 2).

[0064] In contrast, the LED lighting of the comparative example has a peak wavelength of approximately 590 nm in the above coordinate graph, but includes wavelengths below 550 nm, which is the conventional yellow light of LED lighting.

[0065] Since the LED lighting 51 used to illuminate the room 40 (clean room 41) in Examples 1 and 2 does not contain wavelengths below 550nm, it becomes orange-red or deep-red lighting, and the time from drying to exposure (standing after drying) of the photoresist (the photosensitivity retention time) is sufficient, which is more than 12 hours.

[0066] [Examples 3 and 4 of LED lighting 51]

[0067] Figure 3 These are examples 3 and 4 of LED illumination 51 used in a photolithography apparatus 20, which is a photopolymerization molding apparatus according to Embodiment 1 of the present invention, showing a coordinate graph of wavelength (mm) versus relative spectral radiance (%).

[0068] Examples 3 and 4 above do not include wavelengths below 550nm, and in the above coordinate graph, the peak wavelength is about 592nm (amber1 light: example 3) or about 595nm (amber2 light: example 4).

[0069] Examples 3 and 4 do not contain wavelengths below 550nm, and are therefore called amber1 or amber2 illumination, which improves the color environment for workers compared to orange-red or deep-red illumination.

[0070] In addition, the time from drying to exposure (standing after drying) of the photoresist (the time for photosensitivity to be maintained) is more than 12 hours, which is sufficient.

[0071] [Implementation Method 2]

[0072] Figure 4 This is a schematic diagram illustrating the 3D printing apparatus 10 according to Embodiment 2 of the present invention.

[0073] The 3D printing equipment 30, which is the photopolymerization molding equipment 10, includes the 3D printing device 31 (photopolymerization molding device) as a subordinate concept, a room 40 in which the 3D printing device 31 is installed, and a lighting device 50 for illuminating the room 40.

[0074] The 3D printing apparatus 31 includes a curing plate 32, a curing plate suspension drive 33, a photosensitive resin container 35 storing photosensitive liquid resin 60, and an ultraviolet irradiator 37. A transparent window 36 is formed at the bottom of the photosensitive resin container 35, through which ultraviolet light from the ultraviolet irradiator 37 below the photosensitive resin container 35 is irradiated into the photosensitive resin container 35.

[0075] Inside the photosensitive resin container 35, the cured molding plate 32, which is opposite to the transparent window 36, is configured to move up and down or otherwise.

[0076] The photosensitive liquid resin 60 between the cured molding plate 32 and the transparent window 36 is exposed to and cured by ultraviolet light from the ultraviolet irradiator 37, forming a resin layer on the lower surface of the cured molding plate 32.

[0077] Then, the cured molding plate 32 on which the resin portion is formed is raised, and a layer of photosensitive liquid resin 60 penetrates between the resin portion and the transparent window portion 36. It is then exposed and cured using ultraviolet light from the ultraviolet irradiator 37, and a resin portion is added in sequence to manufacture a resin molded article (not shown) on the lower surface of the cured molding plate 32.

[0078] As the lighting device 50 for illuminating the room 40, the same LED lighting 51 as in Examples 1 and 2 of Embodiment 1 above is used, and the same results as in Examples 1 and 2 above are obtained.

[0079] In the above embodiment 2, although it is a photopolymerization molding device of LCD (Liquid Crystal Display) type, it can also be of SLA (Stereo Lithography Apparatus) type or DLP (Digital Light Processing) type.

[0080] In addition, in the 3D printing equipment 30 of the above embodiment 2, the limited liquid surface method is used for exposure from the ultraviolet irradiator 37 below the photosensitive resin container 35, but the free liquid surface method can also be used for exposure from the exposure unit (not shown) using ultraviolet light above the photosensitive liquid resin 60.

[0081] The present invention has been described above with reference to embodiments, but the present invention is not limited to embodiments 1, 2, and examples 1-4. Various modifications that can be understood by those skilled in the art can be made to the structure and details of the present invention within the scope of the present invention.

[0082] This application claims priority based on Japanese Application Special Purpose 2023-164673, filed on September 27, 2023, the entire disclosure of which is incorporated herein by reference.

[0083] [Potential for Industrial Applications]

[0084] In the photopolymerization molding apparatus (10, 20, 30) of the embodiments of the present invention, the lighting device used to illuminate the room 40 where the photopolymerization molding apparatus (photolithography apparatus 21, 3D printing apparatus 31) is provided is an LED lighting 51 that does not contain wavelengths below 550nm. Therefore, compared with the use of fluorescent lamps, it can achieve long life and low power consumption.

[0085] Therefore, the photopolymerization molding equipment of the present invention can be effectively used as a manufacturing equipment for various shapes, such as photolithography devices and photopolymerization molding devices.

[0086] Some or all of the above-described embodiments may also be described as follows, but are not limited to the following.

[0087] (Postscript 1)

[0088] A photopolymerization molding device, comprising: A photocuring molding apparatus for photocuring materials that are sensitive to ultraviolet light and / or visible light with wavelengths of 500-550nm; The room is equipped with the aforementioned photocuring device; and Lighting devices are used to illuminate the room, wherein, The lighting device is LED lighting that does not include wavelengths below 550nm.

[0089] (Postscript 2)

[0090] The photopolymerization molding equipment described in Appendix 1, wherein the photopolymerization molding device is a photolithography device.

[0091] (Note 3)

[0092] As described in Appendix 2, the photopolymerization molding apparatus wherein the photosensitive material, which is sensitive to ultraviolet light and / or visible light with wavelengths of 500-550 nm, is a photoresist.

[0093] (Note 4)

[0094] As described in Appendix 3, the photocurable molding equipment wherein the photoresist is a resist ink, solder resist ink, electroplating resist ink, marking ink, or dry film.

[0095] (Note 5)

[0096] The photopolymerization molding equipment described in Appendix 1 is a 3D printing device.

[0097] (Note 6)

[0098] As described in Appendix 5, the photocurable molding apparatus wherein the photosensitive material, which is sensitive to ultraviolet light and / or visible light with wavelengths of 500-550 nm, is a photosensitive liquid resin.

[0099] (Note 7)

[0100] The photocuring equipment as described in any one of Appendix 1 to 6, wherein the room is a cleanroom.

[0101] (Postscript 8)

[0102] The photocurable molding apparatus as described in any one of Appendices 1 to 7, wherein the peak wavelength of the LED illumination is in any range of 575-605nm, 610-640nm, and 640-670nm.

[0103] (Note 9)

[0104] The photocurable molding apparatus as described in any one of Appendices 1 to 7, wherein the peak wavelength of the LED illumination is in any range of 580-600nm, 615-635nm, and 645-665nm.

[0105] (Postscript 10)

[0106] The photocurable molding apparatus as described in any one of Appendices 1 to 7, wherein the LED lighting comprises two or more peak wavelengths.

[0107] (Postscript 11)

[0108] The photocuring equipment as described in any one of Appendix 1 to 7, wherein the lighting device has multiple LED lights with different peak wavelengths.

[0109] (Postscript 12)

[0110] The photocurable molding apparatus as described in any one of Appendix 1 to 11, wherein the lighting device is installed in the room.

[0111] (Postscript 13)

[0112] An LED lighting for use in a photolithography apparatus, wherein wavelengths below 550 nm are not included.

[0113] (Postscript 14)

[0114] An LED lighting system for use in 3D printing equipment, wherein wavelengths below 550nm are not included.

[0115] (Postscript 15)

[0116] LED lighting as described in Appendix 13 or 14, wherein the LED lighting does not contain wavelengths above 700 nm.

[0117] [Explanation of reference numerals in the attached figures]

[0118] 10. Photopolymerization molding equipment

[0119] 20. Photolithography equipment (photopolymerization molding equipment)

[0120] 21. Photolithography apparatus (photopolymerization molding apparatus)

[0121] 22. Exposure devices using ultraviolet light, etc.

[0122] 23. Developing apparatus

[0123] 30 3D Printing Equipment (Photopolymerization Molding Equipment)

[0124] 31 3D Printing Equipment (Photopolymerization Molding Equipment)

[0125] 32 Cured Molded Board

[0126] 33. Cured Molded Board Suspension Drive Device

[0127] 35 Containers for photosensitive resins

[0128] 36. Transparent window

[0129] 37 Ultraviolet irradiators, etc.

[0130] 40 Rooms equipped with photocuring molding devices

[0131] 41 Cleanroom

[0132] 50. Lighting devices for illuminating rooms equipped with photocuring devices.

[0133] 51LED lighting

[0134] 60. Photosensitive liquid resin (materials that are sensitive to light, such as ultraviolet light)

Claims

1. A photocurable molding apparatus, comprising: A photocuring molding apparatus for photocuring materials that are sensitive to ultraviolet light and / or visible light with wavelengths of 500-550nm; The room is equipped with the aforementioned photocuring molding device; and Lighting devices are used to illuminate the room, wherein, The lighting device is LED lighting that does not include wavelengths below 550nm.

2. The photopolymerization molding equipment according to claim 1, wherein, The photopolymerization molding device is a photolithography device.

3. The photopolymerization molding equipment according to claim 2, wherein, The material that is photosensitive using ultraviolet light and / or visible light with wavelengths of 500-550nm is a photoresist.

4. The photopolymerization molding equipment according to claim 3, wherein, The photoresist is a resist ink, solder resist ink, electroplating resist ink, marking ink, or dry film.

5. The photopolymerization molding equipment according to claim 1, wherein, The photopolymerization molding device is a 3D printing device.

6. The photopolymerization molding equipment according to claim 1, wherein, The room in question is a cleanroom.

7. The photopolymerization molding equipment according to claim 1, wherein, The peak wavelength of the LED lighting is in any of the ranges of 575-605nm, 610-640nm, and 640-670nm.

8. The photopolymerization molding equipment according to claim 1, wherein, The peak wavelength of the LED lighting is in any of the ranges of 580-600nm, 615-635nm, and 645-665nm.

9. The photopolymerization molding equipment according to claim 7 or 8, wherein, The LED lighting includes two or more peak wavelengths.

10. The photopolymerization molding equipment according to claim 1, wherein, The lighting device has multiple LED lights with different peak wavelengths.

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