Electronic component and substrate with built-in electronic component

Abstract

The present invention addresses the problem of providing an electronic component suitable for use in a substrate. This electronic component (10) is provided with a magnetic element body (20) and a metal frame (30) embedded in the magnetic element body (20). The metal frame (30) includes: sections (31, 32) substantially parallel to each other; a section (33) that connects one end of the section (31) and one end of the section (32); a section (34) which is connected to the other end of the section (31) and which is at least partially exposed from the main surface (21) of the magnetic element body (20); and a section (35) that is connected to the other end of the section (32) and that is at least partially exposed from the main surface (22) of the magnetic element body (20).

Description

Technical Field

[0001] This disclosure relates to an electronic component, and more particularly to an electronic component with a coil embedded in a magnetic body. Additionally, this disclosure relates to an electronic component embedded in a substrate in which such an electronic component is built. Background Technology

[0002] Patent document 1 discloses an inductor having a structure in which a conductor formed by bending a metal plate is embedded in the substrate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-151206 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] The inductor disclosed in Patent Document 1 is a surface-mount electronic component.

[0008] In this disclosure, electronic components suitable for use as embedded in a substrate are described.

[0009] Technical means for solving problems

[0010] An electronic component according to one aspect of this disclosure comprises: a magnetic element having a first main surface and a second main surface located on the opposite side of the first main surface; and a first metal frame embedded in the magnetic element, the first metal frame comprising: a first section and a second section opposite to each other and substantially parallel to each other; a third section connecting one end of the first section and one end of the second section; a fourth section connected to the other end of the first section and at least partially exposed from the first main surface; and a fifth section connected to the other end of the second section and at least partially exposed from the second main surface.

[0011] Invention Effects

[0012] According to this disclosure, an electronic component suitable for use embedded in a substrate is provided. Attached Figure Description

[0013] Figure 1 (a) and Figure 1 (b) is a schematic perspective view showing the appearance of the electronic component 10 according to the first embodiment of the technology involved in this disclosure, showing the state viewed from different directions. Additionally, Figure 1 (c) and Figure 1 (d) is a schematic perspective view of electronic component 10, showing the state as viewed from different directions.

[0014] Figure 2 This is a schematic perspective view used to illustrate the construction of the metal frame 30.

[0015] Figure 3 This is a schematic cross-sectional view of the electronic component embedded substrate 100 in which the electronic component 10 is embedded.

[0016] Figure 4 (a) is a schematic perspective view showing the appearance of the electronic component 10A according to the second embodiment of the technology disclosed herein. Additionally, Figure 4 (b) is a schematic perspective top view of electronic component 10A.

[0017] Figure 5 (a) is a schematic perspective view showing the appearance of the electronic component 10B according to the third embodiment of the technology disclosed herein. Additionally, Figure 5 (b) is a schematic perspective top view of electronic component 10B.

[0018] Figure 6 This is a schematic diagram used to illustrate the direction of the magnetic field generated by electronic component 10B.

[0019] Figure 7 (a) is a schematic perspective view showing the appearance of the electronic component 10C according to the fourth embodiment of the technology disclosed herein. Additionally, Figure 7 (b) is a schematic perspective top view of electronic component 10C.

[0020] Figure 8 This is a schematic perspective view illustrating the construction of the metal frame 301 in the first modified example.

[0021] Figure 9 (a) is a schematic perspective view illustrating the construction of the metal frame 302 in the second variation. Figure 9 (b) is a schematic perspective view showing a modified example of the metal frame 302.

[0022] Figure 10 (a) is a schematic perspective view illustrating the construction of the metal frame 303 in the third variation. Figure 10 (b) is a schematic perspective view showing a modified example of the metal frame 303.

[0023] Figure 11 (a) is a schematic perspective view illustrating the construction of the metal frame 304 in the fourth variation. Figure 11 (b) is a schematic perspective view showing a modified example of the metal frame 304.

[0024] Figure 12 (a) is a schematic perspective view illustrating the construction of the metal frame 305 in the fifth variation. Figure 12(b) is a schematic perspective view showing a modified example of the metal frame 305.

[0025] Figure 13 (a) is a schematic perspective view illustrating the construction of the metal frame 306 in the sixth variation. Figure 13 (b) is a schematic perspective view showing a modified example of the metal frame 306.

[0026] Figure 14 (a) is a schematic perspective view illustrating the construction of the metal frame 307 in the seventh variation. Figure 14 (b) is a schematic perspective view showing a modified example of the metal frame 307.

[0027] Figure 15 (a) is a schematic perspective view illustrating the construction of the metal frame 308 in the eighth variation. Figure 15 (b) is a schematic perspective view showing a modified example of the metal frame 308.

[0028] Figure 16 This is a schematic perspective view illustrating the construction of the metal frame 309 in the ninth variation.

[0029] Figure 17 This is a schematic perspective view used to illustrate the construction of the metal frame 310 in the tenth variation.

[0030] Figure 18 This is a schematic perspective view illustrating the construction of the metal frame 311 in the eleventh variation.

[0031] Figure 19 This is a schematic perspective view illustrating the construction of the metal frame 312 in the twelfth variation.

[0032] Figure 20 This is a schematic perspective view illustrating the construction of the metal frame 313 in the thirteenth variation.

[0033] Figure 21 This is a schematic perspective view illustrating the construction of the metal frame 314 in the fourteenth variation.

[0034] Figure 22 This is a schematic perspective view illustrating the construction of the metal frame 315 in the fifteenth variation.

[0035] Figure 23 This is a schematic perspective view used to illustrate the construction of the metal frame 316 in the sixteenth variation. Detailed Implementation

[0036] Hereinafter, with reference to the accompanying drawings, embodiments of the technology involved in this disclosure will be described in detail.

[0037] Figure 1 (a) and Figure 1 (b) is a schematic perspective view showing the appearance of the electronic component 10 according to the first embodiment of the technology involved in this disclosure, showing the state viewed from different directions. Additionally, Figure 1 (c) and Figure 1 (d) is a schematic perspective view of electronic component 10, showing its state as viewed from different directions. Furthermore, in Figure 1 For simplicity, the X-axis, Y-axis, and Z-axis are exemplarily represented in this diagram. Hereinafter, the direction indicated by the arrow will be denoted as + (positive direction), and its opposite direction as - (negative direction) (the same applies to other figures below). In this disclosure, the Z-direction is sometimes referred to as the first direction, the X-direction as the second direction, and the Y-direction as the third direction.

[0038] Figure 1 (a) ~ Figure 1 The electronic component 10 in the example shown in (d) includes a magnetic element 20 and a metal frame 30 in which the magnetic element 20 is embedded. The magnetic element 20 may be made of a composite magnetic material, which is formed by curing a magnetic filler made of a high-permeability material such as ferrite or permalloy with a resin adhesive. The magnetic element 20 has: main surfaces 21 and 22 forming the XY plane and located on opposite sides of each other; side surfaces 23 and 24 forming the YZ plane and located on opposite sides of each other; and side surfaces 25 and 26 forming the XZ plane and located on opposite sides of each other.

[0039] The metal frame 30 is a component made of metal (such as copper (Cu)) and functions as a coil conductor. The metal frame 30 can be manufactured, for example, by stamping a flat metal sheet and then bending it. In this case, the thickness of the metal frame 30 can be approximately constant throughout. Furthermore, the metal frame 30 can be a seamless, integral metal component. Thus, by using the metal frame 30 as the coil conductor, the DC resistance is reduced compared to using a coil conductor made of a plated material. Therefore, the electronic component 10 of this embodiment can preferably also be used as an inductor for a power supply circuit, for example.

[0040] Figure 2 This is a schematic perspective view used to illustrate the construction of the metal frame 30.

[0041] Figure 2The metal frame 30 shown has: plate-shaped sections 31 and 32, both extending in the XY direction (with the Z direction as the thickness direction) and approximately parallel to each other; a plate-shaped section 33 connecting the +X end of section 31 and the +X end of section 32 and extending in the YZ direction (with the X direction as the thickness direction); a section 34 connected to the -X end of section 31; and a section 35 connected to the -X end of section 32. Sections 31 and 32 only need to overlap in the Z direction; they do not need to be strictly parallel. Furthermore, section 33 does not need to be strictly perpendicular to sections 31 and 32; it can have a certain degree of inclination (e.g., ±20° relative to vertical).

[0042] like Figure 1 (c) and Figure 1 As shown in (d), the region in the magnetic element 20 that is clamped from the Z direction by intervals 31 and 32 constitutes the inner diameter region 27 of the coil conductor. The coil conductor, formed by the metal frame 30, has its coil axis in the Y direction and passes through the inner diameter region 27. Interval 31 is located further from the main surface 22 than the inner diameter region 27. The XY plane, which is part of interval 31, is as follows... Figure 1 As illustrated in (a), it can be exposed from the main face 22. Section 32 is located further from the main face 21 than the inner diameter region 27. A portion of the XY plane of section 32, as... Figure 1 As illustrated in (b), it can be exposed from the main surface 21. It is not necessary for a portion of section 31 and a portion of section 32 to be exposed from the magnetic body 20, but by exposing a portion of section 31 and a portion of section 32 from the magnetic body 20, heat generated by the current flowing through the metal frame 30 can be dissipated efficiently, for example. In contrast, section 33 can be entirely embedded in the magnetic body 20. In this case, section 33 is not exposed from the surface of the magnetic body 20. Alternatively, from the viewpoint of improving heat dissipation, at least a portion of section 33 can be exposed from the magnetic body 20. In this case, the size of the electronic component 10 in the X direction is reduced. Furthermore, the metal frame 30 can be configured not to be exposed from the sides 23-26.

[0043] The interval 34 includes: a terminal portion 341 extending in the XY direction (with the Z direction as the thickness direction) and at least partially exposed from the main surface 21; and a connecting portion 342 extending in the YZ direction (with the X direction as the thickness direction) and connecting the terminal portion 341 to the -X end of the interval 31. The connecting portion 342 extends from the interval 31 toward the terminal portion 341 in the -Z direction. Furthermore, the terminal portion 341 extends from the boundary with the connecting portion 342 in the -X direction. That is, the interval 31 and the terminal portion 341 are located on opposite sides of each other in the X direction with reference to the connecting portion 342. The connecting portion 342 does not need to be strictly perpendicular to the terminal portion 341 and the interval 31, and can have a certain degree of inclination. Figure 1 As shown in (b), the XY plane, which is part of the terminal portion 341, is exposed from the main surface 21 of the magnetic body 20. The surface of the terminal portion 341 exposed from the main surface 21 of the magnetic body 20 constitutes a terminal electrode of the coil conductor. The surface of the terminal portion 341 exposed from the main surface 21 of the magnetic body 20 and the surface of the section 32 exposed from the main surface 21 of the magnetic body 20 can form the same plane.

[0044] The interval 35 includes: a terminal portion 351 extending in the XY direction (with the Z direction as the thickness direction) and at least partially exposed from the main surface 22; and a connecting portion 352 extending in the YZ direction (with the X direction as the thickness direction) and connecting the terminal portion 351 to the -X direction end of the interval 32. The connecting portion 352 extends from the interval 32 toward the terminal portion 351 in the +Z direction. Furthermore, the terminal portion 351 extends from the boundary with the connecting portion 352 in the -X direction. That is, the interval 32 and the terminal portion 351 are located on opposite sides of each other in the X direction with reference to the connecting portion 352. The connecting portion 352 does not need to be strictly perpendicular to the terminal portion 351 and the interval 32, and can have a certain degree of inclination. Figure 1 As shown in (a), the XY plane, which is part of the terminal portion 351, is exposed from the main surface 22 of the magnetic body 20. The surface of the terminal portion 351 exposed from the main surface 22 of the magnetic body 20 constitutes another terminal electrode of the coil conductor. The surface of the terminal portion 351 exposed from the main surface 22 of the magnetic body 20 and the surface of the section 31 exposed from the main surface 22 of the magnetic body 20 can form the same plane.

[0045] The terminal portion 341 exposed from the main surface 21 of the magnetic element 20 and the terminal portion 351 exposed from the main surface 22 of the magnetic element 20 are positioned differently in the Y direction. Therefore, in the top view viewed from the Z direction, the terminal portion 341 and the terminal portion 351 do not overlap. The terminal portion 341 and the terminal portion 351 can be positioned identically in the X direction. Alternatively, as another variation, the terminal portion 341 and the terminal portion 351 may partially overlap in the top view viewed from the Z direction. In this case, for example, at least a portion of the terminal portion 341 may extend in the +Y direction, and at least a portion of the terminal portion 351 may extend in the -Y direction.

[0046] The connecting portion 342 of interval 34 and the connecting portion 352 of interval 35 are arranged in the Y direction. The connecting portions 342 and 352 can be configured such that the YZ planes of the connecting portion 342 facing interval 33 and the connecting portion 352 facing interval 33 are arranged in the same plane. Alternatively, the connecting portions 342 and 352 can be configured such that the YZ planes of the connecting portion 342 and the connecting portion 352 facing interval 33 are arranged in the same plane. The inner diameter region 27 of the magnetic element 20 is held from the X direction by interval 33 and connecting portions 342 and 352. That is, the inner diameter region 27 of the magnetic element 20 is surrounded from the X and Z directions by a metal frame 30 with the Y direction as its axis.

[0047] With this structure, the metal frame 30 embedded in the magnetic element 20 forms a coil conductor that wraps approximately one turn. Furthermore, the terminal portion 341 at one end constituting the coil conductor protrudes from one main surface 21 of the magnetic element 20, and the terminal portion 351 at the other end constituting the coil conductor protrudes from the other main surface 22 of the magnetic element 20. Thus, unlike surface-mount electronic components, in the electronic component 10, the coil conductor can be connected from both sides in the Z direction (on the opposing main surfaces 21 and 22 of the magnetic element 20). Therefore, the electronic component 10 can be easily integrated into a substrate for use, for example.

[0048] Because terminal portion 341 bends outward (to the -X direction side) from connecting portion 342, and terminal portion 351 bends outward (to the -X direction side) from connecting portion 352, the distance between terminal portion 341 exposed from main surface 21 and interval 32 is ensured, and the distance between terminal portion 351 exposed from main surface 22 and interval 31 is also ensured. This further improves the short-circuit withstand capability between terminal portion 341 and interval 32, and between terminal portion 351 and interval 31.

[0049] Figure 3 This is a schematic cross-sectional view of the electronic component embedded substrate 100 in which the electronic component 10 of this embodiment is embedded.

[0050] Figure 3 The example electronic component embedded substrate 100 includes: a core layer 110 having a through hole 113; an insulating resin layer 121 disposed on one main surface 111 of the core layer 110; and an insulating resin layer 122 disposed on another main surface 112 of the core layer 110. The core layer 110 is, for example, a high-strength insulating layer in which a resin material is impregnated with a core material such as glass cloth. In contrast, the insulating resin layers 121 and 122 are, for example, insulating layers made of a resin material without a core material such as glass cloth, and have excellent flexibility. Furthermore, in this embodiment, the electronic component 10 is housed within the through hole 113 of the core layer 110 such that the main surface 21 and terminal portion 341 of the magnetic element 20 are covered by the insulating resin layer 121, and the main surface 22 and terminal portion 351 of the magnetic element 20 are covered by the insulating resin layer 122.

[0051] Conductor layers L1 and L2 are formed on the back surface of the insulating resin layer 121. Conductor layer L1 is exposed on one surface of the electronic component embedded substrate 100, and a portion of it is covered by solder resist 131. The portions of the conductor patterns 141 to 144 in conductor layer L1 that are not covered by solder resist 131 constitute external terminals. Furthermore, conductor pattern 141 in conductor layer L1 is connected to the terminal portion 341 of electronic component 10 via a through conductor 151 penetrating the insulating resin layer 121.

[0052] Conductor layer L2 is located between insulating resin layer 121 and core layer 110. Figure 3 In the example shown, conductor layer L2 includes conductor patterns 162 and 164. Conductor pattern 142 located in conductor layer L1 is connected to conductor pattern 162 located in conductor layer L2 via via conductor 152 penetrating insulating resin layer 121. Additionally, conductor pattern 144 located in conductor layer L1 is connected to conductor pattern 164 located in conductor layer L2 via via conductor 154 penetrating insulating resin layer 121.

[0053] Conductor layers L3 and L4 are formed on the back surface of the insulating resin layer 122. Conductor layer L4 is exposed on another surface of the electronic component embedded substrate 100, and a portion of it is covered by solder resist 132. The portions of conductor patterns 171 to 174 located in conductor layer L4 that are not covered by solder resist 132 constitute external terminals. Furthermore, conductor pattern 174 located in conductor layer L4 is connected to the terminal portion 351 of electronic component 10 via a through conductor 184 penetrating the insulating resin layer 122.

[0054] Conductor layer L3 is located between insulating resin layer 122 and core layer 110. Figure 3In the example shown, conductor layer L3 includes conductor patterns 191 and 193. Conductor pattern 171 located in conductor layer L4 is connected to conductor pattern 191 located in conductor layer L3 via via conductor 181 penetrating insulating resin layer 122. Additionally, conductor pattern 173 located in conductor layer L4 is connected to conductor pattern 193 located in conductor layer L3 via via conductor 183 penetrating insulating resin layer 122.

[0055] Furthermore, multiple through-hole conductors, including through-hole conductors TH1 and TH2, can be provided in the core layer 110. These through-hole conductors all penetrate the core layer 110, connecting the conductor pattern located in conductor layer L2 to the conductor pattern located in conductor layer L3. Figure 3 In the example shown, conductor pattern 162 located in conductor layer L2 and conductor pattern 191 located in conductor layer L3 are connected via via conductor TH1. Conductor pattern 164 located in conductor layer L2 and conductor pattern 193 located in conductor layer L3 are connected via via conductor TH2.

[0056] exist Figure 3 In the example shown, insulating resin layer 121 is thicker than insulating resin layer 122. Furthermore, in... Figure 3 In the example shown, the thickness of the electronic component 10 in the Z direction is greater than the thickness of the core layer 110 in the Z direction, and the main surface 21 of the magnetic body 20 of the electronic component 10 protrudes from the main surface 111 of the core layer 110. Conversely, the main surface 22 of the magnetic body 20 of the electronic component 10 can form the same plane as the main surface 112 of the core layer 110. According to this structure, since the film thickness of the insulating resin layer 121 covering the terminal portion 341 is thinner, the processing accuracy of the vias exposed in the terminal portion 341 is improved.

[0057] Figure 4 (a) is a schematic perspective view showing the appearance of the electronic component 10A according to the second embodiment of the technology disclosed herein. Additionally, Figure 4 (b) is a schematic perspective top view of electronic component 10A.

[0058] Figure 4 (a) and Figure 4 The electronic component 10A in the example shown in (b) differs from the electronic component 10 of the first embodiment in that a magnetic core 28 is provided in the inner diameter region 27 surrounded by the metal frame 30. Other basic structures may be the same as those of the electronic component 10 of the first embodiment, and the same reference numerals are used to label the same elements, omitting repeated descriptions.

[0059] The magnetic core 28 is made of a material with a higher permeability than the magnetic body 20. By placing such a magnetic core 28 in the inner diameter region 27, the inductance of the coil conductor formed by the metal frame 30 can be increased. The magnetic core 28 can, for example, be as follows: Figure 4 (a) and Figure 4 As shown in (b), the magnetic core 28 is formed in a size and shape that extends partly from the inner diameter region 27 of the metal frame 30. However, it is not limited to this; for example, the magnetic core 28 may also be formed in a size and shape that is housed inside the inner diameter region 27 of the metal frame 30.

[0060] Figure 5 (a) is a schematic perspective view showing the appearance of the electronic component 10B according to the third embodiment of the technology disclosed herein. Additionally, Figure 5 (b) is a schematic perspective top view of electronic component 10B.

[0061] Figure 5 (a) and Figure 5 The electronic component 10B in the example shown in (b) differs from the electronic component 10 of the first embodiment in that another metal frame 30B is embedded in the magnetic element 20. The other basic structures are the same as those of the electronic component 10 of the first embodiment; therefore, the same reference numerals are used to label the same elements, and repeated descriptions are omitted. Furthermore, the reference numerals for each element constituting the metal frame 30B are marked with a "B" at the end of the reference numerals for the corresponding elements of the metal frame 30.

[0062] exist Figure 5 (a) and Figure 5 In the example shown in (b), the metal frame 30B is formed to have approximately the same shape as the metal frame 30 described above. The metal frame 30 and the metal frame 30B are arranged along the Y direction inside the magnetic body 20. The metal frame 30B is embedded coaxially with the metal frame 30 in a state where the metal frame 30 is rotated 180° about a coil axis extending in the Y direction. Thus, it is possible to embed two coil conductors in one electronic component. Furthermore, it is also possible to embed three or more coil conductors in one electronic component.

[0063] exist Figure 5 (a) and Figure 5 In the example shown in (b), the connecting parts 342 and 352 of the metal frame 30 are roughly aligned with the interval 33B of the metal frame 30B in the X direction, and the interval 33 of the metal frame 30 is roughly aligned with the connecting parts 342B and 352B of the metal frame 30B in the X direction.

[0064] In practical use of the electronic component 10B of this embodiment, if it is designed such that current flows from terminal 351 to terminal 341 for the metal frame 30 and from terminal 341B to terminal 351B for the metal frame 30B, the mutual cancellation between the magnetic field generated by the metal frame 30 and the magnetic field generated by the metal frame 30B can be reduced, thereby improving inductance. That is, as... Figure 6As shown, when current flows from terminal 351 to terminal 341 of the metal frame 30, the current flowing in the connecting portions 342 and 352 is in the -Z direction, and the current flowing in the interval 33 is in the +Z direction. On the other hand, when current flows from terminal 341B to terminal 351B of the metal frame 30B, the current flowing in the connecting portions 342B and 352B is in the -Z direction, and the current flowing in the interval 33B is in the +Z direction. Therefore, the magnetic fields generated by the connecting portions 342 and 352 and the magnetic field generated by the interval 33B are in the same direction in the region indicated by reference numeral B1, and the magnetic field in region B1 can be strengthened. Similarly, the magnetic fields generated by the connecting portions 342B and 352B and the magnetic field generated by the interval 33 are in the same direction in the region indicated by reference numeral B2, and the magnetic field in region B2 can be strengthened.

[0065] Figure 7 (a) is a schematic perspective view showing the appearance of the electronic component 10C according to the fourth embodiment of the technology disclosed herein. Additionally, Figure 7 (b) is a schematic perspective top view of electronic component 10C.

[0066] Figure 7 (a) and Figure 7 The electronic component 10C in the example shown in (b) differs from the electronic component 10B of the third embodiment in that a magnetic core 28 is provided in the inner diameter region 27 surrounded by the metal frame 30 and the inner diameter region 27B surrounded by the metal frame 30B. Other basic structures are the same as those of the electronic component 10B of the third embodiment; therefore, the same reference numerals are used for the same elements, and repeated descriptions are omitted.

[0067] The magnetic core 28 is made of a material with higher permeability than the magnetic body 20, and has a continuous shape that extends through the inner diameter region 27 surrounded by the metal frame 30 and the inner diameter region 27B surrounded by the metal frame 30B. Thus, even when multiple metal frames are embedded in the magnetic body 20, a common magnetic core 28 can be used. This reduces the number of components.

[0068] Figure 8 This is a schematic perspective view illustrating the construction of the metal frame 301 in the first modified example.

[0069] Figure 8 The metal frame 301 shown is Figure 2 The difference in the metal frame 30 shown is that the width of the terminal portions 341 and 351 is increased in the Y direction. Other basic structures are the same as... Figure 2 The metal frame 30 shown is the same, therefore the same reference numerals are used to label the same elements, and repeated descriptions are omitted.

[0070] exist Figure 8 In the example shown, the width of the connecting portions 342 and 352 in the Y direction is W2, while the width of the terminal portions 341 and 351 in the Y direction is W1 (>W2). The widening direction of the terminal portion 341 is the -Y direction, thus preventing interference with the connecting portion 352 due to widening. Similarly, the widening direction of the terminal portion 351 is the +Y direction, thus preventing interference with the connecting portion 342 due to widening. Therefore, by increasing the width of the terminal portions 341 and 351 in the Y direction, the area exposed from the magnetic element 20 increases, thereby improving connection reliability.

[0071] Figure 9 (a) is a schematic perspective view illustrating the construction of the metal frame 302 in the second variation.

[0072] Figure 9 The metal frame 302 shown in (a) and Figure 2 The difference in the metal frame 30 shown is that the terminal portion 341 bends from the connecting portion 342 in the +X direction, and the terminal portion 351 bends from the connecting portion 352 in the +X direction. Other basic structures are the same as... Figure 2 The metal frame 30 shown is the same, therefore the same reference numerals are used to label the same elements, and repeated descriptions are omitted.

[0073] exist Figure 9 In the example shown in (a), terminal portion 341 faces a portion of interval 31 in the Z direction across inner diameter region 27, and terminal portion 351 faces a portion of interval 32 in the Z direction across inner diameter region 27. Thus, by bending terminal portions 341 and 351 inward (towards the +X direction), the size of the metal frame 30 in the X direction can be reduced. Furthermore, as... Figure 9 As shown in (b) the metal frame 302A, the width of the inwardly bent terminal portions 341, 351 in the Y direction can also be increased.

[0074] Figure 10 (a) is a schematic perspective view illustrating the construction of the metal frame 303 in the third variation.

[0075] Figure 10 The metal frame 303 shown in (a) and Figure 2 The difference in the metal frame 30 shown is that the terminal portion 351 bends from the connecting portion 352 in the +X direction. Other basic structures are the same as... Figure 2 The metal frame 30 shown is the same, therefore the same reference numerals are used to label the same elements, and repeated descriptions are omitted.

[0076] exist Figure 10In the example shown in (a), terminal portion 351 faces a portion of interval 32 in the Z direction across inner diameter region 27. Regarding terminal portion 341, and... Figure 2 Similarly, the metal frame 30 shown is bent in the -X direction (outward) from the connecting portion 342. Thus, one of the terminal portions 341 and 351 can be bent inward, and the other of the terminal portions 341 and 351 can be bent outward. Furthermore, as... Figure 10 As shown in (b) the metal frame 303A, the width of the outwardly bent terminal portion 341 in the Y direction and the width of the inwardly bent terminal portion 351 in the Y direction can also be increased.

[0077] Figure 11 (a) is a schematic perspective view illustrating the construction of the metal frame 304 in the fourth variation.

[0078] Figure 11 The metal frame 304 shown in (a) and Figure 2 The metal frame 30 shown differs in that it does not have terminal portions 341 and 351 that bend in the X direction; instead, the XY surfaces that serve as the front ends of the connecting portions 342 and 352 constitute the terminal portions 341 and 351. Other basic structures are the same as... Figure 2 The metal frame 30 shown is identical; therefore, the same reference numerals are used for the same elements, and repeated descriptions are omitted. Thus, it is not necessary that the terminal portions 341 and 351 are bent from the connecting portions 342 and 352. Furthermore, as... Figure 11 As shown in (b) the metal frame 304A, the area of ​​the exposed terminal portions 341 and 351 can also be increased by increasing the width of the connecting portions 342 and 352 in the Y direction.

[0079] Figure 12 (a) is a schematic perspective view illustrating the construction of the metal frame 305 in the fifth variation.

[0080] Figure 12 The metal frame 305 shown in (a) and Figure 2 The difference in the metal frame 30 shown is that the connecting portions 342 and 352 extend in the XZ direction (with the Y direction as the thickness direction), and the connecting portion 342 faces the connecting portion 352 in the Y direction across the inner diameter region 27. Other basic structures are the same as... Figure 2 The metal frame 30 shown is the same, therefore the same reference numerals are used to label the same elements, and repeated descriptions are omitted.

[0081] exist Figure 12 In the example shown in (a), terminal portion 341 bends from connecting portion 342 in the -Y direction, and terminal portion 351 bends from connecting portion 352 in the +Y direction. This ensures sufficient area for intervals 31 and 32. Furthermore, as... Figure 12 As shown in (b) the metal frame 305A, the width of the outwardly bent terminal portions 341 and 351 in the X direction can also be increased.

[0082] Figure 13 (a) is a schematic perspective view illustrating the construction of the metal frame 306 in the sixth variation.

[0083] Figure 13 The metal frame 306 shown in (a) and Figure 13 The difference between the metal frame 305 shown in (a) and the terminal portion 341 is bent from the connecting portion 342 in the +Y direction, and the terminal portion 351 is bent from the connecting portion 352 in the -Y direction. Other basic structures are the same as those shown in (a). Figure 13 The metal frame 305 shown in (a) is the same, therefore the same reference numerals are used to label the same elements, and repeated descriptions are omitted.

[0084] exist Figure 13 In the example shown in (a), terminal portion 341 faces a portion of interval 31 in the Z direction across inner diameter region 27, and terminal portion 351 faces a portion of interval 32 in the Z direction across inner diameter region 27. Thus, by bending terminal portion 341 inward (towards the +Y direction) and terminal portion 351 inward (towards the -Y direction), the size of metal frame 30 in the Y direction can be miniaturized. Furthermore, as... Figure 13 As shown in (b) the metal frame 306A, the width of the inwardly bent terminal portions 341 and 351 in the X direction can also be increased.

[0085] Figure 14 (a) is a schematic perspective view illustrating the construction of the metal frame 307 in the seventh variation.

[0086] Figure 14 The metal frame 307 shown in (a) and Figure 12 The metal frame 305 shown in (a) differs in that the terminal portion 351 bends from the connecting portion 352 in the -Y direction. Other basic structures are the same as... Figure 12 The metal frame 305 shown in (a) is the same, therefore the same reference numerals are used to label the same elements, and repeated descriptions are omitted.

[0087] exist Figure 14 In the example shown in (a), terminal portion 351 faces a portion of interval 32 in the Z direction across inner diameter region 27. Regarding terminal portion 341, and... Figure 12 Similarly, the metal frame 305 shown in (a) is bent in the -Y direction (outward) from the connecting portion 342. Thus, one of the terminal portions 341 and 351 can be bent inward, and the other of the terminal portions 341 and 351 can be bent outward. Furthermore, as... Figure 14 As shown in (b) the metal frame 307A, the width of the outwardly bent terminal portion 341 in the X direction and the width of the inwardly bent terminal portion 351 in the X direction can also be increased.

[0088] Figure 15 (a) is a schematic perspective view illustrating the construction of the metal frame 308 in the eighth variation.

[0089] Figure 15 The metal frame 308 shown in (a) and Figure 12 The metal frame 305 shown in (a) differs in that it does not have terminal portions 341 and 351 that bend in the Y direction; instead, the XY surfaces that serve as the front ends of the connecting portions 342 and 352 constitute the terminal portions 341 and 351. Other basic structures are the same as... Figure 12 The metal frame 305 shown in (a) is the same, therefore the same reference numerals are used for the same elements, and repeated descriptions are omitted. Thus, it is not necessary that the terminal portions 341 and 351 are bent from the connecting portions 342 and 352. Furthermore, as... Figure 15 As shown in (b) the metal frame 308A, the area of ​​the exposed terminal portions 341 and 351 can also be increased by increasing the width of the connecting portions 342 and 352 in the X direction.

[0090] Figure 16 This is a schematic perspective view illustrating the construction of the metal frame 309 in the ninth variation.

[0091] Figure 16 The metal frame 309 shown has: sections 31 and 32 that extend in the XZ direction (with the Y direction as the thickness direction) and are generally parallel to each other; a section 33 that connects the +X direction end of section 31 and the +X direction end of section 32 and extends in the YZ direction (with the X direction as the thickness direction); a section 34 that connects to the -X direction end of section 31; and a section 35 that connects to the -X direction end of section 32.

[0092] In the magnetic body 20, the region sandwiched by intervals 31 and 32 in the Y direction constitutes the inner diameter region 27 of the coil conductor. The coil conductor, formed by the metal frame 309, has its coil axis in the Z direction and passes through the inner diameter region 27. Interval 31 is located on the side 26 further than the inner diameter region 27. Interval 32 is located on the side 25 further than the inner diameter region 27. Interval 34 is the portion that bends from interval 31 towards the +Y direction (outer side), and its surface is exposed from the main surface 21 of the magnetic body 20. Interval 35 is the portion that bends from interval 32 towards the -Y direction (outer side), and its surface is exposed from the main surface 22 of the magnetic body 20.

[0093] like Figure 16The coil axis of the coil conductor, illustrated by the metal frame 309, can also be in the Z direction. Furthermore, section 34 does not need to be composed of terminal portion 341 and connecting portion 342; the portion bent from section 31 can be directly exposed from the main surface 21 of the magnetic element 20. Similarly, section 35 does not need to be composed of terminal portion 351 and connecting portion 352; the portion bent from section 32 can be directly exposed from the main surface 22 of the magnetic element 20.

[0094] Figure 17 This is a schematic perspective view used to illustrate the construction of the metal frame 310 in the tenth variation.

[0095] Figure 17 The metal frame 310 shown is Figure 16 The difference in the metal frame 309 shown is that section 34 bends from section 31 towards the -Y direction, and section 35 bends from section 32 towards the +Y direction. Other basic structures are the same as... Figure 16 The metal frame 309 shown is the same, therefore the same reference numerals are used to label the same elements, and repeated descriptions are omitted.

[0096] exist Figure 17 In the example shown, a portion of section 34 faces a portion of section 35 in the Z direction, separated by the inner diameter region 27. Thus, if section 34 is bent inward (toward the -Y direction) and section 35 is bent inward (toward the +Y direction), the size of the metal frame 310 in the Y direction can be reduced.

[0097] Figure 18 This is a schematic perspective view illustrating the construction of the metal frame 311 in the eleventh variation.

[0098] Figure 18 The metal frame 311 shown is Figure 16 The difference in the metal frame 309 shown is that section 34 bends from section 31 in the -Y direction. Other basic structures are the same as... Figure 16 The metal frame 309 shown is identical; therefore, identical elements are labeled with the same reference numerals, and redundant descriptions are omitted. Regarding interval 35, and... Figure 16 Similarly, the metal frame 309 shown is bent from section 32 in the -Y direction (outward). Thus, one of sections 34 and 35 can also be bent inward, and the other of sections 34 and 35 can be bent outward.

[0099] Figure 19 This is a schematic perspective view illustrating the construction of the metal frame 312 in the twelfth variation.

[0100] Figure 19 The metal frame 312 shown is Figure 16The metal frame 309 shown differs in that it does not have sections 34 and 35 that bend in the X direction. The XY planes at the front end of section 31 constitute section 34, and the XY planes at the front end of section 32 constitute section 35. Other basic structures are the same as... Figure 16 The metal frame 309 shown is identical, therefore the same reference numerals are used for the same elements, and repeated descriptions are omitted. Thus, it is not necessary that intervals 34 and 35 are the parts that bend from intervals 31 and 32, respectively.

[0101] Figure 20 This is a schematic perspective view illustrating the construction of the metal frame 313 in the thirteenth variation.

[0102] Figure 20 The metal frame 313 shown is Figure 16 The difference in the metal frame 309 shown is that section 34 is composed of terminal portion 341 and connecting portion 342, and section 35 is composed of terminal portion 351 and connecting portion 352. Connecting portions 342 and 352 extend in the YZ direction (with the X direction as the thickness direction), and terminal portions 341 and 351 extend in the XY direction (with the Z direction as the thickness direction). Other basic structures are the same as... Figure 16 The metal frame 309 shown is the same, therefore the same reference numerals are used to label the same elements, and repeated descriptions are omitted.

[0103] exist Figure 20 In the example shown, the connecting portion 342 bends from the interval 31 towards the -Y direction, and the connecting portion 352 bends from the interval 32 towards the +Y direction. Thus, the interval 33 faces the connecting portions 342 and 352 in the X direction, separated by the inner diameter region 27. Furthermore, the terminal portion 341 bends from the connecting portion 342 towards the -X direction (outer side), and the terminal portion 351 bends from the connecting portion 352 towards the -X direction (outer side). With this structure, a higher efficiency than... Figure 16 The metal frame 309 shown has a larger inductance.

[0104] Figure 21 This is a schematic perspective view illustrating the construction of the metal frame 314 in the fourteenth variation.

[0105] Figure 21 The metal frame 314 shown is Figure 20 The difference in the metal frame 313 shown is that the terminal portion 341 is bent from the connecting portion 342 towards the +X direction (inner side), and the terminal portion 351 is bent from the connecting portion 352 towards the +X direction (inner side). Other basic structures are the same as... Figure 20 The metal frame 313 shown is the same, so the same reference numerals are used for the same elements, and repeated descriptions are omitted. Thus, if the terminal portions 341 and 351 are bent inward (towards the +X direction), the size of the metal frame 314 in the X direction can be reduced.

[0106] Figure 22 This is a schematic perspective view illustrating the construction of the metal frame 315 in the fifteenth variation.

[0107] Figure 22 The metal frame 315 shown is Figure 20 The difference in the metal frame 313 shown is that the terminal portion 341 bends from the connecting portion 342 toward the +X direction side (inner side). Other basic structures are the same as... Figure 20 The metal frame 313 shown is identical; therefore, identical elements are labeled with the same reference numerals, and repeated descriptions are omitted. Regarding the terminal portion 351, it is the same as... Figure 20 Similarly, the metal frame 313 shown is bent from the connecting portion 352 in the -X direction (outward). In this way, one of the terminal portions 341 and 351 can be bent inward, and the other of the terminal portions 341 and 351 can be bent outward.

[0108] Figure 23 This is a schematic perspective view used to illustrate the construction of the metal frame 316 in the sixteenth variation.

[0109] Figure 23 The metal frame 316 shown is Figure 20 The metal frame 313 shown differs in that it does not have terminal portions 341 and 351 that bend in the X direction; instead, the XY surfaces that serve as the front ends of the connecting portions 342 and 352 constitute the terminal portions 341 and 351. Other basic structures are the same as... Figure 20 The metal frame 313 shown is the same, therefore the same reference numerals are used for the same elements, and repeated descriptions are omitted. Thus, it is not necessary that the terminal portions 341 and 351 are bent from the connecting portions 342 and 352.

[0110] The above describes the implementation of the technology involved in this disclosure. However, the technology involved in this disclosure is not limited to the above implementation, and various changes can be made without departing from its spirit. Needless to say, these changes are also included in the scope of the technology involved in this disclosure.

[0111] Furthermore, the appropriate combination of the various embodiments and variations described above is also included in the technology involved in this disclosure.

[0112] For example, by combining the electronic component 10 of the first embodiment described above with the electronic component 10A of the second embodiment, the electronic component 10B of the third embodiment can be constructed. That is, in this case, a magnetic core 28 is disposed in the inner diameter region 27 of any one or more of the two or more metal frames.

[0113] In addition, for example, Figure 8The metal frame 301 of the first variant illustrated can be used as the metal frame of the second to fourth embodiments described above. Similarly, for example, Figure 9 (a) and Figure 9 The metal frame 302 (302A) of the second modified example illustrated in (b) Figure 10 (a) and Figure 10 The metal frame 303 (303A) of the third modified example illustrated in (b) Figure 11 (a) and Figure 11 The metal frame 304 (304A) of the fourth variant example illustrated in (b) Figure 12 (a) and Figure 12 The fifth variant illustrated in (b) is a metal frame 305 (305A). Figure 13 (a) and Figure 13 The metal frame 306 (306A) of the sixth variant illustrated in (b) Figure 14 (a) and Figure 14 The metal frame 307 (307A) of the seventh variation illustrated in (b), and Figure 15 (a) and Figure 15 The metal frame 308 (308A) of the eighth variant illustrated in (b) can be used as the metal frame of the second to fourth embodiments described above.

[0114] In addition, for example, Figure 16 The metal frame 309 of the ninth variation illustrated can be used as the metal frame of the second or third embodiment described above. Furthermore, when the metal frame 309 is used as the metal frame of the second embodiment described above, the magnetic core 28 can be formed in an appropriate shape and size to be accommodated in the inner diameter region 27. Additionally, by arranging one or more metal frames 309 in such a way that the magnetic core 28 is disposed in the inner diameter region, electronic components similar to those of the third or fourth embodiment can be formed. Similarly, for example, Figure 17 The metal frame 310 of the tenth variation example is illustrated. Figure 18 The metal frame 311 of the eleventh variation example is illustrated. Figure 19 The metal frame 312 of the twelfth variation example is illustrated. Figure 20 The metal frame 313 of the thirteenth variation example is illustrated. Figure 21 The metal frame 314 of the fourteenth variation example is illustrated. Figure 22 The metal frame 315 of the fifteenth variation example illustrated, and Figure 23The metal frame 316 of the sixteenth variation illustrated can be used as the metal frame of the second or third embodiment described above. Furthermore, when using the metal frames of these variations as the metal frame of the second embodiment described above, the magnetic core 28 can be formed in an appropriate shape and size to be accommodated in the inner diameter region 27. Additionally, by arranging one or more metal frames in which the magnetic core 28 is disposed in the inner diameter region, an electronic component similar to the third or fourth embodiment can be formed.

[0115] In addition, by using one or more Figure 2 The metal frame 30 of the illustrated manner can be combined with one or more metal frames of various modifications to form an electronic component similar to the third or fourth embodiment. Alternatively, multiple metal frames of various modifications can be combined to form an electronic component similar to the third or fourth embodiment.

[0116] The technologies involved in this disclosure include, but are not limited to, the following structural examples.

[0117] An electronic component according to one aspect of this disclosure comprises: a magnetic element having a first main surface and a second main surface located opposite to the first main surface; and a first metal frame embedded in the magnetic element, the first metal frame comprising: a first section and a second section opposite to each other and substantially parallel; a third section connecting one end of the first section and one end of the second section; a fourth section connected to the other end of the first section and at least partially exposed from the first main surface; and a fifth section connected to the other end of the second section and at least partially exposed from the second main surface. Thus, one end and the other end of a coil conductor formed by the first metal frame can be exposed on the surface of the magnetic element.

[0118] In the aforementioned electronic component, the first and second sections may be opposite each other in a first direction. The magnetic element includes an inner diameter region sandwiched between the first and second sections in the first direction. The first section is located closer to the second main surface than the inner diameter region, and the second section is located closer to the first main surface than the inner diameter region. The fourth section includes a first terminal portion exposed at least partially from the first main surface and a first connecting portion connecting the first terminal portion to the other end of the first section. The fifth section includes a second terminal portion exposed at least partially from the second main surface and a second connecting portion connecting the second terminal portion to the other end of the second section. Therefore, even with a reduced height for the electronic component, the cross-sectional area of ​​the first and second sections can be adequately ensured, thus reducing DC resistance.

[0119] In the aforementioned electronic component, the third section may be positioned opposite the first and second connecting portions in a second direction orthogonal to the first direction, with the inner diameter region clamped by the third section and the first and second connecting portions from the second direction. This allows for a larger inductance. Alternatively, at least the first, second, and third sections, the first and second connecting portions of the first metal frame may constitute a coil, with the second direction perpendicular to the coil's axis. This prevents the magnetic field generated by the first metal frame from interfering with the first and second connecting portions.

[0120] In the aforementioned electronic component, the first connecting portion and the second connecting portion may face each other in a third direction orthogonal to the first direction, with the inner diameter region clamped by the first and second connecting portions in the third direction. This allows for a larger inductance. In this case, at least the first, second, and third sections of the first metal frame constitute a coil, and the third direction is a direction parallel to the coil axis direction. This allows for miniaturization of the first metal frame in the third direction orthogonal to the first and second directions.

[0121] In the aforementioned electronic components, a portion of the first section may be exposed from the second main surface, and a portion of the second section may be exposed from the first main surface. This improves heat dissipation characteristics.

[0122] In the aforementioned electronic component, at least a first section, a second section, a third section, a first connecting portion, and a second connecting portion of the first metal frame may constitute a coil, with the coil axis direction perpendicular to the first and second main surfaces. This facilitates a lower height for the electronic component. Alternatively, the first and second sections may face each other in a third direction, and the magnetic element may include an inner diameter region clamped by the first and second sections in a third direction. The fourth section may include a first terminal portion exposed at least partially from the first main surface and a first connecting portion connecting the first terminal portion to the other end of the first section. The fifth section may include a second terminal portion exposed at least partially from the second main surface and a second connecting portion connecting the second terminal portion to the other end of the second section. The inner diameter region is clamped by the third section, the first connecting portion, and the second connecting portion in a second direction orthogonal to the third direction. This allows for a larger inductance.

[0123] The aforementioned electronic component may also include: a magnetic core disposed in the inner diameter region sandwiched between the first and second intervals, which has a higher permeability than the magnetic material. This allows for a greater inductance.

[0124] The aforementioned electronic component may also include a second metal frame having the same shape as the first metal frame, with the magnetic element embedded coaxially in both the first and second metal frames. This allows for the provision of an electronic component that incorporates two coil conductors.

[0125] One aspect of this disclosure relates to an electronic component embedded substrate comprising: a core layer in which the electronic component is embedded; a first conductor pattern covering one main surface of the core layer and connected to a fourth region exposed from a magnetic element; and a second conductor pattern covering another main surface of the core layer and connected to a fifth region exposed from a magnetic element. Thus, by mounting a switching circuit or the like on the electronic component embedded substrate, a power supply circuit with an embedded inductor can be constructed.

[0126] This application claims priority to Japanese Patent Application No. 2023-151451, filed on September 19, 2023, the entire disclosure of which is incorporated herein by reference.

[0127] Explanation of reference numerals in the attached figures

[0128] 10. Electronic components, 10A-10C

[0129] 20 Magnetic bodies

[0130] 21. Principal face (first principal face) of the magnetic solid

[0131] 22. The principal face (second principal face) of the magnetic solid.

[0132] 23-26 Side views of magnetic elements

[0133] 27, 27B Inner Diameter Area

[0134] 28 Magnetic Cores

[0135] Metal frames 30, 30B, 301~316, 302A~308A

[0136] 31. Metal frame section (first section)

[0137] 32. Metal frame section (second section)

[0138] 33, 33B Metal frame section (third section)

[0139] 34. Metal frame section (fourth section)

[0140] 35. Metal frame section (fifth section)

[0141] 100 Electronic components built into the substrate

[0142] 110 core layer

[0143] 111 A principal face of the core layer

[0144] Another principal surface of the 112 core layer

[0145] 113 Through hole

[0146] 121, 122 Insulating resin layers

[0147] 131, 132 Solder resist

[0148] Conductor patterns 141–144, 162, 164, 171–174, 191, 193

[0149] 151, 152, 154, 181, 183, 184 via conductors

[0150] Terminal sections 341 and 351

[0151] 342, 352, 342B, 352B connecting parts

[0152] Areas B1 and B2

[0153] L1~L4 conductor layers

[0154] TH1 and TH2 are through-hole conductors.

Claims

1. An electronic component, wherein, have: A magnetic element having a first principal surface and a second principal surface located on the opposite side of the first principal surface; and A first metal frame is embedded in the magnetic element. The first metal frame includes: a first section and a second section that are opposite to each other and generally parallel; a third section that connects one end of the first section and one end of the second section; a fourth section that is connected to the other end of the first section and is at least partially exposed from the first main surface; and a fifth section that is connected to the other end of the second section and is at least partially exposed from the second main surface.

2. The electronic component according to claim 1, wherein, The first interval and the second interval are opposite each other in the first direction. The magnetic element includes an inner diameter region that is sandwiched between the first interval and the second interval from the first direction. The first interval is located further along the second main surface than the inner diameter region. The second interval is located further along the first main surface than the inner diameter region. The fourth section includes: a first terminal portion at least partially exposed from the first main surface; and a first connecting portion connecting the first terminal portion to the other end of the first section. The fifth section includes: a second terminal portion at least partially exposed from the second main surface; and a second connecting portion connecting the second terminal portion to the other end of the second section.

3. The electronic component according to claim 2, wherein, The third section is opposite to the first connecting portion and the second connecting portion in a second direction orthogonal to the first direction. The inner diameter region is held from the second direction by the third interval, the first connecting portion, and the second connecting portion.

4. The electronic component according to claim 3, wherein, At least the first section, the second section, the third section, the first connecting portion, and the second connecting portion of the first metal frame constitute a coil. The second direction is perpendicular to the coil axis direction of the coil.

5. The electronic component according to claim 2, wherein, The first connecting portion and the second connecting portion are opposite each other in a third direction orthogonal to the first direction. The inner diameter region is clamped from the third direction by the first connecting portion and the second connecting portion.

6. The electronic component according to claim 5, wherein, At least the first section, the second section, and the third section of the first metal frame constitute a coil. The third direction is the direction parallel to the coil axis direction of the coil.

7. The electronic component according to claim 1, wherein, A portion of the first section is exposed from the second main surface. A portion of the second section is exposed from the first main surface.

8. The electronic component according to claim 1, wherein, At least the first section, the second section, the third section, the first connecting portion, and the second connecting portion of the first metal frame constitute a coil. The coil axis is perpendicular to the first main surface and the second main surface.

9. The electronic component according to claim 8, wherein, The first interval and the second interval are opposite each other on a third upward direction. The magnetic element includes an inner diameter region that is held in a third direction by the first interval and the second interval. The fourth section includes: a first terminal portion at least partially exposed from the first main surface; and a first connecting portion connecting the first terminal portion to the other end of the first section. The fifth section includes: a second terminal portion at least partially exposed from the second main surface; and a second connecting portion connecting the second terminal portion to the other end of the second section. The inner diameter region is held by the third interval, the first connecting portion, and the second connecting portion from a second direction orthogonal to the third.

10. The electronic component according to claim 1, wherein, It also includes a magnetic core disposed in the inner diameter region sandwiched between the first and second intervals, which has a higher permeability than the magnetic element.

11. The electronic component according to claim 1, wherein, It also includes a second metal frame having the same shape as the first metal frame. The first metal frame and the second metal frame are coaxially embedded in the magnetic element.

12. An electronic component embedded substrate, wherein, have: A core layer in which the electronic components according to any one of claims 1 to 11 are embedded; A first conductor pattern covers one main surface of the core layer and is connected to the fourth region exposed from the magnetic body; as well as A second conductor pattern covers another main surface of the core layer and is connected to the fifth interval exposed from the magnetic body.

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