Substrate separation device

Abstract

The invention provides a substrate separating device capable of accurately separating bonded substrates. A substrate separation device 1 is provided with: a holding unit 10 for holding a bonded substrate S formed by bonding a pair of substrates; a rotation drive unit 122 that rotates the holding unit 10; a nozzle 30 that separates the bonding substrate S by discharging a fluid toward the outer periphery of the rotating bonding substrate S; a nozzle moving unit (40) that moves the nozzle (30); an imaging unit that captures an image of the outer peripheral surface CS of the bonded substrate S held by the holding unit 10; and a control device (100) that controls the nozzle moving unit (40). Furthermore, the control device (100) controls the height adjustment mechanism (43) of the nozzle moving part (40) so that the height position of the nozzle (30) is aligned with the position of the separation surface (RS) of the bonding substrate (S) detected from the image captured by the camera (431).

Description

Technical Field

[0001] This invention relates to a substrate separation device. Background Technology

[0002] In the manufacturing process of three-dimensional semiconductor devices, a layer formed on one substrate is copied to the other substrate by using a technique that separates two substrates formed by bonding them together, thereby forming a uniform thin film.

[0003] As a separation technology for this type of substrate, the following technique is proposed: the front and back surfaces of the bonding substrate are held by adsorption using a pair of retaining parts (fixers), and while rotating it, high-pressure water (water jet) is supplied from a nozzle toward the separation surface exposed on the outer periphery of the bonding substrate, thereby using the wedge effect of the fluid to separate the bonding substrate.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 11-005064 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] To achieve uniform separation of the bonding substrates, the fluid must consistently and correctly contact the separation surface. If the fluid detaches from the separation surface, the wedge-effect-based separation process cannot proceed, resulting in uneven separation progress within the bonding substrate surface and causing defects such as cracks or gaps. Therefore, it is necessary to accurately detect the separation surface in a direction orthogonal to the surface of the bonding substrate.

[0009] The present invention was made to solve the problems described above, and its object is to provide a substrate separation apparatus that can accurately separate a bonded substrate.

[0010] Technical means to solve the problem

[0011] The substrate separation apparatus according to an embodiment of the present invention is characterized by comprising: a holding portion for holding a pair of substrates bonded together; a rotation drive portion for rotating the holding portion; a nozzle for separating the bonded substrates by ejecting fluid toward the outer periphery of the rotating bonded substrates; a nozzle moving portion for moving the nozzle; an imaging portion for capturing an image of the outer peripheral surface of the bonded substrates held by the holding portion; and a control device for controlling the nozzle moving portion, wherein the control device controls the nozzle moving portion to align the height position of the nozzle with the position of the separation surface of the bonded substrates detected based on the image captured by the imaging portion.

[0012] The effects of the invention

[0013] Through the embodiments of the present invention, the bonding substrate can be accurately separated. Attached Figure Description

[0014] [ Figure 1 [ ] is a side view showing the substrate separation device of the embodiment.

[0015] [ Figure 2 [] is a plan view showing the bonding substrate and positioning part when the bonding substrate is moved in.

[0016] [ Figure 3 [This is a plan view showing the bonding substrate and positioning part during the positioning of the bonding substrate before the separation process.]

[0017] [ Figure 4 [ ] is a planar diagram showing the displacement of the nozzle from the standby position, the separation start position, and the center separation position.

[0018] [ Figure 5 [This is a plan view showing the bonding substrate, positioning part, and nozzle when the center of the bonding substrate is separated.]

[0019] [ Figure 6 [] is a block diagram representing the structure of the control device.

[0020] [ Figure 7 [ ] is a flowchart showing the sequence of separating the bonding substrate in the embodiment.

[0021] [ Figure 8 [ ] is an explanatory diagram showing the transfer and separation process of the bonding substrate in the embodiment.

[0022] [ Figure 9 [] is a flowchart illustrating the process of detecting the tilt of the nozzle.

[0023] [ Figure 10 [ ] is a plan view showing the positional relationship between the nozzle and the camera when the detection nozzle is tilted.

[0024] [ Figure 11 (a) is an illustration of the reflected light from the ejected fluid, and (b) is an example of a camera image.

[0025] [ Figure 12 [] is a graph showing the height change of the detected separation surface.

[0026] [ Figure 13 [ ] is a flowchart representing the process of determining the height of the nozzle.

[0027] [ Figure 14(a) is an explanatory diagram showing the outer peripheral surface and the separation surface as viewed from the side of the bonding substrate; (b) is an explanatory diagram showing the situation of reflected light from the bonding substrate; and (c) is a diagram showing an example of a camera image.

[0028] [ Figure 15 [Illustration] is a schematic diagram showing the positional relationship between the bonding substrate, nozzle, and camera in a modified example. Detailed Implementation

[0029] The substrate separation apparatus of the embodiment will be described with reference to the accompanying drawings. Furthermore, the drawings are schematic diagrams, and the dimensions, proportions, etc., of each part include exaggerated portions for ease of understanding. Figure 1 As shown, the substrate separation device 1 is a device that separates the bonded substrate S by ejecting fluid from the nozzle 30. Figure 1 In this embodiment, the gripping part 210 and the placing part 220 located near the front are omitted. Furthermore, in the following description, the direction along the rotation axis of the bonding substrate S is defined as the Z direction, the direction in which the nozzle 30 ejects fluid in a plane perpendicular to it is defined as the Y direction, and the direction orthogonal to it is defined as the X direction. The rotation plane of the bonding substrate S is parallel to the XY plane. In this embodiment, the Z direction is the vertical direction and the XY direction is the horizontal direction, but the installation direction of the substrate separation device 1 is not limited to this.

[0030] [Lamination substrate]

[0031] The bonding substrate S is a circular substrate formed by bonding a first substrate Sa and a second substrate Sb. The first substrate Sa has a bonding surface Sa1, a surface Sa2 as its opposite side, and an outer peripheral surface Sa3 connecting the bonding surface Sa1 and surface Sa2. The second substrate Sb has a bonding surface Sb1, a surface Sb2 as its opposite side, and an outer peripheral surface Sb3 connecting the bonding surface Sa1 and surface Sa2. That is, the bonding substrate S has a first surface Sa2 and a second surface Sb2, which are circular opposite surfaces and are opposite to the first substrate Sa and the second substrate Sb. Hereinafter, surface Sa2 will be designated as the first surface of the bonding substrate S, and surface Sb2 will be designated as the second surface of the bonding substrate S. Furthermore, as... Figure 14 As shown in (a), the surface obtained by viewing the recess formed by the bonding of the first substrate Sa and the second substrate Sb from the outer peripheral surface CS side of the bonding substrate S is called the separation surface RS. The outer peripheral surface CS of the bonding substrate S is composed of the outer peripheral surface Sa3 of the first substrate Sa, the separation surface RS, and the outer peripheral surface Sb3 of the second substrate Sb.

[0032] The first substrate Sa is, for example, a substrate on which a porous layer is formed on the surface of a semiconductor wafer, and then a single-crystal Si layer is formed thereon.

[0033] The second substrate Sb is, for example, a substrate on which a single-crystal Si layer is formed on the surface of a semiconductor wafer. A bonding substrate S is formed by bonding the first substrate Sa and the second substrate Sb together with an insulating layer formed on either the first substrate Sa or the second substrate Sb. Furthermore, in the following description, even if the first substrate Sa and the second substrate Sb are separate, a substrate in which the bonding surface Sa1 and the bonding surface Sb1 overlap is also considered a bonding substrate S.

[0034] [Substrate Separation Device]

[0035] The substrate separation device 1 separates the first substrate Sa, which is bonded to the substrate S, from the porous layer, and forms a multilayered single-crystal Si layer on the second substrate Sb. For example... Figure 1 As shown, the substrate separation device 1 includes a holding part 10, a positioning part 20, a nozzle 30, a nozzle moving part 40, and a control device 100.

[0036] [Maintenance Department]

[0037] The holding part 10 holds and rotates both sides (Sa2 and Sb2) of the bonding substrate S. The holding part 10 has a first retainer 110 and a second retainer 120.

[0038] (First Maintenance Section)

[0039] The first retainer 110 has a first holding portion 111 and a support mechanism 112. The first holding portion 111 is a circular plate with a diameter smaller than the diameter of the surface of the substrate S. The support mechanism 112 is connected to the center of the surface of the first holding portion 111 via a support shaft in the Z direction, supporting the first holding portion 111 so that it can rotate with its center as the rotation center Ct. In this embodiment, the support shaft is connected to a drive source that rotates the second holding portion 121 (described later) via a pulley and a timing belt, and rotates synchronously with the second holding portion 121.

[0040] In this embodiment, the surface of the first holding portion 111 that is fixed to the support mechanism 112 faces upward, while its opposite surface faces downward. Furthermore, although not shown in the figure, a suction hole is formed in the first holding portion 111 that opens on the surface in contact with the bonding substrate S. By connecting an exhaust device to the suction hole, one surface (surface Sa2 of the first substrate Sa) of the bonding substrate S can be suctioned and held using negative pressure.

[0041] (Second Fixator)

[0042] The second retainer 120 includes a second holding portion 121, a rotation drive portion 122, and a loading / unloading drive portion 123. The second holding portion 121 is a circular plate with the same diameter as the first holding portion 111. The rotation drive portion 122 rotates the substrate S. The drive shaft in the Z direction of the rotation drive portion 122 is connected to the center of the second holding portion 121, supporting the second holding portion 121 so that it can rotate. The rotation drive portion 122 has a motor as a drive source to rotate the second holding portion 121. The drive shaft is the shaft of the motor, and the second holding portion 121 rotates around the rotation center Ct by the operation of the motor.

[0043] In this embodiment, the surface of the second holding portion 121 that is mounted on the rotary drive portion 122 faces downwards, while its opposite surface faces upwards and is opposite to the first holding portion 111. That is, the first holding portion 111 and the second holding portion 121 are arranged facing each other with their rotation centers Ct aligned. Furthermore, although not shown, a suction hole is formed in the second holding portion 121 that opens on the surface in contact with the bonding substrate S. By connecting an exhaust device to the suction hole, negative pressure can be used to suction and hold the other surface of the bonding substrate S (surface Sb2 of the second substrate Sb).

[0044] The loading / unloading drive unit 123 holds the bonding substrate S in the holding portion 10. The loading / unloading drive unit 123 moves the second holding portion 121 in a direction that contacts / separates from the first holding portion 111. The loading / unloading drive unit 123 has a cylinder as a drive source. When the bonding substrate S is inserted between the separated first holding portion 111 and second holding portion 121, the loading / unloading drive unit 123 can clamp and hold the bonding substrate S between the first holding portion 111 and the second holding portion 121 by bringing the second holding portion 121 close to the first holding portion 111.

[0045] [Positioning Department]

[0046] Positioning unit 20 positions the central axis Cs of the bonding substrate S on the central axis Ct of the holding unit 10 (see reference). Figure 2 , Figure 3 That is, the central axis Cs of the bonding substrate S disposed between the first retainer 110 and the second retainer 120 is aligned with the central axis Ct of the first retainer 110 and the second retainer 120. The positioning part 20 has a gripping part 210, a mounting part 220, an axial driving part 230, and an opening and closing driving part 240 (see reference). Figure 1 ).

[0047] (Holding part)

[0048] The gripping portion 210 grips the outer periphery of the bonding substrate S. The outer periphery of the bonding substrate S is the side surface along the outer edge of the circumference. Multiple gripping portions 210 are arranged at equal intervals around the holding portion 10, that is, along the outer periphery of the bonding substrate S held by the holding portion 10. In this embodiment, the gripping portion 210 consists of four upright pins.

[0049] (Loading section)

[0050] The mounting portion 220 holds the bonding substrate S. The mounting portion 220 has a mounting surface that supports the bonding substrate S and is equipped with gripping portions 210. Four mounting portions 220 and gripping portions 210 are provided in a one-to-one correspondence. In this embodiment, the mounting portion 220 is used to hold the surface of the bonding substrate S held by the second fixture 120, namely the surface Sb2 of the second substrate Sb.

[0051] (Axial drive unit)

[0052] The axial drive unit 230 moves the gripping part 210 and the mounting part 220 along an axial direction parallel to the rotation axis of the holding part 10. The axial drive unit 230 has a support part 231, a force-applying part 232, and an absorption part 233. The support part 231 is a member that supports and erects the gripping part 210 and the mounting part 220 at its front end. The force-applying part 232 is configured to move axially, for example, by a drive mechanism such as a cam that rotates using a cylinder. The absorption part 233 exists between the force-applying part 232 and the support part 231, transmitting the movement of the force-applying part 232 to the support part 231 and absorbing vibrations during the separation of the bonding substrate S. The absorption part 233 only needs to be able to absorb vibrations during separation, so it can be, for example, a compression spring, a leaf spring, an elastomer of rubber or resin, a cylinder, etc.

[0053] (Opening and closing drive unit)

[0054] The opening / closing drive unit 240 moves the gripping part 210 and the mounting part 220 between a closed position where the gripping part 210 is in contact with the outer periphery of the bonding substrate S, and an open position away from the outer periphery of the bonding substrate S. The position of the gripping part 210 is set such that when it is in the closed position, the center Cs of the bonding substrate S is positioned at the rotation center Ct. The opening / closing drive unit 240 has an arm 241, which moves along the radial direction of the bonding substrate S (the centripetal and centrifugal directions relative to the rotation center Ct) by a drive mechanism such as a cam that rotates using a cylinder (not shown). A support part 231 is connected to the arm 241 in a manner that allows it to move axially.

[0055] (nozzle)

[0056] The nozzle 30 ejects fluid toward the outer periphery of the rotating bonding substrate S, thereby separating the bonding substrate S into substrate Sa and substrate Sb. In this embodiment, the nozzle 30 ejects fluid toward the outer periphery of the bonding substrate S, which is held and rotated by the holding part 10.

[0057] The nozzle 30 in this embodiment is an ejection device for spraying high-pressure fluid onto an object. The nozzle 30 is connected to a supply device 31, including a pump or the like, that supplies the high-pressure fluid, via piping and valves. The nozzle 30 is configured to eject a high-pressure fluid, i.e., water (e.g., spray water), has a very small orifice diameter (0.1 mm to 1 mm), and the wall thickness at the tip of the nozzle 30 is sufficient to withstand high-pressure water (1 cm to 5 cm). Furthermore, due to the inclination of the orifice axis of the fluid ejection hole in the nozzle 30 or the inclination of the nozzle 30 itself, the fluid may sometimes be ejected from the nozzle 30 at a predetermined angle. That is, the fluid may sometimes be ejected from the nozzle 30 at an angle θ° relative to the horizontal direction.

[0058] like Figure 3 As shown, the axis of the nozzle 30 is arranged on the extension line of the radius of the positioned bonding substrate S, and the nozzle outlet at the front end of the nozzle 30 faces the outer periphery of the bonding substrate S. Therefore, the nozzle 30 ejects fluid in a direction parallel to the rotation plane of the bonding substrate S and toward the center Cs. The gripping part 210 is provided at a position that does not overlap with the extension line of the axis of the nozzle 30.

[0059] (Nozzle moving part)

[0060] like Figure 4 , Figure 5 As shown, the nozzle moving part 40 changes the ejection direction of the fluid from the nozzle 30 between a first direction (tangential to the outer periphery of the bonding substrate S) and a second direction (direction toward the central axis Cs of the bonding substrate S). The first and second directions are parallel. That is, the nozzle 30 does not change the ejection direction of the fluid from... Figure 4 The separation start position [a] is changed to the center separation position [b], thereby ejecting fluid in two directions. The nozzle moving part 40 of this embodiment can move the nozzle 30 in a direction along the outer periphery of the bonding substrate S. The nozzle moving part 40 has a contact / separation mechanism 41, a position adjustment mechanism 42, and a height adjustment mechanism 43.

[0061] (Contact / Separation Mechanism)

[0062] The contact / separation mechanism 41 moves the nozzle 30 between a standby position where the nozzle exits from the outer periphery of the bonding substrate S, and an exit position where fluid can be ejected near the outer periphery to separate the bonding substrate S. That is, the contact / separation mechanism 41 moves the nozzle 30 along the Y direction. The contact / separation mechanism 41 can, for example, be a ball screw mechanism driven by a servo motor.

[0063] (Position adjustment mechanism)

[0064] The position adjustment mechanism 42 moves the nozzle 30 between a separation start position [a] along the tangent of the outer periphery of the bonding substrate S held and rotated by the holding part 10, and a center separation position [b] toward the central axis Cs of the bonding substrate S. That is, the nozzle 30 is moved along the X direction by the position adjustment mechanism 42. The position adjustment mechanism 42 may be, for example, a ball screw mechanism driven by a servo motor.

[0065] like Figure 4 As shown, via the contact / separation mechanism 41 and the position adjustment mechanism 42, the nozzle 30 can move from the separation start position [a] to the center separation position [b] in an arc trajectory. Thus, the fluid ejected from the nozzle 30 moves towards... Figure 4 A portion of the outer periphery of the bonding substrate S, as shown in Ra, is blown onto it. This portion is defined as an arc region on the outer periphery of the bonding substrate S containing a central angle of 90 degrees. Furthermore, the bonding substrate S rotates at least during the separation process at its outer periphery, thus ensuring that even when fluid is ejected into a portion of the outer periphery, the ejected fluid reaches the entire circumference. Moreover, with… Figure 4 The diagonal lines indicate the expansion of the separation portion of the bonding substrate S, and fluid also flows from the gap between the first substrate Sa and the second substrate Sb to reach the central portion of the bonding substrate S. During separation at the center of the bonding substrate S, as... Figure 5 As shown, nozzle 30 is located at the center separation position [b]. Before and after the separation of the bonding substrate S begins, nozzle 30 is moved to a standby position separated from the outer periphery of the bonding substrate S by contact / separation mechanism 41 and position adjustment mechanism 42 [c].

[0066] The distance d between the nozzle 30 positioned in the first direction and the outer periphery of the bonding substrate S is the same as the distance d between the nozzle 30 positioned in the second direction and the outer periphery of the bonding substrate S. Therefore, the nozzles 30 in the first direction and the nozzles 30 in the second direction can be positioned as close as possible to the outer periphery of the bonding substrate S.

[0067] (Height adjustment mechanism)

[0068] The height adjustment mechanism 43 moves the nozzle 30 along the height direction (Z-axis direction). The height adjustment mechanism 43 can be, for example, a cylinder. That is, the nozzle 30 is moved along the Z-direction by the height adjustment mechanism 43. The separation surface RS of the rotating bonding substrate S moves slightly up and down due to the holding condition or deflection of the bonding substrate S. Furthermore, when fluid is ejected from the nozzle 30 at a predetermined angle, when moving the nozzle 30 along the Z-axis direction, in order to ensure that the fluid (hereinafter referred to as the ejected fluid) correctly contacts the separation surface RS, it is necessary to adjust the height of the nozzle 30 in the up and down direction, taking into account the angle of the fluid ejected from the nozzle 30. The height adjustment mechanism 43 includes a camera 431 as an imaging unit, and the nozzle 30 is moved along the height direction based on the detection results of the camera 431.

[0069] Camera 431 can be used with a depth of field of 35 μm to 50 μm. For example... Figure 4 As shown, the camera 431 is located at a position 90° relative to the axis of the nozzle 30 and on the extension line of the diameter of the bonding substrate S. In the XY plane, the axis of the nozzle 30 is aligned with the ejection direction of the ejected fluid from the nozzle 30. The camera 431 can be mounted on a fixed stand or on a lifting worktable, etc., so that it can be adjusted according to the height of the bonding substrate S held by the holding part 10.

[0070] In order to suppress the influence of water droplets during shooting, the camera 431 ideally maintains a certain distance from the ejected fluid.

[0071] Near the camera 431, a lamp 433, serving as an illumination unit, is arranged parallel to the optical axis of the camera 431. Illumination light from the lamp 433 illuminates the ejected fluid in a direction orthogonal to it. The camera 431 detects the position of the ejected fluid by detecting the reflected light (normal reflection light) caused by the reflected light on the surface of the ejected fluid. Furthermore, the camera 431 is positioned to capture images of the outer peripheral surface CS of the bonding substrate S, including the separation surface RS, which is being moved in. When the bonding substrate S is moved in and held by the holding unit 10, the focal point of the camera 431 is located at the separation surface RS of the bonding substrate S.

[0072] As the camera 431, it can be a camera that only takes pictures of a point on the outer peripheral surface CS of the stationary bonding substrate S, but preferably a camera that can take pictures of the entire circumference of the outer peripheral surface CS of the bonding substrate S rotating at a low speed at predetermined angular intervals or continuously. That is, the outer peripheral surface CS of the bonding substrate S held by the holding part 10 may not be kept at the same height due to reasons such as the dimensional accuracy of the holding part 10 or the bonding substrate S, and a slight displacement in the circumferential direction is conceivable. Therefore, when performing the separation operation while rotating the bonding substrate S, by adjusting the height of the nozzle 30 according to the rotation angle and height of the bonding substrate S, the fluid can be reliably ejected onto the separation surface RS.

[0073] [Control Device]

[0074] The control device 100 is a device for controlling the substrate separation device 1, and controls the operation of the holding part 10, the positioning part 20, the nozzle 30, and the nozzle moving part 40. The control device 100 can be implemented, for example, by a dedicated electronic circuit or a computer running a predetermined program.

[0075] More specifically, the control device 100 controls the rotation and movement of the second holding part 121 by controlling the rotation drive unit 122 and the loading / unloading drive unit 123. Furthermore, the control device 100 controls the movement of the gripping part 210 and the mounting part 220 by controlling the axial drive unit 230 and the opening / closing drive unit 240. Moreover, the control device 100 controls the ejection of fluid from the nozzle 30 by controlling the supply device 31, and controls the movement of the nozzle 30 by controlling the contact / separation mechanism 41 and the position adjustment mechanism 42 provided on the nozzle moving part 40.

[0076] Next, the alignment of the nozzle 30 with the separation surface RS of the bonding substrate S will be explained.

[0077] (1) Calculation of the amount of movement of the inclined nozzle 30 based on the ejected fluid

[0078] The control device 100 detects the tilt of the fluid ejected from the nozzle 30 based on the image captured by the camera 431. Based on the detected tilt of the ejected fluid and the distance from the nozzle 30 outlet to any processing position on the separation surface RS where the ejected fluid is supplied, the nozzle moving part 40 is controlled to align the height position of the nozzle 30 with the height position of the separation surface RS.

[0079] Therefore, as Figure 6 As shown, the control device 100 has a photography processing unit 101, which performs actions such as determining the timing of the camera 431's photography, controlling the rotation of the substrate S, and controlling the movement of the nozzle 30.

[0080] Before the bonding substrate S is loaded, the photography processing unit 101 moves the nozzle 30 to a position where the camera 431 can photograph the ejected fluid, and photographs the ejected fluid. The photographed image is stored in the image storage unit 102a within the storage unit 102. The tilt detection unit 103 detects the tilt of the ejected fluid based on the photographed image and stores the detected tilt in the tilt storage unit 102b. The calculation unit 104 calculates the amount of movement of the nozzle 30 based on the detected tilt of the ejected fluid and the distance from the nozzle 30's outlet to any processing position on the separation surface RS, so that the height position of the nozzle 30 is aligned with the height of the separation surface RS. That is, the amount of movement of the nozzle 30 in the height direction is calculated to position the nozzle 30 at the position where the ejected fluid ejected from the nozzle 30 touches the separation surface RS.

[0081] (2) Height correction control based on the change in the height of the separation surface

[0082] The control device 100 corrects the calculated movement amount of the nozzle 30 based on the correction amount of the separation surface RS which moves up and down according to the rotation of the bonding substrate S, and controls the movement of the nozzle 30 in the height direction.

[0083] To calculate the correction amount based on the height of the separation surface RS, which moves up and down according to the rotation of the bonding substrate S, the imaging processing unit 101 takes a picture of the outer peripheral surface CS of the bonding substrate S, which is held and rotated by the holding unit 10, at least once before the ejected fluid. The storage unit 102 has a separation surface height storage unit 102c, which stores the rotation angle of the bonding substrate S at the time of imaging in association with the position of the separation surface RS of the bonding substrate S detected from the image captured by the camera 431. The separation surface height detection unit 105 detects the change in position of the separation surface RS of the bonding substrate S based on a specific position of the bonding substrate S. For example, in the case where the bonding substrate S is a semiconductor wafer, the position of the notch is used as a reference. Based on the position of the notch, the change in height of the separation surface RS of the bonding substrate S is detected in association with the separation angle from the position of the notch. In order to detect the amount of change in the height of the separation surface RS of the bonding substrate S, it is necessary to detect the height position of the separation surface RS by more than one revolution. However, by using the position of the notch as a reference, the amount of one revolution of the rotating bonding substrate S can be easily determined.

[0084] The control device 100 includes a calculation unit 104, which calculates the movement amount of the nozzle 30 based on the height of the separation surface RS and the rotation angle of the bonding substrate S, referring to the value stored in the separation surface height storage unit 102c. The calculation unit 104 also calculates the movement amount of the nozzle 30 based on the tilt of the ejected fluid stored in the tilt storage unit 102b, and the distance from the nozzle 30's outlet to any processing position on the separation surface RS. A nozzle height correction unit 106 calculates a correction amount for the height of the nozzle 30 based on changes in the height of the separation surface RS. The nozzle height correction unit 106 outputs a control signal to the nozzle movement unit 40 based on the movement amount of the nozzle 30 calculated by the calculation unit 104 and the calculated nozzle height correction amount.

[0085] The control device 100 includes a separation status determination unit 107 that determines the separation status based on images captured by the camera 431. The separation status determination unit 107 determines the extent of the separation process by comparing reference images of each stage of the separation status pre-stored in the storage unit 102 with images captured by the camera 431. More specifically, during the separation process, fluid intrudes into the bonding surfaces Sa1 and Sb2 of the first substrate Sa and the second substrate Sb, causing the recess between the first substrate Sa and the second substrate Sb to enlarge, i.e., the separation surface RS to enlarge. Therefore, by comparing the reference image of the separation stage of the outer periphery of the bonding substrate S with the images captured by the camera 431, if the images match, it can be determined that the outer periphery has separated. Alternatively, a method can be used to calculate the distance between the two substrates in the bonding substrate S based on the images, and determine the degree of separation or separation completion if a preset threshold is exceeded. Based on the determination result, the control device 100 can control the movement of the nozzle 30, or the spraying time and intensity of the ejected fluid from the nozzle 30.

[0086] [action]

[0087] In the Figures 1-6 Based on reference Figure 7 Flowchart and Figure 8 The explanatory diagram illustrates the operation of the substrate separation device 1 as described above. Furthermore, Figure 8Ph1 is the fixed reference position of the lower surface of the first fixture 110. Ph2 is the handover position of the lower surface of the mounting portion 220 when the mounting portion 220 transfers the bonding substrate S between itself and the robotic arm M. Ps1 is the separation position of the lower surface of the second substrate Sb when the bonding substrate S is held by the first fixture 110 and the second fixture 120, and separated by the ejection of fluid from the nozzle 30 while being rotated. Ps2 is the receiving position of the upper surface of the mounting portion 220 when the positioning portion 20 receives the bonding substrate S from the holding portion 10.

[0088] First, before the substrate separation device 1 loads the bonding substrate S, it detects the tilt of the ejected fluid (S101). Figure 9 This is a flowchart illustrating the process of detecting the tilt of the ejected fluid in S101.

[0089] To detect the tilt of the ejected fluid, the imaging processing unit 101 moves the nozzle 30 to the imaging position (S201). Figure 10 As shown, the camera position is the location where the ejected fluid overlaps with the focal point of the camera 431. After the nozzle 30 moves, the photography processing unit 101 takes a picture of the fluid ejected from the nozzle 30 through the camera 431 (S202, S203).

[0090] Figure 11 (a) is an explanatory diagram showing the reflected light from the surface of the ejected fluid. (e.g.) Figure 11 As shown in (a), the illumination light from lamp 433, indicated by the black arrow, reflects positively at the center of the ejected fluid, but diffuses at the periphery. For example, in the case of an ejected fluid with a diameter of φ100 μm, the illumination light reflects positively at approximately 20 μm in the center. Therefore, when the ejected fluid illuminated by lamp 433 is photographed by camera 431, as... Figure 11 Like the image in (b), the central part is bright (high brightness) and appears in a straight line, while the peripheral part becomes a dark (low brightness) image. That is, by illuminating the ejected fluid with light using lamp 433, an image with clear contrast between the central part and the peripheral part can be captured. The captured image is stored in the image storage unit 102a (S204).

[0091] Next, the tilt detection unit 103 detects the tilt based on the captured image (S205). The tilt detection unit 103 detects the tilt of the ejected fluid based on the captured image stored in the image storage unit 102a, and stores the detected tilt in the tilt storage unit 102b (S206). Figure 11Since the central portion of the ejected fluid appears in a straight line, the tilt of the ejected fluid can be detected if the angle of inclination of the straight line is detected. As described above, the ejected fluid in the camera image has a clear contrast between the central portion and the peripheral portion, thus the tilt can be detected correctly. The process of detecting the tilt of the ejected fluid (S101) is completed through the above steps S201 to S206.

[0092] At this time, the second retainer 120 is located at a position separated from the first retainer 110. Figure 8 (A)). Additionally, the gripping part 210 and the placing part 220 are located at the junction position Ph2 and in the open position. The robotic arm M of the conveying device moves the bonding substrate S into the container and places the bonding substrate S in the placing part 220. Figure 8 (B) Step S102). The bonding substrate S is raised by the lifting of the gripping part 210. Figure 8 (C)), and then the second fixture 120 rises and contacts the lower surface of the second substrate Sb, and by raising the bonding substrate S, it is slightly separated from the mounting portion 220. Figure 8 (D) Step S103).

[0093] like Figure 3 As shown, the gripping part 210 moves to the closed position to grip the outer periphery of the bonding substrate S, positioning the central axis Cs of the bonding substrate S at the central axis Ct ( Figure 8 (E), Step S104). Afterwards, the grip 210 moves to the open position ( Figure 8 (F)), together with the mounting section 220, retreats to the handover position Ph2 ( Figure 8 (G), Step S105). Then, the second retainer 120 rises, bringing the bonding substrate S into contact with the first retainer 110 and holding it in a clamping manner, positioning the bonding substrate S at the separation position Ps1, and holding it by suction through the negative pressure of the suction hole. Figure 8 (H), Step S106).

[0094] In this state, the bonding substrate S is rotated together with the first fixture 110 by rotating the second fixture 120 (rotation process: step S107). When the bonding substrate S is held and rotated by the holding part 10, the height of the separation surface RS located on the side of the bonding substrate S may sometimes move slightly up and down due to the holding condition or deflection of the bonding substrate S. Figure 12 This is a graph representing the height of the separation surface RS relative to the rotation angle. Figure 12In this context, within rotation angles between 200° and 400°, 600° and 800°, 800° and 1000°, and 1200° and 1400°, the rotation angle represented by a straight line extending along the longitudinal axis is the rotation angle at which the notch appears after more than one rotation of the bonding substrate S. That is, the height displacement between the notch at a certain rotation angle and the next appearing notch (between the straight lines) can be determined as the height displacement of one rotation. For example... Figure 12 As shown, each time the bonding substrate S rotates one revolution, the height of the separation surface RS shifts within ±150 μm with a reference height of 0. The control device 100 corrects the position of the nozzle 30 based on the displacement of the height of the separation surface RS and controls it so that the ejected fluid does not detach from the separation surface RS.

[0095] Figure 13 This is a flowchart illustrating the process of determining the height of nozzle 30 based on the change in the height of the separation surface. When the bonding substrate S is held by the first holder 110 and the second holder 120, the imaging processing unit 101 rotates the bonding substrate S while taking a full circle of images of the outer peripheral surface CS using the camera 431 (S301). The height of the separation surface RS moves up and down due to the rotation of the bonding substrate S. By adjusting the focal length or position of the camera 431, even if the separation surface RS moves up and down, the separation surface RS will not exceed the field of view of the camera 431.

[0096] Figure 14 (b) is an explanatory diagram showing the reflected light from the bonding substrate S. (As shown) Figure 14 As shown in (b), in the illumination light from lamp 433, on the outer peripheral surface CS of the bonding substrate S, indicated by the black arrow, the illumination light is positively reflected at the portion where the illumination light is incident perpendicularly, but diffused at the curved surface portion where the outer peripheral surface CS of the bonding substrate S connects to surface Sa2. Therefore, when photographing the bonding substrate S illuminated by lamp 433, as... Figure 14 As in the photographic image (c), the central portions of the outer peripheral surfaces Sa3 of the first substrate Sa and Sb3 of the second substrate Sb in the outer peripheral surface CS of the bonding substrate S become orthogonal reflection surfaces for the reflected light, and the orthogonal reflection light is detected, resulting in a bright (high brightness) image. In contrast, the central portion between the first substrate Sa and the second substrate Sb, including the separation surface RS, becomes a dark (low brightness) image. That is, by illuminating the outer peripheral surface CS of the bonding substrate S with lamp 433, a clear image of the outer peripheral surfaces Sa3 of the first substrate Sa and Sb3 of the second substrate Sb, and the central portion sandwiched between them, can be captured. The captured image is stored in the image storage unit 102a (S302).

[0097] Next, the separation surface height detection unit 105 detects changes in the height of the separation surface RS based on the captured image (S303). The separation surface height detection unit 105 detects the area between two positively reflecting surfaces as the separation surface RS. Specifically, it detects the area several μm wide from the center between the two linear regions where positively reflected light is detected as the separation surface RS. By using a high-contrast image, the separation surface height detection unit 105 can accurately detect the height of the separation surface RS. The separation surface height detection unit 105 sends the detected height information of the separation surface RS to the separation surface height storage unit 102c. The separation surface height storage unit 2c stores the height of the separation surface RS detected from the image in a corresponding manner with the rotation angle of the bonding substrate S (S304).

[0098] The calculation unit 104 calculates the movement amount of the nozzle 30 based on the relationship between the inclination of the ejected fluid and the distance from the nozzle 30 outlet to any processing position on the separation surface RS (S305). Then, the nozzle height correction unit 106 calculates the height correction amount of the nozzle 30 (S306). Based on the movement amount of the nozzle 30 calculated by the calculation unit 104 and the calculated height correction amount of the nozzle 30, a control signal is output to the nozzle movement unit 40 (S307).

[0099] By following steps S301 to S307 above, the height position of nozzle 30 is determined. Then, nozzle 30 moves from... Figure 4 The standby position [c] shown is moved and positioned at the separation start position [a] (step 108). Based on the height position determined in S307, the height position of the nozzle 30 is also adjusted. Then, the nozzle 30 sprays fluid toward the outer periphery of the bonding substrate S (separation process: step S109). Thus, the separation of the bonding substrate S begins (step S110).

[0100] The nozzle 30 moves in a manner that follows the separation surface RS of the bonding substrate S (displacement process: step S111). Here, as described above, as the bonding substrate S rotates or the separation portion in the separation surface RS migrates, the distance of the nozzle 30 from the separation surface RS or the height of the separation surface RS changes. By changing the height of the nozzle 30 based on these changes, the ejected fluid from the nozzle 30 correctly contacts the separation surface RS, and the separation process is performed.

[0101] Then, when separation occurs and the bonding surface Sa1 corresponding to the central axis Cs separates from the bonding surface Sb1 (YES in step S112), the ejection of fluid from the nozzle 30 is stopped (step S113). By stopping the rotation of the first retainer 110 and the second retainer 120, the rotation of the bonding substrate S is stopped (step S114).

[0102] Then, the negative pressure on the first retainer 110 and the second retainer 120 is released. The second retainer 120 descends and transfers the bonding substrate S to the mounting section 220. The robotic arm M of the conveying device pushes the bonding substrate S upward from the lower surface side of the bonding substrate S, and the robotic arm M removes the bonding substrate S (see reference). Figure 8 (B) Figure 8 (A) Step S115).

[0103] [Effect]

[0104] (1) The substrate separation apparatus 1 of this embodiment includes: a holding part 10 for holding a pair of substrates bonded together to form a bonded substrate S; a rotation drive part 122 for rotating the holding part 10; a nozzle 30 for separating the bonded substrate S by spraying fluid toward the outer periphery of the rotating bonded substrate S; a nozzle moving part 40 for moving the nozzle 30; an imaging part for capturing an image of the outer peripheral surface CS of the bonded substrate S held by the holding part 10; and a control device 100 for controlling the nozzle moving part 40. Furthermore, the control device 100 controls the height adjustment mechanism 43 of the nozzle moving part 40 so that the height position of the nozzle 30 is aligned with the position of the separation surface RS of the bonded substrate S detected based on the image captured by the camera 431.

[0105] Therefore, the separation surface RS of the bonding substrate S can be accurately detected in the height direction, ensuring that the fluid always correctly contacts the separation surface RS, and reliably performing the wedge-effect-based separation process. As a result, uniform separation within the bonding substrate S can be performed, and a uniform thin film can be formed on the substrate by replicating the layer formed on one substrate to another without generating defects such as cracks or gaps in the substrate.

[0106] (2) The camera 431 takes a picture of the outer peripheral surface CS of the bonding substrate S held and rotated by the holding part 10 for more than one revolution. The control device 100 stores the rotation angle of the bonding substrate S in association with the position of the separation surface RS of the bonding substrate S detected from the image taken by the camera 431, and controls the height adjustment mechanism 43 of the nozzle moving part 40 so that the height position of the nozzle 30 is aligned with the position of the separation surface RS.

[0107] Therefore, even if the height of the bonding substrate S is slightly different at the rotation angle, the position of the separation surface RS of the bonding substrate S detected by the image captured by the camera 431 can be accurately determined, and the ejected fluid can be correctly aligned with the separation surface RS throughout the entire outer periphery of the bonding substrate S.

[0108] (3) The camera 431 captures images of the ejected fluid from the nozzle 30. The control device 100 detects the tilt of the ejected fluid from the nozzle 30 based on the image captured by the camera 431. Based on the detected tilt of the ejected fluid and the distance from the nozzle 30 outlet to the separation surface RS, the control device 100 controls the height adjustment mechanism 43 of the nozzle moving part 40 to align the height of the nozzle 30 with the height of the separation surface RS. That is, the movement of the nozzle 30 in the height direction is controlled to position the nozzle 30 at the position where the ejected fluid from the nozzle 30 touches the separation surface RS.

[0109] Therefore, even if the fluid ejected from nozzle 30 is tilted, the height adjustment mechanism 43 can be controlled to align the height of nozzle 30 with the separation surface RS, so that the fluid is correctly sprayed onto the separation surface RS taking into account the tilt amount. As a result, not only does the fluid detach from the separation surface RS, preventing separation of the bonding substrate S, but concerns about damage to the substrate due to collisions between the ejected fluid and other parts of the bonding substrate S are also eliminated. In particular, since the ejected fluid changes to a mist form as the distance from the ejection position of nozzle 30 increases, it is necessary to bring nozzle 30 closer to the separation surface RS. However, depending on the location, the distance between the fluid and the processing point based on nozzle 30 varies, and the tilt angle of the ejected fluid also changes accordingly. Therefore, detecting the tilt of the ejected fluid and setting the appropriate height of nozzle 30 accordingly is extremely effective for performing proper separation operations.

[0110] (4) A lamp 433 is provided that illuminates the outer peripheral surface CS of the bonding substrate S or the fluid ejected from the nozzle 30 in a direction coaxial with the camera 431. Therefore, the camera 431 can directly capture the reflected light in the coaxial direction, which is reflected when the illumination light from the illumination part touches the vicinity of the separation surface RS or the fluid ejected from the nozzle 30. Therefore, compared with the case of taking pictures using diffused light such as natural light or indoor light, a clearer image of the separation surface RS can be obtained, and the alignment accuracy of the nozzle 30 is improved. In addition, a large amount of illumination light or reflected light can be obtained through the lamp 433, so the accuracy or contrast of the captured image is also improved, and image analysis when detecting the position of the separation surface RS or the position of the fluid ejected from the nozzle 30 becomes easier.

[0111] (5) The camera 431 takes a picture of the outer peripheral surface CS of the bonding substrate S after separation begins and before separation is completed. The control device 100 determines the separation status based on the image taken by the camera. Therefore, in addition to determining the alignment of the nozzle 30, the camera 431 can also determine the separation status of the bonding substrate S. Based on the determination result, the control device 100 controls the injection time, intensity, position, etc. of the fluid, thereby enabling more accurate separation processing of the bonding substrate S.

[0112] [Variation Example]

[0113] This embodiment can also be applied to variations such as those shown below.

[0114] (1) such as Figure 15 As shown, a plate 432 can be provided in front of the lens of the camera 431, between the camera 431 and the bonding substrate S, and closer to the camera 431 than the nozzle 30's outlet, to prevent water droplets from adhering to the camera 431. The plate 432 is preferably made of transparent glass or a plastic plate. By providing this plate 432 to prevent water droplets from adhering to the camera unit (camera 431), water droplets can be prevented from adhering to the camera unit. In particular, when determining the separation status based on the image captured by the camera unit as described above, even when the bonding substrate S is held by the holding part 10, water droplets can be prevented from adhering to the camera unit from the ejected fluid for nozzle 30 alignment, thus preventing obstruction of subsequent imaging of the separation surface RS of the bonding substrate S. Furthermore, the plate 432 can be integrally provided with the camera 431 or can be provided as a separate component.

[0115] (2) When the tilt of the ejected fluid before reaching the separation surface RS from the tip of the nozzle 30 due to factors such as the shape of the nozzle 30 is negligible in the separation operation, it is not necessary to detect the tilt angle of the ejected fluid through image analysis as described in the embodiment. Furthermore, if the tilt angle is predetermined using simulation or calculation, this value can be reflected in the correction amount in the height direction of the separation surface RS and the nozzle 30 acquired by the camera 431. In this case, it is also not necessary to detect the tilt angle of the ejected fluid through image analysis as described in the embodiment.

[0116] (3) When the displacement of the bonding substrate S under the rotation angle is negligible in the separation operation due to factors such as the thickness, material, and diameter of the bonding substrate S, it is possible to determine the amount of movement of the nozzle 30 by taking pictures of only one point of the bonding substrate S without taking pictures of the outer peripheral surface CS for more than one week.

[0117] (4) Based on the brightness around the separation surface RS, it is not necessary to illuminate the outer periphery of the bonding substrate S or the fluid ejected from the nozzle 30 with light. In addition, the position of the lamp 433 can be appropriately changed if the position of the separation surface RS or the tilt angle of the ejected fluid can be determined from the image even if the illumination light is not coaxial with the optical axis of the camera 431.

[0118] (5) As for the camera 431, in addition to a conventional camera that takes pictures of visible light, a camera that acquires images of the separation surface RS or the fluid through infrared light, radiation, etc. can also be used. In addition to a camera that takes pictures of still images, a camera that takes pictures of moving images, such as a video camera, can also be used. Furthermore, there is no limit to the number of cameras 431. When multiple parts of the outer periphery of the bonding substrate S are detected, multiple cameras 431 can be set according to the detection positions.

[0119] (6) Alternatively, the nozzle 30 can be moved to determine the separation status based on the image captured by the camera 431, or in parallel, the progress of the separation of the bonding substrate S can be determined based on the time predetermined by experiment or simulation.

[0120] (7) When determining the separation status, the preferred timing for taking pictures based on the camera 431 is at least one or more points after the separation begins and before the separation is completed, or the pictures can be taken after the separation is completed. Alternatively, the start and completion of the separation of the bonding substrate S can be determined based on the movement position of the nozzle 30, and the separation operation can be determined based on the images taken before and after the separation.

[0121] (8) Although the embodiment shown in the figure rotates the bonding substrate S horizontally, it is also possible to rotate the bonding substrate S vertically by holding it from the left and right by the holding part 10. In this case, the nozzle moving part 40 moves the nozzle 30 in the horizontal direction, that is, in a direction parallel to the rotation center axis of the bonding substrate S, instead of adjusting the height direction as described in the embodiment.

[0122] [Other Implementation Methods]

[0123] This invention is not limited to the embodiments described above, but also includes other embodiments shown above. Furthermore, this invention also includes embodiments that combine all or any combination of the above embodiments and other embodiments. Moreover, various omissions, substitutions, and modifications can be made to these embodiments without departing from the scope of the invention, and such variations are also included in this invention.

[0124] Explanation of icon numbers

[0125] 1: Substrate separation device

[0126] 10: Maintaining section

[0127] 20: Positioning Department

[0128] 30: Nozzle

[0129] 31: Supply device

[0130] 40: Nozzle moving part

[0131] 41: Contact / Separation Mechanism

[0132] 42: Position Adjustment Mechanism

[0133] 43: Height Adjustment Mechanism

[0134] 100: Control Department

[0135] 101: Photography Processing Department

[0136] 102: Storage Department

[0137] 102a: Image storage unit

[0138] 102b: Tilt storage unit

[0139] 102c: Separation Surface Height Storage Section

[0140] 103: Tilt Detection Unit

[0141] 104: Separation Surface Height Detection Unit

[0142] 105: Computation Department

[0143] 106: Nozzle height correction section

[0144] 107: Separation Status Determination Department

[0145] 110: First Fixture

[0146] 111: First Maintenance Section

[0147] 112: Supporting institutions

[0148] 112a: Support shaft

[0149] 120: Second Fixator

[0150] 121: Second Maintenance Section

[0151] 122: Rotary drive unit

[0152] 122a: Drive shaft

[0153] 123: Loading and unloading drive unit

[0154] 210: Grip section

[0155] 220: Loading section

[0156] 230: Axial drive unit

[0157] 231: Supporting Department

[0158] 232: Force-Exerting Unit

[0159] 233: Absorption section

[0160] 240: Opening / closing drive unit

[0161] 241: Arm

[0162] 431: Camera

[0163] 432: Board

[0164] 433: Lamp

Claims

1. A substrate separation device, characterized in that... have: The holding section holds both sides of the bonding substrate formed by bonding a pair of substrates together. The rotation drive unit rotates the holding unit. The nozzle separates the bonding substrate by spraying fluid toward the outer periphery of the rotating bonding substrate; A nozzle moving part that moves the nozzle; The camera unit captures an image of the outer peripheral surface of the bonding substrate held by the holding unit; as well as The control device controls the movement of the nozzle. The control device controls the nozzle movement section to align the position of the nozzle with the position of the separation surface of the bonding substrate detected based on the image captured by the camera section.

2. The substrate separation apparatus according to claim 1, wherein, The camera unit takes pictures of the outer peripheral surface of the bonding substrate, which is held and rotated by the holding unit, at least once. The control device The rotation angle of the bonding substrate is stored in association with the position of the separation surface of the bonding substrate detected from the image captured by the camera unit, and the nozzle moving unit is controlled to align the height position of the nozzle with the position of the separation surface.

3. The substrate separation apparatus according to claim 1, wherein, The camera unit captures images of the fluid ejected from the nozzle. The control device The tilt of the fluid ejected from the nozzle is detected based on the image captured by the camera unit. Based on the detected fluid tilt and the distance from the nozzle outlet to the separation surface, the nozzle moving part is controlled to align the height of the nozzle with the height of the separation surface.

4. The substrate separation apparatus according to claim 1, comprising a light irradiation unit, wherein the light irradiation unit irradiates illumination light onto the outer periphery of the bonding substrate or onto fluid ejected from the nozzle in a direction coaxial with the imaging unit.

5. The substrate separation apparatus according to claim 1, wherein, The camera unit captures images of the outer peripheral surface of the bonding substrate after separation begins and before separation is complete. The control device determines the separation status based on the images captured by the camera unit.

6. The substrate separation apparatus according to claim 3, wherein, The camera unit captures images of the fluid ejected between the camera unit and the substrate while the bonding substrate is held in the holding portion. A plate is included between the camera unit and the bonding substrate, and further from the nozzle outlet onto the bonding substrate side, to prevent water droplets from adhering to the camera unit.

Images