Substrate processing apparatus and substrate processing method

Abstract

The substrate processing apparatus is provided with a dresser which divides the periphery of a first substrate into a plurality of end materials along the periphery of the first substrate of a superposed substrate composed of the first substrate and a second substrate which are jointed with each other, and removes the end materials. The dresser is provided with: a holding unit for holding the superposed substrate; a blade inserted between the first substrate and the second substrate; a rotation unit that rotates the blade and the first substrate relative to each other along the peripheral edge of the first substrate; and an ultrasonic vibrator that vibrates the blade.

Description

Technical Field

[0001] This disclosure relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] The apparatus described in Patent Documents 1 and 2 processes overlapping substrates. The overlapping substrates have a first substrate and a second substrate bonded together. The first substrate has a modification layer on each of a first dividing surface that radially divides the first substrate and on each of a plurality of second dividing surfaces that extend radially outward from the first dividing surface. The apparatus described above removes the modification layer by dividing the periphery of the first substrate into a plurality of end pieces.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2020 / 105483

[0006] Patent Document 2: International Publication No. 2020 / 246214 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] One aspect of this disclosure provides a technique for suppressing the situation where end-materials are not removed and remain when the periphery of a substrate is divided into multiple end-materials for removal.

[0009] Solution for solving the problem

[0010] One aspect of the substrate processing apparatus disclosed herein includes a trimming machine that removes a plurality of end pieces along the periphery of an overlapping substrate composed of a first substrate and a second substrate joined together. The trimming machine includes: a holding section for holding the overlapping substrate; a blade inserted between the first substrate and the second substrate; a rotating section for rotating the blade relative to the first substrate along the periphery of the first substrate; and an ultrasonic transducer for vibrating the blade.

[0011] Invention Effects

[0012] According to one aspect of this disclosure, it is possible to suppress the situation where end materials are not removed and remain when the periphery of the substrate is divided into multiple end materials for removal. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view showing a substrate processing apparatus according to one embodiment.

[0014] Figure 2 This is a cross-sectional view showing an example of an overlapping substrate after edge trimming.

[0015] Figure 3 This is a cross-sectional view showing an example of a thinned composite substrate.

[0016] Figure 4 This is a three-dimensional diagram representing an example of a blade.

[0017] Figure 5 This is a top view showing an example from the time the blade is inserted until it is pulled out.

[0018] Figure 6 It is Figure 5 A magnified view of a portion of the top view.

[0019] Figure 7 This is a top view showing an example of blade insertion.

[0020] Figure 8 This is a top view showing an example of a blade being pulled out.

[0021] Figure 9 This is a cross-sectional view showing an example of the third dividing plane.

[0022] Figure 10 This is a front view showing an example of a crusher.

[0023] Figure 11 It is along Figure 10 A cross-sectional view of the XI-XI line.

[0024] Figure 12 This is an exploded perspective view showing an example of a crusher.

[0025] Figure 13 This is a flowchart illustrating an example of when a crusher operates.

[0026] Figure 14 This is a cross-sectional view showing an example of an input machine, along... Figure 15 A cross-sectional view of the XIV-XIV line.

[0027] Figure 15 This is a top view showing an example of the arrangement of containers on the first rotating platform.

[0028] Figure 16 This is a cross-sectional view showing an example of throwing fragments into a container on a second rotating platform.

[0029] Figure 17 This is a cross-sectional view showing an example of a closed mechanism.

[0030] Figure 18 This is a cross-sectional view showing an example of an installation mechanism. Detailed Implementation

[0031] The embodiments of this disclosure will now be described with reference to the accompanying drawings. Furthermore, sometimes the same or corresponding structures are labeled with the same reference numerals in the various drawings, and descriptions are omitted. In this specification, the X-axis, Y-axis, and Z-axis are directions perpendicular to each other. The X-axis and Y-axis are horizontal directions, and the Z-axis is a vertical direction. The X-axis includes the positive X-axis direction and the direction opposite to the positive X-axis direction, i.e., the negative X-axis direction. The Y-axis includes the positive Y-axis direction and the direction opposite to the positive Y-axis direction, i.e., the negative Y-axis direction. The Z-axis includes the positive Z-axis direction and the direction opposite to the positive Z-axis direction, i.e., the negative Z-axis direction.

[0032] Reference Figures 1-8 The following describes a substrate processing apparatus 2 according to one embodiment. The substrate processing apparatus 2 processes overlapping substrates W. The overlapping substrate W has a first substrate W1 and a second substrate W2 bonded together with each other. Figure 2 As shown, the substrate processing apparatus 2 removes the first substrate W1 by dividing its periphery W1e into multiple end pieces W1a along the periphery W1e. This process is called edge trimming. Through edge trimming, the first substrate W1 is reduced in the radial direction, and the periphery W1e of the first substrate W1 moves radially inward. The end pieces W1a are, for example, arc-shaped. Figure 3 As shown, the bevel of the first substrate W1 can be removed before the first substrate W1 is thinned, thus preventing the so-called blade edge ( Figure 3 The generation of fragments (shown by the dashed line in the middle).

[0033] The first substrate W1, for example, sequentially comprises a semiconductor substrate, a device layer, and a bonding layer. The semiconductor substrate is, for example, a silicon wafer or a compound semiconductor wafer. The device layer is, for example, an electronic circuit. The bonding layer is, for example, an oxide layer. The oxide layer is, for example, a silicon oxide layer. The silicon oxide layer is, for example, formed of tetraethyl orthosilicate (TEOS). The second substrate W2, similarly to the first substrate W1, sequentially comprises, for example, a semiconductor substrate, a device layer, and a bonding layer. Alternatively, the second substrate W2 may not have a device layer.

[0034] The overlapping substrate W is obtained by bonding the bonding layers of the first substrate W1 and the second substrate W2 together, with the bonding layers of the second substrate W2 facing each other. After bonding the first substrate W1 and the second substrate W2, a modification layer M is formed on the first substrate W1. The modification layer M is formed, for example, by a laser processing apparatus. The laser processing apparatus irradiates a laser beam onto the semiconductor substrate from the side opposite to the device layer, forming a focal point of the laser beam inside the semiconductor substrate, and forming the modification layer M at the focal point.

[0035] exist Figure 5The first dividing surface D1 and the plurality of second dividing surfaces D2 shown are each formed with a plurality of modified layers M. The first dividing surface D1 divides the first substrate W1 radially. The first dividing surface D1 is a circumferential surface along the periphery W1e of the first substrate W1. The plurality of second dividing surfaces D2 extend radially outward from the first dividing surface D1. In this embodiment, the number of second dividing surfaces D2 is four, but any two or more are acceptable, for example, eight. During the formation of the modified layers M, cracks CR are generated that connect the modified layers M to each other. Edge trimming can be performed starting from the modified layers M.

[0036] Alternatively, it could be in Figure 9 Multiple modified layers M are also formed on the third dividing surface D3 shown. The third dividing surface D3 divides the first substrate W1 in the thickness direction. Multiple modified layers M are formed on the third dividing surface D3 at intervals along the circumferential and radial directions of the first substrate W1, and are arranged in a concentric circle or spiral shape. The first substrate W1 can be divided in the thickness direction starting from the modified layers M, which allows the first substrate W1 to be thinned. In addition, if the first substrate W1 is thinned by grinding, the modified layers M may not need to be formed on the third dividing surface D3.

[0037] like Figure 1 As shown, the substrate processing apparatus 2 includes, for example, a trimmer 10, a shredder 20, an input machine 30, and a control circuit 90. The trimmer 10 performs edge trimming. The shredder 20 shreds the end material W1a into multiple fragments W1b (see reference). Figure 11 The feeding machine 30 feeds fragment W1b into the container (see reference). Figure 14 In addition, without the crusher 20, the feeder 30 directly feeds the end material W1a into the container.

[0038] The control circuit 90 is, for example, a computer, including an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. The storage unit 92 stores programs for controlling various processes executed in the substrate processing apparatus 2. The control circuit 90 controls the operation of the substrate processing apparatus 2 by causing the arithmetic unit 91 to execute the programs stored in the storage unit 92.

[0039] The control circuit 90 includes electronic circuits such as a CPU, FPGA (Field Programmable Gate Array), or ASIC (Application Specific Integrated Circuit), and executes various control actions described in this application specification by executing instruction codes stored in memory or by designing circuits for special purposes.

[0040] Next, refer to again Figures 1-8 An example of a dressing machine 10 will be described. The dressing machine 10 includes a holding part 11, a rotating part 12, and a blade 13. The holding part 11 holds the overlapping substrate W. The holding part 11 holds the overlapping substrate W horizontally, for example, with the first substrate W1 facing upward. The holding part 11 includes, for example, a holding disc. The rotating part 12 rotates the blade 13 relative to the first substrate W1 along the periphery W1e of the first substrate W1. The rotating part 12 includes, for example, a motor. In this embodiment, the rotating part 12 rotates the overlapping substrate W together with the holding part 11 without rotating the blade 13, but it is also possible to rotate the blade 13 without rotating the holding part 11. In the latter case, the blade 13 rotates about the center of the first substrate W1. The rotating part 12 may also be a multi-joint robot. The blade 13 is inserted between the first substrate W1 and the second substrate W2. The blade 13 does not perform cutting on the first substrate W1. By inserting the blade 13, the crack CR extends from the modified layer M. As a result, edge trimming of the first substrate W1 can be performed.

[0041] like Figure 4 As shown, the blade 13 can be plate-shaped. The blade 13 has a horizontal upper surface 13a and a horizontal lower surface 13b. The blade 13 may also have a first inclined surface 13c and a second inclined surface 13d at its tip (i.e., the blade tip) in the insertion direction. Both the first inclined surface 13c and the second inclined surface 13d can be planar. The tip of the first inclined surface 13c has a straight line 13e, described later. The tip of the second inclined surface 13d has a tapered line 13f, described later.

[0042] like Figure 5 and Figure 6 As shown, when viewed from the thickness direction of the overlapping substrate W (from the positive Z-axis side to the negative Z-axis side), the blade 13 has a straight line 13e and a tapered line 13f at its tip (i.e., blade tip) in the insertion direction. The straight line 13e is orthogonal to the radial direction of the overlapping substrate W. The tapered line 13f extends radially outward from the overlapping substrate W as it moves upstream of the rotation direction of the overlapping substrate W from one end of the straight line 13e. The tapered line 13f can be inclined relative to the straight line 13e; in this embodiment, it is a straight line, but it can also be a curve, or a combination of a straight line and a curve. The second inclined surface 13d can be a curved surface instead of a plane, or it can be a combination of a plane and a curved surface.

[0043] like Figure 6 As shown by the solid line in the image, the tip of the blade 13 has a straight line 13e, thus, as... Figure 6Compared to the case where the blade tip of the blade 13 has a rounded curve, as shown by the double-dotted line, the contact area between the blade 13 and the overlay substrate W can be increased. With the same force pressing the blade 13 against the overlay substrate W, a larger contact area results in lower pressure on the overlay substrate W. Therefore, by having a straight line 13e at the blade tip of the blade 13, the pressure acting on the overlay substrate W can be reduced.

[0044] In addition, such as Figure 6 As shown in solid lines, the blade tip of blade 13 has a tapered line 13f. Therefore, compared to the case with only a straight line 13e, as it moves downstream in the rotational direction of the overlapping substrate W, the first substrate W1 can separate from the second substrate W2 more and more slowly, suppressing bending of the end piece W1a during removal. When the end piece W1a bends at a position away from the second dividing surface D2, it is difficult to remove the remaining portion of the end piece W1a. The tapered line 13f prevents the end piece W1a from remaining unremoved.

[0045] Control circuit 90 performs the following controls: such as Figure 7 As shown, insert the blade 13 at the position where it is separated upstream from the second dividing surface D2 in the rotational direction of the overlapping substrate W; and as shown Figure 8 As shown, the blade 13 is pulled out at a position where it has separated from the second dividing surface D2 in the rotational direction downstream of the overlapping substrate W. The control circuit 90, while rotating the first substrate W1 and pressing the blade 13 against it, moves the blade 13 forward and backward in a manner that avoids the second dividing surface D2. Assuming that when the blade 13 encounters the second dividing surface D2, an impact occurs because a modified layer M is formed on the second dividing surface D2. If this impact is large, the following problems may occur: Undesirable cracks may occur, and the end pieces W1a may fall off at unexpected locations. Multiple adjacent end pieces W1a may fall off and become blocked while still connected, without being separated by the second dividing surface D2. The lifespan of the blade 13 may be shortened. According to this embodiment, the control circuit 90 moves the blade 13 forward and backward in a manner that avoids the second dividing surface D2, thus solving these problems.

[0046] like Figure 5 As shown, the trimming machine 10 may also include an edge detector 14. The edge detector 14 detects the periphery W1e of the first substrate W1 held in the holding portion 11. The edge detector 14 may include, for example, an image sensor 14a, which captures an image of the periphery W1e of the first substrate W1. Alternatively, a displacement sensor or the like may be used instead of the image sensor 14a.

[0047] The edge detector 14 sends its detection results (e.g., image data captured by the camera sensor 14a) to the control circuit 90. The detection results of the edge detector 14 are used, for example, to (A) detect the position of the cut W1n in the rotational direction of the overlapping substrate W, (B) detect the eccentricity (i.e., rotational jitter) between the holding part 11 and the overlapping substrate W, or (C) confirm whether the removal of the end material W1a is complete. (A) and (B) are performed before edge trimming, and (C) is performed after edge trimming. The detection performed before edge trimming is called pre-inspection. The detection performed after edge trimming is called post-inspection.

[0048] The control circuit 90 can detect the position of the second dividing surface D2 by detecting the position of the cut W1n, and can control the insertion and withdrawal positions of the blade 13. In addition, the control circuit 90 can control the X-axis position of the blade 13 for each end piece W1a by detecting the eccentricity (i.e., rotational jitter) between the holding part 11 and the overlapping substrate W, and can suppress the variation of the insertion amount of the blade 13.

[0049] Furthermore, by confirming whether the removal of the end material W1a is complete, the control circuit 90 can determine the quality of the overlapping substrate W after edge trimming. If the removal of the end material W1a is incomplete, i.e., if the end material W1a remains, the control circuit 90 can also change the conditions for the next and subsequent edge trimming (e.g., the insertion amount of the blade 13 or the output of the ultrasonic transducer 15, which will be described later).

[0050] like Figure 1 As shown, the trimming machine 10 includes an ultrasonic transducer 15. The ultrasonic transducer 15 vibrates the blade 13. The ultrasonic transducer 15 includes, for example, a piezoelectric element. By vibrating the blade 13, the force pressing the blade 13 against the overlapping substrate W can be reduced, cracking at undesirable locations can be suppressed, and residual end material W1a can be prevented from being removed. Preferably, the ultrasonic transducer 15 vibrates the blade 13 in the insertion direction (positive X-axis direction) and the withdrawal direction (negative X-axis direction). Compared to vibrating the blade 13 in the thickness direction (positive Z-axis direction and negative Z-axis direction) of the overlapping substrate W, defects at the interface between the first substrate W1 and the second substrate W2 during blade insertion can be suppressed.

[0051] The trimming machine 10 includes a moving part 16. The moving part 16 moves the blade 13 in the insertion direction (positive X-axis direction) and the withdrawal direction (negative X-axis direction). The moving part 16 can also move the blade 13 in the thickness direction (positive Z-axis direction or negative Z-axis direction) of the overlapping substrate W, so that the tip of the blade 13 is inserted into the interface between the first substrate W1 and the second substrate W2. The moving part 16, for example, moves the blade 13 together with the ultrasonic transducer 15. The moving part 16 may also have an elastic body such as a spring to absorb rotational vibrations of the overlapping substrate W caused by the eccentricity between the holding part 11 and the overlapping substrate W. The spring is disposed between a drive source such as a motor and the ultrasonic transducer 15.

[0052] The control circuit 90 can also perform the following control: changing the output of the ultrasonic transducer 15 when the blade 13 is inserted and withdrawn. For example, the control circuit 90 can also perform the following control: making the output of the ultrasonic transducer 15 larger when the blade 13 is withdrawn than the output of the ultrasonic transducer 15 when the blade 13 is inserted. If the output of the ultrasonic transducer 15 is smaller when the blade 13 is inserted, the impact on the overlapping substrate W due to the vibration of the blade 13 can be suppressed when the tip of the blade 13 is inserted between the first substrate W1 and the second substrate W2. On the other hand, if the output of the ultrasonic transducer 15 is larger when the blade 13 is withdrawn, the end material W1a is more likely to break at the second dividing surface D2.

[0053] The control circuit 90 can also perform the following control: during the period from inserting the blade 13 to removing the blade 13, the output of the ultrasonic transducer 15 is lower than the output of the ultrasonic transducer 15 when the blade 13 is removed. This can suppress the formation of cracks at unwanted locations during the period from insertion to removal, and can prevent incomplete removal of the end material W1a.

[0054] The control circuit 90 can also perform the following control: sequentially increase the output of the ultrasonic transducer 15 when inserting the blade 13, during the period from inserting the blade 13 to removing the blade 13, and when removing the blade 13. Alternatively, during the period from inserting the blade 13 to removing the blade 13, make the output of the ultrasonic transducer 15 larger than the output of the ultrasonic transducer 15 when inserting the blade 13, but smaller than the output of the ultrasonic transducer 15 when removing the blade 13.

[0055] The trimming machine 10 includes a cup 18. When viewed from the thickness direction of the overlapping substrate W held by the holding part 11, the cup 18 surrounds the entire periphery W1e of the overlapping substrate W, and the cup 18 is used to recover the end material W1a. The cup 18 has, for example, a vertical cylindrical portion 18a and a tapered cylindrical portion 18b that tapers towards the lower end from the lower end of the cylindrical portion 18a. The cylindrical portion 18a has an inner diameter larger than the diameter of the overlapping substrate W. The end material W1a is conveyed from the cup 18 to the shredder 20.

[0056] Next, refer to Figures 10-12An example of a pulverizer 20 is described below. Figure 10 For ease of explanation, the following is omitted: Figure 11 and Figure 12 The illustration shows the housing 25. The shredder 20 shreds the end material W1a along its original periphery W1e into multiple fragments W1b. That is, the shredder 20 shreds the end material W1a into multiple fragments W1b along its length. The volume of each fragment W1b is no larger than the volume of the end material W1a. Therefore, for example, it is possible to contain the fragments W1b in a container with high density (e.g., ...). Figure 14 The container C1 shown can reduce the frequency of changing between full and empty containers. The shredder 20 preferably cuts off the end material W1a instead of machining it. Cutting reduces dust generation compared to machining.

[0057] The pulverizer 20 includes, for example, a rotating shaft 21, a drive source 22 for rotating the rotating shaft 21, and a rotating roller 23 that rotates together with the rotating shaft 21. The rotating roller 23 has a cylindrical shape. The outer circumferential surface of the rotating roller 23 has annular grooves 23a and receiving grooves 23b. The annular grooves 23a are arranged in a ring along the rotation direction of the rotating roller 23. Multiple annular grooves 23a are spaced apart along the axial direction (X-axis direction) of the rotating shaft 21. The interval between two adjacent annular grooves 23a is shorter than the length of the end material W1a. The receiving groove 23b is formed across multiple annular grooves 23a and is used to receive the end material W1a. The receiving groove 23b is straight in this embodiment, but it can also be curved. The shape of the receiving groove 23b can be appropriately selected according to the shape of the end material W1a. Multiple receiving grooves 23b can also be spaced apart along the rotation direction of the rotating roller 23.

[0058] The crusher 20 has fixed blades 24 in each of the multiple annular grooves 23a. The fixed blades 24 are spaced apart along the axial direction (X-axis direction) of the rotation axis 21, similar to the annular grooves 23a. Figure 11 As shown, the fixed blade 24 is fixed to the housing 25 such that it rotates together with different rotation axes 21. The fixed blade 24 is, for example, a vertical plate, with a notch 24a at the center of its upper end, and blade tips 24b and 24c separated by the notch 24a. The rotation axis 21 is inserted into the notch 24a. The blade tips 24b and 24c may have a cross-sectional shape that tapers towards the top.

[0059] Furthermore, the fixed blade 24 can also be a straight rod, and there are no particular limitations on the structure of the fixed blade 24. The housing 25 houses the rotating roller 23 in a rotatable manner. In the housing 25, a plurality of insertion slots 25a are provided at intervals along the axial direction (X-axis direction) of the rotation axis 21. A fixed blade 24 is inserted into and fixed in each of the plurality of insertion slots 25a. The fixed blade 24 is inserted into the interior of the housing 25 from below. A discharge port 25b for discharging debris W1b is provided on the lower surface of the housing 25. The discharge port 25b can also open wider towards the bottom.

[0060] End material W1a is supplied from above the pulverizer 20 and is received in the receiving groove 23b of the rotating roller 23. Then, the end material W1a is clamped by the rotating roller 23 and the blade tip 24b of the fixed blade 24 and cut into multiple fragments W1b. The length of each fragment W1b is equal to the distance between two adjacent fixed blades 24. Multiple fragments W1b fall by gravity from the discharge port 25b on the lower surface of the housing 25 and are supplied to the feeder 30. Additionally, if fragments W1b clog the rotating shaft 21, preventing it from rotating, the drive source 22 can reverse the rotation of the rotating shaft 21. With the blade tips 24b and 24c positioned across the rotating shaft 21, the end material W1a can be pulverized regardless of the rotation direction of the rotating shaft 21.

[0061] Next, refer to Figure 13 An example of when the crusher 20 will be operated will be explained. Figure 13 Steps S101 to S109 shown are performed under the control of control circuit 90. First, a conveying device (not shown) moves the overlapping substrate W into substrate processing device 2 (step S101). Then, control circuit 90 stops crusher 20 (step S102). Steps S101 and S102 can be performed either first or simultaneously.

[0062] Next, the control circuit 90 performs a pre-check (step S103) while the shredder 20 is stopped. For example, the edge detector 14 detects the periphery W1e of the first substrate W1 held in the holding portion 11. The detection result of the edge detector 14 is used, for example, to detect (A) the position of the cut W1n in the rotation direction of the overlapping substrate W, and (B) to detect the eccentricity (i.e., rotational jitter) between the holding portion 11 and the overlapping substrate W.

[0063] Next, the control circuit 90 operates the pulverizer 20 (step S104). For example, the drive source 22 causes the rotating roller 23 to rotate together with the rotating shaft 21. While the pulverizer 20 is operating, the control circuit 90 performs edge trimming via the trimmer 10 (step S105). The end material W1a generated during edge trimming is fed to the pulverizer 20 and pulverized into multiple fragments W1b. After S105, the control circuit 90 stops the pulverizer 20 again (step S106).

[0064] Next, the control circuit 90 performs a post-check (step S107) while the shredder 20 is stopped. For example, the edge detector 14 detects the periphery W1e of the first substrate W1 held in the holding portion 11. The detection result of the edge detector 14 is used, for example, to confirm whether the removal of the (C) end material W1a is complete.

[0065] Next, the control circuit 90 restarts the shredder 20 (step S108). Additionally, a conveying device (not shown) removes the overlapping substrate W from the substrate processing apparatus 2 (step S109). Steps S108 and S109 can be performed either first or simultaneously.

[0066] As described above, the control circuit 90 stops the shredder 20 when the edge detector 14 detects the periphery W1e of the first substrate W1. For example, the control circuit 90 stops the shredder 20 when the camera sensor 14a captures an image of the periphery W1e of the first substrate W1. This prevents the edge detector 14 from becoming less accurate due to vibration of the shredder 20, thus improving its detection accuracy. Furthermore, the processing of the image captured by the camera sensor 14a can also be performed during the operation of the shredder 20.

[0067] The control circuit 90 performs the following control: When edge trimming is performed using the trimmer 10, the pulverizer 20 is operated. Whenever the trimmer 10 produces end material W1a, the pulverizer 20 pulverizes the end material W1a into multiple fragments W1b. This prevents the end material W1a from clogging the pulverizer 20. Preferably, the control circuit 90 keeps the pulverizer 20 operating continuously from the start of edge trimming until the end of edge trimming.

[0068] The control circuit 90 performs the following control: The shredder 20 is operated from the time of the post-inspection of the k-th first substrate W1 (step S107) until the time of the pre-inspection of the (k+1)-th first substrate W1 (step S103). This reduces the amount of unshredded end material W1a remaining before the edge trimming of the (k+1)-th first substrate W1 (step S105), and prevents end material W1a from clogging the shredder 20.

[0069] Next, refer to Figures 14-18An example of the feeding machine 30 will be described. The feeding machine 30 feeds fragment W1b into container C1. Container C1 is used to contain fragment W1b. When container C1 is filled with fragment W1b, a cover C2 is installed on the top of container C1. Afterwards, container C1, which has been filled with fragment W1b, is replaced with an empty container C1. The replacement of container C1 can be done manually or automatically. Alternatively, in the absence of the shredder 20, the feeding machine 30 can directly feed end material W1a into container C1. Container C1 can also contain end material W1a.

[0070] The feeding machine 30 has a first rotating platform 31 supporting multiple containers C1 and a first rotation drive source 32 for rotating the first rotating platform 31. The feeding machine 30 sequentially feeds fragments W1b into the multiple containers C1. Figure 15 As shown, multiple containers C1 are arranged at intervals around the rotation center line of the first rotating platform 31. Each container C1 is moved sequentially to position A1 where the fragment W1b is inserted, position A2 where the cover C2 is installed, and position A3 where an empty container C1 is replaced. Furthermore, there are no particular limitations on the arrangement and number of A1, A2, and A3.

[0071] As described above, the feeding machine 30 uses the first rotary table 31 to sequentially feed fragments W1b into multiple containers C1. Therefore, during the feeding of fragments W1b into a container C1, a cover C2 can be installed on the top of the container C1 filled with fragments W1b, or the container C1 filled with fragments W1b can be replaced with an empty container C1, thereby improving the operating efficiency of the feeding machine 30.

[0072] The feeding machine 30 may also have a second rotating platform 33 supporting multiple containers C1 below the first rotating platform 31, and a second rotation drive source 34 for rotating the second rotating platform 33. This allows for an increase in the number of containers C1. The rotation center line of the second rotating platform 33 can be arranged on the same straight line as the rotation center line of the first rotating platform 31. Although not shown, the multiple containers C1 are arranged at intervals around the rotation center line of the second rotating platform 33. Each of the multiple containers C1 sequentially moves to position A1 for feeding fragment W1b, position A2 for installing the cover C2, and position A3 for replacing with an empty container C1.

[0073] In the case where the feeder 30 has a second rotary table 33, a piping 35 is provided on the first rotary table 31. The piping 35 is used to convey fragment W1b from above to below on the first rotary table 31. The piping 35 rotates together with the first rotary table 31. Figure 16 As shown, while the piping 35 is stopped at a specific position A1, the feeder 30 feeds fragment W1b into container C1 on the second rotary table 33 via the piping 35.

[0074] like Figure 17As shown, the feeding machine 30 may also have a piping 36 for conveying fragments W1b, and a sealing mechanism 37 for sealing the passage of fragments W1b from the lower end of the piping 36 to the upper end of the container C1. The sealing mechanism 37 prevents the fragments W1b from scattering. The piping 36 and the sealing mechanism 37 may also be respectively positioned above and below the first rotating platform 31. Furthermore, as... Figure 16 As shown, the sealing mechanism 37 can also seal the passage of fragment W1b from the lower end of pipe 36 to the upper end of pipe 35. In the absence of the shredder 20, the sealing mechanism 37 seals the passage of end material W1a.

[0075] Furthermore, piping 36 and sealing mechanism 37 can also be used in combination with a first sliding table (not shown) instead of the first rotating table 31. In the latter case, multiple containers C1 are arranged at intervals along the sliding direction of the first sliding table. Alternatively, a second sliding table can be provided below the first sliding table instead of the second rotating table 33. In this case, piping 35 conveys fragment W1b from above to below the first sliding table.

[0076] The sealing mechanism 37 includes, for example, a bellows 37a, a tapered member 37b, and a lifting mechanism 37c. The bellows 37a is located at the lower end of the piping 36. The tapered member 37b is located below the bellows 37a and is formed to taper at its front end as it moves upwards. The lifting mechanism 37c extends or retracts the bellows 37a by raising or lowering the tapered member 37b. The lifting mechanism 37c is, for example, an elevator.

[0077] Alternatively, a ring 37d may be provided at the lower end of the bellows 37a. The weight of the ring 37d causes the bellows 37a to extend downward. Preferably, the ring 37d is inserted into the interior of the container C1 in a manner that prevents the fragment W1b from leaking to the outside of the container C1. A stop C3 is provided on the inner circumference of the container C1, and the ring 37d rests on the stop C3.

[0078] Multiple protrusions 37e are provided on the inner circumference of ring 37d. The multiple protrusions 37e are spaced apart in such a way that the fragment W1b can pass through them. The multiple protrusions 37e surround the lifting shaft 37f. A tapered member 37b is provided at the lower end of the lifting shaft 37f. The tapered member 37b is located below the multiple protrusions 37e.

[0079] When the lifting mechanism 37c raises the conical member 37b together with the lifting shaft 37f, the conical member 37b pushes the multiple protrusions 37e upwards. As a result, the ring 37d is removed above the container C1, allowing the container C1 to move. Additionally, the upward pushing of the ring 37d causes the bellows 37a to contract upwards.

[0080] On the other hand, when the lifting mechanism 37c lowers the tapered member 37b together with the lifting shaft 37f, the multiple protrusions 37e and rings 37d descend by gravity. The protrusions 37e and rings 37d continue to descend until the rings 37d hit the stop C3. Then, the lifting mechanism 37c lowers the tapered member 37b together with the lifting shaft 37f to separate the tapered member 37b from the protrusions 37e.

[0081] With the conical member 37b separated from the protrusion 37e, fragment W1b is introduced into container C1. Fragment W1b falls along the inclined surface of the conical member 37b and is dispersedly contained inside container C1. The conical member 37b can suppress the deflection of fragment W1b. The conical member 37b is disposed inside container C1.

[0082] The feeder 30 may also have a level sensor 38 at the lower end of the conical member 37b. The level sensor 38 detects the level of the height of the fragment W1b contained inside the container C1. The level sensor 38 may be, for example, a proximity sensor or a distance sensor. If the level of the height of the fragment W1b is detected instead of its weight, the fragment W1b will not overflow from the container C1 even if its bulk density changes. Additionally, in the absence of the shredder 20, the level sensor 38 detects the height of the end piece W1a.

[0083] When the height of fragment W1b reaches a threshold, the feeding machine 30 rotates either the first rotary table 31 or the second rotary table 33 to move the container C1. Alternatively, sliding the first sliding table or the second sliding table can be used instead of rotating the first rotary table 31 or the second rotary table 33. In short, the container C1 can be moved. The feeding machine 30 sequentially feeds fragment W1b into multiple containers C1. Furthermore, even without the level sensor 38, the movement of the container C1 can be based on factors such as the number of overlapping substrates W processed.

[0084] like Figure 18 As shown, the feeding machine 30 may also have a mounting mechanism 39 for mounting a cover C2 on the upper end of the container C1. By mounting the cover C2 on the upper end of the container C1, leakage of fragments W1b from the inside of the container C1 to the outside can be suppressed. The mounting mechanism 39 may include, for example, a box 39a, a conveying arm 39b, an adsorption pad 39c, a lifting mechanism 39d, and a sliding mechanism 39e.

[0085] Box 39a houses multiple lids C2 in a stacked manner. The lids C2 are housed in a through-hole that extends vertically through box 39a. A conveying arm 39b receives the lids C2 from box 39a directly below it and moves them directly above container C1. An adsorption pad 39c adsorbs the lids C2 directly above container C1. A lifting mechanism 39d raises and lowers the adsorption pad 39c. The lifting mechanism 39d is, for example, an elevator. A sliding mechanism 39e slides the conveying arm 39b horizontally. The sliding mechanism 39e includes, for example, a guide that guides the conveying arm 39b horizontally and a motor that slides the conveying arm 39b along the guide.

[0086] The conveyor arm 39b receives the lid C2 that has detached from the box 39a directly below the box 39a. The height of the conveyor arm 39b is set so that multiple lids C2 will not detach from the box 39a simultaneously. Then, the conveyor arm 39b moves the received lid C2 directly above the container C1. At this point, the conveyor arm 39b supports the lid C2 destined for the next container C1 in a manner that prevents it from detaching from the box 39a.

[0087] Next, the lifting mechanism 39d lowers the adsorption pad 39c and presses it against the cover C2. Then, as the adsorption pad 39c adsorbs the cover C2, the lifting mechanism 39d raises the adsorption pad 39c. This separates the cover C2 from the conveying arm 39b. In this state, the conveying arm 39b slides back to its original position. Simultaneously, the cover C2, intended for installation in the next container C1, detaches from the box 39a and is placed on the conveying arm 39b.

[0088] Next, the lifting mechanism 39d lowers the adsorption pad 39c again and installs the cover C2 onto the container C1. The outer diameter of the cover C2 can be smaller than the inner diameter of the container C1, and the cover C2 can also be placed on the stop C3. Alternatively, the outer diameter of the cover C2 can be larger than the inner diameter of the container C1. Afterward, when the adsorption pad 39c releases its adsorption from the cover C2, the lifting mechanism 39d raises the adsorption pad 39c back to its original position.

[0089] Subsequently, the feeding machine 30 rotates either the first rotating platform 31 or the second rotating platform 33 to move the container C1. Alternatively, the first sliding platform or the second sliding platform can be slid instead of rotating the first rotating platform 31 or the second rotating platform 33. In short, the container C1 can be moved. The feeding machine 30 sequentially feeds fragments W1b into multiple containers C1.

[0090] The substrate processing apparatus and substrate processing method disclosed herein have been described above, but this disclosure is not limited to the embodiments described above. Various changes, modifications, substitutions, additions, deletions, and combinations can be made within the scope of the claims. These, of course, also fall within the technical scope of this disclosure.

[0091] This application claims priority based on Japanese Patent Application No. 2023-169273, filed with the Japan Patent Office on September 29, 2023, the entire contents of which are incorporated herein by reference.

[0092] Explanation of reference numerals in the attached figures

[0093] 2: Substrate processing apparatus; 10: Dressing machine; 11: Holding part; 12: Rotating part; 13: Blade; 15: Ultrasonic transducer; W: Overlapping substrate; W1: First substrate; W1a: End material; W2: Second substrate.

Claims

1. A substrate processing apparatus comprising a trimming machine that removes a plurality of end pieces by slicing the periphery of the first substrate of an overlapping substrate composed of a first substrate and a second substrate joined together, wherein... The trimming machine includes: a holding part for holding the overlapping substrates; a blade inserted between the first substrate and the second substrate; a rotating part for rotating the blade relative to the first substrate along the periphery of the first substrate; and an ultrasonic transducer for vibrating the blade.

2. The substrate processing apparatus according to claim 1, wherein, The ultrasonic transducer causes the blade to vibrate in both the insertion and extraction directions.

3. The substrate processing apparatus according to claim 1 or 2, wherein, The rotating part causes the overlapping substrate to rotate together with the holding part. When viewed from the thickness direction of the overlapping substrate, the blade has a straight line orthogonal to the diameter direction of the overlapping substrate at its front end in the insertion direction, and a tapered line that moves radially outward toward the overlapping substrate from one end of the straight line toward the upstream side of the rotation direction of the overlapping substrate.

4. The substrate processing apparatus according to claim 1 or 2, wherein, The trimming machine includes a movable part that moves the blade in an insertion direction and a withdrawal direction. The substrate processing apparatus includes a control circuit that controls the position of the blade and the output of the ultrasonic transducer. The control circuit performs the following control: changes the output of the ultrasonic transducer when the blade is inserted and withdrawn.

5. The substrate processing apparatus according to claim 1 or 2, wherein, The trimming machine includes a movable part that moves the blade in an insertion direction and a withdrawal direction. The substrate processing apparatus includes a control circuit that controls the position of the cutting blade. The first substrate has a modified layer on each of a first dividing surface that radially divides the first substrate and a plurality of second dividing surfaces that extend radially outward from the first dividing surface. The first substrate is divided with the modified layers as the starting point. The rotating part causes the overlapping substrate to rotate together with the holding part. The control circuit performs the following control: inserting the blade at a position where it is separated upstream of the second segment facing the overlapping substrate in the direction of rotation; and removing the blade at a position where it is separated downstream of the second segment facing the overlapping substrate in the direction of rotation.

6. The substrate processing apparatus according to claim 1 or 2, wherein, The substrate processing apparatus includes a shredder that shreds the end material into multiple fragments.

7. The substrate processing apparatus according to claim 6, wherein, The crusher includes a rotating shaft and a rotating roller that rotates together with the rotating shaft. The outer peripheral surface of the rotating roller has a plurality of annular grooves spaced apart along the axial direction of the rotation axis, and a receiving groove formed across the plurality of annular grooves for receiving the end material. The crusher has fixed blades in each of the multiple annular grooves, each with a different rotating shaft that rotates together.

8. The substrate processing apparatus according to claim 6, wherein, The trimming machine includes an edge detector that detects the periphery of the first substrate held in the holding portion. The substrate processing apparatus includes a control circuit that controls the operation and stop of the pulverizer. The control circuit performs the following control: when the edge detector detects the periphery of the first substrate, it stops the crusher from operating.

9. The substrate processing apparatus according to claim 8, wherein, The edge detector has a camera sensor that captures images of the periphery of the first substrate. The control circuit performs the following control: when the camera sensor is used to photograph the periphery of the first substrate, the crusher is stopped from operating.

10. The substrate processing apparatus according to claim 8, wherein, The control circuit performs edge trimming by dividing the periphery of the first substrate into multiple end pieces using the trimming machine, and performs the following control: during the edge trimming, the shredder is operated.

11. The substrate processing apparatus according to claim 8, wherein, The control circuit performs edge trimming by dividing the periphery of the first substrate into multiple end pieces using the trimming machine, a pre-inspection by detecting the periphery of the first substrate using the edge detector before the edge trimming, and a post-inspection by detecting the periphery of the first substrate using the edge detector after the edge trimming. The control circuit performs the following control: during the period from the post-inspection of the kth first substrate to the pre-inspection of the (k+1)th first substrate, the shredder is operated.

12. The substrate processing apparatus according to claim 1 or 2, wherein, The substrate processing apparatus includes an input machine that feeds fragments or the end material obtained by crushing the end material into a container.

13. The substrate processing apparatus according to claim 12, wherein, The feeding machine has a first rotating platform supporting a plurality of containers, and the feeding machine sequentially feeds the fragments or the end material into the plurality of containers.

14. The substrate processing apparatus according to claim 13, wherein, The feeding machine has a second rotating platform below the first rotating platform that supports a plurality of the containers. The first rotary table is provided with piping for conveying the fragments or end pieces from above to below the first rotary table.

15. The substrate processing apparatus according to claim 12, wherein, The feeding machine includes: piping for conveying the fragments or the end pieces; and a sealing mechanism for sealing the passage of the fragments or the end pieces from the lower end of the piping to the upper end of the container. The sealing mechanism includes: a bellows disposed at the lower end of the piping; a tapered member disposed below the bellows, the tapered member being tapered at the front end as it moves upward; and a lifting mechanism that extends or retracts the bellows by raising or lowering the tapered member.

16. The substrate processing apparatus according to claim 15, wherein, The feeding machine has a level sensor at the lower end of the conical member, which detects the level of the height of the fragment or the end material contained inside the container.

17. The substrate processing apparatus according to claim 12, wherein, The feeding machine has an installation mechanism for installing a cover on the upper end of the container.

18. A substrate processing method, comprising the following steps: The periphery of the first substrate is divided into multiple end pieces for removal using the substrate processing apparatus according to claim 1 or 2.

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