Laser focusing method and related equipment thereof

Abstract

The invention relates to the technical field of laser processing, in particular to a laser focusing method and related equipment thereof. The laser focusing method comprises the following steps: acquiring a first calibration parameter and a second calibration parameter; processing offset parameters under the condition that the to-be-processed object is arranged on the processing platform surface are obtained, wherein the processing offset parameters comprise a Z-axis offset value and a light spot center distance associated with the to-be-processed object; based on the machining offset parameter, the first calibration parameter and the second calibration parameter, the first distance between the machining plane of the to-be-machined object and a preset machining datum plane in the Z-axis direction is determined, and the preset machining datum plane is a platform plane of the machining platform plane at the preset Z-axis height; determining a laser processing height based on the calibration information of the laser focal length, the first distance and a preset Z-axis height; and the laser module is controlled to be guided to the laser machining height so that the machining plane of the object to be machined can be machined. According to the invention, automatic focusing of the laser focal length can be realized.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, specifically to a laser focusing method and related equipment. Background Technology

[0002] Laser processing equipment consists of modules such as a laser component and a processing platform. The height (focal length) between the laser component and the surface of the processing platform has a significant impact on the processing effect. When processing objects of different heights, the focal length is passively altered. To ensure processing results, related technologies typically require the user to manually adjust the focal length to ensure the laser emitted from the laser module is properly focused on the processing plane of the object. However, manual focal length adjustment is prone to errors, time-consuming, labor-intensive, and highly dependent on the user's skill level. Summary of the Invention

[0003] In view of the above, embodiments of this application provide a laser focusing method and related equipment, which can realize automatic focusing of the laser focal length.

[0004] In a first aspect, embodiments of this application provide a laser focusing method applied to a laser processing equipment. The laser processing equipment includes a vision module and a laser module. The laser module is pre-calibrated with a laser focal length, and the vision module can move with the movement of a Z-axis component within the laser processing equipment. The laser focusing method includes: acquiring first calibration parameters and second calibration parameters. The first and second calibration parameters are determined based on multiple first spot position data or multiple second spot position data. Each first spot position data indicates the position of the center point of a spot image at a processing plane height, and each second spot position data indicates the position of the center point of a spot image at a Z-axis height. The light spot image is acquired by the vision module; processing offset parameters are obtained when an object to be processed is placed on the processing platform surface, the processing offset parameters include the Z-axis offset value and the center distance of the light spot associated with the object to be processed; based on the processing offset parameters, the first calibration parameter and the second calibration parameter, a first distance in the Z-axis direction between the processing plane of the object to be processed and a preset processing reference plane is determined, the preset processing reference plane being the platform surface of the processing platform at a preset Z-axis height; based on the calibration information of the laser focal length, the first distance and the preset Z-axis height, the laser processing height is determined; the laser module is controlled to guide to the laser processing height to process the processing plane of the object to be processed.

[0005] The embodiments of this application can automatically complete laser focusing at any height of the object being processed, thereby ensuring that the laser emitted by the laser module can be focused on the processing plane, guaranteeing the laser processing effect, and solving the problem that related technologies require manual adjustment of the laser focal length, which is time-consuming, labor-intensive, and has a large adjustment error.

[0006] In some embodiments, the center distance of the light spot associated with the object to be processed is determined by: acquiring a first light spot image and a second light spot image, wherein the first light spot image is a light spot image of the auxiliary positioning light source illuminating the processing plane of the object to be processed, acquired by the vision module, and the second light spot image is a light spot image of the auxiliary positioning light source illuminating the processing platform surface, acquired by the vision module; determining the image coordinate distance between the center point of the light spot in the first light spot image and the center point of the light spot in the second light spot image; and using the image coordinate distance as the center distance of the light spot.

[0007] In some embodiments, determining the first distance in the Z-axis direction between the processing plane of the object to be processed and the preset processing reference plane based on the processing offset parameter, the first calibration parameter, and the second calibration parameter includes: determining the height of the object to be processed based on the spot center distance, the first calibration parameter, and the second calibration parameter; and determining the first distance in the Z-axis direction between the processing plane of the object to be processed and the preset processing reference plane based on the height of the object to be processed and the Z-axis offset value.

[0008] In some embodiments, determining the first distance in the Z-axis direction between the processing plane of the object to be processed and the preset processing reference surface based on the height of the object to be processed and the Z-axis offset value includes: acquiring third spot position data, wherein the third spot position data indicates the position of the spot center point of the third spot image, and the third spot image is a spot image of the auxiliary positioning light source illuminating the preset processing reference surface acquired by the vision module; acquiring fourth spot position data, wherein the fourth spot position data indicates the position of the spot center point of the fourth spot image, and the fourth spot image is a spot image of the auxiliary positioning light source illuminating the processing platform surface acquired by the vision module; determining the offset direction of the processing platform surface relative to the preset processing reference surface based on the third spot position data and the fourth spot position data; and determining the first distance in the Z-axis direction between the processing plane of the object to be processed and the preset processing reference surface based on the offset direction, the height of the object to be processed, and the Z-axis offset value.

[0009] In some embodiments, determining a first distance in the Z-axis direction between the processing plane of the object to be processed and the preset processing reference surface based on the offset direction, the height of the object to be processed, and the Z-axis offset value includes: if the offset direction indicates that the processing platform surface is offset in a first direction relative to the preset processing reference surface, the difference between the Z-axis offset value and the height of the object to be processed is used as the first distance; if the offset direction indicates that the processing platform surface is offset in a second direction relative to the preset processing reference surface, the sum of the Z-axis offset value and the height of the object to be processed is used as the first distance, wherein the first direction is opposite to the second direction.

[0010] In some embodiments, determining the laser processing height based on the calibration information of the laser focal length, the first distance, and the preset Z-axis height includes: determining the coordinate offset value of the laser focal length relative to the preset processing reference surface based on the calibration information of the laser focal length; and determining the laser processing height based on the coordinate offset value, the first distance, and the preset Z-axis height.

[0011] In some embodiments, the laser processing equipment includes multiple auxiliary positioning light sources for forming light spots. The light spots in the light spot image at each processing plane height and the light spots in the light spot image at each Z-axis height are formed by the same auxiliary positioning light source. One auxiliary positioning light source corresponds to one laser processing height. Controlling the laser module to guide it to the laser processing height includes: determining a target laser processing height based on the multiple laser processing heights corresponding to the multiple auxiliary positioning light sources; and controlling the laser module to guide it to the target laser processing height.

[0012] Secondly, embodiments of this application also provide a laser focusing device for a laser processing equipment. The laser processing equipment includes a vision module and a laser module. The laser module is pre-calibrated with a laser focal length, and the vision module can move with the movement of the Z-axis component in the laser processing equipment. The laser focusing device includes: a first acquisition unit, used to acquire first calibration parameters and second calibration parameters. The first and second calibration parameters are determined based on multiple first spot position data or multiple second spot position data. Each first spot position data indicates the position of the center point of the spot image at a processing plane height, and each second spot position data indicates the position of the center point of the spot image at a Z-axis height. The spot image is acquired by the vision module. The system comprises: a second acquisition unit, configured to acquire processing offset parameters when an object to be processed is placed on the processing platform surface, the processing offset parameters including a Z-axis offset value and a spot center distance associated with the object to be processed; a first determination unit, configured to determine a first distance in the Z-axis direction between the processing plane of the object to be processed and a preset processing reference surface based on the processing offset parameters, the first calibration parameters, and the second calibration parameters, the preset processing reference surface being the platform surface of the processing platform at a preset Z-axis height; a second determination unit, configured to determine a laser processing height based on the calibration information of the laser focal length, the first distance, and the preset Z-axis height; and a control unit, configured to control the laser module to be guided to the laser processing height to process the processing plane of the object to be processed.

[0013] Thirdly, embodiments of this application also provide an electronic device, the electronic device including a processor and a memory, the memory being used to store instructions, and the processor being used to call the instructions in the memory, causing the electronic device to perform the laser focusing method as described in the first aspect.

[0014] Fourthly, embodiments of this application also provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the laser focusing method as described in the first aspect.

[0015] One of the above technical solutions has the following advantages or beneficial effects: it can automatically complete laser focusing at any height of the object being processed, thereby ensuring that the laser emitted by the laser module can be focused on the processing plane, guaranteeing the laser processing effect, and solving the problem that related technologies require manual adjustment of the laser focal length, which is time-consuming, labor-intensive, and has a large adjustment error. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the laser processing equipment provided in the embodiments of this application.

[0017] Figure 2 This is a flowchart illustrating the steps of a laser focusing method provided in an embodiment of this application.

[0018] Figure 3 This is a schematic diagram of a mathematical model constructed based on the position of the auxiliary positioning light source, the position of the camera module, and the position of the processing platform surface, according to an embodiment of this application.

[0019] Figure 4 A flowchart illustrating a step for determining a first distance based on the height of the object to be processed and the Z-axis offset value, as provided in an embodiment of this application.

[0020] Figure 5 This is a schematic diagram of the functional modules of the laser focusing device of a laser processing equipment provided in an embodiment of this application.

[0021] Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0022] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0023] Numerous specific details are set forth in the following description to provide a full understanding of this application. The described embodiments are only a part of, and not all, of the embodiments of this application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0024] It should be further noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0025] In this application, "at least one" means one or more, and "more than one" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and drawings of this application are used to distinguish similar objects, not to describe a specific order or sequence. In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0026] Laser processing equipment can be used to process the surface of objects, such as laser marking equipment and laser engraving equipment. Taking surface pattern processing as an example, laser processing equipment can process squares, crosses, and other patterns on the surface of objects. During processing, the height of the laser component relative to the processing platform surface (laser focal length) has a significant impact on the processing effect. Processing objects at different heights passively alters the focal length. To ensure processing results, related technologies typically require the user to manually adjust the laser focal length to ensure the laser emitted from the laser module is properly focused on the processing plane of the object. However, manual focal length adjustment is prone to errors, time-consuming, labor-intensive, and highly dependent on the user's skill level.

[0027] Based on this, embodiments of this application provide a laser focusing method and related equipment, which can automatically adjust the laser focal length based on the height of the object to be processed, without requiring user intervention in adjusting the laser focal length, thus ensuring the effectiveness of laser processing.

[0028] The laser focusing method of this application can be applied to laser processing equipment.

[0029] like Figure 1As shown, the laser processing equipment 100 may include a laser module 101, a processing platform 102, a vision module 103, an auxiliary positioning light source 104, and a control module 105. The laser module 101 emits laser light, which can be used to process the surface of an object to be processed. The processing platform 102 is used to support the object to be processed; the surface of the processing platform 102 used to support the object to be processed is referred to as the processing platform surface. The auxiliary positioning light source 104 can be used to irradiate the surface of the object to be processed or the processing platform surface, forming a light spot. There can be one or more auxiliary positioning light sources 104, and the positioning optical path of the auxiliary positioning light source 104 can form a preset acute angle with the plane where the processing platform 102 is located; for example, the preset acute angle can be 30°, 60°, etc. The vision module 103 can be used to acquire the light spot formed by the illumination of the auxiliary positioning light source 104, obtaining a light spot image. The light spot image can be used to adjust the laser focal length; for example, the vision module 103 may include a camera module. The control module 105 serves as the control center of the laser processing equipment 100 and can be used to control related functional modules. The control module 105 can also be used to execute the laser focusing method of this application.

[0030] For example, the control module 105 may include a chip with data processing / control functions, which may be at least one of a processor, a microprogrammed control unit (MCU), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), etc.

[0031] In some embodiments, the laser processing equipment 100 further includes a Z-axis component that can move up and down in the Z-axis direction. For example, the laser module 101, the vision module 103, and the auxiliary positioning light source 104 can all move up and down with the up and down movement of the Z-axis component. The XY axes can be constructed with the processing platform surface, and the direction perpendicular to the processing platform surface is defined as the Z-axis.

[0032] Before the laser processing equipment 100 leaves the factory, the laser focal length and camera module can be calibrated, and the relevant calibration data and offset data are stored in the configuration file. During the actual engraving process, after the user places objects of different heights on the processing platform, the laser processing equipment 100 can automatically adjust the laser module 101 to a suitable focal length by triggering the "auto-focusing" function of the laser processing equipment 100, so as to process the objects.

[0033] In some embodiments, to improve the autofocus effect, the auxiliary positioning light source 104 may also include a grating and a filter (e.g., a bandpass filter), and the filter may be installed in front of the lens of the camera module.

[0034] The steps and flow of the laser focusing method provided in the embodiments of this application are described in detail below.

[0035] Please refer to the following: Figure 2 As shown, Figure 2 This is a flowchart illustrating the steps of an embodiment of the laser focusing method provided in this application. The laser focusing method can be applied to laser processing equipment. Depending on different needs... Figure 2 The order of steps in the flowchart shown can be changed, and some steps can be omitted or combined.

[0036] The laser focusing method may include the following steps: Step S101: Obtain the first calibration parameter and the second calibration parameter.

[0037] In some embodiments, the first calibration parameter and the second calibration parameter may be determined based on a plurality of first spot position data or a plurality of second spot position data. Each first spot position data indicates the position of the center point of the spot image at a processing plane height, and each second spot position data indicates the position of the center point of the spot image at a Z-axis height. The spot image may be acquired by a vision module.

[0038] In some embodiments, the first spot position data may refer to the spot position data obtained under the machining height calibration method. The second spot position data may refer to the spot position data obtained under the Z-axis calibration method. That is, the embodiments of this application determine the first calibration parameter and the second calibration parameter through the machining height calibration method or the Z-axis calibration method.

[0039] Before performing machining height calibration or Z-axis calibration, any suitable surface can be selected as the preset machining reference surface. For example, the preset machining reference surface can be defined as the plane where the machining platform surface is located when the Z-axis coordinate is the preset Z-axis height z0. In this embodiment, the value of z0 is not limited.

[0040] Machining height calibration can be achieved in the following ways: (a1). Prepare objects to be processed or simulated objects of objects to be processed with different heights h, for example, h∈[0,h]. 11 , h 12 , …, h 1n ], h 11 ~h 1nThe height can be any suitable value (i.e., within the height range of objects that the laser processing equipment can process). h=0 indicates that no object to be processed is placed or a simulated object to be processed is on the processing platform. One image of the light spot formed by the auxiliary positioning light source can be acquired for each corresponding height. If the laser processing equipment includes m auxiliary positioning light sources, m images of the light spot formed by the auxiliary positioning light sources can be acquired for each corresponding height, with one image corresponding to one auxiliary positioning light source. That is, the height sequence is n+1 heights, and for each auxiliary positioning light source, the camera module can acquire n+1 images of the light spot.

[0041] In some embodiments, for a height h=0, the camera module acquires a light spot image of the light spot formed by the auxiliary positioning light source illuminating the processing platform surface; for a height h=h 11 The camera module captures data from an auxiliary positioning light source at a height of h. 11 The image of the light spot formed on the upper surface (processing plane) of the object to be processed or the simulated object to be processed, for a height h = h 1n The camera module captures data from an auxiliary positioning light source at a height of h. 1n A light spot image formed on the upper surface of the object to be processed or a simulated object of the object to be processed.

[0042] (a2) The acquired spot images are divided into multiple spot image sequences. Each spot image sequence corresponds to one auxiliary positioning light source. That is, for a certain spot image sequence, the spot images in that sequence originate from the illumination of the same auxiliary positioning light source. For the spot images in the spot image sequence, the positions of the spot center points in the spot images are extracted using a preset image processing algorithm / software to form an h-spot center point sequence. Each item in the h-spot center point sequence is the position (x11, y11) of the spot center point, where x11 is the coordinate of the X-axis and y11 is the coordinate of the Y-axis. This yields m h-spot center point sequences, each including the positions (x11, y11) of the spot center points (n+1). The h-spot center point sequences can be used to calculate the first and second calibration parameters. For m h-spot center point sequences, m sets of the first and second calibration parameters can be calculated, meaning that one auxiliary positioning light source corresponds to one set of the first and second calibration parameters.

[0043] Z-axis calibration can be achieved in the following ways: (b1). The offset of the machining platform surface relative to a preset machining reference surface in the Z direction can be simulated by the movement height of the Z-axis component in the Z direction. For example, the movement height h'∈[0, h 21 , h 22 , …, h 2n ], h21 ~h 2n The height can be any suitable value (i.e., within the movable height range of the Z-axis component), with h'=0 representing the initial height. Each corresponding moving height allows the acquisition of one image of the light spot formed by the auxiliary positioning light source. If the laser processing equipment includes m auxiliary positioning light sources, each corresponding moving height can acquire m images of the light spot formed by the auxiliary positioning light source, with one image corresponding to one auxiliary positioning light source. That is, the moving height sequence is n+1 heights, and for each auxiliary positioning light source, the camera module can acquire n+1 images of the light spot.

[0044] In some embodiments, when the movement height h'=0, the camera module acquires a light spot image of the light spot formed by the auxiliary positioning light source illuminating the machining platform surface at the initial height of the Z-axis component. When the movement height h'= h 21 The camera module captures the auxiliary positioning light source at the Z-axis position h. 21 The image of the light spot formed by the illumination of the processing platform surface at a certain height, for a moving height h' = h 2n The camera module captures the auxiliary positioning light source at the Z-axis position h. 2n Image of the light spot formed by irradiating the processing platform surface at a certain height.

[0045] (b2) The acquired spot images are divided into multiple spot image sequences. Each spot image sequence corresponds to one auxiliary positioning light source. That is, for a certain spot image sequence, the spot images in that sequence originate from the illumination of the same auxiliary positioning light source. For the spot images in the spot image sequence, the positions of the spot center points in the spot images are extracted using a preset image processing algorithm / software to form a z-spot center point sequence. Each item in the z-spot center point sequence is the position (x21, y21) of the spot center point, thus obtaining m z-spot center point sequences. Each z-spot center point sequence includes the positions (x21, y21) of the spot center points. The z-spot center point sequences can be used to calculate the first calibration parameter and the second calibration parameter. For m z-spot center point sequences, z combinations of the first calibration parameter and the second calibration parameter can be calculated. That is, one auxiliary positioning light source can be used to calculate a set of first calibration parameters and second calibration parameters.

[0046] In some embodiments, a system can be established based on the position of the auxiliary positioning light source, the position of the camera module, and the position of the processing platform surface, such as... Figure 3 The mathematical model shown Assuming the preset reference machining surface is the plane of the machining platform surface with Z-axis coordinate z=z0, the preset reference machining surface is at the same height as the plane where the laser focal length is located when the laser module is working.

[0047] Assuming the height of the object to be processed is H1, it can be based on Figure 3 The mathematical model shown, along with the pinhole model of the camera module, leads to the following formula: D(cc) / B=H1 / H2; (Pixel(cc)) / D(cc)=F / (H2–H1); Combining these two equations, we can obtain the following equation 1: H1 = (Pixel(cc) × H2) / (Pixel(cc) + F × B / H2), Where D(cc) is the physical distance between the center point of the light spot when z = z0 + H1 and the center point of the light spot when z = z0 in the physical world, (Pixel(cc)) is the image coordinate distance between the center point of the light spot image acquired when z = z0 + H1 and the center point of the light spot image acquired when z = z0, B is the physical horizontal distance between the center of the CCD (charge-coupled device) of the camera module and the center of the auxiliary positioning light source, F is the Z-axis component of the focal length of the camera module, H2–H1 can be represented as the height of the triangle formed by the center of the CCD of the camera module, the center of the auxiliary positioning light source and the center point of the light spot on the processing plane of the object to be processed, and H2 can be represented as the height of the triangle formed by the center of the CCD of the camera module, the center of the auxiliary positioning light source and the center point of the light spot on the preset reference processing surface.

[0048] In some embodiments, formula 1 can be rewritten as formula 2 as follows: H1=(a×Pixel(cc)) / (b+Pixel(cc)), where a is the first calibration parameter and b is the second calibration parameter, that is, a=H2 and b=F×B / H2 are defined. Subsequently, the values ​​of H2 and F×B can be calculated by calibrating the values ​​of a and b.

[0049] In some embodiments, after obtaining Formula 2, the values ​​of a and b can be determined by the h-spot center point sequence or the z-spot center point sequence. For example, the h-spot center point sequence contains the positions of the spot center points at multiple heights, that is, any two sequences in the h-spot center point sequence correspond to the positions of the spot center points at two different heights. The difference between the two heights corresponding to these two sequences can be equivalent to H1, and Pixel(cc) can be the image coordinate distance between the spot center points corresponding to these two sequences.

[0050] Step S102: Obtain the machining offset parameters when the object to be machined is set on the machining platform surface. The machining offset parameters include the Z-axis offset value and the distance between the center of the light spot associated with the object to be machined.

[0051] In some embodiments, the Z-axis offset value can refer to the offset value of the Z coordinate of the acquired machining platform surface relative to a preset machining reference surface. The Z coordinate of the machining platform surface can be acquired before the machining operation is performed. The Z coordinate of the preset machining reference surface is a fixed value z0, and thus the Z-axis offset value can be obtained.

[0052] In some embodiments, the spot center distance associated with the object to be processed can refer to the spot center distance associated with the height of the object to be processed, specifically the image coordinate distance between the spot center point on the processing plane and the spot center point on the processing platform surface. This spot center distance can be determined in the following ways: c1. Acquire a first light spot image and a second light spot image. The first light spot image is the light spot image of the auxiliary positioning light source illuminating the processing plane of the object to be processed, which is acquired by the vision module. The second light spot image is the light spot image of the auxiliary positioning light source illuminating the processing platform surface, which is acquired by the vision module. c2. Determine the image coordinate distance between the center point of the first spot image and the center point of the second spot image, and use this image coordinate distance as the center distance of the spot.

[0053] Step S103: Based on the machining offset parameter, the first calibration parameter, and the second calibration parameter, determine the first distance in the Z-axis direction between the machining plane of the object to be machined and the preset machining reference plane.

[0054] In some embodiments, laser focusing is performed to ensure that the laser focal length of the laser module on the current processing plane (i.e., the processing plane of the object to be processed) matches the laser focal length on the processing reference plane used during laser focal length calibration. The offset of the processing plane of the object to be processed relative to the preset processing reference plane in the Z-axis direction can be obtained by determining a first distance between the processing plane of the object to be processed and the preset processing reference plane. This facilitates subsequent determination of the laser processing height at which the laser module focuses the laser emitted from the laser module onto the current processing plane.

[0055] In some embodiments, after obtaining the center distance of the light spot associated with the object to be processed, the center distance of the light spot can be used as the Pixel(cc) value and substituted into Formula 2. Based on the previously calibrated first calibration parameter and second calibration parameter, the height of the object to be processed is determined. Then, based on the determined height of the object to be processed and the Z-axis offset value, the first distance between the processing plane of the object to be processed and the preset processing reference plane in the Z-axis direction is further determined.

[0056] Step S104: Determine the laser processing height based on the laser focal length calibration information, the first distance, and the preset Z-axis height.

[0057] In some embodiments, the laser processing equipment 100 has completed the calibration of the laser focal length before leaving the factory. The calibration information of the laser focal length is known information. The calibration information may include the processing reference surface information during the laser focal length calibration. For example, the processing reference surface may be defined in the case of z = 0 or other preset values ​​during the laser focal length calibration process.

[0058] In this embodiment, a preset machining reference surface is defined based on a preset Z-axis height z = z0, and z0 can be a relatively arbitrary value. That is, there can be a coordinate offset between the preset machining reference surface and the machining reference surface used for laser focal length calibration.

[0059] The laser processing height is determined based on the laser focal length calibration information, a first distance, and a preset Z-axis height. Specifically, this includes: determining the coordinate offset of the laser focal length relative to a preset processing reference plane (z = z0) based on the laser focal length calibration information; and determining the laser processing height based on the coordinate offset, the first distance, and the preset Z-axis height. For example, the laser processing height can be determined using the following formula: target_z = z0 + offset_h + LIGHT_OFFSET, where target_z is the laser processing height, offset_h is the first distance, LIGHT_OFFSET is the coordinate offset, and z0 is the preset Z-axis height.

[0060] Step S105: Control the laser module to the laser processing height to process the processing plane of the object to be processed.

[0061] In some embodiments, after obtaining the laser processing height, the laser module can be controlled to be guided to the laser processing height so that the laser module processes the processing plane of the object to be processed at this laser processing height, thereby ensuring that the laser emitted by the laser module can be focused on the processing plane and ensuring the laser processing effect.

[0062] In some embodiments, if the laser processing equipment includes multiple auxiliary positioning light sources, the values ​​of a and b can be calibrated based on the h-spot center point sequence or z-spot center point sequence corresponding to each auxiliary positioning light source, thereby calculating multiple laser processing heights. Each auxiliary positioning light source corresponds to one laser processing height. The laser module is then controlled to guide the laser processing height. Specifically, the process may include: determining a target laser processing height based on the multiple laser processing heights corresponding to the multiple auxiliary positioning light sources; and controlling the laser module to guide the laser processing height to the target laser processing height. For example, the target laser processing height can be the average value, median value, or other value determined based on the multiple laser processing heights. This application embodiment does not limit this.

[0063] Compared with the prior art, the embodiments of this application have at least the following advantages: The embodiments of this application can automatically complete laser focusing at any height of the object being processed, thereby ensuring that the laser emitted by the laser module can be focused on the processing plane, guaranteeing the laser processing effect, and solving the adjustment error that exists in related technologies by manually adjusting the laser focal length.

[0064] In some embodiments, for the machining platform surface currently bearing the object to be processed, the Z-axis offset value may be an offset in the same direction as the height direction of the object to be processed (the height direction is in the same direction as the positive Z-axis direction), or an offset in the opposite direction to the height direction. Therefore, determining the first distance in the Z-axis direction between the machining plane of the object to be processed and the preset machining reference surface based on the height of the object to be processed and the Z-axis offset value may include two cases.

[0065] Please refer to Figure 4 , Figure 4 This illustrates how to further determine the first distance in the Z-axis direction between the machining plane of the object to be machined and the preset machining reference plane, based on the height and Z-axis offset value of the object. Specifically, this may include the following steps: Step S201: Obtain the position data of the third spot. The position data of the third spot indicates the position of the center point of the spot in the third spot image. The third spot image is the spot image of the auxiliary positioning light source illuminating the preset processing reference surface, which is acquired by the vision module.

[0066] In some embodiments, a third light spot image can be obtained by controlling an auxiliary positioning light source to illuminate a preset processing reference surface to form a light spot, and by controlling a vision module to acquire an image of the light spot illuminated by the auxiliary positioning light source on the preset processing reference surface. The position of the center point of the light spot in the third light spot image is extracted by a preset image processing algorithm / software to obtain the position data of the third light spot.

[0067] Step S202: Obtain the position data of the fourth spot. The position data of the fourth spot indicates the position of the center point of the spot in the fourth spot image. The fourth spot image is the spot image of the auxiliary positioning light source illuminating the processing platform surface, which is acquired by the vision module.

[0068] In some embodiments, a fourth light spot image can be obtained by controlling an auxiliary positioning light source to illuminate the current processing platform surface to form a light spot, and by controlling a vision module to acquire an image of the light spot illuminated by the auxiliary positioning light source on the current processing platform surface. The position of the center point of the light spot in the fourth light spot image is extracted by a preset image processing algorithm / software to obtain the position data of the fourth light spot.

[0069] Step S203: Based on the position data of the third spot and the position data of the fourth spot, determine the offset direction of the machining platform surface relative to the preset machining reference surface.

[0070] In some embodiments, the offset direction of the processing platform surface relative to a preset processing reference surface can be determined by comparing the position data of the third spot and the position data of the fourth spot. For example, the coordinate offset direction of the center point of the third spot image relative to the center point of the fourth spot image can be determined by comparing the X coordinate of the third spot position data with the X coordinate of the fourth spot position data, and the Y coordinate of the third spot position data with the Y coordinate of the fourth spot position data. Then, the offset direction of the processing platform surface relative to the preset processing reference surface can be determined based on this coordinate offset direction.

[0071] Step S204: Based on the offset direction, the height of the object to be processed, and the Z-axis offset value, determine the first distance in the Z-axis direction between the surface to be processed of the object to be processed and the preset processing reference surface.

[0072] In some embodiments, the first distance between the surface to be processed of the object to be processed and the preset processing reference surface in the Z-axis direction can be calculated by two calculation factors: the height of the object to be processed and the Z-axis offset value. However, the offset direction of the processing platform surface relative to the preset processing reference surface affects the calculation rules used to calculate the first distance.

[0073] For example, if the offset direction indicates that the current machining platform surface is offset in a first direction relative to the preset machining reference surface, the difference between the Z-axis offset value and the height of the object to be processed is used as the first distance; if the offset direction indicates that the current machining platform surface is offset in a second direction relative to the preset machining reference surface, the sum of the Z-axis offset value and the height of the object to be processed is used as the first distance, and the first direction is opposite to the second direction.

[0074] For example, the first direction is downward offset, that is, if the current processing platform surface is offset downward relative to the preset processing reference surface, the first distance = Z-axis offset value - height of the object to be processed; the second direction is upward offset, that is, if the current processing platform surface is offset upward relative to the preset processing reference surface, the first distance = Z-axis offset value + height of the object to be processed.

[0075] In some embodiments, if the processing plane of the object to be processed is not a horizontal plane, taking a curved surface as an example, the fluctuation range of the laser focal length for curved surface processing is z_low to z_upper, where z_low is the lowest point of the curved surface and z_upper is the highest point of the curved surface. Taking automatic focusing of the laser focal length at the lowest point z_low as an example, let the Z-axis offset value offset_z = z_low - z0. The Z-axis offset value and the position of the center point of the z_low spot can be used in the calculation. For example, the position of the center point of the z_low spot can be used to determine the center distance of the spot associated with the object to be processed. z_low - z0 is the Z-axis offset value, which facilitates determining the first distance in the Z-axis direction between the surface to be processed (the lowest point z_low) and the preset processing reference surface of the object to be processed. When processing z_upper, the Z-axis is moved by the offset amount z_upper - z_low.

[0076] In some embodiments, the laser processing height can be determined with z=z_low as the bottom surface and z_upper as the top surface. Then, the laser processing height of all points can be obtained by performing surface modeling and interpolation on other points. Subsequently, surface processing can be performed based on each laser processing height.

[0077] Please see Figure 5 This application provides a laser focusing device 200 for a laser processing equipment. For example... Figure 5 As shown, the laser focusing device 200 of the laser processing equipment includes: The first acquisition unit 201 is used to acquire a first calibration parameter and a second calibration parameter. The first calibration parameter and the second calibration parameter are determined based on multiple first spot position data or multiple second spot position data. Each first spot position data indicates the position of the center point of the spot image at a processing plane height, and each second spot position data indicates the position of the center point of the spot image at a Z-axis height. The spot image is acquired by the vision module.

[0078] The second acquisition unit 202 is used to acquire the machining offset parameters when an object to be processed is set on the machining platform surface. The machining offset parameters include the Z-axis offset value and the center distance of the spot associated with the object to be processed.

[0079] The first determining unit 203 is used to determine the first distance in the Z-axis direction between the machining plane of the object to be processed and the preset machining reference plane based on the machining offset parameter, the first calibration parameter and the second calibration parameter. The preset machining reference plane is the platform surface of the machining platform surface at the preset Z-axis height.

[0080] The second determining unit 204 is used to determine the laser processing height based on the calibration information of the laser focal length, the first distance, and the preset Z-axis height.

[0081] The control unit 205 is used to control the laser module to be guided to the laser processing height so as to process the processing plane of the object to be processed.

[0082] The aforementioned modules can be programmable software instructions stored in memory and executable by the processor. It is understood that in other embodiments, the aforementioned modules can also be program instructions or firmware embedded in the processor.

[0083] Figure 6 This is a schematic diagram of an embodiment of the electronic device of this application.

[0084] The electronic device 1000 includes a memory 1001, a processor 1002, and a computer program 1003 stored in the memory 1001 and executable on the processor 1002. The processor 1002 is used to implement the steps in the above-described laser focusing method embodiments when executing the computer program 1003.

[0085] The electronic device 1000 can be integrated into the laser processing equipment or operate independently of the laser processing equipment. It can control the laser processing equipment to perform processing by communicating with the laser processing equipment.

[0086] For example, computer program 1003 can also be divided into one or more modules / units, which are stored in memory 1001 and executed by processor 1002. The one or more modules / units can be a series of computer program instruction segments capable of performing specific functions, which describe the execution process of computer program 1003 in electronic device 1000.

[0087] Those skilled in the art will understand that the schematic diagram is merely an example of the electronic device 1000 and does not constitute a limitation on the electronic device 1000. It may include more or fewer components than shown in the diagram, or combine certain components, or different components. For example, the electronic device 1000 may also include input / output devices, network access devices, buses, etc.

[0088] Processor 1002 can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), etc. General-purpose processors can be microprocessors, single-chip microcomputers, or any conventional processor.

[0089] The memory 1001 can be used to store computer programs 1003 and / or modules / units. The processor 1002 implements various functions of the electronic device 1000 by running or executing the computer programs and / or modules / units stored in the memory 1001 and by calling data stored in the memory 1001. The memory 1001 may include high-speed random access memory, and may also include non-volatile memory, such as hard disk, RAM, plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, at least one disk storage device, flash memory device, or other non-volatile solid-state storage device.

[0090] This application also provides a computer-readable storage medium that stores computer instructions that, when executed on a laser processing device, cause the laser processing device to perform the laser focusing method described above.

[0091] If the modules / units integrated in the electronic device 1000 are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a portable hard drive, a magnetic disk, an optical disk, a computer memory, a read-only memory (ROM), a random access memory (RAM), etc.

[0092] In the several embodiments provided in this application, it should be understood that the disclosed laser processing equipment and methods can be implemented in other ways. For example, the laser focusing device embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and other division methods may be used in actual implementation.

[0093] Furthermore, the functional units in the various embodiments of this application can be integrated into the same processing unit, or each unit can exist physically separately, or two or more units can be integrated into the same unit. The integrated units described above can be implemented in hardware or in the form of hardware plus software functional modules.

[0094] Compared with the prior art, the embodiments of this application have at least the following advantages: The embodiments of this application can automatically complete laser focusing at any height of the object being processed, thereby ensuring that the laser emitted by the laser module can be focused on the processing plane, guaranteeing the laser processing effect, and solving the adjustment error that exists in related technologies by manually adjusting the laser focal length.

[0095] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The multiple units or laser focusing devices described in the laser focusing apparatus may also be implemented by the same unit or laser focusing device through software or hardware.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A laser focusing method, characterized in that, This method is applied to laser processing equipment, which includes a vision module and a laser module. The laser module is pre-calibrated with a laser focal length, and the vision module can move along with the Z-axis component of the laser processing equipment. The laser focusing method includes: A first calibration parameter and a second calibration parameter are obtained. The first calibration parameter and the second calibration parameter are determined based on multiple first spot position data or multiple second spot position data. Each first spot position data indicates the position of the center point of the spot image at a processing plane height, and each second spot position data indicates the position of the center point of the spot image at a Z-axis height. The spot image is acquired by the vision module. Obtain machining offset parameters when an object to be machined is set on the machining platform surface. The machining offset parameters include the Z-axis offset value and the center distance of the spot associated with the object to be machined. Based on the machining offset parameter, the first calibration parameter, and the second calibration parameter, a first distance in the Z-axis direction between the machining plane of the object to be processed and the preset machining reference plane is determined. The preset machining reference plane is the platform surface of the machining platform at the preset Z-axis height. Based on the calibration information of the laser focal length, the first distance, and the preset Z-axis height, the laser processing height is determined; The laser module is controlled to be guided to the laser processing height to process the processing plane of the object to be processed.

2. The laser focusing method as described in claim 1, characterized in that, The center distance of the light spot associated with the object to be processed is determined in the following way: Acquire a first light spot image and a second light spot image. The first light spot image is the light spot image of the auxiliary positioning light source illuminating the processing plane of the object to be processed, which is acquired by the vision module. The second light spot image is the light spot image of the auxiliary positioning light source illuminating the processing platform surface, which is acquired by the vision module. Determine the image coordinate distance between the center point of the first spot image and the center point of the second spot image; The image coordinate distance is used as the center distance of the light spot.

3. The laser focusing method as described in claim 1, characterized in that, The step of determining the first distance in the Z-axis direction between the machining plane of the object to be machined and the preset machining reference plane based on the machining offset parameter, the first calibration parameter, and the second calibration parameter includes: The height of the object to be processed is determined based on the center distance of the light spot, the first calibration parameter, and the second calibration parameter; Based on the height of the object to be processed and the Z-axis offset value, the first distance between the processing plane of the object to be processed and the preset processing reference plane in the Z-axis direction is determined.

4. The laser focusing method as described in claim 3, characterized in that, Determining the first distance in the Z-axis direction between the machining plane of the object to be machined and the preset machining reference plane based on the height of the object to be machined and the Z-axis offset value includes: Acquire the position data of the third spot, which indicates the position of the center point of the spot in the third spot image. The third spot image is the spot image of the auxiliary positioning light source illuminating the preset processing reference surface, which is acquired by the vision module. Acquire the position data of the fourth light spot, which indicates the position of the center point of the light spot in the fourth light spot image. The fourth light spot image is the light spot image of the auxiliary positioning light source illuminating the processing platform surface, which is acquired by the vision module. Based on the third spot position data and the fourth spot position data, the offset direction of the processing platform surface relative to the preset processing reference surface is determined; Based on the offset direction, the height of the object to be processed, and the Z-axis offset value, a first distance in the Z-axis direction between the processing plane of the object to be processed and the preset processing reference plane is determined.

5. The laser focusing method as described in claim 4, characterized in that, The step of determining the first distance in the Z-axis direction between the machining plane of the object to be machined and the preset machining reference plane based on the offset direction, the height of the object to be machined, and the Z-axis offset value includes: If the offset direction indicates that the processing platform surface is offset in a first direction relative to the preset processing reference surface, the difference between the Z-axis offset value and the height of the object to be processed is taken as the first distance; If the offset direction indicates that the machining platform surface is offset in a second direction relative to the preset machining reference surface, the sum of the Z-axis offset value and the height of the object to be processed is taken as the first distance, and the first direction is opposite to the second direction.

6. The laser focusing method as described in claim 1, characterized in that, Determining the laser processing height based on the calibration information of the laser focal length, the first distance, and the preset Z-axis height includes: Based on the calibration information of the laser focal length, the coordinate offset value of the laser focal length relative to the preset processing reference surface is determined; The laser processing height is determined based on the coordinate offset value, the first distance, and the preset Z-axis height.

7. The laser focusing method as described in claim 1, characterized in that, The laser processing equipment includes multiple auxiliary positioning light sources for forming laser spots. The laser spots in the image at each processing plane height and the laser spots in the image at each Z-axis height are formed by the same auxiliary positioning light source. Each auxiliary positioning light source corresponds to a laser processing height. Controlling the laser module to guide it to the laser processing height includes: The target laser processing height is determined based on multiple laser processing heights corresponding to multiple auxiliary positioning light sources. The laser module is controlled to be guided to the target laser processing height.

8. A laser focusing device for laser processing equipment, characterized in that, The laser processing equipment includes a vision module and a laser module. The laser module is pre-calibrated with a laser focal length, and the vision module can move along with the Z-axis component of the laser processing equipment. The laser focusing device includes: The first acquisition unit is used to acquire a first calibration parameter and a second calibration parameter. The first calibration parameter and the second calibration parameter are determined based on a plurality of first spot position data or a plurality of second spot position data. Each first spot position data indicates the position of the center point of the spot image at a processing plane height, and each second spot position data indicates the position of the center point of the spot image at a Z-axis height. The spot image is acquired by the vision module. The second acquisition unit is used to acquire the machining offset parameters when an object to be processed is set on the machining platform surface. The machining offset parameters include the Z-axis offset value and the center distance of the light spot associated with the object to be processed. The first determining unit is used to determine, based on the machining offset parameter, the first calibration parameter and the second calibration parameter, a first distance in the Z-axis direction between the machining plane of the object to be processed and a preset machining reference plane, wherein the preset machining reference plane is the platform surface of the machining platform surface at a preset Z-axis height; The second determining unit is used to determine the laser processing height based on the calibration information of the laser focal length, the first distance, and the preset Z-axis height; The control unit is used to guide the laser module to the laser processing height to process the processing plane of the object to be processed.

9. An electronic device, characterized in that, The electronic device includes a processor and a memory, the memory being used to store instructions, and the processor being used to invoke the instructions in the memory, causing the electronic device to execute the laser focusing method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the laser focusing method as described in any one of claims 1 to 7.

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