Laser processing apparatus and laser processing method

Abstract

The invention discloses a laser processing device and a laser processing method.The laser processing device comprises a light source assembly, an adjusting assembly and a field lens assembly, and the light source assembly is used for emitting a laser beam; the adjusting assembly comprises a first lens, a second lens and a driving part; a laser beam emitted by the light source assembly sequentially passes through the first lens and the second lens and then is emitted; the driving part is used for adjusting the relative position of the first lens and the second lens so as to control the emitting divergence angle of the laser beam; the field lens assembly is located on the light emitting side of the second lens and used for focusing the laser beams emitted by the second lens to the to-be-machined surface of the product. Wherein the light source assembly, the first lens, the second lens and the field lens assembly are sequentially and optically coupled to form a transmission light path for laser beam transmission. The method aims at increasing the adjusting speed so as to improve the efficiency of the machining process.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and in particular to a laser processing apparatus and a laser processing method. Background Technology

[0002] Currently, consumer-grade laser processing devices on the market require the laser beam to be precisely focused on the target processing area during laser processing to ensure uniform energy distribution and thus guarantee processing quality. However, in actual operation, the surface to be processed often has a certain height difference due to design or manufacturing processes, making it impossible to present a neat and flat surface. Therefore, the laser beam focus often deviates from the ideal position, resulting in uneven energy distribution.

[0003] In existing laser processing devices, an additional drive mechanism is usually provided to move the laser processing head vertically, thereby adjusting the height difference between the laser processing head and the product surface to keep the focus of the laser beam always on the surface of the product to be processed.

[0004] However, with this setup, whenever the height of the surface to be processed on the product changes, the drive mechanism needs to move the entire laser processing head. This part of the structure is often heavy and has high inertia. When the drive mechanism is adjusting the height, its acceleration and speed will be limited, which will slow down the entire processing process. Summary of the Invention

[0005] The main objective of this invention is to provide a laser processing apparatus and a laser processing method, which aims to accelerate the adjustment speed in order to improve the efficiency of the processing flow.

[0006] To achieve the above objectives, the present invention provides a laser processing apparatus, comprising: A light source assembly for emitting a laser beam; An adjustment assembly, comprising a first lens, a second lens, and a driving component; the laser beam emitted by the light source assembly passes sequentially through the first lens and the second lens before exiting; the driving component is used to adjust the relative positions of the first lens and the second lens to control the divergence angle of the emitted laser beam; and A field lens assembly is located on the light-emitting side of the second lens, and the field lens assembly is used to focus the laser beam emitted from the second lens onto the surface of the product to be processed.

[0007] In one embodiment, the adjustment assembly further includes a first reflector disposed between the first lens and the second lens, the first reflector being configured to reflect the laser beam emitted from the first lens to the second lens.

[0008] In one embodiment, the laser processing apparatus further includes a second reflector disposed between the light source assembly and the first lens, the second reflector being configured to reflect the laser beam emitted from the light source assembly to the first lens; The driving component drives the first lens to reciprocate between the second reflector and the first reflector.

[0009] In one embodiment, the light source assembly includes a first emitter, a second emitter, and a beam combiner. The first emitter is used to emit a first initial laser beam, the second emitter is used to emit a second initial laser beam, and the beam combiner is disposed on the light-emitting side of the first emitter and the second emitter. The second initial laser beam emitted by the second transmitter is reflected by the beam combiner to the first lens, and the first initial laser beam emitted by the first transmitter is transmitted through the beam combiner and coaxially directed towards the first lens with the reflected second initial laser beam.

[0010] In one embodiment, the light source assembly further includes a third reflector disposed between the first emitter and the beam combiner, the third reflector being configured to reflect the first initial laser beam emitted by the first emitter to the beam combiner.

[0011] In one embodiment, the first emitter and the second emitter are arranged side by side, and the light emission direction of the first emitter is the same as that of the second emitter.

[0012] In one embodiment, the field lens assembly includes a galvanometer module and a field lens module, wherein the galvanometer module is located on the light-emitting side of the second lens, and the field lens module is located between the galvanometer module and the surface to be processed; The galvanometer module includes a base, a first galvanometer, and a second galvanometer, both of which are movably mounted on the base. The laser beam emitted from the second lens passes sequentially through the first galvanometer, the second galvanometer, and the field mirror module.

[0013] In one embodiment, the side wall of the base has an inlet, and the second lens is disposed in the inlet.

[0014] This invention also proposes a laser processing method based on a laser processing apparatus, which includes a light source assembly, an adjustment assembly, and a field lens assembly. The light source assembly emits a laser beam. The adjustment assembly includes a first lens, a second lens, and a driving component. The laser beam emitted by the light source assembly passes sequentially through the first lens and the second lens before exiting. The driving component adjusts the relative positions of the first lens and the second lens to control the divergence angle of the emitted laser beam. The field lens assembly is located on the light-emitting side of the second lens and is used to focus the laser beam emitted from the second lens onto the surface of the product to be processed. The laser processing method includes: Adjust the light source assembly so that at least one laser beam is emitted along the transmission optical path; Measure the working distance between the laser processing device and the surface of the product to be processed; The distance between the first lens and the second lens is adjusted according to the second-order function relationship between the distance between the first lens and the second lens and the working distance; Adjust the rotation angles of the first and second galvanometers in the field mirror assembly to allow the laser beam to process within the working area.

[0015] In one embodiment, the step of obtaining the second-order function relationship between the distance between the first lens and the second lens and the working distance includes: Adjust the working distance wd between the laser processing device and the surface to be processed; Adjust the distance x between the first lens and the second lens so that the laser beam is focused on the surface to be processed; Repeat the above steps to obtain multiple sets of corresponding data; Based on the data, the working distance wd is fitted and its relationship with the distance x between the first lens and the second lens is wd=ax²+bx+c, where a, b and c are correlation coefficients.

[0016] The technical solution of this invention emits a laser beam through a light source assembly, and then adjusts the relative position between the first and second lenses via a driving component to change the divergence angle of the laser beam. A field lens assembly focuses the laser beam emitted from the second lens to process the surface of the product. When the working distance between the laser processing device and the surface to be processed changes, only the relative position between the first and second lenses needs to be adjusted to change the divergence angle of the laser beam, ensuring that the field lens assembly can precisely focus the laser beam onto the surface. This configuration avoids driving the entire laser processing device vertically; instead, the focus is adjusted by changing the relative position between the first and second lenses within the optical path. Because the first and second lenses are lighter, the limitations imposed by inertia are reduced, thus accelerating the adjustment speed and improving processing efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a structure of an embodiment of the laser processing apparatus provided by the present invention; Figure 2 This is another structural schematic diagram of a laser processing device; Figure 3 A flowchart of the laser processing method provided by the present invention; Figure 4 This is a partial flowchart of a laser processing method.

[0019] Explanation of icon numbers: 100. Laser processing device; 1. Light source assembly; 11. First emitter; 111. First initial laser beam; 12. Second emitter; 121. Second initial laser beam; 13. Beam combiner; 14. Third reflector; 2. Adjustment assembly; 21. First lens; 22. Second lens; 23. Drive unit; 24. Second reflector; 25. First reflector; 3. Field lens assembly; 31. Galvanometer module; 311. Base; 3111. Inlet; 312. First galvanometer; 313. Second galvanometer; 32. Field lens module; 4. Transmission optical path; 200. Surface to be processed.

[0020] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0023] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0024] Currently, consumer-grade laser processing devices on the market require the laser beam to be precisely focused on the target processing area during laser processing to ensure uniform energy distribution and thus guarantee processing quality. However, in actual operation, the surface to be processed often has a certain height difference due to design or manufacturing processes, making it impossible to present a neat and flat surface. Therefore, the laser beam focus often deviates from the ideal position, resulting in uneven energy distribution.

[0025] In existing laser processing devices, an additional drive mechanism is usually provided to move the laser processing head vertically, thereby adjusting the height difference between the laser processing head and the product surface to keep the focus of the laser beam always on the surface of the product to be processed.

[0026] However, with this setup, whenever the height of the surface to be processed on the product changes, the drive mechanism needs to move the entire laser processing head. This part of the structure is often heavy and has high inertia. When the drive mechanism is adjusting the height, its acceleration and speed will be limited, which will slow down the entire processing process.

[0027] To address the aforementioned problems, this invention proposes a laser processing apparatus 100 and a laser processing method, aiming to accelerate the adjustment speed and improve the efficiency of the processing flow.

[0028] Please see Figure 1 and Figure 2 In one embodiment, the laser processing apparatus 100 includes a light source assembly 1, an adjustment assembly 2, and a field lens assembly 3. The light source assembly 1 emits a laser beam. The adjustment assembly 2 includes a first lens 21, a second lens 22, and a driving member 23. The laser beam emitted by the light source assembly 1 passes through the first lens 21 and the second lens 22 sequentially before exiting. The driving member 23 adjusts the relative positions of the first lens 21 and the second lens 22 to control the divergence angle of the laser beam. The field lens assembly 3 is located on the light-emitting side of the second lens 22 and is used to focus the laser beam emitted from the second lens 22 onto the surface 200 of the product to be processed. The light source assembly 1, the first lens 21, the second lens 22, and the field lens assembly 3 are optically coupled sequentially to form a transmission optical path 4 for laser beam transmission.

[0029] Understandably, this solution emits a laser beam through the light source assembly 1, and then adjusts the relative position between the first lens 21 and the second lens 22 via the drive component 23 to change the divergence angle of the laser beam. The field lens assembly 3 focuses the laser beam emitted from the second lens 22 to process the surface 200 of the product. When the working distance between the laser processing device 100 and the surface 200 of the product changes, it is only necessary to adjust the relative position between the first lens 21 and the second lens 22 to adjust the divergence angle of the laser beam, so that the field lens assembly 3 can precisely focus the laser beam onto the surface 200 of the product. This setup avoids driving the entire laser processing device 100 to move vertically, but instead achieves focus adjustment by changing the relative position between the first lens 21 and the second lens 22 within the transmission optical path 4. Since the first lens 21 and the second lens 22 are lighter, the limitations caused by inertia are reduced, thus accelerating the adjustment speed and improving processing efficiency.

[0030] Specifically, the drive component 23 is a voice coil motor, which can achieve micron-level adjustment of the lens position, thereby precisely controlling the divergence angle of the laser beam. As for the light source component 1, a fiber laser or a CO2 laser can be selected to ensure that the emitted laser beam has sufficient energy and high beam quality.

[0031] Simultaneously, the first lens 21 and the second lens 22 cooperate to converge or diverge the laser beam. Optionally, both the first lens 21 and the second lens 22 are concave mirrors with their concave surfaces facing each other. The laser beam passes through the two concave mirrors sequentially, and each concave mirror converges the laser beam, causing it to diverge after forming a focal point between the two lenses. Alternatively, both the first lens 21 and the second lens 22 are convex mirrors with their convex surfaces facing each other. The laser beam passes through the two convex mirrors sequentially, and each convex mirror diverges the laser beam, thereby achieving gradual expansion of the laser beam.

[0032] In actual operation, when the working distance between the laser processing device 100 and the surface 200 to be processed of the product varies within a height difference of 60mm, the focal point of the laser beam can be made to fall on the surface 200 to be processed by adjusting the relative position between the first lens 21 and the second lens 22.

[0033] Optionally, a high-precision optical interface or connector can be provided between the light source assembly 1, the adjustment assembly 2 and the field lens assembly 3 to reduce the energy loss of the laser beam during transmission.

[0034] In one embodiment, the adjustment component 2 further includes a first reflector 25, which is disposed between the first lens 21 and the second lens 22. The first reflector 25 is configured to reflect the laser beam emitted from the first lens 21 to the second lens 22.

[0035] In this embodiment, the first reflector 25 is installed between the first lens 21 and the second lens 22. This means that the first reflector 25 is located in the optical path between the first lens 21 and the second lens 22, rather than in the area corresponding to the straight line segment connecting the first lens 21 and the second lens 22. This allows the laser beam emitted from the first lens 21 to be reflected towards the second lens 22. As a result, the transmission path of the laser beam between the first lens 21 and the first reflector 25 is set at an angle to the transmission path of the laser beam between the second lens 22 and the first reflector 25.

[0036] It is understandable that by setting the first reflector 25, the first lens 21 and the second lens 22 can avoid occupying a large space in one direction, so that the first lens 21 and the second lens 22 do not need to be arranged in a straight line, thereby making the setting of the transmission optical path 4 of the laser beam more flexible and enabling the adjustment of the relative position of the first lens 21 and the second lens 22 within a limited space.

[0037] Optionally, the angle between the laser beam emitted from the first lens 21 and the first reflector 25 can be 45 degrees, so that the angle between the incident light and the emitted light is 90 degrees, which facilitates the installation of the entire device.

[0038] In one embodiment, the laser processing apparatus 100 further includes a second reflector 24, which is disposed between the light source assembly 1 and the first lens 21. The second reflector 24 is configured to reflect the laser beam emitted from the light source assembly 1 to the first lens 21. A driving member 23 drives the first lens 21 to reciprocate between the second reflector 24 and the first reflector 25.

[0039] In this embodiment, the second reflector 24 is installed between the light source assembly 1 and the first lens 21 to reflect the laser beam emitted by the light source assembly 1 to the first lens 21. It is understood that the working principle of the second reflector 24 is the same as that of the first reflector 25, so it will not be described in detail here.

[0040] Optionally, the angle between the laser beam emitted from the light source assembly 1 and the second reflector 24 can also be set to 45 degrees.

[0041] It is understandable that by setting the first reflector 25 and the second reflector 24, not only is the transmission optical path 4 of the laser beam limited, but also the moving distance of the first lens 21 is limited, so that the driving member 23 can only drive the first lens 21 to move between the first reflector 25 and the second reflector 24.

[0042] In one embodiment, the light source assembly 1 includes a first emitter 11, a second emitter 12, and a beam combiner 13. The first emitter 11 emits a first initial laser beam 111, the second emitter 12 emits a second initial laser beam 121, and the beam combiner 13 is disposed on the light-emitting side of the first emitter 11 and the second emitter 12. The second initial laser beam 121 emitted by the second emitter 12 is reflected by the beam combiner 13 to a first lens 21. The first initial laser beam 111 emitted by the first emitter 11 is transmitted through the beam combiner 13 and coaxially directed with the reflected second initial laser beam 121 toward the first lens 21.

[0043] It is understandable that the light source assembly 1 uses beam combining technology to generate two independent laser beams through the first emitter 11 and the second emitter 12, and then uses the beam combiner 13 to combine them into a coaxial laser beam.

[0044] Specifically, the first initial laser beam 111 generated by the first transmitter 11 is transmitted through the beam combiner 13, while the second initial laser beam 121 generated by the second transmitter 12 is reflected by the beam combiner 13. Finally, the two laser beams are emitted from the same position of the beam combiner 13 and coaxially directed toward the first lens 21 under the action of the beam combiner 13.

[0045] At this point, the first emitter 11 and the second emitter 12 can employ lasers of different wavelengths to adapt to diverse processing needs. For example, the first emitter 11 can use an infrared laser with a wavelength of 1064nm. This wavelength of laser has good absorption characteristics for metallic materials (especially high-reflectivity metals such as copper and aluminum), making it suitable for metal processing. The second emitter 12 can use a blue laser with a wavelength of 450nm. Blue lasers perform better when processing transparent or translucent polymers. With this setup, the operator can quickly switch the laser wavelength according to the type of material being processed without changing the laser or adjusting the optical path, thus improving processing efficiency.

[0046] In one embodiment, the light source assembly 1 further includes a third reflector 14 disposed between the first emitter 11 and the beam combiner 13, and the third reflector 14 is configured to reflect the first initial laser beam 111 emitted by the first emitter 11 to the beam combiner 13.

[0047] In this embodiment, the third reflector 14 is installed between the first emitter 11 and the beam combiner 13, and can reflect the first initial laser beam 111 emitted by the first emitter 11 to the beam combiner 13. It is understood that the function of the third reflector 14 is similar to that of the first reflector 25, allowing for more flexible placement of the first initial laser beam 111. Of course, in other embodiments of this application, the third reflector 14 can also adopt the same or similar structure as the beam combiner 13 to combine more laser beams.

[0048] Optionally, the angle between the first initial laser beam 111 emitted by the first transmitter 11 and the third reflector 14 can also be 45 degrees.

[0049] Alternatively, the third reflector 14 may be omitted, in which case the first initial laser beam 111 emitted by the first emitter 11 is directly directed toward the beam combiner 13.

[0050] In one embodiment, the first emitter 11 and the second emitter 12 are arranged side by side, and the light emission direction of the first emitter 11 is the same as that of the second emitter 12.

[0051] In this embodiment, the first emitter 11 and the second emitter 12 are arranged side by side, and the laser beams emitted by them remain parallel and in the same direction in the initial stage. Specifically, the second initial laser beam 121 emitted by the second emitter 12 is directed toward the beam combiner 13, and the first initial laser beam 111 emitted by the first emitter 11 is directed toward the third reflector 14. After reflection by the beam combiner 13 and the third reflector 14, the first initial laser beam 111 and the second initial laser beam 121 are coaxially directed toward the second reflector 24.

[0052] It is understandable that placing the first emitter 11 and the second emitter 12 together makes the overall structure more compact and easier to integrate into a smaller laser processing system.

[0053] In one embodiment, the field lens assembly 3 includes a galvanometer module 31 and a field lens module 32. The galvanometer module 31 is located on the light-emitting side of the second lens 22, and the field lens module 32 is located between the galvanometer module 31 and the surface 200 of the product to be processed. The galvanometer module 31 includes a base 311, a first galvanometer 312, and a second galvanometer 313. Both the first galvanometer 312 and the second galvanometer 313 are movably mounted on the base 311. The laser beam emitted from the second lens 22 passes sequentially through the first galvanometer 312, the second galvanometer 313, and the field lens module 32 before exiting. The first galvanometer 312 and the second galvanometer 313 are used to receive the laser beam emitted from the second lens 22 and adjust the emission direction of the laser beam. The field lens module 32 is used to receive the laser beam emitted from the galvanometer module 31 and focus the laser beam onto the surface 200 of the product to be processed.

[0054] In this embodiment, the field lens assembly 3 includes a galvanometer module 31 and a field lens module 32. The galvanometer module 31 can change the emission direction of the laser beam by moving the first galvanometer 312 and the second galvanometer 313, so that the laser processing device 100 can perform processing within a square area. The field lens module 32 is used to receive the laser beam emitted by the galvanometer module 31 and focus the laser beam onto the surface 200 of the product to be processed.

[0055] Optionally, the laser beam can be adjusted by the first galvanometer 312 and then directed to the second galvanometer 313 for further adjustment. In this case, the laser beam first strikes the reflecting surface of the first galvanometer 312, which is typically responsible for scanning and deflecting along the X-axis. A motor drives the reflecting mirror to rotate around a fixed axis, causing the laser beam to deflect at an angle in the horizontal direction. After being deflected by the first galvanometer 312, the laser beam's optical axis deviates from its original incident direction and then enters the receiving field of view of the second galvanometer 313. The second galvanometer 313 is typically responsible for scanning along the Y-axis. Driven by an independent motor, it undergoes a secondary deflection in the vertical direction, ultimately achieving vector synthesis of the laser beam's output direction in three-dimensional space, covering a square processing area.

[0056] Alternatively, the laser beam can be adjusted via the second galvanometer 313 before being directed to the first galvanometer 312 for further adjustment. The laser beam is first incident on the second galvanometer 313, where it undergoes primary deflection to guide the laser beam to the first galvanometer 312. The first galvanometer 312 then performs secondary fine-tuning, which can also achieve adjustment in the X and Y axes.

[0057] It should be noted that by adjusting the first galvanometer 312 and the second galvanometer 313, the laser processing device 100 can always perform processing within a square area. For example, when the working distance between the laser processing device 100 and the surface 200 to be processed of the product is 90mm, the laser processing device 100 can be controlled to work within a square area with a side length of 60mm; or, when the working distance is 160mm, the laser processing device 100 can be controlled to work within a square area with a side length of 90mm.

[0058] More preferably, the field lens module 32 can employ an achromatic design. For example, the field lens module 32 includes multiple lenses, and by setting the curvature, thickness, and material of these lenses, the focal points of laser beams of different wavelengths passing through the field lens module 32 are approximately located on the same plane. Thus, when the working distance between the laser processing device 100 and the surface 200 of the product to be processed varies within a height difference of 60 mm, after adjustment by the first lens 21 and the second lens 22, the laser beams emitted by the first emitter 11 and the second emitter 12 can both be focused on the surface 200 of the product to be processed.

[0059] In one embodiment, the side wall of the base 311 is provided with an inlet 3111, which communicates with the cavity, and the second lens 22 is disposed in the inlet 3111.

[0060] In this embodiment, the second lens 22 is installed in the inlet 3111 of the base 311, so that after the laser beam passes through the second lens 22, it directly enters the galvanometer module 31 for adjustment, thereby reducing the energy loss of the laser beam during transmission.

[0061] Please see Figure 3 and Figure 4 The present invention also proposes a laser processing method, based on the laser processing device 100, the laser processing method comprising: S101, Adjust the light source assembly 1 so that at least one laser beam is emitted along the transmission optical path 4; S102, Measure the working distance between the laser processing device 100 and the surface 200 of the product to be processed; S103, adjust the distance between the first lens 21 and the second lens 22 according to the second-order function relationship between the distance between the first lens 21 and the second lens 22 and the working distance; S104, adjust the rotation angle of the first galvanometer 312 and the second galvanometer 313 in the field mirror assembly 3 so that the laser beam can perform processing within the working area.

[0062] It should be noted that in this embodiment, the laser beam is ultimately processed within a square working area. Only then does the relationship between the distance between the first lens 21 and the second lens 22 and the working distance satisfy a second-order function relationship.

[0063] Furthermore, in step S104, when the first galvanometer 312 and the second galvanometer 313 rotate by an angle, the actual laser landing point will be affected by factors such as lens tilt and motor response delay, resulting in nonlinear distortion.

[0064] To address the distortion issue, in practice, a coordinate system can be established with the center of the galvanometer module 31 as the origin, and theoretical coordinate points can be set based on the swing angles of the first lens 21 and the second lens 22. Multiple reference points are uniformly selected within the working range of the galvanometer module 31, and the actual laser impact points are captured using a high-precision camera. The deviation between the theoretical and actual coordinates is recorded. A distortion function is obtained by fitting multiple sets of experimental data. This distortion function is then applied to the theoretical coordinates to obtain the actual coordinates, thus achieving precise distortion correction.

[0065] In one embodiment, the step of obtaining the second-order function relationship between the distance between the first lens 21 and the second lens 22 and the working distance includes: S201, Adjust the working distance wd between the laser processing device 100 and the surface 200 of the product to be processed; S202, adjust the distance x between the first lens 21 and the second lens 22 so that the laser beam is focused on the surface 200 of the product to be processed; S203, Repeat the above steps to obtain multiple sets of corresponding data; S204. Based on the data, the working distance wd is fitted and its relationship with the distance x between the first lens 21 and the second lens 22 is wd=ax²+bx+c, where a, b and c are correlation coefficients.

[0066] In this embodiment, when determining the second-order functional relationship between the distance between the first lens 21 and the second lens 22 and the working distance, it is first necessary to adjust the working distance wd between the laser processing device 100 and the surface 200 of the product to be processed. Then, by adjusting the distance x between the first lens 21 and the second lens 22, the focal point of the laser beam is accurately placed on the surface 200 of the product to be processed. This process is repeated multiple times to collect multiple sets of data pairs of wd and x. Finally, using data fitting technology, the second-order functional relationship between the two is obtained as wd = ax² + bx + c, where a, b, and c are the correlation coefficients obtained from the fitting. During the fitting process, at least five sets of data pairs are collected to eliminate linearity errors.

[0067] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A laser processing apparatus, characterized in that, include: A light source assembly for emitting a laser beam; An adjustment assembly includes a first lens, a second lens, and a driving component; the laser beam emitted by the light source assembly passes sequentially through the first lens and the second lens before exiting; the driving component is used to adjust the relative position of the first lens and the second lens to control the divergence angle of the laser beam. as well as A field lens assembly is located on the light-emitting side of the second lens, and the field lens assembly is used to focus the laser beam emitted from the second lens onto the surface of the product to be processed.

2. The laser processing apparatus as described in claim 1, characterized in that, The adjustment assembly further includes a first reflector disposed between the first lens and the second lens, the first reflector being configured to reflect the laser beam emitted from the first lens to the second lens.

3. The laser processing apparatus as described in claim 2, characterized in that, The laser processing apparatus further includes a second reflector, which is disposed between the light source assembly and the first lens, and is configured to reflect the laser beam emitted from the light source assembly to the first lens; The driving component drives the first lens to reciprocate between the second reflector and the first reflector.

4. The laser processing apparatus according to any one of claims 1 to 3, characterized in that, The light source assembly includes a first emitter, a second emitter, and a beam combiner. The first emitter is used to emit a first initial laser beam, the second emitter is used to emit a second initial laser beam, and the beam combiner is disposed on the light-emitting side of the first emitter and the second emitter. The second initial laser beam emitted by the second transmitter is reflected by the beam combiner to the first lens, and the first initial laser beam emitted by the first transmitter is transmitted through the beam combiner and coaxially directed towards the first lens with the reflected second initial laser beam.

5. The laser processing apparatus as described in claim 4, characterized in that, The light source assembly further includes a third reflector, which is disposed between the first emitter and the beam combiner, and is configured to reflect the first initial laser beam emitted by the first emitter to the beam combiner.

6. The laser processing apparatus as described in claim 5, characterized in that, The first emitter and the second emitter are arranged side by side, and the light emission direction of the first emitter is the same as that of the second emitter.

7. The laser processing apparatus according to any one of claims 1 to 3, characterized in that, The field lens assembly includes a galvanometer module and a field lens module. The galvanometer module is located on the light-emitting side of the second lens, and the field lens module is located between the galvanometer module and the surface to be processed. The galvanometer module includes a base, a first galvanometer, and a second galvanometer, both of which are movably mounted on the base. The laser beam emitted from the second lens passes sequentially through the first galvanometer, the second galvanometer, and the field mirror module.

8. The laser processing apparatus as described in claim 7, characterized in that, The base has an inlet on its side wall, and the second lens is located inside the inlet.

9. A laser processing method, based on the laser processing apparatus as described in any one of claims 1 to 8, characterized in that, The laser processing method includes: Adjust the light source assembly to make at least one laser beam exit along the transmission optical path; Measure the working distance between the laser processing device and the surface of the product to be processed; The distance between the first lens and the second lens is adjusted according to the second-order function relationship between the distance between the first lens and the second lens and the working distance; Adjust the rotation angles of the first and second galvanometers in the field mirror assembly to allow the laser beam to process within the working area.

10. The laser processing method as described in claim 9, characterized in that, The steps for obtaining the second-order functional relationship between the distance between the first lens and the second lens and the working distance include: Adjust the working distance wd between the laser processing device and the surface to be processed; Adjust the distance x between the first lens and the second lens so that the laser beam is focused on the surface to be processed; Repeat the above steps to obtain multiple sets of corresponding data; Based on the data, the working distance wd is fitted and its relationship with the distance x between the first lens and the second lens is wd=ax²+bx+c, where a, b and c are correlation coefficients.

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