Laser internal modification cutting device for transparent material

Abstract

The invention relates to the technical field of transparent material cutting, and mainly discloses a laser internal modification cutting device for transparent materials, which comprises a workbench, and the workbench comprises a base and a bearing platform fixed in the middle of the base; the cutting unit comprises a moving module and a cutting head, the moving module is movably fixed to the workbench, the cutting head is fixed to the moving module, and the cutting head faces the material to be machined; the cleaning unit comprises mounting frames, a cleaning frame and cleaning rollers, the mounting frames are slidably fixed to the two sides of the bearing platform, and the cleaning frame and the cleaning rollers are movably fixed to the mounting frames; the problems that an existing device is poor in overall adaptability and reliability, high in maintenance frequency and low in machining efficiency are solved.

Description

Technical Field

[0001] This invention relates to the technical field of transparent material cutting, and in particular to a laser internal modification cutting device for transparent materials. Background Technology

[0002] Transparent, hard, and brittle materials such as ultra-thin glass and sapphire are widely used in semiconductors, display panels, and other fields. Laser internal modification cutting is widely adopted due to its advantages such as high cut quality and no chipping. In existing laser cutting equipment, the platform supporting the workpiece is prone to dust and stubborn stains, and the holes are easily clogged, affecting the workpiece's adhesion stability and cutting accuracy.

[0003] Meanwhile, existing cleaning mechanisms have a single cleaning direction, making it difficult to simultaneously clean both the platform surface and the holes. Furthermore, the cleaning components lack adaptive adjustment capabilities, resulting in poor adaptability to different working conditions, and dust easily disperses after cleaning, causing secondary pollution. In addition, the displacement accuracy and stability of the moving module are insufficient, easily generating minute vibrations during the cutting process. This, coupled with the timing conflict between cleaning and adsorption actions, further affects processing accuracy. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is that the existing devices have poor overall adaptability and reliability, high maintenance frequency and low processing efficiency.

[0005] The above-mentioned technical problems are solved by the following technical solution: This invention proposes a laser internal modification cutting device for transparent materials, which includes a worktable, the worktable including a base and a support platform fixed in the middle therein; a cutting unit, the cutting unit including a moving module and a cutting head, the moving module being movably fixed on the worktable, the cutting head being fixed on the moving module, and the cutting head facing the material to be processed; and a cleaning unit, the cleaning unit including a mounting frame, a cleaning frame and cleaning rollers, the mounting frame being slidably fixed on both sides of the support platform, and the cleaning frame and cleaning rollers being movably fixed on the mounting frame.

[0006] In a preferred embodiment of the laser internal modification and cutting device for transparent materials described in this invention: a mounting groove is provided in the middle of the base, and a first slide rail and a rack are symmetrically fixed on both sides of the base of the mounting groove; a second slide rail is also symmetrically fixed in the mounting groove, and a drive assembly is fixed between the second slide rail and the first slide rail; an adsorption component is also fixed in the middle of the mounting groove.

[0007] In a preferred embodiment of the laser internal modification cutting device for transparent materials described in this invention: the moving module includes a first module, a second module, and a third module, and the cutting head is fixed on the third module; the second module is slidably disposed along the extension direction of the first module, and the third module is slidably disposed along the extension direction of the second module; slide rail blocks are fixed at both ends of the first module, the slide rail blocks are slidably engaged with the first slide rail, a first reducer and a first motor are fixed at the top of the slide rail blocks, the output shaft of the first motor is connected to the first reducer, a gear is fixed on the output shaft of the first reducer, and the gear meshes with a rack.

[0008] In a preferred embodiment of the laser internal modification and cutting device for transparent materials described in this invention: the support platform is slidably inserted and fixed to the top of the mounting groove, and several sets of perforations are arrayed on the support platform; slide rails are symmetrically opened on both sides of the support platform near the first slide rail; the adsorption assembly is fixed to the bottom of the support platform, and the adsorption assembly includes a drive cylinder and an adsorption disk fixed to the end of its piston rod; several sets of adsorption holes are opened on the top of the adsorption disk, and the adsorption holes are interconnected; the adsorption disk is connected to an air extraction device through an adsorption tube.

[0009] In a preferred embodiment of the laser internal modification cutting device for transparent materials described in this invention: the mounting frame includes symmetrically arranged base plates, with a fitting gap between the base plates, and the base plates are fixed together by connecting blocks. The connecting blocks slide within a slide rail, and the bearing platform is slidably inserted into the fitting gap. A support plate is fixed to one side of the base plate, and a second motor and a second reducer are symmetrically fixed to both ends of the support plate. The output shaft of the second motor is connected to the second reducer, and a baffle is also fixed to the second reducer, with an movable gap between the baffles.

[0010] In a preferred embodiment of the laser internal modification and cutting device for transparent materials described in this invention: a docking plate is also fixed on the base plate at the bottom of the support platform, and a sliding block is fixed at the bottom end of the docking plate, the sliding block being slidably engaged with the second slide rail; the docking plate is fixedly connected to a stabilizing block on another set of base plates via a connecting block; the drive group includes a third motor and a lead screw fixed on its output shaft, the other end of the lead screw being rotatably inserted into the vertical plate, and the docking plate being threaded onto the outside of the lead screw.

[0011] In a preferred embodiment of the laser internal modification cutting device for transparent materials described in this invention: the two ends of the base plate away from the support plate are fixed with extension plates, and the mating plate on this side is also fixedly connected with a mounting block, and a tray is movably engaged on the mounting block; a buffer perforation is opened in the extension plate, and a spring is fixed in the buffer perforation, and the spring is fixed to the inner wall of the buffer perforation by a first spring.

[0012] In a preferred embodiment of the laser internal modification cutting device for transparent materials described in this invention: the cleaning frame includes a cleaning scraper and a rotating plate fixed thereto. The rotating plate is disposed within the movable gap and rotatably inserted into the baffles on both sides, and is fixed to the output shaft of the second reducer; wherein the scraping end of the cleaning scraper abuts against the upper surface of the bearing platform.

[0013] In a preferred embodiment of the laser internal modification cutting device for transparent materials described in this invention: the cleaning roller includes a main rotating wheel and stabilizing wheels fixed at both ends thereon. A rotating shaft is fixed at the middle of the end of the stabilizing wheel away from the main rotating wheel. The rotating shaft is rotatably inserted into a buffer perforation and abuts against the spring sheet. Several sets of brushes are also fixed in an angled array on the main rotating wheel. The brushes are inclined and adjacent sets of brushes are symmetrical to each other. At least two sets of adjacent brushes can be placed simultaneously in a single perforation of the bearing platform. The brushes can slide in contact with the cleaning surface of the cleaning scraper. An outer plate is also fixed at the end of the extended plate. A spring plate is fixedly connected between the outer plates, and the brushes can slide in contact with the spring plate.

[0014] In a preferred embodiment of the laser internal modification and cutting device for transparent materials described in this invention: the mounting block has a mounting hole at its top, and an unlocking hole is formed at the end of the mounting block away from the docking plate. A spring-loaded groove is formed at the top of the unlocking hole. An unlocking push plate is slidably inserted into the unlocking hole. The unlocking push plate includes a synchronization plate and sliding push rods fixed to its two end sidewalls. A spring-loaded plate is fixed to the top of the sliding push rods. The sliding push rods and the spring-loaded plate are slidably inserted into the unlocking hole and the spring-loaded groove, respectively. The spring-loaded plate is fixed to the inner wall of the spring-loaded groove. The tray includes a second spring; the tray includes symmetrically fixed snap-fit ​​blocks at the bottom, the snap-fit ​​blocks are slidably inserted into the mounting holes, the snap-fit ​​blocks have an auxiliary groove, the auxiliary groove has an auxiliary block slidably inserted into the auxiliary groove, the auxiliary block can be inserted into the unlocking hole and abut against the sliding push rod, and a third spring is fixed between the auxiliary block and the wall of the auxiliary groove; the tray also has an adsorption groove in the collection groove, the adsorption groove has an array of several sets of air holes, the air holes are connected to the negative pressure air box at the bottom of the tray, and the negative pressure air box is also connected to an air extraction device.

[0015] The beneficial effects of this invention are as follows: This device significantly improves the precision, efficiency, and ease of maintenance of laser cutting of transparent, hard, and brittle materials through the rational layout of its functional components, offering multiple beneficial effects. The worktable, in conjunction with the mesh support platform, provides stable support for the workpiece. Combined with the liftable adsorption assembly, it can precisely adsorb and fix the workpiece through perforations, and can also be lowered during cleaning to avoid collisions and wear on components.

[0016] The cleaning unit features a symmetrical layout of scrapers and roller brushes. The scrapers are angle-adjustable to fit platforms of varying thicknesses, while the roller brushes' bidirectional bristles can penetrate deep into pores for cleaning. Combined with the spring plate and scraper, self-cleaning is achieved, preventing secondary contamination. A negative pressure tray and quick-release structure allow for rapid dust collection and locking, simplifying maintenance.

[0017] The mobile module, through the cooperation of gears, racks and pinions and slide rails, ensures precise and stable displacement of the cutting head and coordinated and orderly operation of all components. It effectively solves problems such as incomplete platform cleaning and interference between adsorption and cleaning, and is suitable for high-volume, high-precision cutting needs. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments of the present invention will be briefly described below. Obviously, the drawings described below only relate to some embodiments of the present invention and are not intended to limit the present invention. Wherein: Figure 1 An overall structural diagram of a laser internal modification cutting device for transparent materials is shown.

[0019] Figure 2 A schematic diagram of the stage structure of a laser internal modification cutting device for transparent materials is shown.

[0020] Figure 3 A structural diagram of the adsorption component of a laser internal modification cutting device for transparent materials is shown.

[0021] Figure 4 A structural diagram of the cutting unit of a laser internal modification cutting device for transparent materials is shown.

[0022] Figure 5 A structural diagram of the support platform for a laser internal modification cutting device for transparent materials is shown.

[0023] Figure 6 A structural diagram of the mounting frame for a laser internal modification cutting device for transparent materials is shown.

[0024] Figure 7 A partial structural diagram of the mounting bracket for a laser internal modification cutting device for transparent materials is shown.

[0025] Figure 8 A structural diagram of the cleaning frame of a laser internal modification cutting device for transparent materials is shown.

[0026] Figure 9 A structural diagram of the cleaning roller of a laser internal modification cutting device for transparent materials is shown.

[0027] Figure 10 A partial structural diagram of the cleaning roller of a laser internal modification cutting device for transparent materials is shown.

[0028] Figure 11 A cross-sectional view of the mounting block for a laser internal modification cutting device for transparent materials is shown.

[0029] Figure 12 A schematic diagram of the unlocking pusher structure of a laser internal modification cutting device for transparent materials is shown.

[0030] Figure 13 A diagram of the tray structure of a laser internal modification cutting device for transparent materials is shown.

[0031] Figure 14 A diagram of the tray bottom structure of a laser internal modification cutting device for transparent materials is shown. Detailed Implementation

[0032] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0033] The terminology used in this invention is that which is currently widely used in the art in consideration of the function of the invention; however, these terms may vary according to the intent of those skilled in the art, precedent, or new technology in the art. Furthermore, specific terms may be chosen by the applicant, and in such cases, their detailed meanings will be described in the detailed description of the invention. Therefore, the terms used in this specification should not be construed as simple names, but rather based on their meanings and the overall description of the invention.

[0034] Reference Figures 1-14 This embodiment provides a laser internal modification cutting device for transparent materials, which includes a worktable 1. The worktable 1 includes a base 11 and a support platform 12 fixed in the middle. The base 11 is made of high-strength cast iron to ensure the overall structural stability of the device, avoid vibration during laser cutting that affects processing accuracy, and provide a stable mounting foundation for each functional component.

[0035] The cutting unit 2 includes a moving module 21 and a cutting head 22. The moving module 21 is movably fixed on the worktable 1, and the cutting head 22 is fixed on the moving module 21. The cutting head 22 faces the material to be processed. The cutting head 22 is a fiber laser cutting head, which can emit a focused laser beam to act on the interior of the transparent material to achieve internal modification cutting. It can effectively reduce defects such as edge chipping and cracking of the material during the cutting process and is suitable for processing transparent hard and brittle materials such as ultra-thin glass and sapphire.

[0036] The cleaning unit 3 includes a mounting frame 31, a cleaning frame 32, and a cleaning roller 33. The mounting frame 31 is slidably fixed on both sides of the support platform 12, and the cleaning frame 32 and the cleaning roller 33 are movably fixed on the mounting frame 31. The cleaning unit 3 is used to clean the surface and perforations of the support platform 12 in all directions to prevent dust residue from clogging the perforations and affecting the adsorption and fixation effect of the workpiece, while also avoiding dust adhering to the surface of the workpiece and interfering with the laser cutting accuracy.

[0037] A mounting groove 111 is provided in the middle of the base 11. A first slide rail 112 and a rack 113 are symmetrically fixed on the base 11 on both sides of the mounting groove 111. The first slide rail 112 is a linear slide rail with low friction and high precision, which can ensure the smoothness of the sliding process of the moving module 21. Together with the rack 113, it can achieve precise positioning of the moving module 21 and meet the stringent requirements of laser cutting for displacement accuracy.

[0038] A second slide rail 1111 is symmetrically fixed inside the mounting slot 111. A drive assembly 1112 is also fixed between the second slide rail 1111 and the first slide rail 112. An adsorption assembly 13 is also fixed in the middle of the mounting slot 111. The second slide rail 1111 and the first slide rail 112 have the same structure and are used to provide precise guidance and support for the sliding of the mounting bracket 31, ensuring that the movement trajectory of the cleaning unit 3 is adapted to the bearing platform 12 and avoiding cleaning deviation.

[0039] The moving module 21 includes a first module 211, a second module 212, and a third module 213. The cutting head 22 is fixed on the third module 213. The first module 211, the second module 212, and the third module 213 correspond to the movement in the X-axis, Y-axis, and Z-axis directions, respectively, which can realize the precise displacement of the cutting head 22 in three-dimensional space, adapt to the cutting needs of workpieces of different sizes and shapes, and flexibly adjust the cutting position and height.

[0040] The second module 212 is slidably arranged along the extension direction of the first module 211, and the third module 213 is slidably arranged along the extension direction of the second module 212. The modules are connected by sliders and slide rails. The sliders are made of high-rigidity and wear-resistant material to ensure positioning accuracy and service life during sliding and reduce gap wear after long-term movement.

[0041] The first module 211 has slide rail blocks 2111 fixed at both ends. The slide rail blocks 2111 are slidably connected to the first slide rail 112. The top of the slide rail blocks 2111 is fixed with a first reducer 2112 and a first motor 2113. The first reducer 2112 is preferably a planetary gear reducer, which has high transmission efficiency, small size, and can accurately match the motor speed. The first motor 2113 is preferably a servo motor, which has high control precision and fast response.

[0042] The output shaft of the first motor 2113 is connected to the first reducer 2112. A gear 2114 is fixed on the output shaft of the first reducer 2112. The gear 2114 meshes with the rack 113. Through the meshing transmission of the gear and rack, the rotational motion of the first motor 2113 is smoothly converted into the linear motion of the moving module 21 along the first slide rail 112, ensuring smooth and uninterrupted displacement during the cutting process.

[0043] The support platform 12 is slidably inserted and fixed to the top of the mounting groove 111. Several sets of through holes 121 are arrayed on the support platform 12. The through holes 121 penetrate the upper and lower surfaces of the support platform 12 and have a uniform diameter. They allow the brush of the cleaning roller 33 to pass through and clean deeply into the hole, and also allow the suction force of the adsorption component 13 to be evenly applied to the workpiece to be processed, ensuring that the workpiece is subjected to balanced force and does not warp. The support platform 12 has symmetrical slide rails 122 on both sides near the first slide rail 112, which provide auxiliary guidance for the sliding of the mounting frame 31 and enhance the movement stability of the cleaning unit 3.

[0044] The adsorption assembly 13 is fixed to the bottom of the support platform 12. The adsorption assembly 13 includes a drive cylinder 131 and an adsorption disk 132 fixed to the end of its piston rod. The drive cylinder 131 is preferably a thin cylinder, which has a compact structure, occupies little space, is suitable for the installation environment in the mounting slot 111, and can accurately control the lifting stroke of the adsorption disk 132. The top of the adsorption disk 132 has several sets of adsorption holes 1321, which are interconnected to form a uniform negative pressure adsorption surface. The diameter of the adsorption holes 1321 matches the diameter of the through holes 121 of the support platform 12, and their positions correspond one-to-one to ensure that the suction force can be efficiently transferred to the surface of the workpiece.

[0045] The adsorption plate 132 is connected to an air extraction device through an adsorption tube. The air extraction device is preferably an oil-free diaphragm vacuum pump, which produces no oil stains during operation, avoiding contamination of transparent workpieces and adsorption pipes. At the same time, the vacuum degree is adjustable, and the adsorption force can be adjusted according to the thickness and material of the workpiece to prevent ultra-thin workpieces from being crushed or thick materials from being poorly adsorbed.

[0046] The mounting frame 31 includes symmetrically arranged base plates 311, with a fitting gap X1 between the base plates 311. The base plates 311 are fixed together by connecting blocks 312. The connecting blocks 312 are made of high-strength alloy material to enhance the overall rigidity of the mounting frame 31. The connecting blocks 312 slide within the slide rail 122. The bearing platform 12 slides into the fitting gap X1. The width of the fitting gap X1 is slightly larger than the thickness of the bearing platform 12 to ensure that the mounting frame 31 does not interfere with the bearing platform 12 when it slides, while ensuring that the cleaning components can work in close contact with the platform surface.

[0047] A support plate 313 is fixed to one side of the base plate 311. A second motor 3121 and a second reducer 3122 are symmetrically fixed to both ends of the support plate 313. The second motor 3121 is preferably a stepper motor, which provides precise angle control and enables fine-tuning of the cleaning scraper 321. The second reducer 3122 is preferably a worm gear reducer, which has a reliable self-locking function and can maintain a fixed angle after the cleaning scraper 321 has been adjusted, preventing angle deviation during operation. The output shaft of the second motor 3121 is connected to the second reducer 3122. A baffle 31221 is also fixed on the second reducer 3122. A movable gap X2 is formed between the baffles 31221, providing room for the rotation of the rotating plate 322 while limiting the range of motion of the rotating plate 322 to prevent excessive rotation from damaging the components.

[0048] A docking plate 314 is also fixed on the bottom plate 311 at the bottom of the bearing platform 12. A sliding block 3131 is fixed at the bottom of the docking plate 314. The sliding block 3131 is slidably engaged with the second slide rail 1111. The cooperation method between the sliding block 3131 and the second slide rail 1111 is the same as the cooperation method between the slide rail block 2111 and the first slide rail 112, ensuring that the mounting frame 31 slides smoothly and is accurately positioned, and is adapted to the cleaning operation requirements.

[0049] The docking plate 314 is fixedly connected to the stabilizing block 315 on another set of base plates 311 via the connecting block 312. The stabilizing block 315 is used to enhance the connection strength between the two sets of base plates 311, offset the impact of the cleaning operation, ensure the stability of the overall structure of the mounting frame 31, and avoid loosening and deformation after long-term reciprocating motion.

[0050] The drive unit 1112 includes a third motor 11121 and a lead screw 11122 fixed on its output shaft. The third motor 11121 is preferably a servo motor, which can realize the uniform reciprocating motion of the mounting frame 31 and precisely control the cleaning speed and stroke. The lead screw 11122 is preferably a ball screw, which has high transmission accuracy and low wear, and can efficiently convert the rotational motion of the motor into linear motion. The other end of the lead screw 11122 is rotatably inserted into the upright plate 11123, which provides stable support for the lead screw. The mating plate 314 is threaded onto the outside of the lead screw 11122. The third motor 11121 drives the lead screw 11122 to rotate. Through the transmission action of the lead screw nut, the mating plate 314 and the mounting frame 31 are driven to make linear reciprocating motion along the second slide rail 1111, so as to achieve comprehensive cleaning of the bearing platform 12.

[0051] The base plate 311 has extension plates 316 fixed at both ends on the side away from the support plate 313. The extension plates 316 provide a mounting carrier for the cleaning roller 33 and the spring plate 3191. The docking plate 314 on this side is also fixedly connected to the mounting block 317. The mounting block 317 is movably engaged with the tray 318. The tray 318 is used to receive dust and debris that fall during the cleaning process, so as to prevent dust from falling into the device and causing wear or contamination of the components.

[0052] The extended plate 316 has a buffer through hole 3161, and a spring piece 31611 is fixed inside the buffer through hole 3161. The spring piece 31611 is made of elastic stainless steel, which has good resilience and wear resistance. The spring piece 31611 is fixed to the inner wall of the buffer through hole 3161 by a first spring T1. The first spring T1 is preferably a cylindrical helical compression spring, which has stable elastic force and long service life, and can provide continuous and uniform elastic support for the spring piece 31611. This allows the spring piece 31611 to drive the cleaning roller 33 to fit tightly against the surface of the bearing platform 12. Even if there are slight flatness errors in the platform, the spring can adjust adaptively by extension and retraction to ensure cleaning without dead corners.

[0053] The cleaning frame 32 includes a cleaning scraper 321 and a rotating plate 322 fixed thereto. The rotating plate 322 is set in the movable gap X2 and is rotatably inserted into the baffles 31221 on both sides, and is fixed to the output shaft of the second reducer 3122. The second stepper motor 3121 drives the rotating plate 322 to rotate through the second worm gear reducer 3122, thereby driving the cleaning scraper 321 to flexibly adjust the angle to adapt to the bearing platform 12 of different thicknesses. At the same time, the adhesion between the scraper and the platform can be adjusted according to the stubbornness of the stains, taking into account both the cleaning effect and the protection of the platform.

[0054] The scraping end 3211 of the cleaning scraper 321 abuts against the upper surface of the bearing platform 12. The scraping end 3211 is made of polyurethane wear-resistant material with moderate hardness. It has a good scraping effect and can effectively remove stubborn stains and dust clumps adhering to the surface without scratching the surface of the bearing platform 12 and protecting the platform's precision.

[0055] The cleaning roller 33 includes a main rotating wheel 331 and stabilizing wheels 332 fixed at both ends. The stabilizing wheels 332 are made of wear-resistant plastic to ensure the stability of the main rotating wheel 331 during rotation and prevent the rotating wheel from shifting and causing the brush to misalign during cleaning. A rotating shaft 333 is fixed in the middle of the end of the stabilizing wheel away from the main rotating wheel 331. The rotating shaft 333 is rotatably inserted into the buffer through hole 3161 and abuts against the spring piece 31611. The surface of the rotating shaft 333 is smoothed to reduce rotational friction and improve the smoothness of the rotation of the cleaning roller 33.

[0056] The main rotating wheel 331 is also fixed with several sets of brushes 3311 in an angled array. The brushes 3311 are made of anti-static nylon material, which is soft and tough. They can effectively remove residual dust in the perforation 121, while avoiding static electricity to attract dust and prevent secondary pollution. The brushes 3311 are set at an angle, and the two adjacent sets of brushes 3311 are symmetrical to each other. At least two sets of adjacent brushes 3311 can be placed in a single perforation 121 of the bearing platform 12 at the same time. Through the synergistic effect of the bidirectional brushes, they clean from both sides of the hole wall at the same time, improving the thoroughness of cleaning inside the hole.

[0057] The brush 3311 can slide into contact with the cleaning surface of the cleaning scraper 321. When the mounting bracket 31 moves backward, the brush 3311 can scrape the cleaning surface of the cleaning scraper 321, effectively shaking off the dust attached to the scraper, realizing the self-cleaning of the scraper, eliminating the need for additional manual cleaning, and improving work efficiency.

[0058] An external plate 319 is fixed to the end of the extension plate 316. A spring plate 3191 is fixedly connected between the external plates 319. The spring plate 3191 is made of stainless steel elastic material, which has good elasticity and wear resistance. The brush 3311 can slide in contact with the spring plate 3191. When the brush 3311 contacts the spring plate 3191, it bends and deforms. After leaving, it quickly rebounds. The rebound impact force shakes off the dust attached to the brush, further enhancing the self-cleaning effect of the brush and ensuring that the subsequent cleaning efficiency does not decrease.

[0059] The mounting block 317 has a mounting hole 3171 on its top and an unlocking hole 3172 on the end of the mounting block 317 away from the docking plate 314. The unlocking hole 3172 has a spring groove 31721 on its top, which provides space for the installation and movement of the unlocking push plate 3173, while limiting its movement trajectory to ensure that the unlocking action is accurate and controllable.

[0060] An unlocking push plate 3173 is also slidably inserted into the unlocking socket 3172. The unlocking push plate 3173 includes a synchronization plate 31731 and sliding push rods 31732 fixed to its two end side walls. The synchronization plate 31731 facilitates manual pressing operation and realizes the synchronous movement of the two end sliding push rods 31732. A spring plate 31733 is fixed to the top of the sliding push rod 31732. The sliding push rod 31732 and the spring plate 31733 are slidably inserted into the unlocking socket 3172 and the spring groove 31721, respectively. A second spring T2 is fixed between the spring plate 31733 and the inner wall of the spring groove 31721. The second spring T2 is preferably a cylindrical helical compression spring with moderate elasticity, which can provide a stable reset elastic force for the unlocking push plate 3173. After pressing to unlock, it can automatically spring back and reset, waiting for the next unlocking operation.

[0061] The tray 318 includes symmetrically fixed snap-fit ​​blocks 3181 at its bottom end. The snap-fit ​​blocks 3181 are slidably inserted into the mounting holes 3171 to achieve initial positioning of the tray 318. An auxiliary groove 31811 is formed within the snap-fit ​​blocks 31811, and an auxiliary block 31812 is slidably inserted into the auxiliary groove 31811. The auxiliary block 31812 can be inserted into the unlocking hole 3172 and abuts against the sliding push rod 31732. Furthermore, a fixed distance is maintained between the auxiliary block 31812 and the groove wall of the auxiliary groove 31811. The third spring T3, preferably a cylindrical helical compression spring, provides continuous clamping force to the auxiliary block 31812, ensuring that the tray 318 is securely engaged and preventing it from falling off during operation. Pressing the synchronous plate 31731 can drive the sliding push rod 31732 to squeeze the auxiliary block 31812 into the auxiliary groove 31811, thereby quickly releasing the engagement between the tray 318 and the mounting block 317, realizing the quick disassembly of the tray 318, which is convenient for dust cleaning and tray maintenance.

[0062] The collection groove 3182 of the tray 318 is also provided with an adsorption groove 31821. Several sets of air holes 31822 are arrayed in the adsorption groove 31821. The air holes 31822 are evenly distributed to ensure that the suction covers the entire collection groove area. The air holes 31822 are connected to the negative pressure air box 3183 at the bottom of the tray 318. The negative pressure air box 3183 can make the air holes 31822 generate uniform micro-suction, which firmly locks the dust that falls into the collection groove 3182, preventing the dust from flying and causing secondary pollution. The negative pressure air box 3183 is also connected to an air extraction device. The air extraction device is preferably an oil-free diaphragm vacuum pump, which can be shared with or independently controlled with the vacuum pump of the adsorption component 13, flexibly adapting to cleaning and adsorption needs, while avoiding oil pollution.

[0063] Finally, it should be noted that the methods and devices described in detail above are merely embodiments, and those skilled in the art can modify these embodiments in different ways as long as they do not depart from the scope of the present invention.

Claims

1. A laser internal modification cutting device for transparent materials, characterized in that: include, Workbench (1), the workbench (1) includes a base (11) and a support platform (12) fixed in the middle therein. The cutting unit (2) includes a moving module (21) and a cutting head (22). The moving module (21) is movably fixed on the worktable (1), and the cutting head (22) is fixed on the moving module (21). The cutting head (22) faces the material being processed. The cleaning unit (3) includes a mounting frame (31), a cleaning frame (32) and a cleaning roller (33). The mounting frame (31) is slidably fixed on both sides of the bearing platform (12), and the cleaning frame (32) and the cleaning roller (33) are movably fixed on the mounting frame (31).

2. The laser internal modification and cutting device for transparent materials according to claim 1, characterized in that: The base (11) has a mounting groove (111) in the middle, and the base (11) on both sides of the mounting groove (111) is symmetrically fixed with a first slide rail (112) and a rack (113). The mounting groove (111) is also symmetrically fixed with a second slide rail (1111), and a drive group (1112) is fixed between the second slide rail (1111) and the first slide rail (112). An adsorption component (13) is also fixed in the middle of the mounting groove (111).

3. The laser internal modification cutting device for transparent materials according to claim 2, characterized in that: The mobile module (21) includes a first module (211), a second module (212) and a third module (213), and the cutting head (22) is fixed on the third module (213); The second module (212) is slidably disposed along the extension direction of the first module (211), and the third module (213) is slidably disposed along the extension direction of the second module (212); The first module (211) has slide rail blocks (2111) fixed at both ends. The slide rail blocks (2111) are slidably connected to the first slide rail (112). The top of the slide rail blocks (2111) is fixed with a first reducer (2112) and a first motor (2113). The output shaft of the first motor (2113) is connected to the first reducer (2112). A gear (2114) is fixed on the output shaft of the first reducer (2112). The gear (2114) meshes with the rack (113).

4. The laser internal modification cutting apparatus for transparent materials according to claim 2 or 3, characterized in that: The support platform (12) is slidably inserted and fixed to the top of the mounting groove (111). Several sets of through holes (121) are arrayed on the support platform (12). Slide tracks (122) are symmetrically opened on both sides of the support platform (12) near the first slide rail (112). The adsorption assembly (13) is fixed to the bottom of the support platform (12). The adsorption assembly (13) includes a drive cylinder (131) and an adsorption disk (132) fixed to the end of its piston rod. The top of the adsorption disk (132) is provided with a number of adsorption holes (1321), and the adsorption holes (1321) are interconnected. The adsorption plate (132) is connected to an air extraction device via an adsorption tube.

5. The laser internal modification cutting device for transparent materials according to claim 4, characterized in that: The mounting bracket (31) includes symmetrically arranged base plates (311), with a fitting gap (X1) formed between the base plates (311), and the base plates (311) are fixed together by connecting blocks (312). The connecting blocks (312) slide within the slide rail (122), and the bearing platform (12) slides into the fitting gap (X1). A support plate (313) is fixed on one side of the base plate (311). A second motor (3121) and a second reducer (3122) are symmetrically fixed at both ends of the support plate (313). The output shaft of the second motor (3121) is connected to the second reducer (3122). A baffle (31221) is also fixed on the second reducer (3122), and an movable gap (X2) is formed between the baffles (31221).

6. The laser internal modification cutting apparatus for transparent materials according to claim 5, characterized in that: A docking plate (314) is also fixed on the bottom plate (311) at the bottom of the bearing platform (12). A sliding block (3131) is fixed at the bottom end of the docking plate (314). The sliding block (3131) is slidably engaged with the second slide rail (1111). The docking plate (314) is fixedly connected to the stabilizing block (315) on another set of base plates (311) via the connecting block (312); The drive assembly (1112) includes a third motor (11121) and a lead screw (11122) fixed on its output shaft. The other end of the lead screw (11122) is rotatably inserted into the upright plate (11123), and the mating plate (314) is threaded onto the outside of the lead screw (11122).

7. The laser internal modification cutting apparatus for transparent materials according to claim 5 or 6, characterized in that: The bottom plate (311) has an extension plate (316) fixed at both ends on the side away from the support plate (313), and an installation block (317) is fixedly connected to the docking plate (314) on this side, and a tray (318) is movably engaged on the installation block (317). The extended plate (316) has a buffer through hole (3161) inside, and a spring piece (31611) is fixed inside the buffer through hole (3161). The spring piece (31611) is fixed to the inner wall of the buffer through hole (3161) by a first spring (T1).

8. The laser internal modification cutting apparatus for transparent materials according to claim 7, characterized in that: The cleaning frame (32) includes a cleaning scraper (321) and a rotating plate (322) fixed thereto. The rotating plate (322) is disposed in the movable gap (X2) and rotatably inserted into the baffles (31221) on both sides, and is fixed to the output shaft of the second reducer (3122). The scraping end (3211) of the cleaning scraper (321) abuts against the upper surface of the support platform (12).

9. The laser internal modification cutting apparatus for transparent materials according to claim 8, characterized in that: The cleaning roller (33) includes a main rotating wheel (331) and a stabilizing wheel (332) fixed at both ends thereon. A rotating shaft (333) is fixed at the middle of the end of the stabilizing wheel (332) away from the main rotating wheel (331). The rotating shaft (333) is rotatably inserted into the buffer through hole (3161) and abuts against the spring piece (31611). The main rotating wheel (331) is also fixed with several sets of brushes (3311) in an angled array. The brushes (3311) are inclined and two adjacent sets of brushes (3311) are symmetrical to each other. At least two adjacent sets of brushes (3311) can be placed in a single perforation (121) of the bearing platform (12) at the same time. The brush (3311) is able to slide in contact with the cleaning surface of the cleaning scraper (321); An outer plate (319) is also fixed to the end of the extension plate (316), and a spring plate (3191) is fixedly connected between the outer plates (319). The brush (3311) can slide in contact with the spring plate (3191).

10. The laser internal modification cutting apparatus for transparent materials according to claim 8 or 9, characterized in that: The mounting block (317) has a mounting hole (3171) on its top, and an unlocking hole (3172) is provided at the end of the mounting block (317) away from the docking plate (314). A spring groove (31721) is provided on the top of the unlocking hole (3172). An unlocking push plate (3173) is also slidably inserted into the unlocking socket (3172). The unlocking push plate (3173) includes a synchronization plate (31731) and a sliding push rod (31732) fixed to its two end side walls. A spring plate (31733) is fixed to the top of the sliding push rod (31732). The sliding push rod (31732) and the spring plate (31733) are slidably inserted into the unlocking socket (3172) and the spring groove (31721) respectively. A second spring (T2) is fixed between the spring plate (31733) and the inner wall of the spring groove (31721). The tray (318) includes a snap-fit ​​block (3181) symmetrically fixed at the bottom end. The snap-fit ​​block (3181) is slidably inserted into the mounting hole (3171). An auxiliary groove (31811) is provided in the snap-fit ​​block (31811). An auxiliary block (31812) is slidably inserted into the auxiliary groove (31811). The auxiliary block (31812) can be inserted into the unlocking hole (3172) and abut against the sliding push rod (31732). A third spring (T3) is fixed between the auxiliary block (31812) and the groove wall of the auxiliary groove (31811). The collection groove (3182) of the tray (318) is also provided with an adsorption groove (31821), and a number of air holes (31822) are arrayed in the adsorption groove (31821). The air holes (31822) are connected to the negative pressure air box (3183) at the bottom of the tray (318), and the negative pressure air box (3183) is also connected to an air extraction device.

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