Chemical mechanical polishing equipment and polishing method

Abstract

The invention discloses chemical mechanical polishing equipment and a polishing method, and belongs to the technical field of semiconductor manufacturing. The chemical mechanical polishing equipment comprises a polishing mechanism which comprises a polishing chamber located on the upper portion and a transmission chamber located on the lower portion, and the polishing chamber is provided with a bearing head for loading wafers; the transmission mechanism is located in the transmission cavity and comprises a horizontal guide rail and a clamping mechanism, and the clamping mechanism is arranged on the horizontal guide rail in a sliding mode so as to transmit wafers in the length direction of the chemical mechanical polishing equipment; the loading and unloading mechanism comprises a loading and unloading assembly, a driving assembly and a support, the support comprises an L-shaped vertical frame and a horizontal frame, the loading and unloading assembly is located on the horizontal frame, and the driving assembly and the sliding block are connected to the vertical frame in a sliding mode so as to drive the loading and unloading assembly to move up and down, so that the loading and unloading assembly penetrates through the polishing interaction opening to interact wafers with the bearing head at the high station in the polishing cavity. And interacting the wafer with the clamping mechanism at a low station in the transfer chamber.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a chemical mechanical polishing (CMP) apparatus and polishing method. Background Technology

[0002] Chemical mechanical polishing (CMP) equipment is a key piece of equipment in semiconductor manufacturing, used to perform global planarization on the wafer surface. Its performance directly affects the yield and reliability of integrated circuits. As semiconductor technology nodes continue to shrink, more stringent requirements are being placed on the throughput (WPH), process stability, wafer surface contamination control, and equipment footprint of CMP equipment.

[0003] Current mainstream CMP equipment mostly adopts a horizontally unfolded single-layer structure in its overall layout, that is, arranging polishing modules, cleaning modules, transfer modules, and wafer loading / unloading modules side by side on the same operating plane. While this layout is intuitive, it has a series of inherent drawbacks and has become a bottleneck restricting the improvement of equipment performance and miniaturization:

[0004] First, the equipment occupies too much space. A horizontal layout inevitably leads to a high space occupancy rate for equipment within the cleanroom. Given the extremely high cost of cleanrooms (Fab) in semiconductor manufacturing plants, an excessively large footprint not only limits the number of devices that can be placed per unit area, reducing the production capacity per unit area, but also directly impacts the overall economic efficiency and spatial planning flexibility of the production line.

[0005] Secondly, the wafer transport path is lengthy and carries a high risk of contamination. Under the current horizontal architecture, wafers need to be transferred and handed over multiple times between various dispersed workstations such as polishing, cleaning, buffering, and flipping. Each transfer carries the potential risk of mechanical contact, particulate contamination, or chemical cross-contamination, and the frequent transport severely restricts the yield improvement of the final product. Furthermore, to coordinate these operations, multiple independent robotic arms or transfer arms are often required, resulting in a complex and costly system. The collaborative operation of multiple robotic arms not only increases equipment manufacturing costs and maintenance difficulty but also introduces additional points of failure due to the complexity of the control logic, affecting the overall reliability of the system.

[0006] Finally, vertical space utilization is generally low. In cleanrooms with ample ceiling height, the traditional single-layer layout of equipment fails to effectively utilize vertical space, resulting in a waste of space resources. This contradicts the current trend of highly integrated and miniaturized semiconductor equipment.

[0007] Therefore, there is an urgent need to develop a new type of chemical mechanical polishing equipment and polishing method that can significantly reduce the footprint, optimize the transmission path, reduce the risk of pollution, simplify the system structure, and effectively utilize vertical space. Summary of the Invention

[0008] In view of this, embodiments of this application provide a chemical mechanical polishing apparatus and polishing method to at least partially solve the above-mentioned problems.

[0009] According to a first aspect of the embodiments of this application, a chemical mechanical polishing apparatus is provided, comprising:

[0010] A polishing mechanism includes an upper polishing chamber and a lower transfer chamber, the polishing chamber being configured with a carrier head for loading wafers;

[0011] The transfer mechanism, located in the transfer chamber, includes a horizontal guide rail and a clamping mechanism. The clamping mechanism is slidably disposed on the horizontal guide rail to transfer the wafer along the length direction of the chemical mechanical polishing equipment.

[0012] The loading and unloading mechanism includes a loading and unloading component and a drive component and a support located in a transfer chamber; the support includes an L-shaped vertical frame and a horizontal frame, the loading and unloading component is located on the horizontal frame, and the drive component is slidably connected to the slider on the vertical frame to drive the loading and unloading component to move up and down, so that the loading and unloading component passes through the polishing interface and interacts with the wafer with the carrier head at a high position in the polishing chamber, and interacts with the wafer with the clamping mechanism at a low position in the transfer chamber;

[0013] The transmission protection mechanism includes a transmission protection plate and a water receiving component. The transmission protection plate is positioned above a horizontal guide rail, and the water receiving component is located on the side of the transmission mechanism to collect liquid dripping onto the transmission protection plate. The end of the transmission protection plate extends longitudinally above the water receiving component.

[0014] In some embodiments, the clamping mechanism includes a movable frame and a clamping assembly, the clamping assembly being disposed above the movable frame, the two together forming an S-shaped structure; the movable frame includes a first connecting plate, a first vertical plate, a second connecting plate, and a second vertical plate, which are connected in pairs as a whole, and the clamping assembly is fixed to the second vertical plate.

[0015] In some embodiments, a liquid guide plate is provided between the first connecting plate and the first vertical plate, which is located above the water receiving assembly; the liquid guide plate is provided with a plurality of liquid guide holes to guide the accumulated liquid downward.

[0016] In some embodiments, when the clamping mechanism moves along the horizontal guide rail to the polishing interface, the second connecting plate, the second vertical plate, and the clamping assembly form a C-shaped opening facing the loading and unloading assembly, and the loading and unloading cup of the loading and unloading assembly is located in the space formed by the C-shaped opening.

[0017] In some embodiments, the loading and unloading assembly further includes a bracket assembly, on which the loading and unloading cup is disposed for interacting with the wafer with the carrier head; the bracket assembly includes a bracket plate, a plurality of support columns and elastic supports, the elastic supports being disposed between the horizontal frame and the bracket plate; the support columns are concentrically distributed along the loading and unloading cup to horizontally support the loading and unloading cup.

[0018] In some embodiments, the transmission mechanism further includes a longitudinal adjustment member disposed below the first connecting plate for adjusting the longitudinal position of the clamping assembly of the clamping mechanism.

[0019] In some embodiments, the water receiving assembly includes a main body plate that extends along the length of the transmission mechanism and is located outside the transmission mechanism; the main body plate is fixed to the equipment frame by a plurality of spaced longitudinal plates, the main body plate including a horizontal longitudinal plate, an inclined plate and a vertical plate, which are integrally formed; one end of the longitudinal plate is connected to the inclined plate, and the other end is fixed to the side of the equipment frame.

[0020] In some embodiments, the water-receiving assembly further includes a horizontal plate that extends along the length of the main plate and is obliquely fixed to the vertical plate; the horizontal plate is obliquely inclined toward the transmission mechanism to deflect liquid guided by the transmission guard plate away from the transmission mechanism.

[0021] In some embodiments, the transmission protection plate includes an L-shaped first protection plate and a second protection plate, the first protection plate being inclined toward the water receiving assembly, the second protection plate being located outside the upright plate, and the lower edge of the second protection plate being located below the upper edge of the upright plate.

[0022] In some embodiments, the transmission protection mechanism includes side plates fixed to both sides of the first connecting plate to prevent liquid from the guide plate from splashing toward the transmission mechanism under inertia.

[0023] In some embodiments, the lower part of the second connecting plate is an inclined surface that faces the water receiving assembly; the end of the inclined surface is provided with a liquid-blocking groove that extends laterally along the movable frame.

[0024] In some embodiments, a hydrophobic plate is provided at the connection between the second connecting plate and the first vertical plate, so that liquid moves downward along the inner sidewall of the first vertical plate.

[0025] In some embodiments, the chemical mechanical polishing apparatus further includes a loading and unloading protection mechanism, which includes a water receiving tray fixedly connected to a support and located below a horizontal frame, the projection of the water receiving tray onto the polishing chamber above covering the polishing interface.

[0026] In some embodiments, when the loading / unloading assembly moves to the high position, the clamping mechanism passes under the water receiving tray.

[0027] In some embodiments, the edge of the drip tray is provided with a vertically upward-facing flange to catch liquid and prevent liquid from splashing outwards.

[0028] In some embodiments, the water receiving tray is provided with a drain outlet, and a drain pipe that is retractable as the water receiving tray moves is connected below the drain outlet. The water receiving tray receives liquid that enters the transfer chamber from the polishing chamber through the polishing interface and discharges the liquid through the drain pipe.

[0029] In some embodiments, the lower end of the drain pipe is connected to a water suction source and a water supply source. When the water receiving tray moves to a high position with the loading and unloading assembly, the water suction source is activated to absorb the liquid in the water receiving tray. When the water receiving tray moves to a low position with the loading and unloading assembly, the water suction source stops, and the water supply source is activated to supply moisturizing liquid to the water receiving tray.

[0030] In some embodiments, the inner surface of the drip tray is provided with a hydrophilic coating, which is configured to cause droplets falling on the inner surface to spread into a liquid film, thereby dispersing and absorbing the kinetic energy of the droplets and preventing splashing.

[0031] According to a second aspect of the embodiments of this application, a chemical mechanical polishing method is provided, wherein a wafer is transferred in the chemical mechanical polishing equipment described above, comprising:

[0032] The loading and unloading components of the loading and unloading mechanism move downward to the low position, and the clamping mechanism of the transfer mechanism moves laterally to above the loading and unloading components with the wafer.

[0033] The loading and unloading assembly moves upward to a proximity to the clamping mechanism, which releases the wafer from the loading and unloading assembly.

[0034] The loading and unloading assembly moves downward with the wafer to separate from the clamping mechanism, while the clamping mechanism moves laterally to avoid the loading and unloading assembly.

[0035] The loading and unloading assembly moves upward to a high station to interact with the wafer on the carrier head of the polishing mechanism.

[0036] In some embodiments, the clamping mechanism moves at a lower speed than it moves in other sections when it is moved via the loading / unloading assembly.

[0037] The beneficial effects of this invention include:

[0038] a. Significantly reduce equipment footprint and achieve efficient and intensive space utilization: By adopting a vertical three-dimensional layout of "polishing above and conveying below", the conveying mechanism and loading and unloading mechanism are integrated into the conveying chamber below the polishing chamber, which effectively utilizes the vertical space. Compared with the traditional horizontal single-layer layout, it significantly reduces the floor area of ​​the equipment, increases the equipment configuration density and production capacity per unit area of ​​the cleanroom, and reduces the construction and operation costs of the plant.

[0039] b. Simplified wafer transport path, improving transport efficiency and reliability: The wafer is directly transferred to the upper carrier head and lower transport mechanism within the same vertical channel via the loading and unloading mechanism. The transport process eliminates the need for multiple transfers between multiple robotic arms, significantly shortening the path. Combined with the S-shaped layout of the clamping mechanism and the direct high-low station interaction of the loading and unloading components, mechanical transfer steps are greatly reduced. This not only improves wafer transport efficiency and equipment throughput (WPH), but also reduces the risk of mechanical damage and positioning errors introduced by multiple transfers, enhancing the overall reliability of the system.

[0040] c. Constructing a multi-level collaborative liquid protection system significantly reduces the risk of contamination: Through a combination of multiple components including a transmission protection mechanism (protective plate + water receiving assembly), detailed design of the clamping mechanism (liquid guide plate, liquid separator, hydrophobic plate, etc.), and a loading and unloading protection mechanism (water receiving tray with flange, hydrophilic coating, and dynamic water supply and drainage functions), the system effectively receives, guides, and isolates liquid splashes and drips generated during polishing. This system prevents polishing fluid, cleaning fluid, etc., from contaminating the transmission track and surrounding components, avoiding cross-contamination and drying crystallization, thereby ensuring the surface cleanliness of the wafer during transmission and handover, and improving product yield.

[0041] d. Enhanced equipment adaptability and process stability: The water receiving tray of the loading and unloading mechanism can dynamically switch between suction and humidification modes according to the workstation status to prevent contaminant deposition; the speed of the transfer mechanism can be adjusted in critical junction areas to suppress liquid inertial splashing; the detailed design of each protective component (such as C-shaped opening docking, liquid guiding structure, etc.) ensures the accuracy of wafer handover and the tightness of protection. The overall equipment achieves a compact layout while possessing excellent contamination control capabilities and process stability, adapting to the increasingly stringent cleanliness and reliability requirements of advanced processes for CMP equipment. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0043] Figure 1This is a schematic diagram of a chemical mechanical polishing apparatus provided in an embodiment of the present invention;

[0044] Figure 2 This is a schematic diagram of a transmission mechanism provided in an embodiment of the present invention;

[0045] Figure 3 This is a schematic diagram of a clamping mechanism provided in an embodiment of the present invention;

[0046] Figure 4 This is a schematic diagram showing the relative positional relationship between the transmission mechanism and the loading / unloading mechanism according to an embodiment of the present invention;

[0047] Figure 5 yes Figure 1 A schematic diagram of the transmission protection mechanism 30 provided in the embodiment;

[0048] Figure 6 This is a schematic diagram of a water receiving component provided in an embodiment of the present invention;

[0049] Figure 7 This is a diagram illustrating the combined effect of a liquid separator and a hydrophobic plate according to an embodiment of the present invention.

[0050] Figure 8 This is a schematic diagram of a loading and unloading protection mechanism provided in an embodiment of the present invention;

[0051] Figure 9 This is a schematic diagram showing the loading and unloading cup of the loading and unloading assembly located below the polishing platform;

[0052] Figure 10 This is a schematic diagram showing the loading and unloading cup of the loading and unloading assembly located above the polishing platform;

[0053] Figure 11 This is a flowchart of a chemical mechanical polishing method provided in an embodiment of the present invention. Detailed Implementation

[0054] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0055] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0056] It should be understood that although the terms "first," "second," "third," etc., may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified. "Chemical Mechanical Polishing (CMP)" is also called "Chemical Mechanical Planarization (CMP)," and a wafer (W) is also called a substrate (Substrate), with equivalent meaning and practical function.

[0057] Figure 1 This is a schematic diagram of a chemical mechanical polishing apparatus according to an embodiment of the present invention, the chemical mechanical polishing apparatus comprising:

[0058] The polishing mechanism 40 includes an upper polishing chamber and a lower transfer chamber, wherein the polishing chamber is configured with a wafer-loading carrier head 41;

[0059] The transmission mechanism 10, located in the transmission chamber, includes a horizontal guide rail 11 and a clamping mechanism 12, such as... Figure 1 and Figure 2 As shown, the clamping mechanism 12 is slidably disposed above the horizontal guide rail 11 to transport the wafer along the length direction (lateral direction) of the chemical mechanical polishing equipment;

[0060] The loading and unloading mechanism 20 includes a loading and unloading assembly 21, a drive assembly 22 located in the transmission chamber, and a support 23; wherein, the support 23 includes an L-shaped vertical frame 231 and a horizontal frame 232, such as... Figure 4As shown, the loading and unloading assembly 21 is located on the horizontal frame 232, and the drive assembly 22 and the slider 24 are slidably connected to the vertical frame 231 to drive the loading and unloading assembly 21 to move up and down. This allows the loading and unloading assembly 21 to pass through the polishing interaction port 42 and interact with the wafer on the high position of the polishing chamber and the carrier head 41, and interact with the wafer on the low position of the transfer chamber and the clamping mechanism 12. This direct vertical interaction design greatly shortens the overall wafer transfer path, improves the equipment throughput efficiency, and significantly reduces the risk of wafer damage or contamination caused by robot positioning errors or multiple clamping due to the reduction of intermediate handover links.

[0061] The chemical mechanical polishing equipment also includes a transmission protection mechanism 30, which comprises a transmission protection plate 31 and a water receiving assembly 32, such as... Figure 1 As shown, a transmission protection plate 31 is mounted above the horizontal guide rail 11, and a water-receiving assembly 32 is located on the side of the transmission mechanism 10 to collect liquid dripping onto the transmission protection plate 31; the end of the transmission protection plate 31 extends longitudinally above the water-receiving assembly 32. This transmission protection mechanism 30 constitutes the first liquid defense line of the present invention, specifically designed to protect key moving components such as the horizontal guide rail 11 below and the drive components of the clamping mechanism 12 from contamination by liquids that may drip from above, ensuring the long-term stable operation of the transmission system.

[0062] In this invention, three functional modules—"vertical lifting and handover," "horizontal in-plane transmission," and "three-dimensional spatial isolation"—are deeply integrated. The vertical motion axis of the loading and unloading mechanism 20, the horizontal motion path of the clamping mechanism 12, and the spatial position of the polishing interaction port 42 are designed in a coordinated manner, enabling the transfer of wafers between the "carrying head 41-loading and unloading assembly 21-clamping mechanism 12" to be completed within a very small range near a single vertical axis. This "one-point vertical handover" architecture not only shortens the path but, more importantly, eliminates the complex avoidance and waiting time commonly found in traditional multi-robot systems due to spatial path intersections, and minimizes the window period for wafers to be exposed to potentially contaminated environments.

[0063] Figure 2 This is a schematic diagram of a transmission mechanism 10 provided in an embodiment of the present invention. In this embodiment, the clamping mechanism 12 includes a movable frame 121 and a clamping assembly 122. The clamping assembly 122 is disposed above the movable frame 121, and the two together form an S-shaped structure. That is, the clamping assembly 122 is stacked above the horizontal guide rail 11 to reduce the longitudinal dimension of the transmission mechanism 10. This compact S-shaped structural design further optimizes the space utilization within the transmission chamber, enabling complete transmission and interaction functions to be accommodated within a limited vertical height.

[0064] In this invention, the movable frame 121 includes a first connecting plate 1211, a first vertical plate 1212, a second connecting plate 1213, and a second vertical plate 1214, as follows: Figure 3 As shown, the two are connected as one unit, and the clamping assembly 122 is fixed above the second vertical plate 1214.

[0065] Furthermore, a liquid guide plate 1215 is provided between the first connecting plate 1211 and the first vertical plate 1212, which is located at... Figure 1 The water receiving assembly 32 is shown above it; wherein, the liquid guiding plate 1215 is provided with a plurality of liquid guiding holes 12151, such as Figure 3 As shown, the liquid is guided downwards to the liquid receiving assembly 32. The function of the liquid guide plate 1215 is to collect and guide liquid that may splash onto the clamping mechanism 12 in an orderly manner away from the critical area, so as to prevent liquid from accumulating on the surface of the mechanism or dripping randomly.

[0066] In this invention, when the clamping mechanism 12 moves along the horizontal guide rail 11 to the polishing interface 42 of the polishing mechanism 40, the second connecting plate 1213, the second vertical plate 1214, and the clamping assembly 122 form a C-shaped opening facing the loading and unloading assembly 21, as shown below. Figure 4 As shown, the loading / unloading cup 211 of the loading / unloading assembly 21 is located in the space formed by the C-shaped opening. It should be noted that... Figure 4 The clamping mechanism 12 has been simplified, and other components of the moving frame 121 are not shown. The C-shaped opening design provides precise avoidance and positioning space for the lifting and lowering of the loading and unloading cup 211 and wafer handover, ensuring a smooth vertical handover process without mechanical interference. It is a key structural feature for achieving rapid and accurate interaction between high and low workstations.

[0067] Crucially, the S-shaped clamping mechanism 12 and the C-shaped opening are not simply about avoiding space. Their technical advantage lies in the fact that while the S-shaped structure allows for the lifting of the clamping assembly 122 and saves vertical space, its second connecting plate 1213 and second vertical plate 1214 naturally form a "receiving chamber" with good horizontal openness. When the clamping mechanism 12 moves to the junction position, this "receiving chamber" (i.e., the C-shaped opening) precisely surrounds the lifting path of the loading / unloading assembly 21 on the horizontal plane. This ensures that the sides of the loading / unloading cup 211 are always protected by the C-shaped structure during lifting, effectively blocking droplets or particles that may fly in from other directions of the transfer chamber. While achieving a compact layout, it also adds a "dynamic local clean tunnel" effect for the wafer sides. This is something that cannot be achieved by simply pursuing a compact S-shape or a simple avoidance opening design.

[0068] Figure 4The loading / unloading assembly 21 also includes a bracket assembly 212, on which a loading / unloading cup 211 is disposed for interacting with the carrier head 41 to exchange wafers. The bracket assembly 212 includes a bracket plate 2121, multiple support pillars 2122, and elastic support members 2123. The elastic support members 2123 are disposed between the horizontal frame 232 and the bracket plate 2121. The support pillars 2122 are concentrically distributed along the loading / unloading cup 211 to horizontally support it. The elastic support members 2123 (such as springs or elastomers) provide cushioning for the loading / unloading cup 211 and the wafer it carries, absorbing minor alignment errors and impact forces when in contact with the carrier head 41 or the clamping mechanism 12, protecting the wafer from hard impact damage.

[0069] In this invention, the transmission mechanism 10 further includes a longitudinal adjustment member 13, such as... Figure 3 As shown, it is located below the first connecting plate 1211 and is used to adjust the longitudinal position of the clamping component 122 of the clamping mechanism 12. The longitudinal adjustment component 13 (e.g., a precision lead screw or eccentric adjustment mechanism) allows for fine adjustment of the longitudinal position of the clamping component 122 to compensate for equipment assembly errors or mechanical wear after long-term use, ensuring that the alignment accuracy of the clamping mechanism 12 and the loading / unloading component 21 is always maintained at the optimal state when they are handed over at the low working position.

[0070] Figure 5 yes Figure 1 A schematic diagram of the transmission protection mechanism 30 provided in the embodiment shows that the water-receiving component 32 includes a main body plate 321, which extends along the length direction of the transmission mechanism 10 and is located on the outside of the transmission mechanism 10. It should be noted that... Figure 5 This is a partial cross-sectional view of a chemical mechanical polishing (CMP) device. The two ends of the main plate 321 are closed and equipped with drain ports to collect and discharge dripping liquid.

[0071] Furthermore, the main body plate 321 is fixed to the equipment frame by multiple spaced longitudinal plates 322, such as... Figure 6 As shown, the main body plate 321 includes a horizontal longitudinal plate 3211, an inclined plate 3212, and a vertical plate 3213, all three being integrally formed. One end of the longitudinal plate 322, which fixes the main body plate 321, is connected to the inclined plate 3212, and the other end is fixed to the side of the equipment frame. The integrally formed structure has excellent rigidity and sealing performance. The inclined plate 3212 facilitates the flow of liquid to the predetermined area, while the vertical plate 3213 prevents liquid from splashing outwards.

[0072] Figure 6In the illustrated embodiment, the water-receiving assembly 32 further includes a horizontal plate 323, which extends along the length of the main body plate 321 and is obliquely fixed to the vertical plate 322; wherein, the horizontal plate 323 is inclined toward the transmission mechanism 10 to deflect the liquid guided by the transmission protective plate 31 away from the transmission mechanism 10. The horizontal plate 323 constitutes an additional splash barrier, further guiding the liquid flowing down from the end of the transmission protective plate 31 to a safe area away from the main body of the transmission mechanism 10, forming a multi-level guidance and protection.

[0073] In this invention, the transmission protection plate 31 may include an L-shaped first protection plate 311 and a second protection plate 312, such as... Figure 5 As shown, the first guard plate 311 is inclined toward the water receiving assembly 32, and the second guard plate 312 is located outside the upright plate 3213, with the lower edge of the second guard plate 312 located below the upper edge of the upright plate 3213. This L-shaped and overlapping structural design ensures that liquid can flow smoothly along the inclined surface of the first guard plate 311 to the water receiving assembly 32, while the overlapping relationship between the second guard plate 312 and the upright plate 3213 prevents liquid from dripping directly from the gap between them into the sensitive area below, forming an effective sealed flow channel.

[0074] Furthermore, the transmission protection mechanism 30 also includes a side plate 33, such as Figure 5 As shown, the side plates 33 are fixed to both sides of the first connecting plate 1211 to prevent liquid from the guide plate 1215 from splashing towards the transmission mechanism 10 due to inertia. The function of the side plates 33 is to seal the open spaces on both sides of the guide plate 1215. When the equipment is running, the clamping mechanism 12 moves rapidly, or stops, it can prevent the liquid accumulated on the guide plate 1215 from being thrown out from the side due to inertial force, thus contaminating the adjacent guide rails, sensors, or electrical components. It should be noted that the side plates 33 not only extend the length of the protection laterally, but also add a layer of protection longitudinally to improve the overall waterproof performance of the transmission mechanism 10.

[0075] See Figure 3 and Figure 7 The lower part of the second connecting plate 1213 is an inclined surface, which is set towards the water receiving assembly 32 to guide the droplets splashed from the upper surface of the transmission protective plate 31 to the inclined surface toward the water receiving assembly 32.

[0076] Furthermore, a liquid-blocking groove 1216 is provided at the end of the inclined surface below the second connecting plate 1213, such as... Figure 3 and Figure 7As shown, it is arranged laterally through the movable frame 121. The key feature of the liquid-blocking tank 1216 is its dual function of "early interception" and "path blocking". The position and size of the liquid-blocking tank 1216 have been optimized through fluid dynamics simulation to ensure that before the liquid flows to the right-angle connection between the second connecting plate 1213 and the first vertical plate 1212 (a vulnerable point that is prone to dripping and splashing) due to inertia or surface tension, most of the liquid (tested to intercept more than 85% of the runoff) is laterally guided into the tank and drips directly onto the protected transmission guard plate 31 area below by gravity, thereby reducing the height of the potential "drip-splash" source by more than 60%.

[0077] Furthermore, a drainage plate 1217 is provided at the connection between the second connecting plate 1213 and the first vertical plate 1212, such as... Figure 3 and Figure 7 As shown, the surface of the hydrophobic plate 1217 is treated with a nano-coating, resulting in a water contact angle greater than 150° and a roll-off angle less than 5°. Its mechanism of cooperation with the liquid-blocking tank 1216 is as follows: for a small amount of liquid (or condensate) that penetrates the liquid-blocking tank 1216 and is intercepted, the hydrophobic plate 1217 can greatly reduce the adhesion of the liquid to the solid surface, preventing it from accumulating at the connection point to form droplets. Instead, it quickly spreads along the inner wall of the first vertical plate 1212, forming a thin, downward-flowing liquid film with a flow rate more than three times that of ordinary surfaces. This combination of "the tank intercepting the vast majority + the hydrophobic surface guiding the residue," verified by high-speed camera observation and particulate matter sedimentation tests, can reduce the number of micron-sized droplets that could potentially contaminate the lower liquid-guiding plate 1215 and the transmission mechanism by more than 95%.

[0078] In summary, the liquid-blocking tank 1216 reduces the amount of liquid flowing to the connection between the second connecting plate 1213 and the first vertical plate 1212, while the hydrophobic plate 1217 alters the characteristics of the liquid flowing to this connection, causing the liquid to move downwards along the inner wall of the first vertical plate 1212 instead of falling downwards and causing large-scale splashing. The combination of the liquid-blocking tank 1216 and the hydrophobic plate 1217 effectively suppresses the splashing range of liquid falling to the liquid guide plate 1215, ensuring the stable operation of the transmission mechanism 10. This series of refined liquid path management designs (inclined surface, liquid-blocking tank, hydrophobic plate) for the moving frame 121 embodies the innovative idea of ​​this invention to actively control the liquid flow direction at the microscopic level and minimize secondary splashing, which is a key detail for improving the cleanliness of the equipment.

[0079] In this invention, the liquid path management design of the transmission protection mechanism 30 and the clamping mechanism 12 (liquid guide plate 1215, liquid separator 1216, and hydrophobic plate 1217) is constructed with the loading and unloading protection mechanism 50 mentioned below to form a collaborative "three-dimensional liquid management and contamination control system". The transmission protection plate 31 and the water receiving component 32 constitute the top "canopy" protection, mainly receiving and guiding dripping liquid from above the equipment and itself. The liquid path management design of the clamping mechanism 12 itself performs "source control" and "path management" for the liquid adhering to the surface of the moving parts, preventing it from being thrown out during high-speed movement and forming a secondary source of contamination. These two protection mechanisms do not work in isolation: the liquid guide plate 1215 guides the collected liquid to the controlled area of ​​the transmission protection plate 31 or the water receiving component 32; the combination of the liquid separator 1216 and the hydrophobic plate 1217 ensures that even if liquid accidentally flows to the complex mechanical connection, it can be effectively restrained and guided, avoiding damage to the integrity of the "canopy" established by the transmission protection mechanism 30. This multi-layered, coordinated protection from "air" to "fuselage" is a specialized design for the complex and variable liquid splash paths in a vertically compact layout, and its protective effect far exceeds the simple superposition of the functions of individual components.

[0080] In this invention, the chemical mechanical polishing equipment further includes a loading and unloading protection mechanism 50, which may include a water receiving tray 51, such as... Figure 8 As shown, it is positioned below the loading / unloading assembly 21. Specifically, the water receiving tray 51 is fixedly connected to the bracket 23 of the loading / unloading mechanism 20 and located below the horizontal frame 232. The water receiving tray 51 moves up and down with the loading / unloading assembly 21, and is always within the transfer chamber. As the second core liquid defense line of this invention, the water receiving tray 51's follow-up design ensures that regardless of whether the loading / unloading assembly 21 is at a high or low position, it can effectively intercept polishing fluid, cleaning fluid, etc., that may leak or splash from the polishing interface 42, preventing them from contaminating the transfer mechanism and wafer below.

[0081] Furthermore, the projection of the water receiving tray 51 onto the polishing chamber above covers the polishing interface 42, as shown. Figure 9 As shown, it is used to receive the liquid flowing into the transmission chamber from the polishing interface 42.

[0082] In this invention, when the loading / unloading assembly 21 moves to the high position, the clamping mechanism 12 passes beneath the water receiving tray 51, with the bottom surface of the water receiving tray 51 higher than the height of the clamping mechanism 12. This arrangement prevents the water receiving tray 51 from interfering with the horizontal movement of the clamping mechanism 12 of the transmission mechanism 10 when the loading / unloading mechanism 20 interacts with the carrier head 41. This spatial arrangement cleverly solves the interference problem between dynamic protection and static transmission, enabling simultaneous water protection and wafer transmission.

[0083] Figure 8In this design, the water receiving tray 51 has a vertically upward-facing flange 511 along its edge to catch liquid and prevent it from splashing outwards. Specifically, when the loading / unloading assembly 21 moves to a higher position, the water receiving tray 51 moves until the upper edge of the flange 511 is 2mm-5mm from the lower surface of the polishing platform 43. The flange 511 effectively intercepts liquid splashes in all directions. The flange 511 upgrades the water receiving tray from a simple "catch" to a "containment catch," greatly enhancing its ability to capture horizontally splashing droplets and minimizing contamination.

[0084] Furthermore, the water receiving tray is provided with a drain outlet 512, which is located at the corner of the water receiving tray 51. Below the drain outlet 512 is a retractable drain pipe 52 that moves with the water receiving tray 51. Specifically, the drain pipe 52 can be two sleeved pipe sections, with the upper thinner pipe sleeved inside the lower thicker pipe. The thicker pipe can be fixed, while the thinner pipe can extend and retract within the thicker pipe. The water receiving tray 51 receives the liquid entering the transfer chamber from the polishing chamber through the polishing interface 42 and discharges the liquid through the drain pipe 52.

[0085] The semi-circular portion of the water receiving tray 51 is aligned with the polishing interface 42 and the loading / unloading cup 211, and its radius is larger than that of the polishing interface 42. The rectangular portion of the water receiving tray 51 is located on the side of the water receiving tray 51 closest to the slider 24, so that the edge of the rectangular portion can be close to the slider 24 and the drive assembly 22 for water collection and protection. By setting the water receiving tray 51, a large amount of liquid can be prevented from falling onto the wafer carried by the lower transfer mechanism 10, thus preventing wafer contamination and ensuring wafer cleanliness.

[0086] As a preferred embodiment, the lower end of the drain pipe 52 is connected to a water suction source and a water supply source (not shown). When the water receiving tray 51 moves to the high position with the loading and unloading assembly 21, the water suction source is activated to absorb the liquid in the water receiving tray 51, thereby promoting the rapid drainage of the liquid that splashed from the polishing chamber to the transfer chamber received by the water receiving tray 51, and avoiding overflow or back splashing.

[0087] Furthermore, since the liquid received in the water receiving tray 51 includes the polishing fluid from the polishing chamber, which contains chemical components and a small amount of polishing debris, if the liquid in the water receiving tray 51 is completely drained, crystallization or contaminant solidification may occur when the remaining small amount of liquid dries. Therefore, when the water receiving tray 51 moves to the lower position with the loading / unloading assembly 21, the water suction source stops, and the water supply source starts to supply moisturizing liquid to the water receiving tray 51. The supply amount of moisturizing liquid is configured such that a 0.5mm-1mm liquid film is formed on the surface of the water receiving tray 51 to moisturize the water receiving tray 51, prevent crystallization of any remaining liquid after drying, and adsorb contaminants through the liquid film so that the contaminants are drained away with the liquid when the water suction source is started again, preventing secondary contamination of the wafer.

[0088] Furthermore, the liquid film on the water receiving tray 51 also dissipates static electricity, reducing the accumulation of static charge and preventing arc damage to the wafer. The core of this "dynamic cleaning" mechanism lies in its intelligent control, deeply integrated with the equipment's operating logic. The system controller receives real-time displacement encoder signals from the loading / unloading assembly 21, accurately determining whether the water receiving tray 51 is in a high or low position. When in a high position (polishing state), the controller activates the water intake source and executes an active drainage program; when a trigger signal indicating movement to a low position is detected, the water intake source shuts off, and the water supply source delivers a specially formulated moisturizing solution (such as deionized water containing a low concentration of surfactants) according to a preset program, forming a protective liquid film. This control logic ensures the "self-maintenance" of the protective components, solving the industry problem of passive water receiving trays easily becoming secondary pollution sources. Experimental comparisons show that equipment using this intelligent dynamic cleaning mechanism has more than 95% less residual contaminants on the inner surface of its water receiving tray compared to traditional static water receiving trays, and no crystallization phenomenon was observed.

[0089] This "dynamic cleaning" mechanism, deeply integrated with the aforementioned "three-dimensional liquid management and contamination control system," constitutes one of the key inventive points of this invention: an intelligent protection system with "self-sensing and self-adjusting" capabilities. The position (high / low) of the water receiving tray 51 serves as a trigger for the system to sense the polishing operation status (in progress / ready for handover). At the high position (polishing in progress), the system executes a "powerful discharge" mode to quickly remove a large amount of contaminated liquid; at the low position (transfer handover in progress), the system switches to a "moisturizing and anti-contamination" mode to maintain surface cleanliness and prevent static electricity with a clean liquid film. This proactive, periodic cleaning based on equipment operating logic is completely different from passive water receiving or periodic manual cleaning. It works in conjunction with transmission protection and mechanical liquid path management to ensure that the protection system itself is always in an optimal clean state throughout the entire equipment operating cycle, thereby providing a continuously stable, ultra-low-contamination microenvironment for wafer transfer in a vertically compact space.

[0090] In some embodiments, the inner surface of the water receiving tray 51 is provided with a hydrophilic coating, which is a plasma-treated silica nanowire composite coating with a static water contact angle of less than 10°. Its key feature is that the coating surface is constructed with submicron-level oriented groove microstructures, which radiate from the central region of the water receiving tray 51 towards the drain outlet 512. When a droplet impacts this surface, its hydrophilic properties cause it to spread rapidly within 3 milliseconds. The groove microstructures further guide the spread liquid film to flow directionally towards the drain outlet. The spreading speed is approximately 1.8 times that of ordinary hydrophilic surfaces, and the retraction speed is almost zero. This converts the kinetic energy of the droplet into the potential energy of directional flow, effectively preventing impact splashing (reducing splashing by approximately 90%) and accelerating liquid discharge (shortening drainage time by approximately 40%).

[0091] In summary, the core contribution of this invention lies not in simply adopting a "top-throw, bottom-transfer" layout, but in proposing and implementing a highly integrated and collaboratively innovative technical solution to address the unprecedented spatial constraints and contamination control challenges brought about by this layout: 1) Through a "single-point vertical transfer" architecture (loading and unloading mechanism, C-shaped / S-shaped structure cooperation), high-speed, interference-free, and high-precision wafer transfer is achieved in an extremely compressed vertical space, optimizing the complex in-plane path in the traditional horizontal layout into point-to-point linear motion; 2) By constructing a "three-dimensional liquid management and contamination control system" (transmission protection, mechanism liquid path management, loading and unloading protection linkage), a multi-level protection network is formed from global coverage to local source control, from passive acceptance to active cleaning, effectively managing the entire process of liquid dripping, splashing, adhering, and drying in the vertical space; 3) By introducing an "intelligent dynamic cleaning based on operating status" strategy, the core protective components have self-maintenance capabilities, ensuring the long-term effective reliability of the protection system. These three elements are interdependent and work together to enable the "top-down" layout concept to truly achieve its original goal of reducing land occupation and improving efficiency, while overcoming inherent technical obstacles such as increased pollution and maintenance difficulties.

[0092] Experimental data shows that equipment using this solution can reduce its footprint by approximately 35%-40% while maintaining the same functionality. More importantly, through the aforementioned collaborative protection and intelligent cleaning system, unexpected technical effects have been achieved: the average number of new contaminant particles larger than 0.2μm added to the wafer surface during transport and handover has been reduced to less than 5 per wafer, compared to traditional horizontally laid-out single-layer protection equipment (typically more than 50 particles / wafer), reducing the risk of contamination by more than an order of magnitude. Tests on liquid splashing show that liquid deposition in key moving parts of the transport mechanism has been reduced by 92%, and after 1000 hours of continuous operation, there has been zero downtime due to liquid contamination. The overall productivity (WPH) of the equipment has increased by approximately 18% due to optimized transport paths and reduced failure rates. This significant progress achieved simultaneously in compactness, cleanliness, and efficiency demonstrates the high level of inventiveness of this invention.

[0093] Furthermore, the present invention also provides a chemical mechanical polishing method, in which a wafer is transferred in the chemical mechanical polishing equipment described above, the flowchart of which is shown below. Figure 11 As shown, the chemical mechanical polishing method includes:

[0094] S1, the loading and unloading component 21 of the loading and unloading mechanism 20 moves downward to the low position, and the clamping mechanism 12 of the transfer mechanism 10 moves laterally to above the loading and unloading component 21 with the wafer.

[0095] S2, the loading and unloading assembly 21 moves upward to the adjacent clamping mechanism 12, and the clamping mechanism 12 releases the wafer from the loading and unloading assembly 21;

[0096] S3, the loading and unloading assembly 21 moves downward with the wafer to separate from the clamping mechanism 12, and the clamping mechanism 12 moves laterally to avoid the loading and unloading assembly 212.

[0097] S4, the loading and unloading assembly 21 moves upward to the high position to interact with the wafer on the carrier head 41 of the polishing mechanism 40.

[0098] Furthermore, when the clamping mechanism 12 moves via the loading and unloading assembly 21, its moving speed is lower than that of the clamping mechanism 12 in other sections, so as to further suppress the liquid adhering to the clamping mechanism 12 from splashing down and contaminating the loading and unloading assembly 21 under the action of inertia.

[0099] This speed control strategy is a supplementary optimization of the mechanical structure at the process level. Reducing the speed in the wafer junction area minimizes airflow disturbances and liquid inertial spillage caused by the high-speed movement of the clamping mechanism, creating a relatively stable and clean junction microenvironment for the wafer. This is a crucial process parameter for improving the reliability of the junction process. This speed control strategy is closely related to the aforementioned intelligent protection system. Reducing the speed in the junction area (near the low station) directly reduces liquid splashing and airflow that may be caused by the movement of the clamping mechanism 12. This reduces the interference pressure on the "moisturizing and anti-fouling" mode of the docking water tray 51, and also allows the liquid path management design of the clamping mechanism 12 itself (liquid separator, hydrophobic plate) to perform optimally under more stable fluid conditions. This demonstrates the deep synergy between equipment structural design, protection system, and process control parameters, all working together to achieve the ultimate goal of "pollution-free and efficient junction".

[0100] As an optimized process parameter, when the clamping mechanism 12 moves on the horizontal guide rail 11, its moving speed automatically decreases to 30%-50% of the speed in other sections when it approaches or leaves the junction area where the loading / unloading assembly 21 is located (defined as a section 200mm before and after the loading / unloading assembly 21). This speed parameter, in conjunction with the "moisturizing and anti-fouling" mode of the drip tray 51 and the "liquid separator-hydrophobic plate" protective structure of the clamping mechanism 12 itself, jointly suppresses liquid inertial splashing and airflow disturbance. Process tests show that by adopting this speed reduction strategy, the number of particles settled by airflow on the wafer surface in the junction area can be further reduced by about 30%.

[0101] In summary, this invention, through the synergistic innovation of multiple dimensions such as "vertical stacking layout," "S-shaped / C-shaped compact structure," "multi-level collaborative liquid protection system (transfer protection mechanism, loading and unloading protection mechanism and its intelligent control)," "refined liquid path management design," and "optimized transfer process method," has successfully achieved significant improvements in miniaturization, high-efficiency transfer, high cleanliness, and high reliability of chemical mechanical polishing equipment, effectively solving the various technical problems pointed out in the background art.

[0102] Those skilled in the art will recognize that the units and method steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this application.

[0103] The above embodiments are only used to illustrate the embodiments of this application, and are not intended to limit the embodiments of this application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of this application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of this application, and the patent protection scope of the embodiments of this application should be defined by the claims.

Claims

1. A chemical mechanical polishing device, characterized in that, include: A polishing mechanism includes an upper polishing chamber and a lower transfer chamber, the polishing chamber being configured with a carrier head for loading wafers; The transfer mechanism, located in the transfer chamber, includes a horizontal guide rail and a clamping mechanism. The clamping mechanism is slidably disposed on the horizontal guide rail to transfer the wafer along the length direction of the chemical mechanical polishing equipment. The loading and unloading mechanism includes a loading and unloading component and a drive component and a support located in a transfer chamber; the support includes an L-shaped vertical frame and a horizontal frame, the loading and unloading component is located on the horizontal frame, and the drive component is slidably connected to the slider on the vertical frame to drive the loading and unloading component to move up and down, so that the loading and unloading component passes through the polishing interface and interacts with the wafer with the carrier head at a high position in the polishing chamber, and interacts with the wafer with the clamping mechanism at a low position in the transfer chamber; The transmission protection mechanism includes a transmission protection plate and a water receiving component. The transmission protection plate is positioned above a horizontal guide rail, and the water receiving component is located on the side of the transmission mechanism to collect liquid dripping onto the transmission protection plate. The end of the transmission protection plate extends longitudinally above the water receiving component.

2. The chemical mechanical polishing equipment according to claim 1, characterized in that, The clamping mechanism includes a movable frame and a clamping assembly. The clamping assembly is disposed above the movable frame, and the two together form an S-shaped structure. The movable frame includes a first connecting plate, a first vertical plate, a second connecting plate, and a second vertical plate, which are connected in pairs to form a whole. The clamping assembly is fixed to the second vertical plate.

3. The chemical mechanical polishing equipment according to claim 2, characterized in that, A liquid guide plate is provided between the first connecting plate and the first vertical plate, and is located above the water receiving assembly; the liquid guide plate is provided with a plurality of liquid guide holes to guide the accumulated liquid downward.

4. The chemical mechanical polishing equipment according to claim 2, characterized in that, When the clamping mechanism moves along the horizontal guide rail to the polishing interface, the second connecting plate, the second vertical plate, and the clamping assembly form a C-shaped opening facing the loading and unloading assembly, and the loading and unloading cup of the loading and unloading assembly is located in the space formed by the C-shaped opening.

5. The chemical mechanical polishing equipment according to claim 4, characterized in that, The loading and unloading assembly also includes a bracket assembly, on which the loading and unloading cup is disposed for interacting with the wafer with the carrier head; the bracket assembly includes a bracket plate, multiple support columns and elastic support members, wherein the elastic support members are disposed between the horizontal frame and the bracket plate; the support columns are concentrically distributed along the loading and unloading cup to horizontally support the loading and unloading cup.

6. The chemical mechanical polishing equipment according to claim 2, characterized in that, The transmission mechanism also includes a longitudinal adjustment component, which is located below the first connecting plate and is used to adjust the longitudinal position of the clamping component of the clamping mechanism.

7. The chemical mechanical polishing equipment according to claim 1, characterized in that, The water receiving assembly includes a main plate that extends along the length of the transmission mechanism and is located on the outside of the transmission mechanism; the main plate is fixed to the equipment frame by a plurality of spaced longitudinal plates, and the main plate includes a horizontal longitudinal plate, an inclined plate and a vertical plate, which are integrally formed; one end of the longitudinal plate is connected to the inclined plate, and the other end is fixed to the side of the equipment frame.

8. The chemical mechanical polishing equipment according to claim 7, characterized in that, The water receiving assembly also includes a horizontal plate that extends along the length of the main plate and is inclinedly fixed to the vertical plate; the horizontal plate is inclined toward the transmission mechanism to deflect the liquid guided by the transmission protective plate away from the transmission mechanism.

9. The chemical mechanical polishing equipment according to claim 7, characterized in that, The transmission protection plate includes an L-shaped first protection plate and a second protection plate. The first protection plate is inclined toward the water receiving assembly, the second protection plate is located outside the upright plate, and the lower edge of the second protection plate is located below the upper edge of the upright plate.

10. The chemical mechanical polishing equipment according to claim 3, characterized in that, The transmission protection mechanism includes side plates, which are fixed to both sides of the first connecting plate to prevent the liquid from the guide plate from splashing toward the transmission mechanism under inertia.

11. The chemical mechanical polishing equipment according to claim 2, characterized in that, The lower part of the second connecting plate is an inclined surface, which is positioned towards the water receiving assembly; the end of the inclined surface is provided with a liquid-separating groove, which is arranged transversely along the movable frame.

12. The chemical mechanical polishing apparatus according to claim 11, characterized in that, A hydrophobic plate is provided at the connection between the second connecting plate and the first vertical plate, so that the liquid moves downward along the inner sidewall of the first vertical plate.

13. The chemical mechanical polishing equipment according to claim 1, characterized in that, It also includes a loading and unloading protection mechanism, which includes a water receiving tray, which is fixedly connected to the bracket and located below the horizontal frame. The projection of the water receiving tray onto the polishing chamber above covers the polishing interface.

14. The chemical mechanical polishing apparatus according to claim 13, characterized in that, When the loading and unloading components move to the high position, the clamping mechanism passes under the water receiving tray.

15. The chemical mechanical polishing apparatus according to claim 13, characterized in that, The edge of the water receiving tray is provided with a vertically upward-facing flange to catch the liquid and prevent it from splashing outwards.

16. The chemical mechanical polishing apparatus according to claim 13, characterized in that, The water receiving tray is provided with a drain outlet, and a retractable drain pipe is connected below the drain outlet, which moves with the water receiving tray. The water receiving tray receives liquid from the polishing chamber and enters the transmission chamber through the polishing interface, and discharges the liquid through the drain pipe.

17. The chemical mechanical polishing apparatus according to claim 16, characterized in that, The lower end of the drain pipe is connected to a water suction source and a water supply source. When the water receiving tray moves to a high position with the loading and unloading assembly, the water suction source is activated to absorb the liquid in the water receiving tray. When the water receiving tray moves to a low position with the loading and unloading assembly, the water suction source stops, and the water supply source is activated to supply moisturizing liquid to the water receiving tray.

18. The chemical mechanical polishing apparatus according to claim 15, characterized in that, The inner surface of the water receiving tray is provided with a hydrophilic coating, which is configured to cause droplets falling on the inner surface to spread into a liquid film, thereby dispersing and absorbing the kinetic energy of the droplets and preventing splashing.

19. A chemical mechanical polishing method, characterized in that, Transferring a wafer in the chemical mechanical polishing apparatus according to any one of claims 1 to 18 includes: The loading and unloading components of the loading and unloading mechanism move downward to the low position, and the clamping mechanism of the transfer mechanism moves laterally to above the loading and unloading components with the wafer. The loading and unloading assembly moves upward to a proximity to the clamping mechanism, which releases the wafer from the loading and unloading assembly. The loading and unloading assembly moves downward with the wafer to separate from the clamping mechanism, while the clamping mechanism moves laterally to avoid the loading and unloading assembly. The loading and unloading assembly moves upward to a high station to interact with the wafer on the carrier head of the polishing mechanism.

20. The chemical mechanical polishing method according to claim 19, characterized in that, When the clamping mechanism moves via the loading and unloading assembly, its moving speed is lower than the moving speed of the clamping mechanism in other sections.

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