Semiconductor chip coating equipment

Abstract

The invention belongs to the technical field of semiconductors, and particularly relates to semiconductor chip coating equipment which comprises a workbench, a coating disc is rotatably arranged on the upper end face of the workbench, a plurality of supporting frames designed in a circumferential array mode are fixedly installed on the upper end face of the coating disc, and an adsorption pipe is arranged on the inner side of each supporting frame. A chip body is arranged above each supporting frame, the adsorption pipe is used for adsorbing the lower end face of the chip body, a film coating frame is installed on the side of the workbench and located on the side wall of the film coating disc, and a film coating head is arranged on the end face of the film coating frame; the controller controls the film coating disc to stop rotating and controls the film coating head to move towards the side close to the chip body, and then the film coating head conducts film coating treatment on the upper end face and the periphery of the chip body; through the design of the first contact and the second contact, when the first contact and the second contact are in contact with each other, one group of chip bodies can just move to the position below a coating head.

Description

[0001] This application is a divisional application of application filed on September 30, 2025, with application number 2025114187774 and invention title "A Semiconductor Chip Coating Apparatus and Coating Method". Technical Field

[0002] This invention belongs to the field of semiconductor technology, specifically a semiconductor chip coating device. Background Technology

[0003] Semiconductor chips are ubiquitous, and coating is an important part of semiconductor chip manufacturing. Most coating equipment now uses vacuum coating technology, which requires coating equipment.

[0004] Existing technologies also offer some solutions. For example, a Chinese patent application with publication number CN210866113U discloses a semiconductor chip coating device, including a base plate, an operation panel, an operation panel control unit, a baffle, a circular shaft control unit, a circular shaft, a coating head, and a support column. The base plate has a first support frame, a second support frame, and a support plate fixedly connected to its upper surface. The operation panel control unit is installed in the middle of the base plate, and the first support frame is located on the front side of the base plate. The operation panel is installed on the upper part of the operation panel control unit. The support column is fixedly connected to the left end of the upper surface of the base plate. The support column is a right-angled support column, and a support rod is fixedly connected to the right side of the middle part of the support column. This semiconductor chip coating device can achieve complete coating, high speed, and very high efficiency during operation.

[0005] While the above technical solutions improve chip coating efficiency, other problems still exist in practical applications. To improve the stability of the coating process, the chip needs to be clamped. However, when using a clamping mechanism, the chip sidewalls are clamped, making it difficult for the coating head to coat the clamped areas of the sidewalls during subsequent coating. Moreover, because the clamping mechanism directly contacts the chip surface, it may cause scratches on the chip surface.

[0006] Therefore, the present invention provides a semiconductor chip coating apparatus. Summary of the Invention

[0007] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0008] The technical solution adopted by the present invention to solve its technical problem is as follows: The semiconductor chip coating apparatus of the present invention includes a worktable, a coating disk rotatably disposed on the upper end surface of the worktable, a plurality of support frames arranged in a circumferential array fixedly installed on the upper end surface of the coating disk, an adsorption tube disposed on the inner side of each support frame, the adsorption tube being used to adsorb the lower end surface of the chip body, a coating frame being installed on the side of the worktable and located on the side wall of the coating disk, and a coating head being disposed on the end face of the coating frame.

[0009] Preferably, a contact point one is fixedly installed on the side wall of the support frame, and a contact point two is installed on the side wall of the coating frame via a support rod. During the rotation of the coating disc, the contact point one will rotate and come into contact with the contact point two on the side wall of the coating frame.

[0010] Preferably, the coating disk has an annular channel inside, and the bottom end of each adsorption tube extends into the annular channel. An external suction tube creates an internal negative pressure inside the annular channel. The suction tube is installed inside the coating disk and controlled by a controller and a valve body. During operation, the controller controls the suction tube to draw air, ensuring that the annular channel and each adsorption tube are under negative pressure. This allows the adsorption tube to adsorb the lower end face of the chip body, ensuring stability during subsequent coating processes. This design avoids the problem in existing technologies where clamping mechanisms hold the sidewalls of the chip body, making it difficult for the coating head to coat the clamped areas during subsequent coating. It also avoids damage caused by excessive force from the clamping mechanism due to the relatively low hardness of the chip body, thus facilitating the subsequent use of the semiconductor chip.

[0011] Preferably, a square block is fixedly installed on the outer peripheral surface of the adsorption tube, and guide grooves are provided on both side walls of the square block. An electric telescopic rod is fixedly installed on the groove wall of the guide groove, and a slanted frame is fixedly installed on the telescopic end of the electric telescopic rod. A ring-shaped placement frame is fixedly installed on the top of the slanted frame.

[0012] Preferably, the inner wall of the annular placement frame has a limiting groove, the diameter of which is greater than the length of the chip body. Smooth rubber is provided inside the limiting groove, and the shape of the guide groove matches the shape of the electric telescopic rod. During operation, because the limiting groove is provided on the inner wall of the annular placement frame, when the chip body is transferred to the inner wall of the annular placement frame by the robotic arm, the chip body will first be placed in the limiting groove. After being adsorbed by the adsorption tube, when the annular placement frame is moved downwards through the aforementioned control, the annular placement frame and the limiting groove can move along the side wall of the chip body. This design facilitates the placement of the chip body inside the limiting groove and ensures that the chip body will not move when the limiting groove moves from the side wall of the chip body.

[0013] Preferably, the inner wall of the annular pipe is equipped with elastic telescopic columns arranged in a circumferential array. Each set of elastic telescopic columns corresponds one-to-one with the adsorption tube. A magnetic plate is fixedly installed on the upper end face of each set of elastic telescopic columns. A telescopic spring is sleeved on the outer surface of the elastic telescopic columns. A recycling platform is installed above the worktable and on the side wall of the coating tray. A recycling unit is provided above the worktable for recycling the coated chip body. A magnetic block is installed inside the worktable and on the side near the recycling platform. The magnetic block has the same magnetic properties as the magnetic plate.

[0014] Preferably, the recycling unit includes an L-shaped fixing rod, which is installed in the middle of the worktable and does not contact the coating plate. An arc-shaped protrusion is fixedly installed at the end of the L-shaped fixing rod away from the worktable. When the coating plate drives the support frame and the chip body to rotate, the lower end of the chip body will contact the protruding end of the arc-shaped protrusion. The recycling table is designed to be inclined relative to the horizontal plane. During operation, when the coating disc stops rotating, the coated chip body moves to the side corresponding to the magnetic block, and the magnetic plate moves closer to the bottom of the adsorption tube. During this process, the coating disc will drive the coated chip body to move closer to the arc-shaped bump, and gradually move towards the raised surface along the horizontal plane of the arc-shaped bump. Then, under the limit of the raised surface of the arc-shaped bump, the chip body will be tilted. At this time, the adsorption force of the adsorption tube will decrease, and the tilted chip body will slide onto the surface of the recycling platform and be recycled into the external device along the recycling platform.

[0015] Preferably, the surface of the recycling platform is equipped with multiple rotating rollers arranged in a linear array. During operation, when the chip body is tilted on the surface of the recycling platform, the rotating rollers can be controlled to rotate, which can facilitate the movement of the chip body and make it move away from the adsorption tube as quickly as possible.

[0016] Preferably, a semiconductor chip coating method, using the semiconductor chip coating apparatus described above, includes the following steps: S1. The chip body is clamped from the transport station and sent to the top of the support frame by an external mechanical suction hand, and the negative pressure is generated by the suction tube to firmly attach the lower end face of the chip body to the top of the support frame. S2. Then, the coating disk is rotated above the worktable by an external controller, so that the coating disk drives one of the support frames and the chip body to move closer to the coating frame. S3. When the chip body moves below the coating head, stop moving the coating plate. Then the coating head can be used to coat the chip body.

[0017] Preferably, in step S1, the adsorption tube is made of rubber.

[0018] The beneficial effects of this invention are as follows: 1. The semiconductor chip coating equipment of the present invention uses a magnetic plate to move closer to the bottom of the adsorption tube. After the magnetic plate moves closer to the bottom of the adsorption tube, the adsorption force generated by the adsorption tube on the side of the recycling station decreases. Then, under the action of the recycling unit, the coated chip body can be pressed against and moved to the surface of the recycling station, realizing the automatic recycling function of the coated chip body without the need for manual operation by the staff.

[0019] 2. In the semiconductor chip coating equipment described in this invention, when the subsequent chip body coating is completed and the coating disk continues to rotate, one of the magnetic plates separates from the magnetic block. Under the elastic force of the elastic telescopic column, the magnetic plate can be driven back to its initial position. When the subsequent chip body moves above the magnetic block again, the coated chip body will be taken out according to the above steps. This design allows for continuous coating and recycling of the chip body, is relatively convenient to operate, and is beneficial to the subsequent use of semiconductor chips. Attached Figure Description

[0020] The invention will now be further described with reference to the accompanying drawings.

[0021] Figure 1 This is a perspective view of the present invention; Figure 2 This is a schematic diagram of the coating frame structure in this invention; Figure 3 This is a top view of the structure in this invention; Figure 4 This is a schematic diagram of the support frame structure in this invention; Figure 5 This is a schematic diagram of the adsorption tube structure in this invention; Figure 6 This is a schematic diagram of the square block structure in this invention; Figure 7 This is a schematic diagram of the magnetic block structure in this invention; Figure 8 This is a schematic diagram of the recycling platform structure in this invention; Figure 9 This is a schematic diagram of the L-shaped fixing rod structure in this invention; Figure 10 This is a schematic diagram of the arc-shaped protrusion structure in this invention; Figure 11 This is a flowchart of the method in this invention.

[0022] In the diagram: 1. Workbench; 101. Coating rack; 102. Coating head; 2. Coating disc; 3. Support frame; 4. Adsorption tube; 301. Chip body; 5. Contact one; 6. Contact two; 7. Annular pipe; 8. Square block; 9. Guide groove; 901. Electric telescopic rod; 10. Inclined frame; 11. Annular placement rack; 12. Limiting ring groove; 13. Elastic telescopic column; 14. Magnetic plate; 15. Magnetic block; 16. Recycling table; 17. L-shaped fixing rod; 18. Arc-shaped protrusion; 19. Rotating roller. Detailed Implementation

[0023] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0024] like Figures 1 to 10 As shown in the embodiment of the present invention, a semiconductor chip coating apparatus includes a worktable 1. A coating disk 2 is rotatably mounted on the upper surface of the worktable 1. A plurality of support frames 3 arranged in a circumferential array are fixedly mounted on the upper surface of the coating disk 2. An adsorption tube 4 is provided on the inner side of each support frame 3. During coating, the chip body 301 is placed above each support frame 3. The adsorption tube 4 is used to adsorb the lower surface of the chip body 301. A coating rack 101 is mounted on the side of the worktable 1 and on the side wall of the coating disk 2. A coating head 102 is provided on the end face of the coating rack 101. During operation, an external mechanical suction arm clamps the chip body 301 from the transport station to the support frame 3. The suction tube 4 generates negative pressure, tightly adhering the lower surface of the chip body 301 to the support frame 3. An external controller then controls the coating disc 2 to rotate above the worktable 1, causing it to move one set of support frames 3 and the chip body 301 closer to the coating frame 101. When the chip body 301 moves below the coating head 102, the movement of the coating disc 2 stops, and the coating head 102 then coats the chip body 301. Adhering the lower surface of the chip body 301 via the suction tube 4 avoids the problem in existing technologies where clamping mechanisms hold the sidewalls of the chip body 301, making it difficult for the coating head 102 to coat the clamped areas. It also avoids damage caused by excessive force from the clamping mechanism due to the relatively low hardness of the chip body 301. It should be noted that the way the coating holder 101 controls the movement of the coating head 102 and the coating of the coating head 102 on the chip body 301 are existing technologies. That is, stainless steel (transition layer) and copper (shielding layer) are sputtered on the top surface and four side walls of the chip body 301 to prevent electromagnetic interference. The specific details will not be elaborated in the embodiments of the present invention. Moreover, the method of driving the coating disk 2 to rotate is also existing technology. In the embodiment of the present invention, a toothed ring can be provided on the outer wall of the coating disk 2, and then the toothed ring and the coating disk 2 can be rotated by a gear.

[0025] The support frame 3 has a contact point 5 fixedly installed on its side wall, and the coating frame 101 has a contact point 6 installed on its side wall via a support rod. When the coating plate 2 rotates, it will drive the contact point 5 to rotate and come into contact with the contact point 6 on the side wall of the coating frame 101. During operation, the coating disk 2 is controlled by an external controller to rotate above the worktable 1, causing the coating disk 2 to move one of the support frames 3 and the chip body 301 closer to the coating frame 101. At the same time, the coating disk 2 will also move the support frame 3 and contact 1 5 closer to contact 2 6. When contact 1 5 and contact 2 6 come into contact, contact 2 6 will transmit a contact signal to the external controller. The controller will first control the coating disk 2 to stop rotating and control the coating head 102 to move closer to the chip body 301. Then the coating head 102 will perform coating treatment on the upper surface and around the chip body 301. By designing contact 5 and contact 6, when the two contacts each other, one set of chip bodies 301 can move just below the coating head 102. This design can automatically control the movement of the coating disk 2, making it convenient for the chip bodies 301 to be coated.

[0026] The coating plate 2 has an annular pipe 7 inside, and the bottom end of each adsorption tube 4 passes through the inside of the annular pipe 7. The inside of the annular pipe 7 is negatively pressured by an external suction tube. The suction tube is installed inside the coating plate 2 and controlled by a controller and a valve body. During operation, the suction tube is controlled by the controller to draw the chip, so that the annular pipe 7 and each suction tube 4 are in a negative pressure state. This allows the suction tube 4 to adsorb the lower end face of the chip body 301, ensuring stability during the subsequent coating process. This design avoids the problem in the prior art where the clamping mechanism holds the side wall of the chip body 301, making it difficult for the coating head 102 to coat the clamped part of the side wall during subsequent coating. It also avoids direct contact between the chip body 301 and the clamping mechanism, which could scratch the surface of the chip body 301 and is beneficial for the subsequent use of the semiconductor chip.

[0027] A square block 8 is fixedly installed on the outer periphery of the adsorption tube 4. Guide grooves 9 are opened on both sides of the square block 8. An electric telescopic rod 901 is fixedly installed on the groove wall of the guide groove 9. A slant frame 10 is fixedly installed at the telescopic end of the electric telescopic rod 901. A ring-shaped placement frame 11 is fixedly installed at the top of the slant frame 10. During operation, when the external mechanical suction arm transfers the chip body 301 above the suction tube 4, the chip body 301 will first fall inside the annular placement frame 11, and then... Figure 5 At the position shown, after the adsorption tube 4 adsorbs the bottom of the chip body 301, the controller controls the telescopic end of the electric telescopic rod 901 to move, so that the telescopic end drives the inclined frame 10 to move down, and the inclined frame 10 drives the annular placement frame 11 to move down, that is, the annular placement frame 11 moves away from the chip body 301. Then, the lower end surface of the chip body 301 can be adsorbed by the adsorption effect of the adsorption tube 4 alone. In this way, the annular placement frame 11 can avoid affecting the coating head 102 to coat the side wall of the chip body 301. It should be noted that during the process of the mechanical suction hand transferring the chip body 301, the part that the mechanical suction hand adsorbs is the upper end surface of the chip body 301, while when it lands on the upper end surface of the annular placement frame 11, it is the lower end surface of the chip body 301.

[0028] The inner wall of the annular placement rack 11 is provided with a limiting annular groove 12. The diameter of the limiting annular groove 12 is greater than the length of the chip body 301. Smooth rubber is provided in the limiting annular groove 12. The shape of the guide groove 9 is adapted to the shape of the electric telescopic rod 901. During operation, since a limiting ring groove 12 is provided on the inner wall of the annular placement frame 11, when the chip body 301 is transferred to the inner wall of the annular placement frame 11 by the robot arm, the chip body 301 will first be placed in the limiting ring groove 12. After being adsorbed by the adsorption tube 4, when the annular placement frame 11 is moved down by the above control, the annular placement frame 11 and the limiting ring groove 12 can move along the side wall of the chip body 301. This design makes it convenient for the chip body 301 to be placed inside the limiting ring groove 12, and makes it convenient for the limiting ring groove 12 to move from the side wall of the chip body 301 without causing the chip body 301 to move.

[0029] The inner wall of the annular pipe 7 is equipped with elastic telescopic columns 13 arranged in a circular array. Each set of elastic telescopic columns 13 corresponds to the adsorption tube 4. A magnetic plate 14 is fixedly installed on the upper end face of each set of elastic telescopic columns 13. A telescopic spring is sleeved on the outer surface of the elastic telescopic columns 13. A recycling platform 16 is installed above the workbench 1 and on the side wall of the coating tray 2. A recycling unit is set above the workbench 1. The recycling unit is used to recycle the chip body 301 after coating. A magnetic block 15 is installed inside the workbench 1 and on the side near the recycling platform 16. The magnetic properties of the magnetic block 15 are the same as those of the magnetic plate 14. During operation, after the chip body 301 completes one coating cycle, the coating disk 2 continues to rotate, causing the subsequent support frame 3 and contact point 5 to continue rotating. When the next set of contact points 5 and 6 come into contact, the coated chip body 301 has just moved to one side of the recycling table 16, and contact point 6 transmits a contact signal to the controller. Then, the coating disk 2 stops rotating; the coated chip body 301 moves to the side corresponding to the magnetic block 15. Due to the magnetism of the magnetic block 15 and the magnetic plate 14... Based on the principle of like poles repelling each other, the magnetic plate 14 will move away from the magnetic block 15, that is, the magnetic plate 14 will move closer to the bottom of the adsorption tube 4. After that, the magnetic plate 14 will be close to the bottom of the adsorption tube 4. As a result, the adsorption force generated by the adsorption tube 4 on the side of the recycling platform 16 will be reduced. Then, under the action of the recycling unit, the coated chip body 301 can be pressed and moved to the surface of the recycling platform 16, realizing the automatic recycling function of the coated chip body 301 without the need for manual operation by the staff. It should be noted that the repulsive force of the magnetic block 15 on the magnetic plate 14 is sufficient to drive the magnetic plate 14 to move closer to the bottom of the adsorption tube 4.

[0030] The recycling unit includes an L-shaped fixing rod 17, which is installed in the middle of the workbench 1 and does not contact the coating plate 2. An arc-shaped protrusion 18 is fixedly installed at the end of the L-shaped fixing rod 17 away from the workbench 1. When the coating plate 2 drives the support frame 3 and the chip body 301 to rotate, the lower end of the chip body 301 will contact the protruding end of the arc-shaped protrusion 18. The recycling table 16 is designed to be inclined relative to the horizontal plane. During operation, when the coating disk 2 stops rotating, the coated chip body 301 moves to the side corresponding to the magnetic block 15, and the magnetic plate 14 moves closer to the bottom of the adsorption tube 4; during this process, the coating disk 2 will drive the coated chip body 301 to move closer to the arc-shaped bump 18, and gradually move towards the raised surface along the horizontal plane of the arc-shaped bump 18. Then, under the limit of the raised surface of the arc-shaped bump 18, the chip body 301 will be in an inclined state. At this time, the adsorption force of the adsorption tube 4 will decrease, and the inclined chip body 301 will slide onto the surface of the recycling table 16 and be recycled into the external device along the recycling table 16. It should be noted that when the magnetic plate 14 comes into contact with the bottom of the adsorption tube 4, the adsorption force of the adsorption tube 4 will decrease. At this time, the adsorption force is not enough to adsorb the chip body 301, and when the chip body 301 is tilted, it will fall onto the recycling platform 16 under its own gravity.

[0031] The surface of the recycling platform 16 is equipped with multiple rotating rollers 19, which are arranged in a linear array. During operation, when the chip body 301 is tilted on the surface of the recycling platform 16, the rotating rollers 19 can be controlled to rotate, which can facilitate the movement of the chip body 301, thereby making the chip body 301 move away from the adsorption tube 4 as quickly as possible. When the subsequent chip body 301 is coated, and the coating disk 2 continues to rotate, one of the magnetic plates 14 separates from the magnetic block 15. Under the elastic force of the elastic telescopic column 13, the magnetic plate 14 can be driven back to its initial position. When the subsequent chip body 301 moves above the magnetic block 15 again, the coated chip body 301 will be taken out according to the above steps. This design allows for continuous coating and recycling of the chip body 301, which is convenient to operate and beneficial to the use of subsequent semiconductor chips.

[0032] like Figure 11 As shown: A semiconductor chip coating method, which uses the semiconductor chip coating apparatus described above, includes the following steps: S1. The chip body 301 is clamped from the transport station and sent to the support frame 3 by an external mechanical suction hand, and the lower end face of the chip body 301 is tightly adsorbed to the support frame 3 by the suction tube 4 to generate negative pressure. S2. Then, the coating disk 2 is rotated above the worktable 1 by an external controller, so that the coating disk 2 drives one of the support frames 3 and the chip body 301 to move closer to the coating frame 101. S3. When the chip body 301 moves below the coating head 102, the movement of the coating disk 2 is stopped, and then the chip body 301 can be coated by the coating head 102.

[0033] In step S1, the material of the adsorption tube 4 is rubber.

[0034] Working principle: In the initial state, the chip body 301 is clamped from the transport station and sent to the support frame 3 by an external mechanical suction hand. The suction tube 4 generates negative pressure, which tightly adsorbs the lower end face of the chip body 301 onto the support frame 3. Then, the external controller controls the coating plate 2 to rotate above the worktable 1. The coating plate 2 drives one set of support frames 3 and the chip body 301 to move closer to the coating frame 101. At the same time, the coating plate 2 will drive the support frame 3 and contact 1 5 to move closer to contact 2 6. When contact 1 5 and contact 2 6 come into contact, contact 2 6 will transmit a contact signal to the external controller. The controller will first control the coating plate 2 to stop rotating and control the coating head 102 to move closer to the chip body 301. Then, the coating head 102 will perform coating treatment on the upper end face and the surrounding area of ​​the chip body 301. The suction tubes are controlled by a controller to ensure that the annular pipe 7 and each suction tube 4 are under negative pressure. This allows the suction tube 4 to adsorb the lower end face of the chip body 301, ensuring stability during the subsequent coating process. This design avoids the problem in the prior art where the clamping mechanism holds the side wall of the chip body 301, making it difficult for the coating head 102 to coat the clamped part of the side wall during subsequent coating. It also avoids direct contact between the chip body 301 and the clamping mechanism, which could scratch the surface of the chip body 301 and is beneficial for the subsequent use of the semiconductor chip. When the external mechanical suction arm transfers the chip body 301 above the suction tube 4, the chip body 301 will first fall inside the annular placement frame 11, and as attached... Figure 5 As shown, after the adsorption tube 4 adsorbs the bottom of the chip body 301, the controller controls the telescopic end of the electric telescopic rod 901 to move, causing the telescopic end to move the inclined frame 10 downwards. The inclined frame 10 then moves the annular placement frame 11 downwards, that is, the annular placement frame 11 moves away from the chip body 301. Then, the lower end face of the chip body 301 is adsorbed solely by the adsorption action of the adsorption tube 4. This avoids the annular placement frame 11 affecting the coating head 102's coating of the sidewall of the chip body 301. Because the annular placement frame 11 is located on the inner wall of the annular placement frame 11... With the presence of a limiting ring groove 12, when the chip body 301 is transferred to the inner wall of the annular placement rack 11 by the robotic arm, the chip body 301 will first be placed in the limiting ring groove 12. After being adsorbed by the adsorption tube 4, when the annular placement rack 11 is moved down by the above control, the annular placement rack 11 and the limiting ring groove 12 can move along the side wall of the chip body 301. This design makes it convenient for the chip body 301 to be placed inside the limiting ring groove 12, and also makes it convenient for the limiting ring groove 12 to move from the side wall of the chip body 301 without causing the chip body 301 to move. After the chip body 301 completes one coating, the coating disk 2 continues to rotate, which in turn drives the subsequent support frame 3 and contact point 5 to continue rotating. When the next set of contact points 5 and 6 come into contact, the coated chip body 301 has just moved to one side of the recycling table 16, and contact point 6 transmits a contact signal to the controller. At this time, the coating disk 2 stops rotating; the coated chip body 301 has just moved to the side corresponding to the magnetic block 15. Because the magnetism of the magnetic block 15 and the magnetism of the magnetic plate 14 are similar... Similarly, according to the principle of like poles repulsion, the magnetic plate 14 will move away from the magnetic block 15, that is, the magnetic plate 14 will move closer to the bottom of the adsorption tube 4. After that, the magnetic plate 14 will be close to the bottom of the adsorption tube 4. As a result, the adsorption force generated by the adsorption tube 4 on the side of the recycling platform 16 will be reduced. Then, under the action of the recycling unit, the coated chip body 301 can be pressed and moved to the surface of the recycling platform 16, realizing the automatic recycling function of the coated chip body 301 without the need for manual operation by the staff. As the coating disk 2 stops rotating, the coated chip body 301 moves to the position corresponding to the magnetic block 15, and the magnetic plate 14 moves closer to the bottom of the adsorption tube 4. During this process, the coating disk 2 will drive the coated chip body 301 to move closer to the arc-shaped bump 18, and gradually move towards the raised surface along the horizontal plane of the arc-shaped bump 18. Then, under the limitation of the raised surface of the arc-shaped bump 18, the chip body 301 will be in an inclined state. At this time, the adsorption force of the adsorption tube 4 will decrease, and the inclined chip body 301 will slide onto the surface of the recycling table 16. The chip is then recycled along the recycling platform 16 into the external device. When the subsequent chip body 301 is coated, and the coating disk 2 continues to rotate, one of the magnetic plates 14 separates from the magnetic block 15. Under the elastic force of the elastic telescopic column 13, the magnetic plate 14 can be driven back to its initial position. When the subsequent chip body 301 moves above the magnetic block 15 again, the coated chip body 301 will be taken out according to the above steps. This design allows for continuous coating and recycling of the chip body 301, which is convenient to operate and beneficial to the subsequent use of semiconductor chips.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip coating apparatus, characterized in that: The device includes a worktable, on the upper surface of which a coating disk is rotatably mounted. Multiple support frames arranged in a circular array are fixedly mounted on the upper surface of the coating disk. Each support frame has an adsorption tube on its inner side, which is used to adsorb the lower surface of the chip body. A coating frame is mounted on the side of the worktable and on the side wall of the coating disk. A coating head is provided on the end face of the coating frame. The support frame has a contact point one fixedly installed on its side wall, and the coating frame has a contact point two installed on its side wall via a support rod. When the coating disc rotates, it will drive the contact point one to rotate and come into contact with the contact point two on the side wall of the coating frame. The coating disc has an annular channel inside, and the bottom end of each adsorption tube extends into the annular channel. The annular channel is connected to an external suction tube to achieve internal negative pressure. The suction tube is installed inside the coating disc and controlled by a controller and a valve body. A square block is fixedly installed on the outer circumferential surface of the adsorption tube. Guide grooves are opened on both side walls of the square block. An electric telescopic rod is fixedly installed on the groove wall of the guide groove. An inclined frame is fixedly installed on the telescopic end of the electric telescopic rod. An annular placement frame is fixedly installed on the top of the inclined frame. The inner wall of the annular placement rack is provided with a limiting ring groove. The diameter of the limiting ring groove is larger than the length of the chip body. Smooth rubber is provided inside the limiting ring groove. The shape of the guide groove is adapted to the shape of the electric telescopic rod. The inner wall of the annular pipe is equipped with elastic telescopic columns arranged in a circumferential array. Each set of elastic telescopic columns corresponds to an adsorption tube. A magnetic plate is fixedly installed on the upper end face of each set of elastic telescopic columns. A telescopic spring is sleeved on the outer surface of the elastic telescopic columns. A recycling platform is installed above the worktable and on the side wall of the coating tray. When the coated chip body moves to the side corresponding to the magnetic block, the magnetic plate will move away from the magnetic block, that is, the magnetic plate will move closer to the bottom of the adsorption tube, so that the adsorption force inside the adsorption tube will decrease.

2. The semiconductor chip coating apparatus according to claim 1, characterized in that: A magnetic block is installed inside the workbench and on the side near the recycling table. The magnetic block has the same magnetic properties as the magnetic plate.

3. The semiconductor chip coating apparatus according to claim 1, characterized in that: A recycling unit is provided above the workbench. The recycling unit is used to recycle the chip body after coating. The recycling unit includes an L-shaped fixing rod, which is installed in the middle of the workbench and does not contact the coating plate. An arc-shaped protrusion is fixedly installed at the end of the L-shaped fixing rod away from the workbench. When the coating plate drives the support frame and the chip body to rotate, the lower end of the chip body will contact the protruding end of the arc-shaped protrusion. The recycling table is designed to be inclined relative to the horizontal plane.

4. The semiconductor chip coating apparatus according to claim 1, characterized in that: The surface of the recycling platform is equipped with multiple rotating rollers arranged in a linear array. During operation, when the chip body is tilted on the surface of the recycling platform, the rotating rollers can be controlled to rotate, which can facilitate the movement of the chip body and make it move away from the adsorption tube as quickly as possible.

Images