MEMS inertial sensor multi-physical field coupling calibration device and method
By integrating a three-axis turntable, vibration excitation stage, and temperature-controlled chamber into a multi-physics coupling calibration device, synchronous simulation of temperature, vibration, angular velocity, and acceleration is achieved. This solves the problem of insufficient simulation of complex working conditions in MEMS inertial sensor calibration, improves calibration accuracy and efficiency, and is suitable for high-precision applications.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 709TH RESEARCH INSTITUTE CHINA STATE SHIPBUILDING CORP LTD
- Filing Date
- 2026-01-28
- Publication Date
- 2026-04-21
AI Technical Summary
Existing MEMS inertial sensor calibration technology cannot realistically simulate complex working conditions, resulting in large deviations between calibration results and actual working conditions, and failing to meet long-term dynamic accuracy requirements.
An integrated device consisting of a three-axis turntable, a vibration excitation stage, a temperature control chamber, and a center of gravity adjustment module is used to simultaneously apply four physical fields: temperature, vibration, angular velocity, and acceleration. Through synchronous control and data acquisition units, the various excitation sources are coordinated to simulate the working environment of MEMS inertial sensors under actual complex working conditions.
It significantly improves calibration accuracy and efficiency, and can accurately predict the zero bias and scale factor drift problems of inertial sensors under complex working conditions, making it suitable for high-precision application scenarios such as high-dynamic aircraft.
Smart Images
Figure CN121898486A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of MEMS inertial sensor calibration technology, and more specifically, relates to a MEMS inertial sensor multi-physics coupling calibration device and method. Background Technology
[0002] With the rapid development of unmanned systems technology, intelligent equipment such as drones, unmanned vehicles, and robots have been widely used in various fields, including military reconnaissance, geographic surveying, logistics transportation, and agricultural plant protection. These devices perform tasks in complex and ever-changing real-world working environments, often facing harsh physical conditions such as alternating high and low temperatures, severe airflow disturbances, and broadband mechanical vibrations. Microelectromechanical systems (MEMS) inertial sensors, as core components for navigation, guidance, and attitude control of unmanned equipment, directly determine the overall performance and mission reliability of the system through their measurement accuracy.
[0003] Due to limitations in their working principle and manufacturing process, MEMS inertial sensors are susceptible to temperature changes and mechanical vibrations in practical applications. This manifests as drift in parameters such as zero bias, scaling factor, and inter-axis coupling error depending on environmental conditions. Static calibration before delivery alone is insufficient to meet long-term dynamic accuracy requirements. Therefore, achieving online calibration or dynamic compensation of inertial sensors under operating conditions is crucial for improving the environmental adaptability of unmanned systems.
[0004] Currently, common MEMS inertial sensor calibration techniques are generally performed under normal temperature, static, and vibration-free laboratory conditions, with a single calibration excitation method. Although high-precision three-axis turntables can achieve calibration in multiple positions and attitudes, they lack the ability to synchronously simulate key environmental factors such as temperature and vibration, and cannot truly reproduce the comprehensive response characteristics of MEMS inertial sensors under actual complex working conditions.
[0005] Therefore, in order to address the shortcomings of existing calibration technologies in terms of environmental simulation realism and multi-field coupling, it is urgent to develop a calibration device and method that can simultaneously generate multiple physical field excitations to achieve accurate calibration of MEMS inertial sensors. Summary of the Invention
[0006] In view of the shortcomings of the prior art, the purpose of this application is to provide a multi-physics coupling calibration device and method for MEMS inertial sensors, which aims to solve the problem that the existing calibration system cannot simulate the complex working conditions of inertial sensors, resulting in large deviations between the calibration results and the actual working conditions.
[0007] To achieve the above objectives, this application provides a multi-physics coupling calibration device for MEMS inertial sensors, including a three-axis turntable, a vibration excitation stage, a temperature control chamber, a center of gravity adjustment module, and a synchronization control and data acquisition unit, wherein: The three-axis turntable includes an outer frame, a middle frame, and an inner frame nested sequentially from the outside in. The vibration excitation stage and the center of gravity adjustment module are symmetrically mounted on the side wall of the inner frame, and the central axes of both are coincident with the X-axis of the three-axis turntable. The temperature control chamber is coaxially mounted on the vibration excitation stage, and it contains a temperature control plate and a MEMS inertial sensor. The sensitive axis direction of the MEMS inertial sensor to be calibrated is consistent with the corresponding coordinate axis of the multiphysics coupling calibration device. The center of gravity adjustment module is used to adjust the center of gravity of the inner frame to always be located at its center of mass. The synchronous control and data acquisition unit is used to control the vibration excitation stage to provide vibration excitation and the temperature control plate to provide temperature excitation according to calibration requirements, so as to simulate the working conditions of the MEMS inertial sensor; at the same time, it controls the outer frame, middle frame and inner frame to rotate independently to provide angular velocity excitation and acceleration excitation; it is also used to calibrate the MEMS inertial sensor based on the angular velocity excitation and acceleration excitation, as well as the angular velocity and acceleration actually measured by the MEMS inertial sensor.
[0008] Furthermore, the three-axis turntable also includes a base on which an annular guide rail is provided; a roller and a second drive motor are provided on the bottom surface of the outer frame, and the roller is assembled in the annular guide rail; the second drive motor is used to drive the outer frame to rotate around the X-axis, and when the outer frame rotates, the roller can roll along the annular guide rail.
[0009] Furthermore, the temperature-controlled chamber includes an enclosure structure, which includes an alloy frame and an insulation layer fitted from the outside to the inside; the enclosure structure is equipped with an air intake control unit and an exhaust control unit; the temperature control plate and the MEMS inertial sensor are located inside the enclosure structure.
[0010] Furthermore, the enclosure structure is provided with at least one set of test seat assemblies rigidly connected to the alloy frame; each set of test seat assemblies includes three sensor test seats, which are used to install the MEMS inertial sensor, and when the MEMS inertial sensor is located on different sensor test seats in the same set of test seat assemblies, its sensitive axis direction is different, and corresponds to the X-axis, Y-axis and Z-axis respectively.
[0011] Furthermore, a temperature sensor is also installed inside the temperature control chamber. The temperature sensor is located between the temperature control plate and the MEMS inertial sensor, and is used to monitor the surface temperature of the MEMS inertial sensor in real time and feed the surface temperature data back to the synchronous control and data acquisition unit in real time.
[0012] Furthermore, the temperature control plate is parallel to the top surface of the MEMS inertial sensor, and the two do not contact each other.
[0013] Furthermore, a detachable temperature control plate support is inserted into the inner bottom surface of the temperature control chamber. The temperature control plate support is a first U-shaped frame, and the temperature control plate is parallel to the bottom surface of the first U-shaped frame and suspended therein.
[0014] Furthermore, the outer frame is a second U-shaped frame, and the middle frame and inner frame are both cubic frames. The middle frame and the outer frame are connected by a pair of first drive motors, and the middle frame and the inner frame are connected by a pair of third drive motors. The synchronization control and data acquisition unit is connected to the first drive motor, the second drive motor, and the third drive motor, respectively.
[0015] Secondly, this application provides a calibration method for MEMS inertial sensors using the multiphysics coupling calibration device as described above, comprising: Based on the performance parameters and operating characteristics of the MEMS inertial sensor, S1 determines the temperature excitation, vibration spectrum, acceleration excitation, and angular velocity excitation required for calibration. S2 sequentially aligns the direction of each sensitive axis of the MEMS inertial sensor with the corresponding direction to be calibrated; S3 controls the temperature control plate to provide the temperature excitation in each calibration direction, and controls the vibration excitation stage (11) to provide the vibration excitation corresponding to the vibration spectrum to simulate the working condition of the MEMS inertial sensor; controls the outer frame, middle frame and inner frame of the three-axis turntable to rotate independently to provide the acceleration excitation and angular velocity excitation. S4 causes the MEMS inertial sensor to measure the actual angular velocity and actual acceleration in each direction to be calibrated under the operating condition, and compares them with the angular velocity excitation and acceleration excitation respectively to determine whether the actual angular velocity and actual acceleration are within the allowable error range of the corresponding angular velocity excitation and acceleration excitation: if so, no calibration is required; if not, the parameters of the MEMS inertial sensor need to be corrected.
[0016] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here.
[0017] Overall, the technical solutions conceived in this application have the following beneficial effects compared with the prior art: (1) This application innovatively integrates a temperature-controlled chamber (providing temperature excitation), a vibration excitation stage (providing vibration excitation), and a three-axis turntable (providing angular velocity and acceleration excitation), achieving the simultaneous application of four physical fields: temperature, vibration, angular velocity, and acceleration. A temperature control plate is installed inside the temperature-controlled chamber to rapidly simulate high and low temperature cycles; the vibration excitation stage is directly installed inside the turntable frame, ensuring that the vibration direction dynamically changes with the sensor coordinate system. This multi-field synchronous excitation capability places the sensor in a highly realistic coupled environment during calibration, significantly improving the authenticity and reliability of the calibration data. By coordinating the various excitation sources through a synchronous control and acquisition unit, the simultaneous application of four physical field excitations—temperature, vibration, angular velocity, and acceleration—within the same device is achieved, realistically simulating the working environment of a MEMS inertial sensor under complex actual conditions. This significantly improves calibration accuracy and efficiency, and has promising engineering application prospects.
[0018] (2) This application actively constructs the coupling relationship between physical fields through a unique structural layout (such as the vibration table being installed in the inner frame of the turntable and the temperature control chamber being placed on the vibration excitation platform) and a synchronous control strategy. When the inner frame rotates, the vibration excitation direction changes synchronously with the sensor coordinate system, which can simulate the rotation-vibration coupling effect; the integration of the temperature control chamber and the vibration excitation platform enables the study of error characteristics under temperature-vibration-inertia multi-field coupling. The synchronous control and data acquisition unit collects multi-dimensional data such as temperature, angular velocity, acceleration, and vibration power spectral density in real time. Through the coupling calibration principle, it overcomes the one-sidedness of traditional single-field calibration and can more accurately predict problems such as zero bias and scale factor drift of inertial sensors under complex working conditions. It is especially suitable for high-precision application scenarios such as high-dynamic aircraft.
[0019] (3) This application eliminates the interference of non-ideal couples by symmetrically installing center-of-gravity adjustment modules on the inner frame sidewalls to dynamically adjust the center of gravity of the inner frame so that it always coincides with the rotation axis. At the same time, the synchronous control and data acquisition unit synchronously acquire data, which can ensure that the excitations such as angular position, vibration spectrum, and temperature change are strictly synchronized in time and space, avoiding the accumulation of errors in step-by-step calibration. This dual optimization of "structure + control" enables the device to achieve high-precision calibration effect. Attached Figure Description
[0020] Figure 1 A schematic diagram of the overall structure of a MEMS inertial sensor multi-physics coupling dynamic calibration device proposed in Embodiment 1 of this application; Figure 2 A schematic diagram of the internal structure of the temperature control chamber of a MEMS inertial sensor multiphysics coupling calibration device proposed in Embodiment 1 of this application; Figure 3 A schematic diagram of the sensor test stand installation of a MEMS inertial sensor multiphysics coupling calibration device proposed in Embodiment 1 of this application; Figure 4 A schematic diagram of the layout of the sensor test stand during batch calibration of a MEMS inertial sensor multiphysics coupling calibration device proposed in Embodiment 1 of this application; Figure 5 A flowchart of a calibration method using a MEMS inertial sensor multi-physics coupling calibration device is presented in Embodiment 2 of this application.
[0021] In the diagram: 1-Outer frame, 2-Middle frame, 10-Inner frame, 3-First drive motor, 4-Base, 5-Annular guide rail, 6-Roller, 7-Second drive motor, 8-Third drive motor, 9-Center of gravity adjustment module, 11-Vibration excitation table, 12-Temperature control chamber, S1-Mounting surface, S2-Sealed and insulated door, S3-Alloy frame, S4-Insulation layer, S5-Intake control unit, S6-Exhaust control unit, S7-Temperature control plate support, S8-Temperature sensor, S9-Temperature control plate, S10-Sensor test base, S11-Insulation and sealing layer, S12-Power supply line, S20-Bottom surface, S21-Vertical baffle. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0023] The embodiments of this application are described below with reference to the accompanying drawings.
[0024] Example 1 This application provides a multi-physics coupling calibration device for MEMS inertial sensors, such as... Figure 1 As shown, it includes: a three-axis turntable, a vibration excitation stage 11, a temperature control chamber 12, a center of gravity adjustment module 9, and a synchronous control and data acquisition unit.
[0025] The aforementioned three-axis turntable is a three-axis high-stability turntable, which includes an outer frame 1, a middle frame 2, and an inner frame 10 arranged sequentially from the outside to the inside; the vibration excitation stage 11 and the center of gravity adjustment module 9 are symmetrically installed on the side wall of the inner frame 10, and the central axes of both are coincident with the X-axis of the three-axis turntable; the temperature control chamber 12 is coaxially installed on the vibration excitation stage 11, and a temperature control plate S9 and a MEMS inertial sensor are installed inside it. The sensitive axis of the MEMS inertial sensor is consistent with the direction to be calibrated, that is, the direction of the sensitive axis of the inertial sensor to be tested for whether it needs to be calibrated needs to be consistent with the direction of the corresponding coordinate axis on the coordinate system of the calibration device, that is, the sensitive axis in the X direction is consistent with the X-axis, or the sensitive axis in the Y direction is consistent with the Y-axis, and the sensitive axis in the Z direction is consistent with the Z-axis.
[0026] The aforementioned center of gravity adjustment module 9 is used to adjust the center of gravity of the inner frame 10 so that it is always located on its center of mass. Specifically, the center of mass adjustment can be achieved by adding or removing counterweights or adjusting the mass distribution. This balances the center of gravity shift caused by the vibration excitation stage 11 and the temperature control chamber 12 when the three-axis high-stability turntable rotates at high speed, thereby ensuring that the entire correction device maintains dynamic balance during high-speed rotation.
[0027] The aforementioned synchronous control and data acquisition unit is used to control the vibration excitation stage 11 to provide vibration excitation and the temperature control plate S9 to provide temperature excitation according to calibration requirements, so as to simulate the working conditions of the MEMS inertial sensor; at the same time, it controls the outer frame 1, the middle frame 2 and the inner frame 10 to rotate independently, providing angular velocity excitation and acceleration excitation; it is also used to calibrate the MEMS inertial sensor based on the angular velocity excitation and acceleration excitation, as well as the angular velocity and acceleration actually measured by the MEMS inertial sensor.
[0028] Specifically, the synchronous control and data acquisition unit can be implemented using an industrial control computer or an embedded real-time system. Such equipment has multi-channel data acquisition, real-time control, data storage and processing functions.
[0029] like Figure 1 As shown, the outer frame 1 of the aforementioned three-axis high-stability turntable (i.e., the three-axis turntable) is a second U-shaped frame, while the middle frame 2 and inner frame 1 are both cubic frames. The middle frame 2 and the outer frame 1 are connected by a pair of first drive motors 3, and the middle frame 2 and the inner frame 10 are connected by a pair of third drive motors 8. The synchronous control and data acquisition unit is connected to the first drive motor 3, the second drive motor 7, and the third drive motor 8 respectively via power supply lines 12. Each drive motor has a built-in slip ring. Specifically, slip rings are installed between the inner frame 10 and the middle frame 2, between the middle frame 2 and the outer frame 1, and between the outer frame 1 and the base 4, for data communication and power supply routing between the device and the host computer.
[0030] The central axis of the aforementioned second drive motor 7 is parallel to the Z-axis, so the outer frame 1 can rotate independently around the Z-axis; the central axes of the pair of first drive motors 3 are parallel to the X-axis, so the middle frame 2 can rotate with the outer frame 1 while also rotating independently around the X-axis to perform pitch motion; the central axes of the pair of third drive motors 8 are perpendicular to the central axes of the pair of first drive motors 3, so the inner frame 10 can rotate synchronously with the outer frame 1 and the middle frame 2, and can also rotate around the central axes of the pair of third drive motors 8.
[0031] An annular guide rail 5 is provided on the aforementioned base 4, and rollers 6 are installed on the outer frame 1 of the three-axis high-stability turntable. The aforementioned second drive motor 7 is located on the bottom surface of the outer frame 1 and is used to drive the outer frame 1 to rotate around the Z-axis, thereby driving the entire three-axis high-stability turntable to rotate. When the outer frame 1 rotates, the rollers 6 can roll along the annular guide rail 5 to share part of the load and reduce structural stress, thereby enhancing the stability of the correction device during high-speed rotation. A pair of third drive motors 8 are used to drive the inner frame 10 to rotate.
[0032] The aforementioned vibration excitation stage 11 is installed on one side of the inner frame 10 of the three-axis high-stability turntable, and is used to provide controllable vibration excitation for the temperature control chamber 12 and the MEMS inertial sensors inside it. The vibration excitation stage 11 can be an electromagnetic, piezoelectric or electric vibration stage, and its output frequency range and amplitude can be adjusted according to calibration requirements.
[0033] like Figure 2 As shown, the aforementioned temperature control chamber 12 is installed on the mounting surface S1 of the vibration excitation table 11. The temperature control chamber includes a box-shaped enclosure structure. The enclosure structure includes an alloy frame S3 and an insulation layer S4 that are integrated from the outside to the inside. The alloy frame S3 is a low heat capacity alloy frame, so the overall enclosure structure has good thermal insulation performance.
[0034] The aforementioned enclosure structure is also equipped with an air intake control unit S5 and an exhaust control unit S6, both of which are connected to a synchronization control and data acquisition unit. The synchronization control and data acquisition unit can control the air intake control unit S5 to start air intake and control the exhaust control unit S6 to start exhaust, so as to achieve air circulation and temperature balance in the cabin.
[0035] The enclosure structure also includes a thermal insulation sealing layer S11, which houses a temperature control element S9, a temperature sensor S8, and a sensor test mount S10. These three components are electrically connected to an external synchronization control and data acquisition unit via a power supply line S12 (or a data communication line). The MEMS inertial sensor can be mounted on different sensor test mounts S10, and when located on different sensor test mounts S10, its sensing axis to be calibrated always remains consistent with the direction to be calibrated. like Figure 3 As shown, the side of the temperature control chamber 12 that is in contact with the vibration excitation stage is its bottom surface S20 (i.e., one side of the enclosure structure). The sensor test seat S10 is installed on the vertical baffle S21 (i.e., the side of the enclosure structure that is installed on the vibration excitation stage 11). The sensitive axis direction of the corresponding MEMS inertial sensor is the Z-axis.
[0036] In this embodiment, the aforementioned temperature control chip S9 and MEMS inertial sensor (not shown in the figure) are located inside the enclosure structure. The temperature control chip S9 uses a semiconductor temperature control chip to achieve rapid heating and cooling. Its upper plane is parallel to the top surface of the MEMS inertial sensor and is located in the same plane. The two are not connected and maintain a certain distance to achieve non-contact temperature control.
[0037] A temperature sensor S8 is also arranged between the temperature control chip S9 and the MEMS inertial sensor to monitor the surface temperature of the MEMS inertial sensor in real time, and feeds the surface temperature data back to the synchronization control and data acquisition unit. The temperature control chip S9 is controlled to rise and fall according to the temperature value set by calibration, so as to realize closed-loop temperature feedback control of the ambient temperature of the MEMS inertial sensor.
[0038] In this embodiment, the temperature control element S9 is specifically mounted on the temperature control element support S7. The temperature control element support S7 adopts a first U-shaped frame structure, with the temperature control element S9 parallel to the bottom surface of the first U-shaped frame and suspended within it. The first U-shaped frame is detachably mounted to the bottom of the compartment via a pin mechanism, facilitating quick replacement and maintenance. Specifically, the bottom of the compartment has a pair of slots (not shown in the figure) that match the first U-shaped frame. The open end of the first U-shaped frame faces the bottom of the compartment, and both ends are inserted into the corresponding slots for fixation.
[0039] In this embodiment, the aforementioned enclosure structure contains a set of test mount assemblies rigidly connected to the alloy frame S3. This rigid connection ensures that vibration excitation can be directly transmitted to the MEMS inertial sensor, guaranteeing that the vibration output of the vibration excitation stage 11 is consistent with the vibration environment characteristics of the MEMS inertial sensor. Each set of test mount assemblies includes three sensor test mounts S10. The sensor test mounts S10 are used to mount the MEMS inertial sensor. When the MEMS inertial sensor is located on different sensor test mounts S10 in the same set, its sensitive axis direction is different, and they correspond to the X-axis, Y-axis, and Z-axis of the coordinate system where the calibration device is located, respectively. That is, each sensor test mount S10 corresponds to a sensitive axis direction to be calibrated.
[0040] For example, when a MEMS inertial sensor is installed on the first sensor test holder S10, its X-axis sensing axis needs to be calibrated. In this case, the X-axis sensing axis must be in the same direction as the X-axis of the calibration device. When a MEMS inertial sensor is installed on the second sensor test holder S10, its Y-axis sensing axis needs to be calibrated. In this case, the Y-axis sensing axis must be in the same direction as the Y-axis of the calibration device. When a MEMS inertial sensor is installed on the third sensor test holder S10, its X-axis sensing axis needs to be calibrated. In this case, the Z-axis sensing axis must be in the same direction as the Z-axis of the calibration device.
[0041] In other embodiments, the enclosure structure may also contain multiple sets of test seat assemblies rigidly connected to the alloy frame S3. For example... Figure 4As shown in the figure, a layout with three sets of test mount assemblies is provided, which can be used to simultaneously measure and calibrate the sensitive axis parameters of three MEMS inertial sensors. The three sets of test mount assemblies are arranged in a straight line and parallel to one side of the inner frame 10, ensuring that the direction and magnitude of the acceleration and angular velocity excitations of the three sensor test mounts in the same group are consistent when the inner frame 10 rotates. During calibration, the triaxial synchronous calibration of multiple MEMS inertial sensors can be efficiently completed by rotating the mounting orientation of each MEMS inertial sensor (a total of 3 rotations).
[0042] Example 2 This embodiment provides a calibration method for a MEMS inertial sensor using the multiphysics coupling calibration device described in Embodiment 1 above. The calibration method includes: Based on the performance parameters and operating characteristics of the MEMS inertial sensor, S1 determines the temperature excitation, vibration spectrum, acceleration excitation, and angular velocity excitation required for calibration. S2 aligns the sensitive axis of the MEMS inertial sensor with the direction to be calibrated; S3 controls the temperature control plate S9 to provide temperature excitation and controls the vibration excitation stage 11 to provide vibration excitation corresponding to the vibration spectrum to simulate the working conditions of MEMS inertial sensors; it controls the outer frame 1, middle frame 2 and inner frame 10 of the three-axis turntable to rotate independently around the X-axis, Z-axis and Y-axis respectively to provide acceleration excitation and angular velocity excitation. S4 receives the actual angular velocity and actual acceleration measured by the MEMS inertial sensor under operating conditions, and compares them with the angular velocity excitation and acceleration excitation respectively to determine whether the actual angular velocity and actual acceleration are within the allowable error range of the corresponding angular velocity excitation and acceleration excitation: if so, no calibration is required; if not, the parameters of the MEMS inertial sensor need to be corrected.
[0043] Specifically, such as Figure 5 As shown, based on the performance indicators and actual working conditions of the MEMS inertial sensor, the four-dimensional parameters required for calibration, such as temperature range, vibration spectrum, acceleration, and angular velocity, are first set. Then open the sealed door S2 of the temperature control chamber 12, remove the temperature control plate support S7, and install the temperature control plate S9 and temperature sensor S8. Next, install the MEMS inertial sensor to be calibrated onto the corresponding sensor test mount S10, ensuring that its sensitive axis direction is consistent with the test mount direction. Insert the temperature control plate support S7 and fix it, then close the door S2.
[0044] Then, the synchronous control and data acquisition unit is activated to control the three-axis high-stability turntable, vibration excitation stage 11, and temperature control chamber 12 to output corresponding excitations according to the set parameters. Temperature excitation and vibration excitation are used to simulate the corresponding working conditions. Angular velocity excitation and acceleration excitation are provided by the rotation of the outer frame, middle frame, and inner frame in the three-dimensional high-stability turntable. At the same time, the angular velocity and acceleration measured by the MEMS inertial sensor under the simulated working conditions are collected, and the angular velocity excitation provided by the calibration device is compared with the actual measured angular velocity, and the acceleration excitation is compared with the actual measured acceleration. If the actual angular velocity and actual acceleration are within the allowable error range of the corresponding angular velocity excitation and acceleration excitation, then the MEMS inertial sensor does not need to be calibrated. Otherwise, the relevant parameters of its sensitive axis need to be calibrated.
[0045] For example, in this embodiment, the angular velocity of the calibration device is set to 100° / s. The allowable error of a certain type of inertial MEMS sensor under test at 100° / s is ±2° / s (within this range, the MEMS inertial sensor is considered to be accurate). In this embodiment, the angular velocity measured by the calibration device under a four-physics coupling environment is 99° / s, with an error of -1° / s. Therefore, the MEMS inertial sensor is functioning correctly, and the calibration is successful. If the angular velocity is not within the ±2° / s range, it indicates a problem with the MEMS inertial sensor, requiring correction.
[0046] To calibrate other sensitive axes of the MEMS inertial sensor, repeat the aforementioned steps, only switching the mounting orientation of the MEMS inertial sensor each time. If multiple MEMS inertial sensors need to be calibrated in batches, multiple sensors can be mounted simultaneously on their respective sensor test mounts, and the sensitive axis orientation can be rotated according to the above procedure to complete the calibration.
[0047] Through the above-mentioned calibration device and method, this application realizes the simultaneous application of four physical field excitations—temperature, vibration, angular velocity, and acceleration—within the same device, realistically simulating the working environment of MEMS inertial sensors under actual complex working conditions, significantly improving calibration accuracy and efficiency, and showing good prospects for engineering applications.
[0048] It should be understood that expressions such as “comprising” and “may include” used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as “comprising” and / or “having” are to be interpreted as indicating a particular characteristic, number, operation, constituent element, component, or combination thereof, but not to exclude the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.
[0049] Furthermore, in this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. The symbol " / " in this document indicates that the related objects are in an "or" relationship; for example, A / B means A or B.
[0050] The terms "first" and "second," etc., used in the specification and claims herein are used to distinguish different objects, not to describe a specific order of objects. For example, "first response message" and "second response message," etc., are used to distinguish different response messages, not to describe a specific order of response messages.
[0051] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.
[0052] In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more, for example, multiple processing units means two or more processing units, multiple elements means two or more elements, etc.
[0053] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. "Rotary connection" refers to a connection where the components can rotate relative to each other after connection. "Sliding connection" refers to a connection where the components can slide relative to each other after connection. The directional terms mentioned in the embodiments of this application, such as "top," "bottom," "inner," "outer," "left," and "right," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0054] Furthermore, the mathematical concepts mentioned in the embodiments of this application, such as symmetry, equality, parallelism, and perpendicularity, are limitations specific to the current technological level, rather than absolute and strict mathematical definitions. Slight deviations are permissible; approximations of symmetry, equality, parallelism, and perpendicularity are all acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.
[0055] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A multiphysics coupling calibration device for MEMS inertial sensors, characterized in that, It includes a three-axis rotary table, a vibration excitation table (11), a temperature control chamber (12), a center of gravity adjustment module (9), and a synchronous control and data acquisition unit, wherein: The three-axis turntable includes an outer frame (1), a middle frame (2), and an inner frame (10) arranged sequentially from the outside to the inside; the vibration excitation stage (11) and the center of gravity adjustment module (9) are symmetrically installed on the side wall of the inner frame (10), and the central axes of both are coincident with the X-axis of the three-axis turntable; the temperature control chamber (12) is coaxially installed on the vibration excitation stage (11), and a temperature control plate (S9) and a MEMS inertial sensor are provided inside it. The sensitive axis direction of the MEMS inertial sensor to be calibrated is consistent with the corresponding coordinate axis of the multi-physics coupling calibration device; the center of gravity adjustment module (9) is used to adjust the center of gravity of the inner frame (10) to always be located on its center of mass; The synchronous control and data acquisition unit is used to control the vibration excitation stage (11) to provide vibration excitation and control the temperature control plate (S9) to provide temperature excitation according to the calibration requirements, so as to simulate the working conditions of the MEMS inertial sensor; at the same time, it controls the outer frame (1), middle frame (2) and inner frame (10) to rotate independently to provide angular velocity excitation and acceleration excitation; it is also used to calibrate the MEMS inertial sensor based on the angular velocity excitation and acceleration excitation, as well as the angular velocity and acceleration actually measured by the MEMS inertial sensor.
2. The multiphysics coupling calibration device as described in claim 1, characterized in that, The three-axis turntable also includes a base (4), on which an annular guide rail (5) is provided; a roller (6) and a second drive motor (7) are provided on the bottom surface of the outer frame (1), and the roller (6) is assembled in the annular guide rail (5); the second drive motor (7) is used to drive the outer frame (1) to rotate around the X-axis, and when the outer frame (1) rotates, the roller (6) can roll along the annular guide rail (5).
3. The multiphysics coupling calibration device as described in claim 1, characterized in that, The temperature control chamber (12) includes an enclosure structure, which includes an alloy frame (S3) and an insulation layer (S4) fitted from the outside to the inside; an air intake control unit (S5) and an exhaust control unit (S6) are provided on the enclosure structure; the temperature control plate (S9) and the MEMS inertial sensor are located inside the enclosure structure.
4. The multiphysics coupling calibration device as described in claim 3, characterized in that, The enclosure structure is provided with at least one set of test base assemblies that are rigidly connected to the alloy frame (S3); each set of test base assemblies includes three sensor test bases (S10), the sensor test bases (S10) are used to install the MEMS inertial sensor, and when the MEMS inertial sensor is located on different sensor test bases (S10) in the same set of test base assemblies, its sensitive axis direction is different, and it corresponds to the X-axis, Y-axis and Z-axis respectively.
5. The multiphysics coupling calibration device as described in claim 1, characterized in that, The temperature control chamber (12) is also equipped with a temperature sensor (S8), which is located between the temperature control plate (S9) and the MEMS inertial sensor. It is used to monitor the surface temperature of the MEMS inertial sensor in real time and feed the surface temperature back to the synchronous control and data acquisition unit in real time.
6. The multiphysics coupling calibration device as described in claim 1, characterized in that, The temperature control plate (S9) is parallel to the top surface of the MEMS inertial sensor and the two do not contact each other.
7. The multiphysics coupling calibration device as described in claim 1, characterized in that, A detachable temperature control plate support (S7) is inserted into the bottom surface of the temperature control chamber (12). The temperature control plate support (S7) is a first U-shaped frame, and the temperature control plate (S9) is parallel to the bottom surface of the first U-shaped frame and suspended therein.
8. The multiphysics coupling calibration device as described in claim 2, characterized in that, The outer frame (1) is a second U-shaped frame, the middle frame (2) and the inner frame (10) are both cubic frames, the middle frame (2) and the outer frame (1) are connected by a pair of first drive motors (3), and the middle frame (2) and the inner frame (10) are connected by a pair of third drive motors (8); the synchronous control and data acquisition unit is connected to the first drive motor (3), the second drive motor (7) and the third drive motor (8) respectively.
9. A calibration method for a MEMS inertial sensor using the multiphysics coupling calibration device as described in any one of claims 1-8, characterized in that, include: Based on the performance parameters and operating characteristics of the MEMS inertial sensor, S1 determines the temperature excitation, vibration spectrum, acceleration excitation, and angular velocity excitation required for calibration. S2 sequentially aligns the direction of each sensitive axis of the MEMS inertial sensor with the corresponding direction to be calibrated; S3 controls the temperature control plate (S9) to provide the temperature excitation in each calibration direction, and controls the vibration excitation stage (11) to provide the vibration excitation corresponding to the vibration spectrum to simulate the working condition of the MEMS inertial sensor; controls the outer frame (1), middle frame (2) and inner frame (10) of the three-axis turntable to rotate independently to provide the acceleration excitation and angular velocity excitation; S4 causes the MEMS inertial sensor to measure the actual angular velocity and actual acceleration in each direction to be calibrated under the operating condition, and compares them with the angular velocity excitation and acceleration excitation respectively to determine whether the actual angular velocity and actual acceleration are within the allowable error range of the corresponding angular velocity excitation and acceleration excitation: if so, no calibration is required; if not, the parameters of the MEMS inertial sensor need to be corrected.