Chip test seat, test device and method

Abstract

The invention provides a chip testing seat, a testing device and a testing method, and relates to the technical field of semiconductor production, the chip testing seat comprises a testing base provided with a placing groove, a pressing plate hinged with one end of the testing base, a fixing plate installed in the placing groove, an elastic mechanism fixedly connected with the fixing plate, and a pressing strip mechanism fixed on the pressing plate; the placing groove is used for placing a to-be-tested chip, the fixing plate forms a width-adjustable placing position in the placing groove through the elastic mechanism, and the elastic mechanism applies an acting force to one side of the to-be-tested chip; and the pressing plate is folded with the test base along the hinged part, and the pressing strip mechanism presses and fixes the to-be-tested chip placed in the placing position. When the chip is placed in the placing groove, the pressing plate is fixed on the testing base, so that the chip is pressed and fixed, and the chip is ensured not to deviate in the testing process. Through the test seat, stable test of a small-size single chip can be realized, improvement of chip test efficiency is facilitated, and test accuracy is ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more specifically to a chip test socket, test apparatus, and method. Background Technology

[0002] In the semiconductor manufacturing process, before chip packaging, the chip's electrical performance needs to be tested to determine if its various electrical properties are satisfactory. After testing, defective semiconductor chips are screened out based on the test results to prevent them from flowing into subsequent processes and wasting resources. Through electrical testing of the chips, the overall yield of the chip manufacturing process can be obtained, and failure analysis of the test results can identify the causes of failures in related process technologies, thereby improving those technologies.

[0003] Currently, electrical testing of chips typically involves testing the entire wafer. This means placing the entire wafer on a probe station, which uses vacuum suction to hold it in place, allowing the wafer to move with the probe station for testing. However, for electrical testing of individual bare chips after dicing, the chip is placed directly on the probe station, allowing it to move with the station. But existing chip test sockets often experience positional misalignment when testing individual bare chips because the chips are too small to be vacuum-held. This affects the positioning accuracy of the contact between the spring probes and the chip pins, reducing testing efficiency.

[0004] In summary, existing technologies suffer from a problem where the testing device experiences positional shifts during the testing of a single chip. This leads to a decrease in the positioning accuracy of the contact between the spring probes of the probe station and the chip pins, thereby reducing testing efficiency. Summary of the Invention

[0005] To address the problem that existing testing devices may experience positional shifts during single-chip testing, leading to decreased positioning accuracy between the spring probes of the probe station and the chip pins, thus reducing testing efficiency.

[0006] The objective of this invention is achieved through the following technical solution: In a first aspect, the present invention provides a chip test socket, comprising: a test base with a placement slot, a pressure plate hinged to one end of the test base, a fixing plate installed in the placement slot, an elastic mechanism fixedly connected to the fixing plate, and a pressure strip mechanism fixed to the pressure plate. The placement slot is used to place the chip under test. The fixing plate forms an adjustable placement position in the placement slot through the elastic mechanism. The elastic mechanism applies a force to one side of the chip under test. The pressure plate closes to the test base along the hinged part, and the pressure bar mechanism presses and fixes the chip under test placed in the placement position.

[0007] Preferably, the elastic mechanism includes a slide rail fixed on the test base, a slider mounted on the slide rail, and a spring fixedly connected to the slider; The slide rail is perpendicular to the side wall of the placement groove. The fixing plate is fixed to the slider. One end of the spring is fixed to the test base. The spring applies a force to the fixing plate toward the other side of the placement groove.

[0008] Preferably, a retaining edge is fixedly provided on the other side wall of the placement groove opposite to the fixing plate.

[0009] Preferably, the pressure strip mechanism includes a pressure strip and a dovetail block. The length direction of the dovetail block is arranged along the width direction of the placement groove. The pressure strip is provided with a dovetail groove that is adapted to the dovetail block. The pressure strip is installed on the pressure plate by inserting and engaging with the dovetail block through the dovetail groove.

[0010] Furthermore, the pressure strip mechanism also includes a control plate disposed on the pressure strip; The control panel is a plate-shaped structure arranged along the length of the pressure strip, and the movement of the pressure strip is controlled by the control panel.

[0011] Furthermore, the pressure plate is provided with a scale, which is located near the end of the pressure strip.

[0012] Preferably, the chip test socket further includes a snap-fit ​​mechanism; The snap-fit ​​mechanism is fixed to the end of the pressure plate away from the hinge. A corresponding buckle is installed on the test base. The snap-fit ​​mechanism and the buckle are pressed together to fix the chip in the placement slot.

[0013] Preferably, the pressure plate is provided with a needle-piercing groove, which penetrates the pressure plate and corresponds to the placement groove.

[0014] Secondly, the present invention provides a chip testing apparatus, including a probe station, testing equipment, and a chip testing socket as described in any one of the above. The probe station is electrically connected to the testing equipment; The test base and pressure plate in the chip test socket are used to press and fix the chip under test. During electrical performance testing, the probes in the testing equipment contact the surface of the chip under test to achieve an electrical connection with the chip under test.

[0015] Thirdly, the present invention proposes a chip testing method, implemented based on the chip testing apparatus described in any one of the above claims, comprising: The chip test socket is fixed on the probe stage, and the width of the placement slot in the chip test socket is adjusted so that the placement slot is adapted to the chip under test. The chip under test is placed in the placement slot, and the bottom surface of the chip under test is in contact with the probe station; The chip under test is pressed firmly into the placement slot using a pressure plate; The probes in the testing equipment pass through the pressure plate and contact the surface of the chip under test to perform electrical tests on the chip under test.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention provides a chip test socket. A placement slot is formed in the test base, and a fixing plate is installed within the slot, with an elastic mechanism fixedly connected to the fixing plate. The placement slot is used to place the chip under test (DUT). The fixing plate forms an adjustable-width placement position within the placement slot via the elastic mechanism, which applies force to one side of the DUT. A pressure plate closes to the test base along a hinged section, and the pressure strip mechanism presses and fixes the DUT placed in the placement position. By providing an adjustable-width placement slot on the test base, it can accommodate chips of different sizes, offering a wide range of applications. The pressure plate, located on the test base, presses the chip firmly into the placement slot. Once the chip is placed in the slot, the pressure plate is fixed to the test base, achieving a firm and secure fit, ensuring the chip does not shift position during testing. This test socket enables stable testing of small-sized individual chips, improving chip testing efficiency and ensuring testing accuracy.

[0017] This invention provides a chip testing apparatus and method. The method involves fixing a chip test socket to a probe stage, adjusting the width of a placement slot in the chip test socket to fit the chip under test (DUT), placing the DUT in the placement slot with its bottom surface in contact with the probe stage, pressing the DUT firmly into the placement slot using a pressure plate, and then using probes from the testing equipment to pass through the pressure plate and contact the surface of the DUT to perform electrical testing. The testing apparatus of this invention can effectively hold small individual chips and can perform testing on chips of different sizes. It is convenient to use and has a wide range of applications. Attached Figure Description

[0018] Figure 1 This is a perspective view of a chip test socket according to Embodiment 1 of the present invention; Figure 2 This is a schematic diagram of the structure in Embodiment 1 of the present invention, in which the fixing plate is mounted on the slide rail; Figure 3 This is a schematic diagram of the structure of the pressure strip and pressure plate in Embodiment 1 of the present invention; Figure 4 This is a schematic diagram showing the positional relationship between the scale and the probe groove in Embodiment 2 of the present invention; Figure 5 This is a schematic diagram of the chip testing device in Embodiment 2 of the present invention.

[0019] In the diagram: 1 is the test base; 2 is the placement slot; 21 is the retaining edge; 3 is the pressure plate; 31 is the dovetail block; 4 is the probe station; 5 is the chip under test; 6 is the fixing plate; 7 is the elastic mechanism; 8 is the rotating shaft; 9 is the pin slot; 10 is the probe; 11 is the pressure strip; 111 is the dovetail groove; 112 is the locking screw; 12 is the scale; 13 is the control board; 14 is the snap-fit ​​mechanism; 15 is the transmission line; 16 is the test equipment; 17 is the slide rail. Detailed Implementation

[0020] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0021] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0023] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0025] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0026] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0027] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0028] The accompanying drawings illustrate various structural schematic diagrams according to embodiments disclosed in this invention. These drawings are not to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0029] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0030] Example 1: This invention provides a chip test socket, such as... Figure 1 and Figure 2 As shown, it includes: a test base 1 with a placement groove 2, a pressure plate 3 hinged to one end of the test base 1, a fixing plate 6 installed in the placement groove 2, an elastic mechanism 7 fixedly connected to the fixing plate 6, and a pressure strip mechanism fixed on the pressure plate 3.

[0031] The placement slot 2 is used to place the chip under test 5. The fixing plate 6 forms an adjustable placement position in the placement slot 2 through the elastic mechanism 7. The elastic mechanism 7 applies a force to one side of the chip under test 5. The pressure plate 3 closes with the test base 1 along the hinge part. The pressure strip mechanism presses and fixes the chip under test 5 placed in the placement position.

[0032] This invention provides a chip test socket. A placement slot is formed in the test base, and a fixing plate is installed within the slot, with an elastic mechanism fixedly connected to the fixing plate. The placement slot is used to place the chip under test (DUT). The fixing plate forms an adjustable-width placement position within the placement slot via the elastic mechanism, which applies force to one side of the DUT. A pressure plate closes to the test base along a hinged section, and the pressure strip mechanism presses and fixes the DUT placed in the placement position. By providing an adjustable-width placement slot on the test base, it can accommodate chips of different sizes, offering a wide range of applications. The pressure plate, located on the test base, presses the chip firmly into the placement slot. Once the chip is placed in the slot, the pressure plate is fixed to the test base, achieving a firm and secure fit, ensuring the chip does not shift position during testing. This test socket enables stable testing of small-sized individual chips, improving chip testing efficiency and ensuring testing accuracy.

[0033] Specifically, in this embodiment of the invention, the test base 1 is provided with an adjustable-width placement groove 2. The pressure plate 3 is disposed on the test base 1, and the pressure plate 3 is used to press the chip firmly into the placement groove 2. In practical applications, the pressure plate 3 is provided with a pressure strip mechanism corresponding to the placement groove 2. The pressure strip mechanism protrudes from the surface of the pressure plate 3 to increase the pressure of the pressure plate 3 on the chip.

[0034] It should be further explained that the cross-section of the test base 1 is rectangular, and the length of the placement slot 2 is set along the width of the test base 1. The length of the placement slot 2 can be slightly smaller than the width of the test base 1, allowing multiple chips to be placed during the test. The bottom of the placement slot 2 has a hollow structure so that after the chip is placed in the placement slot 2, the bottom of the chip can contact the surface of the probe station 4.

[0035] It should be further explained that the test base 1 of this chip test socket is equipped with an adjustable-width placement slot 2, which can accommodate chips of different sizes, making it widely applicable. The pressure plate 3 of the test socket is mounted on the test base 1 to press the chip firmly into the placement slot 2. After the chip is placed in the placement slot 2, the pressure plate 3 is fixed to the test base 1, achieving a firm and secure hold, ensuring that the chip does not shift position during testing. This test socket enables stable testing of small-sized individual chips, improving chip testing efficiency and ensuring testing accuracy.

[0036] Specifically, in this embodiment of the invention, the elastic mechanism 7 includes a slide rail 17 fixed on the test base 1, a slider mounted on the slide rail 17, and a spring fixedly connected to the slider; The slide rail 17 is perpendicular to the side wall of the placement groove 2. The fixing plate 6 is fixed on the slider. One end of the spring is fixed to the test base 1. The spring applies a force to the fixing plate 6 toward the other side of the placement groove 2.

[0037] The fixing plate 6 is provided with an elastic mechanism 7 on the side opposite to the retaining edge 21. One end of the elastic mechanism 7 is connected to the test base 1, and the opposite side is connected to the fixing plate 6. The elastic mechanism 7 applies a force toward the retaining edge 21. The elastic mechanism 7 can be a spring, and multiple springs are arranged along the length of the fixing plate 6.

[0038] The function of the elastic mechanism 7 is to apply a force to the fixed plate 6 toward the stop edge 21, thereby causing the fixed plate 6 to move toward the stop edge 21. Therefore, the elastic mechanism 7 should be in a compressed state. In practical applications, the elastic coefficient of the elastic mechanism 7 should not be too large to avoid damaging the chip in the placement position.

[0039] In this embodiment, the test base 1 is provided with a slide rail 17, which is perpendicular to the placement slot 2. A slider is mounted on the slide rail 17, and the fixing plate 6 is fixed to the slider. In this embodiment of the chip test holder, a movable fixing plate 6 is also used to adjust the width of the placement slot 2. The movement of the fixing plate 6 is achieved through the cooperation of the slide rail 17 and the slider. The cooperation between the slider and the slide rail 17 makes the movement of the fixing plate 6 convenient and the trajectory fixed, thus making it more convenient to use. Furthermore, a spring is provided on the slider, which applies a force to the slider towards the retaining edge 21 of the placement slot 2, causing the fixing plate 6 to maintain a tendency to move towards the retaining edge 21.

[0040] Specifically, in this embodiment of the invention, a retaining edge 21 is fixedly provided on the other side wall of the placement groove 2 opposite to the fixing plate 6.

[0041] In a more specific embodiment, a retaining edge 21 is provided on one side wall of the placement groove 2, and a movable fixing plate 6 is provided on the opposite side of the retaining edge 21. A placement position for accommodating the chip is formed between the fixing plate 6 and the retaining edge 21. The retaining edge 21 is arranged along the length direction of the placement groove 2, and the length direction of the fixing plate 6 is also the same as the length direction of the placement groove 2. The movable fixing plate 6 can change the distance between the retaining edge 21 and the fixing plate 6, thus the width of the placement position is adjustable to accommodate chips of different sizes. The height of the retaining edge 21 is less than 2mm and can protrude upwards from the surface of the test base 1. In a preferred embodiment, the pressure plate 3 is provided with a groove that matches the retaining edge 21.

[0042] Specifically, in this embodiment of the invention, the pressure strip mechanism includes a pressure strip 11 and a dovetail block 31. The length direction of the dovetail block 31 is arranged along the width direction of the placement groove 2. The pressure strip 11 is provided with a dovetail groove 111 that is adapted to the dovetail block 31. The pressure strip 11 is installed on the pressure plate 3 by inserting and engaging with the dovetail block 31 through the dovetail groove 111.

[0043] It should be further explained that the length direction of the dovetail block 31 is set along the width direction of the placement groove 2, and the pressure strip 11 is provided with a dovetail groove 111 adapted to the dovetail block 31. The pressure strip 11 is movably mounted on the pressure plate 3 through the mutual cooperation between the dovetail groove 111 and the dovetail block 31. The pressure strip 11 is made of rubber with a certain degree of elasticity. The dovetail groove 111 and the dovetail block 31 are in clearance fit. Therefore, after the dovetail groove 111 of the pressure strip 11 is fitted onto the dovetail block 31, the pressure strip 11 can still move along the length direction of the dovetail block 31. In a preferred embodiment, a locking screw 112 can be provided on the pressure strip 11 so that after the pressure strip 11 moves into place, it is fixed on the pressure plate 3 by the locking screw 112, ensuring that the pressure strip 11 will not move during testing, thereby ensuring the accuracy of the test.

[0044] In another implementation, such as Figure 3 As shown, the pressure plate 3 is equipped with a scale 12, which is positioned near the end of the pressure strip 11. The scale 12 can be a graduation line on the pressure plate 3, and its length is set along the moving direction of the pressure strip 11. The scale 12 can visually and quantitatively represent the position of the pressure strip 11, ensuring that the user can accurately move the pressure strip 11 to adapt to the testing of chips of different sizes.

[0045] In another embodiment, the pressure strip 11 is provided with a control plate 13, which is detachably fixed to the end of the pressure strip 11. The control plate 13 is a plate-shaped structure arranged along the length direction of the pressure strip 11 and can be integrally formed with the pressure strip 11. The movement of the pressure strip 11 can be manually controlled by the control plate 13.

[0046] Specifically, in this embodiment of the invention, the pressure plate 3 is provided with a pin groove 9, which penetrates the pressure plate 3 and corresponds to the placement groove 2. During electrical performance testing, the probe 10 passes through the pin groove 9 and contacts the surface of the chip to achieve an electrical connection with the chip.

[0047] Specifically, in this embodiment of the invention, the pressure plate 3 is provided with a snap-fit ​​mechanism 14 that presses and fixes itself to the base. The snap-fit ​​mechanism 14 is fixed to the end of the pressure plate 3 away from the hinge portion, and a corresponding buckle is installed on the test base 1. The snap-fit ​​mechanism 14 and the buckle press and fix themselves to each other, thus fixing the chip in the placement slot 2. During testing, the pressure plate 3 is pressed onto the test base 1, thereby fixing the chip in the placement slot 2.

[0048] After the test is completed, open the clamping mechanism 14. The pressure plate 3 rotates and gradually moves away from the test base 1. At this point, the chip in the placement slot 2 can be removed. To ensure the accuracy of the test, both the test base 1 and the pressure plate 3 are made of insulating material.

[0049] The pressure plate 3 is hinged to the test base 1, that is, a rotating shaft 8 is provided at the connection between the pressure plate 3 and the test base 1.

[0050] In another embodiment, the pressure plate 3 can be separated from the test base 1. In this embodiment, the pressure plate 3 is locked and fixed to the test base 1 by at least two locking mechanisms.

[0051] This invention provides a chip test socket, comprising a test base and a pressure plate. The test base has an adjustable-width placement slot, which can accommodate chips of different sizes, thus having a wide range of applications. The pressure plate is disposed on the test base and is used to press the chip firmly into the placement slot. After the chip is placed in the placement slot, the pressure plate is fixed to the test base, achieving a firm and secure hold on the chip and ensuring that the chip does not shift position during testing. This test socket enables stable testing of small-sized individual chips, which helps improve chip testing efficiency and ensures testing accuracy.

[0052] Example 2: Based on the same inventive concept, the present invention also provides a chip testing device, such as... Figures 4 to 5 As shown, it includes a probe station 4, a test device 16, and a chip test socket as in Example 1.

[0053] The probe station 4 is electrically connected to the test equipment 16; the test base 1 and the pressure plate 3 in the chip test socket press and fix the chip 5 to be tested.

[0054] During electrical performance testing, the probe 10 in the testing device 16 contacts the surface of the chip under test 5 to achieve an electrical connection with the chip under test 5.

[0055] This device can effectively fix small individual chips and can test chips of different sizes. It is easy to use and has a wide range of applications. The probe station 4 is electrically connected to the testing equipment 16 via the transmission line 15 to enable the testing of the electrical performance of the chip. The probe station 4 is provided with a mounting position to accommodate the test base 1. In a preferred embodiment, the probe station 4 can be provided with a positioning pin, and the test base 1 is provided with a positioning hole that matches the positioning pin. The test base 1 is fixed on the probe station 4 by the cooperation of the positioning hole and the positioning pin.

[0056] Example 3: Based on the same inventive concept, the present invention also provides a chip testing method, which is implemented based on the chip testing apparatus described above, and includes: The chip test socket is fixed on the probe station 4, and the width of the placement slot 2 in the chip test socket is adjusted so that the placement slot 2 is adapted to the chip 5 under test. The chip under test 5 is placed in the placement slot 2, and the bottom surface of the chip under test 5 is in contact with the probe station 4; The chip to be tested 5 is pressed into the placement slot 2 using the pressure plate 3; The probe 10 in the test device 16 passes through the pressure plate 3 and contacts the surface of the chip under test 5 to perform electrical tests on the chip under test 5.

[0057] It should be further explained that the testing method in this embodiment of the invention specifically includes the following steps: S100. Fix the chip test socket onto the probe station 4, and adjust the width of the placement slot 2 to fit the chip to be tested. Fixing the chip test socket onto the probe station 4 means fixing the test base 1 onto the probe station 4. Before adjusting the width of the placement slot 2, the dimensions of the individual chip to be tested need to be obtained. The width of the placement slot 2 is adjusted by the fixing plate 6. In a preferred embodiment, a support plate protruding along the side of the fixing plate 6 can be provided at the bottom of the fixing plate 6 to support the chip to be tested.

[0058] S200. Place the chip in the placement slot 2, and make the bottom surface of the chip contact the probe station 4.

[0059] S300, The chip is pressed into the placement groove 2 using the pressure plate 3; specifically, the pressure strip 11 of the pressure plate 3 corresponds to the chip, and the pressure plate 3 is fastened to the surface of the test base 1.

[0060] S400, causing probe 10 to pass through pressure plate 3 and contact the chip surface to perform electrical testing on the chip.

[0061] The testing process of this method is as follows: After placing the chip under test (DUT) 5 in the placement slot 2, the back side of the DUT 5 is in direct contact with the probe station 4, and the probe station 4 is connected to the testing equipment 16 via the transmission line 15, so that current or voltage can be applied to the back side of the DUT 5. The front side of the DUT 5 is in direct contact with the probe 10, and the probe 10 is connected to the testing equipment 16 via the transmission line 15, so that current or voltage can be applied to the front side of the DUT 5, thereby performing electrical testing.

[0062] This invention provides a chip testing method. The method involves fixing a chip test socket to a probe stage, adjusting the width of the placement slot in the chip test socket to fit the chip under test (DUT), placing the DUT in the placement slot with its bottom surface in contact with the probe stage, and using a pressure plate to press the DUT firmly into the placement slot. Probes in the testing device then pass through the pressure plate and contact the surface of the DUT to perform electrical testing. The testing device of this invention can effectively hold small individual chips and can perform testing on chips of different sizes. It is convenient to use and has a wide range of applications.

[0063] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that can be understood by those skilled in the art. The above content is only for illustrating the technical concept of the present invention and should not be construed as limiting the scope of protection of the present invention. Any modifications made based on the technical concept proposed in this invention shall fall within the scope of protection of the claims of this invention.

Claims

1. A chip test socket, characterized in that, include: The test base (1) with a placement slot (2), the pressure plate (3) hinged to one end of the test base (1), the fixing plate (6) installed in the placement slot (2), the elastic mechanism (7) fixedly connected to the fixing plate (6), and the pressure strip mechanism fixed on the pressure plate (3); The placement slot (2) is used to place the chip under test (5). The fixing plate (6) forms an adjustable placement position in the placement slot (2) through the elastic mechanism (7). The elastic mechanism (7) applies a force to one side of the chip under test (5). The pressure plate (3) is joined to the test base (1) along the hinge, and the pressure bar mechanism presses and fixes the chip to be tested (5) placed in the placement position.

2. A chip test socket according to claim 1, characterized in that, The elastic mechanism (7) includes a slide rail (17) fixed on the test base (1), a slider mounted on the slide rail (17), and a spring fixedly connected to the slider; The slide rail (17) is perpendicular to the side wall of the placement groove (2), the fixing plate (6) is fixed on the slider, one end of the spring is fixed on the test base (1), and the spring applies a force to the fixing plate (6) toward the other side of the placement groove (2).

3. A chip test socket according to claim 1, characterized in that, A retaining edge (21) is fixedly provided on the other side wall of the placement groove (2) relative to the fixing plate (6).

4. A chip test socket according to claim 1, characterized in that, The pressure strip mechanism includes a pressure strip (11) and a dovetail block (31). The length direction of the dovetail block (31) is set along the width direction of the placement groove (2). The pressure strip (11) is provided with a dovetail groove (111) that is adapted to the dovetail block (31). The pressure strip (11) is installed on the pressure plate (3) by inserting and engaging with the dovetail block (31) through the dovetail groove (111).

5. A chip test socket according to claim 4, characterized in that, The pressure bar mechanism also includes a control plate (13) disposed on the pressure bar (11); The control plate (13) is a plate-shaped structure arranged along the length direction of the pressure strip (11), and the movement of the pressure strip (11) is controlled by the control plate (13).

6. A chip test socket according to claim 4, characterized in that, The pressure plate (3) is provided with a scale (12), which is located near the end of the pressure strip (11).

7. A chip test socket according to claim 1, characterized in that, The chip test socket also includes a snap-fit ​​mechanism (14). The snap-fit ​​mechanism (14) is fixed to one end of the pressure plate (3) away from the hinge. A corresponding buckle is installed on the test base (1). The snap-fit ​​mechanism (14) and the buckle press against each other to fix the chip in the placement slot (2).

8. A chip test socket according to claim 1, characterized in that, The pressure plate (3) is provided with a needle puncture groove (9), which passes through the pressure plate (3) and corresponds to the placement groove (2).

9. A chip testing device, characterized in that, Includes a probe station (4), a testing device (16), and a chip test socket as described in any one of claims 1-8; The probe station (4) is electrically connected to the test equipment (16); The test base (1) and pressure plate (3) in the chip test socket press and fix the chip (5) to be tested; During electrical performance testing, the probe (10) in the test device (16) contacts the surface of the chip under test (5) to achieve electrical connection with the chip under test (5).

10. A chip testing method, characterized in that, Implemented based on the chip testing apparatus as described in claim 9, including: The chip test socket is fixed on the probe station (4), and the width of the placement slot (2) in the chip test socket is adjusted so that the placement slot (2) is adapted to the chip (5) under test. The chip under test (5) is placed in the placement slot (2) and the bottom surface of the chip under test (5) is in contact with the probe station (4); The chip to be tested (5) is pressed into the placement slot (2) using the pressure plate (3); The probe (10) in the test device (16) passes through the pressure plate (3) and contacts the surface of the chip under test (5) to perform electrical testing on the chip under test (5).

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