A circuit board chip temperature resistance testing device

Abstract

This utility model relates to the field of circuit board performance testing technology, and proposes a circuit board chip temperature resistance testing device, including: a frame, an isolation shell located in the center, and a base located below the frame. The inner wall of the isolation shell of the frame is fixedly connected to a test shell. A fan draws external gas into the heating shell through an air supply pipe, guides the gas flow through a guide plate, and heats the gas inside the heating shell through a heating wire. Then, the hot gas enters from the top of the test shell through a second delivery pipe, and simultaneously enters the chamber where the circuit board chip is placed in the test shell through an airflow port on the surface of the partition. In addition, a semiconductor cooler lowers the temperature of the gas in the cooling shell, and then the low-temperature gas enters from the top of the test shell through a first delivery pipe, and simultaneously enters the chamber where the circuit board chip is placed in the test shell through an airflow port on the surface of the partition. In summary, this application provides a method for testing the performance of circuit board chips in both high-temperature and low-temperature environments.

Description

Technical Field

[0001] This utility model relates to the field of circuit board performance testing technology, specifically to a circuit board chip temperature resistance testing device. Background Technology

[0002] PCIe cards are an interface standard used to connect high-speed components. Each desktop motherboard has many PCIe slots, which can be used to add general-purpose graphics cards, various peripheral cards, wireless network cards, or solid-state drives, etc. Before leaving the factory, the cards undergo high-temperature performance testing to ensure that they can maintain good performance under certain high-temperature environments and eliminate substandard products with poor high-temperature performance.

[0003] A known Chinese utility model patent (Publication No.: CN221804193U) discloses a circuit board chip temperature resistance testing device, including a test chamber and a side plate. An operating port is provided through the side plate, and an air outlet mesh for closing the operating port is hinged to the side plate. A horizontal plate is fixed to the inner wall of the test chamber, and a placement plate is fixed to the top of the horizontal plate. Multiple placement slots for engaging with the circuit board under test are provided on the top of the placement plate. A heating wire is provided between the inner wall of the test chamber and the side of the placement plate away from the air outlet mesh. A blowing assembly is provided inside the test chamber. The bottom of the horizontal plate and the test chamber form a storage cavity for storing a server. A through-hole is provided through the horizontal plate for the connection cable between the server and the circuit board under test to pass through. In this application, the partition can be made of a material with good heat insulation properties. The circuit board under test and the server are located in two different chambers within the test chamber, which helps prevent damage to the server due to excessive temperature, thus affecting the high-temperature testing of the circuit board under test.

[0004] However, the following problems were found in the implementation of the relevant technology: when the board chip is tested for performance, it can only be tested in a single environment. When the board chip is tested at low temperature, the staff needs to disassemble the board chip and put it into other testing equipment for testing, which increases the board chip production time and reduces the factory's work efficiency. Therefore, a board chip temperature resistance testing device is proposed. Utility Model Content

[0005] This invention proposes a circuit board chip temperature resistance testing device, which solves the problem in related technologies that circuit board chips can only be tested in a single environment. When the circuit board chips are tested at low temperatures, the staff needs to disassemble the circuit board chips and put them into other testing equipment for testing, which increases the production time of the circuit board chips and reduces the working efficiency of the factory.

[0006] The technical solution of this utility model is as follows: a circuit board chip temperature resistance testing device, comprising: a frame, an isolation shell disposed in the center and a base disposed below the frame;

[0007] The inner wall of the isolation shell of the frame is fixedly connected to the test shell. The surfaces of the isolation shell and the test shell are provided with sealing elements. The bottom of the isolation shell and the test shell are provided with wire passage openings. The inner wall of the wire passage opening is provided with a high-temperature resistant sealing ring.

[0008] A heating shell is provided on one side of the surface of the isolation shell, and a cooling shell is provided on the other side of the surface of the isolation shell. A first delivery pipe that cooperates with the cooling shell is provided on one side of the test shell, and a second delivery pipe that cooperates with the heating shell is provided on the other side of the test shell. An air inlet assembly is provided on one side of both the heating shell and the cooling shell, and a closure is provided on the inner wall of both the heating shell and the cooling shell.

[0009] A heating wire is fixedly connected to one side of the heating shell, a cooling frame is provided on one side of the cooling shell, a semiconductor cooler is provided on the inner wall of the cooling frame, and a heat dissipation fan is provided on one side of the semiconductor cooler.

[0010] Optionally, the base has multiple opening and closing doors on its surface, multiple dustproof nets on its outer surface, multiple flow openings on the surface of the frame, and inspection door one and inspection door two on the surface of the frame.

[0011] Optionally, the sealing element includes a snap-fit ​​groove formed on one side of the isolation shell and a sealing plate provided on the inner wall of the snap-fit ​​groove. One side of the sealing plate is provided with a high-temperature resistant sealing sheet, which is used to cooperate with the test shell. An observation port is formed on the surface of the sealing plate, and tempered glass is fixedly connected to the inner wall of the observation port.

[0012] Optionally, the air intake assembly includes a fan disposed inside the base and an air supply pipe disposed at the output end of the fan.

[0013] Optionally, the closure includes an adjustment frame, a plurality of adjustment ports formed on the surface of the adjustment frame, a closure plate slidably connected to the inside of the adjustment ports, a plurality of adjustment openings formed on the surface of the closure plate, an electric telescopic rod fixedly connected to one side of the heating shell, and a connecting plate fixedly connected to one side of the electric telescopic rod.

[0014] The connecting plate is fixedly connected to the closing plate.

[0015] Optionally, a temperature sensor is provided on the surface of the isolation shell, the detection end of the temperature sensor is located inside the test shell, and an explosion-proof display is fixedly connected to the outer surface of the frame.

[0016] Optionally, a partition is fixedly connected to the inner wall of the test shell, and the surface of the partition has multiple airflow ports.

[0017] Optionally, a plurality of casters are fixedly connected to the lower surface of the frame, and guide plates are fixedly connected to the inner walls of both the heating shell and the cooling shell.

[0018] The working principle and beneficial effects of this utility model are as follows:

[0019] This application has a reasonable structure. The fan draws external gas into the heating shell through the air supply pipe. The gas is guided by the guide plate and heated by the heating wire. Then, the hot gas enters from the top of the test shell through the second delivery pipe and simultaneously enters the chamber where the test shell houses the circuit board chip through the airflow port on the surface of the partition. In addition, the temperature of the gas in the cooling shell is reduced by the semiconductor cooler. Then, the low-temperature gas enters from the top of the test shell through the first delivery pipe and simultaneously enters the chamber where the test shell houses the circuit board chip through the airflow port on the surface of the partition. In summary, this application provides both high-temperature and low-temperature environments for testing the performance of the circuit board chip. Attached Figure Description

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ;

[0022] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 ;

[0023] Figure 3 This is a cross-sectional structural diagram of the present invention;

[0024] Figure 4 This is a cross-sectional view of the isolation shell and the test shell in this utility model;

[0025] Figure 5 This is a cross-sectional view of the heating shell in this utility model;

[0026] Figure 6 This is a cross-sectional view of the cooling shell in this utility model;

[0027] In the diagram: 1. Frame; 2. Base; 3. Sealing plate; 4. Flow port; 5. Tempered glass; 6. Explosion-proof display; 7. Inspection door one; 8. Dustproof net; 9. Opening door; 10. Casters; 11. Inspection door two; 12. Isolation shell; 13. Heating shell; 14. Electric telescopic rod; 15. Closing plate; 16. Connecting plate; 17. Air supply duct; 18. Fan; 19. Cooling shell; 20. Cooling frame; 21. Test shell; 22. Partition plate; 23. Air outlet; 24. Delivery pipe one; 25. Delivery pipe two; 26. Heating wire; 27. Adjustment frame; 28. Adjustment port; 29. ​​Guide plate; 30. Cooling fan; 31. Semiconductor cooler; 32. Temperature sensor. Detailed Implementation

[0028] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this utility model.

[0029] Example

[0030] Please see Figure 1 - Figure 6 The present invention provides a circuit board chip temperature resistance testing device, comprising: a frame 1, an isolation shell 12 disposed in the center and a base 2 disposed below the frame 1;

[0031] The inner wall of the isolation shell 12 of the frame 1 is fixedly connected to the test shell 21, and the surfaces of the isolation shell 12 and the test shell 21 are provided with sealing elements.

[0032] A heating shell 13 is provided on one side of the surface of the isolation shell 12, and a cooling shell 19 is provided on the other side of the surface of the isolation shell 12. A first delivery pipe 24 that cooperates with the cooling shell 19 is provided on one side of the test shell 21, and a second delivery pipe 25 that cooperates with the heating shell 13 is provided on the other side of the test shell 21. An air inlet assembly is provided on one side of both the heating shell 13 and the cooling shell 19, and a closure is provided on the inner wall of both the heating shell 13 and the cooling shell 19.

[0033] A heating wire 26 is fixedly connected to one side of the heating shell 13, and a cooling frame 20 is provided on one side of the cooling shell 19. A semiconductor cooler 31 is provided on the inner wall of the cooling frame 20, and a heat dissipation fan 30 is provided on one side of the semiconductor cooler 31.

[0034] Furthermore, the surface of the base 2 is provided with multiple opening and closing doors 9, the outer surface of the base 2 is provided with multiple dustproof nets 8, the surface of the frame 1 is provided with multiple flow openings 4, the surface of the frame 1 is provided with inspection door one 7 and inspection door two 11, the bottom of the isolation shell 12 and the test shell 21 are provided with wire passages, and the inner wall of the wire passages is provided with high temperature resistant sealing rings.

[0035] Specifically, the opening and closing door 9 facilitates the placement of the host or server inside the base 2. Then, the wiring port facilitates the connection of the host with the board chip, and the wiring port is sealed with a sealing ring.

[0036] Furthermore, the sealing element includes a snap-fit ​​groove formed on one side of the isolation shell 12 and a sealing plate 3 provided on the inner wall of the snap-fit ​​groove. One side of the sealing plate 3 is provided with a high-temperature resistant sealing sheet, which is used to cooperate with the test shell 21. An observation port is formed on the surface of the sealing plate 3, and a tempered glass 5 is fixedly connected to the inner wall of the observation port.

[0037] Specifically, the sealed card plate 3 is opened to facilitate the placement of the board chip into the test shell 21, and it is connected to the host through the connecting cable. The tempered glass 5 allows the tester to observe the status of the board chip in real time.

[0038] Furthermore, the air intake assembly includes a fan 18 located inside the base 2 and an air supply duct 17 located at the output end of the fan 18.

[0039] Specifically, the fan 18 causes external gas to enter the heating shell 13 and cooling shell 19 through the air supply pipe 17.

[0040] Furthermore, the closure includes an adjustment frame 27, a plurality of adjustment ports 28 formed on the surface of the adjustment frame 27, a closure plate 15 slidably connected to the inside of the adjustment ports 28, a plurality of adjustment openings formed on the surface of the closure plate 15, an electric telescopic rod 14 fixedly connected to one side of the heating shell 13, and a connecting plate 16 fixedly connected to one side of the electric telescopic rod 14.

[0041] The connecting plate 16 is fixedly connected to the closing plate 15.

[0042] Specifically, the electric telescopic rod 14 connects to the connecting plate 16 to make the adjustment opening on the surface of the closing plate 15 coincide with the adjustment port 28, so that the gas can enter the interior of the test shell 21 through the heating shell 13.

[0043] Furthermore, a temperature sensor 32 is provided on the surface of the isolation shell 12, the detection end of the temperature sensor 32 is located inside the test shell 21, and an explosion-proof display 6 is fixedly connected to the outer surface of the frame 1.

[0044] Specifically, the temperature inside the test housing 21 is detected by the temperature sensor 32 and displayed on the surface of the explosion-proof display 6 for easy observation by the test personnel.

[0045] Furthermore, a partition 22 is fixedly connected to the inner wall of the test shell 21, and multiple airflow ports 23 are opened on the surface of the partition 22, which divides the test shell 21 into two chambers.

[0046] Specifically, the gas enters through the top of the test housing 21 and simultaneously enters the chamber where the circuit board chip is placed through the airflow port 23 on the surface of the partition 22, thus preventing the gas from directly contacting the circuit board chip.

[0047] Furthermore, multiple casters 10 are fixedly connected to the lower surface of the base 2, and guide plates 29 are fixedly connected to the inner walls of the heating shell 13 and the cooling shell 19.

[0048] Specifically, the casters 10 facilitate the movement of the base 2, and the guide plate 29 is used to guide the gas flow.

[0049] The workflow for this application is as follows:

[0050] The opening and closing door 9 facilitates the placement of the host or server inside the base 2. Then, the wiring port facilitates the connection of the host and the board chip. At the same time, the wiring port is sealed by the sealing ring. Opening the sealing card plate 3 facilitates the placement of the board chip into the test shell 21 and the connection of the board chip to the host through the wiring.

[0051] The electric telescopic rod 14 connects to the connecting plate 16 to make the adjustment opening on the surface of the closed plate 15 coincide with the adjustment port 28, which facilitates the flow of gas. The fan 18 brings the external gas into the heating shell 13 through the air supply pipe 17. The guide plate 29 guides the gas flow, and the heating wire 26 heats the gas inside the heating shell 13. Then, the hot gas enters from the top of the test shell 21 through the second delivery pipe 25. At the same time, it enters the chamber where the board chip is placed in the test shell 21 through the air outlet 23 on the surface of the partition 22, which avoids the gas from directly contacting the board chip and increases the operating temperature of the board chip.

[0052] In addition, external gas is introduced into the cooling shell 19 through the air supply pipe 17 by the fan 18. The temperature of the gas in the cooling shell 19 is reduced by the semiconductor cooler 31. Then, the low-temperature gas enters from the top of the test shell 21 through the delivery pipe 24 and enters the chamber where the board chip is placed in the test shell 21 through the air outlet 23 on the surface of the partition 22. This avoids the gas from directly contacting the board chip, thus achieving the goal of low-temperature performance testing of the board chip.

[0053] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A circuit board chip temperature resistance testing device, characterized in that, include: The frame (1), the isolation shell (12) located in the center, and the base (2) located below the frame (1); The inner wall of the isolation shell (12) of the frame (1) is fixedly connected to the test shell (21). The surfaces of the isolation shell (12) and the test shell (21) are provided with sealing elements. The bottom of the isolation shell (12) and the test shell (21) are provided with wire-passing holes. The inner wall of the wire-passing holes is provided with high-temperature resistant sealing rings. A heating shell (13) is provided on one side of the surface of the isolation shell (12), and a cooling shell (19) is provided on the other side of the surface of the isolation shell (12). A first delivery pipe (24) that cooperates with the cooling shell (19) is provided on one side of the test shell (21), and a second delivery pipe (25) that cooperates with the heating shell (13) is provided on the other side of the test shell (21). An air inlet assembly is provided on one side of both the heating shell (13) and the cooling shell (19), and a closure is provided on the inner wall of both the heating shell (13) and the cooling shell (19). A heating wire (26) is fixedly connected to one side of the heating shell (13), and a cooling frame (20) is provided on one side of the cooling shell (19). A semiconductor cooler (31) is provided on the inner wall of the cooling frame (20), and a heat dissipation fan (30) is provided on one side of the semiconductor cooler (31).

2. The circuit board chip temperature resistance testing device according to claim 1, characterized in that: The base (2) is provided with multiple opening and closing doors (9) on its surface, and multiple dustproof nets (8) are provided on the outer surface of the base (2). The frame (1) is provided with multiple flow openings (4) on its surface, and inspection door one (7) and inspection door two (11) are provided on the surface of the frame (1).

3. The circuit board chip temperature resistance testing device according to claim 1, characterized in that: The sealing element includes a snap-fit ​​groove on one side of the isolation shell (12) and a sealing plate (3) on the inner wall of the snap-fit ​​groove. One side of the sealing plate (3) is provided with a high-temperature resistant sealing sheet. The sealing sheet is used to cooperate with the test shell (21). An observation port is opened on the surface of the sealing plate (3). Tempered glass (5) is fixedly connected to the inner wall of the observation port.

4. The circuit board chip temperature resistance testing device according to claim 1, characterized in that: The air intake assembly includes a fan (18) located inside the base (2) and an air supply pipe (17) located at the output end of the fan (18).

5. The circuit board chip temperature resistance testing device according to claim 1, characterized in that: The closure includes an adjustment frame (27), multiple adjustment ports (28) opened on the surface of the adjustment frame (27), a closure plate (15) slidably connected to the inside of the adjustment port (28), multiple adjustment openings opened on the surface of the closure plate (15), an electric telescopic rod (14) fixedly connected to one side of the heating shell (13), and a connecting plate (16) fixedly connected to one side of the electric telescopic rod (14). The connecting plate (16) is fixedly connected to the closing plate (15).

6. The circuit board chip temperature resistance testing device according to claim 1, characterized in that: The surface of the isolation shell (12) is provided with a temperature sensor (32), the detection end of the temperature sensor (32) is located inside the test shell (21), and an explosion-proof display (6) is fixedly connected to the outer surface of the frame (1).

7. The circuit board chip temperature resistance testing device according to claim 1, characterized in that: The inner wall of the test shell (21) is fixedly connected to a partition (22), and the surface of the partition (22) is provided with multiple airflow ports (23).

8. The circuit board chip temperature resistance testing device according to claim 1, characterized in that: The lower surface of the frame (1) is fixedly connected with a plurality of casters (10), and the inner walls of the heating shell (13) and the cooling shell (19) are both fixedly connected with guide plates (29).

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