A non-destructive testing probe for a coaxial printed circuit board connector

Abstract

This application relates to the field of printed circuit board connector testing technology, and in particular to a non-destructive testing probe for coaxial printed circuit board connectors. The non-destructive testing probe includes an outer conductor assembly, a ground contact assembly, a center conductor assembly, and an insulating dielectric assembly. The outer conductor assembly includes a first body and a second body. One end of the second body is embedded in the first body, and the other end has a first receiving groove and a second receiving groove. The ground contact assembly is located in the first receiving groove, and the center conductor assembly and the insulating dielectric assembly are located within the outer conductor assembly. During testing, the ground pin and center pin of the coaxial PCB connector under test are connected to the ground contact assembly and the center conductor assembly through the first and second receiving grooves to achieve non-destructive electrical conduction between them. This allows for accurate and reliable performance testing of the PCB coaxial connector, reproducing real-world usage scenarios.

Description

Technical Field

[0001] This application relates to the field of printed circuit board connector testing technology, and in particular to a non-destructive testing probe for coaxial printed circuit board connectors. Background Technology

[0002] As a key interconnect component for high-frequency signal transmission, the accurate testing of the electrical performance of printed circuit board (PCB) coaxial connectors is crucial for ensuring the signal integrity of the entire device. Currently, the mainstream methods in the industry for performance testing of PCB coaxial connectors (such as voltage standing wave ratio, insertion loss, and return loss) mainly include the following three:

[0003] 1. Insert or side-solder the connector under test to the custom PCB test board for testing;

[0004] 2. After grinding down the center pins and ground pins of the two connectors, perform a mating test;

[0005] 3. Insert the center pin of the connector directly into the test fixture for testing.

[0006] However, all of the above methods have significant drawbacks: the first and second methods are complex to operate, constitute destructive testing of coaxial PCB connectors, and cannot be reused; furthermore, the second method does not meet the actual usage conditions of coaxial PCB connectors. While the third method is applicable to connectors without grounding solder pads, it struggles to accurately reproduce the air interface and corresponding impedance changes present when connectors with grounding solder pads are bonded to the PCB board, resulting in insufficient reliability of the test results and making them incompatible with the electrical performance in real-world applications.

[0007] Therefore, how to develop a non-destructive testing probe that can accurately, reliably, and non-destructively test the performance of PCB coaxial connectors is a technical problem that urgently needs to be solved. Summary of the Invention

[0008] The purpose of this application is to overcome the above-mentioned technical problems and provide a non-destructive testing probe for coaxial printed circuit board connectors. Through a unique structural design, it can accurately, reliably and non-destructively test the performance of PCB coaxial connectors.

[0009] This application discloses a non-destructive testing probe for coaxial printed circuit board connectors, specifically employing the following scheme:

[0010] A non-destructive testing probe for a coaxial printed circuit board connector includes: an outer conductor assembly comprising a first body and a second body, one end of the second body being embedded in the first body, and the other end being provided with a first receiving groove and a second receiving groove for the grounding solder pin and center pin of the coaxial PCB connector to be tested to be inserted respectively; a grounding contact assembly located in the first receiving groove and comprising: a pin, a limiting ring, and a first spring, one end of the pin passing through and abutting against the first spring, the limiting ring being punched into the first receiving groove and located at the end of the pin away from the first spring, wherein the grounding solder pin passes through the limiting ring, is located in the first receiving groove, and abuts against the pin, wherein the end of the grounding solder pin is provided with a boss, and the limiting ring... The upper part is provided with a through hole for the protrusion to be inserted and abutted against the limiting ring; the center conductor assembly includes: a first center pin, a second center pin, a third center pin and a second spring member. The first center pin is disposed in the first main body. The second center pin, the second spring member and the third center pin are disposed in the second main body relative to the first center pin. One end of the second spring member is connected to the second center pin and the other end is connected to the third center pin. The end of the third center pin away from the second center pin is inserted into the second receiving groove for electrical conduction of the center pin solder joint. The center pin solder joint inserted into the second receiving groove abuts against the third center pin to conduct electricity between the center pin solder joint and the center conductor assembly.

[0011] By adopting the above technical solution, the outer conductor assembly includes a first main body and a second main body, with one end of the second main body embedded in the first main body, ensuring the stability and tightness of the overall structure. The second main body has a first receiving groove and a second receiving groove for inserting the grounding solder foot and the center pin solder foot respectively, facilitating docking with the PCB connector under test. A through hole is provided on the limiting ring, allowing the grounding solder foot to be inserted. Simultaneously, the limiting ring and the boss encapsulate the first spring and the pin in the first receiving groove, enhancing the connection stability between the grounding solder foot and the pin, ensuring reliable grounding contact, and thus improving the accuracy and stability of the non-destructive testing probe. In the center conductor assembly, the second spring connects the second center pin and the third center pin. When the center pin solder foot is inserted into the second receiving groove and abuts against the third center pin, the second spring can buffer the impact force of the third center pin, achieving stable electrical conduction between the center pin solder foot and the center conductor assembly. Furthermore, the entire testing process will not damage the connector, improving the reliability and safety of the test.

[0012] Optionally, it further includes: an insulating medium assembly, the insulating medium assembly including a first insulating medium, a second insulating medium and a third insulating medium, the first insulating medium being located within the first main body for inserting one end of the first center pin, the second insulating medium being located within one end of the second main body for inserting the end of the second center pin away from the third center pin, the third insulating medium being located within the other end of the second main body for inserting the end of the third center pin away from the second center pin, and the center pin solder joint being inserted into the third insulating medium and electrically connected to the third center pin.

[0013] By adopting the above technical solution, the first insulating medium, the second insulating medium and the third insulating medium are all used to fix the center conductor assembly and form a coaxial structure between the outer conductor assembly, and have the required characteristic impedance. In addition, the setting of the third insulating medium also helps to achieve impedance matching.

[0014] Optionally, the grounding contact assembly further includes: a first spring member located at the end of the pin away from the limiting ring, through which the pin passes and abuts.

[0015] By adopting the above technical solution, the first spring is located at the end of the pin away from the limiting ring and is used for the pin to pass through and abut against it. It can provide elastic support for the pin, ensure reliable abutment between the grounding weld foot and the pin, and thus ensure the electrical connection stability between the grounding contact component and the grounding weld foot. At the same time, the setting of the first spring can also buffer the impact force when the grounding weld foot is inserted to a certain extent, reducing damage to the grounding contact component and the grounding weld foot.

[0016] Optionally, the first receiving slot is configured with four grounding solder feet, and the corresponding grounding contact components are configured with four respectively located in the four first receiving slots; wherein the center pin solder foot is configured with one, located between the four grounding solder feet.

[0017] By adopting the above technical solution, four grounding solder feet are set for the first receiving slot, and the four corresponding grounding contact components are respectively set in the four first receiving slots, which can increase the stability and reliability of grounding contact and ensure good grounding connection. Setting one center pin solder foot and placing it between the four grounding solder feet is conducive to achieving a reasonable layout of the center pin solder foot and the grounding solder foot, reducing mutual interference, and improving the accuracy and stability of detection.

[0018] Optionally, an air interface of a preset length is provided between the coaxial PCB connector and the second main body.

[0019] By adopting the above technical solution, an air interface with a preset length is set between the coaxial PCB connector and the second main body, so that the interface state is consistent with the interface when the traditional coaxial PCB connector is actually soldered to the PCB board, thereby equivalently simulating the real situation when the signal is transmitted from the coaxial PCB connector to the PCB board trace.

[0020] Optionally, a fixing hole is provided on the outer side of the first main body for fixing the first main body.

[0021] By adopting the above technical solution, the fixing hole provided on the outside of the first main body can fix the first main body, ensuring the stability of the non-destructive testing probe during use and avoiding the impact of shaking or displacement on the test results.

[0022] Optionally, the first center pin and the center pin solder joint are electrically connected via two ports of a vector network analyzer.

[0023] By adopting the above technical solution, the first center pin and the center pin solder joint are electrically connected through the two ports of the vector network analyzer. The vector network analyzer can accurately detect and analyze the electrical conductivity between the center pin solder joint and the center conductor assembly, measure relevant electrical parameters, and thus evaluate the electrical performance and transmission characteristics of the non-destructive testing probe during the testing process, which helps to ensure the accuracy and reliability of the test results.

[0024] Optionally, the insulating dielectric assembly is made of polytetrafluoroethylene (PTFE).

[0025] By adopting the above technical solutions, the insulating dielectric component made of polytetrafluoroethylene (PTFE) has a low loss factor, which can reduce energy loss during signal transmission and improve the efficiency and quality of signal transmission; PTFE has good chemical stability, which can resist the corrosion of various chemical substances, enhancing the durability and reliability of the insulating dielectric component; PTFE has a stable dielectric constant, which can ensure the stability of the signal during transmission and reduce signal distortion; PTFE has good high-temperature resistance, which allows the insulating dielectric component to maintain good insulation performance even in high-temperature environments.

[0026] In summary, this application includes at least one of the following beneficial technical effects:

[0027] 1. By adopting a non-destructive testing method, damage to the coaxial printed circuit board connector is avoided, making the connector reusable and solving the problems of complex operation and non-reusability in traditional methods;

[0028] 2. An air interface of a preset length is provided between the coaxial PCB connector under test and the second main body component, which can accurately reproduce the air interface and corresponding impedance changes that exist when the connector with grounding solder is connected to the PCB board, improve the reliability of the test results, and is equivalent to the electrical performance in real application scenarios, thus solving the problem of insufficient reliability of test results in traditional methods.

[0029] 3. By setting up grounding contact components and center conductor components, electrical conductivity can be achieved between the grounding solder pin and the center pin solder pin and the test probe, thus constructing a stable signal transmission and return path and completing the test of the connector's electrical performance. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of a coaxial PCB connector.

[0031] Figure 2 This is a three-dimensional structural schematic diagram of a non-destructive testing probe for a coaxial printed circuit board connector disclosed in an embodiment of this application;

[0032] Figure 3 for Figure 2 A schematic diagram of the cross-sectional structure of a non-destructive testing probe for a coaxial printed circuit board connector after being inserted with the coaxial PCB connector to be tested.

[0033] Figure 4 for Figure 2 An exploded view of a non-destructive testing probe for coaxial printed circuit board connectors is disclosed.

[0034] Figure 5 for Figure 2 A schematic diagram of a non-destructive testing probe for a coaxial printed circuit board connector is disclosed, which is electrically connected to the coaxial PCB connector via two ports of a vector network analyzer.

[0035] Figure 6 for Figure 2 A schematic diagram of the cross-sectional structure of a non-destructive testing probe for a coaxial printed circuit board connector after being inserted with the coaxial PCB connector to be tested.

[0036] Figure 7 A schematic diagram of the structure for soldering a traditional coaxial PCB connector to a PCB test board;

[0037] Figure 8 for Figure 5 The simulation parameters of a non-destructive testing probe for a coaxial printed circuit board connector electrically connected to the two ports of a vector network analyzer are disclosed.

[0038] Figure 9 for Figure 7The simulation parameters for soldering a conventional coaxial PCB connector to a PCB test board are publicly available.

[0039] Explanation of reference numerals in the attached figures:

[0040] 10. Coaxial PCB connector; 100. Tight contact surface; 101. Air interface; 102. Uniform characteristic impedance section; 103. Coaxial line segment; 104. First impedance transformation structure; 105. Second impedance transformation structure; 106. Coaxial transmission line; 11. Center pin solder pad; 12. Grounding solder pad; 121. Boss; 20. Outer conductor assembly; 21. First main body component; 211. Fixing hole; 22. Second main body component; 221. First receiving groove; 222. Second receiving groove; 30. Grounding contact assembly; 31. Pin; 32. Limiting ring; 321. Through hole; 33. First spring component; 40. Center conductor assembly; 41. First center pin; 42. Second center pin; 43. Third center pin; 44. Second spring component; 50. Insulating medium assembly; 51. First insulating medium; 52. Second insulating medium; 53. Third insulating medium. Detailed Implementation

[0041] The terminology used in the following embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” and “this” are intended to include the plural expressions as well, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in this application refers to and includes any or all possible combinations of one or more of the listed items.

[0042] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0043] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings.

[0044] See Figure 1This is an example of a coaxial PCB connector (straight / bent) structure with an operating frequency of 0–10 GHz. The structure of its connection part includes a center pin 11 (for establishing a signal transmission path connection with the PCB test board) and four grounding pins 12 with bosses 121. The center pin 11 is used to establish a signal transmission path connection with the PCB test board, and the grounding pins 12 are used to establish a signal return path connection with the PCB test board.

[0045] See Figure 2 , Figure 3 and Figure 4 This application discloses a non-destructive testing probe for coaxial printed circuit board connectors, which is used to perform connector performance testing in an equivalent manner to a traditional PCB test board without damaging the connector. The non-destructive testing probe includes: an outer conductor assembly 20, a ground contact assembly 30, and a center conductor assembly 40.

[0046] The outer conductor assembly 20 includes a first main body 21 and a second main body 22. One end of the second main body 22 is embedded in the first main body 21, and the other end is provided with a first receiving groove 221 and a second receiving groove 222. The grounding contact assembly 30 is located in the first receiving groove 221, and the center conductor assembly 40 is located in the outer conductor assembly 20. During testing, the grounding solder pin 12 and the center pin solder pin 11 of the coaxial PCB connector 10 under test are connected together with the grounding contact assembly 30 and the center conductor assembly 40 of the non-destructive testing probe through the first receiving groove 221 and the second receiving groove 222 to achieve non-destructive electrical conduction between the two, and to accurately and reliably perform performance testing on the PCB coaxial connector, replicating the actual use scenario.

[0047] Specifically, the assembly structure of the first main component 21 and the second main component 22 forms the basic support for the entire non-destructive testing probe. The first main component 21 and the second main component 22 can be arranged as follows: Figure 2 The structure shown can be made of, for example, copper alloy, which has good conductivity and a certain strength. A fixing hole 211 is provided on the outside of the first main body 21. The structure is a two-hole or four-hole flange sleeved on the outside. The fixing hole 211 can be a circular through hole. During testing, it is used to fix the first main body 21 and the overall structure. For example, it can be installed in a specific position of the test equipment by passing bolts through the fixing hole 211.

[0048] One end of the second main body 22 is embedded in the first main body 21, and the embedding method can be an interference fit to ensure the stability of the connection. At the end of the second main body 22 away from the first main body 21, there are first receiving grooves 221 and second receiving grooves 222 for the grounding solder pin 12 and center pin solder pin 11 of the coaxial PCB connector 10 to be inserted, respectively. The first receiving grooves 221 correspond to four grounding solder pins 12, and their shape can be a stepped deep groove. Each groove, through a limiting ring 32, a spring (first spring member 33), and a pin 31, forms a grounding contact assembly 30 (see below). The corresponding grounding contact assemblies 30 are four in number, each located in one of the four first receiving grooves 221.

[0049] The second receiving slot 222 is used to accommodate the center pin solder 11. One center pin solder 11 is provided, located between the four grounding solder pins 12. The second receiving slot 222 can be a circular slot, matching the shape of the center pin solder 11. An air interface 101 of a predetermined length is spaced between the coaxial PCB connector 10 and the second main body 22. This air interface 101 can more accurately reproduce the air interface 101 and corresponding impedance changes that exist when the connector with grounding solder pins 12 is joined to the PCB board, making the test results more equivalent to the electrical performance in real-world application scenarios.

[0050] The grounding contact assembly 30 is located in the first receiving groove 221 and includes a pin 31, a limiting ring 32, and a first spring 33. The limiting ring 32 abuts against the pin 31, and the first spring 33 is located at the end of the pin 31 away from the limiting ring 32, through which the pin 31 passes and abuts. The pin 31 can be a cylindrical metal part, such as stainless steel, with a certain degree of hardness and wear resistance. The pin 31 is provided with a through hole 321, which can be a circular hole, for the grounding welding foot 12 to be inserted and abutted, thus ensuring good contact between the grounding welding foot 12 and the pin 31. The limiting ring 32 is a copper ring, stamped in the first receiving groove 221, and is used to encapsulate the first spring 33 and the pin 31 in the first receiving groove 221. The first spring element 33 can be a helical spring, which provides a certain elastic buffer when the grounding solder pin 12 is inserted, while ensuring that the outer conductor of the coaxial PCB connector 10 and the second main body 22 form a tight contact surface 100 to construct a complete signal return path.

[0051] The center conductor assembly 40 includes a first center pin 41, a second center pin 42, a third center pin 43, and a second spring member 44. The first center pin 41 is disposed within the first main body 21, and one end of the first center pin 41 can be a slender metal needle, such as brass, which has good conductivity. The second center pin 42, the second spring member 44, and the third center pin 43 are sequentially disposed in the second main body 22 relative to the first center pin 41, with one end of the second spring member 44 connected to the second center pin 42 and the other end connected to the third center pin 43. The second spring member 44 can also be a helical spring, its function being to provide elastic force when the center pin solder joint 11 is inserted, ensuring good contact between the center pins. The end of the third center pin 43 furthest from the second center pin 42 is inserted into the second receiving groove 222 for electrical conduction of the center pin solder joint 11. During testing, the center pin solder 11 of the coaxial PCB connector applies pressure to the third center pin 43, causing it to move backward until it is flush with the end face of the third insulating medium 53 (described below). At this time, the second spring 44 is compressed to provide a continuous and stable normal contact force with the center pin solder 11, thereby establishing a reliable center signal conduction connection.

[0052] In addition, it is worth mentioning that, see Figure 3 The non-destructive testing probe also includes an insulating dielectric assembly 50, which is assembled into the outer conductor assembly 20 by stamping and includes a first insulating dielectric 51, a second insulating dielectric 52, and a third insulating dielectric 53. The first insulating dielectric 51 is located inside the first main body 21 and is used for inserting one end of the first center pin 41. The second insulating dielectric 52 is located inside one end of the second main body 22 and is used for inserting the end of the second center pin 42 away from the third center pin 43. The third insulating dielectric 53 is located inside the other end of the second main body 22 and is used for inserting the end of the third center pin 43 away from the second center pin 42. The center pin solder joint 11 is inserted into the third insulating dielectric 53 and is electrically connected to the third center pin 43.

[0053] Among them, the insulating dielectric assembly 50 is made of polytetrafluoroethylene (PTFE). PTFE has good insulation properties and chemical stability, which can effectively prevent leakage between the center pins and between the center pins and other components, thus ensuring the accuracy of the test.

[0054] See Figure 3 , Figure 5 and Figure 6During testing, the first center pin 41 of the non-destructive testing probe and the center pin solder 11 of the coaxial PCB connector are electrically connected via the two ports of a vector network analyzer (VNA). Subsequently, the center pin solder 11 of the coaxial PCB connector 10 is inserted into the second receiving slot 222 to abut against the third center pin 43, and the second spring 44 pushes the second center pin 42 to abut against the first center pin 41, thereby establishing a reliable center signal conduction electrical connection between the center pin solder 11 and the center conductor assembly 40. At the same time, the four ground solder pins 12 of the coaxial PCB connector 10 are inserted into the first receiving slot 221 via the limiting ring 32 to push the corresponding pins 31 to compress the first spring 33, so that the outer conductor of the coaxial PCB connector 10 and the second body 22 form a tight contact surface 100, constructing a complete signal return path.

[0055] When the coaxial PCB connector 10 is fully inserted, the end boss 121 of its grounding solder pin 12 is blocked and tightly fitted by the limiting ring 32 (i.e., the boss 121 is pressed against the through hole 321), further preventing the grounding solder pin 12 from being pushed out by the first spring member 33, thereby enhancing the grounding effect and forming an air interface 101 between the two. This interface state is similar to... Figure 5 The interface of the coaxial PCB connector 10 shown is consistent with that of the actual PCB board when it is soldered, thus simulating the actual situation when the signal is transmitted from the connector to the PCB trace.

[0056] When an RF signal is transmitted from the 50Ω uniform characteristic impedance section 102 of the coaxial PCB connector 10, and passes through the exposed center pin solder pad 11 at the air interface 101, this solder pad introduces a series inductive mismatch. To compensate for this effect, the solder pad section extending into the non-destructive testing probe and the outer conductor assembly 20 of the non-destructive testing probe form a coaxial line section 103 with a lower characteristic impedance, which acts as capacitive compensation. Subsequently, the signal is transmitted to the third center pin 43 and passes through two impedance transformation structures in sequence: the first impedance transformation structure 104 reduces signal reflection caused by structural steps by keeping the inner diameter of the outer conductor constant; the second impedance transformation structure 105 is a stepped impedance coaxial transition line used for a good impedance matching transition with the subsequent 50Ω coaxial transmission line 106. This design is equivalent to the impedance matching process experienced by the signal of the coaxial PCB connector 10 in actual applications, when it transitions from the air interface 101 through the pads and vias on the PCB test board to the microstrip line, see [reference]. Figure 7 .

[0057] Based on the aforementioned coaxial line segment 103 with low characteristic impedance and a two-segment impedance transformation structure with constant outer and inner diameters, an integrated impedance matching network is constructed. This structure effectively provides capacitive compensation for the inductive mismatch introduced by the air interface and ultimately achieves good matching with a standard 50Ω transmission line. This effectively optimizes and transforms the entire impedance transformation process of the signal from the air interface through PCB pads and vias to the microstrip line when the coaxial PCB connector 10 is bonded to the PCB board.

[0058] See Figure 8 , which is the simulation S-parameter result of the connection between the non-destructive testing probe and the coaxial PCB connector 10 to be tested in this embodiment; Figure 9 These are the simulated S-parameters for traditional welding testing methods. A comparison shows that the curves of both methods exhibit similar trends. Among them, Figure 8 and Figure 9 S 11 Reflectance coefficient (dB) curve and S 21 Compared to the transmission coefficient (dB) curve, Figure 8 S in 11 The resonant point of the reflection coefficient (dB) curve shifts slightly towards higher frequencies. 21 The loss in the transmission factor (dB) curve is slightly lower because the electrical length of the signal transmission in the test probe is shorter than that of the PCB trace. This difference does not affect the effective evaluation of the connector performance.

[0059] The implementation principle of this embodiment is as follows: The non-destructive testing probe, through a reasonable structural design, utilizes the first accommodating groove 221 and the second accommodating groove 222 to respectively accommodate the grounding solder foot 12 and the center pin solder foot 11. The grounding contact component 30 and the center conductor component 40 achieve electrical conductivity with the solder foot. Electrical performance testing is then performed using a vector network analyzer. This method can effectively replace PCB soldering testing methods without damaging the connector. Furthermore, by simulating the actual soldering interface and impedance transition conditions, a complete signal transmission path and return path are constructed, achieving results similar to PCB soldering testing. It also possesses advantages such as simple and fast operation, accurate results, and low cost, making it suitable for large-scale production testing and demonstrating significant application value and market prospects.

[0060] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A non-destructive testing probe for coaxial printed circuit board connectors, characterized in that, include: The outer conductor assembly (20) includes a first main body (21) and a second main body (22). One end of the second main body (22) is embedded in the first main body (21), and the other end is provided with a first receiving groove (221) and a second receiving groove (222) for the grounding solder pin (12) and center pin solder pin (11) of the coaxial PCB connector (10) to be tested to be inserted respectively. An air interface (101) of a predetermined length is provided between the coaxial PCB connector (10) and the second main body (22). A grounding contact assembly (30) is located in the first receiving groove (221) and includes: a pin (31), a limiting ring (32), and a first spring (33). One end of the pin (31) passes through and abuts against the first spring (33). The limiting ring (32) is pressed into the first receiving groove (221) and is located at the end of the pin (31) away from the first spring (33). The grounding welding foot (12) passes through the limiting ring (32) and is located in the first receiving groove (221) and abuts against the pin (31). The end of the grounding welding foot (12) is provided with a boss (121). The limiting ring (32) is provided with a through hole (321) for the boss (121) to be inserted and abutted and fixed to the limiting ring (32). The center conductor assembly (40) includes: a first center pin (41), a second center pin (42), a third center pin (43), and a second spring member (44). The first center pin (41) is disposed in the first main body (21). The second center pin (42), the second spring member (44), and the third center pin (43) are disposed in the second main body (22) in sequence relative to the first center pin (41). One end of the second spring member (44) is connected to the second center pin (42), and the other end is connected to the third center pin (43). The end of the third center pin (43) away from the second center pin (42) is inserted into the second receiving groove (222) for electrically conducting the center pin solder foot (11). The center pin solder foot (11) inserted into the second receiving groove (222) abuts against the third center pin (43) to conduct electricity between the center pin solder foot (11) and the center conductor assembly (40). An insulating medium assembly (50) includes a first insulating medium (51), a second insulating medium (52), and a third insulating medium (53). The first insulating medium (51) is located inside the first main body (21) for inserting one end of the first center pin (41). The second insulating medium (52) is located inside one end of the second main body (22) for inserting the end of the second center pin (42) away from the third center pin (43). The third insulating medium (53) is located inside the other end of the second main body (22) for inserting the end of the third center pin (43) away from the second center pin (42). The center pin solder foot (11) is inserted into the third insulating medium (53) and electrically connected to the third center pin (43).

2. The non-destructive testing probe according to claim 1, characterized in that, The first receiving groove (221) is configured with four grounding solder feet (12), and the corresponding grounding contact components (30) are configured with four respectively located in the four first receiving grooves (221); wherein the center pin solder foot (11) is configured with one, located between the four grounding solder feet (12).

3. The non-destructive testing probe according to claim 1, characterized in that, The first main body (21) has a fixing hole (211) on its outer side for fixing the first main body (21).

4. The non-destructive testing probe according to claim 1, characterized in that, The first center pin (41) and the center pin solder foot (11) are electrically connected via the two ports of the vector network analyzer.

5. The non-destructive testing probe according to claim 1, characterized in that, The insulating dielectric assembly (50) is made of polytetrafluoroethylene.

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