Optical chip packaging structure and preparation method thereof

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to an optical chip packaging structure and a preparation method thereof. The optical chip packaging structure comprises a first optical conduction unit of an optical chip and a second optical conduction unit of an optical connector module which are oppositely arranged, and the first optical conduction unit converts a light beam horizontally output by an optical port into a light beam in the vertical direction and vertically emits the light beam from the first surface of the optical chip. The second optical conduction unit converts the light beam emitted by the first optical conduction unit into a light beam in the horizontal direction and inputs the light beam into an optical fiber of the optical connector module, so that the first optical conduction unit is flexibly arranged at any position of the first surface of the optical chip, and compatibility with a wafer-level test process is realized. Moreover, the optical connector module of the optical chip packaging structure is of a pluggable structure, so that the optical chip packaging structure and the optical connector module are decoupled, replacement of the whole optical chip packaging structure in a traditional process is avoided, and the life cycle of the optical chip packaging structure is prolonged.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to an optical chip packaging structure and its fabrication method. Background Technology

[0002] With the exponential growth in computing power demand from artificial intelligence, cloud computing, and big data centers, co-packaged optoelectronic (CPO) technology, which integrates PIC optical chips and electrical chips through advanced packaging, is regarded as a key path to break through the performance bottleneck of traditional pluggable optical modules.

[0003] In the CPO architecture, the coupling efficiency, alignment tolerance, testability, and maintainability of the optical chip and fiber array directly determine the product's yield, cost, and lifecycle. Currently, the fiber coupling processes widely used in the industry mainly include vertical grating coupling (GC) and edge coupling (EC). GC coupling offers greater flexibility in placement and facilitates testing, but its performance is limited by factors such as light source type and high coupling loss. While edge coupling offers high coupling efficiency, it cannot achieve wafer-level inspection. Therefore, existing fiber coupling processes hinder the large-scale mass production of CPO products with high yield and low cost goals. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides an optical chip packaging structure and its fabrication method.

[0005] An optical chip packaging structure, comprising: Optical chips and optical connector modules; The first surface of the optical chip has an optical chip receiving groove, the side wall of the optical chip receiving groove is provided with an optical port, and a first optical transmission unit is provided in the optical chip receiving groove. The first optical transmission unit is correspondingly arranged with the optical port. The first optical transmission unit is used to convert the horizontally output light beam of the optical port into a vertically oriented light beam that is vertically emitted from the first surface of the optical chip. The optical connector module includes an optical fiber array and a second optical transmission unit. The optical fiber array includes several optical fibers. One end of each optical fiber is optically connected to the second optical transmission unit. The second optical transmission unit is disposed opposite to the first optical transmission unit. The second optical transmission unit is used to convert the vertically emitted light beam from the first optical transmission unit into a horizontally oriented light beam and input it into the optical fiber of the optical fiber array.

[0006] Optionally, the first light transmission unit is a curved micromirror, which is opposite to the center of the optical port.

[0007] Optionally, the optical port is a mode converter, and the first optical transmission unit is opposite to the center of the mode converter.

[0008] Optionally, the optical chip receiving groove is located at the middle or edge of the first surface of the optical chip.

[0009] Optionally, the optical connector module further includes a first optical fiber substrate, the first optical fiber substrate having a reflective bevel, the reflective bevel serving as the second optical transmission unit; the optical fiber is located on the first surface of the first optical fiber substrate, the reflective bevel being disposed opposite to one end of the optical fiber, thereby realizing an optical connection between one end of the optical fiber and the second optical transmission unit.

[0010] Optionally, the optical connector module further includes a first optical fiber cover, which has a cover window. The first optical fiber cover is located on the first surface of the first optical fiber substrate and the surface of the optical fiber array. The cover window is located above the reflective slope, exposing the reflective slope, thereby realizing the relative arrangement of the second optical transmission unit and the first optical transmission unit.

[0011] Optionally, the optical connector module further includes a second optical fiber substrate and a second optical fiber cover. The optical fiber is located on the first surface of the second optical fiber substrate, and the second optical fiber cover is located on the first surface of the second optical fiber substrate and the surface of the optical fiber array. The second optical fiber substrate, the second optical fiber cover, and the optical fiber array constitute an optical fiber subunit, and one end of the optical fiber is exposed on the first side end face of the optical fiber subunit. The second optical transmission unit is a lens array, which includes a plurality of lenses. The lenses are located on the first side end face of the optical fiber subunit and are optically connected to the optical fiber, so that the light beam emitted from the first optical transmission unit passes through the lenses and enters the optical fiber of the optical fiber array.

[0012] Optionally, the first surface of the first optical fiber substrate and the first surface of the second optical fiber substrate have a plurality of grooves, and the optical fiber is located in the grooves.

[0013] Optionally, the optical chip packaging structure further includes a substrate and a first socket. The first side end face of the substrate has a substrate slot, and the first socket is fixed in the substrate slot on the first side end face of the substrate. The first socket is used to position the optical connector module. The optical chip is located on the first surface of the substrate, the first surface of the optical chip is disposed opposite to the first surface of the substrate, the optical chip receiving groove is disposed opposite to the slot window, and the optical chip is electrically connected to the substrate; The optical connector module is positioned in the substrate slot via a first socket. The optical connector module corresponds to the optical chip receiving slot of the optical chip, such that the second optical transmission unit of the optical connector module is arranged opposite to the first optical transmission unit in the optical chip receiving slot.

[0014] Optionally, the optical chip packaging structure further includes a substrate and a second socket, the second socket being fixed to the edge of the first surface of the substrate, and the second socket being used to position the optical connector module above the first surface of the substrate; The optical chip is located on the first surface of the substrate, and the first surface of the optical chip is arranged in the same direction as the first surface of the substrate; The optical connector module is positioned above the first surface of the substrate via a second socket. The optical connector module corresponds to the optical chip receiving slot of the optical chip, such that the second optical transmission unit of the optical connector module is arranged opposite to the first optical transmission unit in the optical chip receiving slot.

[0015] Optionally, the optical chip packaging structure further includes a substrate and a third socket. The first surface of the substrate has a substrate receiving groove, and the third socket is fixed to the edge of the first surface of the substrate. The third socket is used to position the optical connector module above the first surface of the substrate. The optical chip is located in the substrate receiving groove, and the first surface of the optical chip is arranged in the same direction as the first surface of the substrate and the first surface of the optical chip is exposed by the substrate receiving groove. The optical connector module is positioned above the first surface of the substrate via a third socket. The optical connector module corresponds to the optical chip receiving slot of the optical chip, such that the second optical transmission unit of the optical connector module is arranged opposite to the first optical transmission unit in the optical chip receiving slot.

[0016] Optionally, the optical chip packaging structure further includes a first optical chip receiving structure, wherein the optical chip is located on a first surface of the first optical chip receiving structure, the projection of the first optical chip receiving structure onto the optical chip does not overlap with the optical chip receiving groove, the first optical chip receiving structure is electrically connected to the substrate, and the first surface of the first optical chip receiving structure is disposed opposite to the first surface of the substrate and the first surface of the optical chip, and the optical chip is electrically connected to the substrate through the first optical chip receiving structure.

[0017] Optionally, the first optical chip receiving structure is a combination structure of an electrical chip and an adapter board, or an adapter board or an electrical chip.

[0018] Optionally, the optical chip packaging structure also includes an electrical chip located on the first surface of the substrate.

[0019] Optionally, the electrical chip is one or both of ASIC and EIC.

[0020] Optionally, the optical chip packaging structure further includes a heat sink, which is disposed on the first surface of the substrate, above the optical chip and the optical connector module.

[0021] This invention also provides a method for fabricating an optical chip packaging structure, comprising: An optical chip is provided, the first surface of the optical chip has an optical chip receiving groove, the sidewall of the optical chip receiving groove is provided with an optical port, the optical chip receiving groove is provided with a first optical transmission unit, the first optical transmission unit is correspondingly arranged with the optical port, and the first optical transmission unit is used to convert the horizontally output light beam of the optical port into a vertically oriented light beam that is vertically emitted from the first surface of the optical chip. An optical connector module is provided, which is disposed opposite to the first surface of the optical chip. The optical fiber array includes a plurality of optical fibers, one end of which is optically connected to a second optical transmission unit. The second optical transmission unit is disposed opposite to the first optical transmission unit. The second optical transmission unit is used to convert the beam emitted vertically from the first optical transmission unit into a beam in the horizontal direction and input it into the optical fiber of the optical fiber array.

[0022] Optionally, when the optical chip packaging structure further includes a substrate, a first socket, and a heat sink, the fabrication method includes: A substrate is provided, the substrate having a first surface and a substrate slot on a first side end face of the substrate; An optical chip is provided, the optical chip is disposed on a first surface of the substrate, the first surface of the optical chip is disposed opposite to the first surface of the substrate, the optical chip receiving groove is disposed opposite to the slot window, and the optical chip is electrically connected to the substrate; A first socket is provided, which is fixed in a substrate slot on a first side end face of the substrate, and the first socket is used to position the optical connector module; A heat dissipation cover is provided and disposed on the first surface of the substrate, above the optical chip; The optical connector module is inserted into and positioned in the substrate slot through the first socket, such that the second optical transmission unit of the optical connector module is positioned opposite to the first optical transmission unit in the optical chip receiving slot.

[0023] Optionally, when the optical chip packaging structure further includes a substrate, a second socket, and a heat sink, the fabrication method includes: A substrate is provided, the first surface of which has a substrate receiving groove; An optical chip and a first optical chip receiving structure are provided. The optical chip is disposed on a first surface of the first optical chip receiving structure. The first surface of a first electrical chip unit is disposed opposite to the first surface of the first optical chip receiving structure. The projection of the first optical chip receiving structure onto the optical chip does not overlap with the optical chip receiving groove. The optical chip is disposed in the substrate receiving groove. The first surface of the optical chip is disposed in the same direction as the first surface of the substrate and the first surface of the optical chip is exposed by the substrate receiving groove. The first surface of the first optical chip receiving structure is disposed opposite to the first surface of the substrate and the first surface of the optical chip. The first optical chip receiving structure is electrically connected to the substrate. A third socket is provided, which is fixed to the edge of the first surface of the substrate and is used to position the optical connector module above the first surface of the substrate; A heat dissipation cover is provided, which is placed over the first surface of the substrate and above the optical chip. The optical connector module is inserted through the third socket and positioned above the first surface of the substrate. The optical connector module corresponds to the optical chip receiving slot, such that the second optical transmission unit is disposed opposite to the first optical transmission unit in the optical chip receiving slot.

[0024] Optionally, when the optical chip packaging structure further includes an electrical chip, the electrical chip is disposed on the first surface of the substrate.

[0025] In summary, the advantages and beneficial effects of the present invention are as follows: This application provides an optical chip packaging structure and its fabrication method. The optical chip packaging structure includes an optical chip and an optical connector module. The first surface of the optical chip has an optical chip receiving groove, and the sidewall of the optical chip receiving groove is provided with an optical port. A first optical transmission unit is provided in the optical chip receiving groove, and the first optical transmission unit is correspondingly arranged with the optical port. The first optical transmission unit is used to convert the horizontally output light beam from the optical port into a vertically oriented light beam that is vertically emitted from the first surface of the optical chip. The optical connector module includes an optical fiber array and a second optical transmission unit. The optical fiber array includes a plurality of optical fibers, one end of which is optically connected to the second optical transmission unit. The second optical transmission unit is arranged opposite to the first optical transmission unit, and the second optical transmission unit is used to convert the vertically emitted light beam from the first optical transmission unit into a horizontally oriented light beam and input it into the optical fiber array.

[0026] The first optical transmission unit located in the optical chip receiving slot and the second optical transmission unit arranged opposite to it are used to convert the horizontally output light beam from the optical port into a vertically oriented light beam that is emitted vertically from the first surface of the optical chip. The vertically emitted light beam is then converted into a horizontally oriented light beam and input into the optical fiber of the optical connector module. This allows the first optical transmission unit to be flexibly arranged at any position on the first surface of the optical chip, achieving compatibility with wafer-level testing processes.

[0027] Furthermore, the optical connector module of the optical chip packaging structure is a pluggable structure, which decouples the optical chip packaging structure from the optical connector module, avoiding the need to replace the entire optical chip packaging structure in traditional processes and extending the life cycle of the optical chip packaging structure. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of an optical chip packaging structure provided in an embodiment of the present invention; Figure 2 This is a top view schematic diagram of an optical chip in an optical chip packaging structure provided in an embodiment of the present invention; Figure 3 A top view schematic diagram of an optical fiber array in an optical chip packaging structure provided in an embodiment of the present invention; Figure 4 for Figure 3 A cross-sectional schematic diagram of the provided fiber optic array; Figure 5 A cross-sectional schematic diagram of an optical connector module in an optical chip packaging structure provided in another embodiment of the present invention; Figure 6 for Figure 5 A top view of the provided optical connector module; Figure 7 This is a schematic diagram of an optical chip packaging structure provided in an embodiment of the present invention; Figure 8 for Figure 7 A top view schematic diagram of an optical chip packaging structure is provided; Figure 9 This is a schematic diagram of an optical chip packaging structure provided in another embodiment of the present invention; Figure 10 This is a schematic diagram of an optical chip packaging structure provided in another embodiment of the present invention; Figure 11 for Figure 10 A top view schematic diagram of an optical chip packaging structure is provided; Figure 12 A schematic flowchart of a method for fabricating an optical chip packaging structure provided by an embodiment of the present invention; Figures 13-15A schematic diagram illustrating a method for fabricating an optical chip packaging structure according to an embodiment of the present invention; Figures 16-22 This is a schematic diagram of a method for fabricating an optical chip packaging structure according to another embodiment of the present invention. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] It should be understood that terms such as “first” and “second” used herein to describe various elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. For example, the use of terms such as “first” and “second” herein does not imply order or sequence unless the context clearly indicates otherwise. For ease of description, spatially relative terms such as “upper” and “lower” may be used herein to describe the relationship of one element or feature to other elements or features as shown in the accompanying drawings. It should be understood that spatially relative terms are intended to include not only the orientations shown in the accompanying drawings but also different orientations of the device in use or operation.

[0031] In this application, unless otherwise expressly specified and limited, the terms "connected" and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0032] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples. It should be noted that the terms "comprising" and "having," and their variations, used in this application are intended to cover non-exclusive inclusion.

[0033] The coupling interface of the vertical grating coupling process is located on the surface of the optical chip, which allows for flexible placement and compatibility with wafer-level testing processes. It enables comprehensive optoelectronic performance screening before chip dicing, improving product manufacturing yield and reducing testing costs. However, the vertical grating coupling process is limited by the diffraction coupling principle, resulting in high coupling loss. It is also sensitive to the operating wavelength and has significant polarization-dependent loss, which limits its high-performance applications.

[0034] Edge coupling technology couples the optical chip through the end face on the side and achieves optical field mode matching through a mode converter. Edge coupling technology has the characteristics of high coupling efficiency, wide operating bandwidth, and polarization insensitivity. However, the coupling interface of edge coupling technology is located at the edge of the optical chip, which means that edge coupling cannot be optically tested at the wafer level. All optical performance tests can only be performed after the optical chip is cut and expensive packaging alignment is completed, which greatly increases manufacturing risk and cost.

[0035] Therefore, to meet the requirements of both wafer-level testing capabilities and high coupling performance, this invention provides an optical chip packaging structure and its fabrication method.

[0036] This invention provides an optical chip packaging structure, such as... Figure 1 As shown, it includes: Optical chip 100 and optical connector module 200; The first surface of the optical chip 100 has an optical chip receiving groove 101. The side wall of the optical chip receiving groove 101 is provided with an optical port 102. The optical chip receiving groove 101 is provided with a first light transmission unit 103. The first light transmission unit 103 is correspondingly arranged with the optical port 102. The first light transmission unit 103 is used to convert the horizontally output light beam of the optical port 102 into a vertically oriented light beam that is vertically emitted from the first surface of the optical chip 100. The optical connector module 200 includes an optical fiber array and a second optical transmission unit 202. The optical fiber array includes a plurality of optical fibers 201. One end of each optical fiber 201 is optically connected to the second optical transmission unit 202. The second optical transmission unit 202 is disposed opposite to the first optical transmission unit 103. The second optical transmission unit 202 is used to convert the vertically emitted light beam from the first optical transmission unit 103 into a horizontally oriented light beam and input it into the optical fiber 201 of the optical fiber array.

[0037] In this embodiment of the invention, the optical chip 100 is a photonic integrated circuit (PIC), which integrates optical devices such as modulators and detectors.

[0038] In other embodiments, the optical chip may further include a laser chip, an electro-optic modulator chip, a detector chip, a coherent optical transceiver chip, an optical phased array chip, or a photonic computing chip, and the type of optical chip is not limited.

[0039] In this embodiment of the invention, the first surface of the optical chip 100 has an optical chip receiving groove 101, which is a reserved position for the first optical transmission unit 103. The first optical transmission unit 103 is disposed in the optical chip receiving groove 101, and the center of the first optical transmission unit 103 is opposite to that of the optical port 102, thereby realizing the optical connection between the first optical transmission unit 103 and the optical port 102. The first optical transmission unit 103 is used to convert the horizontally output light beam of the optical port 102 into a vertically oriented light beam that is vertically emitted from the first surface of the optical chip 100. The direction parallel to the first surface of the optical chip 100 is the horizontal direction, and the direction perpendicular to the first surface of the optical chip 100 is the vertical direction.

[0040] In this embodiment of the invention, the optical port 102 is a mode converter, and the first optical transmission unit 103 is opposite to the center of the mode converter. The mode converter converts the small light spot of the optical chip waveguide of the optical chip into a large light spot, thereby significantly reducing coupling loss.

[0041] In this embodiment of the invention, the sidewall of the optical chip receiving slot is provided with a receiving slot step, and the mode converter is located on the receiving slot step of the sidewall of the receiving slot.

[0042] In this embodiment of the invention, the first light transmission unit 103 is a curved micromirror, and the curved micromirror is opposite to the center of the optical port 102.

[0043] In this embodiment of the invention, the curved micromirror has a concave or curved micro-reflector that collimates and reflects the light spot emitted from the optical port 102, converging it to form a light spot more suitable for optical fiber reception.

[0044] In this embodiment of the invention, the first surface of the optical chip 100 has an optical chip conductive bump 104, which is used for electrical connection.

[0045] In embodiments of the present invention, such as Figure 2 As shown, the first surface of the optical chip 100 has a plurality of optical chip receiving slots 101, each of which is coupled with an optical fiber. When there are multiple optical chip receiving slots 101, multiple independent optical channels are provided, thereby realizing high bandwidth and high density data transmission.

[0046] In this embodiment of the invention, the optical chip receiving slot 101 is located at the middle position of the first surface of the optical chip 100, so that the optical chip receiving slot 101 can be located at any position on the first surface of the optical chip that does not have an optical signal channel and an active device area. This avoids the situation in the traditional process where the first optical transmission unit 103 must be located at the edge of the optical chip 100 or the end of a certain main waveguide. This allows the light beam of the optical chip 100 to be emitted perpendicularly from any position on the first surface of the optical chip. The direction parallel to the first surface of the optical chip is the horizontal direction, and the direction perpendicular to the first surface of the optical chip is the vertical direction.

[0047] In other embodiments, the optical chip receiving slot may also be located at the edge of the first surface of the optical chip.

[0048] In embodiments of the present invention, such as Figure 1 , Figure 3 As shown, the optical connector module 200 is used to transmit the light beam from the optical chip 100 to an external optical fiber network.

[0049] In this embodiment of the invention, the optical fiber array of the optical connector module 200 has multiple optical fibers 201. The number of optical fibers 201 is the same as the number of the first optical transmission units 103 on the first surface of the optical chip 100. The optical fibers 201 cooperate with the first optical transmission units 103 to provide multiple independent optical channels and realize high bandwidth and high density data transmission.

[0050] In this embodiment of the invention, the second optical transmission unit 202 converts the beam of vertical light output from the first optical transmission unit 103 into a beam of horizontal light and inputs it into the optical fiber 201 of the optical connector module 200.

[0051] Specifically, in the embodiments of the present invention, such as Figure 1 , Figure 3 As shown, the optical connector module 200 further includes a first optical fiber substrate 203, which has a reflective slope, and the reflective slope serves as the second optical transmission unit 202; the optical fiber 201 is located on the first surface of the first optical fiber substrate 203, and the reflective slope is disposed opposite to one end of the optical fiber 201 to realize the optical connection between one end of the optical fiber 201 and the second optical transmission unit 202.

[0052] In this embodiment of the invention, the first surface of the first optical fiber substrate 203 has a plurality of grooves 2031, and the optical fiber 201 is located in the grooves 2031.

[0053] In other embodiments, the surface of the reflective slope has a metal coating, and the metal coating and the reflective slope together serve as the second light transmission unit. The metal coating increases the light reflection ratio and reduces light loss during the coupling process.

[0054] In other embodiments, the reflective slope is a plane mirror, which serves as the second light transmission unit.

[0055] In embodiments of the present invention, such as Figure 1 As shown, the optical connector module 200 further includes a first optical fiber cover 204. The first optical fiber cover 204 has a cover window 2041. The first optical fiber cover 204 is located on the first surface of the first optical fiber substrate 203 and the surface of the optical fiber array. The cover window 2041 is located above the second optical transmission unit 202, exposing the second optical transmission unit 202 and realizing the relative arrangement of the second optical transmission unit 202 and the first optical transmission unit 103.

[0056] In this embodiment of the invention, the first optical fiber cover 204 is a glass cover.

[0057] In another embodiment of the invention, such as Figure 4 As shown, the surface of the first optical fiber substrate has a receiving protrusion 2032, which is used to position the optical connector module 200.

[0058] In another embodiment of the invention, such as Figure 5 , Figure 6As shown, the optical connector module 200 further includes a second optical fiber substrate 205 and a second optical fiber cover 206. The optical fiber 201 is located on the first surface of the second optical fiber substrate 205, and the second optical fiber cover 206 is located on the first surface of the second optical fiber substrate 205 and the surface of the optical fiber array. The second optical fiber substrate 205, the second optical fiber cover 206 and the optical fiber array form an optical fiber subunit. One end of the optical fiber 201 is exposed on the first side end face of the optical fiber subunit. The second optical transmission unit is a lens array, which includes a plurality of lenses 207. The lenses 207 are located on the first side end face of the optical fiber subunit and are optically connected to the optical fiber 201, so that the light beam emitted from the first optical transmission unit 103 passes through the lenses 207 and enters the optical fiber 201 of the optical fiber array.

[0059] In another embodiment of the present invention, the first surface of the second optical fiber substrate has a plurality of grooves (not shown), and the optical fiber is located in the grooves.

[0060] In another embodiment of the invention, such as Figure 5 As shown, the lens 207 includes a reflective inclined surface 2071, and the light beam emitted from the first light transmission unit 103 is output to the optical fiber 201 of the optical fiber array through the reflective inclined surface 2071 of the lens 207.

[0061] In this embodiment of the invention, the optical chip packaging structure further includes a substrate, which includes a PCB substrate, a ceramic substrate, a copper-clad laminate, or other suitable substrates.

[0062] In embodiments of the present invention, such as Figure 7 , Figure 8 As shown, the substrate 10 includes a first surface and a second surface, and the second surface of the substrate has substrate conductive bumps 30 for electrical connection with external devices.

[0063] In this embodiment of the invention, the conductive bump 30 on the substrate is a solder ball.

[0064] In embodiments of the present invention, such as Figures 7-9 As shown, when the optical chip packaging structure includes a substrate 10, a first socket 91 and a heat dissipation cover 80, the first side end face of the substrate 10 has a substrate slot 1001, and the first socket 91 is fixed in the substrate slot on the first side end face of the substrate 10. The first socket 91 is used to position the optical connector module 200. The optical chip 100 is located on the first surface of the substrate 10, and the first surface of the optical chip 100 is disposed opposite to the first surface of the substrate 10. The optical chip receiving groove 101 is disposed opposite to the slot window, and the optical chip 100 is electrically connected to the substrate 10. The optical connector module 200 is positioned in the substrate slot 1001 through the first socket 91. The optical connector module 200 corresponds to the optical chip receiving slot 101 of the optical chip 100, such that the second optical transmission unit 202 of the optical connector module 200 is arranged opposite to the first optical transmission unit 103 in the optical chip receiving slot 101. The heat dissipation cover 80 is applied to the first surface of the substrate 20 and the devices on the first surface.

[0065] In this embodiment of the invention, the optical connector module 200 is inserted into the substrate slot 1001 through the first socket 91, thereby realizing the insertion of the optical connector module 200 into the optical chip packaging structure; and the optical connector module 200 is positioned through the first socket 91, thereby realizing the relative arrangement of the second optical transmission unit 202 and the first optical transmission unit 103 in the optical chip receiving slot 101.

[0066] In this embodiment of the invention, the optical chip 100 is electrically connected to the substrate 10 via solder balls 104, so that the alignment deviation between the optical chip 100 and the substrate 10 is automatically corrected during the reflow soldering process, thereby achieving precise alignment between the optical chip 100 and the substrate 10, and thus achieving precise alignment between the first light transmission unit 103 and the second light transmission unit 202.

[0067] In another embodiment of the invention, such as Figure 10 , Figure 11 As shown, when the optical chip packaging structure includes a substrate 10, a second socket 92, and a heat dissipation cover 80, and the first surface of the substrate 10 has a substrate receiving groove 20, the optical chip 100 is located in the substrate receiving groove 20, the first surface of the optical chip 10 is arranged in the same direction as the first surface of the substrate and the first surface of the optical chip 100 is exposed by the substrate receiving groove 20, the optical connector module 200 is located above the first surface of the substrate, and the second optical transmission unit 202 of the optical connector module 200 is arranged opposite to the first optical transmission unit 103 in the optical chip receiving groove.

[0068] The substrate 10 is prepared by grinding, etching, laser ablation or other suitable processes to obtain the substrate receiving groove 20. The optical chip 100 is placed in the substrate receiving groove 20, so that the optical chip 100 sinks from the surface of the substrate 10, reducing the thickness of the optical chip packaging structure and improving the stability of the optical chip packaging structure.

[0069] When the optical chip is located on the first surface of the substrate or in the substrate receiving groove, the optical chip packaging structure further includes a first optical chip receiving structure. The optical chip is located on the first surface of the first optical chip receiving structure. The projection of the first optical chip receiving structure onto the optical chip does not overlap with the optical chip receiving groove. The first optical chip receiving structure is electrically connected to the substrate, and the first surface of the first optical chip receiving structure is disposed opposite to the first surface of the substrate and the first surface of the optical chip. The optical chip is electrically connected to the substrate through the first optical chip receiving structure. The optical connector module is located above the first surface of the substrate, and the second optical transmission unit of the optical connector module is disposed opposite to the first optical transmission unit in the optical chip receiving groove.

[0070] The first optical chip receiving structure is a combination structure of an electrical chip and an adapter board, or an adapter board or an electrical chip.

[0071] In another embodiment of the present invention, when the first optical chip receiving structure is a combination structure of an electrical chip and an adapter board, an adapter board or an electrical chip, the first optical chip receiving structure is electrically connected to the substrate through solder balls, so that the alignment deviation between the first optical chip receiving structure and the substrate is automatically corrected during the reflow soldering process, and the first optical chip receiving structure and the substrate are precisely aligned, thereby achieving precise alignment between the first optical transmission unit and the second optical transmission unit.

[0072] In another embodiment of the present invention, the optical chip is first disposed on the first surface of the first optical chip receiving structure, and the first surface of the optical chip is disposed opposite to the first surface of the first optical chip receiving structure; then the optical chip and the first optical chip receiving structure are disposed on the first surface of the substrate; wherein, when the substrate includes the substrate receiving groove, the optical chip is located in the substrate receiving groove, the first surface of the optical chip is disposed in the same direction as the first surface of the substrate, the first surface of the first optical chip receiving structure is disposed opposite to the first surface of the substrate and the first surface of the optical chip, the first surface of the first optical chip receiving structure is electrically connected to the substrate, and the optical chip is positioned and fixed by the first optical chip receiving structure.

[0073] In other embodiments, when the optical chip packaging structure includes a substrate, a socket, and a heat sink, the optical chip is located on the first surface of the substrate, the first surface of the optical chip is arranged in the same direction as the first surface of the substrate, the optical connector module is located above the first surface of the substrate, and the second optical transmission unit of the optical connector module is arranged opposite to the first optical transmission unit in the optical chip receiving slot.

[0074] In other embodiments, when the optical chip is located on the first surface of the substrate, an intermediary layer is provided between the first optical chip receiving structure and the substrate, and the electrical connection between the first optical chip receiving structure and the substrate is achieved through the intermediary layer. Specifically, the intermediary layer has a semiconductor packaging structure with one or more wiring layers.

[0075] When the optical chip packaging structure includes a substrate 10, a second socket 92, and a heat dissipation cover 80, and the first optical chip receiving structure is an adapter board, in another embodiment of the present invention, such as Figure 10 , Figure 11 As shown, the first optical chip receiving structure is a second adapter plate 603. The second adapter plate 603 has a first surface and a second surface facing each other. The second adapter plate 603 has an adapter plate window 6031. The optical chip 100 is located on the first surface of the second adapter plate 603. The adapter plate window 6031 is opposite to the optical chip receiving groove 101. The projection of the second adapter plate 603 and the optical chip receiving groove 101 do not overlap. The second adapter plate 603 is electrically connected to the substrate 10. The first surface of the substrate 10 has a substrate receiving groove 20. The optical chip 100 is located in the substrate receiving groove 20. The first surface of the optical chip 100... The first surface of the optical chip 100 is exposed by the substrate receiving groove 20 and is co-oriented with the first surface of the substrate 10. The first surface of the second adapter plate 603 is disposed opposite to the first surface of the substrate 10 and the first surface of the optical chip 100. The optical chip 100 is electrically connected to the substrate 10 through the second adapter plate 603. The optical connection module 200 is located above the second adapter plate 603. The optical connection module 200 is positioned by the socket so that the second optical transmission unit of the optical connector module is disposed opposite to the window 6031 of the adapter plate, thereby realizing that the second optical transmission unit is disposed opposite to the first optical transmission unit in the optical chip receiving groove. The second socket 92 is fixed to the edge of the first surface of the substrate 10, and the second socket is used to position the optical connector module above the first surface of the substrate; The heat dissipation cover 80 is disposed on the first surface of the substrate 20 and the devices on the first surface thereon; The optical connector module 200 is positioned above the first surface of the substrate 10 via the second socket 92. The optical connector module 200 corresponds to the optical chip receiving slot 101 of the optical chip 100, such that the second optical transmission unit 202 of the optical connector module 200 is disposed opposite to the first optical transmission unit 103 in the optical chip receiving slot 101.

[0076] The second socket 92 is used to position the optical connector module 200, which is inserted into the optical chip package structure through the second socket 92.

[0077] In other embodiments, when the optical chip packaging structure includes a substrate, a third socket, and a heat sink, the third socket is fixed to the edge of the first surface of the substrate, and the third socket is used to position the optical connector module above the first surface of the substrate. The optical chip is located on the first surface of the substrate, and the first surface of the optical chip is arranged in the same direction as the first surface of the substrate; The heat dissipation cover is disposed on the first surface of the substrate 20 and the devices on the first surface; The optical connector module is positioned above the first surface of the substrate via a third socket. The optical connector module corresponds to the optical chip receiving slot of the optical chip, such that the second optical transmission unit of the optical connector module is arranged opposite to the first optical transmission unit in the optical chip receiving slot.

[0078] In another embodiment of the invention, such as Figure 4 , Figure 10 As shown, the surface of the first optical fiber substrate has a receiving protrusion 2032, and the second surface of the second adapter plate 603 has a receiving groove 6033. The receiving protrusion 2032 and the receiving groove 6033 cooperate to position the optical connector module 200, and further position and fix the optical connector module 200.

[0079] In another embodiment of the present invention, the optical chip and the substrate are electrically connected via the second adapter plate 603. Specifically, the second adapter plate 603 has a semiconductor packaging structure with one or more wiring layers.

[0080] In another embodiment of the invention, such as Figure 10 , Figure 11 As shown, a second electrical chip unit 605 is provided on the second surface of the second adapter plate 603. The second electrical chip unit 605 is electrically connected to the second adapter plate 603. The combined structure of the second electrical chip unit 605 and the second adapter plate 603 serves as the first optical chip receiving structure.

[0081] The optical chip packaging structure also includes an electrical chip, as described in this embodiment of the invention. Figure 10 , Figure 11 As shown, the optical chip is a fourth electrical chip unit 70, which is located on the first surface of the substrate.

[0082] In this embodiment of the invention, the electrical chip serving as the first optical chip receiving structure is an application-specific integrated circuit (ASIC), an electronic integrated circuit (EIC), or other suitable electrical chip; the electrical chip serving as the optical fiber receiving structure is an ASIC, an EIC, or other suitable electrical chip; and the electrical chip located on the first surface of the substrate is an ASIC, an EIC, or other suitable electrical chip.

[0083] In this embodiment of the invention, the electrical chips in the optical chip packaging structure are ASIC and EIC.

[0084] In this embodiment of the invention, there is an encapsulation material 105 between the electrical chip and the substrate, between the first optical chip receiving structure and the electrical chip, and between the substrate. Specifically, the encapsulation material is a bottom filler.

[0085] In another embodiment of the present invention, the heat dissipation cover 80 is tightly attached to the surface of the first optical chip receiving structure and the electrical chip, and the first optical chip receiving structure and the electrical chip dissipate heat through the heat dissipation cover 80. Specifically, a thermal adhesive 81 is provided between the heat dissipation cover 80 and the first optical chip receiving structure and the electrical chip.

[0086] In another embodiment of the present invention, when the optical chip packaging structure further includes a fourth electrical chip unit 70, the heat dissipation cover 80 is also disposed above the fourth electrical chip unit 70.

[0087] This invention also provides a method for fabricating an optical chip packaging structure, such as... Figure 1 , Figure 12 As shown, it includes: Step S100: Provide an optical chip, the first surface of the optical chip has an optical chip receiving groove, the sidewall of the optical chip receiving groove is provided with an optical port, the optical chip receiving groove is provided with a first optical transmission unit, the first optical transmission unit is correspondingly arranged with the optical port, the first optical transmission unit is used to convert the horizontally output light beam of the optical port into a vertically oriented light beam that is vertically emitted from the first surface of the optical chip; Step S200: Provide an optical connector module and arrange the optical connector module opposite to the first surface of the optical chip. The optical connector module includes an optical fiber array and a second optical transmission unit. The optical fiber array includes a plurality of optical fibers. One end of each optical fiber is optically connected to the second optical transmission unit. The second optical transmission unit is arranged opposite to the first optical transmission unit. The second optical transmission unit is used to convert the beam emitted vertically from the first optical transmission unit into a beam in the horizontal direction and input it into the optical fiber of the optical fiber array.

[0088] Specifically, in step S100, an optical chip 100 is provided. The first surface of the optical chip 100 has an optical chip receiving groove 101. An optical port 102 is provided on the side wall of the optical chip receiving groove 101. A first light transmission unit 103 is provided in the optical chip receiving groove 101. The first light transmission unit 103 is correspondingly arranged with the optical port 102. The first light transmission unit 103 is used to convert the horizontally output light beam from the optical port 102 into a vertically oriented light beam that is vertically emitted from the first surface of the optical chip 100.

[0089] In embodiments of the present invention, such as Figure 1 , Figure 2 As shown, the steps for forming the optical chip 100 include: The optical chip 100 is provided, and an optical chip receiving groove 101 is formed on the first surface of the optical chip 100. An optical port 102 is formed on the sidewall of the optical chip receiving groove 101. The first optical transmission unit 102 is disposed in the optical chip receiving slot 101, and the first optical transmission unit 103 is disposed opposite to the optical port 102 to obtain the optical chip 101.

[0090] In this embodiment of the invention, the first surface of the optical chip 100 has an optical chip receiving groove 101, which is a reserved position for the first optical transmission unit 103. The first optical transmission unit 103 is disposed in the optical chip receiving groove 101, and the center of the first optical transmission unit 103 is opposite to that of the optical port 102, thereby realizing the optical connection between the first optical transmission unit 103 and the optical port 102. The first optical transmission unit 103 is used to convert the horizontally output light beam of the optical port 102 into a vertically oriented light beam that is vertically emitted from the first surface of the optical chip 100. The direction parallel to the first surface of the optical chip 100 is the horizontal direction, and the direction perpendicular to the first surface of the optical chip 100 is the vertical direction.

[0091] In this embodiment of the invention, the optical port 102 is a mode converter, and the first optical transmission unit 103 is opposite to the center of the mode converter. The mode converter converts the small light spot of the optical chip waveguide of the optical chip into a large light spot, thereby significantly reducing coupling loss.

[0092] In this embodiment of the invention, the sidewall of the optical chip receiving slot is provided with a receiving slot step, and the mode converter is disposed on the receiving slot step of the sidewall of the receiving slot.

[0093] In this embodiment of the invention, the first light transmission unit 103 is a curved micromirror, and the curved micromirror is opposite to the center of the optical port 102.

[0094] In this embodiment of the invention, the first surface of the optical chip 100 has an optical chip conductive bump 104, which is used for electrical connection.

[0095] In step S200, an optical connector module 200 is provided and positioned opposite to the first surface of the optical chip 100. The optical connector module 200 includes an optical fiber array and a second optical transmission unit 202. The optical fiber array includes a plurality of optical fibers 201. One end of each optical fiber 201 is optically connected to the second optical transmission unit 202. The second optical transmission unit 202 is positioned opposite to the first optical transmission unit 103. The second optical transmission unit 202 is used to convert the vertically emitted light beam from the first optical transmission unit 103 into a horizontally oriented light beam and input it into the optical fiber 201 of the optical fiber array.

[0096] In embodiments of the present invention, such as Figure 1 , Figure 3 As shown, the steps for forming the optical connector module 200 include: A plurality of optical fibers 202 and a first optical fiber substrate 203 are provided. The first optical fiber substrate 203 has a reflective inclined surface, which serves as the second optical transmission unit 202. A plurality of grooves 2031 are provided on the first surface of the first optical fiber substrate 203. The optical fiber 201 is disposed in the groove on the first surface of the first optical fiber substrate 203 to form an optical fiber array. The reflective inclined surface is disposed opposite to one end of the optical fiber 201, so that one end of the optical fiber 201 is optically connected to the second optical transmission unit 202.

[0097] In embodiments of the present invention, such as Figure 1 As shown, when the optical connector module 200 further includes a first optical fiber cover 204, the steps for forming the optical connector module 200 further include: A first optical fiber cover 204 is provided, the first optical fiber cover 204 having a cover window 2041. The first optical fiber cover 204 is disposed on the first surface of the first optical fiber substrate 203 and the surface of the optical fiber array. The cover window 2041 is located above the second optical transmission unit 202, exposing the second optical transmission unit 202, thereby realizing the relative arrangement of the second optical transmission unit 202 and the first optical transmission unit 103.

[0098] In embodiments of the present invention, such as Figure 5 As shown, when the second optical transmission unit 202 is a lens array, the steps for forming the optical connector module 200 include: A plurality of optical fibers 201 and a second optical fiber substrate 205 are provided, wherein a plurality of grooves (not shown) are provided on the first surface of the second optical fiber substrate 205. The optical fiber 201 is disposed in a groove on the first surface of the second optical fiber substrate 205 to form an optical fiber array; A second optical fiber cover 206 is provided, which is disposed on the first surface of the second optical fiber substrate 205 and the surface of the optical fiber array. The second optical fiber substrate 205, the second optical fiber cover 206 and the optical fiber array constitute an optical fiber subunit. One end of the optical fiber 201 is exposed on the first side end face of the optical fiber subunit. The lens array is provided, which includes a plurality of lenses 207. The lenses 207 are located on the first side end face of the fiber subunit and are optically connected to the fiber 201, so that the light beam emitted from the first light transmission unit 103 passes through the lenses 207 and enters the fiber 201 of the fiber array. The lens array serves as a second light transmission unit.

[0099] In embodiments of the present invention, such as Figure 5 As shown, the lens includes a reflective inclined surface 2071, and the light beam emitted from the first light transmission unit 103 is output to the optical fiber 201 of the optical fiber array through the reflective inclined surface 2071.

[0100] In this embodiment of the invention, the optical chip packaging structure further includes a substrate 10, which includes a PCB substrate, a ceramic substrate, a copper-clad laminate, or other suitable substrates.

[0101] In other embodiments, the substrate may also be a semiconductor packaging structure substrate having one or more chip packaging structures.

[0102] In embodiments of the present invention, such as Figure 7 As shown, the substrate 10 includes a first surface and a second surface. The second surface of the substrate is provided with substrate conductive bumps 30 for electrical connection with external devices.

[0103] In this embodiment of the invention, the conductive bump 30 on the substrate is a solder ball.

[0104] In an embodiment of the present invention, when the optical chip packaging structure further includes a socket, the socket is used to position the optical connector module 200, and the optical connector module 200 is inserted into the optical chip packaging structure through the socket 90.

[0105] In embodiments of the present invention, such as Figures 7-9 As shown, when the optical chip packaging structure includes a substrate 10, a first socket 91, and a heat dissipation cover 80, the fabrication method includes: A substrate 10 is provided, the substrate 10 having a first surface and a first side end face, the first side end face of the substrate having a substrate slot 1001; An optical chip 100 is provided, the optical chip 100 is disposed on the first surface of the substrate 10, the first surface of the optical chip 10 is disposed opposite to the first surface of the substrate, the optical chip receiving groove 101 is disposed opposite to the slot window, and the optical chip 100 is electrically connected to the substrate. A first socket 91 is provided, which is fixed in a substrate slot 1001 on a first side end face of the substrate 10. The first socket 91 is used to position the optical connector module 200. A device that provides a heat dissipation cover 80 and covers the first surface of the substrate 10, the optical chip, and the first surface of the substrate 10; The optical connector module 200 is inserted into and positioned in the substrate slot 1001 through the first socket 91, such that the second optical transmission unit 202 of the optical connector module 200 is positioned opposite to the first optical transmission unit 103 in the optical chip receiving slot 1001.

[0106] In another embodiment of the invention, such as Figure 4 , Figure 10 , Figure 11 As shown, when the optical chip packaging structure includes a substrate 10, a second socket 92, a heat dissipation cover 80, and a second adapter plate 603, the preparation method includes: A substrate 10 is provided, and a first surface of the substrate has a substrate receiving groove 20. An optical chip 100 and a second adapter plate 603 are provided. The second adapter plate 603 has a first surface and a second surface facing each other. The second adapter plate 603 has an adapter plate window 6031. The optical chip 100 is disposed on the first surface of the second adapter plate 603, and the first surface of the second adapter plate 603 is opposite to the first surface of the optical chip 100. The adapter plate window 6031 is opposite to the optical chip receiving groove 101. The projection of the second adapter plate 603 is not parallel to the optical chip receiving groove 101. Having overlapping area; the optical chip 100 is located in the substrate receiving groove 20, the first surface of the optical chip 100 is arranged in the same direction as the first surface of the substrate 10 and the first surface of the optical chip 100 is exposed by the substrate receiving groove 20, the first surface of the second adapter plate 603 is arranged opposite to the first surface of the substrate 10 and the first surface of the optical chip 100, the second adapter plate 603 is electrically connected to the substrate 10, and the optical chip 100 is electrically connected to the substrate 10 through the second adapter plate 603; A second socket 92 is provided, which is fixed to the edge of the first surface of the substrate 10 and is used to position the optical connector module 200 above the first surface of the substrate. A heat dissipation cover 80 is provided, which covers the first surface of the substrate 10, the optical chip, and the device on the first surface of the substrate; The optical connector module 200 is inserted through the second socket 92 and positioned above the first surface of the substrate, such that the optical connector module 200 corresponds to the optical chip receiving slot 101, and the second optical transmission unit 200 is disposed opposite to the first optical transmission unit 103 in the optical chip receiving slot 101.

[0107] In another embodiment of the invention, such as Figure 4 , Figure 10 As shown, the surface of the first optical fiber substrate has a receiving protrusion 2032, and the second surface of the second adapter plate 603 has a receiving groove 6033. The receiving protrusion 2032 and the receiving groove 6033 cooperate to position the optical connector module 200, and further position and fix the optical connector module.

[0108] In another embodiment of the present invention, the second adapter plate 603 is electrically connected to the substrate 10 through solder balls, so that the alignment deviation between the second adapter plate 603 and the substrate 10 is automatically corrected during the reflow soldering process, thereby achieving precise alignment between the second adapter plate 603 and the substrate 10, and thus achieving precise alignment between the first light transmission unit and the second light transmission unit.

[0109] When the optical chip packaging structure further includes an electrical chip, in this embodiment of the invention, such as... Figure 7 , Figure 10 As shown, the optical chip is a fourth electrical chip unit 70, which is disposed on the first surface of the substrate 10.

[0110] In this embodiment of the invention, an encapsulation material 105 is formed between the electrical chip and the substrate 10, between the first optical chip receiving structure and the electrical chip, and between the substrate 10. Specifically, the encapsulation material is a bottom filler.

[0111] In another embodiment of the present invention, when the optical chip packaging structure includes an electrical chip, the heat dissipation cover is also disposed on top of the electrical chip.

[0112] The heat dissipation cover 80 is tightly attached to the surface of the first optical chip receiving structure or the electrical chip, and the first optical chip receiving structure and the electrical chip dissipate heat through the heat dissipation cover 80. Specifically, a thermal adhesive 81 is provided between the heat dissipation cover 80 and the first optical chip receiving structure or the electrical chip.

[0113] In embodiments of the present invention, such as Figure 7 , Figure 8 Taking the optical chip packaging structure as an example, as Figures 13-15 As shown, the specific steps of the optical chip packaging structure fabrication method include: Step S101: Provide a substrate 10, the substrate 10 having a first surface, a first side end face, and the first side end face of the substrate having a substrate slot 1001; Step S102: Provide an optical chip 100, the optical chip 100 is disposed on the first surface of the substrate 10, the first surface of the optical chip 10 is disposed opposite to the first surface of the substrate 10, the optical chip receiving groove 101 is disposed opposite to the slot window, and the optical chip 100 is electrically connected to the substrate 10. Step S103: Provide a fourth electrical chip unit 70 and place the fourth electrical chip unit 70 on the first surface of the substrate; Step S104: Provide a first socket 91, which is fixed in the substrate slot 1001 on the first side end face of the substrate 10. The first socket 91 is used to position the optical connector module 200. Step S105: Provide a heat dissipation cover 80 and cover the first surface of the substrate 10 and the devices on the first surface thereon. Step S106: Form substrate conductive bumps 30 on the second surface of the substrate 10; Step S107: Provide an optical connector module 200, insert the optical connector module 200 into the substrate slot 1001 through the first socket 90, and position it so that the second optical transmission unit 202 of the optical connector module 200 is positioned opposite to the first optical transmission unit 103 in the optical chip receiving slot 101.

[0114] In another embodiment of the invention, such as Figure 10 , Figure 11 Taking the optical chip packaging structure as an example, as Figures 16-22 As shown, the specific steps of the optical chip packaging structure fabrication method include: Step S201: Provide multiple optical chips 100 and a second adapter board body 6032. The second adapter board body 6032 has a first surface and a second surface opposite to each other. The second adapter board body 6032 has multiple adapter board windows 6031. The second surface of the second adapter board body 6032 has a receiving groove 6033. Step S202: Multiple optical chips 100 are disposed on the first surface of the second adapter board body 6032, each adapter board window 6031 is disposed opposite to each optical chip receiving slot 101, and the projection of the second adapter board body 6032 and the optical chip receiving slot 101 do not overlap in area. Step S203: Cut to obtain the optical chip 100 and the second adapter board 603, with the second adapter board body 6032 serving as the second adapter board 603; Step S204: A substrate 10 is provided, the first surface of the substrate 10 having a substrate receiving groove 20. The optical chip 100 is disposed in the substrate receiving groove 20, the first surface of the optical chip 100 is disposed in the same direction as the first surface of the substrate 10 and the first surface of the optical chip 100 is exposed by the substrate receiving groove 20. The second adapter plate 603 is electrically connected to the substrate 10, such that the first surface of the second adapter plate 603 is disposed opposite to the first surface of the substrate 10 and the first surface of the optical chip 100. Step S205: Provide a second electrical chip unit 605 and place the second electrical chip unit 605 on the second surface of the second adapter plate 603; Step S206: Provide a fourth electrical chip unit 70 and dispose of the fourth electrical chip unit 70 on the first surface of the substrate; Step S207: Provide a second socket 92, which is fixed to the edge of the first surface of the substrate. The second socket is used to position the optical connector module above the first surface of the substrate. Step S208: Provide a heat dissipation cover 80, cover the first surface of the substrate 10 and the devices on the first surface with the heat dissipation cover 80, and the heat dissipation cover 80 is tightly attached to the surface of the fourth electrical chip unit 70 and the second electrical chip unit 605. Step S209: Provide an optical connector module 200, insert the optical connector module 200 into the second socket 92 and position it above the first surface of the substrate. The receiving protrusion 2032 of the optical connector module 200 is disposed in the receiving groove 6033 on the second surface of the second adapter plate 603. The receiving protrusion 2032 cooperates with the receiving groove 6033 to position the optical connector module 200, such that the second optical transmission unit 202 of the optical connector module 200 is disposed opposite to the first optical transmission unit 103 in the optical chip receiving slot.

[0115] In this embodiment of the invention, the specific steps of the preparation method further include forming an encapsulation material 105 between the fourth electrical chip unit 70 and the substrate 10, between the first optical chip receiving structure 604 and the second electrical chip unit 605, and between the substrate 10.

[0116] In this embodiment of the invention, the specific steps of the preparation method further include providing thermal adhesive 81 between the heat dissipation cover 80 and the second electrical chip unit 605, and between the heat dissipation cover 80 and the fourth electrical chip unit 70.

[0117] In another embodiment of the present invention, a substrate conductive bump 30 is provided on the second surface of the substrate, the substrate conductive bump 30 being used for electrical connection with an external device.

[0118] Finally, it should be noted that any modification or equivalent substitution of some or all of the technical features based on the device structure and the technical solutions of the embodiments of the present invention, without departing from the corresponding technical solutions of the present invention, shall fall within the patent scope of the device structure and the embodiments of the present invention.

Claims

1. A light chip packaging structure, characterized in that, include: Optical chips and optical connector modules; The first surface of the optical chip has an optical chip receiving groove, the side wall of the optical chip receiving groove is provided with an optical port, and a first optical transmission unit is provided in the optical chip receiving groove. The first optical transmission unit is correspondingly arranged with the optical port. The first optical transmission unit is used to convert the horizontally output light beam of the optical port into a vertically oriented light beam that is vertically emitted from the first surface of the optical chip. The optical connector module includes an optical fiber array and a second optical transmission unit. The optical fiber array includes several optical fibers. One end of each optical fiber is optically connected to the second optical transmission unit. The second optical transmission unit is disposed opposite to the first optical transmission unit. The second optical transmission unit is used to convert the vertically emitted light beam from the first optical transmission unit into a horizontally oriented light beam and input it into the optical fiber of the optical fiber array.

2. The optical chip packaging structure as described in claim 1, characterized in that, The first optical transmission unit is a curved micromirror, and the curved micromirror is opposite to the center of the optical port.

3. The optical chip packaging structure as described in claim 1, characterized in that, The optical port is a speckle converter, and the first optical transmission unit is opposite to the center of the speckle converter.

4. The optical chip packaging structure according to claim 1, characterized in that, The optical chip receiving slot is located at the middle or edge of the first surface of the optical chip.

5. The optical chip packaging structure as described in claim 1, characterized in that, The optical connector module further includes a first optical fiber substrate, which has a reflective bevel, and the reflective bevel serves as the second optical transmission unit. The optical fiber is located on the first surface of the first optical fiber substrate, and the reflective bevel is positioned opposite to one end of the optical fiber, thereby achieving an optical connection between one end of the optical fiber and the second optical transmission unit.

6. The optical chip packaging structure as described in claim 5, characterized in that, The optical connector module further includes a first optical fiber cover, which has a cover window. The first optical fiber cover is located on the first surface of the first optical fiber substrate and the surface of the optical fiber array. The cover window is located above the reflective slope, exposing the reflective slope, thereby realizing the relative arrangement of the second optical transmission unit and the first optical transmission unit.

7. The optical chip packaging structure as described in claim 1, characterized in that, The optical connector module further includes a second optical fiber substrate and a second optical fiber cover. The optical fiber is located on the first surface of the second optical fiber substrate, and the second optical fiber cover is located on the first surface of the second optical fiber substrate and the surface of the optical fiber array. The second optical fiber substrate, the second optical fiber cover, and the optical fiber array constitute an optical fiber subunit. One end of the optical fiber is exposed on the first side end face of the optical fiber subunit. The second optical transmission unit is a lens array, which includes a plurality of lenses. The lenses are located on the first side end face of the optical fiber subunit and are optically connected to the optical fiber, so that the light beam emitted from the first optical transmission unit passes through the lenses and enters the optical fiber of the optical fiber array.

8. A light chip packaging structure as described in claim 5 or 7, characterized in that, The first surface of the first optical fiber substrate and the first surface of the second optical fiber substrate have a plurality of grooves, and the optical fiber is located in the grooves.

9. The optical chip packaging structure as described in claim 1, characterized in that, It also includes a substrate and a first socket. The first side end face of the substrate has a substrate slot, and the first socket is fixed in the substrate slot on the first side end face of the substrate. The first socket is used to position the optical connector module. The optical chip is located on the first surface of the substrate, the first surface of the optical chip is disposed opposite to the first surface of the substrate, the optical chip receiving groove is disposed opposite to the slot window, and the optical chip is electrically connected to the substrate; The optical connector module is positioned in the substrate slot via a first socket. The optical connector module corresponds to the optical chip receiving slot of the optical chip, such that the second optical transmission unit of the optical connector module is arranged opposite to the first optical transmission unit in the optical chip receiving slot.

10. The optical chip packaging structure as described in claim 1, characterized in that, It also includes a substrate and a second socket, the second socket being fixed to the edge of the first surface of the substrate, and the second socket being used to position the optical connector module above the first surface of the substrate; The optical chip is located on the first surface of the substrate, and the first surface of the optical chip is arranged in the same direction as the first surface of the substrate; The optical connector module is positioned above the first surface of the substrate via a second socket. The optical connector module corresponds to the optical chip receiving slot of the optical chip, such that the second optical transmission unit of the optical connector module is disposed opposite to the first optical transmission unit in the optical chip receiving slot.

11. The optical chip packaging structure as described in claim 1, characterized in that, It also includes a substrate and a third socket, wherein the first surface of the substrate has a substrate receiving groove, the third socket is fixed to the edge of the first surface of the substrate, and the third socket is used to position the optical connector module above the first surface of the substrate; The optical chip is located in the substrate receiving groove, and the first surface of the optical chip is arranged in the same direction as the first surface of the substrate and the first surface of the optical chip is exposed by the substrate receiving groove. The optical connector module is positioned above the first surface of the substrate via a third socket. The optical connector module corresponds to the optical chip receiving slot of the optical chip, such that the second optical transmission unit of the optical connector module is arranged opposite to the first optical transmission unit in the optical chip receiving slot.

12. The optical chip packaging structure as described in claim 10 or 11, characterized in that, It also includes a first optical chip receiving structure, wherein the optical chip is located on the first surface of the first optical chip receiving structure, the projection of the first optical chip receiving structure onto the optical chip does not overlap with the optical chip receiving groove, the first optical chip receiving structure is electrically connected to the substrate, and the first surface of the first optical chip receiving structure is disposed opposite to the first surface of the substrate and the first surface of the optical chip, and the optical chip is electrically connected to the substrate through the first optical chip receiving structure.

13. The optical chip packaging structure as described in claim 12, characterized in that, The first optical chip receiving structure is a combination structure of an electrical chip and an adapter board, or an adapter board or an electrical chip.

14. A light chip packaging structure as described in claim 9, 10, or 11, characterized in that, It also includes an electrical chip located on the first surface of the substrate.

15. A light chip packaging structure as described in claim 12 or 14, characterized in that, The electrical chip is one or both of ASIC and EIC.

16. A light chip packaging structure as described in claim 9, 10, or 11, characterized in that, It also includes a heat dissipation cover, which is disposed on the first surface of the substrate, above the optical chip and the optical connector module.

17. A method for fabricating an optical chip packaging structure, characterized in that, include: An optical chip is provided, the first surface of the optical chip has an optical chip receiving groove, the sidewall of the optical chip receiving groove is provided with an optical port, the optical chip receiving groove is provided with a first optical transmission unit, the first optical transmission unit is correspondingly arranged with the optical port, and the first optical transmission unit is used to convert the horizontally output light beam of the optical port into a vertically oriented light beam that is vertically emitted from the first surface of the optical chip. An optical connector module is provided, which is disposed opposite to the first surface of the optical chip. The optical fiber array includes a plurality of optical fibers, one end of which is optically connected to a second optical transmission unit. The second optical transmission unit is disposed opposite to the first optical transmission unit. The second optical transmission unit is used to convert the beam emitted vertically from the first optical transmission unit into a beam in the horizontal direction and input it into the optical fiber of the optical fiber array.

18. The method for fabricating an optical chip packaging structure as described in claim 17, characterized in that, When the optical chip packaging structure further includes a substrate, a first socket, and a heat sink, the fabrication method includes: A substrate is provided, the substrate having a first surface and a substrate slot on a first side end face of the substrate; An optical chip is provided, the optical chip is disposed on a first surface of the substrate, the first surface of the optical chip is disposed opposite to the first surface of the substrate, the optical chip receiving groove is disposed opposite to the slot window, and the optical chip is electrically connected to the substrate; A first socket is provided, which is fixed in a substrate slot on a first side end face of the substrate, and the first socket is used to position the optical connector module; A heat dissipation cover is provided and disposed on the first surface of the substrate, above the optical chip; The optical connector module is inserted into and positioned in the substrate slot through the first socket, such that the second optical transmission unit of the optical connector module is positioned opposite to the first optical transmission unit in the optical chip receiving slot.

19. The method for fabricating an optical chip packaging structure as described in claim 17, characterized in that, When the optical chip packaging structure further includes a substrate, a second socket, and a heat sink, the fabrication method includes: A substrate is provided, the first surface of which has a substrate receiving groove; An optical chip and a first optical chip receiving structure are provided. The optical chip is disposed on a first surface of the first optical chip receiving structure. The first surface of a first electrical chip unit is disposed opposite to the first surface of the first optical chip receiving structure. The projection of the first optical chip receiving structure onto the optical chip does not overlap with the optical chip receiving groove. The optical chip is disposed in the substrate receiving groove. The first surface of the optical chip is disposed in the same direction as the first surface of the substrate and the first surface of the optical chip is exposed by the substrate receiving groove. The first surface of the first optical chip receiving structure is disposed opposite to the first surface of the substrate and the first surface of the optical chip. The first optical chip receiving structure is electrically connected to the substrate. A third socket is provided, which is fixed to the edge of the first surface of the substrate and is used to position the optical connector module above the first surface of the substrate; A heat dissipation cover is provided, which is placed over the first surface of the substrate and above the optical chip. The optical connector module is inserted through the third socket and positioned above the first surface of the substrate. The optical connector module corresponds to the optical chip receiving slot, such that the second optical transmission unit is disposed opposite to the first optical transmission unit in the optical chip receiving slot.

20. A method for fabricating an optical chip packaging structure as described in claim 18 or 19, characterized in that, When the optical chip packaging structure further includes an electrical chip, the electrical chip is disposed on the first surface of the substrate.

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