Intelligent control method and device applied to galvanometer laser

Abstract

The invention relates to the technical field of laser processing and numerical control, and discloses an intelligent control method and device applied to galvanometer laser, and the method comprises the steps: carrying out calibration operation on a target processing object, obtaining a target calibration result corresponding to the target processing object, and determining an error parameter corresponding to the target processing object through a target driver; determining a measurement parameter corresponding to the target processing object, and generating a compensation parameter corresponding to the target processing object based on the measurement parameter and the error parameter; based on the compensation parameters, cooperative control parameters corresponding to the target machining equipment are generated, and the cooperative control parameters are used for controlling a galvanometer laser emitting assembly, a Y-axis driving assembly and a roller motor assembly corresponding to the target machining equipment to achieve cooperative operation. Therefore, the processing efficiency in the galvanometer laser application process can be improved, and the control intelligence and the control efficiency can be improved.

Description

Technical Field

[0001] This invention relates to the fields of laser processing and numerical control technology, and in particular to an intelligent control method and device for galvanometer lasers. Background Technology

[0002] In the field of existing laser processing technology, the demand for engraving cylindrical workpieces is widespread in desktop consumer goods, light industrial production, and other scenarios. Traditional roller-type cylindrical engraving technology is one of the mainstream solutions for achieving this type of processing. This technology typically relies on two sets of rollers to drive the workpiece to rotate through friction, while a galvanometer completes laser imaging and engraving within its single field of view. However, this current method is limited by the structural design of the rollers, which cannot move along the workpiece axis. It can only process within the limited axial length covered by the galvanometer's field of view, making it difficult to meet the integrated engraving needs of long patterns. Furthermore, when processing patterns that exceed the length of a single galvanometer field of view, it is usually necessary to reassemble the workpiece in sections, resulting in low control intelligence.

[0003] Therefore, it is particularly important to provide a new control method for galvanometer lasers to improve processing efficiency and control intelligence. Summary of the Invention

[0004] This invention provides an intelligent control method and device for galvanometer lasers, which can improve the processing efficiency of galvanometer laser applications, as well as enhance the intelligence and efficiency of control.

[0005] The first aspect of this invention discloses an intelligent control method for galvanometer lasers, the method comprising: A calibration operation is performed on the target processing object to obtain the target calibration result corresponding to the target processing object, and the error parameter corresponding to the target processing object is determined by the target driver. Determine the measurement parameters corresponding to the target processing object, and generate compensation parameters corresponding to the target processing object based on the measurement parameters and the error parameters; Based on the compensation parameters, collaborative control parameters corresponding to the target processing equipment are generated. The collaborative control parameters include those for controlling the galvanometer laser emission assembly, Y-axis drive assembly, and roller motor assembly corresponding to the target processing equipment to achieve collaborative operation.

[0006] As an optional implementation, in a first aspect of the present invention, the method further includes: Obtain the taper measurement result of the target processing equipment, and determine whether the taper measurement result meets the preset taper measurement conditions; When it is determined that the taper measurement result does not meet the preset taper measurement conditions, based on the taper measurement result and the preset taper measurement conditions, the real-time correction parameter corresponding to the taper measurement result is determined, and the target processing equipment is controlled to perform a correction control operation that matches the real-time correction parameter.

[0007] As an optional implementation, in a first aspect of the present invention, determining the measurement parameters corresponding to the target processing object includes: A first measurement operation is performed on the target processing object by a preset target encoder to obtain a first measurement result, and a second measurement operation is performed on the target processing object by a preset laser mark to obtain a second measurement result; The measurement error value between the first measurement result and the second measurement result is determined. Based on the measurement error value, a target measurement result is generated, and measurement parameters are determined according to the target measurement result. The measurement parameters corresponding to the target processing object include the diameter parameter corresponding to the target processing object.

[0008] As an optional implementation, in the first aspect of the present invention, after generating compensation parameters corresponding to the target processing object based on the measurement parameters and the error parameters, the method further includes: The surface characteristic information of the target processing object is detected, and based on the surface characteristic information, the processing matching parameters corresponding to the target processing object are determined. The processing matching parameters include one or more of the following: roller drive matching parameters, current limiting matching parameters, and clamping force matching parameters. Based on the processing matching parameters, compensation update parameters corresponding to the compensation parameters are generated, and an update operation is performed on the compensation parameters based on the compensation update parameters.

[0009] As an optional implementation, in a first aspect of the present invention, the method further includes: Determine the adjacent processing areas corresponding to the target processing object, and based on the adjacent processing areas, determine the phase alignment operation corresponding to the adjacent processing areas to obtain the phase alignment result; Based on the phase alignment result, the processing operation parameters corresponding to the target processing equipment are obtained, wherein the processing operation parameters include one or more of the following: movement speed parameters, real-time curvature parameters, and acceleration parameters; Based on all the processing operation parameters, an energy density feedforward model is established, and the operation control parameters corresponding to the target processing are determined based on the energy density feedforward model. The cooperative control parameters are then updated according to the operation control parameters.

[0010] As an optional implementation, in a first aspect of the present invention, the method further includes: Obtain the processing requirement information of the target processing object, and determine the target processing mode corresponding to the target processing object based on the processing requirement information; The step of generating the cooperative control parameters corresponding to the target processing equipment based on the compensation parameters includes: Based on the compensation parameters and the target processing mode, the corresponding collaborative control parameters for the target processing equipment are generated.

[0011] As an optional implementation, in a first aspect of the present invention, the target processing mode includes a first processing mode or a second processing mode; When the target processing mode includes the first processing mode, generating the cooperative control parameters corresponding to the target processing equipment based on the compensation parameters and the target processing mode includes: Based on the compensation parameters and the first processing mode, the first operating parameters corresponding to the Y-axis drive component are determined, and the Y-axis drive component is controlled to perform a circumferential scanning operation that matches the first operating parameters to obtain the scanning result. Based on the scanning result, the cooperative control parameters corresponding to the target processing equipment are generated. When the target processing mode includes the second processing mode, generating the cooperative control parameters corresponding to the target processing equipment based on the compensation parameters and the target processing mode includes: Based on the compensation parameters and the second processing mode, the second operating parameters corresponding to the Y-axis drive assembly and the third operating parameters of the roller motor assembly are determined. Based on the second operating parameters and the third operating parameters, the helical pitch parameters corresponding to the target processing object are determined. Based on the helical pitch parameters, the cooperative control parameters corresponding to the target processing equipment are generated.

[0012] A second aspect of this invention discloses an intelligent control device for galvanometer lasers, the device comprising: The calibration module is used to perform calibration operations on the target processing object and obtain the target calibration result corresponding to the target processing object; The determination module is used to determine the error parameters corresponding to the target object being processed via the target driver; and to determine the measurement parameters corresponding to the target object being processed. The generation module is used to generate compensation parameters corresponding to the target processing object based on the measurement parameters and the error parameters; and to generate collaborative control parameters corresponding to the target processing equipment based on the compensation parameters, wherein the collaborative control parameters include parameters for controlling the galvanometer laser emitting component, Y-axis drive component, and roller motor component corresponding to the target processing equipment to achieve collaborative operation.

[0013] As an optional implementation, in a second aspect of the invention, the apparatus further includes: The acquisition module is used to acquire the taper measurement results of the target processing equipment; The judgment module is used to determine whether the taper measurement result meets the preset taper measurement conditions; The determining module is further configured to determine the real-time correction parameters corresponding to the taper measurement results based on the taper measurement results and the preset taper measurement conditions; The control module is used to control the target processing equipment to perform correction control operations that match the real-time correction parameters.

[0014] As an optional implementation, in a second aspect of the present invention, the specific method by which the determining module determines the measurement parameters corresponding to the target processing object includes: A first measurement operation is performed on the target processing object by a preset target encoder to obtain a first measurement result, and a second measurement operation is performed on the target processing object by a preset laser mark to obtain a second measurement result; The measurement error value between the first measurement result and the second measurement result is determined. Based on the measurement error value, a target measurement result is generated, and measurement parameters are determined according to the target measurement result. The measurement parameters corresponding to the target processing object include the diameter parameter corresponding to the target processing object.

[0015] As an optional implementation, in a second aspect of the invention, the apparatus further includes: The detection module is used to detect the surface characteristic information of the target processing object after the generation module generates the compensation parameters corresponding to the target processing object based on the measurement parameters and the error parameters. The determining module is further configured to use the surface characteristic information to determine the processing matching parameters corresponding to the target processing object, wherein the processing matching parameters include one or more of the following: roller drive matching parameters, current limiting matching parameters, and clamping force matching parameters; The generation module is further configured to generate compensation update parameters corresponding to the compensation parameters based on the processing matching parameters, and perform update operations on the compensation parameters based on the compensation update parameters.

[0016] As an optional implementation, in a second aspect of the present invention, the determining module is further configured to determine adjacent processing areas corresponding to the target processing object, and based on the adjacent processing areas, determine the phase alignment operation corresponding to the adjacent processing areas to obtain a phase alignment result; The acquisition module is further configured to acquire the processing operation parameters corresponding to the target processing equipment based on the phase alignment result, wherein the processing operation parameters include one or more of the following: movement speed parameters, real-time curvature parameters, and acceleration parameters; The determining module is further configured to establish an energy density feedforward model based on all the processing operation parameters, determine the operation control parameters corresponding to the target processing based on the energy density feedforward model, and update the cooperative control parameters according to the operation control parameters.

[0017] As an optional implementation, in a second aspect of the present invention, the acquisition module is further configured to acquire processing requirement information of the target processing object; The determining module is further configured to determine the target processing mode corresponding to the target processing object based on the processing requirement information; The specific method by which the generation module generates the collaborative control parameters corresponding to the target processing equipment based on the compensation parameters includes: Based on the compensation parameters and the target processing mode, the corresponding collaborative control parameters for the target processing equipment are generated.

[0018] As an optional implementation, in a second aspect of the present invention, the target processing mode includes a first processing mode or a second processing mode; When the target processing mode includes the first processing mode, the specific method by which the generation module generates the cooperative control parameters corresponding to the target processing equipment based on the compensation parameters and the target processing mode includes: Based on the compensation parameters and the first processing mode, the first operating parameters corresponding to the Y-axis drive component are determined, and the Y-axis drive component is controlled to perform a circumferential scanning operation that matches the first operating parameters to obtain the scanning result. Based on the scanning result, the cooperative control parameters corresponding to the target processing equipment are generated. When the target processing mode includes the second processing mode, the specific method by which the generation module generates the cooperative control parameters corresponding to the target processing equipment based on the compensation parameters and the target processing mode includes: Based on the compensation parameters and the second processing mode, the second operating parameters corresponding to the Y-axis drive assembly and the third operating parameters of the roller motor assembly are determined. Based on the second operating parameters and the third operating parameters, the helical pitch parameters corresponding to the target processing object are determined. Based on the helical pitch parameters, the cooperative control parameters corresponding to the target processing equipment are generated.

[0019] A third aspect of the present invention discloses another intelligent control device for galvanometer lasers, the device comprising: Memory containing executable program code; A processor coupled to the memory; The processor calls the executable program code stored in the memory to execute some or all of the steps in the intelligent control method for galvanometer lasers according to any of the first aspects of the present invention.

[0020] The fourth aspect of the present invention discloses a computer storage medium storing computer instructions, which, when invoked, are used to execute some or all of the steps in the intelligent control method for galvanometer lasers described in any of the first aspects of the present invention.

[0021] Compared with the prior art, the present invention has the following beneficial effects: In this embodiment of the invention, a calibration operation is performed on the target processing object to obtain the target calibration result corresponding to the target processing object, and the error parameters corresponding to the target processing object are determined by the target driver; the measurement parameters corresponding to the target processing object are determined, and the compensation parameters corresponding to the target processing object are generated based on the measurement parameters and the error parameters; based on the compensation parameters, the cooperative control parameters corresponding to the target processing equipment are generated, wherein the cooperative control parameters include those for controlling the galvanometer laser emitting component, the Y-axis drive component, and the roller motor component corresponding to the target processing equipment to achieve cooperative operation. Therefore, implementing this invention can improve the processing efficiency in galvanometer laser applications, and also improve the intelligence and efficiency of control. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a flowchart illustrating an intelligent control method for galvanometer lasers disclosed in an embodiment of the present invention. Figure 2 This is a flowchart illustrating another intelligent control method for galvanometer lasers disclosed in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of an intelligent control device for galvanometer lasers disclosed in an embodiment of the present invention; Figure 4 This is a schematic diagram of another intelligent control device for galvanometer lasers disclosed in an embodiment of the present invention; Figure 5This is a schematic diagram of the structure of another intelligent control device for galvanometer lasers disclosed in an embodiment of the present invention. Detailed Implementation

[0024] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, apparatus, product, or end that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or ends.

[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0027] This invention discloses intelligent control applied to galvanometer lasers, which can improve processing efficiency during galvanometer laser applications, as well as enhance the intelligence and efficiency of control. These will be described in detail below. Example

[0028] Please see Figure 1 , Figure 1 This is a flowchart illustrating an intelligent control method for galvanometer lasers disclosed in an embodiment of the present invention. Figure 1 The described intelligent control method for galvanometer lasers can be applied to intelligent control devices for galvanometer lasers, or to galvanometer laser equipment. The intelligent control device for galvanometer lasers can be integrated into a cloud server or a local server; this embodiment of the invention is not limited to this. Figure 1 As shown, the intelligent control method applied to galvanometer lasers may include the following operations.

[0029] 101. Perform calibration operation on the target processing object to obtain the target calibration result corresponding to the target processing object, and determine the error parameter corresponding to the target processing object through the target driver.

[0030] In this embodiment of the invention, the target driver includes a Y-axis driver.

[0031] In this embodiment of the invention, optionally, the target processing object may include the object to be processed, wherein the target processing object may include one or more of cylindrical workpieces and conical workpieces.

[0032] In this embodiment of the invention, optionally, the above-mentioned calibration operation on the target processing object to obtain the target calibration result corresponding to the target processing object may include: A dot matrix calibration operation is performed on the local field of view of the target object to fit radial / tangential distortion or LUT to obtain the target calibration result corresponding to the target object. Radial distortion can include the positional deviation of the laser beam along the "radial direction" (radiation direction from the center to the edge) with the center of the field of view as the origin when the galvanometer laser scans. Tangential distortion can include the deviation of the laser landing point in the direction perpendicular to the radial direction (tangential). LUT is a "pre-stored error correction mapping table", which essentially stores the "theoretical control parameters of the galvanometer" and the "corrected actual control parameters" in a one-to-one correspondence. There is no need to calculate complex distortion formulas in real time. The table can be directly looked up during engraving to achieve fast and accurate correction. In particular, a large amount of actual deviation data is collected by "calibration dot matrix" to directly establish the mapping of "theoretical coordinates → actual corrected coordinates", which can cover all complex distortion cases and has a fast table lookup speed.

[0033] In this embodiment of the invention, optionally, the above-mentioned determination of the error parameters corresponding to the target processing object by the target driver may include: calculating the axial nonlinear error by aligning the measurement points of different Y poses with the target driver to obtain the error parameters.

[0034] In this embodiment of the invention, the error parameters may further optionally include galvanometer optical error parameters, which describe the deviation between the galvanometer laser scanning path and the ideal path, and are derived from the single-field calibration results; they may also include motion system error parameters, including mechanical and synchronization errors describing the Y-axis linear motion and roller rotation motion, and are derived from the axial full-width calibration results; and workpiece geometric error parameters, which describe the influence of the geometric shape deviation of the target object on the processing, and are derived in reverse from the calibration results.

[0035] 102. Determine the measurement parameters corresponding to the target processing object, and generate the compensation parameters corresponding to the target processing object based on the measurement parameters and error parameters.

[0036] In this embodiment of the invention, optionally, the measurement parameters corresponding to the target processing object may include the measured diameter parameter corresponding to the target processing object.

[0037] In this embodiment of the invention, optionally, the above-mentioned generation of compensation parameters corresponding to the target processing object based on measurement parameters and error parameters may include: Based on measurement and error parameters, target adjustment parameters are determined, including roller angular velocity parameters and pulse width modulation (PWM) parameters. Compensation parameters corresponding to the target machining object are then generated based on these parameters. The roller angular velocity parameter includes the rotational speed of the roller motor, and the PWM duty cycle is a core parameter controlling laser output power. A higher PWM duty cycle results in a longer effective laser output time per unit time, higher laser power, and thus higher energy density.

[0038] 103. Based on the compensation parameters, generate the corresponding collaborative control parameters for the target processing equipment.

[0039] In this embodiment of the invention, the collaborative control parameters include those for controlling the galvanometer laser emitting assembly, Y-axis drive assembly, and roller motor assembly corresponding to the target processing equipment to achieve collaborative operation.

[0040] In this embodiment of the invention, optionally, the cooperative control parameters may include the corrected galvanometer scanning coordinate command corresponding to the galvanometer laser emitting component; the corrected Y-axis position command, speed command, and acceleration command corresponding to the Y-axis drive component; and the corrected roller angular velocity command, roller angle positioning command, and roller torque limiting command for the roller motor component.

[0041] In this embodiment of the invention, optionally, the collaborative control parameters corresponding to the target processing equipment may include a unified time base synchronization signal, a hardware trigger signal, and an abnormal collaborative protection command; wherein, the unified time base synchronization signal may include a frequency ≥10kHz to ensure that the triggering timing of the three types of component commands is consistent, the hardware trigger signal may include triggering the galvanometer scanning switch when the Y-axis reaches a specified position, or triggering the laser to start when the roller angular velocity is stable; the abnormal collaborative protection command may include triggering the three components to stop or decelerate synchronously when the deviation of a certain component parameter exceeds a threshold.

[0042] It is evident that implementation Figure 1The described intelligent control method for galvanometer lasers can perform calibration operations on the target processing object to obtain the target calibration result, determine the error parameters corresponding to the target processing object through the target driver, determine the measurement parameters of the target processing object, and generate compensation parameters and then collaborative control parameters based on the measurement parameters and error parameters. It can achieve continuous axial pattern processing with a length greater than the field of view through collaborative control. It can determine the error through calibration and then correct it specifically through compensation parameters, which is beneficial to improving the processing accuracy and precision. Furthermore, based on the axial full-width error parameters obtained from calibration and real-time compensation, the collaborative accuracy of Y-axis movement, roller rotation and galvanometer scanning is greatly improved. It can also improve processing efficiency and processing intelligence through collaborative operation, thereby improving the processing efficiency in the application of galvanometer lasers and the intelligence and control efficiency of the target processing equipment. Example

[0043] Please see Figure 2 , Figure 2 This is a schematic flowchart illustrating another intelligent control method for galvanometer lasers disclosed in an embodiment of the present invention. Figure 2 The described intelligent control method for galvanometer lasers can be applied to intelligent control devices for galvanometer lasers, or to galvanometer laser equipment. The intelligent control device for galvanometer lasers can be integrated into a cloud server or a local server; this embodiment of the invention is not limited to this. Figure 2 As shown, the intelligent control method applied to galvanometer lasers may include the following operations: 201. Perform calibration operation on the target processing object to obtain the target calibration result corresponding to the target processing object, and determine the error parameter corresponding to the target processing object through the target driver.

[0044] 202. Determine the measurement parameters corresponding to the target processing object, and generate the compensation parameters corresponding to the target processing object based on the measurement parameters and error parameters.

[0045] 203. Based on the compensation parameters, generate the corresponding collaborative control parameters for the target processing equipment.

[0046] In this embodiment of the invention, for a detailed description of steps 201-203, please refer to the other descriptions of steps 101-103 in Embodiment 1. This embodiment of the invention will not repeat them.

[0047] 204. Obtain the taper measurement results of the target processing equipment and determine whether the taper measurement results meet the preset taper measurement conditions.

[0048] In this embodiment of the invention, optionally, the taper measurement result of the target processing equipment can be obtained by the collaborative acquisition of a camera component and an encoder, and the taper measurement result output by performing full-axial taper detection on the target processing object.

[0049] In this embodiment of the invention, optionally, the above-mentioned determination of whether the taper measurement result meets the preset taper measurement conditions may include: Determine the taper value corresponding to the taper measurement result, and determine whether the taper value is within the taper range corresponding to the preset taper measurement conditions; When it is determined that the taper value is within the taper range corresponding to the preset taper measurement conditions, the taper measurement result is determined to meet the preset taper measurement conditions; when it is determined that the taper value is not within the taper range corresponding to the preset taper measurement conditions, the taper measurement result is determined to not meet the preset taper measurement conditions.

[0050] 205. When it is determined that the taper measurement result does not meet the preset taper measurement conditions, based on the taper measurement result and the preset taper measurement conditions, the real-time correction parameter corresponding to the taper measurement result is determined, and the target processing equipment is controlled to perform a correction control operation that matches the real-time correction parameter.

[0051] In this embodiment of the invention, optionally, the process can be terminated when it is determined that the taper measurement result meets the preset taper measurement conditions.

[0052] In this embodiment of the invention, optionally, the determination of the real-time correction parameters corresponding to the taper measurement results based on the taper measurement results and preset taper measurement conditions may include: Based on the taper measurement results and preset taper measurement conditions, the taper difference value between the taper measurement results and the preset taper measurement conditions is determined. Based on the taper difference value, the real-time correction parameters corresponding to the taper measurement results are determined. Among them, the real-time correction parameters may include roller angular velocity correction parameters, galvanometer scanning range correction parameters, laser energy correction parameters, and Y-axis velocity collaborative correction parameters.

[0053] In this embodiment of the invention, optionally, the roller angular velocity correction parameter is used to adjust the roller angular velocity ω based on the actual radius of the workpiece, ensuring a constant linear velocity on the workpiece surface and avoiding uneven laser dwell time due to radius changes; the galvanometer scanning range correction parameter is used to adjust the laser scanning boundary of the galvanometer to adapt to the actual radius at different axial positions, avoiding scanning beyond the workpiece surface or not covering the processing area; the laser energy correction parameter is used to compensate for energy density deviations caused by radius changes, ensuring consistent processing effects across the entire surface; the Y-axis speed coordination correction parameter is used to match the roller angular velocity and the galvanometer scanning speed, ensuring uniform pitch in the helical processing mode; furthermore, based on the above correction parameters, slight taper is corrected in real time.

[0054] In this embodiment of the invention, optionally, for example, a measurement of the target processing object is first triggered. As can be seen, implementing this optional embodiment can obtain the taper measurement results of the target processing equipment and determine whether the taper measurement conditions are met. If not, it determines the real-time correction parameters based on the taper measurement results and taper measurement conditions and executes the corresponding correction operation. It can adapt the design pattern to the actual taper characteristics of the workpiece by real-time correction of the mapping parameters and galvanometer scanning range, ensuring that the pattern proportion and dimensional accuracy are consistent with the design throughout the entire axis, improving the accuracy and reliability of processing. Furthermore, the real-time correction operation can ensure that the laser energy density of the entire surface of the workpiece is constant, maintaining a high degree of consistency in engraving depth, color, and texture, avoiding local quality defects, and improving processing quality. It can also avoid energy adaptation problems caused by material thermal conductivity, melting point differences, and taper based on real-time correction parameters, achieving high-quality processing. Moreover, it can be automatically completed through the collaboration of the camera and encoder, with correction parameters calculated in real time by the algorithm, eliminating the need for operators to manually measure the taper and adjust equipment parameters, thus improving processing efficiency and intelligence. This can further improve the processing efficiency in the application of galvanometer lasers and enhance the intelligence and control efficiency of the target processing equipment.

[0055] In an optional embodiment, determining the measurement parameters corresponding to the target processing object includes: A first measurement operation is performed on the target processing object by a preset target encoder to obtain a first measurement result, and a second measurement operation is performed on the target processing object by a preset laser mark to obtain a second measurement result; The measurement error value between the first measurement result and the second measurement result is determined. Based on the measurement error value, a target measurement result is generated, and the measurement parameters are determined according to the target measurement result. Among them, the measurement parameters corresponding to the target processing object include the diameter parameter corresponding to the target processing object.

[0056] In this optional embodiment, the preset target encoder may optionally include one of an incremental photoelectric encoder or an absolute encoder; wherein, the preset target encoder is used to indirectly deduce the diameter-related data of the workpiece through the rotational motion of the roller. For example, the preset target encoder determines the diameter of the target object to be processed by integrating one rotation; wherein, it may be the cumulative number of pulses (N_roll, unit: pulse) for one full rotation of the roller or the roller rotation period (T_roll, unit: s, i.e., the time for one rotation).

[0057] In this optional embodiment, the preset laser marking may include the operation of marking feature points with known spacing on the workpiece surface using a galvanometer laser emitting assembly of the target processing equipment. This can be achieved by controlling a roller to drive the workpiece to rotate at a uniform speed, while simultaneously controlling the galvanometer laser to mark points on the workpiece's circumference at fixed time intervals (Δt, e.g., 10ms), marking a total of M points. The diameter of the target object is then calculated based on the marking pattern. For example, the actual position of the laser marking points can be visually acquired (using a coaxial / range-axis camera), the actual arc length of adjacent marking points can be calculated, and the measurement process for the actual diameter of the workpiece can be derived.

[0058] In this optional embodiment, the first measurement result may include the result of diameter measurement of the target object being processed by a preset target encoder; the second measurement result may include the result of diameter measurement of the target object being processed by a preset laser mark.

[0059] In this optional embodiment, determining the measurement error value between the first measurement result and the second measurement result may include one of the absolute error value and the relative error value between the first measurement result and the second measurement result.

[0060] In this optional embodiment, the process of generating a target measurement result based on the measurement error value and determining measurement parameters based on the target measurement result may include: Based on the measurement error value, a weighted fusion operation is performed on the first measurement result and the second measurement result to obtain the measurement fusion result. The weighted fusion operation corresponds to the weights being set based on a preset measurement confidence flag and a preset measurement accuracy flag. The measurement fusion result includes the weighted calculation result between the first measurement result and the second measurement result. Based on the measurement fusion results, target measurement results are generated, and the actual diameter parameters of the workpiece are determined according to the target measurement results. Then, the measurement parameters are determined according to the actual diameter parameters of the workpiece.

[0061] As can be seen, implementing this optional embodiment can perform a first measurement operation on the target processing object using a preset target encoder to obtain a first measurement result, and perform a second measurement operation on the target processing object using a preset laser mark to obtain a second measurement result. The measurement error value between the first and second measurement results is determined to generate the target measurement result and thus determine the measurement parameters. This dual measurement method, using both encoders and laser marks, improves the accuracy and reliability of measuring the target processing object. It also helps improve the measurement accuracy for diameter measurement. Compared to traditional single encoder or single vision measurement, dual measurement further improves measurement accuracy and reliability. Encoder measurement is unaffected by environmental factors such as lighting and workpiece surface reflection, while laser marking is unaffected by slippage. The complementary advantages of both methods improve measurement accuracy and precision, thereby enhancing the accuracy and reliability of subsequent determination of corresponding compensation parameters and generation of corresponding collaborative control parameters for the target processing equipment based on the measurement results. This, in turn, improves the processing efficiency in galvanometer laser applications and enhances the intelligence and control efficiency of the target processing equipment.

[0062] In another optional embodiment, after generating compensation parameters corresponding to the target processing object based on measurement parameters and error parameters, the method further includes: The surface characteristic information of the target object to be processed is detected, and the processing matching parameters corresponding to the target object to be processed are determined based on the surface characteristic information. The processing matching parameters include one or more of the following: roller drive matching parameters, current limiting matching parameters, and clamping force matching parameters. Based on the processing matching parameters, compensation update parameters corresponding to the compensation parameters are generated, and the compensation parameters are updated based on the compensation update parameters.

[0063] In this optional embodiment, the surface characteristic information of the target processing object can be obtained through a detection module of the target processing equipment. This detection module may include one or more of a vision detection module, a pressure detection module, and a tactile detection module. Furthermore, the surface characteristic information of the target processing object serves as a comprehensive data set reflecting the physical and chemical properties of the target processing object's surface. Its core purpose is to determine the interaction characteristics between the workpiece surface and the roller and laser, providing a basis for processing matching parameters. The surface characteristic information of the target processing object may include one or more of the following: surface hardness information, surface roughness information, and surface friction coefficient information.

[0064] In this optional embodiment, the above-mentioned determination of the processing matching parameters corresponding to the target processing object based on surface characteristic information may include: Based on surface characteristic information, determine the material processing requirements parameters of the target processing object. The material processing requirements parameters include one or more of the following: roller requirements parameters, torque requirements parameters, and clamping force requirements parameters. Based on the material processing requirements parameters of the target processing object, determine the processing matching parameters corresponding to the target processing object; Among them, the roller drive matching parameters are used to adapt the roller motion parameters to the surface friction characteristics and hardness, ensuring a balance between transmission stability and surface protection; the current limiting matching parameters are used to adapt the motor current threshold parameters to the surface hardness and material characteristics, indirectly controlling the roller torque by limiting the current to avoid overload damage; the clamping force matching parameters are used to adapt the roller clamping pressure parameters to the surface hardness, roughness and material, balancing clamping stability and anti-deformation / anti-scratch requirements. Furthermore, the roller drive matching parameters may include roller angle parameters; the current limiting matching parameters may include maximum current threshold parameters; and the clamping force requirement parameters may include one or more of the following: reference clamping force parameters, dynamic clamping force adjustment parameters, maximum clamping force parameters, and minimum clamping force parameters. Furthermore, this also includes roller surface material replacement. Roller surface material replacement refers to the operation of replacing the roller surface contact layer that directly contacts the workpiece in the roller mechanism with a suitable material based on the surface characteristics of the target workpiece (such as hardness, roughness, coefficient of friction, whether it is easy to scratch / adhere, etc.). The core is to change the contact interface material between the roller and the workpiece, together with current limiting and adjustable clamping force, to form a triple adaptation system for roller transmission.

[0065] In this optional embodiment, the above-mentioned generation of compensation update parameters corresponding to the compensation parameters based on the processing matching parameters, and the execution of update operations on the compensation parameters based on the compensation update parameters, may include: Based on the processing matching parameters, compensation requirement parameters are determined, and corresponding compensation update parameters are determined for each compensation requirement parameter. The compensation update parameters include one or more of the following: roller motion compensation update parameters, galvanometer scanning compensation update parameters, and laser energy compensation update parameters. The roller motion compensation update parameters may include angular velocity compensation update parameters, the galvanometer scanning compensation update parameters may include scanning speed compensation update parameters and scanning range compensation update parameters, and the laser energy compensation update parameters may include PWM duty cycle compensation update parameters.

[0066] As can be seen, implementing this optional embodiment can detect the surface characteristic information of the target processing object and determine the processing matching parameters of the target processing object. Based on the processing matching parameters, compensation update parameters corresponding to the compensation parameters are generated, and update operations are performed on the compensation parameters based on the compensation update parameters. The processing matching parameters can be dynamically adjusted through current limiting, clamping force adjustment, and roller surface material replacement. By detecting information such as surface hardness, material type, and special properties, the integrity and safety of processing the target processing object can be ensured. Furthermore, by increasing the clamping force matching parameters and optimizing the roller drive smoothness coefficient, the service life of the workpiece and the equipment roller can be extended. Targeted adjustment of clamping force and roller drive parameters can improve the accuracy and reliability of workpiece processing. In addition, combined with compensation parameter updates, the synchronization accuracy of Y-axis movement and roller rotation can be further ensured. The current limiting matching parameters are dynamically adjusted based on surface hardness and material characteristics. A smaller maximum current threshold is set for soft workpieces to limit the roller output torque and avoid workpiece torsional deformation due to excessive torque, which is beneficial to improving processing accuracy and processing safety. In turn, it can improve the processing efficiency in the galvanometer laser application process and also improve the intelligence and control efficiency of the target processing equipment.

[0067] In yet another optional embodiment, the method further includes: Determine the adjacent processing areas corresponding to the target processing object, and based on the adjacent processing areas, determine the phase alignment operation corresponding to the adjacent processing areas to obtain the phase alignment result; Based on the phase alignment results, the processing operation parameters corresponding to the target processing equipment are obtained. The processing operation parameters include one or more of the following: movement speed parameters, real-time curvature parameters, and acceleration parameters. Based on all processing operation parameters, an energy density feedforward model is established, and the operation control parameters corresponding to the target processing equipment are determined based on the energy density feedforward model. The collaborative control parameters are then updated according to the operation control parameters.

[0068] In this optional embodiment, the adjacent processing area corresponding to the target processing object may optionally include the area corresponding to the 1–3 mm tile / spiral junction area of ​​the target processing object.

[0069] In this optional embodiment, the above-mentioned phase alignment operation based on adjacent processing areas to obtain the phase alignment result may include: Based on adjacent processing areas, the alignment method of the target processing object is determined, wherein the alignment method includes one of the following: directional phase consistent alignment and half-step misalignment alignment. Based on the alignment method of the target processing object, the phase alignment operation corresponding to adjacent processing areas is determined to obtain the phase alignment result. Here, directional phase-consistent alignment can include controlling the fill line direction of the subsequent area to be completely consistent with the previous area, and the distance between the first fill line of the subsequent area and the last fill line of the previous area is equal to the preset processing line spacing; half-step misalignment alignment allows the fill line direction of the subsequent area to be consistent with the previous area, but the overall direction is offset by half a line spacing along the processing direction. Furthermore, the phase alignment result can include the final parameters of the fill lines of the subsequent area output after the phase alignment operation is executed.

[0070] In this optional embodiment, the processing operation parameters corresponding to the target processing equipment may optionally include one or more of the following: movement speed parameters, real-time curvature parameters, and acceleration parameters; wherein, the movement speed parameters may include reflecting the real-time movement state of each moving component of the equipment, which directly affects the dwell time of the laser on the workpiece surface; the real-time curvature parameters may include reflecting the real-time geometry of the target processing object (especially the conical workpiece), which affects the distribution effect of laser energy; the acceleration parameters may include reflecting the rate of change of speed of the moving components, avoiding energy density fluctuations caused by sudden speed changes.

[0071] In this optional embodiment, the above-mentioned process of establishing an energy density feedforward model based on all processing operation parameters, determining the operation control parameters corresponding to the target processing equipment based on the energy density feedforward model, and updating the cooperative control parameters according to the operation control parameters may include: Based on all processing operation parameters and phase alignment results, an energy density feedforward model is constructed. The energy density feedforward model is used to ensure uniform energy density through feedforward control and avoid sudden energy changes at the junction. All processing operation parameters are input into the energy density feedforward model to obtain the model output results. Based on the model output results, the corresponding operation control parameters of the target processing equipment are determined, and the collaborative control parameters are updated according to the operation control parameters. The operation control parameters include one or more of the following: laser energy control parameters, motion collaborative control parameters, and phase collaborative correction parameters. The laser energy control parameters may include the target PWM duty cycle, the power gradient curve of the overlap area, and the energy compensation coefficient. The motion collaborative control parameters may include the target Y-axis velocity, the target angular velocity of the roller, and the galvanometer scanning speed parameters. The phase collaborative correction parameters may include the fine adjustment amount of the fill line phase based on the energy parameters to avoid texture shift caused by energy changes.

[0072] As can be seen, implementing this optional embodiment can determine the adjacent processing areas corresponding to the target processing object and determine the corresponding phase alignment operation to obtain the phase alignment result. It can also acquire processing operation parameters and establish an energy density feedforward model to determine the operation control parameters corresponding to the target processing equipment and update the collaborative control parameters. By selectively choosing the corresponding alignment method, it can ensure seamless connection between the subsequent area filling line and the previous area, which is beneficial to improving processing accuracy and precision. Furthermore, by calculating energy parameters through the model's comprehensive multi-dimensional data, it can both offset the influence of motion state changes on energy and adapt to differences in workpiece geometry, solving the energy imbalance problem caused by traditional single parameter adjustment. This is beneficial to improving processing uniformity and processing intelligence. Real-time acquisition of processing operation parameters and dynamic updating of collaborative control parameters are beneficial to improving processing intelligence and accuracy, thereby improving processing efficiency in galvanometer laser applications and enhancing the intelligence and control efficiency of controlling the target processing equipment.

[0073] In yet another optional embodiment, the method further includes: Obtain the processing requirements information of the target processing object, and determine the target processing mode corresponding to the target processing object based on the processing requirements information; Among them, based on the compensation parameters, the corresponding collaborative control parameters for the target processing equipment are generated, including: Based on the compensation parameters and the target processing mode, the corresponding collaborative control parameters for the target processing equipment are generated.

[0074] In this optional embodiment, the processing requirements information of the target processing object may include comprehensive requirements information that reflects the processing needs of the target processing object, either input by the user through a human-computer interaction interface or retrieved by the system from a preset process library.

[0075] In this optional embodiment, the target processing mode may include a first processing mode or a second processing mode, wherein the first processing mode includes a "rotation + stepping" mode for tile division, and the second processing mode includes a spiral follow-up processing mode.

[0076] In this optional embodiment, the cooperative control parameters corresponding to the target processing equipment may include galvanometer-related compensation parameters: galvanometer position compensation (ΔX_mirror, ΔY_mirror, correcting radial / tangential distortion), scanning range compensation parameters (adapting to workpiece diameter / taper); motion-related compensation parameters: Y-axis position / velocity compensation (ΔY_pos, Δv_y, correcting axial nonlinearity error), roller angular velocity / angle compensation (Δω, Δθ, correcting rotation error and slippage deviation); energy-related compensation parameters: laser power compensation coefficient (K_p_energy, correcting uneven energy density), overlapping area power gradient parameters (adapting to splicing requirements); and cooperative compensation parameters: component synchronization error compensation coefficient (K_sync, ensuring the cooperative accuracy of the galvanometer, Y-axis, and roller).

[0077] In this optional embodiment, the collaborative control parameters may further include a "final set of control parameters that can be directly executed by each component of the equipment" generated by fusing the core parameters based on the compensation parameters and the target processing mode. The core is to enable error cancellation and mode characteristic adaptation to form a synergy, ensuring that processing requirements are met.

[0078] As can be seen, implementing this optional embodiment can obtain the processing requirements information of the target processing object and determine the corresponding target processing mode. Based on the compensation parameters and the target processing mode, it generates the corresponding collaborative control parameters for the target processing equipment. It can determine the corresponding mode based on different processing requirements and select the processing mode in a targeted manner, which is conducive to improving the accuracy and reliability of generating subsequent collaborative control parameters. It can also realize continuous processing, which is conducive to improving processing efficiency and processing intelligence. By selecting the mode to adapt to different efficiency and process requirements, it is conducive to improving processing intelligence and accuracy, thereby improving the processing efficiency in the galvanometer laser application process, and also conducive to improving the intelligence and control efficiency of controlling the target processing equipment.

[0079] In yet another alternative embodiment, the target processing mode includes a first processing mode or a second processing mode; When the target processing mode includes the first processing mode, based on the compensation parameters and the target processing mode, the corresponding collaborative control parameters for the target processing equipment are generated, including: Based on the compensation parameters and the first processing mode, the first operating parameters corresponding to the Y-axis drive component are determined, and the Y-axis drive component is controlled to perform a circumferential scanning operation that matches the first operating parameters to obtain the scanning result. Based on the scanning result, the cooperative control parameters corresponding to the target processing equipment are generated. When the target processing mode includes a second processing mode, based on the compensation parameters and the target processing mode, the corresponding collaborative control parameters for the target processing equipment are generated, including: Based on the compensation parameters and the second processing mode, the second operating parameters corresponding to the Y-axis drive assembly and the third operating parameters of the roller motor assembly are determined. Based on the second and third operating parameters, the helical pitch parameters corresponding to the target processing object are determined. Based on the helical pitch parameters, the cooperative control parameters corresponding to the target processing equipment are generated.

[0080] In this optional embodiment, the first operating parameters may include operating parameters corresponding to controlling the movement and scanning of the Y-axis drive range; the scanning result may include the scanning result corresponding to the roller drive component; the second operating parameters may include operating parameters corresponding to controlling the movement speed of the Y-axis drive component; and the third operating parameters may include operating parameters corresponding to the angular velocity of the roller motor.

[0081] In this optional embodiment, when the target processing mode includes the first processing mode, the parameters of the galvanometer laser emission component are: the corrected scanning coordinates within the tile, the laser switching timing of each tile, the power gradient curve of the overlapping area, and the phase parameters of the fill line; the parameters of the Y-axis drive component are: the target position command for each tile, the Y-axis stepping speed, and the start / stop buffer parameters during tile switching; the parameters of the roller motor component are: the target angular velocity during the processing of each tile, the control command for the circumferential scanning mode, and the torque limiting parameters; and the synchronization and coordination parameters are: the tile switching trigger signal and the unified time base signal.

[0082] In this optional embodiment, when the target processing mode includes a second processing mode, the parameters of the galvanometer laser emission component are: corrected helical scanning coordinates, real-time laser power control parameters, and cross-field-of-view phase alignment parameters; the parameters of the Y-axis drive component are: constant speed control command, real-time update parameters for Y-axis position compensation, and acceleration limit parameters; the parameters of the roller motor component are: target angular velocity command and angular acceleration compensation parameters; and the synchronization and coordination parameters are: speed linkage control signal between the Y-axis and the roller, and galvanometer field-of-view follow-up trigger signal.

[0083] In this optional embodiment, for example, when the target processing mode includes the first processing mode, the Y-axis driver is controlled to move to the center of the target processing object and stop, the roller motor is controlled to perform a circumferential scanning operation to cover the range of 0-2π (or fill the corresponding range in multiple circles), the laser is turned off, and the Y-axis driver is controlled to step to i+1, that is, to overlap the axis of the previous target processing object by δ=1–3 mm, and the processing action is repeated in this way; this method can control the process simply and conveniently with high stability, is applicable to most materials, and has wide versatility.

[0084] In this optional embodiment, optionally, for example, when the target machining mode includes a second machining mode, the Y-axis driver is controlled to advance at a constant speed vyv_yvy, and the roller motor is controlled to rotate continuously at a constant angular velocity ω\omegaω, and the helical pitch p=R⋅vyωp=\frac{R·v_y}{\omega}p=ωR⋅vy is determined to match the required line spacing / fill step (e.g., 0.10–0.20 mm). In this way, the galvanometer can perform short-stroke follow-up and energy uniform distribution within the field of view, continuously cross the machining object without interruption, and achieve continuous and seamless machining, which is beneficial to improving machining efficiency.

[0085] In this optional embodiment, the first processing mode can be precisely adapted to high-precision, fine-textured, small-area / long-pattern processing (such as industrial part markings and high-end customized logos) through "static scanning + closed-loop verification", maximizing the advantage of "controllable precision". The second processing mode, through "dual-component linkage + continuous motion", precisely adapts to high efficiency priority, large-area filling, and batch processing (such as consumer-grade gift engraving and light industrial mass production), maximizing the advantage of "efficiency priority". The two modes can be switched on demand, which avoids the inefficiency caused by using the fine mode to process large-area workpieces, and also avoids the insufficient precision caused by using the high-efficiency mode to process fine patterns, thus achieving "precise coverage of all scenarios".

[0086] As can be seen, implementing this optional embodiment enables the determination of the first operating parameters of the Y-axis drive component based on the compensation parameters and the first processing mode when the target processing mode includes the first processing mode, and the execution of a circumferential scanning operation to obtain the scanning result, thereby generating the corresponding collaborative control parameters for the target processing equipment. When the target processing mode includes the second processing mode, the determination of the second operating parameters of the Y-axis drive component and the third operating parameters of the roller motor component based on the compensation parameters and the second processing mode, and the determination of the helical pitch parameters based on the second and third operating parameters, thereby generating the collaborative control parameters. The first operating parameters are generated based on the compensation parameters and the characteristics of the first processing mode, ensuring that the processing area of ​​each processing object is completely consistent with the theoretical position, which is beneficial to improving processing accuracy and precision. Furthermore, by collecting the scanning results of the circumferential scanning within the tile, the effectiveness of the compensation parameters can be verified in reverse. If a local scanning deviation is found, the collaborative control parameters are dynamically fine-tuned to ensure that the processing precision of each tile meets the standard. Combined with the precise control of the first operating parameters, the laser can achieve high-density, uniform scanning and filling within the tile to improve processing quality. The real-time speed compensation of the axis and the angular velocity correction value of the roller are directly involved in the calculation of the helical pitch, ensuring that the helical pitch parameters are perfectly matched with the preset processing line spacing, ensuring that the helical pitch at different radial positions is always uniform and the energy density is consistent. In the second processing mode, the Y-axis moves continuously at a uniform speed according to the second operating parameters, and the roller rotates synchronously at a uniform speed according to the third operating parameters. There is no need for intermittent waiting during tile switching, and the processing process is uninterrupted, which is conducive to improving processing efficiency and processing intelligence. It can also be linked with the helical pitch parameters and the galvanometer field of view follow-up parameters, combined with the galvanometer scanning range correction in the compensation parameters, which is conducive to improving processing intelligence and accuracy, thereby improving the processing efficiency in the galvanometer laser application process, and also conducive to improving the intelligence and control efficiency of the target processing equipment. Example

[0087] Please see Figure 3 , Figure 3 This is a schematic diagram of the structure of an intelligent control device for galvanometer lasers disclosed in an embodiment of the present invention. Figure 3 As shown, the intelligent control device applied to galvanometer lasers may include: The calibration module 301 is used to perform calibration operations on the target processing object and obtain the target calibration result corresponding to the target processing object; The determination module 302 is used to determine the error parameters corresponding to the target object being processed through the target driver; and to determine the measurement parameters corresponding to the target object being processed. The generation module 303 is used to generate compensation parameters corresponding to the target processing object based on measurement parameters and error parameters; and to generate collaborative control parameters corresponding to the target processing equipment based on the compensation parameters. The collaborative control parameters include parameters for controlling the galvanometer laser emitting component, Y-axis drive component, and roller motor component corresponding to the target processing equipment to achieve collaborative operation.

[0088] It is evident that implementation Figure 3 The described device performs a calibration operation on the target object to obtain the target calibration result, determines the error parameters corresponding to the target object through the target driver, determines the measurement parameters of the target object, and generates compensation parameters based on the measurement parameters and error parameters, thereby generating cooperative control parameters. It can achieve continuous axial pattern processing with a length greater than the field of view through cooperative control. It can determine the error through calibration and then correct it specifically through compensation parameters, which is beneficial to improving the processing accuracy and precision. It can also significantly improve the cooperative precision of Y-axis movement, roller rotation and galvanometer scanning based on the axial full-width error parameters obtained from calibration and real-time compensation. Furthermore, it can improve processing efficiency and processing intelligence through cooperative operation, which in turn can improve the processing efficiency in the process of galvanometer laser application, and also improve the intelligence and control efficiency of the target processing equipment.

[0089] In an optional embodiment, such as Figure 4 As shown, the device also includes: The acquisition module 304 is used to acquire the taper measurement results of the target processing equipment; The judgment module 305 is used to determine whether the taper measurement result meets the preset taper measurement conditions; The determining module 302 is also used to determine the real-time correction parameters corresponding to the taper measurement results based on the taper measurement results and preset taper measurement conditions; The control module 306 is used to control the target processing equipment to perform correction control operations that match the real-time correction parameters.

[0090] It is evident that implementation Figure 4The described device can acquire the taper measurement results of the target processing equipment and determine whether the taper measurement conditions are met. If not, it determines real-time correction parameters based on the taper measurement results and conditions and executes corresponding correction operations. Through real-time correction of the mapping parameters and galvanometer scanning range, it allows the design pattern to adaptively match the actual taper characteristics of the workpiece, ensuring that the pattern proportions and dimensional accuracy are consistent with the design across the entire axis, improving processing accuracy and reliability. Furthermore, the real-time correction operation ensures a constant laser energy density across the entire workpiece surface, maintaining high consistency in engraving depth, color, and texture, avoiding localized quality defects, and improving processing quality. It can also avoid energy matching problems caused by differences in material thermal conductivity, melting point, and taper based on real-time correction parameters, achieving high-quality processing. The correction parameters are automatically completed through the collaboration of a camera and encoder, calculated in real-time by an algorithm, eliminating the need for manual taper measurement and equipment parameter adjustment by operators, thus improving processing efficiency and intelligence. This, in turn, enhances processing efficiency in galvanometer laser applications and improves the intelligence and control efficiency of the target processing equipment.

[0091] In another alternative embodiment, such as Figure 4 As shown, the specific methods by which the determining module 302 determines the measurement parameters corresponding to the target processing object include: A first measurement operation is performed on the target processing object by a preset target encoder to obtain a first measurement result, and a second measurement operation is performed on the target processing object by a preset laser mark to obtain a second measurement result; The measurement error value between the first measurement result and the second measurement result is determined. Based on the measurement error value, a target measurement result is generated, and the measurement parameters are determined according to the target measurement result. Among them, the measurement parameters corresponding to the target processing object include the diameter parameter corresponding to the target processing object.

[0092] It is evident that implementation Figure 4The described device can perform a first measurement operation on a target processing object using a preset target encoder to obtain a first measurement result, and perform a second measurement operation on the target processing object using a preset laser mark to obtain a second measurement result. It determines the measurement error value between the first and second measurement results, thereby generating a target measurement result and determining measurement parameters. By using both encoder and laser mark methods, it improves the accuracy and reliability of measuring the target processing object, and also helps improve the measurement accuracy for diameter measurements. Compared to traditional single encoder or single vision measurement, dual measurement further improves measurement accuracy and reliability. Encoder measurement is unaffected by environmental factors such as lighting and workpiece surface reflection, while laser marking is unaffected by slippage. The complementary advantages of both methods improve measurement accuracy and precision, thereby enhancing the accuracy and reliability of subsequent determination of corresponding compensation parameters and generation of corresponding collaborative control parameters for the target processing equipment based on the measurement results. This, in turn, improves processing efficiency in galvanometer laser applications and enhances the intelligence and control efficiency of the target processing equipment.

[0093] In yet another alternative embodiment, such as Figure 4 As shown, the device also includes: The detection module 307 is used to detect the surface characteristic information of the target processing object after the generation module 303 generates the compensation parameters corresponding to the target processing object based on the measurement parameters and error parameters. The determining module 302 is also used to determine the processing matching parameters corresponding to the target processing object based on surface characteristic information. The processing matching parameters include one or more of the following: roller drive matching parameters, current limiting matching parameters, and clamping force matching parameters. The generation module 303 is also used to generate compensation update parameters corresponding to the compensation parameters based on the processing matching parameters, and to perform update operations on the compensation parameters based on the compensation update parameters.

[0094] It is evident that implementation Figure 4The described device can detect the surface characteristics of the target object and determine the processing matching parameters. Based on the processing matching parameters, it generates compensation update parameters corresponding to the compensation parameters and performs update operations on the compensation parameters. It can dynamically adjust the processing matching parameters through current limiting, clamping force adjustment, and roller surface material replacement. By detecting information such as surface hardness, material type, and special properties, it ensures the integrity and safety of processing the target object. It can also extend the service life of the workpiece and equipment rollers by increasing the clamping force matching parameters and optimizing the roller drive smoothness coefficient. Targeted adjustment of clamping force and roller drive parameters helps improve the accuracy and reliability of workpiece processing. Furthermore, combined with compensation parameter updates, it can further ensure the synchronization accuracy of Y-axis movement and roller rotation. The current limiting matching parameters are dynamically adjusted based on surface hardness and material characteristics. A smaller maximum current threshold is set for soft workpieces to limit the roller output torque and avoid workpiece torsional deformation due to excessive torque, which helps improve processing accuracy and processing safety. This, in turn, can improve the processing efficiency in galvanometer laser applications and enhance the intelligence and control efficiency of the target processing equipment.

[0095] In yet another alternative embodiment, such as Figure 4 As shown, the determining module 302 is also used to determine the adjacent processing areas corresponding to the target processing object, and based on the adjacent processing areas, determine the phase alignment operation corresponding to the adjacent processing areas to obtain the phase alignment result; The acquisition module 304 is also used to acquire the processing operation parameters corresponding to the target processing equipment based on the phase alignment result, wherein the processing operation parameters include one or more of the following: movement speed parameters, real-time curvature parameters, and acceleration parameters; The determination module 302 is also used to establish an energy density feedforward model based on all processing operation parameters, determine the operation control parameters corresponding to the target processing equipment based on the energy density feedforward model, and update the collaborative control parameters according to the operation control parameters.

[0096] It is evident that implementation Figure 4The described device can determine the adjacent processing areas corresponding to the target processing object and determine the corresponding phase alignment operation to obtain the phase alignment result. It acquires processing operation parameters and establishes an energy density feedforward model to determine the corresponding operation control parameters of the target processing equipment and update the collaborative control parameters. By selectively choosing the corresponding alignment method, it can ensure seamless connection between the subsequent area filling line and the previous area, which is beneficial to improving processing accuracy and precision. Furthermore, by comprehensively calculating energy parameters through the model using multi-dimensional data, it can both offset the influence of motion state changes on energy and adapt to differences in workpiece geometry, solving the energy imbalance problem caused by traditional single parameter adjustment. This is beneficial to improving processing uniformity and processing intelligence. Real-time acquisition of processing operation parameters and dynamic updating of collaborative control parameters are beneficial to improving processing intelligence and accuracy, thereby improving processing efficiency in galvanometer laser applications and enhancing the intelligence and control efficiency of controlling the target processing equipment.

[0097] In yet another alternative embodiment, such as Figure 4 As shown, the acquisition module 304 is also used to acquire the processing requirement information of the target processing object; The determination module 302 is also used to determine the target processing mode corresponding to the target processing object based on the processing requirement information; The specific methods by which the generation module 303 generates the collaborative control parameters corresponding to the target processing equipment based on the compensation parameters include: Based on the compensation parameters and the target processing mode, the corresponding collaborative control parameters for the target processing equipment are generated.

[0098] It is evident that implementation Figure 4 The described device can acquire the processing requirements information of the target object and determine the corresponding target processing mode. Based on the compensation parameters and the target processing mode, it generates the corresponding collaborative control parameters for the target processing equipment. It can determine the corresponding mode based on different processing requirements and selectively choose the processing mode, which helps to improve the accuracy and reliability of generating subsequent collaborative control parameters. It can also realize continuous processing, which helps to improve processing efficiency and processing intelligence. By selecting the mode to adapt to different efficiency and process requirements, it helps to improve processing intelligence and accuracy, thereby improving the processing efficiency in the galvanometer laser application process, and also helps to improve the intelligence and control efficiency of controlling the target processing equipment.

[0099] In yet another alternative embodiment, such as Figure 4 As shown, the target processing mode includes either the first processing mode or the second processing mode; When the target processing mode includes the first processing mode, the specific methods by which the generation module 303 generates the corresponding collaborative control parameters for the target processing equipment based on the compensation parameters and the target processing mode include: Based on the compensation parameters and the first processing mode, the first operating parameters corresponding to the Y-axis drive component are determined, and the Y-axis drive component is controlled to perform a circumferential scanning operation that matches the first operating parameters to obtain the scanning result. Based on the scanning result, the cooperative control parameters corresponding to the target processing equipment are generated. When the target processing mode includes a second processing mode, the specific methods by which the generation module 303 generates the corresponding collaborative control parameters for the target processing equipment based on the compensation parameters and the target processing mode include: Based on the compensation parameters and the second processing mode, the second operating parameters corresponding to the Y-axis drive assembly and the third operating parameters of the roller motor assembly are determined. Based on the second and third operating parameters, the helical pitch parameters corresponding to the target processing object are determined. Based on the helical pitch parameters, the cooperative control parameters corresponding to the target processing equipment are generated.

[0100] It is evident that implementation Figure 4 The described device, when the target processing mode includes a first processing mode, determines the first operating parameters of the Y-axis drive component based on compensation parameters and the first processing mode, performs a circumferential scanning operation to obtain the scanning result, and then generates the corresponding cooperative control parameters for the target processing equipment. When the target processing mode includes a second processing mode, it determines the second operating parameters of the Y-axis drive component and the third operating parameters of the roller motor component based on compensation parameters and the second processing mode, and determines the helical pitch parameter based on the second and third operating parameters to generate the cooperative control parameters. The first operating parameters are generated based on the compensation parameters and the characteristics of the first processing mode, ensuring that the processing area of ​​each processing object is completely consistent with the theoretical position, which is beneficial to improving processing accuracy and precision. Furthermore, by acquiring the scanning results of the circumferential scanning within the tile, the effectiveness of the compensation parameters can be verified in reverse. If a local scanning deviation is found, the cooperative control parameters are dynamically fine-tuned to ensure that the processing precision of each tile meets the standard. Combined with the precise control of the first operating parameters, the laser can achieve high-density, uniform scanning and filling within the tile to improve processing quality. The real-time speed compensation of the axis and the angular velocity correction value of the roller are directly involved in the calculation of the helical pitch, ensuring that the helical pitch parameters are perfectly matched with the preset processing line spacing, ensuring that the helical pitch at different radial positions is always uniform and the energy density is consistent. In the second processing mode, the Y-axis moves continuously at a uniform speed according to the second operating parameters, and the roller rotates synchronously at a uniform speed according to the third operating parameters. There is no need for intermittent waiting during tile switching, and the processing process is uninterrupted, which is conducive to improving processing efficiency and processing intelligence. It can also be linked with the helical pitch parameters and the galvanometer field of view follow-up parameters, combined with the galvanometer scanning range correction in the compensation parameters, which is conducive to improving processing intelligence and accuracy, thereby improving the processing efficiency in the galvanometer laser application process, and also conducive to improving the intelligence and control efficiency of the target processing equipment. Example

[0101] Please see Figure 5 , Figure 5 This is a schematic diagram of another intelligent control device for galvanometer lasers disclosed in an embodiment of the present invention. Figure 5 As shown, the intelligent control device applied to galvanometer lasers may include: A memory 401 storing executable program code; a processor 402 coupled to the memory 401; The processor 402 calls the executable program code stored in the memory 401 to execute some or all of the steps in the intelligent control of galvanometer lasers according to any one of the embodiments of the present invention. Example

[0102] This invention discloses a computer storage medium storing computer instructions. When these computer instructions are invoked, they are used to execute some or all of the steps in any of the intelligent control methods for galvanometer lasers disclosed in Embodiment 1 of this invention.

[0103] The device embodiments described above are merely illustrative. The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network modules. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0104] Through the detailed description of the above embodiments, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, including read-only memory (ROM), random access memory (RAM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), one-time programmable read-only memory (OTPROM), electrically-Erasable Programmable Read-Only Memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, disk storage, magnetic tape storage, or any other computer-readable medium that can be used to carry or store data.

[0105] Finally, it should be noted that the above embodiments are merely preferred embodiments of the present invention and are only used to illustrate the technical solutions of the present invention, not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A smart control method for galvanometer lasers, characterized in that, The method includes: A calibration operation is performed on the target processing object to obtain the target calibration result corresponding to the target processing object, and the error parameter corresponding to the target processing object is determined by the target driver. Determine the measurement parameters corresponding to the target processing object, and generate compensation parameters corresponding to the target processing object based on the measurement parameters and the error parameters; Based on the compensation parameters, collaborative control parameters corresponding to the target processing equipment are generated. The collaborative control parameters include those for controlling the galvanometer laser emitting component, Y-axis drive component, and roller motor component corresponding to the target processing equipment to achieve collaborative operation.

2. The intelligent control method for galvanometer lasers according to claim 1, characterized in that, The method further includes: Obtain the taper measurement result of the target processing equipment, and determine whether the taper measurement result meets the preset taper measurement conditions; When it is determined that the taper measurement result does not meet the preset taper measurement conditions, based on the taper measurement result and the preset taper measurement conditions, the real-time correction parameter corresponding to the taper measurement result is determined, and the target processing equipment is controlled to perform a correction control operation that matches the real-time correction parameter.

3. The intelligent control method for galvanometer lasers according to claim 1, characterized in that, Determining the measurement parameters corresponding to the target processing object includes: A first measurement operation is performed on the target processing object by a preset target encoder to obtain a first measurement result, and a second measurement operation is performed on the target processing object by a preset laser mark to obtain a second measurement result; The measurement error value between the first measurement result and the second measurement result is determined. Based on the measurement error value, a target measurement result is generated, and measurement parameters are determined according to the target measurement result. The measurement parameters corresponding to the target processing object include the diameter parameter corresponding to the target processing object.

4. The intelligent control method for galvanometer lasers according to claim 1, characterized in that, After generating compensation parameters corresponding to the target processing object based on the measurement parameters and the error parameters, the method further includes: The surface characteristic information of the target processing object is detected, and based on the surface characteristic information, the processing matching parameters corresponding to the target processing object are determined. The processing matching parameters include one or more of the following: roller drive matching parameters, current limiting matching parameters, and clamping force matching parameters. Based on the processing matching parameters, compensation update parameters corresponding to the compensation parameters are generated, and an update operation is performed on the compensation parameters based on the compensation update parameters.

5. The intelligent control method for galvanometer lasers according to claim 2, characterized in that, The method further includes: Determine the adjacent processing areas corresponding to the target processing object, and based on the adjacent processing areas, determine the phase alignment operation corresponding to the adjacent processing areas to obtain the phase alignment result; Based on the phase alignment result, the processing operation parameters corresponding to the target processing equipment are obtained, wherein the processing operation parameters include one or more of the following: movement speed parameters, real-time curvature parameters, and acceleration parameters; Based on all the processing operation parameters, an energy density feedforward model is established, and the operation control parameters corresponding to the target processing are determined based on the energy density feedforward model. The cooperative control parameters are then updated according to the operation control parameters.

6. The intelligent control method for galvanometer lasers according to claim 2, characterized in that, The method further includes: Obtain the processing requirement information of the target processing object, and determine the target processing mode corresponding to the target processing object based on the processing requirement information; The step of generating the cooperative control parameters corresponding to the target processing equipment based on the compensation parameters includes: Based on the compensation parameters and the target processing mode, the corresponding collaborative control parameters for the target processing equipment are generated.

7. The intelligent control method for galvanometer lasers according to claim 6, characterized in that, The target processing mode includes a first processing mode or a second processing mode; When the target processing mode includes the first processing mode, generating the cooperative control parameters corresponding to the target processing equipment based on the compensation parameters and the target processing mode includes: Based on the compensation parameters and the first processing mode, the first operating parameters corresponding to the Y-axis drive component are determined, and the Y-axis drive component is controlled to perform a circumferential scanning operation that matches the first operating parameters to obtain the scanning result. Based on the scanning result, the cooperative control parameters corresponding to the target processing equipment are generated. When the target processing mode includes the second processing mode, generating the cooperative control parameters corresponding to the target processing equipment based on the compensation parameters and the target processing mode includes: Based on the compensation parameters and the second processing mode, the second operating parameters corresponding to the Y-axis drive assembly and the third operating parameters of the roller motor assembly are determined. Based on the second operating parameters and the third operating parameters, the helical pitch parameters corresponding to the target processing object are determined. Based on the helical pitch parameters, the cooperative control parameters corresponding to the target processing equipment are generated.

8. An intelligent control device for galvanometer lasers, characterized in that, The device includes: The calibration module is used to perform calibration operations on the target processing object and obtain the target calibration result corresponding to the target processing object; The determination module is used to determine the error parameters corresponding to the target object being processed via the target driver; and to determine the measurement parameters corresponding to the target object being processed. The generation module is used to generate compensation parameters corresponding to the target processing object based on the measurement parameters and the error parameters; and to generate collaborative control parameters corresponding to the target processing equipment based on the compensation parameters, wherein the collaborative control parameters include parameters for controlling the galvanometer laser emitting component, Y-axis drive component, and roller motor component corresponding to the target processing equipment to achieve collaborative operation.

9. An intelligent control device for galvanometer lasers, characterized in that, The device includes: Memory containing executable program code; A processor coupled to the memory; The processor calls the executable program code stored in the memory to execute the intelligent control method for galvanometer lasers as described in any one of claims 1-7.

10. A computer storage medium, characterized in that, The computer storage medium stores computer instructions, which, when invoked, are used to execute the intelligent control method for galvanometer lasers as described in any one of claims 1-7.

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