Intensive low-resistance high-thermal-stability electromagnetic coil based on self-adhesive red copper wire

Abstract

According to the intensive low-resistance high-thermal-stability electromagnetic coil based on the self-adhesive red copper wire, the F-level self-adhesive enameled red copper wire with the wire diameter of 1.2 mm is adopted as a wire, a coil body is solidified into a triangular whole with a compact structure and a specific size through a thermal bonding technology, and the winding density of the coil is not lower than 90%. According to the scheme, through combination of the specific wire rod and the winding process, low direct-current resistance, high mechanical strength, excellent heat dissipation performance and high magnetic field utilization rate of the coil are achieved, and the coil is particularly suitable for occasions with strict requirements for efficiency, reliability and size.

Description

Technical Field

[0001] This invention relates to the field of electromagnetic components, specifically to an electromagnetic coil with high winding density, low DC resistance, and excellent thermal stability, which is made by thermal bonding of self-adhesive enameled round copper wire. Background Technology

[0002] In the manufacturing of electromagnetic components such as motors, transformers, and relays, high efficiency and miniaturization are typically desired, requiring electromagnetic coils with low DC resistance and high winding space utilization to reduce copper losses and heat generation, as well as enhance the magnetic field and reduce size. Traditional coils often use ordinary enameled round copper wire wound and then impregnated with enamel, which suffers from limited slot fill factor improvement, poor interlayer thermal conductivity, and inter-turn bonding strength relying on additional insulating varnish with inconsistent performance. While self-adhesive enameled wire is known to be suitable for coil manufacturing, its performance is highly dependent on a specific match between the varnish composition, conductor material, and process parameters. Different self-adhesive varnish formulations and conductor substrates, under the same heat treatment conditions, result in significant differences in the overall coil performance (such as bonding strength, thermal stability, and resistance characteristics). Improper selection or matching can lead to problems such as weak bonding, decreased heat resistance, or excessively high resistance. Therefore, there is an urgent need for a targeted optimization design scheme that deeply integrates self-adhesive wire of specific diameter, conductor material, specific self-supporting dimensions and shapes, and suitable winding processes to systematically solve the synergistic problem of reliability, low resistance, and high thermal stability in high-density windings. Summary of the Invention

[0003] To address the problems mentioned in the background technology, this solution provides a high-density, low-resistance electromagnetic coil using self-adhesive copper wire. By selecting 1.2mm diameter, F-grade heat-resistant self-adhesive enameled copper wire and combining precision winding and thermal bonding processes, this coil achieves extremely high winding density, extremely low DC resistance, excellent inter-turn bonding strength, and good heat dissipation performance, comprehensively improving the electrical and mechanical properties of the coil, thereby ensuring stable and efficient operation of the coil under high-temperature conditions.

[0004] The technical solution adopted by the present invention to solve its technical problem is as follows: a dense low-resistance high thermal stability electromagnetic coil based on self-adhesive copper wire, including a coil body, wherein the coil body is made of wire wound and then thermally bonded to form a dense triangular whole.

[0005] Furthermore, the conductor is selected from self-adhesive enameled round copper wire. The conductor diameter is preferably 1.2 mm. The heat resistance rating is F (temperature range 155 degrees Celsius).

[0006] Furthermore, the conductor of the wire is a round copper wire of grade T2 or higher, with a density of approximately 8.9 × 10³ kg / m³, exhibiting excellent conductivity. The copper purity of the wire is not less than 99.90%, and its DC resistivity at 20°C is not greater than 0.017241 Ω·mm² / m.

[0007] Furthermore, the coil body can be a frameless, stable triangular self-supporting structure, or it can be formed by winding it on a triangular insulating frame.

[0008] Furthermore, during winding, an automatic winding machine is used to tightly and neatly wind the conductors onto a pre-set triangular insulating frame to form a coil assembly. After winding, the coil assembly is placed in a temperature-controlled oven and heated according to the temperature-time curve required by the self-adhesive varnish corresponding to the conductor (for example, maintaining at 130℃~150℃ for 10~20 minutes). The self-adhesive varnish on the surface of the conductor softens, flows, and undergoes a cross-linking reaction, causing adjacent turns to bond firmly together. Finally, the coil assembly is removed and cooled to form the coil body.

[0009] Furthermore, the winding density of the coil body (i.e., the ratio of the total cross-sectional area of ​​the conductors to the cross-sectional area of ​​the coil) is not less than 90%.

[0010] The beneficial effects of this invention are: 1. Low resistance and high efficiency: Using 1.2mm diameter high-conductivity copper conductors and combined with a high winding density design, the DC resistance of the coil is significantly reduced, reducing energy loss (copper loss) caused by resistance during operation and improving electromagnetic conversion efficiency.

[0011] 2. High reliability and long lifespan: Through the thermal bonding effect of the self-adhesive paint, the coil is cured into a solid triangular whole. The triangular structure is stable and has good shock resistance, avoiding loosening or wear between turns caused by vibration or thermal shock, thus improving the mechanical strength and durability of the product. The F-class (155℃) heat resistance rating ensures the safety margin for long-term operation of the coil at high temperatures.

[0012] 3. Excellent heat dissipation: The high winding density results in tighter contact between conductors, improving internal heat conduction. The cured self-adhesive binds the wires together, helping to conduct internal heat more evenly and quickly to the coil surface for dissipation, thereby reducing hot spot temperatures.

[0013] 4. Compact structure and high magnetic field utilization: High winding density means that more ampere turns can be accommodated in the same space, or the coil volume can be smaller when generating the same magnetomotive force, thus achieving miniaturization and high magnetic field utilization. Attached Figure Description

[0014] Figure 1This is a perspective view of the overall structure of Embodiment 1 of the present invention; Figure 2 This is a cross-sectional view of Embodiment 1 of the present invention. Detailed Implementation

[0015] The present invention will be further described below with reference to embodiments. It is worth noting that these specific embodiments are merely representative embodiments of the present invention, and the specific methods, apparatuses, conditions, materials, etc., exemplified are not intended to limit the present invention or the corresponding specific embodiments. Example 1

[0016] A dense, low-resistance, high-thermal-stability electromagnetic coil based on self-adhesive copper wire, such as Figure 1 and Figure 2 As shown, the coil body 1 is formed by winding wires and then thermally bonding them to form a dense, triangular-like structure. In this embodiment, the coil body 1 is a stable, self-supporting triangular structure without a frame, and all corners of the coil body 1 are rounded. The wires are 1.2mm diameter self-adhesive enameled round copper wires with a heat resistance rating of F (temperature range of 155 degrees Celsius). The conductor 2 of the wires is a round copper wire of grade T2 or higher, with a density of approximately 8.9 × 10³ kg / m³, exhibiting excellent conductivity. The purity of the copper in the wires is not less than 99.90%, and its DC resistivity at 20°C is not greater than 0.017241 Ω·mm² / m. In this embodiment, the coil body 1 undergoes a specific thermal bonding process, ensuring that the self-adhesive enamel layers on the surfaces of each turn of the wire are firmly bonded together after heating, forming a stable, dense, self-supporting triangular structure. The enamel film 3 formed by the self-adhesive enameled round copper wire serves as both inter-turn insulation and bonding medium after thermal bonding.

[0017] Furthermore, the winding density (i.e., the ratio of the total cross-sectional area of ​​the conductors to the cross-sectional area of ​​the coil) of the coil body 1 is not less than 90%. Preferably, the coil body 1 comprises at least 10 layers of coils from top to bottom, and each layer of coil comprises at least 7 turns of wire from the inside to the outside.

[0018] This embodiment aims to solve the problems of limited slot fill factor, poor interlayer thermal conductivity, and inconsistent inter-turn bonding strength due to the reliance on additional insulating varnish in traditional coils. It uses 1.2mm diameter, F-grade self-adhesive enameled copper wire as the conductor and employs a thermal bonding process to solidify the coil body into a dense, triangular whole of specific dimensions, with a winding density of no less than 90%. This embodiment, through the combination of specific wire materials and winding techniques, achieves low DC resistance, high mechanical strength, excellent heat dissipation, and high magnetic field utilization in the coil, making it particularly suitable for applications with stringent requirements for efficiency, reliability, and size. Example 2

[0019] A dense, low-resistance, high-thermal-stability electromagnetic coil based on self-adhesive copper wire includes a coil body 1, the structure and manufacturing method of which are similar to those of Embodiment 1. The difference is that in this embodiment, the coil body 1 is formed by winding it onto a triangular insulating frame. During winding, an automatic winding machine is used to tightly and neatly wind the wire onto a preset triangular insulating frame to form a coil assembly. After winding, the coil assembly is placed in a temperature-controlled oven and heated according to the temperature-time curve required by the self-adhesive varnish corresponding to the wire (for example, holding at 130℃~150℃ for 10~20 minutes). The self-adhesive varnish on the surface of the wire softens, flows, and undergoes a cross-linking reaction, causing adjacent turns to bond firmly together. Finally, the coil assembly is removed and cooled to form the coil body 1.

[0020] The above description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All simple equivalent changes and modifications made in accordance with the scope of the patent application and the description of the invention shall still fall within the scope of the patent of the present invention.

Claims

1. A dense, low-resistance, high-thermal-stability electromagnetic coil based on self-adhesive copper wire, characterized in that, It includes a coil body (1), which is made of wire wound together and then heat-bonded to form a dense triangular whole.

2. The dense, low-resistance, high-thermal-stability electromagnetic coil based on self-adhesive copper wire according to claim 1, characterized in that, The conductor is made of self-adhesive enameled round copper wire.

3. A dense, low-resistance, high-thermal-stability electromagnetic coil based on self-adhesive copper wire according to claim 1 or 2, characterized in that, The diameter of the conductor is 1.2 mm.

4. A dense, low-resistance, high-thermal-stability electromagnetic coil based on self-adhesive copper wire according to claim 1 or 2, characterized in that, The heat resistance rating of the conductor is Class F.

5. A dense, low-resistance, high-thermal-stability electromagnetic coil based on self-adhesive copper wire according to claim 1 or 2, characterized in that, The conductor (2) of the wire is a round copper wire of T2 grade or above made of purple copper.

6. A dense, low-resistance, high-thermal-stability electromagnetic coil based on self-adhesive copper wire according to claim 1 or 2, characterized in that, The coil body (1) is a frameless triangular self-supporting structure.

7. A dense, low-resistance, high-thermal-stability electromagnetic coil based on self-adhesive copper wire according to claim 2, characterized in that, During winding, an automatic winding machine is used to tightly and neatly wind the conductors onto a pre-set triangular insulating frame.

8. A dense, low-resistance, high-thermal-stability electromagnetic coil based on self-adhesive copper wire according to claim 7, characterized in that, After winding, the coil assembly is placed in an oven and heated according to the temperature-time curve required by the self-adhesive varnish corresponding to the conductor. When the self-adhesive varnish on the surface of the conductor softens, flows and undergoes a cross-linking reaction, the adjacent coil turns are firmly bonded together. Finally, the coil assembly is taken out and cooled to form the coil body (1).

9. A dense, low-resistance, high-thermal-stability electromagnetic coil based on self-adhesive copper wire according to claim 1, characterized in that, The winding density of the coil body (1) is not less than 90%.

10. A dense, low-resistance, high-thermal-stability electromagnetic coil based on self-adhesive copper wire according to claim 1, characterized in that, The corners of the coil body (1) are all rounded.

Images