22pin type-C male head convenient to use high-frequency welding

Abstract

The invention discloses a 22pin type-C male head convenient to use high-frequency welding, which comprises an A group of pins, a B group of pins, a VBUS short-circuit connecting sheet and a GND short-circuit connecting sheet, and is characterized in that an A4pin is connected with a B4pin through the VBUS short-circuit connecting sheet, and an A9pin is connected with a B9pin through the VBUS short-circuit connecting sheet, so that a VBUS function is realized; the A1 pin is connected with the B1 pin through the GND short-circuit connecting piece, the A12pin is connected with the B12pin through the GND short-circuit connecting piece, and the GND function is achieved. Compared with the prior art, the VBUS function and the GND function of the type-C male connector are achieved, meanwhile, a PCB needing to be adopted originally is omitted, the two sets of pins do not need to be connected with the wire through the PCB, the two sets of pins and the wire can be directly welded in a high-frequency electromagnetic induction heating mode, the welding efficiency can be improved, and the batch production requirement can be met; meanwhile, when high-frequency electromagnetic heating is adopted for welding, the welding quality is higher, the problems of false welding, insufficient welding, tin point short circuit, welding point deflection and the like can be reduced, and then the yield of products can be increased.

Description

Technical Field

[0001] This invention belongs to the field of Type-C connectors, and specifically relates to a 22-pin Type-C male connector that is convenient for high-frequency soldering. Background Technology

[0002] Currently, based on the mandatory requirements of the USB Type-C standard, the four pins A4, A9, B4, and B9 are short-circuited to form a common VBUS pin, providing redundancy, reducing path impedance, and ensuring reversible insertion compatibility. The four pins A1, A12, B1, and B12 are short-circuited to form a common GND pin, providing a low-impedance return path to ensure signal integrity and mechanical reliability.

[0003] In the prior art, in order to meet the above requirements, the male connector of TYPE-C 3.1 / 3.0 usually uses a PCB board. The PCB board can not only realize the connection between the pin group of TYPE-C male connector and the wire, but also realize the mounting of various electronic components. Furthermore, through the multi-layer structure, it can make it easy to realize the short-circuit connection of the pins where the VBUS pin and GND pin are located. For TYPE-C 3.1 / 3.0 male connector, the built-in PCB board is the optimal way to realize its high-speed transmission function.

[0004] However, since the substrate used in PCB boards (such as FR-4) is an insulator, only the copper pads and copper wires on its surface can be heated by electromagnetic induction. However, as independent conductors, it is difficult to form an effective induction heating circuit when electromagnetic induction heating is performed. Therefore, PCB boards cannot be soldered using high-frequency electromagnetic induction heating. When connecting pins, hotbar soldering is usually used.

[0005] Hotbar soldering is slow and inefficient, making it difficult to meet the needs of mass production. In addition, problems such as false soldering, cold soldering, short circuits, and misaligned solder joints are prone to occur during the soldering process, resulting in a high product defect rate. Summary of the Invention

[0006] To address the aforementioned issues, the primary objective of this invention is to provide a convenient 22-pin Type-C male connector for high-frequency soldering. By designing the structure, the PCB board is eliminated, allowing the pins and wires to be soldered using high-frequency electromagnetic induction heating, thereby improving soldering efficiency and meeting the needs of mass production.

[0007] Another objective of this invention is to provide a 22-pin Type-C male connector that is convenient for high-frequency soldering. When soldering with high-frequency electromagnetic heating, the soldering quality is higher, and problems such as cold solder joints, poor solder joints, short circuits, and misaligned solder joints can be reduced, thereby improving the product yield.

[0008] To achieve the above objectives, the technical solution of the present invention is as follows:

[0009] This invention provides a convenient 22-pin Type-C male connector for high-frequency soldering, comprising:

[0010] Group A pins, comprising: Group A pin core, A1 pin, A4 pin, A9 pin, and A12 pin, wherein the A1 pin, A4 pin, A9 pin, and A12 pin are fixedly mounted on the Group A pin core.

[0011] Group B pins, comprising: Group B pin core, B1 pin, B4 pin, B9 pin, and B12 pin, wherein the B1 pin, B4 pin, B9 pin, and B12 pin are fixedly mounted on the Group B pin core.

[0012] VBUS short-circuit connector with conductive properties;

[0013] A conductive GND short-circuit connector;

[0014] The A group of pin cores and the B group of pin cores are arranged vertically opposite each other.

[0015] The VBUS short-circuit connector is disposed between the A group pin core and the B group pin core. The A4 pin and the B4 pin are connected by the VBUS short-circuit connector, and the A9 pin and the B9 pin are connected by the VBUS short-circuit connector, so that the A4 pin, B4 pin, B9 pin and A9 pin are short-circuited to form VBUS pins.

[0016] The GND short-circuit connectors are all located between the A-group pin cores and the B-group pin cores. The A1 pin and the B1 pin are connected by the GND short-circuit connectors, and the A12 pin and the B12 pin are connected by the GND short-circuit connectors, so that the A1 pin, B1 pin, B12 pin, and A12 pin are short-circuited to form the GND pin.

[0017] The A-group pin core and / or B-group pin core are also provided with solder pre-embedded grooves to assist in high-speed welding of the pins to the wire.

[0018] Furthermore, the A4 pin and B4 pin are arranged vertically opposite each other, and the VBUS shorting connector is located between the A4 pin and the B4 pin. The A4 pin has a first protrusion on the side facing the VBUS shorting connector, and the VBUS shorting connector is tightly pressed against the VBUS shorting connector through the first protrusion. The B4 pin has a second protrusion on the side facing the VBUS shorting connector, and the B4 pin is tightly pressed against the VBUS shorting connector through the second protrusion.

[0019] Furthermore, the VBUS short-circuit connector is provided with a first positioning through hole for limiting the first convex bud and the second convex bud, and the front ends of the first convex bud and the second convex bud are respectively pressed into the two ends of the first positioning through hole.

[0020] Furthermore, the A9 pin and B9 pin are arranged vertically opposite each other, and the VBUS shorting connector is located between the A9 pin and the B9 pin. The A9 pin has a third protrusion on the side facing the VBUS shorting connector, and the VBUS shorting connector is tightly pressed against the VBUS shorting connector through the third protrusion. The B9 pin has a fourth protrusion on the side facing the VBUS shorting connector, and the B9 pin is tightly pressed against the VBUS shorting connector through the fourth protrusion.

[0021] Furthermore, the VBUS short-circuit connector is provided with a second positioning through hole for limiting the third convex bud and the fourth convex bud, and the front ends of the third convex bud and the fourth convex bud are respectively pressed into the two ends of the second positioning through hole.

[0022] Furthermore, the A1 pin and B1 pin are arranged vertically opposite each other, and the GND shorting connector is located between the A1 pin and the B1 pin. The A1 pin has a fifth protrusion on the side facing the GND shorting connector, and the GND shorting connector is tightly pressed against the GND shorting connector through the fifth protrusion. The B1 pin has a sixth protrusion on the side facing the GND shorting connector, and the B1 pin is tightly pressed against the GND shorting connector through the sixth protrusion.

[0023] Furthermore, the GND short-circuit connector is provided with a third positioning through hole for limiting the fifth and sixth protrusions, and the front ends of the fifth and sixth protrusions are respectively pressed into the two ends of the third positioning through hole.

[0024] Furthermore, the A12 pin and B12 pin are arranged vertically opposite each other, and the GND shorting connector is located between the A12 pin and the B12 pin. The A12 pin has a seventh protrusion on the side facing the GND shorting connector, and the GND shorting connector is tightly pressed against the GND shorting connector through the seventh protrusion. The B12 pin has an eighth protrusion on the side facing the GND shorting connector, and the B12 pin is tightly pressed against the GND shorting connector through the eighth protrusion.

[0025] Furthermore, the GND short-circuit connector is provided with a fourth positioning through hole for limiting the seventh and eighth protrusions, and the front ends of the seventh and eighth protrusions are respectively pressed into the two ends of the fourth positioning through hole.

[0026] Furthermore, the A-group pin core and / or the B-group pin core are provided with E-MARKER pad grooves for mounting E-MARKER chips.

[0027] Furthermore, the E-MARKER pad slot is located on the B-group pin core. The GND shorting connector has a chip GND pin. The B-group pins include a B5 pin, which has a VCONN1 pin and a VCONN2 pin. There is also a CC1 pad between the A-group pin core and the B-group pin core. The CC1 pad has a CC1 pin. The chip GND pin, VCONN1 pin, VCONN2 pin, and CC1 pin are all located within the E-MARKER pad slot. When the E-MARKER chip is installed, the E-MARKER chip can connect with the chip GND pin, VCONN1 pin, VCONN2 pin, and CC1 pin within the E-MARKER pad slot to achieve high-speed transmission of the TYPE-C male connector.

[0028] Furthermore, the A-group pin core and / or B-group pin core are provided with capacitor pad grooves for mounting ceramic capacitors.

[0029] Furthermore, the capacitor pad slot is formed on the B-group pin core, the B4 pin has a capacitor VBUS pin, and the GND shorting connector has a capacitor GND pin. Both the capacitor VBUS and GND pins are located within the capacitor pad slot. When installing the ceramic capacitor, the ceramic capacitor can connect to the VBUS and GND pins within the capacitor pad slot, assisting the TYPE-C male connector in achieving high-speed transmission.

[0030] Furthermore, the group A pins also include A2 pins, A3 pins, A5 pins, A6 pins, A7 pins, A8 pins, A10 pins, and A11 pins. The A1 pins, A2 pins, A3 pins, A4 pins, A5 pins, A6 pins, A7 pins, A8 pins, A9 pins, A10 pins, A11 pins, and A12 pins are arranged sequentially and integrally injection molded with the group A pin core.

[0031] Furthermore, the B group of pins also includes B2 pins, B3 pins, B8 pins, B10 pins, and B11 pins. The B1 pins, B2 pins, B3 pins, B4 pins, B5 pins, B8 pins, B9 pins, B10 pins, B11 pins, and B12 pins are arranged in sequence and integrally injection molded with the B group of pin core.

[0032] Furthermore, the A-group pin core has a first solder pre-embedded groove on the side opposite to the B-group pin core.

[0033] Furthermore, the A1pin, A2pin, A3pin, A4pin, A5pin, A6pin, A7pin, A8pin, A9pin, A10pin, A11pin, and A12pin extend into the first solder pre-embedded groove.

[0034] Furthermore, the B group of pin cores has a second solder pre-embedded groove on the side opposite to the A group of pin cores.

[0035] Furthermore, the B1 pin, B2 pin, B3 pin, B4 pin, B5 pin, B8 pin, B9 pin, B10 pin, B11 pin, and B12 pin extend into the second solder pre-embedded groove.

[0036] The Type-C male connector also includes:

[0037] shell;

[0038] Core sheath;

[0039] One end of the A-group pin core and the B-group pin core are mounted on the core sheath, and the core sheath is installed inside the outer shell.

[0040] The beneficial effects of this invention are as follows: Compared with the prior art, this application sets a VBUS short-circuit connector and a GND short-circuit connector between two sets of pins. The VBUS short-circuit connector is only connected to pins A4, B4, B9, and A9, and not to other pins, thereby enabling short circuits between pins A4, B4, B9, and A9, integrating the short circuits of pins A4, B4, B9, and A9 into a single VBUS pin to achieve the VBUS function. Similarly, the GND short-circuit connector is only connected to pins A1, B1, B12, and A12, and not to other pins, thereby enabling short circuits between pins A1, B1, B12, and A12, integrating the short circuits of pins A1, B1, B12, and A12 into a single GND pin to achieve the GND function.

[0041] The above design, while achieving the VBUS and GND functions of the Type-C male connector, eliminates the need for a PCB board. The two sets of pins do not need to be connected to the wires via a PCB board; they can be directly soldered to the wires using high-frequency electromagnetic induction heating. This improves soldering efficiency and meets the needs of mass production. At the same time, using high-frequency electromagnetic heating results in higher soldering quality, reducing problems such as cold solder joints, poor solder joints, short circuits, and misaligned solder joints, thereby improving product yield. Attached Figure Description

[0042] Figure 1 This is a first-person view structural diagram of a Type-C male connector.

[0043] Figure 2 yes Figure 1 A magnified view of a portion of point A in the middle.

[0044] Figure 3 This is a structural diagram of a Type-C male connector from a second-view perspective.

[0045] Figure 4 This is an exploded view of a Type-C male connector.

[0046] Figure 5 This is a schematic diagram of the structure of pin group A.

[0047] Figure 6 This is a schematic diagram of the structure of pin group B.

[0048] Figure 7 This is a schematic diagram of the structure of the VBUS shorting connector, the GND shorting connector, and the CC1 pad.

[0049] Figure 8 This is a cross-sectional view of the first position of the Type-C male connector.

[0050] Figure 9 This is a cross-sectional view of the second position of the Type-C male connector.

[0051] Figure 10 This is a cross-sectional view of the third position of the Type-C male connector.

[0052] Figure 11 This is a cross-sectional view of the fourth position of the Type-C male connector.

[0053] In the picture: 1. Outer shell; 2. Rubber core sheath;

[0054] 3. Group A pins; 31. Group A pin core; 311. First solder embedding groove; 32. A1 pin; 321. Fifth convex bulge; 33. A4 pin; 331. First convex bulge; 34. A9 pin; 341. Third convex bulge; 35. A12 pin; 351. Seventh convex bulge; 36. A2 pin; 37. A3 pin; 38. A5 pin; 39. A6 pin; 310. A7 pin; 320. A8 pin; 330. A10 pin; 340. A11 pin;

[0055] 4. Group B pins; 41. Group B pin insert; 411. E-MARKER pad groove; 412. Capacitor pad groove; 413. Second solder pre-embedded groove; 42. B1 pin; 421. Sixth convex bud; 43. B4 pin; 431. Second convex bud; 432. Capacitor VBUS pin; 44. B9 pin; 441. Fourth convex bud; 45. B12 pin; 451. Eighth convex bud; 46. B5 pin; 461. VCONN1 pin; 462. VCONN2 pin; 47. B2 pin; 48. B3 pin; 49. B8 pin; 410. B10 pin; 420. B11 pin;

[0056] 5. VBUS short-circuit connector; 51. First positioning through hole; 52. Second positioning through hole;

[0057] 6. GND shorting connector; 61. Third positioning through hole; 62. Fourth positioning through hole; 63. Chip GND pin; 64. Capacitor GND pin;

[0058] 7. CC1 pad; 71. CC1 pin. Detailed Implementation

[0059] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0060] To achieve the above objectives, the technical solution of the present invention is as follows:

[0061] See Figure 1-11 As shown, this embodiment provides a convenient 22-pin Type-C male connector for high-frequency soldering, comprising:

[0062] Outer shell 1;

[0063] 2. Rubber core sheath;

[0064] Group A pins 3, the group A pins 3 includes: group A pin core 31, A1 pins 32, A4 pins 33, A9 pins 34, and A12 pins 35, the A1 pins 32, A4 pins 33, A9 pins 34, and A12 pins 35 are fixedly installed on the group A pin core 31;

[0065] Group B pins 4, the group B pins 4 includes: group B pin core 41, B1 pin 42, B4 pin 43, B9 pin 44, B12 pin 45, the B1 pin 42, B4 pin 43, B9 pin 44, B12 pin 45 are fixedly installed on the group B pin core 41;

[0066] VBUS short-circuit connector 5 with conductive properties;

[0067] 6. A conductive GND short-circuit connector.

[0068] One end of the A group pin core 31 and the B group pin core 41 is installed on the core sleeve 2, and the core sleeve 2 is installed inside the outer shell 1;

[0069] The pin core 31 of group A and the pin core 41 of group B are arranged vertically opposite each other.

[0070] The VBUS short-circuit connector 5 is disposed between the A group pin core 31 and the B group pin core 41. The A4 pin 33 and the B4 pin 43 are connected by the VBUS short-circuit connector 5, and the A9 pin 34 and the B9 pin 44 are connected by the VBUS short-circuit connector 5, so that the A4 pin 33, B4 pin 43, B9 pin 44 and A9 pin are short-circuited to form VBUS pins.

[0071] The GND short-circuit connector 6 is disposed between the A group pin core 31 and the B group pin core 41. The A1 pin 32 and the B1 pin 42 are connected by the GND short-circuit connector 6, and the A12 pin 35 and the B12 pin 45 are connected by the GND short-circuit connector 6, so that the A1 pin 32, B1 pin 42, B12 pin 45 and A12 pin 35 are short-circuited to form a GND pin.

[0072] The A-group pin core and / or B-group pin core are also provided with solder pre-embedded grooves to assist in high-speed welding of the pins to the wire.

[0073] To achieve the function of short-circuiting pins A4 pin 33, B4 pin 43, B9 pin 44, and A9 pin 34 to form the VBUS pin, and to achieve the function of short-circuiting pins A1 pin 32, B1 pin 42, B12 pin 45, and A12 pin 35 to form the GND pin, existing Type-C male connectors typically use a PCB board to connect the various pins. The multi-layer structure of the PCB board is used to achieve short-circuit connections between specific pins. However, since the material of the PCB board cannot be heated by electromagnetic induction, only hotbar soldering can be used, which results in low soldering efficiency.

[0074] This application achieves VBUS shorting connection piece 5 and GND shorting connection piece 6 between two sets of pins. VBUS shorting connection piece 5 connects only to pins A4 (33), B4 (43), B9 (44), and A9 (34), and not to other pins. This integrates the shorting of pins A4 (33), B4 (43), B9 (44), and A9 into a single VBUS pin, thus realizing the VBUS function. This facilitates the transmission of large currents. Similarly, the GND short-circuit connector 6 is only connected to pins A1 (32), B1 (42), B12 (45), and A12 (35), and not to other pins. This enables short-circuiting between pins A1 (32), B1 (42), B12 (45), and A12 (35), integrating the short circuits of pins A1 (32), B1 (42), B12 (45), and A12 (35) into one GND pin, thus realizing the GND function and facilitating the transmission of large currents up to 5A.

[0075] The above design, while achieving the VBUS and GND functions of the Type-C male connector, eliminates the need for a PCB board to realize Type-C 3.1 / 3.0 functionality. This simplifies the production process, shortens the turnaround time, and effectively reduces production costs. The two sets of pins do not need to be connected to the wires via a PCB board; they can be directly soldered to the wires using high-frequency electromagnetic induction heating, improving soldering efficiency and meeting the needs of mass production. Furthermore, high-frequency electromagnetic heating results in higher soldering quality, reducing issues such as cold solder joints, poor solder joints, short circuits, and misaligned solder joints, thereby improving product yield. During high-frequency electromagnetic heating soldering, solder wire can be pre-embedded in the solder embedding groove. This pre-embedded solder wire adapts to the soldering requirements of high-frequency soldering machines and fully automatic high-frequency soldering machines, eliminating the need for manual soldering. This enables high-frequency, rapid soldering between the A and B sets of pins and the wires, significantly improving soldering efficiency and highlighting the advantages of the PCB-free design.

[0076] Furthermore, the A4pin 33 and B4pin 43 are arranged vertically opposite each other, and the VBUS shorting connector 5 is located between the A4pin 33 and B4pin 43. The A4pin 33 has a first protrusion 331 on the side facing the VBUS shorting connector 5, and the VBUS shorting connector 5 is tightly pressed together with the first protrusion 331. The B4pin 43 has a second protrusion 431 on the side facing the VBUS shorting connector 5, and the B4pin 43 is tightly pressed together with the VBUS shorting connector 5 through the second protrusion 431.

[0077] Furthermore, the VBUS short-circuit connector 5 is also provided with a first positioning through hole 51 for limiting the first protrusion 331 and the second protrusion 431, and the front ends of the first protrusion 331 and the second protrusion 431 are respectively pressed into the two ends of the first positioning through hole 51.

[0078] In this application, the A4pin 33 and B4pin 43 are pressed and connected to the VBUS short-circuit connector 5 through the convex hull, and the front end of the convex hull is limited by the through hole opened in the VBUS short-circuit connector 5 to ensure the stability of the connection.

[0079] Furthermore, the A9 pin 34 and B9 pin 44 are arranged vertically opposite each other, and the VBUS shorting connector 5 is located between the A9 pin 34 and B9 pin 44. The A9 pin 34 has a third protrusion 341 on the side facing the VBUS shorting connector 5, and the VBUS shorting connector 5 is tightly pressed and fitted with the third protrusion 341. The B9 pin 44 has a fourth protrusion 441 on the side facing the VBUS shorting connector 5, and the B9 pin 44 is tightly pressed and fitted with the VBUS shorting connector 5 through the fourth protrusion 441.

[0080] Furthermore, the VBUS short-circuit connecting piece 5 is also provided with a second positioning through hole 52 for limiting the third protrusion 341 and the fourth protrusion 441, and the front ends of the third protrusion 341 and the fourth protrusion 441 are respectively pressed into the two ends of the second positioning through hole 52.

[0081] In this application, the A9pin 34 and B9pin 44 are pressed and connected to the VBUS short-circuit connector 5 through the convex hull, and the front end of the convex hull is limited by the through hole opened in the VBUS short-circuit connector 5, which ensures the stability of the connection and achieves the effect of transmitting 5A high current without overheating.

[0082] Furthermore, the A1pin 32 and B1pin 42 are arranged vertically opposite each other, and the GND shorting connector 6 is located between the A1pin 32 and B1pin 42. The A1pin 32 has a fifth protrusion 321 on the side facing the GND shorting connector 6, and the GND shorting connector 6 is tightly pressed together with the GND shorting connector 6 through the fifth protrusion 321. The B1pin 42 has a sixth protrusion 421 on the side facing the GND shorting connector 6, and the B1pin 42 is tightly pressed together with the GND shorting connector 6 through the sixth protrusion 421.

[0083] Furthermore, the GND short-circuit connector 6 is also provided with a third positioning through hole 61 for limiting the fifth protrusion 321 and the sixth protrusion 421, and the front ends of the fifth protrusion 321 and the sixth protrusion 421 are respectively pressed into the two ends of the third positioning through hole 61.

[0084] In this application, pins A132 and B124 are pressed and connected to the GND short-circuit connector 6 through a convex hull, and the front end of the convex hull is limited by the through hole opened in the GND short-circuit connector 6, which ensures the stability of the connection, ensures that it does not get hot when transmitting a 5A high current, and ensures good resistance to ground, thereby improving the transmission stability.

[0085] Furthermore, the A12 pin 35 and B12 pin 45 are arranged vertically opposite each other, and the GND shorting connector 6 is located between the A12 pin 35 and the B12 pin 45. The A12 pin 35 has a seventh protrusion 351 on the side facing the GND shorting connector 6, and the GND shorting connector 6 is tightly pressed together with the GND shorting connector 6 through the seventh protrusion 351. The B12 pin 45 has an eighth protrusion 451 on the side facing the GND shorting connector 6, and the B12 pin 45 is tightly pressed together with the GND shorting connector 6 through the eighth protrusion 451.

[0086] Furthermore, the GND short-circuit connector 6 is also provided with a fourth positioning through hole 62 for limiting the seventh protrusion 351 and the eighth protrusion 451, and the front ends of the seventh protrusion 351 and the eighth protrusion 451 are respectively pressed into the two ends of the fourth positioning through hole 62.

[0087] In this application, the A12pin 35 and B12pin 45 are pressed and connected to the GND short-circuit connector 6 through the convex hull, and the front end of the convex hull is limited by the through hole opened in the GND short-circuit connector 6 to ensure the stability of the connection.

[0088] Furthermore, the B-group pin core 41 is provided with an E-MARKER pad groove 411 for mounting the E-MARKER chip.

[0089] Furthermore, the GND short-circuit connector 6 has a chip GND pin 63, the B group pins 4 include a B5 pin 46, the B5 pin 46 has a VCONN1 pin 461 and a VCONN2 pin 462, there is also a CC1 pad 7 between the A group pin core 31 and the B group pin core 41, the CC1 pad 7 has a CC1 pin 71, and the chip GND pin 63, VCONN1 pin 461, VCONN2 pin 462 and CC1 pin 71 are all located in the E-MARKER pad groove 411. The above structure design allows for the creation of reserved pins that can be soldered in accordance with the soldering method on the PCB board for soldering E-MARKER chips. When installing the E-MARKER chip, it can connect to the chip's GND pin 63, VCONN1 pin 461, VCONN2 pin 462, and CC1 pin 71 within the E-MARKER pad slot 411, enabling high-speed transmission of the TYPE-C male connector. Furthermore, through the soldering of the E-MARKER chip, it achieves full functionality requirements including USB 3.1, USB 4.0, Thunderbolt 5, audio and video transmission, and 240W high-current charging, overcoming the limitations of existing high-frequency soldered TYPE-C connectors with low functional versions.

[0090] Furthermore, the B-group pin core 41 is provided with a capacitor pad groove 412 for mounting ceramic capacitors.

[0091] Furthermore, the capacitor pad slot 412 is formed on the B-group pin core 41, the B4 pin 43 has a capacitor VBUS pin 432, and the GND shorting connector 6 has a capacitor GND pin 64. Both the capacitor VBUS pin 432 and the capacitor GND pin 64 are located within the capacitor pad slot 412. This structural design allows for the formation of reserved pins, consistent with the soldering method on the PCB board, for soldering ceramic capacitors. When installing ceramic capacitors, they can connect to the reserved capacitor VBUS pin 432 and capacitor GND pin 64 within the capacitor pad slot 412, assisting the TYPE-C male connector in achieving high-speed transmission, improving the connector's high-frequency performance, ensuring better high-frequency testing, and meeting the high-frequency transmission requirements of TYPE-C 3.1 / 3.0.

[0092] Type-C 3.1 / 3.0 connectors typically require various electronic components within their male connectors to meet the demands of high-speed signal transmission and high current. These components include E-Marker chips and ceramic capacitors. Existing technologies generally use PCB boards to house and mount these components. In this embodiment, omitting the PCB board, a crucial issue is how to perfectly relocate these electronic components from the PCB board into the male connector. Therefore, this embodiment achieves this by creating slots in the B-group pin core 41 to mount the E-Marker chip and ceramic capacitors. This, combined with the GND shorting connector 6 and the individual pins, enables the E-Marker chip and ceramic capacitors to seamlessly integrate with the A-group and B-group pins, ensuring the high-speed signal transmission and high-current capabilities of the Type-C 3.1 / 3.0 connector.

[0093] Furthermore, the A-group pins 3 also include A2 pins 36, A3 pins 37, A5 pins 38, A6 pins 39, A7 pins 310, A8 pins 320, A10 pins 330, and A11 pins 340. The A1 pins 32, A2 pins 36, A3 pins 37, A4 pins 33, A5 pins 38, A6 pins 39, A7 pins 310, A8 pins 320, A9 pins 34, A10 pins 330, A11 pins 340, and A12 pins 35 are arranged sequentially and integrally injection molded with the A-group pin core 31.

[0094] Furthermore, the B group pin 4 also includes B2 pin 47, B3 pin 48, B8 pin 49, B10 pin 410, and B11 pin 420. The B1 pin 42, B2 pin 47, B3 pin 48, B4 pin 43, B5 pin 46, B8 pin 49, B9 pin 44, B10 pin 410, B11 pin 420, and B12 pin 45 are arranged in sequence and integrally injection molded with the B group pin core 41.

[0095] Furthermore, the A-group pin core 31 has a first solder pre-embedded groove 311 on the side opposite to the B-group pin core 41.

[0096] Furthermore, the A1 pin 32, A2 pin 36, A3 pin 37, A4 pin 33, A5 pin 38, A6 pin 39, A7 pin 310, A8 pin 320, A9 pin 34, A10 pin 330, A11 pin 340, and A12 pin 35 extend into the first solder pre-embedded groove 311.

[0097] Furthermore, the B-group pin core 41 has a second solder pre-embedded groove 413 on the side opposite to the A-group pin core 31.

[0098] Furthermore, the B1 pin 42, B2 pin 47, B3 pin 48, B4 pin 43, B5 pin 46, B8 pin 49, B9 pin 44, B10 pin 410, B11 pin 420, and B12 pin 45 extend into the second solder pre-embedded groove 413.

[0099] In this application, the solder pre-embedded tank includes a first solder pre-embedded tank 311 and a second solder pre-embedded tank 413. Solder wire for welding can be pre-embedded in the first solder pre-embedded tank 311 and the second solder pre-embedded tank 413. By pre-embedding the solder wire, the welding requirements of high-frequency welding machines and fully automatic high-frequency welding machines are met, eliminating the need for manual soldering and enabling high-frequency, rapid welding between pins of group A and group B and the wire, significantly improving welding efficiency. The combination of pre-embedded solder wire and high-frequency welding can be applied to automatic high-frequency welding machines, improving the overall process yield.

[0100] Furthermore, both the VBUS short-circuit connector 5 and the GND short-circuit connector 6 are made of highly conductive and thermally conductive materials, which further improves current transmission efficiency, reduces heat generation, ensures long-term stable transmission of 5A high current, and extends the service life of the connector.

[0101] Furthermore, the A-group pin core 31 and the B-group pin core 41 are made of PBT material with high temperature resistance and excellent insulation performance, preferably LCP material, which is suitable for the high temperature environment of high frequency welding (PBT material is suitable for 260-280℃, and LCP material is suitable for 300℃), to avoid deformation and damage of the core during welding, and at the same time improve the overall insulation performance of the connector and prevent short circuit faults.

[0102] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A 22-pin Type-C male connector that is convenient for high-frequency soldering, characterized in that, include: Group A pins, comprising: Group A pin core, A1 pin, A4 pin, A9 pin, and A12 pin, wherein the A1 pin, A4 pin, A9 pin, and A12 pin are fixedly mounted on the Group A pin core. Group B pins, comprising: Group B pin core, B1 pin, B4 pin, B9 pin, and B12 pin, wherein the B1 pin, B4 pin, B9 pin, and B12 pin are fixedly mounted on the Group B pin core. VBUS short-circuit connector with conductive properties; A conductive GND short-circuit connector; The A group of pin cores and the B group of pin cores are arranged vertically opposite each other. The VBUS short-circuit connector is disposed between the A group pin core and the B group pin core. The A4 pin and the B4 pin are connected by the VBUS short-circuit connector, and the A9 pin and the B9 pin are connected by the VBUS short-circuit connector, so that the A4 pin, B4 pin, B9 pin and A9 pin are short-circuited to form VBUS pins. The GND short-circuit connectors are all located between the A-group pin cores and the B-group pin cores. The A1 pin and the B1 pin are connected by the GND short-circuit connectors, and the A12 pin and the B12 pin are connected by the GND short-circuit connectors, so that the A1 pin, B1 pin, B12 pin, and A12 pin are short-circuited to form the GND pin. The A-group pin core and / or B-group pin core are also provided with solder pre-embedded grooves to assist in high-speed welding of the pins to the wire.

2. The 22-pin Type-C male connector for convenient high-frequency soldering as described in claim 1, characterized in that, The A4 pin and B4 pin are arranged vertically opposite each other. The VBUS shorting connector is located between the A4 pin and the B4 pin. The A4 pin has a first protrusion on the side facing the VBUS shorting connector. The VBUS shorting connector is tightly pressed against the VBUS shorting connector through the first protrusion. The B4 pin has a second protrusion on the side facing the VBUS shorting connector. The B4 pin is tightly pressed against the VBUS shorting connector through the second protrusion. The VBUS short-circuit connector is also provided with a first positioning through hole for limiting the first convex bud and the second convex bud. The front ends of the first convex bud and the second convex bud are respectively pressed into the two ends of the first positioning through hole.

3. A 22-pin Type-C male connector for convenient high-frequency soldering as described in claim 1, characterized in that, The A9 pin and B9 pin are arranged vertically opposite each other. The VBUS shorting connector is located between the A9 pin and the B9 pin. The A9 pin has a third protrusion on the side facing the VBUS shorting connector. The VBUS shorting connector is tightly pressed against the VBUS shorting connector through the third protrusion. The B9 pin has a fourth protrusion on the side facing the VBUS shorting connector. The B9 pin is tightly pressed against the VBUS shorting connector through the fourth protrusion. The VBUS short-circuit connector is also provided with a second positioning through hole for limiting the third and fourth protrusions. The front ends of the third and fourth protrusions are respectively pressed into the two ends of the second positioning through hole.

4. A 22-pin Type-C male connector for convenient high-frequency soldering as described in claim 1, characterized in that, The A1 pin and B1 pin are arranged vertically opposite each other. The GND shorting connector is located between the A1 pin and the B1 pin. The A1 pin has a fifth protrusion on the side facing the GND shorting connector. The GND shorting connector is tightly pressed against the GND shorting connector through the fifth protrusion. The B1 pin has a sixth protrusion on the side facing the GND shorting connector. The B1 pin is tightly pressed against the GND shorting connector through the sixth protrusion. The GND short-circuit connector is also provided with a third positioning through hole for limiting the fifth and sixth protrusions. The front ends of the fifth and sixth protrusions are respectively pressed into the two ends of the third positioning through hole.

5. A 22-pin Type-C male connector for convenient high-frequency soldering as described in claim 1, characterized in that, The A12 pin and B12 pin are arranged vertically opposite each other. The GND shorting connector is located between the A12 pin and the B12 pin. The A12 pin has a seventh protrusion on the side facing the GND shorting connector. The GND shorting connector is tightly pressed against the GND shorting connector through the seventh protrusion. The B12 pin has an eighth protrusion on the side facing the GND shorting connector. The B12 pin is tightly pressed against the GND shorting connector through the eighth protrusion. The GND short-circuit connector is also provided with a fourth positioning through hole for limiting the seventh and eighth protrusions. The front ends of the seventh and eighth protrusions are respectively pressed into the two ends of the fourth positioning through hole.

6. A 22-pin Type-C male connector for convenient high-frequency soldering as described in claim 1, characterized in that, The A-group pin core and / or B-group pin core are provided with E-MARKER pad grooves for mounting E-MARKER chips.

7. A 22-pin Type-C male connector for convenient high-frequency soldering as described in claim 6, characterized in that, The E-MARKER pad slot is located on the B-group pin core. The GND shorting connector has a chip GND pin. The B-group pin includes a B5 pin, which has a VCONN1 pin and a VCONN2 pin. There is also a CC1 pad between the A-group pin core and the B-group pin core. The CC1 pad has a CC1 pin. The chip GND pin, VCONN1 pin, VCONN2 pin, and CC1 pin are all located within the E-MARKER pad slot.

8. A 22-pin Type-C male connector for convenient high-frequency soldering as described in claim 1, characterized in that, The A-group pin core and / or B-group pin core are provided with capacitor pad grooves for mounting ceramic capacitors.

9. A 22-pin Type-C male connector for convenient high-frequency soldering as described in claim 8, characterized in that, The capacitor pad slot is formed on the B group pin core. The B4 pin has a capacitor VBUS pin. The GND shorting connector has a capacitor GND pin. Both the capacitor VBUS pin and the capacitor GND pin are located in the capacitor pad slot.

10. A 22-pin Type-C male connector for convenient high-frequency soldering as described in claim 1, characterized in that, The A-group pin core has a first solder pre-embedded groove on the side opposite to the B-group pin core. The B-group pin core has a second solder pre-embedded groove on the side opposite to the A-group pin core.

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