Gas-insulated totally-enclosed ring main unit self-cooling system

Abstract

The invention relates to the technical field of ring main units, and provides a gas-insulated totally-enclosed ring main unit self-cooling system which comprises a cabinet body, a rear cover is fixedly mounted on one side of the cabinet body, a cabinet door is hinged to the other side of the cabinet body, and a panel is fixed to the side, close to the cabinet door, in the cabinet body. By arranging the heat dissipation structure, the semiconductor chilling plate is externally connected with a power source, the side, close to the drainage plate, of the semiconductor chilling plate is refrigerated, heat in the cabinet body is rapidly cooled under the action of the drainage plate, and heat generated by the other side of the semiconductor chilling plate is transmitted to the rear cover through the heat conduction plate; heat is quickly dissipated under the action of heat dissipation fins on the outer wall of the rear cover, water drops condensed on the surface of a drainage plate can drop into the collection box through a water inlet under isolation of an isolation plate, water in the collection box can be regularly discharged through a drainage pipe, and the situation that water makes contact with electronic elements to cause short circuit is avoided; therefore, the safety of the gas-insulated totally-enclosed ring main unit self-cooling system in use is improved.

Description

Technical Field

[0001] This invention relates to the field of ring main unit technology, and in particular to a gas-insulated, fully enclosed ring main unit self-heating system. Background Technology

[0002] Gas-insulated fully enclosed ring main units (RMMs) are core equipment in power distribution networks and are widely used in substations at load centers such as urban residential areas, large public buildings, and factories. They are filled with insulating gases such as SF6 to ensure insulation performance under high-voltage environments and must be completely sealed to prevent leakage of toxic gases or moisture intrusion. However, the electrical components inside the RMM continuously generate heat during operation. If heat accumulates and the temperature becomes too high, it will not only reduce the insulation performance of the SF6 gas but also increase the risk of electrical short circuits, mechanical jamming, and other faults. In severe cases, it can lead to power outages, directly threatening the stable operation of the power grid. Therefore, a self-cooling system for gas-insulated fully enclosed RMMs is used. To address this, patent CN214706802U discloses a heat dissipation device for a gas-insulated switchgear and a heat dissipation system for gas-insulated switchgear. The heat dissipation device is installed on the gas box of the gas-insulated switchgear. The gas box contains multiple reinforcing ribs, which are tubular structures. These reinforcing ribs are connected in series via pipe assemblies to form a fluid circulation heat dissipation structure. The two ends of this fluid circulation heat dissipation structure are respectively provided with a fluid outlet pipe and a fluid inlet pipe. The heat dissipation system for the gas-insulated switchgear includes multiple gas boxes, each equipped with a heat dissipation device. The fluid circulation heat dissipation structures on the multiple gas boxes are connected by inter-box connecting pipes. The internal pipes of this invention also function as reinforcing ribs, reducing the cost of the heat dissipation device. This heat dissipation device significantly improves the heat dissipation efficiency of gas-insulated switchgear without affecting the gas box's sealing performance or increasing costs. The aforementioned gas insulation cabinet heat dissipation device utilizes the existing side wall reinforcing ribs inside the gas box as pipes and connects each pipe through external connecting fittings to form an external circulating heat dissipation system that allows the flow of low-temperature fluid to quickly remove heat from the gas box and its interior. However, when high-temperature gas encounters low-temperature pipes, water droplets easily condense on the outer wall of the pipes, causing short circuits between electronic components inside the gas box and resulting in low safety. Summary of the Invention

[0003] The purpose of this invention is to provide a gas-insulated, fully enclosed ring main unit self-heating system to solve the defects of existing gas-insulated, fully enclosed ring main unit self-heating systems, such as easy condensation and low safety.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a gas-insulated fully enclosed ring main unit self-heating system, including a cabinet; A back cover is fixedly installed on one side of the cabinet, and a cabinet door is hinged to the other side of the cabinet. A panel is fixed inside the cabinet on the side near the cabinet door. A heat-conducting plate is fixed on the inner wall of the rear cover, and a sealing structure is provided on the outer side of the heat-conducting plate; A heat dissipation structure is fixed on the side of the heat-conducting plate away from the back cover. The heat dissipation structure includes a thermoelectric cooler fixed to one side of the heat-conducting plate. A flow guide plate is uniformly fixed on one side of the thermoelectric cooler. A collection box is fixed at the bottom of one side of the thermoelectric cooler. An isolation plate is provided on one side of the flow guide plate above the collection box. A fixing post is uniformly fixed on one side of the isolation plate.

[0005] This device uses a heat dissipation structure to rapidly cool the heat inside the cabinet, while simultaneously isolating and collecting the water droplets generated during rapid cooling. This prevents water droplets from contacting electronic components and causing short circuits, thus improving the safety of the device during use. The sealing structure enhances the seal between the back cover and the cabinet. The cabinet is filled with insulating gas, which increases the internal air pressure. The compression of the first air chamber forces the gas inside the first air chamber into the second air chamber through the connecting hole, causing the sealing strip to expand and increasing the contact area between the sealing strip and the cabinet, further enhancing the sealing performance of the device.

[0006] Preferably, an air inlet pipe is fixed to one side of the top of the cabinet, an inlet cable is uniformly fixed to one side of the top of the cabinet, and heat dissipation fins are uniformly fixed to the outer wall of the rear cover.

[0007] Preferably, the cabinet door has observation windows evenly spaced inside, and each observation window has a glass plate fixed inside.

[0008] Preferably, an instrument panel is uniformly fixedly installed on one side of the panel, and the instrument panel is located in the middle of the observation window.

[0009] Preferably, the flow guide plates are evenly distributed in an inverted "8" shape on one side of the semiconductor cooling chip, and one end of the fixing post is fixedly connected to one side of the semiconductor cooling chip.

[0010] Preferably, a water inlet is provided on one side of the top of the collection box, and a drain pipe is fixed on one side of the collection box.

[0011] Preferably, the water inlet is located below the lowest point of the diversion plate, and one end of the drain pipe extends to the outside of the cabinet.

[0012] Preferably, the sealing structure includes a sealing strip disposed on the outside of the heat-conducting plate, a first air chamber is disposed on one side of the inside of the sealing strip, a second air chamber is disposed on the other side of the inside of the sealing strip, and connecting holes are uniformly disposed on one side of the second air chamber inside the sealing strip.

[0013] Preferably, the outer wall of the sealing strip abuts against the inner wall of the cabinet, and the second air cavity is located on the outer side of the heat-conducting plate.

[0014] Preferably, one end of the connecting hole extends into the interior of the first air chamber, and the first air chamber and the second air chamber are connected through the connecting hole.

[0015] The present invention provides a gas-insulated, fully enclosed ring main unit self-heating system, the advantages of which are: By incorporating a heat dissipation structure, the thermoelectric cooler is connected to an external power supply. The side of the thermoelectric cooler closest to the heat sink plate is cooled, and the heat inside the cabinet is rapidly reduced by the heat sink plate. The heat generated on the other side of the thermoelectric cooler is transferred to the rear cover through a heat conduction plate, where it is rapidly dissipated by the heat dissipation fins on the outer wall of the rear cover. Under the isolation of the isolation plate, the water droplets condensed on the surface of the heat sink plate will drip into the inside of the collection box through the water inlet. The water inside the collection box can be drained periodically through the drain pipe to prevent water from contacting electronic components and causing short circuits. This improves the safety of the gas-insulated fully enclosed ring main unit's self-heating system during use. By setting a sealing structure, the sealing strip is snapped onto the outside of the heat-conducting plate, and the back cover is fixed to one side of the cabinet by bolts. Under the action of the sealing strip, the sealing between the back cover and the cabinet is enhanced. Furthermore, insulating gas is injected into the cabinet through the air inlet pipe, increasing the air pressure inside the cabinet. The first air chamber is compressed, causing the gas inside the first air chamber to enter the second air chamber through the connecting hole. Under the expansion of the second air chamber, the sealing between the cabinet and the heat-conducting plate is enhanced, thereby improving the safety of the gas-insulated fully enclosed ring main unit self-heating system during use. Attached Figure Description

[0016] Figure 1 This is a front view schematic diagram of the present invention; Figure 2 This is a schematic diagram of the unfolded state of the present invention; Figure 3 This is a schematic diagram of the first perspective of the front cross-section of the present invention; Figure 4 This is a schematic diagram of the second perspective of the main cross-section of the present invention; Figure 5 This is a side cross-sectional view of the present invention; Figure 6 For the present invention Figure 5 Enlarged view of point A in the middle; Figure 7 This is a partial cross-sectional schematic diagram of the sealing structure of the present invention; Figure 8 This is a schematic diagram of the heat dissipation structure of the present invention; Figure 9This is an exploded view of the heat dissipation structure of the present invention; Figure 10 For the present invention Figure 9 Enlarged diagram of point B in the middle.

[0017] The following are the annotations in the diagram: 1. Cabinet; 11. Air inlet pipe; 12. Cable inlet pipe; 2. Rear cover; 21. Heat conduction plate; 3. Cabinet door; 31. Observation window; 4. Panel; 41. Instrument panel; 5. Heat dissipation structure; 51. Semiconductor cooling chip; 52. Drain plate; 53. Isolation plate; 54. Collection box; 541. Water inlet; 542. Drain pipe; 55. Fixing column; 6. Sealing structure; 61. Sealing strip; 62. First air chamber; 63. Second air chamber; 64. Connection hole. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Please see Figures 1-10 The present invention provides a gas-insulated fully enclosed ring main unit self-heating system, including a cabinet 1.

[0020] Reference Figures 5-7 As shown, a back cover 2 is fixedly installed on one side of cabinet 1, and a cabinet door 3 is hinged to the other side of cabinet 1. An air inlet pipe 11 is fixed to one side of the top of cabinet 1, and inlet pipes 12 are evenly fixed to one side of the top of cabinet 1. Heat dissipation fins are evenly fixed to the outer wall of the back cover 2. Observation windows 31 are evenly opened inside the cabinet door 3, and glass plates are fixed inside each observation window 31. A panel 4 is fixed to the side of the cabinet 1 near the cabinet door 3, and an instrument panel 41 is evenly fixed to one side of the panel 4. The instrument panel 41 is located in the middle of the observation window 31. A heat-conducting plate 21 is fixed to the inner wall of the back cover 2. A sealing structure 6 is provided on the outer side of the heat-conducting plate 21. The sealing structure 6 includes a sealing strip 61 provided on the outer side of the heat-conducting plate 21. A first air chamber 62 is provided on one side of the interior of the sealing strip 61, and a second air chamber 63 is provided on the other side of the interior of the sealing strip 61. Connection holes 64 are evenly provided on one side of the second air chamber 63 inside the sealing strip 61. The outer wall of the sealing strip 61 abuts against the inner wall of the cabinet 1. The second air chamber 63 is located on the outer side of the heat-conducting plate 21. One end of the connection hole 64 extends into the interior of the first air chamber 62. The first air chamber 62 and the second air chamber 63 are connected through the connection hole 64.

[0021] The sealing strip 61 is snapped onto the outside of the heat-conducting plate 21, and the back cover 2 is fixedly installed on one side of the cabinet 1 by bolts. Under the action of the sealing strip 61, the sealing between the back cover 2 and the cabinet 1 is enhanced. Insulating gas is injected into the cabinet 1 through the air inlet pipe 11, and the air pressure inside the cabinet 1 increases. The first air chamber 62 is squeezed, and the gas inside the first air chamber 62 enters the second air chamber 63 through the connecting hole 64. Under the expansion of the second air chamber 63, the sealing between the cabinet 1 and the heat-conducting plate 21 is enhanced.

[0022] Reference Figure 3 and Figures 8-10 As shown, a heat dissipation structure 5 is fixed on the side of the heat-conducting plate 21 away from the back cover 2. The heat dissipation structure 5 includes a semiconductor cooling chip 51 fixed on one side of the heat-conducting plate 21. A flow guide plate 52 is uniformly fixed on one side of the semiconductor cooling chip 51. A collection box 54 is fixed at the bottom of one side of the semiconductor cooling chip 51. An isolation plate 53 is provided on one side of the flow guide plate 52 above the collection box 54. A fixing post 55 is uniformly fixed on one side of the isolation plate 53. The flow guide plate 52 is evenly distributed in an inverted "V" shape on one side of the semiconductor cooling chip 51. One end of the fixing post 55 is fixedly connected to one side of the semiconductor cooling chip 51. A water inlet 541 is opened on one side of the top of the collection box 54. A drain pipe 542 is fixed on one side of the collection box 54. The water inlet 541 is located below the lowest point of the flow guide plate 52. One end of the drain pipe 542 extends to the outside of the cabinet 1.

[0023] The thermoelectric cooler 51 is connected to an external power supply. The side of the thermoelectric cooler 51 closest to the heat sink 52 is cooled. The heat inside the cabinet 1 is rapidly cooled down by the heat sink 52. The heat generated on the other side of the thermoelectric cooler 51 is transferred to the back cover 2 through the heat conduction plate 21. The heat is rapidly dissipated by the heat dissipation fins on the outer wall of the back cover 2. Under the isolation of the isolation plate 53, the water droplets condensed on the surface of the heat sink 52 will drip into the inside of the collection box 54 through the water inlet 541. The water inside the collection box 54 can be drained periodically through the drain pipe 542 to prevent water from contacting electronic components and causing a short circuit.

[0024] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A gas-insulated fully enclosed ring main unit self-heating system, comprising a cabinet (1); Its features are: A back cover (2) is fixedly installed on one side of the cabinet (1), and a cabinet door (3) is hinged on the other side of the cabinet (1). A panel (4) is fixed inside the cabinet (1) on the side near the cabinet door (3). A heat-conducting plate (21) is fixed on the inner wall of the rear cover (2), and a sealing structure (6) is provided on the outer side of the heat-conducting plate (21). A heat dissipation structure (5) is fixed on the side of the heat-conducting plate (21) away from the back cover (2). The heat dissipation structure (5) includes a semiconductor cooling chip (51) fixed on one side of the heat-conducting plate (21). A flow guide plate (52) is uniformly fixed on one side of the semiconductor cooling chip (51). A collection box (54) is fixed at the bottom of one side of the semiconductor cooling chip (51). An isolation plate (53) is provided on one side of the flow guide plate (52) above the collection box (54). A fixing column (55) is uniformly fixed on one side of the isolation plate (53).

2. The gas-insulated fully enclosed ring main unit self-heating system according to claim 1, characterized in that: An air inlet pipe (11) is fixed on one side of the top of the cabinet (1), an inlet pipe (12) is evenly fixed on one side of the top of the cabinet (1), and heat dissipation fins are evenly fixed on the outer wall of the rear cover (2).

3. The gas-insulated fully enclosed ring main unit self-heating system according to claim 1, characterized in that: The cabinet door (3) has observation windows (31) evenly spaced inside, and each observation window (31) has a glass plate fixed inside.

4. The gas-insulated fully enclosed ring main unit self-heating system according to claim 1, characterized in that: An instrument panel (41) is uniformly fixedly installed on one side of the panel (4), and the instrument panel (41) is located in the middle of the observation window (31).

5. The gas-insulated fully enclosed ring main unit self-heating system according to claim 1, characterized in that: The diversion plates (52) are evenly distributed in an inverted "8" shape on one side of the semiconductor cooling chip (51), and one end of the fixing post (55) is fixedly connected to one side of the semiconductor cooling chip (51).

6. The gas-insulated fully enclosed ring main unit self-heating system according to claim 1, characterized in that: The collection box (54) has a water inlet (541) on one side of its top, and a drain pipe (542) is fixed on one side of the collection box (54).

7. The gas-insulated fully enclosed ring main unit self-heating system according to claim 6, characterized in that: The inlet (541) is located below the lowest point of the diversion plate (52), and one end of the drain pipe (542) extends to the outside of the cabinet (1).

8. The gas-insulated fully enclosed ring main unit self-heating system according to claim 1, characterized in that: The sealing structure (6) includes a sealing strip (61) disposed on the outside of the heat-conducting plate (21). A first air chamber (62) is disposed on one side of the inside of the sealing strip (61), and a second air chamber (63) is disposed on the other side of the inside of the sealing strip (61). A connecting hole (64) is uniformly disposed on one side of the second air chamber (63) inside the sealing strip (61).

9. A gas-insulated, fully enclosed ring main unit self-heating system according to claim 8, characterized in that: The outer wall of the sealing strip (61) abuts against the inner wall of the cabinet (1), and the second air cavity (63) is located on the outside of the heat-conducting plate (21).

10. A gas-insulated, fully enclosed ring main unit self-heating system according to claim 8, characterized in that: One end of the connecting hole (64) extends into the interior of the first air chamber (62), and the first air chamber (62) and the second air chamber (63) are connected through the connecting hole (64).

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