86-type high-power wireless AP (Access Point) equipment

Abstract

The invention provides 86-type high-power wireless AP equipment. The 86-type high-power wireless AP equipment comprises a functional mainboard and a power conversion board, wherein a power supply circuit on the power supply conversion board comprises a protection circuit module, a PD interface control module and a power supply conversion module, the PD interface control module comprises a first chip used for realizing a PD protocol-based function, and the power supply conversion module comprises a second chip used for realizing conversion from high voltage to low voltage. Cooling fins connected with the shell are arranged on the surfaces of key power components in a power circuit on the power conversion board. Compared with the prior art, the invention has the following beneficial effects: in order to improve the power supply conversion efficiency and reduce the loss, the power supply circuit on the power supply conversion board does not adopt an integrated PD chip, two chips (a PD interface control chip and an efficient synchronous rectification Buck integrated chip) with high efficiency, small size and few peripheral devices are selected for circuit design, the two chips can dissipate heat separately, and the power supply conversion efficiency is improved; therefore, the risk of heat concentration of a single chip is reduced.

Description

Technical Field

[0001] This invention relates to the field of wireless AP equipment technology, and in particular to an 86-type high-power wireless AP equipment. Background Technology

[0002] To improve the portability of wireless access points (APs), PoE (Power over Ethernet) powered wireless APs can be installed in enclosed spaces similar in size to an 86-type box. However, existing wireless APs installed in 86-type boxes generally suffer from the following technical drawbacks:

[0003] 1. Power limitation: Most products on the market have a power of 3~5W, and serious heat dissipation problems will occur when the power exceeds 10W;

[0004] 2. Insufficient heat dissipation: Traditional solutions rely on natural convection, which results in high temperature rise in enclosed spaces.

[0005] 3. Structural defects: The stacked layout of the motherboard and power board leads to thermal coupling effect. Summary of the Invention

[0006] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide an 86-type high-power wireless AP device to solve the problems of power limitation, insufficient heat dissipation and structural defects in the existing technology.

[0007] To achieve the above and other related objectives, the present invention provides the following technical solution:

[0008] A high-power wireless AP device of type 86 includes a housing, the housing including a first protective shell and a second protective shell mounted on the first protective shell, the first protective shell is equipped with a functional motherboard for realizing wireless access of the core of the device, and the second protective shell is equipped with a power conversion board for realizing high voltage to low voltage conversion and powering the functional motherboard and arranged parallel to the functional motherboard.

[0009] The power circuit on the power conversion board includes a protection circuit module, a PD interface control module connected to the protection circuit module, and a power conversion module connected to both the protection circuit module and the PD interface control module. The PD interface control module includes a first chip for implementing PD protocol-based functions, and the power conversion module includes a second chip for implementing high-voltage to low-voltage conversion. The surfaces of the key power components in the power circuit on the power conversion board are provided with heat sinks connected to the housing.

[0010] In one embodiment of the present invention, the functional circuit on the functional motherboard includes a network processor, two PHY modules for sending and receiving Ethernet data frames, a WiFi module, two FEM modules for processing radio frequency signal transmission and reception, two antenna combiners, and two radio frequency antenna interfaces connected to the antenna combiners; the network processor is connected to the power circuit on the power conversion board through the two PHY modules, the network processor is connected to the two radio frequency antenna interfaces through the two antenna combiners respectively, and the network processor is also connected to the two antenna combiners through the WiFi module and the two FEM modules respectively.

[0011] In one embodiment of the present invention, the power circuit on the power conversion board further includes two network connectors, a first transformer, and a second transformer; one port of one of the network connectors is connected to a user terminal device via a network cable, the other port of one of the network connectors is connected to a functional circuit on the functional motherboard via the first transformer, one port of the other network connector is connected to a PoE switch via a network cable, the other port of the other network connector is also connected to a functional circuit on the functional motherboard via the second transformer, and the second transformer is also connected to the protection circuit module.

[0012] In one embodiment of the present invention, the protection circuit module includes a reverse connection protection submodule connected to the second transformer and a filter submodule connected to the reverse connection protection submodule; the reverse connection protection submodule includes a first bridge rectifier circuit, a second bridge rectifier circuit, and a transient voltage suppressor diode; the first pins of the first bridge rectifier circuit and the second bridge rectifier circuit are connected to one end of the transient voltage suppressor diode and the filter submodule, respectively; the fourth pins of the first bridge rectifier circuit and the second bridge rectifier circuit are connected to the other end of the transient voltage suppressor diode and the filter submodule, respectively; the second pins and the third pins of the first bridge rectifier circuit and the second bridge rectifier circuit are both connected to the second transformer; and both ends of the transient voltage suppressor diode are also connected to the filter submodule.

[0013] In one embodiment of the present invention, the filtering submodule includes a dual-mode inductor, a first inductor, and a plurality of capacitors for filtering. The first and second pins of the dual-mode inductor are both connected to the reverse connection protection submodule. The third pin of the dual-mode inductor is connected to one end of the first inductor. The other end of the first inductor is connected to the PD interface control module and the power conversion module, respectively. The fourth pin of the dual-mode inductor is also connected to the PD interface control module.

[0014] In one embodiment of the present invention, the first chip is a PD interface control chip with model number MP8003AGQ-Z. The power port and eight control terminals of the first chip are all connected to the filter submodule. Two of the eight control terminals of the first chip are connected to the second chip through resistors.

[0015] In one embodiment of the present invention, the power conversion module further includes a second inductor and a plurality of capacitors for filtering. The second chip is a high-efficiency synchronous rectification Buck integrated chip with model number MP9572GQB-Z. The input terminal of the second chip is connected to the filtering submodule. Two of the control terminals of the second chip are connected to the first chip through equalizing resistors. One of the control terminals of the second chip is connected to one end of the second inductor through a capacitor. The other end of the second inductor is connected to the functional circuit on the functional motherboard.

[0016] As described above, the 86-type high-power wireless AP device of the present invention has the following beneficial effects:

[0017] This invention installs the functional motherboard and power conversion board of the wireless AP device separately inside the first and second protective shells. This layered layout of the power board and motherboard within the shell avoids heat accumulation, thus solving the problem of thermal coupling caused by stacked motherboard and power board layouts. Furthermore, to improve power conversion efficiency and reduce losses, the power circuit on the power conversion board does not use an integrated PD chip. Instead, it uses two high-efficiency, small-sized chips (PD interface control chip + high-efficiency synchronous rectification Buck integrated chip) with fewer external components. These two chips can dissipate heat, reducing the risk of heat concentration on a single chip. Finally, by adding heat sinks to key power components and fitting them to the shell for heat dissipation, this invention effectively reduces the operating temperature of components on the power board within the sealed casing, thereby improving product reliability and ensuring compliance with specifications. Attached Figure Description

[0018] Figure 1 This is a top view schematic diagram of the 86-type high-power wireless AP device disclosed in an embodiment of the present invention;

[0019] Figure 2 This is a front view schematic diagram of the 86-type high-power wireless AP device disclosed in an embodiment of the present invention;

[0020] Figure 3 This is a right-side view of the 86-type high-power wireless AP device disclosed in an embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the overall structure of the functional motherboard and power conversion board in the 86-type high-power wireless AP device disclosed in this embodiment of the invention;

[0022] Figure 5 This is a schematic diagram of the overall structure of the power conversion board in the 86-type high-power wireless AP device disclosed in this embodiment of the invention;

[0023] Figure 6 This is a circuit diagram of the protection circuit module in the 86-type high-power wireless AP device disclosed in this embodiment of the invention;

[0024] Figure 7 This is a circuit diagram of the anti-reverse connection submodule in the 86-type high-power wireless AP device disclosed in this embodiment of the invention;

[0025] Figure 8 This is a circuit diagram of the filtering submodule in the 86-type high-power wireless AP device disclosed in this embodiment of the invention;

[0026] Figure 9 This is a circuit diagram of the PD interface control module and power conversion module in the 86-type high-power wireless AP device disclosed in this embodiment of the invention.

[0027] Figure 10 This is a circuit diagram of the PD interface control module in the 86-type high-power wireless AP device disclosed in this embodiment of the invention.

[0028] Figure 11 This is a circuit diagram of the power conversion module in the 86-type high-power wireless AP device disclosed in this embodiment of the invention;

[0029] Figure 12 This is a schematic diagram showing that the average power conversion efficiency of the 86-type high-power wireless AP device disclosed in this embodiment of the invention is over 90% under different input scenarios.

[0030] Figure 13 This is a schematic diagram showing the heat dissipation location of the key power components in the 86-type high-power wireless AP device disclosed in this embodiment of the invention.

[0031] Component designation explanation

[0032] 1. Outer shell; 101. First protective shell; 102. Second protective shell. Detailed Implementation

[0033] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. It should be noted that, unless otherwise specified, the following embodiments and features described herein can be combined with each other.

[0034] Please see Figure 1This invention provides an 86-type high-power wireless AP device, including a housing 1. The housing 1 is an 86-type box. Because the 86-type box is a standard size, the appearance design is limited to its specified range. The rearward protrusion represents the maximum depth of the 86-type box, approximately 47.9mm. Please refer to [link / reference] for details. Figure 2 and Figure 3 The outer casing 1 includes a first protective casing 101 and a second protective casing 102 mounted on the first protective casing 101. The first protective casing 101 contains a functional motherboard for enabling wireless access to the core of the device, and the second protective casing 102 contains a power conversion board for converting high voltage to low voltage and supplying power to the functional motherboard, and is arranged parallel to the functional motherboard.

[0035] It should be noted that a PoE (Power over Ethernet) wireless AP (Access Point) device installed in an enclosed space similar in size to an 86-type box, with power consumption specifications ranging from up to 15W on the motherboard (most products on the market are currently concentrated below 10W, with 3-5W products being the most common), focuses on solving the thermal balance problem when operating at high power in an enclosed space. In other words, installing a high-power wireless AP device in an 86-type box requires solving three core problems of a 15W power AP device in an enclosed space: 1. Heat accumulation under high power density; 2. Coordinated heat dissipation of the PoE power supply module (PD) and the motherboard; 3. In the high-temperature environment of a confined space, the power consumption of all components is relatively high, and the power supply over-temperature protection is in place.

[0036] Due to space constraints, the product adopts a double-layer structure to achieve its final product. This device contains two boards. The first layer is the functional motherboard, which is used to realize the core wireless access function of the device. The functional motherboard is installed in the panel position, that is, inside the first protective shell 101. The second layer is the power conversion board, which is used to convert high voltage to low voltage to power the functional motherboard. The PD (powered device) power receiving device is installed in the rearward protruding space, that is, inside the second protective shell 102. The two boards are installed in different positions of the 86 box and are arranged parallel to each other to achieve coordinated heat dissipation of the PoE power supply module (PD) and the motherboard.

[0037] Please see Figure 4The functional circuitry on the mainboard includes a network processor, two PHY modules for sending and receiving Ethernet data frames, a WiFi module, two FEM modules for processing radio frequency signal transmission and reception, two antenna combiners, and two radio frequency antenna interfaces connected to the antenna combiners. The network processor is connected to the power supply circuitry on the power conversion board via the two PHY modules, and to the two radio frequency antenna interfaces via the two antenna combiners. The network processor is also connected to the two antenna combiners via the WiFi module and the two FEM modules. It should be noted that the two PHY modules are a 1G PHY module and a 2.5G PHY module, the WiFi module is a WiFi 6E module, and the two FEM modules are both 5G FEM modules. The functional circuitry on the mainboard also includes a memory.

[0038] Please see Figure 4 and Figure 5 The power circuit on the power conversion board includes two network connectors, a first transformer, and a second transformer. The two network connectors are a first network connector (1GE RJ45) and a second network connector (2.5GE RJ45). The first transformer is a 1GbE Txfmr and the second transformer is a 2.5GbE Txfmr.

[0039] One port of the first network connector (1GE RJ45) is connected to the user terminal equipment via a network cable, and the other port of the first network connector is connected to the functional circuit on the main board via the first transformer; one port of the second network connector (2.5G ERJ45) is connected to the PoE switch via a network cable, and the other port of the second network connector is also connected to the functional circuit on the main board via the second transformer, which is also connected to the protection circuit module; it should be noted that, in Figure 4 The protection circuit module was not drawn in the diagram, and there is also... Figure 4 In this context, POE 802.11at represents the PD interface control module, and DC / DC represents the power conversion module.

[0040] Please see Figure 5 , Figure 6 and Figure 9 The power circuit on the power conversion board also includes a protection circuit module, a PD interface control module connected to the protection circuit module, and a power conversion module connected to the protection circuit module and the PD interface control module respectively. The PD interface control module includes a first chip for implementing PD protocol-based functions, and the power conversion module includes a second chip for implementing high voltage to low voltage conversion.

[0041] It should be noted that the power conversion board in this embodiment is a 48V to 12V PD power supply with a power of 15W. In order to solve the heat problem of the power board, this invention does not use an integrated PD chip, but selects two chips (PD interface control chip + high-efficiency synchronous rectification Buck integrated chip) with high efficiency, small size and few external components for circuit design. The two chips can be heat dissipated separately, thereby improving the power conversion efficiency and reducing losses.

[0042] Please see Figures 5 to 8 The protection circuit module includes a reverse connection protection submodule and a filtering submodule. The reverse connection protection submodule includes a first bridge rectifier circuit, a second bridge rectifier circuit, a transient voltage suppressor diode, and several capacitors. The filtering submodule includes a dual-mode inductor, a first inductor, and several capacitors. The following explanation uses the first bridge rectifier circuit D10, the second bridge rectifier circuit D11, the transient voltage suppressor diode VD1, the dual-mode inductor LF1, and the first inductor L1 as examples.

[0043] The first pins of the first bridge rectifier circuit D10 and the second bridge rectifier circuit D11 are connected to one end of the transient voltage suppressor diode VD1 and the filter submodule, respectively. The fourth pins of the first bridge rectifier circuit D10 and the second bridge rectifier circuit D11 are connected to the other end of the transient voltage suppressor diode VD1 and the filter submodule, respectively. The second and third pins of the first bridge rectifier circuit D10 and the second bridge rectifier circuit D11 are both connected to the second transformer. The two ends of the transient voltage suppressor diode VD1 are also connected to the filter submodule. The wavelet module is connected; wherein, the second pins of the first bridge rectifier circuit D10 and the second bridge rectifier circuit D11 are CTA and CTC respectively, and the third pins of the first bridge rectifier circuit D10 and the second bridge rectifier circuit D11 are CTB and CTD respectively. The bridge rectifier circuit in this embodiment is a typical bridge rectifier circuit composed of four diodes. The function of the first bridge rectifier circuit D10 and the second bridge rectifier circuit D11 is to avoid the positive and negative terminals being connected incorrectly when the input terminal is connected to the second transformer, thereby affecting the subsequent components.

[0044] The first and second pins of the dual-mode inductor LF1 are both connected to the reverse connection protection submodule. The third pin of the dual-mode inductor LF1 is connected to one end of the first inductor L1 and the positive terminals of several capacitors. The other end of the first inductor L1 is also connected to the PD interface control module, the power conversion module, and the positive terminals of several capacitors. The fourth pin of the dual-mode inductor LF1 is also connected to the PD interface control module. It should be noted that the dual-mode inductor LF1 and several capacitors all serve a filtering function.

[0045] Please see Figures 9 to 11The PD interface control module also includes other circuit components, and the power conversion module also includes a second inductor and other circuit components. In this embodiment, the first chip is MP8003AGQ-Z and the second chip is MP9572GQB-Z. The following description uses the first chip U1, the second chip U2 and the second inductor L2 as examples.

[0046] The power supply ports of the first chip U1 are pin 1 (VSS) and pin 7 (VDD). The eight control terminals of the first chip U1 are pins 2 to 6, pin 8, pin 10, and pin 11. Pins 1 (VSS), 2 (FTY), 3 (CLASS), and 10 (RTN) of the first chip U1 are interconnected through diode VD2 and pin 11 (EPAD) and are all connected to the filter submodule. Pins 1 (VSS), 2 (FTY), 3 (CLASS), and 10 (RTN) of the first chip U1 are also connected to one end of the seventh capacitor C7 through diode VD2 and pin 11 (EPAD). The other end of the seventh capacitor C7 is also connected to the filter submodule. Pins 4 (T2P), 5 (AUX), and 6 (DET) of the first chip U1 are all connected to the filter submodule through resistors. Pin 8 (PG) of the first chip U1 is connected to the second chip U2 through resistor R17. Pin 10 (RTN) of the first chip U1 is connected to the second chip U2 through resistor R12.

[0047] The eighth pin (IN) of the second chip U2 is connected to the filter submodule. Two control terminals of the second chip U2 are the eleventh pin (CCMSYNCO) and the twelfth pin (EN). The eleventh pin (CCMSYNCO) and the twelfth pin (EN) of the second chip U2 are connected to the first chip U1 through the twelfth resistor R12 and the seventeenth resistor R17, respectively. The twelfth pin (EN) of the second chip U2 is also connected to the filter submodule through the ninth resistor R9. The first pin (BST) of the second chip U2 is connected to one end of the second inductor L2 through the thirty-first capacitor C31. The second pin (SW) of the second chip U2 is also connected to one end of the second inductor L2. The other end of the second inductor L2 is connected to the positive terminals of several capacitors and the functional circuits on the functional motherboard.

[0048] It should be noted that the first chip, U1, is an IEEE 802.3af / at Power over Ethernet (PoE) compatible and Device-on-Power (PD) interface controller, possessing all the functions of IEEE 802.3af / at. The second chip, U2, supports 2A output, is highly efficient, compact, has a low IQ of 40uA, and integrates a synchronous rectification chip to achieve a 48V to 12V / 2A output to power the motherboard. U1 and U2 work together; U1 controls the EN pin of U2 through its PG pin, achieving a 12V / 2A (24W) power output based on the PD protocol, thus meeting the 15W power requirement of the motherboard. Therefore, dividing the integrated chip into two chips ensures that the average conversion efficiency of the power supply is over 90% under different input scenarios. For details, please refer to [link to relevant documentation]. Figure 12 .

[0049] The temperature rise test data of key components on a single power supply board at a high temperature of 85℃ (excluding the entire chassis) is shown in Table 1 below:

[0050]

[0051] For the heat dissipation design of the power board, heat sinks connected to the outer casing 1 are installed on the surface of key power components in the power circuit on the power board. This effectively reduces the operating temperature of the components on the power board inside the sealed casing, thereby improving product reliability and ensuring compliance with specifications. Please refer to [link / reference needed] for details. Figure 13 The overall temperature rise test of the power board and motherboard inside the casing showed that the test results met the requirements of the components and product specifications. After heat dissipation with the casing attached, the temperature of the key components of the whole machine did not exceed 105℃, which meets the temperature resistance standards of industrial-grade components, as shown in Table 2 below:

[0052]

[0053] Specifically, the key points and protected points of this invention are: Key point 1: High-efficiency split power supply design: The discrete solution of PD interface control chip (U1) and synchronous rectification Buck chip (U2) is adopted to replace the traditional integrated PD chip, reducing the risk of single-chip heat concentration. At the same time, precise PD power supply (12V / 2A output) to the motherboard is achieved through PG-EN pin linkage control; Small volume and high-density layout: Dual board stacking is completed within the standard size of 86 boxes, and the power board area utilization rate is over 90%;

[0054] Key Point Two: Multi-dimensional Heat Dissipation Optimization: Active Loss Reduction: Select high-efficiency components (efficiency > 90%) to reduce heat source generation; Passive Heat Dissipation: Install aluminum heat sinks on key heat-generating components and directly attach them to the metal casing for heat conduction (e.g., Figure 13 U1 on the power board is controlled at 90.3℃ (Table 2); Thermal distribution decoupling: The power board and motherboard are laid out in layers to avoid heat accumulation, and the temperature on the front of the motherboard is controlled below 93.9℃ (Table 2).

[0055] Key Point 3: High Temperature Environment Adaptability: The power board was independently tested at an ambient temperature of 85℃, and the temperature rise of all components passed the test (e.g., U2≤90.9℃). The whole machine operated stably for a long time at an ambient temperature of 40℃ (Table 2); Structural Compatibility: The rear protrusion space is dedicated to the installation of the PD power board, ensuring heat dissipation and compatibility with the depth of the standard 86 box.

[0056] Protection point one: The combination design of PD interface control chip (U1) and high-efficiency synchronous rectification Buck integrated chip (U2) achieves efficient power conversion from 48V to 12V / 2A, meeting the 15W power requirement, while reducing thermal coupling effect through discrete layout; Protection point two: The heat dissipation design of key power components on the power board with heat sinks attached to the shell effectively solves the high temperature problem in the enclosed space; Protection point three: The double-layer PCB stacked layout (power board and functional motherboard are designed in layers) optimizes space utilization and reduces thermal interference, ensuring that the whole machine can achieve high power operation within the standard 86 box size.

[0057] In summary, compared with the prior art, the present invention has the following advantages:

[0058] 1. High Power Support: Breaking through the traditional 3-5W limitation, it supports 15W high-power output to meet the needs of high-performance wireless APs; 2. Efficient Heat Dissipation: Through discrete chip design, heat sink shell, and double-layer layout, the temperature rise in the confined space is significantly reduced, and the device temperature is controlled within a safe range; 3. Structural Optimization: The layered design of the power board and motherboard avoids thermal coupling and improves overall reliability; 4. High Conversion Efficiency: The average power efficiency reaches 90%, which not only reduces energy loss but also reduces heat sources; This invention has been verified in the laboratory and is already in mass production in the company's products, thus fully demonstrating the feasibility and reliability of the technology. This invention successfully solves the heat dissipation and power bottleneck of a 15W wireless AP in an 86-box confined space, combining the advantages of high efficiency, reliability, and low cost, thus possessing industry promotion value.

[0059] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. All equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this invention should still be covered by the claims of this invention.

Claims

1. A high-power wireless AP device of type 86, comprising a housing (1), the housing (1) comprising a first protective shell (101) and a second protective shell (102) mounted on the first protective shell (101), characterized in that: The first protective shell (101) houses a functional motherboard for enabling wireless access to the core of the device, and the second protective shell (102) houses a power conversion board for converting high voltage to low voltage and supplying power to the functional motherboard, and is arranged parallel to the functional motherboard. The power circuit on the power conversion board includes a protection circuit module, a PD interface control module connected to the protection circuit module, and a power conversion module connected to the protection circuit module and the PD interface control module respectively. The PD interface control module includes a first chip for implementing PD protocol-based functions. The power conversion module includes a second chip for implementing high-voltage to low-voltage conversion. The surfaces of the key power components in the power circuit on the power conversion board are provided with heat sinks connected to the outer casing (1).

2. The 86-type high-power wireless AP device according to claim 1, characterized in that: The functional circuitry on the mainboard includes a network processor, two PHY modules for sending and receiving Ethernet data frames, a WiFi module, two FEM modules for processing radio frequency signal transmission and reception, two antenna combiners, and two radio frequency antenna interfaces connected to the antenna combiners. The network processor is connected to the power circuit on the power conversion board through two PHY modules. The network processor is connected to two radio frequency antenna interfaces through two antenna combiners. The network processor is also connected to the two antenna combiners through a WiFi module and two FEM modules.

3. The 86-type high-power wireless AP device according to claim 1, characterized in that: The power circuit on the power conversion board also includes two network connectors, a first transformer, and a second transformer; One port of one of the network connectors is connected to the user terminal equipment via a network cable, and the other port of one of the network connectors is connected to the functional circuit on the functional motherboard via a first transformer. One port of the other network connector is connected to the PoE switch via a network cable, and the other port of the other network connector is also connected to the functional circuit on the functional motherboard via a second transformer. The second transformer is also connected to the protection circuit module.

4. The 86-type high-power wireless AP device according to claim 3, characterized in that: The protection circuit module includes a reverse connection protection submodule connected to the second transformer and a filter submodule connected to the reverse connection protection submodule; The reverse connection protection submodule includes a first bridge rectifier circuit, a second bridge rectifier circuit, and a transient voltage suppressor diode. The first pins of the first bridge rectifier circuit and the second bridge rectifier circuit are connected to one end of the transient voltage suppressor diode and the filter submodule, respectively. The fourth pins of the first bridge rectifier circuit and the second bridge rectifier circuit are connected to the other end of the transient voltage suppressor diode and the filter submodule, respectively. The second pins and the third pins of the first bridge rectifier circuit and the second bridge rectifier circuit are both connected to the second transformer. The two ends of the transient voltage suppressor diode are also connected to the filter submodule.

5. The 86-type high-power wireless AP device according to claim 4, characterized in that: The filtering submodule includes a dual-mode inductor, a first inductor, and several capacitors for filtering. The first and second pins of the dual-mode inductor are both connected to the reverse connection protection submodule. The third pin of the dual-mode inductor is connected to one end of the first inductor. The other end of the first inductor is connected to the PD interface control module and the power conversion module, respectively. The fourth pin of the dual-mode inductor is also connected to the PD interface control module.

6. The 86-type high-power wireless AP device according to claim 4, characterized in that: The first chip is a PD interface control chip with model number MP8003AGQ-Z. The power port and eight control terminals of the first chip are connected to the filter submodule. Two of the eight control terminals of the first chip are connected to the second chip through resistors.

7. The 86-type high-power wireless AP device according to claim 4, characterized in that: The power conversion module also includes a second inductor and several capacitors for filtering. The second chip is a high-efficiency synchronous rectification Buck integrated chip with model number MP9572GQB-Z. The input terminal of the second chip is connected to the filtering submodule. Two of the control terminals of the second chip are connected to the first chip through equalizing resistors. One of the control terminals of the second chip is connected to one end of the second inductor through a capacitor. The other end of the second inductor is connected to the functional circuit on the functional motherboard.

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